JP2005279842A - Electrodeposition reamer and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrodeposition reamer capable of improving machining accuracy by enhancing a discharge effect of chips, regardless of an abrasive grain fixing state at the time of electrodeposition. <P>SOLUTION: Abrasive grains 2 are fixed on a base material 1 by one layer by electrodeposition. The abrasive grains 2 are disposed so that a center interval of the abrasive grains 2 adjacent to each other in the circumference direction may be ≥2 times and ≤6 times as long as an average grain diameter of the abrasive grains 2. The abrasive grains 2 are disposed so that a center interval D of the abrasive grains 2 adjacent to each other in the longitudinal direction may be ≥2 times and ≤4 times as long as the average grain diameter of the abrasive grains 2. A plating layer 3 is formed between the base material 1 and the abrasive grains 2. Projecting amount at a distal end of each of the abrasive grains 2 is made as ≥60% and ≤70% of the average grain diameter of the abrasive grains 2 by being measured from a plating surface to be an upper surface of the plating layer 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electrodeposition reamer formed by fixing abrasive grains by electrodeposition and a method for producing the same.

  Conventionally used electrodeposition reamers are mostly those in which abrasive grains are uniformly electrodeposited on the straight part of the base material. In order to achieve high-precision machining, the electrodeposited abrasive grains are finely divided. It corresponded by becoming. For this reason, as the abrasive grains are made finer, there is a problem that the chip pocket of the cutting portion is reduced and the processing efficiency cannot be increased. In addition, since a machining allowance cannot be obtained, a plurality of electrodeposition reamer processes are required.

In order to solve this problem, high-precision machining is realized and cut by using abrasive grains that are coarser than conventional ones, flattening the tip of the abrasive grains in the straight part of the base material by truing, and providing a chip pocket. An electrodeposited reamer has been developed that has the effect of discharging powder.
However, since this electrodeposition reamer is a method of electrodeposition by uniformly dispersing abrasive grains, the position of the abrasive grains cannot be controlled, and overlapping abrasive grains exist. Further, since the upper abrasive grains overlapped by truing are largely cut, the surface area of contact with the work material increases, and the area of the chip pocket in the vicinity thereof decreases. Therefore, the chips cannot be discharged stably, and the processing accuracy and life are greatly affected by the fixed state of the abrasive grains by electrodeposition and are not stable.

Patent Documents 1 and 2 disclose an electrodeposition reamer that can control the electrodeposition position of abrasive grains. Further, Patent Document 3 discloses a CMP dresser having an abrasive grain arrangement interval of 2 to 10 times the average grain diameter of abrasive grains. Further, Patent Document 4 discloses that the cutting allowance at the tip of the abrasive grains can be controlled.
Further, Patent Document 5 discloses a technique in which the concentration of abrasive grains is controlled by an electrodeposition method.

JP-A-7-52047 JP-A-6-114741 JP-A-11-309958 No. 7-8136 Japanese Utility Model Publication No. 5-29629

  However, the electrodeposition reamers described in Patent Document 1 and Patent Document 2 are formed by arranging abrasive grains one by one and aligning the abrasive grain tips in order to improve accuracy and life. If the distance is too narrow, sufficient chip pockets cannot be secured, causing clogging. Further, even if the abrasive grain tips can be aligned before electrodeposition, it is extremely difficult to manage the tip variation at the dimensional tolerance micron level by depositing plating in a subsequent process.

  In the CMP dresser described in Patent Document 3, the abrasive grain spacing is uniformly 2 to 10 times the average grain size. In a rotating body between flat surfaces such as a CMP dresser, it is not affected, but in a rotating body between cylindrical surfaces such as a reamer process, machining is performed unless the abrasive grain spacing in the longitudinal direction is narrow compared to the circumferential direction. Scratches may occur.

  In addition, in the electrodeposition reamer described in Patent Document 4, the cutting amount of the abrasive grain tip is different in order to perform roughing and finishing simultaneously. The cutting allowance is not stable, and clogging occurs at an early stage at a place where the cutting allowance is large. Further, if 1/8 to 1/4 of the grain size of the abrasive grains is cut, the contact area with the work material is increased, the sharpness is impaired, and this is not preferable because it reduces the life.

  Moreover, in the electrodeposition reamer described in Patent Document 5, it is attempted to improve the life by controlling the concentration of abrasive grains, but it is not easy to control the concentration by the electrodeposition method, and it is uniform. It is extremely difficult to evenly and uniformly manage the amount of deposited abrasive grains, resulting in unevenness and large variations. In the electrodeposition reamer, in order to stably process the dimensional accuracy and surface roughness accuracy on the micron level for a long period of time, it is not allowed to lack any elements.

