JP2005311283A - High-luminance led lamp - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-luminance LED lamp that need not be soldered at mounting, and has a large reflecting surface having high heat radiation. <P>SOLUTION: A first lead frame 1 comprises a reflecting member 2 in a concave-mirror shape and a lead terminal 3 of which one end is electrically connected to the reflecting member; a passage 2d of a second lead frame is provided in at least a part of the reflecting member 2; one end of the second lead frame 4 is disposed in the passage 2d, while being electrically isolated from the reflection member 2; the reflecting member 2 and the second lead frame 4 form a reflecting surface, having a profile approximately corresponding to the cross section profile of a package; an LED chip 7 is set on the reflecting member 2; and the lead terminal 3 and the other end of the second lead frame 4 are fitted to power supply terminals protruded from a substrate, and extended outside of a translucent resin package 9, such that makes contact with a radiating member on the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to an LED lamp used for a display device, a lighting device, or the like.

As shown in FIG. 6, the conventional LED lamp 60 is electrically connected to the first lead frame 61 on which the LED chip 67 is placed via a conductive paste and the LED chip 67 via a conductive wire 68. The LED chip 67, the first lead frame 61, the second lead frame 64, and the conductive wire 68 are integrally molded with a translucent resin package 69. Yes. A concave surface 61b is formed in the portion on the lead frame 61 where the LED chip 67 is placed. Since this concave surface functions as a reflecting surface and has a light collecting effect, the brightness of the LED lamp 60 is increased.

When the LED lamp 60 is used, the terminal portions 61a and 64a of each lead frame extending from the bottom surface of the translucent resin package 69 are inserted into the through-holes of the substrate 100 and soldered. The circuit is electrically connected to a circuit (not shown).

In addition, by inserting a power supply terminal provided so as to protrude from the board into the insertion hole provided in the lead frame so as to obtain an electrical connection, the circuit can be electrically connected to the circuit without soldering. There has also been proposed an LED lamp to be connected to (see Patent Document 1).
Japanese Patent No. 3135204

However, since the conventional reflecting surface is recessed by pressing the lead frame or the like, its size cannot be increased regardless of the thickness of the lead frame, and its light collecting effect is limited.

Further, there is a problem that the light-transmitting resin package having a role of efficiently extracting light is softened and deformed due to heat generated when being soldered to the substrate, resulting in a decrease in light collection efficiency.

Further, in the LED lamp that is not soldered in Patent Document 1, heat generated from the LED chip by energization is transmitted from the lead frame to the power supply terminal on the substrate side through the fitting portion, and is radiated to the outside. Here, when the contact area of the fitting portion is small, the heat dissipation is deteriorated as compared with the case where heat is radiated directly to the outside without using the fitting portion. For this reason, the influence of carrier scattering due to the thermal vibration of the lattice in the LED chip, so-called phonon scattering, has increased, and the luminance has been lowered.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a high-intensity LED lamp having a large reflective surface, which does not require soldering during mounting and has high heat dissipation. There is to do.

The LED lamp of the present invention capable of solving the above-described problems includes at least one LED chip, a first lead frame on which the LED chip is mounted, and one end electrically connected to the LED chip through a conductive wire. An LED lamp comprising: at least one second lead frame; and a translucent resin package that integrally molds the first and second lead frames and the LED chip, wherein the first lead frame comprises: A concave mirror-like reflecting member having a size substantially matching the transverse cross-sectional shape of the package and a lead terminal having one end electrically connected to the reflecting member, and an LED chip at the center of the concave mirror-like reflecting member And the other end of the lead terminal and the second lead frame is inserted into the power supply terminal protruding from the substrate. Said is extended from outside the translucent resin package so as to be in contact with the heat radiating member on the substrate, it is characterized in.

