JP2005276712A - Plasma display panel, manufacturing method thereof, and plasma display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To securely remove impurities in a panel and achieve the improvement in the yield, a long-durability and the improvement in the emission efficiency, for example, by improving characteristics of a protective film and a fluorescent layer. <P>SOLUTION: In a pressure reducing step, a gas is exhausted in a state of holding a baking temperature of about 300°C or more, and the impurity gas and the like remaining in a discharge space 13 are released and removed. The gas exhaust is stopped, the introduction of a pressure recovering gas is started, and the pressure in a vacuum chamber is returned to the atmospheric pressure. As the pressure recovering gas, a mixture of steam (H<SB>2</SB>O) of about 10% in the volume ratio and argon gas (Ar) is used. Here, by heat treating at the baking temperature or higher, the adhesion of H<SB>2</SB>O, CO<SB>2</SB>and the like to the surface of the protective film 6 is avoided while the containing of H<SB>2</SB>O, CO<SB>2</SB>and the like in the protective film 6 is restricted to a minimum limit. Further, since steam (H<SB>2</SB>O) which is weak in oxidative power is used as the pressure recovering gas, the oxidation of a blue light emitting body causing the degradation of emission efficiency is prevented. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a plasma display panel, a method for manufacturing a plasma display device, and a plasma display panel. In a sealing process for sealing a front substrate and a rear substrate using a sealing material, The present invention relates to a plasma display panel manufacturing method, a plasma display device manufacturing method, and a plasma display panel that remove impurities contained in a protective film made of MgO.

Generally, a plasma display device including a plasma display panel (hereinafter also referred to as PDP (Plasma Display Panel)) as a main part has no flickering and a display contrast ratio compared to a CRT (Cathode Ray Tube) display or a liquid crystal display device. Has a large size, can be made thin and large, and has a high response speed. In recent years, it has been used as a display for large flat-screen television receivers and information processing devices.
This plasma display device is a display that displays by taking out visible light by irradiating the phosphor with ultraviolet rays generated by the discharge, and the electrode is covered with a dielectric material according to the operation method, and the state of AC discharge indirectly It is roughly divided into an AC type that is operated in a DC state and a DC type that is operated in a state of direct current discharge with electrodes exposed to the discharge space. Since a large screen as described above can be easily realized with a simple structure, it is widely used. Further, as an AC type plasma display panel, a surface discharge type and a counter electrode type have been proposed due to the difference in electrode structure.
A plasma display panel constituting the main part of such an AC type plasma display device is arranged so that a front substrate and a rear substrate made of a transparent material such as glass are opposed to each other, and generates plasma between both substrates. A discharge gas space is formed and is schematically configured.

  Further, in the plasma display panel of the AC type, as shown in FIG. 8, in the plasma display panel, one of the pair of substrates as described above for forming a discharge cell (hereinafter also referred to as a cell) 101. A row electrode composed of the scan electrode 103 and the sustain electrode (common electrode) 104 is arranged in parallel along the horizontal direction on the inner surface of the front substrate 102 and the inner surface of the rear substrate 105 which is the other substrate. A plasma display panel 107 having a three-electrode surface discharge configuration in which column electrodes including data electrodes (address electrodes) 106 are arranged along a vertical direction so as to be orthogonal to the row electrodes is generated during surface discharge performed on the front substrate 102. Since the influence of high energy ions can be suppressed, the life can be extended.

This three-electrode surface discharge AC type plasma display panel 107 performs a write discharge for selecting a discharge cell 101 to be displayed (light emission) between the data electrode 106 of the back substrate 105 and the scan electrode 103 of the front substrate 102. Next, the sustain discharge (display discharge) is performed by the surface discharge of the selected cell between the scan electrode 103 and the sustain electrode 104 of the front substrate 102. Scan electrode 103 and sustain electrode 104 constitute electrode pair 115. In FIG. 8, reference numeral 116 indicates a discharge gap.
Here, the scanning electrode 103 includes a transparent electrode 103a made of tin oxide, ITO (Indium Tin Oxide) or the like, and a bus electrode 103b made of Al, Cu, Ag or the like for reducing the resistance value. The sustain electrode 104 includes a transparent electrode 104a and a bus electrode 104b.

Further, as the transparent insulating substrates 108 and 109 of the front substrate 102 and the rear substrate 105, for example, low strain point glass with a thickness of 2 to 5 mm, soda lime glass with a low cost raw material, or the like is used.
A transparent dielectric layer 110 made of low-melting glass that covers the scan electrodes 103 and the sustain electrodes 104 is formed on the inner surface side of the front substrate 102.
In addition, in order to protect the transparent dielectric layer 110 from discharge generated during operation, a protective film 111 made of MgO (magnesium oxide) or the like having a large secondary electron emission coefficient and excellent sputtering resistance is formed. The protective film 111 is generally formed to a thickness of 0.5 to 2 μm by electron beam evaporation or the like.

Further, the data electrode 106 of the back substrate 105 is covered with a white dielectric layer 112. Further, on the white dielectric layer 112, in order to limit the movement of electric charges between the adjacent discharge cells 101 and 101 and prevent erroneous lighting, a height of 100 [μm] to 150 [μm] and a width of 30 [μm]. A partition 113 having a thickness of [mu] m to 150 [[mu] m] is formed.
Red, green, and blue phosphor layers 114r, 114g, and 114b are disposed on the bottom and sides of the discharge cell 101 defined by the barrier ribs 113, and are disposed on the phosphor layers on the inner surface of the front substrate 102. Multi-color emission is possible by arranging the color filter layers of red, green, and blue at positions facing each other.
Here, among the fluorescent materials, as the red phosphor, (Y, Gd) BO: Eu, (Y, Gd) BO 3: Eu, as the green phosphor, Zn ₂ SiO _4: Mn, blue phosphor As for, BaMgAl ₁₀ O ₁₇ : Eu is used.

A method of manufacturing the three-electrode surface discharge AC type plasma display panel 107 will be described.
After creating the front substrate 102 and the rear substrate 105, an assembly process is performed. That is, the front substrate 102 and the rear substrate 105 are opposed to each other with a predetermined gap, and the extension direction (row direction) of the electrode pair 115 and the extension direction (column direction) of the data electrode 106 are orthogonal to each other. Arrange to do so. Here, the discharge cell 101 is defined by the barrier rib 113.
Next, a sealing process is performed. That is, after a glass paste containing glass frit as a sealing material is applied to the peripheral edge of the back substrate 105 and pre-baked, the front substrate 102 and the back substrate 105 are bonded together and placed in a heating furnace. Then, heat treatment (baking treatment) is performed at a temperature equal to or higher than the softening temperature of the glass frit and under atmospheric pressure, the glass frit is melted, and the front substrate 102 and the back substrate 105 are joined to form a panel. Here, low melting glass is used for the glass frit.

