JP2005286039A - Jig for removing module, and removing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig for removing module which can remove, in a state with all the components remaining packaged at a module substrate side, as they are, to easily re-package the component removed, and to provide a removing method. <P>SOLUTION: The reworking unit of the modular removal jig includes a hot wind guide 8 which guides a hot wind, and a suction nozzle 9 for sucking a component and module to be removed. A metal cover 6 is put on a module substrate which constitutes a module to be removed which reworks. A connector is temporarily fixed by a silicone resin 7 to the module substrate side. When the module is removed, hot wind passes through the gap of the hot wind guide, the suction nozzle and the metal cover, and hits the hot wind only to the lower side of the connector. Only the solder connecting part of the lower side of the connector is melted and sucked to the metal cover, by the suction force of the suction nozzle. The metal cover is sucked. the module to be removed is pulled up, and the module to be removed is removed from a main substrate 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a module removal jig and a removal method, and in particular, when a defect occurs in a part of a module or a soldered portion, the module is removed from the main board without destroying, and the defective portion is repaired. In particular, the present invention relates to a module removal jig and a removal method that can be remounted on a main board.

Conventional semiconductor package removal jig and removal method are:
As a conventional technique, there is JP-A-10-163262 (see Patent Document 1).

  This can minimize the heat effect on the periphery of the semiconductor package, and it is not necessary to secure a dedicated space around the semiconductor package. This is a replacement jig that enables high-density mounting.

  An exchange jig used when removing a surface-mounting type semiconductor package from a circuit board includes a flat jig body.

  The jig body is supported by the package body of the semiconductor package, is interposed between the package body and the circuit board, and is heated or heated to a temperature sufficient to melt the solder that joins the solder bumps and the pads. .

  The jig main body is formed with a plurality of openings into which the solder bumps enter.

  The package exchanging jig disclosed in Japanese Patent Laid-Open No. 10-163262 is a jig used for exchanging a surface mount type semiconductor package having a large number of solder balls such as a ball grid array (BGA), and exchanging the semiconductor package. The present invention relates to a method, and a circuit module obtained by surface-mounting a semiconductor package on a circuit board, and further relates to an electronic device such as a portable computer equipped with the circuit module.

  As a surface mount type semiconductor package, a ball grid array (BGA) type semiconductor package is known.

  This type of semiconductor package includes a plastic BGA using a printed circuit board as a package substrate, a ceramic BGA using a ceramic as a package substrate, and a tape BGA using a film as a package substrate. It is properly used according to the purpose.

  Among such BGAs, the plastic BGA has an IC chip bonded to a printed circuit board, and a synthetic resin molding material for molding the IC chip, and a flat box is formed by the molding material and the printed circuit board. A package body is formed.

  A large number of ball-shaped solder bumps are arranged in a matrix on the back surface of the printed circuit board.

  The solder bumps function as external terminals of the semiconductor package and are soldered to the back surface of the printed board.

  This BGA type semiconductor package is mounted on a circuit board.

  The circuit board has a mounting surface on which a semiconductor package is mounted.

  A large number of pads are arranged in a matrix on the mounting surface.

  The pads are electrically connected to conductor patterns formed on the circuit board, and solder bumps of the semiconductor package are soldered to these pads.

  In this type of semiconductor package, since the soldered portion between the solder bump and the pad is located in a minute gap between the package body and the circuit board, only the peripheral portion is soldered QFP (quad flat package) ), The soldered part cannot be directly exposed to the outside.

  For this reason, when it is necessary to replace the semiconductor package due to an IC chip defect or the like, conventionally, heat is applied to the mounting portion of the semiconductor package with a dedicated facility such as air reflow to join the solder bump and the pad. By melting the solder that is being used, the semiconductor package is removed from the mounting surface of the circuit board.

  However, according to this configuration, not only the semiconductor package to be replaced, but also other circuit components and semiconductor packages located around the semiconductor package are heated to a high temperature. It becomes very large and causes defects.

  In addition, when a circuit component with low heat resistance is located around the semiconductor package to be replaced, the circuit component with low heat resistance is temporarily temporarily mounted on the circuit board before heating the mounting portion of the semiconductor package. It is necessary to remove from the heat and prevent damage to the circuit components due to heat.

  Therefore, the number of work steps increases, and there arises a problem that a lot of labor and labor are required for the semiconductor package removal work.

  In order to cope with such a problem, a replacement jig has been devised so that the soldered portion between the solder bump and the pad can be directly heated.

  This replacement jig has a jig main body including a plurality of flat heating parts having a comb-like shape.

  The jig body is made of a material having thermal conductivity, and one end of the jig body is formed with a connection port into which a heat source such as a soldering iron or a heater is inserted.

To remove the semiconductor package from the circuit board using such a replacement jig, first, the heating part of the jig body is inserted into the gap between the circuit board and the package body, and this heating part is adjacent to the solder bump. Position between. Since the heating part is heated by heat transfer from the heat source, the heat of the heating part is concentrated and transmitted to the soldering part between the solder bump and the pad, and the solder joining the solder bump and the pad is melted. .
Therefore, the soldering between the solder bump and the pad can be easily released while suppressing the thermal influence on the circuit components around the semiconductor package to be replaced, and the semiconductor package can be removed.

  However, the above conventional replacement jig requires that the comb-shaped jig body be inserted into the gap between the semiconductor package and the circuit board, so that other circuit components are arranged around the semiconductor package. If this is the case, this circuit component becomes an obstacle, making it impossible to insert the jig body into the gap.

  Therefore, to use the replacement jig, first, remove the circuit components located around the semiconductor package to be replaced from the circuit board, and secure a space for the jig body around the semiconductor package. I have to do it.

  Therefore, there are problems that the number of work steps is increased, and a great deal of labor and labor is required for the work of removing the semiconductor package.

  Moreover, since the replacement jig cannot be used unless there is a space around the semiconductor package, a large number of circuit components cannot be mounted on the mounting surface of the circuit board at a high density.