  The present invention has been made to solve the above-mentioned problems, and sets an optimum abrasive grain interval and abrasive protrusion amount, ensures a sufficient chip pocket, enhances chip discharge effect, and is at a micron level. Provides an electrodeposition reamer that can improve the processing accuracy by setting an optimal amount that does not impair the sharpness with truing necessary to ensure the dimensional accuracy of the electrode and a method for stably manufacturing the electrodeposition reamer The purpose is to do.

In order to solve the above-described problems, the present invention provides an electrodeposition reamer in which abrasive grains are electrodeposited on a base material to form an abrasive grain layer. The electrodeposition reamer is characterized in that the center distance between adjacent abrasive grains in the longitudinal direction is 2 to 6 times and the average grain size of the abrasive grains is 2 to 4 times the average grain size.
The center interval between adjacent abrasive grains in the circumferential direction is 2 to 6 times the average grain size, and the center interval between adjacent abrasive grains in the longitudinal direction is 2 to 4 times the average grain diameter of the abrasive grains. As a result, there can be formed a single-layer electrodeposition reamer having abundant chip pockets without overlapping abrasive grains. Therefore, it is possible to obtain a stable processing accuracy without being influenced by the fixed state of the abrasive grains during electrodeposition, and it is possible to efficiently discharge chips, thereby improving the life. When the center interval between adjacent abrasive grains in the circumferential direction and the longitudinal direction is less than twice the average grain size of the abrasive grains, the chip discharge performance is impaired and clogging occurs early, and the surface roughness and dimensions This is not preferable because of poor accuracy. On the other hand, when the center interval between adjacent abrasive grains in the circumferential direction exceeds 6 times the average grain diameter of the abrasive grains, the number of working abrasive grains is reduced, which is not preferable. Further, if the center interval between adjacent abrasive grains in the longitudinal direction exceeds 4 times the average grain size of the abrasive grains, it is not preferable because it causes the occurrence of processed marks.

  Arranging the abrasive grains in this way is an insulating sheet having a thickness smaller than the average grain diameter of the abrasive grains, and the pores larger than the average grain diameter of the abrasive grains are arranged in the circumferential direction. Is wound around the outer periphery of the base material, and the abrasive grains are temporarily fixed by plating in this state. Then, it is possible to remove the insulating sheet and fix the abrasive grains by plating again.

In the present invention, the tip protrusion amount of the abrasive grains from the plated surface formed on the base material is 60% or more and 70% or less of the average grain diameter of the abrasive grains.
By making the tip protrusion amount of the abrasive grains from the plated surface 60% or more and 70% or less of the average grain diameter of the abrasive grains, discharge of chips can be promoted. If the tip protrusion amount of the abrasive grains is less than 60% of the average particle diameter of the abrasive grains, the protrusion amount is too small and the processing performance is degraded. On the other hand, when the tip protrusion amount of the abrasive grains exceeds 70% of the average particle diameter of the abrasive grains, the protrusion amount is too large, the holding power of the abrasive grains is reduced, and the abrasive grains easily fall off.

  In the present invention, the tip of the abrasive grain is flattened by truing in the range of 5% to 10% of the average grain size of the abrasive grain. The dimensional accuracy is improved by flattening the tip of the abrasive grain by truing. If the truing amount is less than 5% of the average grain size of the abrasive grains, the truing amount is too small to obtain a flattening effect by performing truing. On the other hand, if the truing amount exceeds 10% of the average grain size of the abrasive grains, the contact area with the work material increases, the sharpness is impaired, and this is not preferable because it reduces the life.

In the present invention, the abrasive grains are abrasive grains having a major axis / minor axis ratio of 1.1 or less.
As a result, variations in the height of the abrasive tip after electrodeposition can be suppressed, the truing amount is quantified over the entire circumference, the abrasive tip area after truing is made uniform over the entire circumference, and the machining accuracy is stabilized. The service life is improved.

  According to the present invention, a single-layer electrodeposition reamer without overlapping abrasive grains can be formed, and stable machining accuracy can be obtained without being affected by the fixed state of the abrasive grains during electrodeposition. Since the powder can be discharged efficiently, the life is improved.