Next, an exhaust process is performed. That is, vacuum heating is performed while exhausting the discharge space by connecting to the discharge space formed between the front substrate 102 and the rear substrate 105 via the vent pipe.
Next, the chip-off process is performed. That is, a discharge gas composed of, for example, a mixed rare gas containing xenon is introduced and filled into the discharge space at a pressure of 20 kPa to 80 kPa, and then the vent tube is chipped on by overheating to close the opening end. In this way, the discharge gas is filled in the discharge space.

However, since MgO is hygroscopic, impurities such as magnesium hydroxide (Mg (OH) ₂ ) and magnesium carbonate (MgCO ₃ ) are formed in the protective film 111.
Although most of these impurities are removed in the sealing step and the exhausting step, they cannot be removed sufficiently. In particular, if impurities remain in the protective film 111, the discharge becomes unstable.
For this reason, in the sealing step, the front substrate 102 and the back substrate 105 are bonded to each other through a glass frit, exhausted while performing heat treatment, and the impurity gas is discharged, and then the temperature is further raised to remove the glass frit. There has been proposed a technique for melting and sealing, and then introducing an inert gas into a heating furnace and cooling in an inert gas atmosphere (see, for example, Patent Document 1).
Further, a technique for performing sealing in a reduced pressure atmosphere or a dry gas atmosphere has been proposed (see, for example, Patent Document 2).
In addition, after exhausting and discharging impurity gas while performing heat treatment, oxygen gas, dry gas or inert gas is introduced into the heating furnace, and the temperature is further increased in this atmosphere to melt the glass frit. A technique for performing sealing has been proposed (see, for example, Patent Document 3).
Japanese Patent Laid-Open No. 9-251839 JP 2001-351523 A Japanese Patent No. 2002-245941

The problem to be solved is that the above-described conventional technique has an insufficient effect of removing impurities, and the characteristics of the protective film and the phosphor layer are deteriorated due to the influence of impurity gas remaining in the panel, That is, the yield of the panel is deteriorated, the lifetime is shortened, and the luminous efficiency is lowered.
That is, the desired secondary electron emission characteristics and wall charge retention characteristics cannot be obtained for this protective film due to the influence of H ₂ O, CO _{2 and the} like adsorbed on the MgO film as the protective film, and normal operation over the entire panel surface. For the surface discharge between the scanning electrode of the front substrate and the common electrode after applying a voltage between the scanning electrode of the front substrate of the PDP and the address electrode of the rear substrate to cause a counter discharge. The sustain voltage margin, which is the range of the voltage applied to the scan electrode during transition, becomes smaller, and the sustain voltage margin varies depending on the manufactured panel. Depending on the panel, the reverse margin (over the entire panel surface) There is a case in which the sustain voltage value for performing normal sustain discharge cannot be set), and there is a problem that the yield decreases.

In addition, since the sustain voltage margin is small, the sustain voltage margin is further reduced due to the temporal change of the sustain voltage due to long-time discharge, the time until the reverse margin is reached, and the life of the panel is shortened. is there.
In addition, due to the impurity gas remaining in the panel, the blue phosphor is deteriorated in particular and the luminous efficiency is lowered. In addition, due to the influence of H ₂ O and CO ₂ adsorbed on the MgO film as the protective film, With respect to this protective film, the desired secondary electron emission characteristics cannot be obtained, the sustain voltage rises, and the power consumption increases, so that the luminous efficiency as the luminance per unit power consumption further decreases. is there. In particular, in the production of high-definition and large-sized panels, the problems of the reduction in luminous efficiency and the increase in power consumption are remarkable.

  The present invention has been made in view of the above-mentioned circumstances, and removes impurities in the panel reliably, for example, improves the characteristics of the protective film and the phosphor layer, improves the yield, extends the lifetime, and improves the luminous efficiency. It is an object of the present invention to provide a method for manufacturing a plasma display panel, a method for manufacturing a plasma display device, and a plasma display panel that can realize the improvement of the above.

  In order to solve the above-mentioned problem, the invention according to claim 1 is the state in which the first substrate and the second substrate constituting the plasma display panel are opposed to each other with a gap through the sealing material layer. The present invention relates to a method of manufacturing a plasma display panel in which the first substrate and the second substrate are sealed by heat treatment, and the first substrate and the second substrate are interposed via a sealing material layer. A first step of overlapping and forming a panel internal space; a second step of exhausting the panel internal space; and the panel internal space containing at least one of hydrogen gas and water vapor. And a third step of introducing the return pressure gas.

  The invention according to claim 2 relates to the method of manufacturing a plasma display panel according to claim 1, wherein the third step is performed at a temperature equal to or higher than a desorption temperature at which water molecules are desorbed. Yes.

  According to a third aspect of the present invention, there is provided the plasma display panel manufacturing method according to the first or second aspect, wherein the third step is performed at a temperature of 300 ° C. or higher.

  According to a fourth aspect of the present invention, there is provided the plasma display panel manufacturing method according to the first, second or third aspect, wherein the decompressed gas contains hydrogen gas or water vapor having a volume mixing ratio of 10% or more. It is said.

  The invention described in claim 5 relates to the method of manufacturing a plasma display panel according to any one of claims 1 to 4, wherein the decompression gas is at least one of hydrogen gas and water vapor. It is characterized by containing gas and at least one kind of gas among nitrogen gas and inert gas.

  A sixth aspect of the present invention relates to the method of manufacturing a plasma display panel according to any one of the first to fourth aspects, wherein the decompression gas includes water vapor, oxygen gas, nitrogen gas, and inert gas. It is characterized by containing at least one kind of gas.

  A seventh aspect of the present invention relates to the method of manufacturing a plasma display panel according to any one of the first to sixth aspects, wherein the sealing material layer includes a glass frit.

  The invention according to claim 8 relates to a method of manufacturing a plasma display panel according to any one of claims 1 to 7, wherein the first substrate and the second substrate are formed before the first step. A fourth step of applying a glass paste containing glass frit to a peripheral portion of a surface of at least one of the substrates disposed on the side of the panel space, and pre-baking at a predetermined temperature; It is characterized by implementation.

  The invention according to claim 9 relates to the method of manufacturing a plasma display panel according to any one of claims 1 to 8, wherein the second step is performed at a temperature equal to or higher than a desorption temperature at which water molecules are desorbed. It is characterized by being implemented.

  The invention according to claim 10 relates to the method of manufacturing a plasma display panel according to any one of claims 1 to 9, wherein the carbon dioxide gas contained in the decompressed gas has a volume mixing ratio of 5% or less. It is characterized by being.