  As a result, a dead space is generated on the circuit board, which causes problems such as unreasonable arrangement of circuit components including the semiconductor package and an increase in the size of the circuit board.

  Therefore, the package replacement jig disclosed in Japanese Patent Laid-Open No. 10-163262 can suppress the influence of heat on the periphery of the semiconductor package to be removed as much as possible, and it is necessary to secure a dedicated space around the semiconductor package. In addition, an object of the present invention is to obtain a replacement jig and a replacement method that can easily perform a semiconductor package removal operation and can be mounted at a high density, and a circuit module and an electronic device on which the circuit module is mounted.

  To achieve the above object, the semiconductor package having a large number of solder bumps arranged in a matrix on the back surface of the package body is used for removing from a circuit board having a large number of pads to which the solder bumps are soldered. A jig that is supported by the package body and is interposed between the package body and the circuit board, and melts the solder that joins the solder bump and the pad. A flat jig main body that generates heat or is heated to a sufficient temperature and a plurality of openings that are formed in the jig main body and into which the solder bumps enter.

  In such a configuration, in order to remove the semiconductor package from the circuit board, first, the jig body of the replacement jig is heated or heated.

  Then, since the solder bump is located inside the opening of the jig body, the heat of the jig body is directly transmitted to the solder joining the solder bump and the pad through the opening periphery of the opening. This solder melts.

  When the solder is melted, the replacement jig is slid along the circuit board together with the semiconductor package.

  By this slide, the opening periphery of the opening comes into contact with the molten solder, and the solder is divided.

  As a result, the soldering between the solder bump and the pad is released, and the semiconductor package can be removed from the circuit board.

  Since such a replacement jig is mounted on the circuit board together with the semiconductor package in advance, the soldered portion between the solder bump and the pad can be directly and intensively heated, and heat to the periphery of the semiconductor package can be obtained. Impact is reduced.

  In addition, since it is not necessary to insert the jig body into the minute gap between the semiconductor package and the circuit board, there is no problem even if other circuit components are arranged around the semiconductor package.

  Therefore, the troublesome and troublesome work of once removing circuit components around the semiconductor package becomes unnecessary, and the work man-hours are reduced accordingly, and the semiconductor package can be easily removed.

  At the same time, it is not necessary to secure a space for inserting and removing the replacement jig around the semiconductor package to be removed, so that dead space can be eliminated from the circuit board and high-density mounting becomes possible.

  As described above, according to the package replacement jig of Japanese Patent Laid-Open No. 10-163262, the replacement jig is previously mounted on the circuit board together with the semiconductor package, so that solder bumps and pads are soldered together. The part can be heated directly and intensively, and the thermal influence on the periphery of the semiconductor package is reduced.

  In addition, since it is not necessary to insert the jig body into the minute gap between the semiconductor package and the circuit board, there is no problem even if other circuit components are arranged around the semiconductor package.

  Therefore, the troublesome and troublesome work of once removing circuit components around the semiconductor package becomes unnecessary, and the work man-hours are reduced accordingly, and the semiconductor package can be easily removed.

  At the same time, there is no need to secure a space for inserting and removing the replacement jig around the semiconductor package to be removed, so that there is an advantage that dead space can be eliminated from the circuit board and high-density mounting becomes possible. is there.

JP-A-10-163262 (paragraphs [0001] to [0021] and [0110] to [0111])

The conventional module removal jig and removal method described above are:
The first problem is that it can only be used as a limited replacement jig that can only remove a special type of semiconductor package.

  The reason is that the replacement jig has a structure that can only be removed from a ball grid array (BGA) type semiconductor package in which a small gap is formed between the semiconductor package and the circuit board. is there.

  The second problem is that the replacement jig must be previously mounted on the circuit board integrally with the semiconductor package, and many replacement jigs are required.

The reason is that in order to remove a ball grid array (BGA) type semiconductor package in which a small gap is formed between the semiconductor package and the circuit board, a replacement jig is provided between the semiconductor package and the circuit board at the removal stage. This is because the replacement jig must be embedded in advance, and the replacement jig must be embedded in the semiconductor package that is expected to be removed.
(Object of invention)
Therefore, the object of the present invention is to remove the module from the main board without destroying it, repair the defective part, and re-mount the module. Module removal jig and removal method that can be removed with all components mounted on the module board side in order to easily remount the removed components of various types mounted on the board Is to provide.

According to a first aspect of the present invention, there is provided a module removal jig in which a connector between a main board and a module board of a module constituting the module to be removed is connected to the module board and the main terminal. In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected by soldering to each substrate, hot air is removed when the module to be removed is removed from the main substrate. A hot air guide that leads to a lower terminal of the connector of the module board, a suction nozzle for sucking a component to be removed and a module, a hot air blocking inner wall that prevents the hot air from protecting the parts mounted on the suction nozzle and mounted on the module board With
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
Removal of a module, wherein the removed component and module are sucked by an suction force of an air suction machine connected to the suction nozzle, the removed module is pulled up, and the removed module is removed from the main board. jig.

The module removal jig according to the second aspect of the present invention is the module substrate between the module substrate constituting the main substrate and the module to be removed via the connector, the upper terminal and the lower terminal constituting the connector being the module substrate and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate, A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig.

The module removal jig according to a third aspect of the present invention is the module substrate between the module board of the module constituting the main board and the module to be removed via the connector, the upper terminal and the lower terminal constituting the connector being the module board and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig.

The module removal jig according to a fourth aspect of the present invention is the module substrate including the main substrate and the module substrate of the module to be removed via the connector, the upper terminal and the lower terminal constituting the connector being the module substrate, In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig.