Hereinafter, the present invention will be described based on the embodiments.
FIG. 1 shows an abrasive grain arrangement in an electrodeposition reamer according to an embodiment of the present invention. FIG. 1 shows one half of the base material 1 with respect to the center line of the base material 1 (indicated by a one-dot chain line). Abrasive grains 2 are fixed to one layer on the cylindrical base material 1 by electrodeposition. ing. D in FIG. 1 indicates the center interval of the abrasive grains 2 arranged in the longitudinal direction of the base material 1. The abrasive grains 2 are also arranged at a predetermined center interval in the circumferential direction of the base material 1.
The abrasive grains 2 are arranged so that the center interval between the adjacent abrasive grains 2 in the circumferential direction is 2 to 6 times the average grain size of the abrasive grains 2. The abrasive grains 2 are arranged so that the center interval between adjacent abrasive grains 2 in the longitudinal direction is 2 to 4 times the average grain size of the abrasive grains 2. A plating layer 3 is formed between the base material 1 and the abrasive grain 2, and the tip protrusion amount of the abrasive grain 2 is the average grain size of the abrasive grain 2 as measured from the plating surface which is the upper surface of the plating layer 3. It is 60% or more and 70% or less.

FIG. 2 shows a state in which the abrasive grain 2 is trued, and the tip of the abrasive grain 2 is trued within a range of 5% to 10% of the average grain diameter of the abrasive grain 2. Abrasive grain front end surface 4 is formed by flattening.
Moreover, as the abrasive grain 2, an abrasive grain having a major axis / minor axis ratio of 1.1 or less can be selected. By using abrasive grains with such a crystal shape, variation in the height of the abrasive grain tip after electrodeposition can be suppressed, the truing amount is quantified over the entire circumference, and the abrasive grain tip area after truing is completely It is made uniform over the circumference, the machining accuracy is stabilized and the life is improved.

  In order to form such an abrasive grain layer, the average grain diameter of the abrasive grains 2 having a thickness smaller than the average grain diameter of the abrasive grains 2 and holes larger than the average grain diameter of the abrasive grains 2 in the circumferential direction. Is wound around the outer periphery of the base material, and the abrasive grains are plated by nickel plating in this state. It can be realized by temporarily fixing and then fixing the abrasive grains by plating again after removing the insulating sheet.

The manufacturing process is shown in FIGS.
In FIG. 3, after masking the non-electrodeposition part 1a of the base material 1 as shown in (a), the insulating sheet 5 is mounted so as to cover the electrodeposition part 1b of the base material 1 as shown in (b). The insulating sheet 5 has a mesh shape, and the size of the mesh is 2 to 6 times the average grain size of the abrasive grains 2 in the circumferential direction, and 2 to 4 times the average grain size of the abrasive grains 2 in the longitudinal direction. It is set to be as follows. In this state, the abrasive grains 2 are dispersed. In the state where the abrasive grains 2 are dispersed, the abrasive grains 2 are arranged so as to overlap on the electrodeposited portion 1b of the base material 1 as shown in FIG. According to the sheet 5, the interval between adjacent abrasive grains in the circumferential direction is not less than 2 times and not more than 6 times the average particle diameter of the abrasive grains, and is twice the average particle diameter of the spaced abrasive grains in the longitudinal direction. More than 4 times.

When the abrasive grains 2 are temporarily fixed by nickel plating and the insulating sheet is removed, the abrasive grains 2 are longitudinally spaced at intervals of 2 to 6 times the average grain diameter in the circumferential direction as shown in (d). It is in a state of being arranged in a single layer at intervals of 2 to 4 times the average particle diameter in the direction. On the other hand, when fixed by nickel plating, the plating layer 3 is formed as shown in (e), and when the masking is removed, an electrodeposition reamer having an abrasive grain arrangement having a predetermined protruding amount from the plating surface is obtained. .
FIG. 4 shows a process of truing the abrasive grains 2 arranged one layer by the above method, whereas the tip of the abrasive grains 2 is uneven as shown in (a) before truing. By performing truing, an electrodeposition reamer with a flattened tip can be obtained as shown in FIG.

Specific test examples are shown below.
A processing test was conducted under the following test conditions.
Machine used: Machining center Peripheral speed: 20 m / min
Cutting depth: φ50μm
Feeding speed: 0.75mm / rev
Material to be ground: FCD45
Drilling hole diameter: φ16mm
Judgment of life: When the surface roughness exceeded Rmax 4 μm and the dimensional accuracy exceeded 5 μm, the tool life was judged.

  The test results are shown in FIGS. Here, the conventional product refers to an electrodeposition reamer manufactured by a method in which coarse abrasive grains having a particle size of about 250 μm are uniformly spread and electrodeposited, and then flattened by truing. In addition, the inventive product uses abrasive grains having a major axis / minor axis ratio of about 200 μm and a major axis / minor axis ratio of 1.1 or less, and the center interval between adjacent abrasive grains in the circumferential direction is four times the average grain size of the abrasive grains. The center interval between adjacent abrasive grains in the longitudinal direction is set to 3 times the average grain diameter of the abrasive grains, the protruding amount is 65% of the average grain diameter of the abrasive grains, and truing in the range of 7.5% of the average grain diameter The electrodeposition reamer manufactured by flattening.

