JP2005274328A - Inspection apparatus, inspection method, and method for manufacturing electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection apparatus which has a structure preventing a fracture of a semiconductor device caused by static electricity, an inspection method using the apparatus, and a method for manufacturing an electro-optical device in electrical characteristics inspection performed in a manufacturing process of electro-optical devices such as a liquid crystal display device. <P>SOLUTION: The inspection apparatus 400 comprises a stage 401 having a first surface 401a, inspection terminals 402a, 402b provided on the first surface 401a, and an extendable static electricity removing member 403 which is provided on the first surface 401a so that it becomes taller than the inspection terminals 402a, 402b on the basis of the first surface 401a. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an inspection apparatus used for an electrical characteristic inspection performed as one of manufacturing processes of an electro-optical device, an inspection method using the inspection device, and a method of manufacturing an electro-optical device.

An electro-optical device, for example, a liquid crystal device having a TFD (Thin Film Diode) as a switching element includes a TFD, an array substrate on which data lines and pixel electrodes connected thereto are arranged, a counter substrate on which scanning lines are arranged, and these A liquid crystal sandwiched between two substrates. In such a liquid crystal device, in order to prevent TFD destruction due to static electricity during the manufacturing process, a short-circuit wiring that short-circuits a plurality of data lines and a plurality of scanning lines is provided (for example, Patent Document 1). reference). The connection between the short-circuit wiring, the data line, and the scanning line is disconnected before performing an electrical characteristic inspection which is one of the manufacturing processes of the liquid crystal device. In the electrical characteristic inspection, the presence or absence of a disconnection or short circuit of a scanning line or a data line or a TFD element failure is inspected.
JP 2002-328627 A (paragraphs [0034] to [0036], FIG. 6)

  However, in the liquid crystal device as described above, the TFD can be prevented from being destroyed by static electricity before the step of disconnecting the connection between the data line and the scanning line and the short-circuit wiring. The TFD was destroyed by static electricity. For example, in a lighting inspection as an electrical characteristic inspection, if the inspection terminal and the wiring are in contact with each other while the substrate is charged by static electricity, the charged electric charge may flow rapidly to cause destruction of the TFD. In addition, during a lighting test, if a test signal is supplied to each wiring while the substrate is charged by static electricity, a voltage or current that differs from the original test specification flows, which may cause electrostatic breakdown of the TFD. there were.

  The present invention has been made in view of the above-described problems. In an electrical characteristic inspection performed during the manufacturing process of an electro-optical device, an inspection device having a structure for preventing destruction of a semiconductor element due to static electricity, and the inspection device are provided. It is an object of the present invention to provide an inspection method used and a method for manufacturing an electro-optical device.

  In order to achieve the above object, an inspection apparatus according to the present invention includes a stage having a first surface, an inspection terminal provided on the first surface, and a height of the inspection terminal based on the first surface. And a static electricity removing member that can be expanded and contracted to be higher than the height.

  By inspecting the electrical characteristics of the inspection object using the inspection apparatus having such a configuration of the present invention, the inspection object can be inspected without being destroyed by static electricity. That is, by providing the inspection device with a static eliminating member that can be expanded and contracted to be higher than the height of the inspection terminal, before inspecting the electrical characteristics of the inspection object using the inspection terminal, Unnecessary electric charges previously charged on the inspection object can be removed by bringing the object into contact with the object. Therefore, the electrical property inspection of the inspection object can be performed in a state where unnecessary charges are not charged, so that the charged charge rapidly flows due to the contact between the inspection terminal and the inspection object, and the inspection object Will not be destroyed. Furthermore, a voltage or current having a desired inspection specification can be passed through the inspection object, so that a voltage higher than the withstand voltage of the inspection object is not applied, and breakdown due to static electricity can be prevented.

  Further, the static electricity removing member is provided on the first surface.

  According to such a configuration, a stage or an inspection object is moved by providing an inspection terminal and an expandable / contractable static electricity removing member having a height higher than that of the inspection terminal on the same surface of the same stage. Only by the operation, the static elimination process by the static electricity removing member and the electrical characteristic inspection process by the inspection terminal can be continuously performed.

  In addition, a stage provided with the static electricity removing member different from the stage is provided, and the stage provided with the inspection terminal and the stage provided with the static electricity removing member are interlocked.

  According to such a configuration, the interlocking two stages or the inspection target object can be obtained by providing the inspection terminal and the expandable / contractable static electricity removing member on the different interlocking stages. The static elimination process by the static electricity removing member and the electrical characteristic inspection process by the inspection terminal can be continuously performed only by the movement operation.

