JP2005276447A - Plasma display panel and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a plasma display panel having high image quality and emission efficiency while reducing the rate of address errors while a panel is driven, and its manufacturing method. <P>SOLUTION: Phosphor layers 25R, 25G, 25B are each covered on their surface with a phosphor coating 26 so that they are isolated from a discharge space 30. The phosphor coating 26 formed on the surface of the side of each phosphor layer 25 facing the discharge space 30 has a double structure comprising a layer 261 of MeF<SB>2</SB>and a layer 262 of mixed phases of MeF<SB>2</SB>and MeO. For the Me, at least one kind of element selected from alkaline metals or alkaline earth metals is usable. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a plasma display panel and a manufacturing method thereof.

  An AC surface discharge type plasma display panel (hereinafter referred to as “PDP”), which is currently in widespread use, has a front panel and a rear panel arranged opposite to each other with a partition between them, and two panels. Have a sealed container structure in which the outer peripheral portions are sealed with frit glass or the like. In the discharge space formed between the panels and partitioned by the barrier ribs, a discharge gas such as Ne—Xe or He—Xe is sealed at an internal pressure of, for example, 53.2 to 79.8 (kPa). Yes.

  Of the two panels, the back panel is based on the back substrate, and on one main surface, an address electrode and a dielectric layer are formed in this order, and a partition wall is erected between adjacent address electrodes. It has a configuration. In addition, on the rear panel, each phosphor layer of red (R), green (G), and blue (B) is provided for each groove on the wall portion of the groove formed by a pair of partition walls adjacent to the dielectric layer. It is formed separately. Here, for the formation of the green phosphor layer, various types of phosphors can be used, but zinc silicate phosphors are generally used because of their high brightness and high color purity. .

In the PDP, a voltage is applied to the display electrode pair on the front panel and the address electrode on the rear panel, thereby generating a discharge in the discharge space and accompanyingly releasing it from Xe in the discharge gas. Ultraviolet light is converted into visible light by a phosphor in the phosphor layer of the back panel and emitted to display an image.
In the PDP having such a structure, an in-field time-division gray scale display method is generally adopted for image display, and one field (16.6 msec) composed of each period of initialization, writing, and maintenance is used. .) Is the display time unit.

By the way, in the conventional PDP, during the writing period at the time of driving, an address miss in which a desired charge cannot be accumulated may occur, and so-called black noise may occur in which no sustain discharge occurs in the sustain period. In particular, in the green phosphor layer made of zinc silicate phosphor, unlike the other two-color phosphor layers, the charging characteristic tends to be negative, and thus an address error tends to occur.
As a countermeasure against such black noise, Patent Document 1 discloses a technique in which the surface of the green phosphor layer is covered with a metal oxide film such as Al ₂ O ₃ . In the technique of this document, the charging characteristics of the phosphor layer are different for each phosphor material constituting the phosphor layer of each color, and an address error is likely to occur for each type of phosphor constituting the phosphor layer when the panel is driven. It was made paying attention to the point that is different. That is, by covering the surface of the green phosphor layer with a metal oxide film, the difference in the charging characteristics of the phosphor layer between colors is alleviated as much as possible, thereby trying to suppress the occurrence of address misses.
Japanese Patent Laid-Open No. 11-86735

  However, although the metal oxide film used as a film in the PDP of Patent Document 1 has a slight effect of changing the charging characteristics, the charging characteristics are changed until the occurrence of an address miss during driving of the PDP can be suppressed. It is difficult. That is, by coating a metal oxide film on a green phosphor layer made of a zinc silicate phosphor having negative charge characteristics, the difference from the charge characteristics of the other two color phosphor layers is reduced. There is a limit to this, and it is difficult to actually reduce the occurrence of address misses. In particular, when the green phosphor layer is composed of a zinc silicate phosphor, the polarity in charging characteristics with the other two colors cannot be made uniform simply by forming the metal oxide film.

Moreover, the metal oxide film used in Patent Document 1 has a low ultraviolet light transmittance, which causes a decrease in the light emission efficiency of the PDP. For these reasons, it is difficult to actually employ the technique according to Patent Document 1.
The present invention has been made in order to solve such problems, and has a low display error during the driving of the panel, has a high image quality, and has a high luminous efficiency, and its manufacture. It aims to provide a method.

In order to achieve the above object, the PDP according to the present invention has the following characteristics.
(1) A PDP having a sealed container filled with a discharge gas in a discharge space and having a phosphor layer formed in a partial region facing the discharge space in the sealed container, the surface of the phosphor layer A film containing an alkali metal fluoride or an alkaline earth metal fluoride (hereinafter referred to as “MeF ₂ ”) is formed thereon.

(2) In the PDP according to the above (1), the phosphor layer is composed of a red region, a green region, and a blue region having mutually different charging characteristics, and is a region of at least one of the three color regions. The charging characteristic of is negative, and the film covers at least a color region having a negative charging characteristic.
(3) In the PDP according to the above (1), the phosphor layer is composed of a green region having negative charge characteristics and both red and blue regions having positive charge characteristics, The film is characterized by covering the green area.

(4) In the PDP according to (3), the green region is formed of a zinc silicate phosphor.
(5) The PDP according to any one of (1) to (4) above, wherein the coating is mainly at least one selected from the group consisting of MgF ₂ , CaF ₂ , BaF ₂ , and LiF _2. It is characterized by including as an ingredient.

(6) In the PDP according to any one of (2) to (5), the film also includes an alkali metal oxide or an alkaline earth metal oxide (hereinafter referred to as “MeO”). In the thickness direction of the film, a mixed phase formed by mixing MeF ₂ and MeO is present in a partial region thereof.
(7) In the PDP according to (6) above, in the mixed phase, the distribution ratio of fluorine atoms gradually decreases or gradually increases in the thickness direction of the film, and the distribution ratio of oxygen atoms gradually increases or decreases accordingly. Features.

(8) In the PDP according to (7), the distribution ratio of fluorine atoms and oxygen atoms in the mixed phase continuously changes in the thickness direction of the film.
(9) In the PDP according to any one of (6) to (8), MeO contained in the film has a relationship in which a fluorine atom in MeF ₂ is substituted with an oxygen atom. That is, “Me” in MeO and “Me” in MeF ₂ are the same element.

