JP2005291779A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit Download PDF

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JP2005291779A
JP2005291779A JP2004103923A JP2004103923A JP2005291779A JP 2005291779 A JP2005291779 A JP 2005291779A JP 2004103923 A JP2004103923 A JP 2004103923A JP 2004103923 A JP2004103923 A JP 2004103923A JP 2005291779 A JP2005291779 A JP 2005291779A
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macro
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latches
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semiconductor integrated
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JP4530703B2 (en
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Yoshihiro Uchiyama
義弘 内山
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Kawasaki Microelectronics Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To use only signal wires all required for actual operation for wire connections between a hard macro and a soft macro and prevent the time required for verifying the quality of the wire connections from being prolonged. <P>SOLUTION: This semiconductor integrated circuit is provided with the soft macro 10 having latches FF1-FF3 for signal output; the hard macro 20 having latches FF11-FF13 for signal input; and the wire connections 30 for connecting the soft macro 10 to the hard macro 20. Selectors S1-S3 for separating the latches FF1-FF3 for signal output from normal input signals IN1-IN3 and connecting them to a scan signal SI1 in a shift register form are arranged in the soft macro 10. Logic circuits (NAND11-NAND14, INV11, INV12, S14) for logically processing output of the latches FF11-FF13 for signal input are arranged in the hard macro 20. The quality of the wire connections is verified on the basis of output of the logic circuits when the scan signal SI1 is inputted. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、回路ブロック間の結線の良否の検証を行うスキャン手段を設けた半導体集積回路(LSI)に関するものである。   The present invention relates to a semiconductor integrated circuit (LSI) provided with scanning means for verifying the quality of connection between circuit blocks.

半導体集積回路においては、技術の進歩により、転送レートが1GHz/secを超えるシリアル高速通信化に伴い、高速で動作する必要があるSerDes等のI/O部はハードマクロで実現され、シリアルデータをそのハードマクロ内部でパラレルデータに変換して動作スピードを数分の1〜十数分の1に落としてからシリコン内部のコア部のソフトマクロと接続している。   In semiconductor integrated circuits, with advances in technology, serial I / O units such as SerDes that need to operate at high speeds are realized with hard macros as serial high-speed communication exceeds 1 GHz / sec. It is converted into parallel data inside the hard macro and the operation speed is reduced to one-tenth to one-tenth, and then connected to the soft macro in the core part inside the silicon.

高速シリアルデータをパラレルデータに変換したとは言え、ソフトマクロ−ハードマクロ間は場合によっては200MHzを超える周波数で動作する必要があるため、通常そのインターフェースではフリップフロップからなるラッチを使ってクロックに同期した信号でやりとりされている。   Even though high-speed serial data is converted into parallel data, it is necessary to operate at a frequency exceeding 200 MHz in some cases between soft macro and hard macro. Therefore, the interface usually uses a flip-flop latch to synchronize with the clock. Exchanged with the signal.

そこで、特許文献1では、スタンダードセルを組み合わせたブロックとマクロブロックやIP(機能ブロック等)から成るカスタムブロックとを組み合わせた装置におけるブロック間の境界領域(結線)の良否の検証の容易化を実現することを目的にして、カスタムブロックをスキャンモードに設定した場合に、通常動作よりも簡易なEXOR演算等の処理を行って出力する設計を行うという方法が提案されている。   Therefore, Patent Document 1 realizes easy verification of the quality of the boundary area (connection) between blocks in an apparatus that combines a block combining standard cells and a custom block consisting of a macro block or IP (functional block). For this purpose, a method has been proposed in which when a custom block is set in a scan mode, a design such as an EXOR operation that is simpler than the normal operation is performed and output is performed.