The LED lamp of the present invention includes at least one LED chip, a first lead frame on which the LED chip is mounted, and at least one first chip electrically connected to the LED chip through a conductive wire. An LED lamp comprising a two-lead frame and a translucent resin package that integrally molds the first and second lead frames and the LED chip, wherein the first lead frame is a concave mirror-like reflecting member; A lead terminal electrically connected to the reflecting member at one end, and a second lead frame passage portion that allows passage of the second lead frame is provided at least in part of the reflecting member; One end of the two lead frame is disposed in the second lead frame passage portion so as to be electrically insulated from the reflecting member, and the reflecting member and the front The second lead frame forms a reflecting surface that substantially matches the cross-sectional shape of the package, and the LED chip is placed on the reflecting member, and the other end of the lead terminal and the second lead frame is placed on the substrate. It is characterized by being inserted into the power supply terminal protruding from the outside and extended outward from the translucent resin package so as to come into contact with the heat radiating member on the substrate. The second lead frame passage portion is preferably a notch portion having a creek shape extending from the outer edge portion of the reflecting member toward the center portion, or a through hole.

In the LED lamp of the present invention, the reflective surface can be enlarged regardless of the thickness of the lead terminal by forming the reflective surface separately from the lead terminal. In addition, by providing the reflecting member with a portion through which a terminal other than the lead terminal is electrically insulated, the reflecting surface can be enlarged regardless of the arrangement of the lead terminal, and high brightness is achieved. Can be realized.

In addition, since the lead frame is inserted into the power supply terminal protruding from the substrate, soldering is not required for connection with a circuit provided on the substrate. Therefore, the translucent resin package is not softened and deformed by heat generated during soldering, and a reduction in light collection efficiency can be prevented.

Furthermore, the heat generated from the LED chip by energization is supplied to the board side that is fitted with the lead frame by extending the lead frame from the translucent resin package so that the lead frame contacts the external heat dissipation member. In addition to being discharged to the outside through the terminals, it is directly discharged to the heat dissipating member on the substrate that contacts the lead frame. Therefore, heat dissipation is improved, and a decrease in luminance due to the influence of phonon scattering or the like generated in the LED chip can be prevented.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[Embodiment 1]
FIG. 1 is a schematic perspective view showing an LED lamp according to a first embodiment of the present invention, FIG. 2A is a plan view thereof, and FIG. 2B is a sectional view taken along line BB of FIG. 2A. As shown in FIGS. 1 and 2, the LED lamp 10 includes a first lead frame 1 to which the LED chip 7 is fixed, and a second lead frame 4 that is electrically connected to the LED chip 7 through a conductive wire 8. The LED chip 7, the first lead frame 1, the second lead frame 4, and the conductive wire 8 are integrally molded with a translucent resin package 9.

As shown in FIG. 2, the first lead frame 1 includes a first reflecting member 2 and a first lead terminal 3 made of a conductive material. The first reflecting member 2 is formed in a concave mirror shape and has a hole 2c at the edge. The hole 2 c receives one end 3 a of the cylindrical first lead terminal 3 and electrically connects the first reflecting member 2 and the first lead terminal 3. Further, the LED chip 7 is fixed to the bottom surface 2b, which is substantially flat, of the reflecting surface 2a of the first reflecting member 2 via a conductive paste. Accordingly, one pole of the LED chip 7 is electrically connected to the first lead frame. Furthermore, the 1st reflection member 2 has the notch part 2d of the cove shape which goes to a center part from an outer edge part. In the present embodiment, the notch 2d is the second lead frame passage, and the second lead frame 4 is disposed in the interior thereof so as to be electrically insulated from the first reflecting member 2. The second lead frame 4 includes a second reflecting member 5 and a second lead terminal 6 made of a conductive material. The second reflecting member 5 is shaped like a slide, and has a slope surface 5b shaped along the concave surface of the reflecting surface 2a and a surface 5a that is substantially horizontal at the bottom. Furthermore, the 2nd reflection member 5 has the hole 5c in the upper part of the slope surface 5b. The hole 5 c receives one end 6 a of the cylindrical second lead terminal 6 and electrically connects the second reflecting member 5 and the second lead terminal 6. The second lead frame 4 including the second reflecting member 5 and the second lead terminal 6 is disposed so that the slope surface 5b supplements the notched surface of the reflecting surface 2a when the second lead frame 4 is disposed in the notched portion 2d. . Further, the horizontal surface 5 a of the second reflecting member 5 is electrically connected to the other pole of the LED chip 7 through the conductive wire 8. The first lead terminal 3 and the second lead terminal 6 both extend from the translucent resin package 9 and have insertion holes 3c and 6c at their ends. A drive voltage is applied to the LED chip 7 by inserting power supply terminals (not shown) provided so as to protrude from the substrate into the insertion holes 3c and 6c so as to obtain electrical connection. Is done. The LED lamp 10 is mounted so that the end surfaces 3d and 6d of the first lead terminal 3 and the second lead terminal 6 are in contact with a heat conductive heat dissipating member (not shown) provided on the substrate.