The module removal jig according to a fifth aspect of the present invention is the module substrate between the module substrate of the module constituting the main substrate and the module to be removed via the connector, the upper terminal and the lower terminal constituting the connector being the module substrate and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate, A hot air guide for guiding hot air to the lower terminal of the connector of the module board, a suction nozzle for sucking a component to be removed and a module, and a hot air shield for preventing the component mounted on the suction nozzle from being mounted on the module board from the hot air An inner wall,
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal jig characterized by performing removal.

The module removal jig according to a sixth aspect of the present invention is the module substrate between the module substrate of the module constituting the main substrate and the module to be removed via the connector, the upper terminal and the lower terminal constituting the connector being the module substrate and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate, A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and an adsorption nozzle for adsorbing the component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

The module removal jig according to a seventh aspect of the present invention is a module removal jig comprising a main board and a module board of a module constituting the module to be removed via a connector, the upper terminal and the lower terminal constituting the connector being the module board and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

The module removal jig according to an eighth aspect of the present invention is the module substrate and the module substrate of the module constituting the module to be removed via the connector, the upper terminal and the lower terminal constituting the connector are connected to the module substrate and the module substrate. In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

A module removal jig according to a ninth aspect of the present invention is a module removal jig comprising a main board and a module board of a module constituting the removal module via a connector, the upper terminal and the lower terminal constituting the connector being the module board and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate, A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

The module removal jig according to the tenth aspect of the present invention is the module substrate between the module board of the module constituting the main board and the module to be removed via the connector, the upper terminal and the lower terminal constituting the connector being the module board and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

The module removal jig of the eleventh aspect of the invention is the module substrate between the module substrate constituting the module to be removed and the main substrate via the connector, the upper terminal and the lower terminal constituting the connector being the module substrate and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

A module removal jig according to a twelfth aspect of the invention is an electronic circuit device in which a module substrate of a module constituting a module to be removed is mounted on a main substrate by a ball grid array, and the module to be removed is removed from the main substrate. A hot air guide for guiding the hot air to the module substrate, a suction nozzle for sucking the component to be removed and the module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and the component mounted on the module substrate from the hot air, Prepared,
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
Removal of a module, wherein the removed component and module are sucked by an suction force of an air suction machine connected to the suction nozzle, the removed module is pulled up, and the removed module is removed from the main board. jig.

According to a thirteenth aspect of the present invention, there is provided a module removal jig for removing a module to be removed from the main board in an electronic circuit device in which a module board of a module constituting the module to be removed is mounted on a main board by a ball grid array. A hot air guide for guiding the hot air to the module substrate, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig.

According to a fourteenth aspect of the present invention, there is provided a module removal jig for removing a module to be removed from the main board in an electronic circuit device in which a module board of a module constituting the module to be removed is mounted on a main board by a ball grid array. A hot air guide for guiding the hot air to the module substrate, a suction nozzle for sucking the component to be removed and the module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and the component mounted on the module substrate from the hot air, Prepared,
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal jig characterized by performing removal.

A module removal jig according to a fifteenth aspect of the invention is an electronic circuit device in which a module substrate of a module constituting a module to be removed is mounted on a main substrate by a ball grid array, and the module to be removed is removed from the main substrate. A hot air guide for guiding the hot air to the module substrate, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

According to a sixteenth aspect of the present invention, there is provided a module removing jig for removing a module to be removed from the main board in an electronic circuit device in which a module board of a module constituting the module to be removed is mounted on a main board by a ball grid array. A hot air guide for guiding the hot air to the module substrate, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

According to a seventeenth aspect of the present invention, there is provided a module removing jig for removing the module to be removed from the main board in an electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board through the through hole. A hot air guide for guiding the hot air to the module substrate, and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig.

According to an eighteenth aspect of the present invention, there is provided an electronic circuit device in which a module substrate of a module constituting a module to be removed is mounted on a main board through a through hole. A hot air guide for guiding the hot air to the module substrate, and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

The module removal jig according to the nineteenth aspect of the present invention is the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main board through the through hole, and the module to be removed is removed from the main board. A hot air guide for guiding the hot air to the module substrate, and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The portion of the metal cover that sandwiches the module substrate is folded inward into an L-shaped configuration to sandwich the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module.

A module removing method according to a twentieth aspect of the present invention is the module removing method, wherein the main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are connected to the module board and the module board. In an electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected by soldering to the main substrate, when the module to be removed is removed from the main substrate, A hot air guide that guides the module board to the lower terminal of the module board, a component to be removed and a suction nozzle for sucking the module, and a hot air blocking inner wall that prevents the component mounted on the suction nozzle from being mounted on the module board from the hot air And a module with A removal method of a module in the Disconnect jig,
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
Removal of the module, wherein the module and the module to be removed are sucked by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. Method.

According to a twenty-first aspect of the present invention, there is provided a method for removing a module, comprising: a main board and a module board of a module constituting the module to be removed via a connector; the upper terminal and the lower terminal constituting the connector are connected to the module board and the module board; In an electronic circuit device in which a module substrate of a module constituting the module to be removed is mounted on the main substrate, which is soldered and connected to the main substrate, when removing the module to be removed from the main substrate, A module removal method in a module removal jig comprising: a hot air guide for guiding the module to the lower terminal of the connector of the module board; and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove.

According to a twenty-second aspect of the present invention, there is provided a method for removing a module, comprising: a main board and a module board of a module constituting the module to be removed via a connector, the upper terminal and the lower terminal constituting the connector being the module board and In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove.

The module removing method according to a twenty-third aspect of the present invention is the module removing method, wherein the main board and the module board of the module constituting the module to be removed are connected via the connector, and the upper terminal and the lower terminal constituting the connector are connected to the module board and the module board. In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove.