  An eleventh aspect of the present invention relates to the method of manufacturing a plasma display panel according to any one of the seventh to tenth aspects, wherein after the third step is performed, the molten glass frit is cooled. A fifth step of solidifying is provided.

  A twelfth aspect of the present invention relates to the method of manufacturing a plasma display panel according to the eleventh aspect, and in the fifth step, an oxidizing gas is used as an ambient gas around the first substrate and the second substrate. It is characterized by introducing dry gas including gas.

  A thirteenth aspect of the present invention relates to the plasma display panel manufacturing method according to the twelfth aspect of the present invention, wherein the oxidizing gas contains oxygen gas.

  The invention described in claim 14 relates to the method of manufacturing a plasma display panel according to claim 12 or 13, wherein the dry gas contains at least one of a nitrogen gas and an inert gas. It is a feature.

  The invention described in claim 15 relates to the method of manufacturing a plasma display panel according to claim 12, 13 or 14, wherein the water vapor contained in the atmospheric gas has a volume mixing ratio of 0.1% or less. It is said.

  The invention described in claim 16 relates to the method of manufacturing a plasma display panel according to claim 12, 13 or 14, wherein the carbon dioxide gas contained in the atmospheric gas has a volume mixing ratio of 5% or less. It is said.

  The invention according to claim 17 relates to the method of manufacturing a plasma display panel according to any one of claims 7 to 16, wherein the fifth step is performed to cool the glass frit to a softening temperature or lower. Thereafter, a sixth step of continuously exhausting the space in the panel is performed.

  The invention according to claim 18 relates to the method of manufacturing a plasma display panel according to any one of claims 1 to 17, wherein the second step and the third step are performed at least once. It is characterized by.

  According to a nineteenth aspect of the present invention, there is provided a seventh step of manufacturing the plasma display panel, an eighth step of manufacturing the plasma display panel as a module together with a circuit for driving the plasma display panel, and an image signal. And a ninth step of electrically connecting an interface for transmission to the module to the module. In the seventh step, the seventh step of claim Any one of the methods for manufacturing a plasma display panel according to any one of the embodiments is performed.

  A plasma display panel according to a twentieth aspect of the invention is manufactured using the method for manufacturing a plasma display panel according to any one of the first to eighteenth aspects.

According to the structure of the plasma display panel manufacturing method of the present invention, when the first substrate and the second substrate are sealed by the heat treatment, the interior of the panel is exhausted in the second step, and the third substrate is exhausted. By introducing a decompression gas containing at least one of hydrogen gas and water vapor into the panel space in the process, impurities in the panel are reliably removed. For example, the characteristics of the protective film and phosphor layer Can be improved.
In other words, the desired secondary electron emission characteristics and wall charge retention characteristics of the protective film can be ensured and the sustain voltage margin can be increased, so that variations in the sustain voltage margin due to the manufactured panel are absorbed and yield is improved. Can be made.
In addition, since the sustain voltage margin can be increased, the sustain voltage can change with time due to long-term discharge and the time until the reverse margin is reached can be extended, so that the life of the panel can be extended.

In addition, since the impurity gas remaining in the panel can be removed, in particular, the deterioration of the blue phosphor can be prevented, so that the luminous efficiency can be improved and, in addition, the sustain voltage can be reduced. Therefore, the power consumption can be reduced, and the light emission efficiency as the luminance per unit power consumption can be further improved. In particular, in the production of high-definition panels such as XGA / HD and large panels of 50-inch or larger, it is possible to effectively suppress a decrease in luminance and an increase in power consumption.
In addition, according to the configuration of the method for manufacturing a plasma display device of the present invention, when the plasma display device is modularized, when it becomes necessary to replace parts, the module is replaced for simplification and quick repair. Can be achieved.
In addition, according to the configuration of the plasma display panel of the present invention, it is possible to ensure good quality in which a decrease in light emission efficiency and an increase in power consumption are suppressed.

  When sealing the first substrate and the second substrate by heat treatment, the interior of the panel is evacuated in the second step, and at least one of hydrogen gas and water vapor in the interior of the panel in the third step By introducing a decompression gas containing one of these gases, impurities in the panel can be reliably removed, for example, the characteristics of the protective film and phosphor layer can be improved, the yield of the panel can be improved, and the life can be extended. Realized the purpose of improving luminous efficiency.

FIG. 1 is a perspective view showing a schematic configuration of a plasma display panel according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view showing a schematic configuration of the plasma display panel, and FIG. FIG. 4 is a diagram showing a schematic configuration of a PDP manufacturing apparatus used for manufacturing the plasma display panel, and FIG. 5 is a block diagram of the plasma display panel manufacturing method. The figure which shows the relationship between the time in a wearing process, and heating temperature, and FIG. 6 are waveform diagrams which show the drive waveform for evaluating the drive characteristic of the plasma display panel.
In the plasma display panel manufacturing method of this example, as shown in FIGS. 1 and 2, first, in order to manufacture the front substrate 1, the transparent electrodes 3a, 4a is formed (step SA11 (FIG. 3)). Here, the transparent electrodes 3a and 4a are made of tin oxide, ITO (Indium Tin Oxide), or the like.
Next, bus electrodes (trace electrodes) 3b and 4b for reducing the resistance value are formed on the lower surface side of the transparent electrodes 3a and 4a along the horizontal direction H (step SA12). Here, the bus electrodes 3b and 4b are made of Al, Cu, Ag, or the like. Thus, the scan electrode 3 and the sustain electrode (common electrode) 4 are formed from the transparent electrodes 3a and 4a and the bus electrodes 3b and 4b.
Next, the transparent dielectric layer 5 that covers the scan electrode 3 and the sustain electrode 4 is formed (step SA13). Here, the transparent dielectric layer 5 is made of a low melting point glass such as PbO (lead oxide).
Next, a black mask (not shown) is formed (step SA14).
Next, a protective film 6 for protecting the transparent dielectric layer 5 from discharge is formed (step SA15). Here, the protective film 6 is made of MgO (magnesium oxide) or the like. Thus, the front substrate 1 is completed.

On the other hand, as shown in FIGS. 1 and 2, in order to manufacture the back substrate 8, data electrodes 11 are formed in parallel on the upper surface of the glass substrate 9 along the vertical direction V (step SB11 (FIG. 3)). Here, the address electrode (data electrode) 11 is made of Al (aluminum), Cu (copper), Ag (silver), or the like.
Next, a white dielectric layer 12 that covers the address electrodes 11 is formed (step SB12). Next, the barrier ribs 14 are formed in stripes on the white dielectric layer 12 in order to define discharge cells (step SB13). The partition wall 14 is formed by, for example, curing a light curable paste to form a predetermined uneven pattern, and then performing a baking process.