(10) The PDP according to any one of (1) to (9), wherein when the film is viewed in plan, the film is formed in spots or stripes.
(11) In the PDP according to the above (10), when the coating region of the coating is viewed in plan, the coating rate of the coating is determined by the surface facing the discharge space as one whole discharge cell including the coating region. The charging characteristic is set to be positive.

  (12) In the PDP according to any one of (1) to (11), the discharge vessel is configured such that two panels face each other with the discharge space in between. The panel has a scan electrode (hereinafter referred to as “SCN electrode”) and a sustain electrode (hereinafter referred to as “SUS electrode”), and the other panel has an address in a direction crossing the SCN electrode and SUS electrode. The phosphor layer has an electrode (hereinafter referred to as “Adr electrode”), the phosphor layer is formed in a region facing the discharge space of the panel provided with the Adr electrode, and the coating is SCN on the surface of the phosphor layer. It is formed by being offset in a region close to the electrode.

In addition, the PDP manufacturing method according to the present invention has the following characteristics.
(13) A phosphor material containing a phosphor is arranged in a layer in a partial region on one main surface of the substrate, and the phosphor material is baked to form a phosphor layer (phosphor layer forming step); A film containing MeF ₂ is formed on a part of the surface of the phosphor layer (film forming step).

(14) In the PDP manufacturing method according to (13) above, in the phosphor layer forming step, each of the red (R) region, the green (G) region, and the blue (B) region is divided and formed, When the charging characteristics of at least the G region of the three color regions of R, G, and B are negative, the coating forming step forms a coating on at least the green region.
(15) The method for producing a PDP according to (14) above, wherein a zinc silicate phosphor is used in forming the G region in the phosphor layer forming step. Specific zinc silicate G phosphors include, for example, ZnSiO ₄ : Mn, Zn ₂ GaO ₄ : As, Zn ₂ GeO ₄ : Mn, Zn ₂ GaO ₄ : Mn, and the like.

(16) A method for producing a PDP according to (14) or (15), further comprising a heat treatment step in which heat treatment is performed on the film in an oxygen atmosphere for a desired time after the film is formed. In this film, in the thickness direction of the film, an oxide in which fluorine atoms from the surface to a desired depth are substituted with oxygen atoms is formed, and a partial region is made of MeF ₂ and MeO. It is characterized by the presence of a mixed phase.

(17) In the PDP manufacturing method according to (16) above, in the heat treatment step, the substitution rate from fluorine atoms to oxygen atoms on the surface of the coating is in the range of 30 (mol%) to 60 (mol%). The time for performing the heat treatment is set in the inner state.
(18) In the PDP manufacturing method according to any one of (13) to (17), in the film formation step, when the film after formation is viewed in plan, the film is spotted or striped. The film formation conditions are set so that

  (19) A method for manufacturing a PDP according to any one of (13) to (18) above, wherein a substrate on which a coating film is formed is formed by forming an SCN electrode and a SUS electrode in a paired state. The substrate has an arrangement step in which the substrate is opposed to the substrate with a space (discharge space) in between and the outer peripheral portion is sealed, and the film formation region in the film formation step is on the surface of the phosphor layer. The offset is set in a region close to the SCN electrode.

(20) A method for producing a PDP according to any one of (13) to (19), wherein the film formation step is selected from the group consisting of MgF ₂ , CaF ₂ , BaF ₂ , and LiF _2. A film made of MeF ₂ is formed on a part of the surface of the phosphor layer by using a sputtering method or a vacuum deposition method.

In the PDP according to the present invention, since a film containing MeF ₂ is formed on the surface of the phosphor layer, address mistakes are drastically compared to the case where a metal oxide film is formed as in the conventional PDP. Can be suppressed, and high image quality can be obtained. That is, compared with the case where a metal oxide film (for example, made of Al ₂ O ₃ ) is formed on the surface of the green phosphor layer as in the PDP according to Patent Document 1, the portion covered with the film The charging characteristic can be changed to positive polarity. As a result, regardless of the charging characteristics of the phosphor layer, by forming a MeF ₂ film in a region of the phosphor layer having a negative charging characteristic, the charging characteristic on the film surface is made positive. The charging characteristics of the surface where the discharge space in the entire panel is desired can be made to be positive. Therefore, according to the present invention, it is possible to realize a PDP having an advantage that a phosphor layer is formed by selectively using a phosphor having high luminance and high color purity regardless of charging characteristics, and an address error hardly occurs. Is.

Further, MeF ₂ has a higher ultraviolet transmittance than a film formed of a metal oxide such as Al ₂ O ₃ , and even if a film made of MeF ₂ is formed on the phosphor layer, it is substantially a problem. This does not cause a decrease in luminous efficiency of a certain level.
In addition, when a small amount of moisture remains in the discharge space during the manufacture of the panel, it may cause deterioration of the phosphor layer. However, in the PDP according to the present invention, MeF ₂ having water repellency is used. Since it is formed on the phosphor layer, at least the phosphor layer in the region covered with the film is prevented from being deteriorated due to the influence of moisture.

Furthermore, the method for manufacturing a PDP according to the present invention can easily manufacture the PDP according to the present invention.
The PDP according to the present invention is particularly effective when a zinc silicate phosphor is used as a component of the G phosphor layer.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings, taking an AC surface discharge type PDP as an example. However, the embodiment described below is an example used for explaining the configuration and operation of the present invention, and it is stated in advance that the present invention is not limited to these configurations and the like. .
(Embodiment 1)
1-1. Overall Configuration of PDP 1 The overall configuration of PDP 1 according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view of a main part of the PDP 1 and shows a part of the display area.

  As shown in FIG. 1, the PDP 1 is roughly composed of a front panel 10 and a back panel 20. The front panel 10 includes a display electrode pair 12 (sustain electrodes each extending in the Y direction (hereinafter referred to as “SUS”) on one main surface of the front substrate 11 (a main surface facing downward in the Z direction in FIG. 1). A plurality of pairs are formed in the X direction, and the front substrate 11 on the side on which the display electrode pairs 12 are formed is referred to as “electrodes”) 12a and scan electrodes (hereinafter referred to as “SCN electrodes”) 12b. A dielectric layer 13 and a dielectric protective layer 14 are sequentially formed and configured so as to cover the main surface. Here, the SUS electrode 12a and the SCN electrode 12b are made of, for example, a metal material mainly composed of silver (Ag), and the dielectric layer 13 is made of, for example, lead-based low-melting glass. The dielectric protective layer 14 is made of, for example, magnesium oxide (MgO).