According to a twenty-fourth aspect of the present invention, there is provided a method for removing a module, comprising: a main board and a module board of a module constituting the module to be removed via a connector, the upper terminal and the lower terminal constituting the connector being the module board and the module board; In an electronic circuit device in which a module substrate of a module constituting the module to be removed is mounted on the main substrate, which is soldered and connected to the main substrate, when removing the module to be removed from the main substrate, A hot air guide that guides the module board to the lower terminal of the module substrate, a component to be removed and a suction nozzle for sucking the module, and a hot air blocking inner wall that prevents the component mounted on the suction nozzle from being mounted on the module substrate from the hot air And a module with A removal method of a module in the Disconnect jig,
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal method characterized by performing removal of.

According to a twenty-fifth aspect of the present invention, there is provided a method for removing a module, comprising: a main board and a module board of the module constituting the module to be removed via a connector; In an electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected by soldering to the main substrate, when the module to be removed is removed from the main substrate, A module removal method in a module removal jig comprising: a hot air guide that guides to a lower terminal of the connector of the module board; and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

According to a twenty-sixth aspect of the present invention, there is provided a method for removing a module, wherein a connector is provided between a module board of a module constituting a main board and a module to be removed, and an upper terminal and a lower terminal constituting the connector are connected to the module board and the module board. In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

According to a twenty-seventh aspect of the present invention, there is provided a method of removing a module, wherein a connector is provided between a module board of a module constituting a main board and a module to be removed, and an upper terminal and a lower terminal constituting the connector are connected to the module board and the module board. In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

According to a twenty-eighth aspect of the present invention, there is provided a method of removing a module, wherein a connector is provided between a module board of a module constituting a main board and a module to be removed, and an upper terminal and a lower terminal constituting the connector are connected to the module board and the module board. In an electronic circuit device in which a module substrate of a module constituting the module to be removed is mounted on the main substrate, which is soldered and connected to the main substrate, when removing the module to be removed from the main substrate, A module removal method in a module removal jig comprising: a hot air guide for guiding the module to the lower terminal of the connector of the module board; and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

The module removing method according to a twenty-ninth aspect of the present invention is the module removing method according to the present invention, wherein the main board and the module board of the module constituting the module to be removed are connected via the connector, and the upper terminal and the lower terminal constituting the connector are connected to the module board and the module board. In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

The module removing method according to the thirtieth aspect of the present invention is the module removing method, wherein the main board and the module board of the module constituting the module to be removed are connected via the connector, and the upper terminal and the lower terminal constituting the connector are connected to the module board and the module board. In the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate, which is connected to the main substrate by soldering, when removing the module to be removed from the main substrate,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

The module removing method according to the thirty-first aspect is the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main substrate by a ball grid array, and the module to be removed is removed from the main substrate. A hot air guide for guiding the hot air to the module substrate, a suction nozzle for sucking the component to be removed and the module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and the component mounted on the module substrate from the hot air. A module removal method in a module removal jig,
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
Removal of the module, wherein the module and the module to be removed are sucked by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. Method.

According to a thirty-second aspect of the present invention, there is provided a method of removing a module, wherein the module to be removed is mounted on the main board by a ball grid array and the module to be removed is mounted on the main board. A module removal method in a module removal jig comprising: a hot air guide for guiding hot air to the module substrate; and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove.

According to a thirty-third aspect of the present invention, there is provided a method of removing a module, wherein the module to be removed is mounted on the main board by a ball grid array and the module to be removed is mounted on the main board. A hot air guide for guiding the hot air to the module substrate, a suction nozzle for sucking the component to be removed and the module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and the component mounted on the module substrate from the hot air. The module removal method in the module removal jig,
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal method characterized by performing removal of.

According to a thirty-fourth aspect of the present invention, in the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board by the ball grid array, the module to be removed is removed from the main board. A module removal method in a module removal jig comprising: a hot air guide for guiding hot air to the module substrate; and a suction nozzle for sucking the parts to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

A module removing method according to a thirty-fifth aspect of the invention is an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, and the module to be removed is removed from the main board. A module removal method in a module removal jig comprising: a hot air guide for guiding hot air to the module substrate; and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

The module removing method of the thirty-sixth aspect of the invention is an electronic circuit device in which a module substrate of a module constituting a module to be removed is mounted on a main board through a through hole, and the module to be removed is removed from the main board. A module removal method in a module removal jig comprising a hot air guide for guiding hot air to the module substrate, and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove.

The module removing method of the thirty-seventh aspect of the present invention is the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main board through the through hole, and when the module to be removed is removed from the main board. A module removal method in a module removal jig comprising a hot air guide for guiding hot air to the module substrate, and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

The module removing method according to the thirty-eighth aspect of the present invention is the electronic circuit device in which the module substrate of the module constituting the module to be removed is mounted on the main board through the through hole. A module removal method in a module removal jig comprising a hot air guide for guiding hot air to the module substrate, and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The portion of the metal cover that sandwiches the module substrate is folded inward into an L-shaped configuration to sandwich the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module.

  The module removal jig according to claim 3, 7, or 10, wherein the module removal jig of the thirty-ninth invention uses an adhesive as a screw.

  The module removal jig according to claim 4, 8, or 11, wherein the module removal jig according to the 40th aspect of the present invention is a screw made of silicon resin constituting the adhesive.

  The module removal jig according to claim 3, 7, or 10, wherein the module removal jig of the forty-first aspect of the present invention uses an adhesive as a fitting structural component.

  The module removal jig according to claim 4, 8, or 11, wherein the module removal jig according to the forty-second aspect of the present invention uses a silicon resin constituting an adhesive as a fitting structural component. Ingredients.

  30. The module removing method according to claim 22, 26, or 29, wherein the module removing method according to the 43rd aspect of the present invention uses an adhesive as a screw.

  32. The module removing method according to claim 23, 27, or 30, wherein the module removing method according to the 44th aspect of the present invention uses a silicon resin constituting the adhesive as a screw.

  30. The module removal method according to claim 22, 26, or 29, wherein the module removal method of the forty-fifth aspect of the present invention uses an adhesive as a fitting structural component.

  The module removing method according to claim 23, claim 27, or claim 30, wherein the module removing method of the 46th invention uses a silicon resin constituting the adhesive as a fitting structural component.