また、一般的に、ハードマクロにスキャンチェーンが張られている場合には、ソフトマクロに張られたスキャンチェーンとを組み合わせたスキャン手法を用いてハードマクロとソフトマクロ間の結線の良否を検証することが可能である。
特開2001−183424
Also, generally, when a scan chain is stretched on a hard macro, the quality of the connection between the hard macro and the soft macro is verified using a scan method that combines the scan chain stretched on the soft macro. It is possible.
JP 2001-183424 A

ところが、特許文献1では、その図1などに示されているように、EXOR等の出力結果を表す信号が新たにカスタムブロックとマクロブロック間に付加されるため、高周波動作を要求されるカスタムブロック−マクロブロック間の境界領域がレイアウト上で不利となる。   However, in Patent Document 1, as shown in FIG. 1 and the like, since a signal representing an output result such as EXOR is newly added between the custom block and the macro block, the custom block requiring high-frequency operation. -The boundary area between macroblocks is disadvantageous in the layout.

また、前記スキャン手法では、スキャンのテスト時間は、ソフトマクロ側のスキャンチェーンあるいはハードマクロ側のスキャンチェーンのどちらか長い方で律速され、しかもソフトマクロとハードマクロ間の結線の良否の検証を行うためにスキャンアウトのモードで1クロックで1レジスタずつ読み出す必要があるため、テスト時間が長くなる。   In the scanning method, the scan test time is limited by the longer one of the scan chain on the soft macro side or the scan chain on the hard macro side, and the connection between the soft macro and the hard macro is verified. Therefore, since it is necessary to read one register at a time in the scan-out mode, the test time becomes longer.

本発明の目的は、ハードマクロ−ソフトマクロ間等の回路ブロック間の結線の良否の検証を行うとき、その結線には全て実動作で必要な信号線のみを用い、かつその検証に要する時間が長くならないようにした半導体集積回路を提供することである。   An object of the present invention is to verify the quality of connections between circuit blocks such as between hard macros and soft macros, using only signal lines necessary for actual operation for the connections, and the time required for the verification. It is to provide a semiconductor integrated circuit which is not lengthened.

請求項1にかかる発明は、n(n≧2)個の信号出力用ラッチを有する第1の回路ブロックと、n個の信号入力用のラッチを有する第2の回路ブロックと、前記n個の信号出力用ラッチと前記n個の信号出力用ラッチの間をそれぞれ接続する結線とを具備する半導体集積回路において、前記第1の回路ブロックに、前記n個の信号出力用ラッチを通常入力信号から切り離し且つスキャン信号に対してシフトレジスタ状に接続するn個のセレクタを配置し、前記第2の回路ブロックに、前記n個の信号入力用ラッチの出力を論理処理する論理回路を配置し、前記スキャン信号を入力したときの前記論理回路の出力により前記結線の良否の検証が行われるようにしたことを特徴とする。   The invention according to claim 1 is a first circuit block having n (n ≧ 2) signal output latches, a second circuit block having n signal input latches, and the n circuit blocks. In a semiconductor integrated circuit comprising a signal output latch and a wire connecting between the n signal output latches, the n signal output latches are connected to the first circuit block from the normal input signal. N selectors that are separated and connected to scan signals in a shift register form are arranged, and a logic circuit that logically processes the outputs of the n signal input latches is arranged in the second circuit block, The connection quality is verified based on the output of the logic circuit when a scan signal is input.

請求項2にかかる発明は、請求項1に記載の半導体集積回路において、前記論理回路は、前記n個の信号入力用ラッチの出力を演算する第1および第2の論理回路と、該第1および第2の論理回路の出力の一方を前記スキャン信号の論理に応じて選択するセレクタとを具備することを特徴とする。   According to a second aspect of the present invention, in the semiconductor integrated circuit according to the first aspect, the logic circuit includes first and second logic circuits that calculate outputs of the n signal input latches, and the first logic circuit. And a selector that selects one of the outputs of the second logic circuit according to the logic of the scan signal.