Note that each of the SUS electrode 12a and the SCN electrode 12b has a structure made of a metal material as described above, a structure in which ITO (Indium Tin Oxide) and a bus line are combined, or chromium (Cr) -copper. It may have a laminated structure of (Cu) -chromium (Cr).
In forming the dielectric protective layer 14, an oblique vapor deposition method may be used, and the weight density may be set within a range of 70 to 85 (%) of the single crystal material.

  On the other hand, the back panel 20 has address electrodes (hereinafter referred to as “Adr electrodes”) 22 formed in stripes on one main surface of the back substrate 21 (main surface facing upward in the Z direction in FIG. 1). A dielectric layer 23 is formed and configured to cover the main surface of the back substrate 21 on the side where the Adr electrode 22 is formed. Further, on the surface of the dielectric layer 23, partition walls 24 are erected at portions corresponding to the gaps between the adjacent Adr electrode 22 and the Adr electrode 22, respectively. The red (R), green (G), and blue (B) phosphor layers 25R, 25G, and 25B are formed on the wall surface of the groove formed at 24 separately for each groove. And the surface of each fluorescent substance layer 25R, 25G, 25B is coat | covered with the fluorescent substance film | membrane 26 so that this and the discharge space 30 may be separated. The phosphor film 26 is a characteristic part in the present embodiment and will be described later.

The Adr electrode 22 in the back panel 20 is made of, for example, a metal material mainly composed of Ag, like the SUS electrode 12a and the SCN electrode 12b in the front panel 10. The dielectric layer 23 is formed of lead-based low-melting glass as a main name material like the dielectric layer 13 of the front panel 10, but titanium oxide is considered in consideration of reflection efficiency such as visible light. (TiO ₂ ) is contained. In forming the phosphor layers 25R, 25G, and 25B of the respective colors, for example, the following phosphor materials can be used.

Red (R) phosphor; (Y, Gd) BO ₃ : Eu
Green (G) phosphor; Zn ₂ SiO ₄ : Mn
Blue (B) phosphor; (Ba, Eu) MgAl ₁₀ O ₁₇ : Eu
The front panel 10 and the back panel 20 are sealed with frit glass between the outer peripheral portions of the panels. In the discharge space 30 formed between the panels 10 and 20, a discharge gas (Penning mixed gas) made of an inert gas component such as helium (He), xenon (Xe), or neon (Ne) has a predetermined pressure. (For example, 53.2 to 79.8 kPa).

1-2. Configuration of Phosphor Film 26 Next, the configuration of the phosphor film 26 which is the most characteristic part in the PDP 1 according to the present embodiment will be described with reference to both FIGS. FIG. 2 is an enlarged view of part A in FIG. 1, and FIG. 3 shows the distribution ratio of oxygen atoms in the phosphor film 26 (the ratio of oxygen atoms to the sum of oxygen atoms and fluorine atoms; mol%).

First, as shown in FIG. 2, the phosphor film 26 formed so as to cover the surface of the phosphor layer 25 on the discharge space 30 side is a first layer 261 made of MeF ₂ as shown in the enlarged portion of the figure. And a second layer 262 made of a mixed phase of MeF ₂ and MeO.
Here, as Me, at least one element of alkali metal or alkaline earth metal can be used, but it is desirable to use at least one element selected from the following element group.

Me; Mg, Ca, Ba, Li
Note that Me does not necessarily need to be one type selected from the above element group, and a plurality of types may be selected.
As shown in the enlarged portion of FIG. 2, the first layer 261 has a layer thickness T1 and is in contact with the surface of the phosphor layer 25. Further, the second layer 262 is in a state of being laminated on the outer surface (on the discharge space 30 side) of the first layer 261, and has a layer thickness T2. The phosphor film 26 has a film thickness T as a whole.

  The film thickness T of the phosphor film 26 is desirably set to 1000 (nm) or less, for example. This is because if the film thickness T of the phosphor film 26 is set to 1000 (nm) or more, the loss of ultraviolet rays increases, and the luminous efficiency of the PDP 1 may be reduced. For example, when the film thickness T is set to 1000 (nm) or less, the ultraviolet loss can be suppressed to a maximum of about 5% or less, but the film thickness T is set to 1100 (nm) slightly exceeding 1000 (nm). In such a case, the ultraviolet loss is abruptly increased to 30%.

Next, of the two layers 261 and 262 constituting the phosphor film 26, the first layer 261 is composed of MeF ₂ as described above and is homogeneous in the layer. The second layer 262 is composed of a mixed phase of MeF ₂ and MeO, but is inhomogeneous in the film thickness direction, that is, in the direction from the film surface 26f2 to the interface 26f1 with the phosphor layer 25. Specifically, in the second layer 262, the distribution ratio of oxygen atoms in the composition gradually decreases in the direction from the film surface 26f2 side to the film interface 26f1 side, and the distribution of fluorine atoms accordingly. The ratio increases gradually. This will be described with reference to FIG.

  As shown in FIG. 3, on the film surface 26f2 of the phosphor film 26, the ratio of oxygen atoms to the sum of oxygen atoms and fluorine atoms (hereinafter simply referred to as “oxygen atom ratio”) is approximately 70 (mol%). ) Is set. The ratio of oxygen atoms gradually decreases toward the interface 26f1 with the phosphor layer 25. The oxygen atoms in the second layer 262 in the phosphor film 26 are continuously reduced, and the degree of reduction is n-order function (n ≧ 2) or exponential as shown in FIG. It has become.

The ratio of oxygen atoms is substantially 0 (mol%) at the boundary between the first layer 261 and the second layer 262 where the depth from the film surface 26f2 is T2. In the range closer to the interface 26f1 than the boundary in the phosphor film 26, the first layer 261 having a composition of only MeF ₂ exists. However, even in the first layer 261, oxygen atoms at an impurity level (for example, a level of less than 10 ppm) are present. That is, the ratio of oxygen atoms in the first layer 261 and at the boundary between the second layer 262 and the first layer 261 is infinitely 0 (mol%). Absent. In FIG. 3, the ratio of oxygen atoms in these portions is represented as 0 (mol%) for convenience.