  The first effect is that the removed module can be easily repaired and re-mounted.

  The reason is that the entire module can be removed without breaking, and the metal cover and adhesive can be easily removed.

  The second effect is that the thermal stress applied to the components on the upper surface of the module can be minimized.

  The reason is that the module upper surface is covered with a metal cover, and hot air is not directly applied to the upper surface of the metal cover.

  Next, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing the external appearance of a module to be removed according to an embodiment of a module removal jig and method of the present invention.

  FIG. 2 is a cross-sectional view showing a cross section of the module to be removed according to one embodiment of the module removal jig and method of the present invention.

The perspective view which shows the external appearance of the to-be-removed module shown in FIG. 1, and sectional drawing which shows the cross section of the to-be-removed module of FIG. 2 are referred.
The module to be removed is mounted with various LSI parts 3 constituting the module, various chip parts 4 and connectors 5 connected to the main board 2 on the front and back surfaces of the module board 1 of the module to be removed. The module board 1 is mounted via a connector 5 for connecting the module substrate 1 to constitute a module to be removed.
Various LSI parts 3 that are a plurality of large-scale integrated circuits (LSIs) and various chip parts 4 that are chip electronic parts are mounted on the module.

  For this reason, when a defect occurs in a part of the module or a soldered portion, the defective module cannot be discarded.

  Therefore, it is required that the module can be removed from the main board 2 without being destroyed, a defective portion can be repaired and re-mounted.

  In mounting the module, all components are mounted on both sides of the module substrate 1 and finally mounted on the main substrate 2.

  Therefore, in order to easily remount the removed components, it is necessary to remove the components while all the components are mounted on the module substrate 1 side.

  FIG. 4 is a cross-sectional view showing the configuration of the module removal jig and removal method of the first embodiment in the development process of the present invention.

  When the module is removed, the various LSI components 3 mounted on the module at the lower end of the suction nozzle 9 are attracted by an external air suction device (not shown) connected to the upper end of the suction nozzle 9. Stick.

The suction force attracts the various LSI components 3 from the hollow portion provided in the central portion of the suction nozzle 9 shown in FIG.
When removing the module, first, hot air is sent from the external heater (not shown) to the rework device, which is the module removal jig of the present invention, as shown in FIG. 4, and the module solder is melted. Let

  As indicated by the black arrows in FIG. 4, the hot air is applied only to the lower side of the connector 5 by the hot air guide 8, the suction nozzle 9 and the hot air blocking inner wall 10, and solder connection on the lower side of the connector 5 is performed. Attempt to melt only the part.

  Next, after connecting an external air suction device to the upper end portion of the suction nozzle 9 of the rework device, various LSIs mounted on the module at the lower end portion of the suction nozzle 9 using the suction force of the external air suction device. Stick to part 3.

  An attempt was made to remove the module to be removed from the main board 2 by lifting the module to be removed in the direction of the white arrow shown in FIG.

  Most of the modules to be removed are pulled up, and the modules to be removed can be removed from the main board.

  However, in fact, heat is transmitted even in a place where direct hot air is not applied, and the solder of the adsorbed component (in the case of the embodiment shown in FIG. 4, various LSI components 3) melts and the component (FIG. 4). In the case of this embodiment, there is a problem that only the various LSI parts 3) are removed.

  FIG. 5 is a cross-sectional view showing the configuration of the module removal jig and removal method of the second embodiment in the development process of the present invention.

  Then, as shown in FIG. 5, the module substrate was covered with a metal cover 6 and removed.

  When the module is removed, a metal cover 6 is put on the upper side of the module substrate 1 as shown in FIG.

  When the module is removed, the metal cover 6 is sucked by the lower end portion of the suction nozzle 9 by the suction force of an external air suction machine (not shown) connected to the upper end portion of the suction nozzle 9.

The suction force attracts the metal cover 6 in the upward direction indicated by the white arrow in FIG.
When removing the module, first, hot air is sent from the external heater (not shown) to the rework device, which is the module removal jig of the present invention, as shown in FIG. 5 to melt the module solder. Let

  As indicated by the black arrows in FIG. 5, the hot air passes through the gap between the hot air guide 8, the suction nozzle 9 and the metal cover 6 so that the hot air hits only the lower side of the connector 5. Attempt to melt only the solder joints.

  Next, after connecting an external air suction device to the upper end portion of the suction nozzle 9 of the rework device, the suction force of the external air suction device is used to suck the metal cover 6 at the lower end portion of the suction nozzle 9.

  With the rework device, the module to be removed was pulled up in the direction of the white arrow shown in FIG. 5 and an attempt was made to remove the module to be removed from the main board 2.

  The module substrate 1 held by the metal cover 6 together with the metal cover 6 sucked by the suction force of the suction nozzle 9 is removed from the main substrate 2.

  Here, as a structure of the metal cover 6, a part of the metal cover 6 that holds the module substrate 1 is bent inward into an L-shaped configuration to hold the module substrate 1.

  The tip of the metal cover 6 is L-shaped and bent inward so that the module substrate 1 held by the metal cover 6 can be easily pulled up when it is removed from the main substrate 2.

  On the contrary, when the metal cover 6 is put on the module substrate 1, it becomes difficult to cover the module substrate 1 by folding the portion of the metal cover 6 that holds the module substrate 1 in an L-shaped configuration.

  For this reason, when covering, the module board 1 is held by opening the lower end part containing an L-shaped component part outside, holding the module board 1, and squeezing it inside.

  The hot air passes through the gap between the hot air guide 8, the suction nozzle 9 and the metal cover 6 and is sent so as to directly hit the lower solder connection portion of the connector 5.

  After the solder in the lower solder connection portion of the connector 5 is heated and melted by hot air, an external air suction machine is connected to the upper end portion of the suction nozzle 9 of the rework device, which is a module removal jig.