請求項3にかかる発明は、請求項1または2に記載の半導体集積回路において、ソフトマクロに前記第1及び第2の回路ブロックを配置するとともに、ハードマクロに前記第1及び第2の回路ブロックを配置し、前記ソフトマクロの前記第1の回路ブロックと前記ハードマクロの前記第2の回路ブロックとの間を第1の結線で接続し、前記ハードマクロの前記第1の回路ブロックと前記ソフトマクロの前記第2の回路ブロックとの間を第2の結線で接続したことを特徴とする。   According to a third aspect of the present invention, in the semiconductor integrated circuit according to the first or second aspect, the first and second circuit blocks are arranged in a soft macro and the first and second circuit blocks are arranged in a hard macro. The first circuit block of the soft macro and the second circuit block of the hard macro are connected by a first connection, and the first circuit block of the hard macro and the soft The second circuit block of the macro is connected by a second connection.

本発明によれば、検証用の端子ピンや回路を多く必要とせず、ソフトマクロ−ハードマクロ等の回路ブロック間の結線では通常必要な信号のみを用い、その結線の良否を短い時間で検証できる。   According to the present invention, a large number of terminal pins and circuits for verification are not required, and connection between circuit blocks such as a soft macro and a hard macro is normally performed using only necessary signals, and the quality of the connection can be verified in a short time. .

図1は本発明の実施例の半導体集積回路のブロック図である。10はコア領域を構成するソフトマクロ(第1の回路ブロック)、20はI/O領域を構成するハードマクロ(第2の回路ブロック)、30はそのソフトマクロ10とハードマクロ20間の結線、40はそれらソフトマクロ10とハードマクロ20と配線30を含む半導体集積回路である。   FIG. 1 is a block diagram of a semiconductor integrated circuit according to an embodiment of the present invention. 10 is a soft macro (first circuit block) constituting the core area, 20 is a hard macro (second circuit block) constituting the I / O area, 30 is a connection between the soft macro 10 and the hard macro 20, A semiconductor integrated circuit 40 includes the soft macro 10, the hard macro 20, and the wiring 30.

ソフトマクロ10にはフリップフロップからなる信号出力用のラッチFF1〜FF3とフリップフロップからなる信号入力用のラッチFF4〜FF6が備えられ、ハードマクロ20にはフリップフロップからなる信号入力用のラッチFF11〜FF13とフリップフロップからなる信号出力用のラッチFF14〜FF16が備えられている。ラッチFF1の出力はラッチFF11の入力に、ラッチFF2の出力はラッチFF12の入力に、ラッチFF3の出力はラッチFF13の入力に、ラッチFF14の出力はラッチFF4の入力に、ラッチFF15の出力はラッチFF5の入力に、ラッチFF16の出力はラッチFF6の入力に、それぞれ接続されることで、ソフトマクロ10とハードマクロ20の間の結線30が形成され、その間の送受信が可能となっている。   The soft macro 10 includes signal output latches FF1 to FF3 made of flip-flops and signal input latches FF4 to FF6 made of flip-flops, and the hard macro 20 has signal input latches FF11 to FF11 made of flip-flops. Signal output latches FF14 to FF16 each including an FF 13 and a flip-flop are provided. The output of the latch FF1 is input to the latch FF11, the output of the latch FF2 is input to the latch FF12, the output of the latch FF3 is input to the latch FF13, the output of the latch FF14 is input to the latch FF4, and the output of the latch FF15 is latched. By connecting the output of the latch FF16 to the input of the FF5 and the input of the latch FF6, respectively, a connection 30 between the soft macro 10 and the hard macro 20 is formed, and transmission / reception between them is possible.