Next, the phosphor layer 15 is formed between the barrier ribs 14 (step SB14). The phosphor layer 15 is separately applied to a red phosphor layer, a green phosphor layer, and a blue phosphor layer that convert ultraviolet rays generated by discharge gas discharge into visible light. In this way, the back substrate 8 is completed.
Next, a glass paste containing glass frit is applied to the periphery of the display surface of the glass substrate 9 of the back substrate 8 by screen printing or the like (step SB15). As the glass paste, a paste containing glass frit and an organic binder is used. Here, a low melting point glass frit is used as the glass frit. In addition, as the organic binder, for example, a cellulose-based or acrylic-based resin component is used, and a solvent containing, for example, BCA or α-terpineol is used as a solvent.

Next, the back substrate 8 is heat-treated at a predetermined temperature, and the glass layer is pre-fired simultaneously with the phosphor layer 15 to form the seal frit layer 17.
Next, the front substrate 1 and the rear substrate 8 are fixed in a state of facing each other with a gap of about 100 μm, and assembled so that the discharge space 13 is formed between the substrates 1 and 8 (step SC16).
Next, a sealing process is performed. That is, the peripheral portions of the substrates 1 and 8 are hermetically sealed by the seal frit layer 17 (step SC17 (FIG. 4)).
In this sealing step, first, the bonded front substrate 1 and rear substrate 8 are introduced into the PDP manufacturing apparatus 21.
As shown in FIG. 4, the PDP manufacturing apparatus 21 is provided with a release valve 22, a gas introduction valve 23, and an exhaust valve 24, and a vacuum chamber 26 in which heaters 25 and 25 are disposed, a return pressure gas, A gas introduction device 27 including a gas cylinder for supplying discharge gas and a vacuum exhaust device 28 including a vacuum pump are provided.

Next, as shown in FIG. 4, the front substrate 1 and the rear substrate 8 overlapped with each other through the seal frit layer 17 are arranged in the vacuum chamber 26. A vent pipe 31 is temporarily fixed on the back side of the back substrate 8 (the side facing away from the surface on which the address electrodes 11 are formed) using a crystallized glass frit 32 for fixing.
That is, the glass substrate 9 constituting the back substrate 8 has a vent hole 9a formed at a predetermined position, and the glass substrate 9 is aligned with the vent hole 9a on the back surface (outer surface) side. In the state, the vent pipe 31 is attached under sealed condition. The end portion of the air pipe 31 opposite to the end portion attached to the back substrate 8 is opened in the initial state, and the end portion is evacuated and discharged into the discharge space 13 through the end portion. The gas is introduced.

As shown in FIG. 5, when the heating process (baking process) is started (time t = t ₀ ), the temperature T starts to rise from room temperature, and when the temperature T reaches a predetermined baking temperature Ta (time t = t _1). ), And this temperature Ta is held until (time t = t ₄ ).
Here, the baking temperature Ta is set to a temperature equal to or higher than a desorption temperature at which at least H ₂ O adsorbed on the protective film 6 is desorbed. In this example, the baking temperature Ta is set to approximately 300 ° C. or higher.
During (time t = t _{0 to} t ₁ ), the pressure in the vacuum chamber 26 is maintained at atmospheric pressure. At (time t = t ₂ ), the exhaust valve 24 is opened and exhaust is started.

During the exhaust, impurity gas remaining in the discharge space 13 (in the panel), particularly H ₂ O and CO ₂ adsorbed on the protective film 6 formed on the outermost surface of the front substrate 1 is released by the baking process. It is removed and contributes to the improvement of the secondary electron emission characteristics of the protective film 6. Further, the impurity gas remaining on the back substrate 8, in particular, H ₂ O and CO ₂ remaining on the phosphor layer 15 formed on the outermost surface side of the back substrate 8, components of the organic binder, and the like are also removed.
Next, the temperature T is increased again at (time t = t ₄ ), and when the temperature T reaches a predetermined sealing temperature Tb (a temperature equal to or higher than the softening temperature of the glass frit, for example, approximately 400 to 500 ° C.) (time t = T ₅ ), the sealing temperature Tb is maintained until (time t = t ₆ ), and the glass frit is melted.

At (time t = t ₃ ), the exhaust valve 24 is closed to stop the exhaust, the gas introduction valve 23 is opened, the introduction of the decompressed gas is started, and the pressure in the vacuum chamber 26 is returned to the atmospheric pressure. It is. In this example, a mixed gas containing water vapor (H ₂ O) having a volume mixing ratio of approximately 10% and argon gas (Ar) is used as the reverse pressure gas.
Here, at the baking temperature Ta or higher, along with adherence to the H _{2 O} and CO ₂ and the like protective film 6 surface is avoided by heat treatment, the protective film 6, such as H 2 _O and CO ₂ Contained in is minimized.
Moreover, since water vapor (H ₂ O) having a weak oxidizing power is used as the reverse pressure gas, deterioration due to oxidation of the blue light emitter, which causes a decrease in luminous efficiency, is prevented.

At (time t = t ₆ ), heating is stopped, the temperature in the vacuum chamber 26 is lowered to room temperature, and the front substrate 1 and the back substrate 8 that are overlapped with each other via the seal frit layer 17 are cooled.
In this example, the cooling is performed in air (atmosphere). That is, the atmosphere in the vacuum chamber 26 is air.
Next, the discharge space 13 is evacuated to a vacuum while performing a baking process, and introduction of the discharge gas into the discharge space 13 is started (step SC18). As the discharge gas, an inert gas such as helium gas (He), neon gas (Ne), or xenon gas (Xe) is used alone or in combination.
After the filling of the discharge gas is completed, the vent tube 21 is chipped off due to overheating, and the open end is closed. Thereafter, aging is performed (step SC19).
In this way, the discharge space 13 is filled with the discharge gas, and the plasma display panel 34 as shown in FIGS. 1 and 2 is completed.