  The static electricity removing member is compressible to at least the height of the inspection terminal.

  According to such a configuration, from the static elimination process by the contact between the static electricity removing member and the inspection object to the inspection process by the contact between the inspection terminal and the inspection object, and the inspection terminal and the inspection object are in contact. During the inspection process, the contact between the static eliminating member and the inspection object can be maintained. Accordingly, it is possible to remove static electricity immediately before and during the inspection of the electrical characteristics of the inspection object, and to prevent the inspection object from being damaged by static electricity.

  The apparatus further comprises elevating means for elevating the stage.

  Thus, by providing the raising / lowering means for raising and lowering the stage and raising or lowering the stage, the static elimination step and the electrical characteristic inspection step can be performed continuously.

  In addition, a part of the static electricity removing member is covered with a protective member.

  According to such a configuration, a part of the static electricity removing member is fixed by the protective member, so that the mechanical strength against the external force applied to the static electricity removing member at the time of contact between the static electricity removing member and the inspection object is improved. For example, when an elongated member such as a probe pin is used as the static electricity removing member, if the protective member is not provided, the probe pin may be broken by an external force applied to the static electricity removing member when the static electricity removing member is in contact with the inspection object. Damage such as bending is likely to occur. If the probe pin is bent, the positional accuracy between the static electricity removing member and the inspection object deteriorates, and the probe pin does not come into contact with the static electricity removing member of the inspection object, which may cause a contact failure. is there. Also, if the probe pin breaks, the inspection must be interrupted to replace the probe pin, resulting in poor work efficiency. Therefore, by covering a part of the static electricity removing member with the protective member, it is difficult to bend and break, the positional accuracy between the static electricity removing member and the inspection object is improved, and work efficiency is improved.

  The inspection method of the present invention is a substrate inspection method in which an input terminal and a conductive member are provided on the same surface, a stage having a first surface, an inspection terminal provided on the first surface, and the first A first surface of an inspection apparatus including a static electricity removing member that can be expanded and contracted to be higher than a height of the inspection terminal with respect to one surface; and the input terminal and conductive member of the substrate. After the step of disposing the inspection device and the substrate so as to face each other, the step of bringing the static eliminating member and the conductive member into contact, and the step of contacting the static eliminating member and the conductive member, A step of bringing the input terminal and the inspection terminal into contact with each other.

  According to this configuration of the present invention, the electrical characteristics of the substrate can be inspected without destroying the substrate due to static electricity. That is, since the substrate is inspected using an inspection device provided with a static electricity removing member, the static electricity removing member and the conductive member are contacted before inspecting the electrical characteristics of the substrate by contacting the inspection terminal and the input terminal. Thus, unnecessary charges previously charged on the substrate can be removed. Therefore, the electrical characteristics of the substrate can be inspected in the state where unnecessary charges are not charged, so that the charged charge due to the contact between the inspection terminal and the substrate does not flow rapidly to destroy the substrate. . Furthermore, a voltage or current having a desired inspection specification can be passed through the substrate, so that no voltage exceeding the breakdown voltage of the substrate is applied, and breakdown due to static electricity can be prevented. In addition, for example, the inspection apparatus may be configured to have an inspection terminal and a stretchable static electricity removing member having a height higher than the inspection terminal on the same surface of the same stage, or for inspection on different interlocking stages. By providing a stretchable static electricity removing member having a height higher than that of the terminal and the inspection terminal, the static elimination process by the static electricity removing member and the electrical characteristics by the inspection terminal can be performed in one operation of moving the stage or the substrate. The inspection process can be performed continuously.

  The electro-optical device manufacturing method of the present invention is a method for manufacturing an electro-optical device having a pair of substrates disposed opposite to each other and a semiconductor element disposed on the substrate. A step of short-circuiting the wires to each other and a conductive member electrically connected to the short-circuiting wires, cutting the connection between the short-circuiting wires and the wires, a stage having a first surface, and the first The static elimination member of an inspection apparatus comprising: an inspection terminal provided on one surface; and an electrostatic elimination member that can be expanded and contracted to be higher than a height of the inspection terminal with respect to the first surface. And a step of bringing the wiring and the inspection terminal into contact with each other after the step of contacting the conductive member and the step of contacting the static eliminating member and the conductive member.