The configuration of the phosphor film 26 is not limited to the above. For example, a layer made of MeO on the film surface 26f2 side, a layer made of MeF ₂ on the interface 26f1 side with the phosphor layer 25, and a region made of a mixed phase of MeO and MeF ₂ similar to the first layer in the meantime It is also possible to adopt a configuration in which a layer made of MeO and a layer made of MeF ₂ are reversed. And in the area | region which consists of a mixed phase formed in between, it should just be set as the structure which the distribution ratio of an oxygen atom and a fluorine atom decreases gradually and increases. However, when a layer made of MeO is formed in the phosphor film, particularly on the surface of the film, it is inevitable that the luminous efficiency of the PDP is lowered due to the low ultraviolet transmittance of MeO. . Therefore, as shown in FIG. 3, it is desirable that a mixed phase of MeF ₂ and MeO exists on the film surface 26f2.

The thickness T2 of the second layer 262 is preferably set to 5 (nm) or more and 100 (nm) or less. This is because MeO contained in the second layer 262 has a lower ultraviolet transmittance than MeF ₂ , but is excellent in terms of protecting the phosphor layer from ion bombardment. Taking these two characteristics into consideration, the range of the thickness T2 is defined as a desirable range for the panel.
The ratio of oxygen atoms on the film surface 26f2 in the phosphor film 26 is desirably 60 (mol%) or less for the above reason. For example, when the ratio of oxygen atoms on the film surface 26f2 is 100 (mol%), that is, when a MeO layer is formed on the film surface 26f2, the ultraviolet transmittance is 60, which constitutes the PDP. On the other hand, when the ratio of oxygen atoms on the film surface 26f2 is 60 (mol%), the transmittance of ultraviolet rays is 60, which is an acceptable level for constituting a PDP. Become.

1-3. Next, a method for driving the PDP 1 will be described with reference to FIG. FIG. 4 shows a method of driving the PDP 1 by dividing one field into eight subfields SF1 to SF8 in order to express 256 gradations, for example, using an intra-field time division gradation display method. The axis shows time. Each electrode 12a, 12b, 22 is connected to a signal line from a drive circuit (not shown), and a pulse signal is applied from each driver in the drive circuit (about these configurations). (The explanation is omitted.)

  As shown in FIG. 4, in the method for driving PDP 1 according to the present embodiment, one field is divided into eight subfields SF1 to SF8, and the relative luminance ratio of each subfield is 1: 2: 4: 8: The number of sustain pulses is set to be 16: 32: 64: 128. By controlling lighting (ON) / non-lighting (OFF) of each of the subfields SF1 to SF8 according to display luminance data, 256 gradations can be displayed with a combination of eight subfields. In the present embodiment, the PDP 1 is controlled and driven with 256 gradations, but of course not limited thereto.

Each subfield includes an initialization period T ₁ to which a certain time is allocated, a writing period T _2, and a sustain period T ₃ set with a length of time corresponding to the relative ratio of luminance. For example, when performing display driving of the PDP 1 according to the present embodiment, first, an initialization discharge is generated in all discharge cells of the PDP ₁ in the initialization period T ₁ , and thereby a sub-frame before the sub-frame is generated. Initialization is performed to remove the influence of discharge performed in the field and to absorb variations in discharge characteristics.

Next, in the writing period T ₂ , the SCN electrodes 12b (1) to 12b (k) are sequentially scanned for each line based on the subfield data, and the pulses 300, 310 are applied to the electrodes 12a, 12b, 22 respectively. , 320 are applied, and a slight discharge is generated between the SCN electrode 12b and the Adr electrode 22 in a discharge cell in which a sustain discharge is to be generated in the subfield. Thus, in the discharge cell in which a slight discharge is generated between the SCN electrode 12b and the Adr electrode 22, wall charges are stored on the surface of the dielectric protective layer 14 of the front panel 10.

Thereafter, in the sustain period T ₃ , rectangular-wave sustain pulses 300 and 310 are applied to the SUS electrode 12a and the SCN electrode 12b at a predetermined voltage and a predetermined cycle (for example, 2.5 μsec.). The sustain pulse 300 applied to the SUS electrode 12a and the sustain pulse 310 applied to the SCN electrode 12b have the same period and are out of phase by a half period, and all discharge cells in the PDP 1 Are simultaneously applied.

As described above, the display drive of the PDP 1 is performed.
1-4. Advantage of PDP 1 The advantage of PDP 1 according to the present embodiment will be described using FIG. 5 in comparison with a conventional PDP having no phosphor film. FIG. 5A is a diagram schematically showing a charging state in the discharge cell after the writing period T _{2 in the} PDP 1 according to the present embodiment, and FIG. 5B is a charging immediately after the writing period in the conventional PDP. It is a figure which shows a state. In both PDPs, the green phosphor layer is composed of a zinc silicate phosphor, and in this region, it has negative electrode charging characteristics. Further, there is no structural difference other than the presence or absence of the phosphor film 26.

First, as shown in FIG. 5B, since the green phosphor layer has negative charging characteristics, in the conventional PDP not having the phosphor film 26, in the writing period T ₂ , Charges are not accumulated in the region 530b on the SCN electrode 512b. That is, in the conventional PDP of FIG. 5B, the phosphor layer having negative charging characteristics is exposed to the discharge space 530, and is affected by the charging characteristics of the exposed surface 530c. The charge on the SCN electrode 512b is canceled and an address miss occurs. When it becomes such a situation, in the sustain period T _3, never discharge between the SUS electrodes 512a and SCN electrode 512b occurs, will occur black noise.

On the other hand, as shown in FIG. 5A, in the PDP 1, the surface 30c facing the discharge space 30 in the back panel 20 is positively charged by covering the phosphor layer 25 with the phosphor film 26. To have properties. Therefore, after the writing period T2, negative charges are sufficiently accumulated in the region 30a on the SUS electrode 12a on the surface of the front panel 10 facing the discharge space 30, and positive charges are sufficiently accumulated in the region 30b on the SCN electrode 12b. become. That is, in PDP 1, never occur an address miss, it can be in the sustain period T ₃ causes reliably sustain discharge at a desired discharge cell.