  After an external air suction device is connected to the upper end of the suction nozzle 9 of the rework device, the suction force of the external air suction device is used to suck the metal cover 6 at the lower end of the suction nozzle 9.

  The module to be removed is pulled up together with the metal cover 6 by the rework device, and the module to be removed is removed from the main board 2.

  Most of the modules to be removed are pulled up, and the modules to be removed can be removed from the main board.

  However, although the components on the upper surface of the module substrate 1 could be removed while being mounted, there was a problem that the connector 5 remained on the main substrate 2.

  Therefore, the best mode for carrying out the present invention will be described in detail with reference to FIG.

  FIG. 3 is a cross-sectional view showing a configuration of an embodiment of a module removal jig and removal method according to the best mode of the present invention.

  Referring to FIG. 3, the module to be reworked is covered with a metal cover 6, the connector 5 is temporarily fixed to the module substrate 1 side with a silicone resin 7 constituting an adhesive, and the solder below the connector 5 to be melted by the rework device By improving the attachment part so that it is directly exposed to hot air, the module can be repaired and removed for reuse.

  When removing this module, as shown in FIG. 3, a metal cover 6 is placed on the upper side of the module substrate 1.

  When the module is removed, the metal cover 6 is sucked by the lower end portion of the suction nozzle 9 by the suction force of an external air suction machine (not shown) connected to the upper end portion of the suction nozzle 9.

The suction force attracts the metal cover 6 in the upward direction indicated by the hollow arrow in FIG. 3 from the hollowed portion provided in the central portion of the suction nozzle 9 shown in FIG.
When removing the module, first, hot air is sent from the external heater (not shown) to the rework device, which is the module removal tool of the present invention, as shown in FIG. 3, and the module solder is melted. Let

  As shown by the black arrows in FIG. 3, the hot air passes through the gap between the hot air guide 8, the suction nozzle 9 and the metal cover 6 so that the hot air hits only the lower side of the connector 5. Only the solder connection is melted.

  Next, after connecting an external air suction device to the upper end portion of the suction nozzle 9 of the rework apparatus, the suction force of the external air suction device is used to suck the metal cover 6 at the lower end portion of the suction nozzle 9.

  With the rework device, the module to be removed is pulled up in the direction of the white arrow shown in FIG. 3, and the module to be removed is removed from the main board 2.

  The module substrate 1 held by the metal cover 6 together with the metal cover 6 sucked by the suction force of the suction nozzle 9 is removed from the main substrate 2.

  Here, as a structure of the metal cover 6, a part of the metal cover 6 that holds the module substrate 1 is bent inward into an L-shaped configuration to hold the module substrate 1.

  The tip of the metal cover 6 is L-shaped and bent inward so that the module substrate 1 held by the metal cover 6 can be easily pulled up when it is removed from the main substrate 2.

  On the contrary, when the metal cover 6 is put on the module substrate 1, it becomes difficult to cover the module substrate 1 by folding the portion of the metal cover 6 that holds the module substrate 1 in an L-shaped configuration.

  For this reason, when covering, the module board 1 is held by opening the lower end part containing an L-shaped component part outside, holding the module board 1, and squeezing it inside.

  Further, the solder connection portion of the connector 5 on the module substrate 1 side is coated with an adhesive silicon resin 7 made of silicon that can be easily cured and peeled off, and the connector 5 and the module substrate 1 are temporarily fixed.

  The silicon resin 7 of this adhesive is applied and the connector 5 and the module substrate 1 are temporarily fixed, so that the solder on the module substrate 1 side solder connection portion of the connector 5 at the time of removal melts, and the connector 5 becomes the module substrate. This is to prevent falling off from 1.

  Further, in order to prevent the connector 5 from being detached from the module substrate 1, the connector 5 and the module substrate 1 are temporarily fixed by screws or mating structure parts as another means and method instead of applying with an adhesive. There are means and methods.

The rework device, which is a module removal jig according to the present invention, is simply shown. The rework device includes a hot air guide 8 that guides hot air, and a suction nozzle 9 that sucks components and modules to be removed.
When removing a module, as shown in FIG. 3, hot air is sent from an external heater (not shown) to a rework apparatus, which is a module removal jig of the present invention, and the module solder is melted.

  The hot air passes through the gap between the hot air guide 8, the suction nozzle 9 and the metal cover 6 and is sent so as to directly hit the lower solder connection portion of the connector 5.

  After the solder at the lower solder connection portion of the connector 5 is heated and melted by hot air, an external air suction machine is connected to the upper end portion of the suction nozzle 9 of the rework device as a module removal jig.

  After the external air suction device is connected to the upper end portion of the suction nozzle 9 of the rework apparatus, the suction force of the external air suction device is used to suck the metal cover 6 at the lower end portion of the suction nozzle 9.

  The module to be removed is pulled up together with the metal cover 6 by the rework device, and the module to be removed is removed from the main board 2.

  Next, the operation of the best mode for carrying out the present invention will be described with reference to the drawings.

  The operation when removing the module will be described with reference to FIG.

  1. First, the module substrate 1 side solder connection portion of the connector 5 of the module substrate 1 to be removed is temporarily fixed to the module substrate 1 side by applying an adhesive made of a small amount of silicon resin 7.

  2. A metal cover 6 is placed on the upper side of the module substrate 1 to be removed.

  3. The suction nozzle 9 is placed and set on the upper surface of the metal cover 6 that covers the module substrate 1 of the module to be removed.

  4). Hot air is blown from a heater (not shown) outside the rework device to melt the solder.

  The hot air passes through the gap between the hot air guide 8, the suction nozzle 9 and the metal cover 6 and is sent so as to directly hit the lower solder connection portion of the connector 5.

  Hot air is sent into the various LSI components 3 on the front and back surfaces of the module substrate 1, which are all mounted components of the module to be removed, the various chip components 4, and the solder connection portions of the connector 5 that connects the module substrate 1 and the main substrate 2. It is.