  According to this configuration of the present invention, the electrical characteristics of the substrate can be inspected without destroying the semiconductor element due to static electricity, and an electro-optical device free from defects in the semiconductor element can be obtained efficiently. That is, by inspecting using an inspection apparatus provided with a static electricity removing member, before inspecting the electrical characteristics of the substrate using the inspection terminal, it is unnecessary to contact the static electricity removing member with the conductive member and charge the substrate in advance. Can be removed. Therefore, the electrical characteristics of the substrate can be inspected in the state where unnecessary charges are not charged, so that the charged charge due to the contact between the inspection terminal and the substrate does not flow rapidly to destroy the substrate. . Furthermore, a voltage or current having a desired inspection specification can be passed through the substrate, so that no voltage exceeding the breakdown voltage of the substrate is applied, and breakdown due to static electricity can be prevented. In addition, for example, the inspection apparatus may be configured to have an inspection terminal and a stretchable static electricity removing member having a height higher than the inspection terminal on the same surface of the same stage, or for inspection on different interlocking stages. By providing a stretchable static electricity removing member having a height higher than that of the terminal and the inspection terminal, the static elimination process by the static electricity removing member and the electrical characteristics by the inspection terminal can be performed in one operation of moving the stage or the substrate. The inspection process can be performed continuously.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiments, a liquid crystal device is taken as an example of an electro-optical device. Specifically, a transflective active matrix liquid crystal device using TFD (Thin Film Diode) as a semiconductor element, and an electronic device using the liquid crystal device will be described, but the present invention is not limited thereto. is not. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

(Configuration of electro-optical device)

  First, the electrical configuration of the liquid crystal device will be described.

  FIG. 1 is an equivalent circuit diagram of the liquid crystal device according to the present embodiment.

  As shown in FIG. 1, the liquid crystal device 100 is formed with a plurality of scanning lines 214 extending in the row (x) direction. On the other hand, data lines 314 as a plurality of wirings are formed extending in the column (y) direction. A dot 110 is formed corresponding to each intersection of the scanning line 214 and the data line 314. This dot 110 corresponds to one color of R (red), G (green), and B (blue), and one pixel 120 is constituted by three dots of RGB adjacent to each other in the x direction. ing.

  Here, the dot 110 includes a series connection of a liquid crystal capacitor 162 and a TFD 320 as a semiconductor element which is an example of a switching element. Among these, as will be described later, the liquid crystal capacitor 162 has a configuration in which liquid crystal, which is an example of an electro-optical material, is sandwiched between a scanning line 214 that functions as a counter electrode and a pixel electrode. The TFD 320 has one end connected to the data line 314 and the other end connected to the pixel electrode.

  The Y driver 251 is generally called a scanning line driving circuit. On the other hand, the X driver 350 is generally called a data line driving circuit, and the data lines 314 respectively correspond to the data signals corresponding to the display contents with respect to the dots positioned on the scanning line 214 selected by the Y driver 251. It supplies it via.

  Next, the mechanical structure of the liquid crystal device 100 will be described with reference to FIGS.

  FIG. 2 is a schematic perspective view showing an external configuration of the liquid crystal device 100. In this figure, in order to facilitate understanding of the wiring layout in the liquid crystal device 100, the observation side visually recognized by the observer is shown as the back side in the figure, while the back side that the observer does not normally visually recognize is the front side in the figure. As shown. FIG. 3 is a partial cross-sectional view of the liquid crystal device 100 of FIG. 2 taken along line AA ′, with the observation side on the upper side and the back side on the lower side. FIG. 4A is a schematic plan view showing a wiring state of the array substrate 140b constituting the liquid crystal device 100. FIG. In FIG. 4A, the drivers 251 and 350 are not shown for easy understanding of the positional relationship of the wirings formed on the array substrate 140b. FIG. 4B is an enlarged plan view of a region surrounded by an ellipse B in FIG. FIG. 5 is a cross-sectional view taken along line CC ′ of FIG.

  As illustrated in FIG. 3, the liquid crystal device 100 includes a pair of retardation plates 123 and 133 and polarizing plates 121 and 131 that are disposed so as to sandwich the liquid crystal panel 140. Further, although not shown here, the liquid crystal device 100 includes a backlight on the back side of the liquid crystal panel 140.

  The liquid crystal panel 140 includes a pair of array substrates 140b and a counter substrate 140a arranged to face each other, and a TN (Twisted Nematic) type liquid crystal 160 sandwiched between the substrates.