The surface potential of each surface of each phosphor layer 25R, 25G, 25B before forming the phosphor film 26 was about 25 (mV), about −20 (mV), and about 30 (mV). On the other hand, after the phosphor film 26 is formed, the surface of the phosphor film 26 uniformly exhibits a value of about 40 (mV) regardless of the charging characteristics of the lower phosphor layer 25.
In addition, since the PDP 1 according to the present embodiment includes not only MeF ₂ but also MeO as a constituent material of the phosphor film 26, the phosphor layer 25 is protected from both influences of moisture and ion bombardment when the panel is driven. Even if it has a function and it is driven for a long time, deterioration of the phosphor constituting the phosphor layer 25 is suppressed. Note that the phosphor coating 26, but includes a low UV transmittance MeO, as in FIG 3, has a mixed phase of MeF ₂ and MeO, and, MeF ₂ and in the mixing phase Since the distribution ratio of MeO is set to change continuously, the reflection loss of ultraviolet rays and visible light can be minimized. Therefore, the phosphor film 26 does not have a clear interface in terms of material characteristics between MeF ₂ and MeO, and even if it contains MeO that is resistant to ion bombardment as a component of the film, like the PDP of Patent Document 1 above. The light emission efficiency of the panel does not decrease.

Therefore, the PDP 1 according to the present embodiment has the advantage that it has a high image quality and high light emission efficiency while having a phosphor layer made of a material with high luminance and color purity, with little occurrence of address misses. Have.
Although membrane ultraviolet transmittance as compared to the film made of only MeF ₂ by including MeO in the phosphor coating 26 is to be lowered, the phosphor layer 25 from the effects of ion bombardment, as described above An additional advantage of protecting can be obtained.

1-5. Method for Forming Phosphor Film 26 Next, a method for forming the phosphor film 26 having a feature in the present embodiment among the manufacturing of the PDP 1 will be described with reference to FIG. In addition, since the conventional manufacturing method of PDP can be applied to portions other than the formation of the phosphor film 26 described below, description thereof is omitted here.

As shown in FIG. 6A, the Adr electrodes 22 are formed in a stripe shape on the back substrate 21 and covered with a dielectric layer 23 containing TiO _2. Layer 25 is formed. The steps up to here are known as described above. Then, the thus-formed surface of the phosphor layer 25, by sputtering, to form a precursor film 260 having a thickness T made of MeF ₂ (precursor film forming step). The state in which the precursor film 260 is formed on the surface of the phosphor layer 25 is as shown in FIG.

As shown in FIG. 6B, both end portions of the precursor film 260 are in a state where they partially reach the surface of the partition wall 24.
Next, heat treatment (for example, at a temperature of about 450 ° C. for 15 min.) Is performed on the precursor film 260 in an oxygen atmosphere. By this step, fluorine atoms in the composition of MeF ₂ constituting the precursor film 260 are replaced with oxygen atoms from the film surface side. Here, an annealing treatment may be performed as the heat treatment. In this case, when the precursor film 260 made of MeF ₂ is formed by the sputtering method, MeF ₂ in a part of MeF ₂ is deficient in fluorine atoms and oxygen atoms are embedded in the deficient part by annealing treatment. _A mixed phase composed of ₂ and MeO can be formed.

As shown in FIG. 6 (c), in the later heat treatment step, a first layer 261 made of MeF _2, MeF ₂ and MeO from the second layer 262 Metropolitan comprising a mixed phase of composed phosphor film 26 of the Formation is performed (film formation step).
As a specific example, when Me in the first layer 261 and the second layer 262 is magnesium (Mg) and the film thickness T = 15 (nm), the conditions shown in FIGS. Therefore, the layer thickness T1 of the first layer 261 in FIG. 2 is 8 (nm), and the layer thickness T2 of the second layer 262 is 7 (nm). Further, by performing heat treatment under these conditions, the ratio of oxygen atoms in the composition of the film surface 26f2 (the ratio of oxygen atoms to the sum of oxygen atoms and fluorine atoms) is approximately 70 (moles) as shown in FIG. %).

Regarding the layer thickness of each of the first layer 261 and the second layer 262 in the phosphor film 26, the distribution ratio of oxygen atoms in the composition of the second layer 262, etc., FIG. 6B to FIG. ), Specifically, the heat treatment temperature, the heat treatment time, the oxygen concentration in the atmosphere, and the like can be changed.
In the present embodiment, in forming the phosphor film 26, the heat treatment is performed in an oxygen atmosphere as described above. However, the heat treatment may be performed in oxygen plasma. In this case, it is possible to lower the processing temperature during the heat treatment and shorten the processing time, and it is possible to more reliably eliminate the adverse effects on the back substrate 21 and the like during the heat treatment.

  Further, after the formation of the precursor film 260 as shown in FIG. 6B, oxygen atoms are ion-implanted into the precursor film 260, and then, as described above, a desired temperature (for example, 400 ° C.). It is also possible to form the phosphor film 26 by annealing at (3). Thus, when the phosphor film 26 is formed by using the method of ion implantation and annealing, the lower temperature is set lower than that in the case of the formation by the heat treatment (450 ° C.) of the above embodiment. It is only necessary to add to, and is advantageous in terms of quality and manufacturing cost.

Furthermore, in the formation of the precursor film 260 from FIG. 6A to FIG. 6B, the sputtering method is used in the above, but other methods such as an electron beam evaporation method are used. It is also possible to use it.
(Embodiment 2)
2-1. Next, the configuration of the PDP 2 according to the second embodiment of the present invention will be described with reference to FIG. 7 mainly for the differences from the PDP 1 described above. FIG. 7 is a cross-sectional view of the main part of the PDP 2.

As shown in FIG. 7, in the PDP 2, only the surface of the green phosphor layer 25G having negative charging characteristics among the three color phosphor layers 25R, 25G, and 25B formed on the back panel 40 is phosphor. The structure is covered with the film 27. The phosphor material constituting each phosphor layer 25R, 25G, 25B is the same as that in the first embodiment, and the phosphor film 27 is a zinc silicate phosphor (Zn) having negative charge characteristics. ₂ SiO _4: is only coated surface of the green phosphor layer 25G formed of Mn).

The phosphor film 27 formed only on the surface of the green phosphor layer 25G is composed of MeF ₂ (for example, MgF ₂ , CaF ₂ , BaF ₂ , LiF _2, etc.) having excellent ultraviolet transmittance. MeO is not included. However, in the formation process, a composition other than MeF ₂ may be included at the impurity level, but this embodiment does not exclude the inclusion of other substances at the impurity level. Further, there is no difference from the phosphor film 26 in the film thickness and the like of the phosphor film 27 other than the above configuration.