A voltage characteristic test (sustain voltage) of the panel, for example, for a 42-inch plasma display panel 34 completed when the inventor changed the decompression conditions (composition of the decompressed gas, etc.) using the manufacturing method as described above. When a panel evaluation test including a margin measurement) and an optical characteristic test (luminance efficiency measurement) was performed, the results shown in Table 1 were obtained. In Table 1, the manufacturing conditions other than the above-described decompression conditions of the plasma display panel 34 corresponding to the decompression conditions 1 to 7 are the same.
Here, the sustain voltage margin and the luminous efficiency are the relative sustain voltage margin and the relative luminous efficiency as a ratio to the sustain voltage margin and the luminous efficiency when sealed under atmospheric pressure without decompression and decompression (recompression condition 1). Is calculated and shown.
Here, the sustain voltage margin is formed after writing is performed by the scan electrodes of the front substrate 1 and the address electrodes of the rear substrate 8, and the wall charges remaining on the front substrate 1 are used to scan the front electrode 1. Measured as the difference between the minimum voltage that can be maintained on the entire panel when surface discharge (sustain discharge) is performed between the electrode and the bus electrode, and the maximum voltage that does not cause erroneous discharge in cells that are not written. .
A waveform as shown in FIG. 6 was used as a drive waveform for evaluating the drive characteristics of the panel. In the drawing, reference numerals p1 to p5 denote a sustain pulse, a sustain erase pulse, a priming pulse, a priming erase pulse, and a scanning pulse, respectively.
Luminous efficiency was measured as luminance / power consumption when the entire panel was illuminated in white.

As shown in Table 1, when a mixed gas containing hydrogen gas (H ₂ ) with a volume mixing ratio of 10% and argon gas (Ar) is used as the decompressed gas (return pressure condition 2), the volume mixing ratio When a mixed gas containing 10% water vapor (H ₂ O) and argon gas (Ar) is used (return pressure condition 3), oxygen gas (O ₂ ) with a volume mixing ratio of 10% and argon gas (Ar) ) In the case of using a mixed gas (return pressure condition 4) and in the case of using oxygen gas (O ₂ ) (return pressure condition 5), the sustain voltage margin is the conventional condition (return pressure condition 1). It can be seen that there is an increase of 15%, 12%, 9% and 18%, respectively.
On the other hand, when nitrogen gas (N ₂ ) is used as the return pressure gas (return pressure condition 6) and argon gas (Ar) is used (return pressure condition 7), the sustain voltage margin is the same as the conventional condition. It can be seen that they are reduced by 5% and 7%, respectively, compared with (Return Pressure Condition 1).
Thus, in order to increase the sustain voltage margin, after decompression, a gas containing hydrogen gas (H ₂ ), water vapor (H ₂ O), and oxygen gas (O ₂ ) is used as the decompression gas. You can see that

In addition, when a mixed gas containing hydrogen gas (H ₂ ) having a volume mixing ratio of 10% and argon gas (Ar) is used as the restoring pressure gas (return pressure condition 2), water vapor having a volume mixing ratio of 10% ( H ₂ O) and a mixed gas containing argon gas (Ar) (return pressure condition 3), nitrogen gas (N ₂ ) as the return pressure gas (return pressure condition 6), and When argon gas (Ar) is used (return pressure condition 7), the luminous efficiency is increased by 5%, 8%, 10% and 12%, respectively, compared to the conventional condition (return pressure condition 1). I understand that.
On the other hand, when a mixed gas containing oxygen gas (O ₂ ) with a volume mixing ratio of 10% and argon gas (Ar) is used (restore pressure condition 4), and when oxygen gas (O ₂ ) is used (recovery). It can be seen that the light emission efficiency is reduced by 5% and 8% in the pressure condition 5) as compared with the conventional condition (return pressure condition 1), respectively.

As described above, in order to increase the luminous efficiency, after decompression, a gas containing hydrogen gas (H ₂ ), water vapor (H ₂ O), nitrogen gas (N ₂ ), and argon gas (Ar) as the decompression gas. It can be seen that it should be used.
In addition, when a mixed gas containing hydrogen gas (H ₂ ) having a volume mixing ratio of 10% and argon gas (Ar) is used as the restoring pressure gas (return pressure condition 2), water vapor having a volume mixing ratio of 10% ( It can be seen that when a mixed gas containing H ₂ O) and argon gas (Ar) is used (return pressure condition 3), good results can be obtained for both the sustain voltage margin and the light emission efficiency.

Further, when the inventors measured the sustain voltage margin and the light emission efficiency in the case where the ratio (volume mixing ratio) of water vapor (H ₂ O) was changed, the results shown in Table 2 were obtained. In Table 2, the manufacturing conditions other than the above-described decompression conditions of the plasma display panel 34 corresponding to the decompression conditions 1 and 7 to 10 are the same.

As shown in Table 2, when a mixed gas containing water vapor (H ₂ O) with a volume mixing ratio of 10% and argon gas (Ar) is used as the pressure-reducing gas (return pressure condition 9), the volume mixing ratio When a mixed gas containing 50% water vapor (H ₂ O) and argon gas (Ar) is used (recovery pressure condition 10), the sustain voltage margin is higher than that of the conventional condition (return pressure condition 1). It can be seen that they are increased by 12% and 11%, respectively.
On the other hand, when a mixed gas containing water vapor (H ₂ O) with a volume mixing ratio of 5% and argon gas (Ar) is used as the re-pressure gas (re-pressure condition 8), the sustain voltage margin is less than the conventional one. It can be seen that each is reduced by 5% compared to the condition (return pressure condition 1).
As described above, in order to increase the sustain voltage margin, when a gas containing water vapor (H ₂ O) is used as the decompression gas after decompression, the volume mixing ratio may be set to approximately 10% or more. I understand that.

In addition, when a mixed gas containing water vapor (H ₂ O) having a volume mixing ratio of 5% and argon gas (Ar) is used as the pressure-reducing gas (return pressure condition 8), water vapor having a volume mixing ratio of 10% ( When a mixed gas containing H ₂ O) and argon gas (Ar) is used (return pressure condition 9), a mixture containing water vapor (H ₂ O) with a volume mixing ratio of 50% and argon gas (Ar) It can be seen that the luminous efficiency is increased by 8% in both cases where gas is used (return pressure condition 10).
As described above, in order to increase the luminous efficiency, when a gas containing water vapor (H ₂ O) is used as the decompressed gas after decompression, the volume mixing ratio is set to approximately 50% or more. You can see that

In addition, when a mixed gas containing hydrogen gas (H ₂ ) having a volume mixing ratio of 10% and argon gas (Ar) is used as the decompressed gas (return pressure condition 9), water vapor having a volume mixing ratio of 50% ( It can be seen that when a mixed gas containing H ₂ O) and argon gas (Ar) is used (return pressure condition 10), good results can be obtained for both the sustain voltage margin and the light emission efficiency.
As described above, in order to increase both the sustain voltage margin and the light emission efficiency, the volume mixing ratio of water vapor (H ₂ O) is set to approximately 50% or more as the decompression gas and the decompression gas after decompression. It can be seen that the gas used may be used.