  As shown in FIGS. 2 and 3, the array substrate 140 b has a substrate 300, and the counter substrate 140 a has a substrate 200. The substrate 300 positioned on the observation side has a protruding portion 300a that protrudes from the substrate 200 positioned on the back side. The array substrate 140b and the counter substrate 140a are bonded to each other with a predetermined gap by a sealing material 111 in which conductive particles 114 that also serve as spacers are dispersed at an appropriate ratio. The sealing material 111 is formed along the outer peripheral portion of the substrate 200, but a part of the sealing material 111 is opened to enclose the liquid crystal 160. Therefore, after the liquid crystal 160 is sealed, the opening is sealed with the sealing material 112.

  As shown in FIGS. 2 and 4, a Y driver 251 and an X driver 350 are mounted on the overhanging portion 300a, and an FPC board 150 is bonded thereto. Bumps (not shown) made of, for example, gold are formed on the periphery of the mounting surface of the Y driver 251 and the X driver 350.

  As shown in FIGS. 2 to 4, a plurality of scanning lines 214 are formed in the x direction on the surface of the substrate 200 on the substrate 300 side. On the other hand, a plurality of data lines 314 are formed in the y direction on the surface of the substrate 300 on the substrate 200 side. The scanning line 214 is extended to the region where the sealing material 111 is formed. In addition, on the substrate 300, a lead wiring 372 is formed so as to correspond to the scanning line 214 on a one-to-one basis and to face one end of the corresponding scanning line 214 in a region where the sealing material 111 is formed. In FIG. 4A, the scanning line 214 is indicated by a dotted line. Accordingly, in FIG. 4A, the vicinity of the boundary between the solid line 372 and the dotted line 214 is located in the formation region of the sealing material 111. The conductive particles 114 are dispersed in the sealing material 111 at a ratio such that at least one or more conductive particles 114 are interposed in a portion where one end of the scanning line 214 and one end of the lead wiring 372 are opposed to each other. Therefore, the scanning line 214 formed on the substrate 200 is electrically connected to the lead wiring 372 formed on the substrate 300 through the conductive particles 114. The lead wiring 372 has a laminated structure in which the same layer as a second metal film of a TFD 320 to be described later and the same layer as the pixel electrode 348 are patterned, and the wiring resistance is kept low. The other end opposite to the one end electrically connected to the scanning line 214 of the lead wiring 372 extends to the extension portion 300a. The other end of the lead-out wiring 372 functions as an input terminal, and is joined to the output-side bump of the Y driver 251 at the extension portion 300a.

  On the other hand, the data line 314 has a narrow pitch outside the region where the sealing material 111 is formed, and extends to the protruding portion 300a. Then, the end of the data line 314 functions as an input terminal in the overhang portion 300 a and is joined to the output-side bump of the X driver 350. Further, an FPC (Flexible Circuit Board) substrate 150 is bonded to the overhanging portion 300a, and a clock signal, a control signal, and the like are supplied from an external circuit (not shown) to the input side bumps of the Y driver 251 and the X driver 350. It has a configuration. A connection terminal 384 is formed in the projecting portion 300a, and one end thereof is connected to the input side bumps of the Y driver 251 and the X driver 350, and the other end is connected to the wiring of the FPC board 150.

  As shown in FIGS. 2 and 4A, a guard ring 361 serving as a short-circuit wiring and a bar serving as a conductive member electrically connected to the guard ring 361 are provided on the substrate 300 substantially along the outer periphery of the substrate 300. A code 360 is arranged. The guard ring 361 and the barcode 360 are electrically disconnected from the scanning line 214 and the data line 314 in the state of the liquid crystal device 100.

  The guard ring 361 is connected to one wiring provided along the side of the substrate 300 (side extending in the x direction in the drawing) in the overhang portion 300a, and is connected to the one wiring, and is substantially parallel to the data line 314. Are connected to these two wirings so as to sandwich all of the plurality of data lines 314, and a plurality of scanning lines together with the aforementioned one wiring substantially parallel to the scanning line 214. It consists of one wiring provided so as to sandwich 214. Of the two wirings provided so as to sandwich the data line 314 of the guard ring 361, the wiring located on the left side in the figure is located between the lead-out wiring 372 and the scanning line 214. Of the two wirings provided so as to sandwich the data line 314 of the guard ring 361, the barcode 360 is positioned in the middle of the wiring located on the right side in the figure. Two wirings provided in the guard ring 361 so as to sandwich the data line 314 and wirings provided along the side facing the overhanging portion 300a are substantially located in a region surrounded by the sealing material 111. Of the two wires provided so as to sandwich the data line 314 of the guard ring 361 in the overhang portion 300a, one end portion of the wire located on the left side in the drawing passes through between the Y driver 251 and the X driver 350. It has a shape connected to a part of the guard ring 316 provided along the side of the portion 300a. In addition, one end portion of the wiring located on the right side in the drawing among the two wirings provided so as to sandwich the data line 314 of the guard ring 361 passes along the side of the overhanging portion 300a through the right side of the X driver 350. It has a shape connected to a part of the guard ring 361 provided.