Thus, by covering only the surface of the green phosphor layer 25G with the phosphor film 27, in the PDP 2, it is possible to achieve both a reduction in the occurrence of address misses and a suppression of a decrease in the light emission efficiency of the panel. That is, by covering the surface of the green phosphor layer 25G, which itself has a negative charge characteristic like the PDP 1, with the phosphor film 27 made of MeF ₂ , the surface exposed to the discharge space 30 in this portion The charging characteristic at 1 changes to positive polarity, and the occurrence of an address miss in the writing period T ₂ can be suppressed. Then, the phosphor film 27 is composed of only MeF ₂ containing no MeO, for the transmittance of ultraviolet rays, superior to the PDP 1.

Further, in the PDP 2, since the phosphor film 27 is not coated on the surfaces of the red phosphor layer 25R and the blue phosphor layer 25B that originally have positive charging characteristics, ultraviolet rays and visible light generated by the formation of the phosphor film 27 are not used. There is no reduction in transmittance.
2-2. Confirmation of superiority of PDP _{2 When} the surface of the green phosphor layer is covered with a metal oxide film such as Al ₂ O ₃ as in Patent Document 1 above, and the phosphor film 27 made of MeF ₂ as in PDP ₂ The following table shows the degree of change in charging characteristics with and without coating.

表１に示すように、本実施の形態に係るＰＤＰ２のようにＭｅＦ₂からなる蛍光体皮膜２７を緑色蛍光体層２５Ｇの表面に被覆形成することで、負極性であった帯電特性が正極性へと変化しているのに対して、上記特許文献１に係るＰＤＰのように金属酸化物からなる皮膜を形成した場合には、放電空間３０を望む表面の帯電特性を正極性まで変化させることはできない。具体的には、表１に示すように、蛍光体皮膜の材料としてＭｅＦ₂を用いた場合には、皮膜形成前に負極性の「−４８」であった帯電特性が、皮膜形成後には、正極性の「３２」まで変化させることができた。これに対して、金属酸化物であるＡｌ₂Ｏ₃を材料とする皮膜を形成した場合には、皮膜形成後においても、帯電特性は「−１０」までしか変化させることができず、正極性へ変化させるには至らなかった。

As shown in Table 1, by forming a phosphor film 27 made of MeF _{2 on} the surface of the green phosphor layer 25G as in the PDP _{2 according} to the present embodiment, the charging characteristics that were negative have positive polarity. On the other hand, when a film made of a metal oxide is formed as in the PDP according to Patent Document 1, the charging characteristic of the surface where the discharge space 30 is desired is changed to positive polarity. I can't. Specifically, as shown in Table 1, when MeF ₂ was used as the material of the phosphor film, the negative charge characteristic “−48” before the film formation was It was possible to change the positive polarity to “32”. On the other hand, when a film made of Al ₂ O ₃ which is a metal oxide is formed, the charging characteristics can be changed only up to “−10” even after the film is formed. It did not lead to change.

Therefore, in the PDP ₂ having the phosphor film 27 made of fluoride of MeF _2, it is possible to obtain an effect of reliably suppressing the occurrence of address mistakes that could not be achieved by the conventional PDP having a film made of metal oxide. it can. This is thought to be due to the following factors.
Al ₂ O ₃ , which is a metal oxide, has a property of low transmittance of ultraviolet rays, particularly short-wavelength ultraviolet rays. When the phosphor layer surface is coated with a phosphor film using this, a panel is obtained. The light emission efficiency of is low. Also, for example, when forming a coating made of a metal oxide while suppressing a decrease in the luminous efficiency of the panel, the coating ratio must be small, and the negative charging characteristics are changed to the positive polarity. I can't let you. That is, it can be said that it is difficult to use a metal oxide as a constituent material of the phosphor film in order to suppress the occurrence of an address miss without reducing the light emission efficiency of the panel.

On the other hand, MeF ₂ which is a fluoride has a characteristic of high transmittance of ultraviolet rays. For this reason, even when a large area on the surface of the phosphor layer is covered, it is a cause of lowering the luminous efficiency of the panel. Must not. Accordingly, in the PDP ₂ on which the phosphor film 27 made of MeF ₂ is formed, the charging characteristic on the surface of the green phosphor layer 25G can be changed from the negative polarity to the positive polarity, and the light emission efficiency of the panel is also maintained. The

In the PDP 2, as described above, the phosphor film 27 is configured as a single film made of MeF ₂ , but may have the same configuration as the phosphor film 26 in the PDP 1.
(Embodiment 3)
3-1. Next, the configuration of the PDP 3 according to the third embodiment will be described with reference to FIG. 8A is a cross-sectional view of the main part of the PDP 3, and FIG. 8B is a plan view of the rear panel 50 in the PDP 3 as viewed from the discharge space 30 side.

As shown in FIG. 8A, in the PDP 3 according to the third embodiment, the phosphor film 28 is formed on the surfaces of the phosphor layers 25R, 25G, and 25B for all three colors. The phosphor film 28 is different from the phosphor films 26 and 27 in that it does not cover the entire surface of the phosphor layer 25 and there is a portion where the phosphor layer 25 is exposed to the discharge space 30. . Note that the phosphor film 28 according to the present embodiment is made of MeF ₂ and does not contain MeO, which is an oxide, like the phosphor film 27.

  As shown in FIG. 8B, the phosphor film 28 is formed in spots or stripes on the surface of the phosphor layer 25, and the surface of the phosphor layer 25 is discharged in other regions. It has a state exposed to the space 30. The covering ratio of the phosphor film 28 to the surface of the phosphor layer 25 is set to a range in which the charging characteristics are positive as an average in units of discharge cells. That is, the coverage of the phosphor film 28 should be set in advance so that the charging characteristics of the phosphor layer 25 to be coated are grasped in advance and the charging characteristics are averaged in consideration of this. Can do.

  The reason why the phosphor film 28 is formed in spots on the phosphor layer 25 is to suppress the occurrence of address misses without reducing the transmittance of ultraviolet rays and visible light as much as possible. That is, in the region of the phosphor layer surface 25 that is not covered with the phosphor film 28, the transmittance of ultraviolet rays and visible light is ensured to be approximately 100 (%), and the phosphor film 28 that is coated and formed in a spot shape causes discharge. The charging characteristics are converted to positive polarity as an average in cell units.

In addition, about the formation form of the fluorescent substance film | membrane 28, it does not necessarily need to be the spot shape shown in FIG. 8, For example, the same effect can be acquired also by making it striped.
The coverage of the phosphor film 28 on the surface of each phosphor layer 25R, 25G, 25B can be changed based on the charging of each phosphor layer 25R, 25G, 25B. In this way, it is possible to obtain a PDP with higher luminous efficiency by changing the coverage for each color phosphor layer 25R, 25G, 25B.

