JP2005311152A - Heat radiating structure for electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiation structure for electronic equipment by which heat can radiate fully, even if the volume of an air chamber for storing a heat-generating component is small, and an uneven component and a component made into a high-temperature state are not exposed to the outside. <P>SOLUTION: A part of a casing is formed of a heatsink 2. A component 6 to be heat-radiated is fixed to the internal side of the casing of the heat sink 2. A plate-like member 3 is provided which is arranged to the external side of the casing of the heat sink 2 and formes a vertical ventilation path in-between the heat sink 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic apparatus, and more particularly to a heat dissipation structure for a heat generating component.

  An example of a conventional speaker system in which an amplifier circuit of a speaker is arranged in an enclosure is shown in FIGS. Reference numeral 1 shown in FIG. 5 denotes a speaker enclosure, and the back side thereof is shown in the figure. Although a baffle on the front side of the enclosure 1 is not shown, a speaker is attached to the baffle.

  The rear side of the enclosure 1 is covered with a heat radiating plate 8 also shown in detail in FIG. Fins 9 are provided on the outer surface of the enclosure 1 of the heat sink 8. A power transistor 6 constituting an amplifier circuit of the speaker is fixed so as to be in close contact with the inner surface of the heat sink 8 of the enclosure 1. Heat generated in the power transistor 6 and the amplifier heat generating component 7 is radiated through the heat radiating plate 8 and the fins 9.

  7 and 8 show conventional examples of the heat dissipation structure of the speaker system in the case where the heat dissipation components of the conventional speaker system shown in FIGS. In this example, holes 8 a, 8 a... Are provided in the upper and lower portions of the fin 9 of the heat radiating plate 8.

  And the place where the heat-emitting component inside the enclosure 1 is arranged is partitioned off from other parts by a partition plate 1a. Other configurations are the same as those described with reference to FIGS. 5 and 6, and the same members are denoted by the same reference numerals and detailed description thereof is omitted.

  In this example, when the temperature of the air in the space in which the heat generating component is arranged rises, convection occurs and cold air enters from the lower holes 8a, 8a, and the hot air is discharged from the upper holes 8a, 8a,. The heat generating component is also radiated by the air flow.

  In the conventional heat dissipation structure of the speaker system shown in FIGS. 5, 6, 7, and 8, since the uneven fin 9 appears outside the enclosure, the appearance is inferior. Moreover, since the fin 9 which becomes high temperature is exposed to the outside, it is dangerous.

  The speaker device proposed in Japanese Patent Laid-Open No. 10-164684 is a rear speaker box in which a power supply unit and a signal amplification unit are arranged in an air chamber partitioned from other parts in the enclosure, and the air chamber is separated from the outside. A plurality of heat dissipation holes are provided.

In the speaker device proposed in Japanese Patent Laid-Open No. 10-164684 described above, the air chamber that houses the power supply unit and the signal amplification unit needs to have a certain volume or more. If the volume of the air chamber is not sufficient, the power supply unit and the signal There was a problem that the heat generated from the amplification unit could not be sufficiently dissipated.
Japanese Patent Laid-Open No. 10-164684, page 4, FIG.

  The present invention has been made in view of the above points, and the object of the present invention is to sufficiently dissipate heat even when the volume of the air chamber accommodating the heat-generating component is small. An object of the present invention is to provide a heat dissipation structure for an electronic device in which no part is exposed to the outside.

  In the heat dissipation structure of the electronic device according to the present invention, a part of the housing is formed of a heat sink, and a heat radiated component is fixed to the inside of the housing of the heat sink, and is disposed outside the housing of the heat sink. A plate-like member that forms a vertical air passage between the heat sink is provided.

  In the heat dissipation structure of the electronic device, fins extending in the vertical direction are provided on the inside of the casing of the heat dissipation plate.

  In the heat dissipation structure of each electronic device, a fin extending in the vertical direction is provided in the vertical air passage.

  Further, in the heat dissipation structure of each electronic device, the housing is a speaker enclosure.

  According to the heat dissipation structure for an electronic device of the present invention, the cooling capacity of the heat generating component in the housing is enhanced, and the heat generating component can be arranged in a relatively small space. Moreover, since the high-temperature fin is not exposed to the outside due to the uneven shape, it is excellent in aesthetics and safe.

  The best mode for carrying out the present invention will be described below with reference to examples.

  1 is a perspective view showing a speaker system according to Embodiment 1 of the present invention, FIG. 2 (a) is a front view showing a heat radiating plate of the speaker system, and FIG. 2 (b) is a side view showing the heat radiating plate. 2 (c) is a rear view showing the heat radiating plate, and FIG. 2 (d) is a top view showing the heat radiating plate.