  As will be described in detail later, the guard ring 361, the lead-out wiring 372, and the data line 314 are connected and short-circuited during the manufacturing process, and the connection is cut by, for example, a laser before the lighting inspection. Therefore, as shown in FIG. 4B, in the state of the liquid crystal device 100, there is a cut portion 363 between the guard ring 361 and the data line 314 that cuts both. In addition, there is a cut portion between the guard ring 361 and the lead-out wiring 372 by cutting the both. These cut portions 363 and the guard ring 361 portion in the vicinity of the cut portion 363 are located in the Y driver mounting region 251a and the X driver mounting region 350a in which the driver provided in the overhang portion 300a is mounted.

  The bar code 360 identifies a lot of liquid crystal panels and is used for product management. In the present embodiment, an existing bar code 360 having a certain large area and a guard ring 361 are electrically connected, and a conductive member for grounding when the bar code 360 is grounded via a grounding probe described later. It is used as a feature. As shown in FIG. 5, both the bar code 360 and the guard ring 361 have a stacked structure of the same layers 360 a and 361 a as the data line 314 and the same layers 360 a and 361 a as the pixel electrode 348. The lower layers 360a and 361a are made of chromium, and the upper layers 360b and 361b are made of ITO (Indium Tin Oxide). In the present embodiment, the guard ring 361 has a rectangular shape with a width of about 8 μm, and the bar code 360 has an approximate outer shape of 0.5 mm square. In this way, by adopting a configuration in which the bar code 360 having a large area is connected to the guard ring 361, the charge charged on the substrate can be quickly charged before the lighting inspection as the electrical characteristic inspection by using the inspection device described later. It can be neutralized. Further, by using the existing barcode as a conductive member for grounding, there is no need to newly form a conductive member for grounding. Further, since it is not necessary to newly provide a region for forming a conductive member for grounding, the liquid crystal panel can be downsized. In addition, since the connection part between the barcode and the guard ring can be formed by the same process as the wiring formation during the manufacturing process of the array substrate, there is no need to newly form a connection part between the barcode and the guard ring. Manufacturing efficiency is good.

  Next, the internal configuration of the display area in the liquid crystal device 100 will be described.

  As shown in FIGS. 1 and 3, the array substrate 140b includes a substrate 300, a data line 314 arranged on the substrate 300 and extending in the y direction, and a TFD 320 electrically connected to the data line 314. And a substantially rectangular pixel electrode 348 made of a transparent conductive material such as ITO connected to the TFD 320, and an alignment film 308 made of polyimide or the like covering the pixel electrode 348. The detailed configuration of the data line 314, the pixel electrode 348, and the TFD 320 will be described later.

  On the other hand, the counter substrate 140 a includes a substrate 200, a scattering resin layer 203, a reflective film 204, a color filter 205, a planarization film 207, a scanning line 214, and an alignment film 206 that are sequentially stacked on the substrate 200.

  The scattering resin layer 203 is formed by, for example, heat-treating a photoresist patterned in a spot shape on the surface of the substrate 200 to soften an end portion of the photoresist. The scattering resin layer 203 has an undulating surface, and a reflecting film 204 made of a reflective metal such as aluminum or silver is formed on the undulating surface. Accordingly, since the surface of the reflective film 204 is also undulated reflecting the undulation of the scattering resin layer 203, the light incident from the observation side is appropriately scattered when reflected by the reflective film 204. Further, in order to make the liquid crystal device 100 function not only as a reflection type but also as a transmission type, the reflection film 204 is provided with an opening 209 for transmitting light from the backlight. In addition, without forming such an opening 209, for example, by forming a light-reflective metal such as aluminum with a relatively thin film thickness (20 nm to 50 nm), it is possible to reduce incident light from the back side. It is good also as a structure which permeate | transmits a part. The color filter 205 is provided on the reflective film 204 so as to correspond to a region where the pixel electrode 348 and the scanning line 214 are opposed to each other. The color filter 205 includes three colors of a red color filter 205R, a green color filter 205G, and a blue color filter 205B, and is arranged in a stripe shape. The flattening film 207 flattens unevenness on the surface of the color filter 205 and the reflective film 204. The scanning line 214 is formed to face the pixel electrode 348 formed on the observation-side substrate 300 in the x direction.