  A portion other than the connector 5 has a structure in which hot air does not hit the portions other than the connector 5 due to the heat-insulating air action on the module by the suction nozzles 9 and 6.

  Therefore, only the solder attaching the connector 5 to the module substrate 1 and the main substrate 2 is melted.

  In addition, the thermal wind action minimizes thermal stress on the various LSI components 3 and the various chip components 4 on the front and back surfaces of the module substrate 1, which are all mounted components of the module to be removed.

  5). After the solder of the connector 5 attached between the module board 1 and the main board 2 is melted, an external air suction machine is connected to the upper end of the suction nozzle 9 of the rework apparatus.

  6). After an external air suction device is connected to the upper end of the suction nozzle 9 of the rework device, the suction force of the external air suction device is used to suck the metal cover 6 at the lower end of the suction nozzle 9.

  7). By pulling the rework device upward, the removal target module together with the metal cover 6 is pulled upward.

  Here, since the metal cover 6 holds the module, the module substrate 1 can be lifted upward.

  At that time, since the solder connection portion of the connector 5 on the module substrate 1 side is temporarily fixed with the silicon resin 7, the connector 5 is lifted upward together with being attached to the module substrate 1. The two-side solder connection portion can be removed on the main board 2 side.

  (1). In the preferred embodiment of the invention, the rework in the jig and method for removing a module to be mounted on the main board 2 has been described through the connector 5. However, the ball grid array (BGA) connects to the main board 2. Similarly, a module removal jig and a removal method for removing a module without destroying the module to be removed are also possible for the type of module.

  (2). Also, in the rework in the module removal jig and method for mounting on the main board 2 using the end face through-hole (TH) electrode, the module board 1 is sandwiched by the metal cover 6 to similarly remove the module. Rework is possible without destroying.

  As described above, the effect of the module removal jig and method according to the present invention is that the various LSI components 3 on the module substrate 1 constituting the module to be removed, the various chip components 4 and the connector without destroying the entire module. 5 and the soldering part of the connector 5 can be removed at the main board 2 side soldering part without destroying the soldering part.

  Further, according to the present invention, when a defect is found in a part of a module already mounted on the main board 2 or a part of the soldering, the removed module can be easily repaired and re-mounted. That is.

It is a perspective view which shows the external appearance of the to-be-removed module of one Embodiment of the module removal jig | tool and removal method of this invention. It is sectional drawing which shows the cross section of the to-be-removed module of one Embodiment of the module removal jig | tool and removal method of this invention. It is sectional drawing which shows the structure of one Embodiment of the module removal jig | tool and removal method of the best embodiment of this invention. It is sectional drawing which shows the structure of the module removal jig | tool and removal method of 1st Embodiment in the development process of this invention. It is sectional drawing which shows the structure of the module removal jig | tool and removal method of 2nd Embodiment in the development process of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Module board 2 Main board 3 Various LSI components 4 Various chip components 5 Connector 6 Metal cover 7 Silicon resin 8 Hot air guide 9 Adsorption nozzle 10 Hot air interruption inner wall

Claims (46)