Thus, according to the configuration of this example, when the front substrate and the rear substrate are sealed by the heat treatment, after the discharge space is exhausted, the baking is performed at, for example, 300 ° C. For example, by introducing a decompression gas containing water vapor in a volume mixing ratio of 10% or more, impurities in the discharge space can be reliably removed, and for example, the characteristics of the protective film and the phosphor layer can be improved.
That is, since the desired secondary electron emission characteristics and wall charge retention characteristics can be secured for the protective film 6 and the sustain voltage margin can be increased, variations in the sustain voltage margin due to the manufactured panel can be absorbed and the yield can be increased. Can be improved.

In addition, since the sustain voltage margin can be increased, the sustain voltage can change with time due to long-term discharge and the time until the reverse margin is reached can be extended, so that the life of the panel can be extended.
In addition, since the impurity gas remaining in the panel can be removed, in particular, the deterioration of the blue phosphor can be prevented, so that the luminous efficiency can be improved and, in addition, the sustain voltage can be reduced. Therefore, the power consumption can be reduced, and the light emission efficiency as the luminance per unit power consumption can be further improved. In particular, in the production of high-definition panels such as XGA / HD and large panels of 50-inch or larger, it is possible to effectively suppress a decrease in luminance and an increase in power consumption.

This example is greatly different from Example 1 described above in that a gas containing oxygen is introduced as an atmospheric gas in the cooling process.
Since the other configuration is substantially the same as the configuration of the first embodiment described above, the description thereof will be simplified.

When the heating process (baking process) is started (time t = t ₀ ), the temperature T starts to rise from room temperature. When the temperature T reaches a predetermined baking temperature Ta (time t = t ₁ ), the temperature Ta is set to ( It holds until time t = t ₄ (see FIG. 5).
Here, the baking temperature Ta is set to a temperature equal to or higher than a desorption temperature at which at least H ₂ O adsorbed on the protective film 6 is desorbed. In this example, the baking temperature Ta is set to approximately 300 ° C. or higher.
During (time t = t _{0 to} t ₁ ), the pressure in the vacuum chamber 26 is maintained at atmospheric pressure. At (time t = t ₂ ), the exhaust valve 24 is opened and exhaust is started.
During the exhaust, impurity gas remaining in the discharge space 13 (in the panel), particularly H ₂ O and CO ₂ adsorbed on the protective film 6 formed on the outermost surface of the front substrate 1 is released by the baking process. It is removed and contributes to the improvement of the secondary electron emission characteristics of the protective film 6. Further, the impurity gas remaining on the back substrate 8, in particular, H ₂ O and CO ₂ remaining on the phosphor layer 15 formed on the outermost surface side of the back substrate 8, components of the organic binder, and the like are also removed.

Next, the temperature T is increased again at (time t = t ₄ ), and when the temperature T reaches a predetermined sealing temperature Tb (a temperature equal to or higher than the softening temperature of the glass frit, for example, approximately 400 to 500 ° C.) (time t = T ₅ ), the sealing temperature Tb is maintained until (time t = t ₆ ), and the glass frit is melted.
At (time t = t ₃ ), the exhaust valve 24 is closed to stop the exhaust, the gas introduction valve 23 is opened, the introduction of the decompressed gas is started, and the pressure in the vacuum chamber 26 is returned to the atmospheric pressure. It is. In this example, a mixed gas containing water vapor (H ₂ O) having a volume mixing ratio of approximately 10% and argon gas (Ar) is used as the reverse pressure gas.
Here, at the baking temperature Ta or higher, along with adherence to the H _{2 O} and CO ₂ and the like protective film 6 surface is avoided by heat treatment, the protective film 6, such as H 2 _O and CO ₂ Contained in is minimized.

Moreover, since water vapor (H ₂ O) having a weak oxidizing power is used as the reverse pressure gas, deterioration due to oxidation of the blue light emitter, which causes a decrease in luminous efficiency, is prevented. As a result, high luminous efficiency can be obtained in the completed plasma display panel 34.
At (time t = t ₆ ), heating is stopped, the temperature in the vacuum chamber 26 is lowered to room temperature, and the front substrate 1 and the back substrate 8 that are overlapped with each other via the seal frit layer 17 are cooled.
In this example, the cooling is performed in a dry gas atmosphere containing oxygen gas (O ₂ ). That is, a dry gas (H ₂ O: volume mixing ratio of 0.1% or less) containing oxygen gas (O ₂ ) is introduced into the vacuum chamber 26 as an atmospheric gas, and the glass frit is introduced in the mixed gas atmosphere. The front substrate 1 and the rear substrate 8 which are overlapped with each other through the substrate are cooled. In this dry gas, the volume mixing ratio of carbon dioxide gas (CO ₂ ) is 5% or less.
By cooling in an atmosphere containing oxygen gas (O ₂ ) and having a volume mixing ratio of water vapor (H ₂ O) and carbon dioxide gas (CO ₂ ) less than a predetermined value, the hydroxyl group on the surface of the protective film 6 And the adsorption of impurity gas to the surface of the protective film 6 is suppressed.

As a result, desired secondary electron emission characteristics and wall charge retention characteristics can be obtained for the protective film 6 of the completed plasma display panel 34, and a sufficiently large sustain voltage margin can be secured.
Next, the discharge space 13 is evacuated to a vacuum while performing a baking process, and the introduction of the discharge gas into the discharge space 13 is started (step SC18). As the discharge gas, an inert gas such as helium gas (He), neon gas (Ne), or xenon gas (Xe) is used alone or in combination.
After the filling of the discharge gas is completed, the vent tube 21 is chipped off due to overheating, and the open end is closed. Thereafter, aging is performed (step SC19).
In this way, the discharge space 13 is filled with the discharge gas, and the plasma display panel 34 is completed.

The inventor uses the manufacturing method as described above, and changes the atmospheric conditions (composition of atmospheric gas, etc.) in the cooling process, for example, for a 42-inch plasma display panel 34, the panel voltage characteristic test ( When a panel evaluation test including a maintenance voltage margin measurement) and an optical characteristic test (luminous efficiency measurement) was performed, the results shown in Table 3 were obtained. In Table 3, the manufacturing conditions other than the above atmospheric conditions of the plasma display panel 34 corresponding to the atmospheric conditions 1 to 5 are the same.
Here, the sustain voltage margin and the light emission efficiency are relatively maintained as a ratio to the sustain voltage margin and the light emission efficiency when air (atmosphere) is used as the atmosphere gas in the cooling process (in the case of the atmospheric condition 1 and Example 1). The voltage margin and the relative luminous efficiency are calculated and shown.
A waveform as shown in FIG. 6 was used as a drive waveform for evaluating the drive characteristics of the panel.

