JP2005285925A5 - - Google Patents
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- Publication number
- JP2005285925A5 JP2005285925A5 JP2004094774A JP2004094774A JP2005285925A5 JP 2005285925 A5 JP2005285925 A5 JP 2005285925A5 JP 2004094774 A JP2004094774 A JP 2004094774A JP 2004094774 A JP2004094774 A JP 2004094774A JP 2005285925 A5 JP2005285925 A5 JP 2005285925A5
- Authority
- JP
- Japan
- Prior art keywords
- led
- chip
- light
- led chip
- transparent resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Claims (4)
一方の電極部材の先端に設けられたチップ実装部上に接合されると共に、双方の電極部材に対して電気的に接続されたLEDチップと、このLEDチップを包囲するように形成された波長変換材料を混入した透明樹脂部と、を含んでいるLEDであって、
上記LEDチップが、紫外光,青色光及び/または緑色光を出射するLEDチップであり、
上記透明樹脂部に混入された波長変換材料が、第一の蛍光体としてのチオガレート蛍光体と、第二の蛍光体としての希土類を付活したアルミン酸塩または希土類を付活したオルトケイ酸塩と、を含んでおり、上記LEDチップからの少なくとも一部の光をより長波長の緑色光及び赤色光に変換し、
上記波長変換材料が、フェニル基を含まない脂環式エポキシ樹脂またはオレフィン系樹脂中に分散されていることを特徴とする、LED。 A pair of electrode members;
An LED chip that is bonded onto a chip mounting portion provided at the tip of one electrode member and electrically connected to both electrode members, and a wavelength conversion formed so as to surround the LED chip An LED including a transparent resin portion mixed with a material,
The LED chip is an LED chip that emits ultraviolet light, blue light and / or green light,
The wavelength conversion material mixed in the transparent resin portion includes a thiogallate phosphor as a first phosphor, an aluminate activated with a rare earth as a second phosphor, or an orthosilicate activated with a rare earth. And converting at least part of the light from the LED chip into longer wavelength green light and red light,
The LED , wherein the wavelength conversion material is dispersed in an alicyclic epoxy resin or olefin resin not containing a phenyl group .
さらに、双方のLEDチップ及び透明樹脂部を包囲する透明樹脂から成るレンズ部を備えていることを特徴とする、請求項1に記載のLED。 The pair of electrode members are two lead frames extending in parallel with each other,
The LED according to claim 1, further comprising a lens portion made of a transparent resin surrounding both the LED chip and the transparent resin portion.
上記透明樹脂部が、チップ基板上に形成された枠状部材のチップ実装部を露出させるように上方に拡った凹陥部内に充填されていることを特徴とする、請求項1に記載のLED。 The pair of electrode members is formed on a chip substrate, and includes a conductive pattern that wraps around to the back surface of the chip substrate to define a surface mounting terminal.
2. The LED according to claim 1, wherein the transparent resin portion is filled in a concave portion extending upward so as to expose a chip mounting portion of a frame-shaped member formed on the chip substrate. .
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004094774A JP2005285925A (en) | 2004-03-29 | 2004-03-29 | Led |
CNA2005100594000A CN1677702A (en) | 2004-03-29 | 2005-03-29 | Light emitting diode |
DE102005014144A DE102005014144A1 (en) | 2004-03-29 | 2005-03-29 | led |
US11/091,777 US7586127B2 (en) | 2004-03-29 | 2005-03-29 | Light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004094774A JP2005285925A (en) | 2004-03-29 | 2004-03-29 | Led |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005285925A JP2005285925A (en) | 2005-10-13 |
JP2005285925A5 true JP2005285925A5 (en) | 2007-04-12 |
Family
ID=35184008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004094774A Pending JP2005285925A (en) | 2004-03-29 | 2004-03-29 | Led |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2005285925A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101181112B1 (en) | 2005-10-27 | 2012-09-14 | 엘지이노텍 주식회사 | Light-emitting diode, manufacturing method for the light-emitting diode and light-emitting diode module |
KR101144557B1 (en) * | 2006-03-27 | 2012-05-11 | 엘지이노텍 주식회사 | Lighting Device with Light Emitting Diodes and manufacture method thereof |
WO2010023840A1 (en) | 2008-08-28 | 2010-03-04 | Panasonic Corporation | Semiconductor light emitting device and backlight source, backlight source system, display device, and electronic device using the same |
US9293644B2 (en) | 2009-09-18 | 2016-03-22 | Soraa, Inc. | Power light emitting diode and method with uniform current density operation |
US8502465B2 (en) * | 2009-09-18 | 2013-08-06 | Soraa, Inc. | Power light emitting diode and method with current density operation |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19638667C2 (en) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mixed-color light-emitting semiconductor component with luminescence conversion element |
KR100662955B1 (en) * | 1996-06-26 | 2006-12-28 | 오스람 게젤샤프트 미트 베쉬랭크터 하프퉁 | Light-emitting semiconductor component with luminescence conversion element |
JP3417415B1 (en) * | 2001-01-24 | 2003-06-16 | 日亜化学工業株式会社 | Epoxy resin composition, method for producing the same, and optical semiconductor device using the same |
DE10146719A1 (en) * | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lighting unit with at least one LED as a light source |
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2004
- 2004-03-29 JP JP2004094774A patent/JP2005285925A/en active Pending
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