  Next, the configuration of 100 dots of the liquid crystal device will be described with reference to FIGS.

  FIG. 6 is a plan view showing a configuration of a pixel composed of three dots in the liquid crystal device 100. 7 is a cross-sectional view taken along line DD ′ of FIG.

  As shown in these figures, the pixel electrodes 348 having a substantially rectangular outer shape are arranged in a matrix, and among these, the pixel electrodes 348 belonging to the same column are commonly connected to one data line 314 via the TFD 320, respectively. Has been. Further, as described above, the pixel electrodes 348 in the same row each face one scanning line 214.

  The TFD 320 includes a first TFD 320a and a second TFD 320b, and an island-shaped first metal film 322 made of tantalum tungsten or the like, and an insulating film 323 formed by anodizing the surface of the first metal film 322. And second metal films 316 and 336 formed on the surface and spaced apart from each other. Among these, the second metal films 316 and 336 are obtained by patterning the same conductive film such as chromium, and the former second metal film 316 is branched from the data line 314 in a T shape, while the latter is used. The second metal film 336 is used to connect to the pixel electrode 348.

  Since the first TFD 320a of the TFD 320 becomes a second metal film 316 / insulating film 323 / first metal film 322 in this order when viewed from the data line 314 side, the metal / insulating film / metal structure is adopted. The current-voltage characteristics are nonlinear in the positive and negative directions. On the other hand, when viewed from the data line 314 side, the second TFD 320b becomes a first metal film 322 / insulating film 323 / large second metal film 336, and has a structure opposite to that of the first TFD 320a. . For this reason, the current-voltage characteristic of the second TFD 320b is obtained by making the current-voltage characteristic of the first TFD 320a point-symmetric with respect to the origin. Eventually, the TFD 320 has a form in which two TFDs are connected in series in opposite directions. Therefore, the current-voltage nonlinear characteristic is symmetric in both positive and negative directions compared to the case where one element is used.

  Note that the lower layer of the data line 314 is a first metal film 312 and an insulating film 313 in a cross-sectional view. This is because the first metal film 322 is branched from the first metal film 312 in the first place, and after the insulating films 313 and 323 are formed by anodic oxidation in the same process, the first metal film 322 and the insulating film 322 are insulated. This is because the film 323 is cut into an island shape.

  In such a configuration, when a selection voltage for turning on the TFD 320 is applied as a scanning signal to the scanning line 214 regardless of the data signal applied to the data line 314, the intersection of the scanning line 214 and the data line 314 is performed. The TFD 320 corresponding to the unit is turned on, and charges corresponding to the difference between the selection voltage and the data voltage are accumulated in the liquid crystal capacitor 162 connected to the turned-on TFD 320. Then, display of the liquid crystal device 100 is performed by utilizing the change in the optical characteristics of the liquid crystal according to the amount of charge accumulated in the liquid crystal capacitance.

  (Inspection equipment)

  Next, an inspection apparatus used when performing a lighting inspection as an electrical characteristic inspection during the manufacturing process of the liquid crystal device described later will be described with reference to FIGS.

  FIG. 8 shows a perspective view of the inspection apparatus and a state at the time of lighting inspection. In FIG. 8, a part of the configuration is illustrated as a conceptual diagram. FIG. 9 is a perspective view (FIG. 9A) and a plan view (FIG. 9B) of the grounding probe of the lighting inspection apparatus. FIG. 10 is a partially enlarged perspective view of the inspection apparatus.

  As shown in FIG. 8, the inspection apparatus 400 includes a stage 401 having a first surface 401a, an X driver inspection probe 402a and a Y driver inspection probe 402b as inspection terminals provided on the stage 401, and grounding. Probe 403.

  The stage 401 is connected to an elevating mechanism 410 as an elevating means, and is designed to be able to be raised and lowered by the elevating mechanism 410. The X driver inspection probe 402a and the Y driver inspection probe 402b are made of conductive rubber. These X driver inspection probe 402a and Y driver inspection probe 402b are connected to the end of each data line 314 and the lead wiring 372 as input terminals arranged in the X driver mounting area 350a and the Y driver mounting area 251a. A signal is supplied to the data line 314 and the lead-out wiring 372 at the time of lighting inspection in contact with each end.