As shown in FIGS. 5 and 6, the surface roughness and hole dimensions of the conventional product increased after 2500 holes were processed, and it was determined that processing was impossible at that stage. In addition, when the reamer was removed and observed, the overlapping upper abrasive grains were largely cut by truing to increase the contact surface area, reducing the area of the chip pocket in the vicinity, and discharging stable chips. Clogging occurred.
On the other hand, the product of the invention showed a life of about twice or more that of the conventional product.

Next, FIG. 7, FIG. 8, and FIG. 9 show the results of processing tests when the center interval when the abrasive grains are arranged, the abrasive protrusion amount, and the truing amount are changed.
FIG. 7 shows the number of processing holes when the center interval at the time of arranging the abrasive grains is changed, (a) is for the circumferential direction, and (b) is for the longitudinal direction. is there. The processing performance is excellent when the circumferential direction is 2 to 6 times the average grain size of the abrasive grains, and the longitudinal direction is 2 to 4 times the average grain size of the abrasive grains. On the other hand, the processing performance is reduced outside this range. In the longitudinal direction, when it exceeds 4 times the average grain size of the abrasive grains, a processed trace is generated.
FIG. 8 shows the number of holes processed when the amount of protruding abrasive grains from the plated surface is changed, and the processing performance is excellent when the average particle diameter of abrasive grains is 60% or more and 70% or less. On the other hand, if it is less than this range, the processing performance is lowered, and if it is more than this range, the holding power of the abrasive grains is lowered and there is a risk of dropping off.
FIG. 9 shows the number of processed holes when the truing amount is changed, and the processing performance is excellent when truing and flattening in the range of 5% to 10% of the average grain size of the abrasive grains. .

  The present invention can be used as an electrodeposition reamer formed by adhering abrasive grains by electrodeposition, and can obtain stable processing accuracy without being affected by the fixed state of the abrasive grains during electrodeposition, An electrodeposition reamer capable of efficiently discharging chips can be realized.

It is a figure which shows the abrasive grain arrangement | sequence in the electrodeposition reamer which concerns on embodiment of this invention. It is a figure which shows the thing of the state which gave truing with respect to the abrasive grain. It is a figure which shows the manufacturing process of the electrodeposition reamer which concerns on embodiment of this invention. It is a figure which shows the truing process in the manufacturing process of the electrodeposition reamer which concerns on embodiment of this invention. It is a figure which shows the test result about surface roughness. It is a figure which shows the test result about a processing hole diameter precision. It is a figure which shows the number of processing holes when changing the center space | interval at the time of arranging an abrasive grain, (a) is a circumferential direction, (b) is a thing about a longitudinal direction. It is a figure which shows the number of process holes when changing the amount of abrasive grain protrusion from a plating surface. It is a figure which shows the number of processing holes when changing the truing amount.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 1a Non-electrodeposition part 1b Electrodeposition part 2 Abrasive grain 3 Plating layer 4 Abrasive grain front end surface 5 Insulating sheet

Claims (5)

  In an electrodeposition reamer in which abrasive grains are electrodeposited on a base material to form an abrasive grain layer, the center interval between adjacent abrasive grains in the circumferential direction is set to be 2 to 6 times the average grain diameter of the abrasive grains, An electrodeposition reamer characterized in that the center interval between adjacent abrasive grains in the longitudinal direction is 2 to 4 times the average grain size of the abrasive grains.   The electrodeposition reamer according to claim 1, wherein a tip protrusion amount of the abrasive grains from a plated surface formed on the base material is 60% or more and 70% or less of an average particle diameter of the abrasive grains.   The electrodeposition reamer according to claim 1 or 2, wherein a tip portion of the abrasive grains is flattened by truing within a range of 5% or more and 10% or less of an average particle diameter of the abrasive grains.   The electrodeposited reamer according to any one of claims 1 to 3, wherein the abrasive grains are abrasive grains having a major axis / minor axis ratio of 1.1 or less.   An insulating sheet having a thickness smaller than the average grain size of the abrasive grains, wherein the holes larger than the average grain size of the abrasive grains are ground in the longitudinal direction and are twice or more and six times or less the average grain size of the abrasive grains in the longitudinal direction. A large number of insulating sheets formed at intervals of 2 to 4 times the average particle diameter of the grains are wound around the outer periphery of the base material. In this state, the abrasive grains are temporarily fixed by plating, and then the insulating sheet is removed and plating is performed again. A method for producing an electrodeposition reamer, characterized in that the electrodeposited reamer is produced by permanently fixing the abrasive grains.

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