As shown in Table 3, when the dry gas (H ₂ O: volume mixing ratio 0.1% or less) is used as the atmospheric gas in the cooling step (atmosphere condition 2), the oxygen gas (O ₂ ) is 50%. When the mixed gas containing argon gas (Ar) is used (atmosphere condition 3), the sustain voltage margin is increased by 5% and 10%, respectively, compared with the conventional condition (atmosphere condition 1). I understand that.
On the other hand, when a mixed gas containing carbon dioxide gas (CO ₂ ) and argon gas (Ar) having a volume mixing ratio of 5% is used as the atmosphere gas in the cooling process (atmosphere condition 4), the volume mixing ratio is 10%. When a mixed gas containing water vapor (H ₂ O) and argon gas (Ar) is used (atmosphere condition 5), the sustain voltage becomes a reverse margin, that is, the minimum voltage at which the entire panel can be normally sustained and discharged. As a result, the voltage was lower than the maximum voltage at which no single cell was generated in the panel, resulting in a defective panel.

Further, as the atmosphere gas in the cooling step, the dry gas: when using the _(H 2 O volume mixing ratio of 0.1% or less) (ambient conditions 2), oxygen gas _{(O 2)} 50% and argon gas ( When the mixed gas containing Ar) is used (atmosphere condition 3), it can be seen that the luminous efficiency is increased by 10% and 2%, respectively, compared with the conventional condition (atmosphere condition 1).
On the other hand, when a mixed gas containing carbon dioxide gas (CO ₂ ) and argon gas (Ar) having a volume mixing ratio of 5% is used as the atmosphere gas in the cooling process (atmosphere condition 4), the volume mixing ratio is 10%. When a mixed gas containing water vapor (H ₂ O) and argon gas (Ar) was used (atmosphere condition 5), the voltage could not be set because the sustain voltage was a reverse margin, and measurement was not possible.
Thus, in order to increase the sustain voltage margin and increase the light emission efficiency, the dry gas (H ₂ O: volume mixture ratio is 0.1% or less) containing oxygen gas (O ₂ ) as the atmospheric gas in the cooling process. ) And a volume mixing ratio of carbon dioxide gas (CO ₂ ) of 5% or less.

According to the configuration of this example, substantially the same effect as that of the first embodiment described above can be obtained.
In addition, in the cooling process, a dry gas (H ₂ O: volume mixing ratio of 0.1% or less) containing oxygen gas (O ₂ ) is used as an atmospheric gas in the vacuum chamber 26, and carbon dioxide gas (CO _By setting the volume mixing ratio of ₂ ) to 5% or less, impurities remaining in the panel can be more reliably removed.

FIG. 7 is a block diagram showing the structure of the plasma display device manufactured by the plasma display device manufacturing method according to the third embodiment of the present invention.
As shown in FIG. 7, the plasma display device 41 of this example is designed to have a module structure, and specifically includes an analog interface (hereinafter referred to as IF) 42 and a PDP module 43. Yes.

As shown in the figure, the analog IF 42 includes a Y / C separation circuit 44 having a chroma decoder, an A / D conversion circuit 45, a synchronization signal control circuit 46 having a PLL circuit, an image format conversion circuit 47, The circuit includes an inverse γ (gamma) conversion circuit 48, a system control circuit 49, and a PLE control circuit 51.
Schematically, the analog IF 42 converts the received analog video signal into a digital video signal, and then supplies the digital video signal to the PDP module 43. For example, an analog video signal transmitted from a TV tuner is decomposed into RGB luminance signals in the Y / C separation circuit 44 and then converted into a digital video signal in the A / D conversion circuit 45.

Thereafter, when the pixel configuration of the PDP module 43 is different from the pixel configuration of the video signal, the image format conversion circuit 47 performs necessary image format conversion. The display luminance characteristic with respect to the input signal of the PDP is linearly proportional, but a normal video signal is corrected in advance (gamma-converted) in accordance with the characteristic of the CRT.
For this reason, after A / D conversion of the video signal is performed in the A / D conversion circuit 45, the inverse γ conversion circuit 48 performs inverse γ conversion on the video signal to restore the linear characteristics. Is generated. This digital video signal is output to the PDP module 43 as an RGB video signal.

Since the analog video signal does not include the sampling clock and data clock signal for A / D conversion, the PLL circuit built in the synchronization signal control circuit 46 generates the horizontal synchronization signal supplied simultaneously with the analog video signal. As a reference, a sampling clock and a data clock signal are generated and output to the PDP module 43.
The PLE control circuit 51 of the analog IF 42 performs brightness control. Specifically, when the average luminance level is less than or equal to a predetermined value, the display luminance is increased, and when the average luminance level exceeds a predetermined value, the display luminance is decreased.

The system control circuit 49 outputs various control signals to the PDP module 73. The PDP module 43 further includes a digital signal processing / control circuit 52, a panel unit 53, and an in-module power supply circuit 54 incorporating a D / D converter.
The digital signal processing / control circuit 52 includes an input IF signal processing circuit 55, a frame memory 56, a memory control circuit 57, and a driver control circuit 58.
For example, the average luminance level of the video signal input to the input IF signal processing circuit 55 is calculated by an input signal average luminance level calculation circuit (not shown) in the input IF signal processing circuit 55 and output as, for example, 5-bit data. Is done. Further, the PLE control circuit 51 sets PLE control data according to the average luminance level and inputs it to a luminance level control circuit (not shown) in the input IF signal processing circuit 55.

The panel unit 53 includes a PDP 34, a scan driver 59 that drives the scan electrodes, a data driver 61 that drives the data electrodes, a high voltage pulse circuit 62 that supplies a pulse voltage to the PDP 34 and the scan driver 59, and a high voltage pulse circuit 62. The power recovery circuit 63 recovers the surplus power.
The PDP 34 is configured to have, for example, pixels arranged in 1365 × 768. In the PDP 34, the scanning driver 59 controls the scanning electrodes, and the data driver 61 controls the data electrodes, whereby lighting or non-lighting of predetermined pixels among these pixels is controlled and desired display is performed.
The logic power supply supplies the logic power to the digital signal processing / control circuit 52 and the panel unit 53. Further, the in-module power supply circuit 54 is supplied with DC power from the display power supply, converts the voltage of the DC power into a predetermined voltage, and then supplies it to the panel unit 53.

Next, with reference to FIG. 12, the manufacturing method of the plasma display apparatus 41 of this example is demonstrated roughly.
First, the PDP 34, the scan driver 59, the data driver 61, the high voltage pulse circuit 62, and the power recovery circuit 63 are arranged on one substrate to form the panel unit 53. Further, a digital signal processing / control circuit 52 is formed separately from the panel unit 53.
The panel unit 53 and the digital signal processing / control circuit 52 thus formed are assembled as one module to form a PDP module 43. Further, an analog IF 74 is formed separately from the PDP module 73.
Thus, after forming the analog IF 42 separately from the PDP module 43, both are electrically connected to complete the plasma display device 41.