  The grounding probe 403 is provided corresponding to the barcode 360 of the liquid crystal panel 140. By contacting the grounding probe 403 and the barcode 360, the array substrate 140 b is grounded via the grounding probe 403. That is, the grounding probe 403 removes unnecessary charges charged on the array substrate 140b due to static electricity or the like through the guard ring 361 and the barcode 360 connected thereto, and has a charge eliminating function. The grounding probe 403 has a certain resistance. As a result, when the grounding probe 403 is in contact with the barcode 361 and the charge charged on the array substrate 140b is removed, the charge does not flow rapidly. Accordingly, the voltage applied to the array substrate at the time of static elimination can be adjusted to be equal to or lower than the withstand voltage of the array substrate, strictly speaking, to be equal to or less than the withstand voltage of the TFD 320 which is a semiconductor element, and the destruction of the TFD 320 can be prevented. The preferable resistance of the grounding probe 403 may be appropriately adjusted in consideration of the area where the barcode 360 and the guard ring 361 are formed, the resistance value, and the like.

  As shown in FIGS. 8 and 9, the grounding probe 403 includes two probe pins 404 as static electricity removing members, a holder 405 as a protective member for protecting a part of the probe pins 404, and the probe pins 404. And a wiring 406 electrically connected to each other.

  The grounding probe 403 has a spring structure and is designed to be able to expand and contract in the length direction of the probe pin 404. In FIG. 8, when an external force from the top to the bottom acts on the grounding probe 403, the probe pin 404 of the grounding probe pin 403 is pushed into the holder 405, and when the external force stops working, it protrudes to the initial position by the spring force. . In the inspection apparatus 400, in the initial state before the charge removal and lighting inspection, the height 403a of the grounding probe 403 is the height of the driver inspection probes 402a and 402b when the first surface 401a of the stage 401 is used as a reference. It is provided to be higher than 402c. Further, the probe pin 404 of the grounding probe 403 can be compressed to at least the height 402c of the driver inspection probes 402a and 402b.

  One end of the probe pin 404 is in contact with the bar code 360 during the static elimination process and the lighting inspection process, and the other end is a part that is electrically connected to the grounded wiring 406.

  The holder 405 is formed from, for example, an acrylic resin. The holder 405 exposes one end of the probe pin 404 and covers the other part. Here, when grounding is performed by grounding with the structure of the probe pin 404 alone without providing the holder 405, the probe pin 404 has an elongated shape, and may be bent or broken by an external force acting on the probe pin 404. is there. For example, if the probe pin 404 is bent, the bar code 360 and the probe pin 404 are not in contact with each other during the static elimination process, and static electricity cannot be removed. Further, if the probe pin 404 is broken, the work must be interrupted in order to replace it, resulting in poor work efficiency. On the other hand, since a part of the probe pin 404 is fixed by covering a part of the probe pin 404 with the holder 405 as in the present embodiment, it is difficult to bend and break. As a result, the positional accuracy between the barcode 360 and the probe pin 404 is improved, and the trouble of exchanging the probe pin 404 can be saved, thereby improving work efficiency. In the present embodiment, two probe pins 404 are provided, but the number may be adjusted as appropriate according to the area of the grounding conductive member in contact with the probe pins 404. For example, in the case where the guard ring also serves as a grounding conductive member, the guard ring has a narrow width, so the number of probe pins may be one. In the present embodiment, since the barcode 360 as a grounding conductive member with which the probe pin 404 contacts has a certain area, two probe pins 404 are provided. By increasing the number of probe pins 404 in this way, the contact establishment between the barcode 360 and the probe pins 404 is increased, and the grounding can be made more reliable.

  As shown in FIG. 9, the holder 405 has a shape in which a small rectangular parallelepiped 405b is connected to each of two opposing side surfaces of one large rectangular parallelepiped 405a, and the side surface has a cross shape. Two probe pins 404 are held in the large rectangular parallelepiped 405a along the longitudinal direction, and one end of the probe pin 404 projects from the top surface of the rectangular parallelepiped 405a and the other end projects from the bottom surface of the rectangular parallelepiped 405b. 406 is electrically connected.

  As shown in FIG. 10, the grounding probe 403 is designed to be detachable from the stage 401, and the grounding probe 403 can be quickly replaced according to deterioration of the probe pin 404 or the like. That is, the holder 405 protects the probe pin 404 and also functions as a guide when the grounding probe 403 is attached to and detached from the stage 401.