3-2. Relationship between the surface potential when the phosphor film 28 is formed and the discharge start voltage of the PDP 3 Next, when the spot-like phosphor film 28 is formed as described above, the surface potential and the discharge start voltage of the panel The relationship will be described with reference to FIG. In FIG. 9, the surface potential value is changed at a plurality of levels by changing the coverage of the phosphor film 28, the discharge start voltage at each panel is measured, and each is plotted in correspondence with each other.

  As shown in FIG. 9, the discharge start voltage of the panel changed with the surface potential near 0 (mV), and when the surface potential was less than about −50 (mV), the discharge start was about 200 (V). The voltage drops to about 160 (V) when the surface potential is about 30 (mV). That is, the ease of discharge of the panel varies greatly depending on whether the surface potential is positive or negative, and at least the charging characteristics can be made positive to facilitate the start of discharge.

Although no experimental data is shown, it was found that the discharge delay time with respect to the change timing of the write pulse or the sustain pulse is reduced in the address discharge in the write period T ₂ or the sustain discharge in the sustain period T ₃ .
In the PDP 3 according to the present embodiment, the coverage of the spot-like phosphor film 28 is set according to each charging characteristic of the phosphor layer 25, and charging of the surface portion facing the discharge space 30 between all the discharge cells of the panel is performed. It is possible to make the characteristics uniform, whereby the discharge start voltages can be made uniform and the delay times can be made uniform. Therefore, the PDP 3 can ensure high display quality even when high-speed scanning is performed while suppressing the occurrence of address misses.

3-3. Method for Forming Phosphor Film 28 Hereinafter, a method for forming the spot-like phosphor film 28 shown in FIGS. 8A and 8B will be described. When forming the spot-like phosphor film 28, basically, the same steps as those in FIGS. 6A to 6B are used. However, in order to form the spot-like phosphor film 28, the formation conditions are devised. It is fancy.

  In the present embodiment, the phosphor film 28 is formed on the surface of the phosphor layer 25 by using an electron beam evaporation method. First, a back panel 50 on which the phosphor layer 25 is formed is prepared, and the back panel 50 is placed in a vacuum chamber so that the surface of the phosphor layer 25 faces downward. In this vacuum chamber, a vapor deposition material of magnesium fluoride granules is arranged in the lower region.

The ultimate pressure in the vacuum chamber is 1.3 × 10 ⁻¹³ (Pa) (1.0 × 10 ⁻¹⁵ Torr), and the deposited material is heated by irradiating it with an electron beam, which is reactive with magnesium fluoride. Deposition is performed by introducing a low gas (for example, argon gas). At this time, the deposition conditions are set such that the deposition rate is 100 to 200 (nm / min.) And the deposition time is 5 to 10 (min.). When such a condition is adopted, it is a spot-like phosphor film 28 as shown in FIG. 8, and the film thickness can be set to 10 (nm).

Further, as a method of forming the phosphor film 28, a sputtering method can be adopted other than the electron beam evaporation method. In this case, the spot-like phosphor film 28 shown in FIG. 8 can be formed under the following conditions.
As for the conditions of the sputtering method, argon gas is introduced into the vacuum chamber, and the applied power between the phosphor layer and the target is 400 to 800 (W). Under these conditions, the spot-like phosphor film 28 having a film thickness of less than 10 nm can be formed by sputtering for several minutes at a deposition rate of 50 to 100 nm / min.

When the phosphor film 28 is formed by using the sputtering method, fluorine defects are generated in the film, but by performing heat treatment at 500 (° C.) and 3 (hr.) In an oxygen atmosphere. , Oxygen can be supplemented to fluorine defects. In this case, it has a mixed phase of MeF ₂ and MeO as in the first embodiment. About the effect show | played by having this mixed phase, it is as above-mentioned.
(Embodiment 4)
Next, the configuration of the PDP 4 according to the fourth embodiment will be described with reference to FIG. 10A is a cross-sectional view of the main part of the PDP 4, and FIG. 10B is a perspective view showing only the rear panel 60 taken out.

  As shown in FIG. 10A, in the PDP 4, the phosphor film 29 is formed in a partial region on the surface of the phosphor layer 25 of each color. The region where the phosphor film 29 is formed is a position on the phosphor layer 25 of the back panel 60 and corresponding to the SCN electrode 12 b on the front panel 10. And the fluorescent substance film | membrane 29 is not formed in the position corresponding to the SUS electrode 12a.

  By forming the phosphor film 29 in such a form, it is possible to suppress the occurrence of address misses as in the PDPs 1 to 3 according to the first to third embodiments. At this time, in this embodiment, since the formation position of the phosphor film 29 is offset to the SCN electrode 12b side, the occurrence of address mistakes is reliably suppressed while reducing the coverage of the phosphor film 29b. be able to. Therefore, in the PDP 4, the light emission efficiency of the panel can be maintained higher than in the case where the entire surface of the phosphor layer 25 is covered with the phosphor film.

The phosphor film 29 according to the present embodiment may be configured to have a mixed phase of MeF ₂ and MeO as in the phosphor film 26 according to the first embodiment, or the second embodiment. As described above, a single film of MeF ₂ may be used.
In addition, the phosphor film 29 may be formed in spots or stripes as long as the charging characteristics on the film surface can be positive.

For the phosphor film 29 having such a form, a mask is formed on the surface of the phosphor layer 25 where no film is formed, and a film made of MeF ₂ or the like is formed by vacuum deposition or the like, and then the mask is formed. It can be formed by removing.
(Other matters)
The said Embodiment 1-4 is an example used in order to demonstrate the characteristic on the structure of invention, and the effect show | played from it, Comprising: This invention is not limited to this. For example, in the first to fourth embodiments, a zinc silicate phosphor having a negative charging characteristic is used as the green phosphor 25G, and the respective phosphor coatings 26 are mainly used to convert the charging characteristic to a positive polarity. Although formation of -29 was implemented, about the phosphor material etc. which comprise each of phosphor layer 25R, 25G, 25B, it does not receive limitation to this. For the phosphor films 26 to 29, etc., at least the surface of the phosphor layer having a negative charge characteristic may be coated, and the charge characteristic is positive in discharge cell units. If it is.

  The PDP according to the present invention is effective for realizing a display device such as a computer or a television, in particular, a display device having high definition and high brightness and high image quality.