  In this way, by modularizing the plasma display device 41, it becomes possible to manufacture the plasma display device 41 independently of other components constituting the plasma display device 41. For example, the plasma display device 41 can be manufactured. In the case of failure, replacement of each PDP module 43 can simplify and speed up the repair.

  According to the configuration of this example, by making the plasma display device modular, for example, it is possible to replace each PDP module at the time of failure, thereby simplifying and speeding up the repair.

The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. Are also included in the present invention.
For example, in the above-described embodiment, the gas pressure containing water vapor (H ₂ O) with a volume mixing ratio of 10% is described in the decompression step.
Further, exhaust may be performed in the first temperature raising step (time t = t _{0 to} t ₁ ) or the cooling step (time t = t ₆ to).

The inert gas in the atmosphere at the time of return pressure gas or cooling is not limited to argon gas (Ar), but helium gas (He), neon gas (Ne), xenon gas (Xe) may be used, You may use these individually or in mixture.
Further, the decompression step (time t = t _{2 to} t ₃ ) and the return pressure step (time t = t ₃ to) may be repeated a plurality of times.
In the second embodiment, the case where a dry gas containing oxygen is used as the oxidizing gas is described. However, ozone may be used instead of oxygen.

  In addition to forming a magnesium oxide film as the protective film, the present invention can be applied to the case where oxides of other alkaline earth metals such as barium oxide are used.

1 is a perspective view showing a schematic configuration of a plasma display panel according to a first embodiment of the present invention. It is sectional drawing which shows schematic structure of the plasma display panel. It is a processing procedure figure for demonstrating the manufacturing method of the plasma display panel. It is a figure which shows schematic structure of the PDP manufacturing apparatus used in order to manufacture the same plasma display panel. It is a figure which shows the relationship between the time in the sealing process among the manufacturing methods of the plasma display panel, and heating temperature. It is a wave form diagram which shows the drive waveform for evaluating the drive characteristic of the plasma display panel. It is a block diagram which shows the structure of the plasma display apparatus manufactured by the manufacturing method of the plasma display apparatus which is 3rd Example of this invention. It is explanatory drawing for demonstrating a prior art.

Explanation of symbols

1 Front substrate (first substrate)
3 Scan electrode 4 Sustain electrode 5 Transparent dielectric layer 6 Protective film 8 Back substrate (second substrate)
11 Address electrode 13 Discharge space (Panel internal space)
17 Seal frit layer (sealing material layer)
34 Plasma display panel 41 Plasma display device

Claims (20)

The first substrate and the second substrate constituting the plasma display panel are arranged in a state of being opposed to each other with a gap through a sealing material layer, and the first substrate and the second substrate are subjected to heat treatment. A method of manufacturing a plasma display panel for sealing a substrate,
A first step of stacking the first substrate and the second substrate through a sealing material layer to form a panel internal space; a second step of exhausting the panel internal space; And a third step of introducing a decompressed gas containing at least one of hydrogen gas and water vapor into the internal space of the panel. A method for manufacturing a plasma display panel, comprising:   2. The method of manufacturing a plasma display panel according to claim 1, wherein the third step is performed at a temperature equal to or higher than a desorption temperature at which water molecules are desorbed.   3. The method of manufacturing a plasma display panel according to claim 1, wherein the third step is performed at a temperature of 300 [deg.] C. or higher.   4. The method of manufacturing a plasma display panel according to claim 1, wherein the return pressure gas contains hydrogen gas or water vapor having a volume mixing ratio of 10% or more.   5. The return pressure gas includes at least one kind of gas of hydrogen gas and water vapor and at least one kind of gas of nitrogen gas and inert gas. The method for manufacturing a plasma display panel according to any one of the above.   5. The plasma display panel according to claim 1, wherein the decompressed gas includes water vapor and at least one kind of gas selected from oxygen gas, nitrogen gas, and inert gas. Production method.   The method for manufacturing a plasma display panel according to claim 1, wherein the sealing material layer includes glass frit.   Prior to the first step, a glass frit is applied to the peripheral portion of the surface of the first substrate and the second substrate that are to be disposed on the panel internal space side of at least one of the first substrate and the second substrate. The method of manufacturing a plasma display panel according to claim 1, wherein a fourth step of applying a glass paste containing the glass paste and pre-baking at a predetermined temperature is performed.   9. The method of manufacturing a plasma display panel according to claim 1, wherein the second step is performed at a temperature equal to or higher than a desorption temperature at which water molecules are desorbed.   10. The method of manufacturing a plasma display panel according to claim 1, wherein the carbon dioxide gas contained in the decompressed gas has a volume mixing ratio of 5% or less.   The plasma display panel manufacturing method according to any one of claims 7 to 10, further comprising a fifth step of cooling and solidifying the molten glass frit after performing the third step. Method.   12. The method of manufacturing a plasma display panel according to claim 11, wherein in the fifth step, a dry gas containing an oxidizing gas is introduced as an atmospheric gas around the first substrate and the second substrate. .   13. The method of manufacturing a plasma display panel according to claim 12, wherein the oxidizing gas includes oxygen gas.   The method for manufacturing a plasma display panel according to claim 12 or 13, wherein the dry gas contains at least one kind of gas among nitrogen gas and inert gas.   The method for manufacturing a plasma display panel according to claim 12, 13 or 14, wherein water vapor contained in the atmospheric gas has a volume mixing ratio of 0.1% or less.   15. The method of manufacturing a plasma display panel according to claim 12, wherein the carbon dioxide gas contained in the atmospheric gas has a volume mixing ratio of 5% or less.   17. The sixth step of performing the fifth step of cooling the glass frit to the softening temperature or less and then exhausting the interior of the panel continuously. The manufacturing method of the plasma display panel of any one.   The method for manufacturing a plasma display panel according to any one of claims 1 to 17, wherein the second step and the third step are performed at least once. A seventh step of manufacturing a plasma display panel; an eighth step of manufacturing the plasma display panel as a module together with a circuit for driving the plasma display panel; and a format conversion of an image signal, and transmission to the module And a ninth step of electrically connecting an interface to the module to the plasma display device,
The method for manufacturing a plasma display device according to any one of claims 1 to 18, wherein the method for manufacturing a plasma display panel according to any one of claims 1 to 18 is performed in the seventh step.   A plasma display panel manufactured using the method for manufacturing a plasma display panel according to claim 1.

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