本実施例では、以上のようなソフトマクロ10とハードマクロ20の間の結線30の良否を検証するために、ソフトマクロ10側にはセレクタS1〜S3を接続してスキャンチェーンを形成可能とし、ナンドゲートNAND1〜NAND4、インバータINV1,INV2、セレクタS4を接続して論理回路を形成している。またハードマクロ20側にもセレクタS11〜S13を接続してスキャンチェーンを形成可能とし、ナンドゲートNAND11〜NAND14、インバータINV11,INV12、セレクタS14を接続して論理回路を形成している。これらのスキャンチェーンや論理回路が、ソフトマクロ10とハードマクロ20の間の結線30の良否を検証するためのスキャン回路を構成している。   In this embodiment, in order to verify the quality of the connection 30 between the soft macro 10 and the hard macro 20 as described above, selectors S1 to S3 can be connected to the soft macro 10 side to form a scan chain, NAND gates NAND1 to NAND4, inverters INV1 and INV2, and selector S4 are connected to form a logic circuit. Further, selectors S11 to S13 can also be connected to the hard macro 20 side to form a scan chain, and NAND gates NAND11 to NAND14, inverters INV11 and INV12, and selector S14 are connected to form a logic circuit. These scan chains and logic circuits constitute a scan circuit for verifying the quality of the connection 30 between the soft macro 10 and the hard macro 20.

さて、通常動作モードでは、端子ピンの選択信号SEL1,SEL2が“0”に設定され、セレクタS1〜S3,S11〜S13は端子bが選択されるので、ソフトマクロ10側の入力信号IN1〜IN3がハードマクロ20側に転送されて出力信号OUT11〜OUT13となる。また、ハードマクロ20側の入力信号IN11〜IN13がソフトマクロ10側に転送されて出力信号OUT1〜OUT3となる。   In the normal operation mode, the terminal pin selection signals SEL1 and SEL2 are set to "0", and the selectors S1 to S3 and S11 to S13 select the terminal b, so that the input signals IN1 to IN3 on the soft macro 10 side are selected. Are transferred to the hard macro 20 side and become output signals OUT11 to OUT13. Further, the input signals IN11 to IN13 on the hard macro 20 side are transferred to the soft macro 10 side to become output signals OUT1 to OUT3.

次に、スキャンモードでは、端子ピンの選択信号SEL1,SEL2が“1”に設定されるので、セレクタS1〜S3,S11〜S13は端子aが選択され、ソフトマクロ10側には端子ピンからスキャン信号SI1が入力し、ハードマクロ20には端子ピンからスキャン信号SI2が入力する。   Next, in the scan mode, since the terminal pin selection signals SEL1 and SEL2 are set to “1”, the selectors S1 to S3 and S11 to S13 select the terminal a, and the soft macro 10 side scans from the terminal pin. The signal SI1 is input, and the scan signal SI2 is input to the hard macro 20 from the terminal pin.

ソフトマクロ10側に入力したスキャン信号SI1は、ラッチFF1の出力に信号X1として現れ、これがラッチFF2とラッチFF11に取り込まれて、それぞれ信号X2,X1’となる。また、信号X2はラッチFF3とラッチFF12に取り込まれて、それぞれ信号X3,X2’となる。さらに、信号X3はラッチFF13に取り込まれて信号X3’となる。そして、ラッチFF11〜FF13の出力X1’〜X3’は、ナンドゲートNAND11〜NAND14とインバータINV11,INV12によって演算され、信号X4,X5としてセレクタS14に入力する。このセレクタS14はスキャン信号SI1が“1”のときは端子aが選択され、“0”のときは端子bが選択される。   The scan signal SI1 input to the soft macro 10 side appears as a signal X1 at the output of the latch FF1 and is taken into the latch FF2 and the latch FF11 to become signals X2 and X1 ', respectively. Further, the signal X2 is taken into the latch FF3 and the latch FF12 to become signals X3 and X2 ', respectively. Further, the signal X3 is taken into the latch FF 13 and becomes a signal X3 '. The outputs X1 'to X3' of the latches FF11 to FF13 are calculated by NAND gates NAND11 to NAND14 and inverters INV11 and INV12, and input to the selector S14 as signals X4 and X5. The selector S14 selects the terminal a when the scan signal SI1 is "1", and selects the terminal b when the scan signal SI1 is "0".