Since the LED lamp 10 configured as described above has the large reflective surface 2a that has been difficult to form, the light generated from the LED chip 7 is effectively collected, and the brightness can be increased.

Furthermore, soldering for mounting the LED lamp 10 on the substrate becomes unnecessary, and the light-transmitting resin package 9 can be prevented from being softened and deformed by heat generated during soldering. Accordingly, it is possible to prevent a decrease in light collection efficiency.

Further, the end surfaces 3d and 6d of the first lead terminal 3 and the second lead terminal 6 are brought into contact with a heat conductive heat dissipating member (not shown) provided on the substrate, so that the heat dissipating property is improved and the phonon is improved. It is possible to prevent a decrease in luminance due to the influence of scattering or the like.

Further, as shown in FIG. 3, dummy first lead terminals 33a and 33b that are not connected to the power supply terminal on the board side but are in contact with a heat radiating member (not shown) on the board may be provided. In this case, the heat dissipation effect is further improved, and further higher brightness is possible.

[Embodiment 2]
FIG. 4A is a plan view showing an LED lamp 40 according to the second embodiment of the present invention. As shown in FIG. 4A, the LED lamp 40 includes a first lead frame 41 on which three LED chips 47 are placed, and three second electrodes electrically connected to the LED chips 47 through conductive wires 48. The LED chip 47, the first lead frame 41, the second lead frame 44, and the conductive wire 48 are integrally molded with a translucent resin package 49. In the present embodiment, three LED chips 47 are fixed to the bottom surface 42b of the first reflecting member 42 constituting the first lead frame 41 via a conductive paste. Furthermore, the first reflecting member 42 has three inlet-shaped cutouts 42 d that extend from the outer edge toward the center. In the present embodiment, the three cutout portions 42d are the second lead frame passage portions, and the three second lead frames 44 are insulated from the first reflecting member 42 in each cutout portion 42d. Arranged. Other configurations can be the same as those of the first embodiment described above, and detailed description thereof is omitted.

In the LED lamp 40 configured as described above, three LED chips 47 can be mounted in one LED lamp. Therefore, for example, by mounting LED chips of the same color, an LED lamp with higher brightness can be realized. Further, for example, a high-luminance full-color LED lamp can be realized by mounting red, green, and blue LED chips, which are three primary colors of additive color mixing.

As mentioned above, although embodiment of this invention was described, demonstrating a specific example, this invention is not limited to these specific examples. For example, in the above-described embodiment, the second reflecting member and the second lead terminal are separated, but they may be integrated.

In the second embodiment, the three LED chips 47 are fixed on the first reflecting member 42. However, as shown in FIG. 4B, on the second reflecting member 45 constituting the second lead frame 44, Even if the three LED chips 47 are fixed and electrically connected to the first lead frame 41 via the conductive wires 48, the same effect can be obtained. The same applies to the case of the first embodiment.

In each of the above-described embodiments, the second lead frame is insulated from the second lead frame passage portion of the first reflecting member. However, the second lead frame passage portion is not provided and the outer edge of the first reflecting member is provided. Alternatively, the second lead terminal may be insulated from the outside and electrically connected to the LED chip via a conductive wire. In this case, the second lead frame passage portion and the second reflecting member are unnecessary.