1 is a perspective view of a main part of a PDP 1 according to a first embodiment. 2 is a partial cross-sectional view showing details of a phosphor layer 25 and a phosphor film 26 in the PDP 1. FIG. 6 is a graph showing the ratio of oxygen (O) atoms to the sum of oxygen atoms and fluorine atoms in the thickness direction of the phosphor film 26; It is a wave form diagram which shows the pulse waveform applied with respect to each electrode in the drive of PDP1. (A) is a conceptual diagram showing a charging state immediately after the writing period T ₂ in the PDP 1, and (b) is a conceptual diagram showing a charging state immediately after the writing period in the conventional PDP. FIG. 4 is a schematic diagram showing each step in the formation of the phosphor film 26. 6 is a cross-sectional view of a main part of a PDP 2 according to Embodiment 2. FIG. (A) is principal part sectional drawing of PDP3 which concerns on Embodiment 3, (b) is a top view which shows the spot-like film | membrane 28 formed on the fluorescent substance layer 25. FIG. It is a characteristic view showing the relationship between the charge amount on the surface of the film 27 in the PDP 3 and the discharge start voltage. (A) is principal part sectional drawing of PDP4 which concerns on Embodiment 4, (b) is the one part fragmentary perspective view.

Explanation of symbols

1, 2, 3, 4,. PDP
10. Front panel 12. Display electrode pair 14. Dielectric protective layer 20, 40, 50, 60. Rear panel 25. Phosphor layer 26. Phosphor film 30. Discharge space 261. First layer 262. Second layer

Claims (20)

In a plasma display panel having a sealed container filled with a discharge gas in a discharge space and having a phosphor layer formed in a partial region facing the discharge space in the sealed container,
A plasma display panel, wherein a film containing an alkali metal fluoride or an alkaline earth metal fluoride is formed on the surface of the phosphor layer. The phosphor layer is composed of a red region, a green region, and a blue region having different charging characteristics from each other, and the charging property in at least one of the three color regions is negative.
The plasma display panel according to claim 1, wherein the coating covers at least a color region having the negative charge characteristic. The phosphor layer is composed of a green region having negative charging characteristics and both red and blue regions having positive charging characteristics,
The plasma display panel according to claim 1, wherein the coating covers the green region. The plasma display panel according to claim 3, wherein the green region is formed of a zinc silicate phosphor. The _{coating, MgF 2, CaF 2, BaF} 2, plasma according to any one of claims 1 to 4, characterized in that it comprises as a main component at least one member selected from the group consisting of LiF ₂ Display panel. The coating also includes an alkali metal oxide or an alkaline earth metal oxide,
6. The plasma display according to claim 2, wherein a mixed phase formed by mixing the fluoride and oxide is present in a partial region in the thickness direction of the film. panel. The plasma display panel according to claim 6, wherein in the mixed phase, the distribution ratio of fluorine atoms gradually decreases or gradually increases in the thickness direction of the film, and the distribution ratio of oxygen atoms gradually increases or decreases accordingly. . 8. The plasma display panel according to claim 7, wherein the distribution ratios of fluorine atoms and oxygen atoms in the mixed phase continuously change in the thickness direction. The plasma display panel according to any one of claims 6 to 8, wherein the oxide contained in the film has a relationship in which a fluorine atom in the fluoride is substituted with an oxygen atom. The plasma display panel according to any one of claims 1 to 9, wherein when the film is viewed in plan, the film is formed in the shape of spots or stripes. When the coating region of the coating is viewed in plan, the coating rate of the coating is set so that the charging characteristics on the surface facing the discharge space are positive in one discharge cell including the coating region. The plasma display panel according to claim 10. The discharge vessel is configured such that two panels face each other with the discharge space in between, and has a scan electrode and a sustain electrode paired with one panel, and the other panel has the above-mentioned It has an address electrode in the direction crossing the scan electrode and the sustain electrode,
The phosphor layer is formed in a region facing the discharge space of a panel including the address electrode,
The plasma display panel according to any one of claims 1 to 11, wherein the coating is formed by being offset in a region close to the scan electrode on the surface of the phosphor layer. A phosphor layer forming step in which a phosphor material containing a phosphor is arranged in a layer in a partial region on one main surface of the substrate, and the phosphor layer is formed by firing the phosphor material;
A film forming step of forming a film containing an alkali metal fluoride or an alkaline earth metal fluoride on a part of the surface of the phosphor layer. A method of manufacturing a plasma display panel, comprising: In the phosphor layer forming step, each of the red region, the green region and the blue region is divided and formed,
When the charging characteristic of at least the green region of the three color regions is negative,
The method for manufacturing a plasma display panel according to claim 13, wherein in the film forming step, a film is formed at least on a green region. The method for manufacturing a plasma display panel according to claim 14, wherein a zinc silicate phosphor is used in forming the green region in the phosphor layer forming step. After the formation of the film, a heat treatment step of performing a heat treatment for a desired time in an oxygen atmosphere on the film,
In the film after the heat treatment step, an oxide in which fluorine atoms from the surface to a desired depth are replaced with oxygen atoms is formed in the thickness direction of the film, and the fluoride is partially formed in the region. The method for producing a plasma display panel according to claim 14, wherein a mixed phase composed of an oxide and an oxide exists. In the heat treatment step, the time for performing the heat treatment is set so that the substitution rate from fluorine atoms to oxygen atoms on the surface of the coating is in the range of 30 mol% or more and 60 mol% or less. A method for producing a plasma display panel as described in 1. above. The film formation step includes setting the film formation conditions so that the film after formation is spotted or striped when the film is viewed in plan view. A method for producing the plasma display panel according to claim 1. The substrate on which the film is formed is disposed opposite to a second substrate on which a scan electrode and a sustain electrode are formed in a pair, with a space therebetween, and the outer peripheral portion is sealed. Has a placement step,
The plasma display according to any one of claims 13 to 18, wherein the film formation region in the film formation step is set by being offset to a region close to the scan electrode on the surface of the phosphor layer. Panel manufacturing method. In the film formation step, at least one selected from the group consisting of MgF ₂ , CaF ₂ , BaF ₂ , and LiF ₂ is applied to the surface of the phosphor layer using a sputtering method or a vacuum evaporation method. The method of manufacturing a plasma display panel according to any one of claims 13 to 19, wherein a film made of the fluoride is formed on a portion.

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