JP2005277173A5 - - Google Patents

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Publication number
JP2005277173A5
JP2005277173A5 JP2004089494A JP2004089494A JP2005277173A5 JP 2005277173 A5 JP2005277173 A5 JP 2005277173A5 JP 2004089494 A JP2004089494 A JP 2004089494A JP 2004089494 A JP2004089494 A JP 2004089494A JP 2005277173 A5 JP2005277173 A5 JP 2005277173A5
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JP
Japan
Prior art keywords
opening
semiconductor device
substrate
wiring layer
back surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004089494A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005277173A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004089494A priority Critical patent/JP2005277173A/ja
Priority claimed from JP2004089494A external-priority patent/JP2005277173A/ja
Publication of JP2005277173A publication Critical patent/JP2005277173A/ja
Publication of JP2005277173A5 publication Critical patent/JP2005277173A5/ja
Pending legal-status Critical Current

Links

JP2004089494A 2004-03-25 2004-03-25 半導体装置及びその製造方法 Pending JP2005277173A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004089494A JP2005277173A (ja) 2004-03-25 2004-03-25 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004089494A JP2005277173A (ja) 2004-03-25 2004-03-25 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2005277173A JP2005277173A (ja) 2005-10-06
JP2005277173A5 true JP2005277173A5 (cg-RX-API-DMAC7.html) 2007-05-17

Family

ID=35176487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004089494A Pending JP2005277173A (ja) 2004-03-25 2004-03-25 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2005277173A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1786027A3 (en) * 2005-11-14 2009-03-04 Schott AG Plasma etching of tapered structures
JP5143382B2 (ja) 2006-07-27 2013-02-13 オンセミコンダクター・トレーディング・リミテッド 半導体装置及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0358421A (ja) * 1989-07-26 1991-03-13 Nec Corp 半導体装置の製造方法
JP3462166B2 (ja) * 2000-09-08 2003-11-05 富士通カンタムデバイス株式会社 化合物半導体装置
JP2002190477A (ja) * 2000-12-22 2002-07-05 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP3748516B2 (ja) * 2001-04-23 2006-02-22 シャープ株式会社 半導体装置および無線通信システム
JP4212293B2 (ja) * 2002-04-15 2009-01-21 三洋電機株式会社 半導体装置の製造方法

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