以上から、スキャン信号SI1をソフトマクロ10側に入力するときは、ソフトマクロ10側からハードマクロ20側への結線のスキャンが行われ、図2に示すような動作波形の信号X1〜X3、X1’〜X3’,X4,X5を得ることができ、セレクタS14の出力信号OUTaを検証することにより、ソフトマクロ10側からハードマクロ20側への結線の良否を検証することが可能となる。出力信号OUTaには、スキャン信号SI1が“1”のときは信号X4が出力し、“0”のときは信号X5が出力する。   From the above, when the scan signal SI1 is input to the soft macro 10 side, the connection scan from the soft macro 10 side to the hard macro 20 side is performed, and the operation waveform signals X1 to X3, X1 as shown in FIG. 'To X3', X4, and X5 can be obtained, and the quality of the connection from the soft macro 10 side to the hard macro 20 side can be verified by verifying the output signal OUTa of the selector S14. As the output signal OUTa, the signal X4 is output when the scan signal SI1 is “1”, and the signal X5 is output when the scan signal SI1 is “0”.

ハードマクロ20側にスキャン信号SI2を入力したときも、上記と同様に、セレクタS4の出力信号OUTbを検証することにより、ハードマクロ20側からソフトマクロ10側への結線の良否を検証することが可能となる。   Even when the scan signal SI2 is input to the hard macro 20 side, the quality of the connection from the hard macro 20 side to the soft macro 10 side can be verified by verifying the output signal OUTb of the selector S4 in the same manner as described above. It becomes possible.

以上のように、本実施例では、データ転送用に本来的に備わっているラッチFF1〜FF6,FF11〜FF16に対して、セレクタS1〜S4,S11〜S14、ナンドゲートNAND1〜NAND4,NAND11〜NAND14、インバータINV1,INV2,INV11,INV12を追加するのみで、ソフトマクロ10とハードマクロ20の間の送受信用の結線30の良否を検証することが可能となる。このとき、ソフトマクロ10とハードマクロ20の境界に新たな線路配置は不要であり、またスキャン信号を1回入力するのみで短時間で結線の良否の検証が可能となる。   As described above, in the present embodiment, the selectors S1 to S4, S11 to S14, the NAND gates NAND1 to NAND4, NAND11 to NAND14, Only by adding the inverters INV1, INV2, INV11, and INV12, it is possible to verify the quality of the transmission / reception connection 30 between the soft macro 10 and the hard macro 20. At this time, a new line arrangement is not necessary at the boundary between the soft macro 10 and the hard macro 20, and the quality of the connection can be verified in a short time by inputting the scan signal once.

本発明の実施例の半導体集積回路のブロック図である。It is a block diagram of the semiconductor integrated circuit of the Example of this invention. 図1の半導体集積回路のスキャン時のタイムチャートである。2 is a time chart at the time of scanning of the semiconductor integrated circuit of FIG.

符号の説明Explanation of symbols

10:ソフトマクロ
20:ハードマクロ
30:結線
40:半導体集積回路
10: Soft macro 20: Hard macro 30: Connection 40: Semiconductor integrated circuit

Claims (3)