The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A guide, a suction nozzle for sucking a component to be removed and a module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and mounting the component board from the hot air,
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
Removal of a module, wherein the removed component and module are sucked by an suction force of an air suction machine connected to the suction nozzle, the removed module is pulled up, and the removed module is removed from the main board. jig. The module board of the module constituting the main board and the module to be removed is connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A guide and a suction nozzle for sucking parts and modules to be removed;
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A guide, a suction nozzle for sucking a component to be removed and a module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and mounting the component board from the hot air,
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal jig characterized by performing removal. The module board of the module constituting the main board and the module to be removed is connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A guide and a suction nozzle for sucking parts and modules to be removed;
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. The module board of the module constituting the main board and the module to be removed is connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A guide and a suction nozzle for sucking parts and modules to be removed;
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A hot air guide for guiding the hot air to the lower terminal of the connector of the module board, and a suction nozzle for sucking the component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. An adsorption nozzle for adsorbing components and modules, and a hot air blocking inner wall for preventing the components mounted on the adsorption substrate from being heated from the hot air,
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
Removal of a module, wherein the removed component and module are sucked by an suction force of an air suction machine connected to the suction nozzle, the removed module is pulled up, and the removed module is removed from the main board. jig. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A suction nozzle for sucking parts and modules;
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. An adsorption nozzle for adsorbing components and modules, and a hot air blocking inner wall for preventing the components mounted on the adsorption substrate from being heated from the hot air,
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal jig characterized by performing removal. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A suction nozzle for sucking parts and modules;
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A suction nozzle for sucking parts and modules;
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. In an electronic circuit device in which a module board of a module that constitutes a module to be removed by a through hole is mounted on a main board, when removing the removed module from the main board, a hot air guide that guides hot air to the module board, and a component to be removed And an adsorption nozzle for adsorbing the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. Removal jig. In an electronic circuit device in which a module board of a module that constitutes a module to be removed by a through hole is mounted on a main board, when removing the removed module from the main board, a hot air guide that guides hot air to the module board, and a component to be removed And an adsorption nozzle for adsorbing the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. In an electronic circuit device in which a module board of a module that constitutes a module to be removed by a through hole is mounted on a main board, when removing the removed module from the main board, a hot air guide that guides hot air to the module board, and a component to be removed And an adsorption nozzle for adsorbing the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The portion of the metal cover that sandwiches the module substrate is folded inward into an L-shaped configuration to sandwich the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is adsorbed through a hollow portion provided in the adsorption nozzle by an adsorption force of an air suction device connected to the adsorption nozzle, the module to be removed is pulled up together with the metal cover, and the object is removed from the main substrate. A module removal jig characterized by removing a removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A module in a module removal jig comprising a guide, a suction nozzle for sucking the component to be removed and the module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and mounting the component board from the hot air How to remove Te,
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
Removal of the module, wherein the module and the module to be removed are sucked by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. Method. The module board of the module constituting the main board and the module to be removed is connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A module removal method in a module removal jig comprising a guide and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A module in a module removal jig comprising a guide, a suction nozzle for sucking the component to be removed and the module, and a hot air blocking inner wall for preventing the component mounted on the suction nozzle and mounting the component board from the hot air How to remove Te,
When removing the module board, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. The hot air is applied to the lower terminal of the connector, and the solder connection portion of the lower terminal of the connector of the module board is melted,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal method characterized by performing removal of. The module board of the module constituting the main board and the module to be removed is connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A module removal method in a module removal jig comprising a guide and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. The module board of the module constituting the main board and the module to be removed is connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board, the hot air is guided to the lower terminal of the connector of the module board. A module removal method in a module removal jig comprising a guide and a suction nozzle for sucking parts to be removed and the module,
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The connector is temporarily fixed with an adhesive on the module substrate side,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. The main board and the module board of the module constituting the module to be removed are connected via a connector, and the upper terminal and the lower terminal constituting the connector are soldered to the module board and the main board, respectively. In the electronic circuit device in which the module board of the module constituting the module to be removed is mounted on the main board, when removing the module to be removed from the main board,
A module removal method in a module removal jig comprising a hot air guide for guiding hot air to a lower terminal of the connector of the module board, and a suction nozzle for sucking a component to be removed and the module,
When removing the module substrate,
Cover the module substrate with a metal cover,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
Temporarily fix the connector on the module substrate side with a silicone resin constituting an adhesive,
The hot air from the heater passes through the gap between the hot air guide and the suction nozzle, is sent to the module to be removed, and the hot air is applied to the lower terminal of the connector of the module board, and the lower terminal of the connector of the module board Melt the solder joints of
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A module removal method in a module removal jig, comprising: a suction nozzle for sucking parts and modules; and a hot air blocking inner wall that heats the parts mounted on the suction nozzle and mounted on the module substrate from the hot air. And
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
Removal of the module, wherein the module and the module to be removed are sucked by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. Method. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A module removal method in a module removal jig comprising a suction nozzle for sucking parts and modules,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A module removal method in a module removal jig, comprising: a suction nozzle for sucking parts and modules; and a hot air blocking inner wall that heats the parts mounted on the suction nozzle and mounted on the module substrate from the hot air. And
When removing the module substrate, the hot air is sent from the heater through the gap between the hot air guide and the suction nozzle, and through the gap between the hot air guide and the hot air blocking inner wall, and sent to the module to be removed. To the hot air, to melt the solder connection portion of the module substrate,
The parts and modules to be removed are sucked through the hollowed portion provided in the suction nozzle by the suction force of the air suction machine connected to the suction nozzle, the module to be removed is pulled up, and the module to be removed is removed from the main board. The module removal method characterized by performing removal of. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A module removal method in a module removal jig comprising a suction nozzle for sucking parts and modules,
When removing the module substrate, put a metal cover on the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. In an electronic circuit device in which a module board of a module constituting a module to be removed is mounted on a main board by a ball grid array, when removing the module to be removed from the main board, a hot air guide for guiding hot air to the module board is removed. A module removal method in a module removal jig comprising a suction nozzle for sucking parts and modules,
When removing the module substrate, put a metal cover on the module substrate,
The portion of the metal cover that holds the module substrate is folded inward into an L-shaped configuration, and the module substrate is held.
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. In an electronic circuit device in which a module board of a module that constitutes a module to be removed by a through hole is mounted on a main board, when removing the module to be removed from the main board, a hot air guide that guides hot air to the module board, and a component to be removed A module removal method in a module removal jig comprising a suction nozzle for sucking the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
A module that adsorbs the metal cover by an adsorbing force of an air suction device connected to the adsorption nozzle, pulls up the module to be removed together with the metal cover, and removes the module to be removed from the main board. How to remove. In an electronic circuit device in which a module board of a module that constitutes a module to be removed by a through hole is mounted on a main board, when removing the module to be removed from the main board, a hot air guide that guides hot air to the module board, and a component to be removed A module removal method in a module removal jig comprising a suction nozzle for sucking the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. In an electronic circuit device in which a module board of a module that constitutes a module to be removed by a through hole is mounted on a main board, when removing the module to be removed from the main board, a hot air guide that guides hot air to the module board, and a component to be removed A module removal method in a module removal jig comprising a suction nozzle for sucking the module,
When removing the module substrate, cover the module substrate with a metal cover, sandwich the module substrate with the metal cover,
The portion of the metal cover that sandwiches the module substrate is folded inward into an L-shaped configuration to sandwich the module substrate,
The hot air from the heater is passed through the gap between the hot air guide and the suction nozzle, sent to the module to be removed, the hot air is applied to the module substrate, and the solder connection portion of the module substrate is melted,
The metal cover is sucked through a hollow portion provided in the suction nozzle by the suction force of an air suction machine connected to the suction nozzle, the module to be removed is pulled up together with the metal cover, and the target substrate is pulled from the main substrate. A method for removing a module, comprising removing the removal module. 11. The module removal jig according to claim 3, wherein the adhesive is a screw. 12. The module removing jig according to claim 4, wherein the silicon resin constituting the adhesive is a screw. 11. The module removing jig according to claim 3, wherein the adhesive is a fitting structural part. 12. The module removal jig according to claim 4, wherein the silicon resin constituting the adhesive is a fitting structural part. 30. The method for removing a module according to claim 22, 26, or 29, wherein the adhesive is a screw. The method of removing a module according to claim 23, claim 27, or claim 30, wherein a silicon resin constituting the adhesive is a screw. 30. The module removal method according to claim 22, 26, or 29, wherein an adhesive is used as a fitting structural part. The method for removing a module according to claim 23, claim 27, or claim 30, wherein a silicon resin constituting the adhesive is used as a fitting structural part.

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