  Reference numeral 1 shown in FIG. 1 denotes a speaker enclosure, and FIG. 1 shows the back side thereof. Although a baffle on the front side of the enclosure 1 is not shown, a speaker is attached to the baffle.

  The rear side of the enclosure 1 is covered with a heat radiating plate 2 also shown in detail in FIG. Fins 4 are provided on the inner surface side of the enclosure 1 of the heat radiating plate 2, and the power transistors 6 constituting the amplifier circuit of the speaker are fixed so as to be in close contact with each other.

  A portion of the heat sink 2 on the outer surface side of the enclosure 1 is covered with a plate-like member 3 attached to the heat sink 2, and a ventilation path extending in the vertical direction by a gap between the heat sink 2 and the plate-like member 3. Is formed.

  Heat generated in the power transistor 6 and the amplifier heat generating component 7 fixed to the heat radiating plate 2 is transmitted to the heat radiating plate 2 and radiated into the enclosure 1 through the fins 4. The air in the air passage on the side is heated. The heated air in the air passage rises, and the heat sink 2 is cooled by this air flow.

  In this manner, the heat radiating plate 2 is efficiently cooled by the convection of air, the cooling capacity of the heat generating components in the enclosure 1 is enhanced, and the heat generating components can be arranged in a relatively small space. Moreover, since the high-temperature fin is not exposed to the outside due to the uneven shape, it is excellent in aesthetics and safe.

  3 is a perspective view showing a speaker system according to Embodiment 2 of the present invention, FIG. 4 (a) is a front view showing a heat radiating plate of the speaker system, and FIG. 4 (b) is a side view showing the heat radiating plate. 4 (c) is a rear view of the heat radiating plate, and FIG. 4 (d) is a top view showing the heat radiating plate. In FIG. 3, FIG.4 (c) and (d), it has shown except for a part of plate-shaped member 3. In FIG.

  In this example, fins 5 protruding from the heat sink 2 and extending in the vertical direction are provided in the air passage between the heat sink 2 and the plate-like member 3. Other configurations are the same as those of the first embodiment described with reference to FIGS. 1 and 2, and the same members are denoted by the same reference numerals and detailed description thereof is omitted.

  In this example, in addition to the effects described in the first embodiment, the fins 5 are provided in the portions that come into contact with the airflow in the air passages, so that the effect of radiating the heat-generating components through the heat radiating plate 2 is further enhanced. There exists an effect peculiar to Example 2.

  The embodiment is configured as described above, but the invention is not limited to this. For example, the effect of the present invention can be obtained without providing the heat sink 2 with fins inside the enclosure. In addition to the speaker system, the present invention can be applied.

BRIEF DESCRIPTION OF THE DRAWINGS It is a perspective view which shows the speaker system which is Example 1 of this invention. 2A is a front view showing the heat sink of the speaker system, FIG. 2B is a side view showing the heat sink, FIG. 2C is a rear view showing the heat sink, and FIG. 2D. FIG. 3 is a top view showing the heat radiating plate. It is a perspective view which shows the speaker system which is Example 2 of this invention except for some members. 4 (a) is a front view showing the heat sink of the speaker system, FIG. 4 (b) is a side view showing the heat sink, and FIG. 4 (c) is a rear view showing the heat sink with some members removed. FIG. 4D is a top view showing the heat radiating plate except for some members. It is a perspective view which shows the example of the conventional speaker system. 6 (a) is a front view showing the heat sink of the speaker system, FIG. 6 (b) is a side view showing the heat sink, FIG. 6 (c) is a rear view showing the heat sink, and FIG. 6 (d). FIG. 3 is a top view showing the heat radiating plate. It is a perspective view which shows the other example of the conventional speaker system except a part member. It is.

  8A is a front view showing the heat sink of the speaker system, FIG. 8B is a side view showing the heat sink, FIG. 8C is a rear view showing the heat sink, and FIG. 8D. FIG. 3 is a top view showing the heat radiating plate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Enclosure, 1a Partition plate 2 Heat sink 3 Plate-like member 4 Fin 5 Fin 6 Power transistor 7 Amplifier heat generating parts (transformer etc.)
8 Heat sink, 8a hole 9 Fin

Claims (4)

A part of the housing is formed of a heat sink, a heat radiating component is fixed to the inside of the heat sink, and the ventilation between the heat sink and the heat sink is arranged in the vertical direction. A heat dissipation structure for an electronic device, comprising a plate-like member that forms a path. The heat dissipation structure for an electronic device according to claim 1, wherein fins extending in a vertical direction are provided on the inside of the casing of the heat dissipation plate. The heat dissipation structure for an electronic device according to claim 1, wherein fins extending in a vertical direction are provided in the vertical air passage.
. The heat dissipation structure for an electronic device according to claim 1, wherein the housing is an enclosure for a speaker.

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