n(n≧2)個の信号出力用ラッチを有する第1の回路ブロックと、n個の信号入力用のラッチを有する第2の回路ブロックと、前記n個の信号出力用ラッチと前記n個の信号出力用ラッチの間をそれぞれ接続する結線とを具備する半導体集積回路において、
前記第1の回路ブロックに、前記n個の信号出力用ラッチを通常入力信号から切り離し且つスキャン信号に対してシフトレジスタ状に接続するn個のセレクタを配置し、
前記第2の回路ブロックに、前記n個の信号入力用ラッチの出力を論理処理する論理回路を配置し、
前記スキャン信号を入力したときの前記論理回路の出力により前記結線の良否の検証が行われるようにしたことを特徴とする半導体集積回路。
a first circuit block having n (n ≧ 2) signal output latches, a second circuit block having n signal input latches, the n signal output latches, and the n signal output latches. In a semiconductor integrated circuit comprising a connection for connecting the signal output latches of
In the first circuit block, n selectors for separating the n signal output latches from the normal input signal and connecting the scan signal in a shift register form are arranged,
In the second circuit block, a logic circuit for logically processing the outputs of the n signal input latches is arranged,
A semiconductor integrated circuit characterized in that the quality of the connection is verified by the output of the logic circuit when the scan signal is input.
請求項1に記載の半導体集積回路において、
前記論理回路は、前記n個の信号入力用ラッチの出力を演算する第1および第2の論理回路と、該第1および第2の論理回路の出力の一方を前記スキャン信号の論理に応じて選択するセレクタとを具備することを特徴とする半導体集積回路。
The semiconductor integrated circuit according to claim 1,
The logic circuit is configured to output one of the first and second logic circuits for calculating the outputs of the n signal input latches and one of the outputs of the first and second logic circuits according to the logic of the scan signal. A semiconductor integrated circuit comprising a selector for selecting.
請求項1または2に記載の半導体集積回路において、
ソフトマクロに前記第1及び第2の回路ブロックを配置するとともに、ハードマクロに前記第1及び第2の回路ブロックを配置し、
前記ソフトマクロの前記第1の回路ブロックと前記ハードマクロの前記第2の回路ブロックとの間を第1の結線で接続し、
前記ハードマクロの前記第1の回路ブロックと前記ソフトマクロの前記第2の回路ブロックとの間を第2の結線で接続したことを特徴とする半導体集積回路。
The semiconductor integrated circuit according to claim 1 or 2,
Arranging the first and second circuit blocks in a soft macro and arranging the first and second circuit blocks in a hard macro;
Connecting the first circuit block of the soft macro and the second circuit block of the hard macro with a first connection;
2. A semiconductor integrated circuit, wherein the first circuit block of the hard macro and the second circuit block of the soft macro are connected by a second connection.
JP2004103923A 2004-03-31 2004-03-31 Semiconductor integrated circuit Expired - Fee Related JP4530703B2 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394183A (en) * 1989-05-19 1991-04-18 Fujitsu Ltd Testing method for semiconductor integrated circuit and circuit therefor
JPH11218559A (en) * 1998-02-02 1999-08-10 Nec Corp Method and circuit for testing logic lsi
JP2000046914A (en) * 1998-07-29 2000-02-18 Sony Corp Inspection apparatus
JP2001034650A (en) * 1999-07-19 2001-02-09 Nec Corp Design method of semiconductor device, and storage medium storing arrangement and wiring information of circuit element
JP2001183424A (en) * 1999-12-27 2001-07-06 Toshiba Corp Integrated circuit and its design method
JP2001235513A (en) * 2000-02-21 2001-08-31 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit device and its test method
JP2003344500A (en) * 2002-05-29 2003-12-03 Nec Electronics Corp Macro test circuit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0394183A (en) * 1989-05-19 1991-04-18 Fujitsu Ltd Testing method for semiconductor integrated circuit and circuit therefor
JPH11218559A (en) * 1998-02-02 1999-08-10 Nec Corp Method and circuit for testing logic lsi
JP2000046914A (en) * 1998-07-29 2000-02-18 Sony Corp Inspection apparatus
JP2001034650A (en) * 1999-07-19 2001-02-09 Nec Corp Design method of semiconductor device, and storage medium storing arrangement and wiring information of circuit element
JP2001183424A (en) * 1999-12-27 2001-07-06 Toshiba Corp Integrated circuit and its design method
JP2001235513A (en) * 2000-02-21 2001-08-31 Matsushita Electric Ind Co Ltd Semiconductor integrated circuit device and its test method
JP2003344500A (en) * 2002-05-29 2003-12-03 Nec Electronics Corp Macro test circuit

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