Further, in each of the above-described embodiments, the second lead frame passage portion is a notch portion having a creek shape extending from the outer edge portion toward the center portion, but the shape of the notch portion is not limited thereto. It may be a cutout portion having a shape in which a part of the first reflecting member is cut off. Further, as shown in FIG. 5, the second lead frame passage portion is formed as a through hole 52d provided in a part of the first reflecting member, and the second lead terminal 55 is disposed so as to insulate and pass through the inside. The other electrode of the LED chip 57 may be electrically connected via the conductive wire 58. In this case, the second reflecting member is not necessary.

As detailed above, it is clear that the present invention is a novel and extremely useful invention that provides a high brightness LED lamp.

It is the schematic perspective view which showed the LED lamp which concerns on one Embodiment of this invention. It is the schematic plan view and schematic sectional side view of the said LED lamp. It is the schematic perspective view which showed the LED lamp which concerns on another embodiment of this invention. It is the schematic plan view and schematic side view which showed the LED lamp which concerns on another embodiment of this invention. It is the schematic plan view and schematic side view which showed the LED lamp which concerns on another embodiment of this invention. It is the schematic sectional side view which showed the conventional LED lamp.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st lead frame 2 1st reflection member 2d 2nd lead frame passage part 3 1st lead terminal 4 2nd lead frame 5 2nd reflection member 6 2nd lead terminal 7 LED chip 8 Conductive wire 9 Translucent resin package 10 LED lamp

Claims (7)

At least one LED chip;
A first lead frame on which the LED chip is placed;
At least one second lead frame having one end electrically connected to the LED chip through a conductive wire;
An LED lamp comprising the first and second lead frames and a translucent resin package for integrally molding the LED chip,
The first lead frame is constituted by a concave mirror-like reflecting member having a size substantially matching the cross-sectional shape of the package, and a lead terminal having one end electrically connected to the reflecting member,
An LED chip is placed at the center of the concave mirror-like reflecting member,
The other end of the lead terminal and the second lead frame is inserted into the power supply terminal protruding from the board, and outside the translucent resin package so as to come into contact with the heat radiating member on the board. Extended,
An LED lamp characterized by that. At least one LED chip;
A first lead frame on which the LED chip is placed;
At least one second lead frame electrically connected to the LED chip via a conductive wire;
An LED lamp comprising the first and second lead frames and a translucent resin package for integrally molding the LED chip,
The first lead frame includes a concave mirror-like reflecting member and a lead terminal having one end electrically connected to the reflecting member,
At least a part of the reflecting member is provided with a second lead frame passage portion that allows passage of the second lead frame;
One end of the second lead frame is disposed in the second lead frame passage part and electrically insulated from the reflecting member,
The reflective member and the second lead frame form a reflective surface that substantially matches the cross-sectional shape of the package, and the LED chip is placed on the reflective member.
The other end of the lead terminal and the second lead frame is inserted into the power supply terminal protruding from the board, and outside the translucent resin package so as to come into contact with the heat radiating member on the board. Extended,
An LED lamp characterized by that. 3. The LED lamp according to claim 2, wherein the second lead frame passage portion is a notch portion having a creek shape extending from an outer edge portion of the reflecting member toward a center portion. The LED lamp according to claim 2, wherein the second lead frame passage portion is a through hole. The second lead frame is constituted by a concave mirror-like reflecting member and a lead terminal having one end electrically connected to the reflecting member,
At least a part of the reflection member is provided with a first lead frame passage portion that allows passage of the first lead frame;
One end of the first lead frame is disposed in the first lead frame passage part and electrically insulated from the reflective member,
The reflective member and the first lead frame form a reflective surface that substantially matches the cross-sectional shape of the package, and the LED chip is placed on one end of the first lead frame,
The other end of the lead terminal and the first lead frame is inserted into the power supply terminal protruding from the substrate, and the outside of the translucent resin package is in contact with the heat radiating member on the substrate. Extended to
The LED lamp according to claim 2. 6. The LED lamp according to claim 5, wherein the first lead frame passage portion is a notch portion having a creek shape extending from an outer edge portion of the reflecting member toward a center portion. The LED lamp according to claim 5, wherein the first lead frame passage portion is a through hole.

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