  As shown in FIGS. 8 and 10, the stage 401 is provided with a through hole 410 in which the grounding probe 403 is installed. The through hole 410 has two stepped portions 410b therein, and the side surface of the through hole 410 has a T-shape. In other words, the through-hole 410 has a shape in which two holes of different sizes having a rectangular cross section cut by a plane parallel to the first surface 401a are connected, and a hole located on the first surface 401a side is formed. The cross section is larger than the other hole. The shape of the hole 410a opened in the first surface 401a of the through hole 410 is substantially the same as the shape when the grounding probe 403 is viewed from above. On the other hand, the shape of the hole 410c opened on the surface opposite to the first surface 401a of the through hole 410 is substantially the same as the shape of the bottom surface of the large rectangular parallelepiped 405a. In a state where the grounding probe 403 is incorporated in the stage 401, the small rectangular parallelepiped 405 b portion of the grounding probe 403 is supported by the step portion 410 b in the through hole 410. The small rectangular parallelepiped 405b portion of the grounding probe 403 is completely embedded in the through hole 410, and the upper portion of the grounding probe 403 projects from the first surface 401a. In FIG. 8, the height of the portion protruding from the first surface 401a of the grounding probe 403 relative to the first surface 401a of the portion occupied by the holder 405 is the height 402c of the driver inspection probes 402a and 402b. It is almost the same. That is, the grounding probe 403 is higher than the driver inspection probes 402a and 402b by the height of the probe pin 404 protruding from the holder 405. The probe pin 404 of the grounding probe 403 can be compressed to the height 402c of the driver inspection probes 402a and 402b. Therefore, at the time of lighting inspection, the driver inspection probes 402a and 402b are in contact with the driver mounting regions 350a and 251a, and the grounding probe 403 is in contact with the barcode 360 and the probe pin 403 while the probe pin 403 is It is in a state of being pushed into the holder 405. In the present embodiment, the height of the holder 405 protruding from the first surface 401a of the grounding probe 403 is substantially the same as the height 402c of the driver inspection probes 402a and 402b. Is designed to be compressible up to the height 402c of the driver inspection probes 402a and 402b. However, the present invention is not limited to such a configuration, and the probe pin 404 may be designed to be compressible to a position lower than the height 402c of the driver inspection probes 402a and 402b. For example, the height of the holder 405 protruding from the first surface 401 a of the grounding probe 403 is made lower than the height 402 c of the driver inspection probes 402 a and 402 b, and the probe pin 404 is completely pushed into the holder 405. As such, the probe pin 404 may be compressible.

  Thus, in the present embodiment, the grounding probe 403 and the driver inspection probes 402a and 402b are provided on the same stage, and the height of the probe pin 404 of the grounding probe 403 can be contracted. The static elimination process and the lighting inspection process in the manufacturing process of the liquid crystal device described later can be continuously performed by one operation of moving the stage.

  In the inspection apparatus 400 according to the present embodiment, the inspection probes 402a and 402b that are inspection terminals and the grounding probe 403 that is an electrostatic removal member are provided on the same stage. It is also possible to adopt a configuration in which the stage provided with the difference between the stage provided with the inspection terminal and the stage provided with the inspection terminal are interlocked. Thus, for example, by designing the inspection apparatus so that the positional relationship between the stage on which the inspection terminal is provided and the stage on which the static electricity removing member is provided can be changed, the position of the inspection terminal can be changed by changing the design of the liquid crystal panel. Even when the positions of the static electricity removing member and the static electricity removing member have to be changed, it is not necessary to newly manufacture an inspection device, and an existing inspection device can be used. In addition, by making it possible to arbitrarily change the positional relationship between the inspection terminal and the static electricity removing member, it is possible to obtain an inspection apparatus that can be used for inspection of a wide variety of electro-optical devices without being limited to the liquid crystal panel.

  (Method for manufacturing electro-optical device)

  Next, a method for manufacturing the above-described liquid crystal device 100 using the above-described inspection apparatus will be described with reference to FIGS.

  Since the description of FIG. 8 has been described above, it is omitted here. FIG. 11 is a schematic plan view of the array substrate 140b ′ before the lighting inspection. FIG. 12 is an equivalent circuit diagram of a liquid crystal panel 140 ′ in which the array substrate 140b ′ shown in FIG. 11 and the above-described counter substrate 140a are bonded and liquid crystal is sealed.

  First, a counter substrate 140a and an array substrate 140b ′ shown in FIG. 11 are prepared by a known method.

  As shown in FIG. 11, in the array substrate 140b ′, the guard ring 361, the lead-out wiring 372, and the data line 314 are electrically connected to each other. No driver is mounted in either the Y driver mounting area 251a or the X driver mounting area 350a. Note that the array substrate 140b of FIG. 4A and the array substrate 140b ′ of FIG. 11 differ only in whether the guard ring 361 is connected to the lead-out wiring 372 and the data line 314, and other structures are different. Since they are the same, the description is omitted here. As described above, the guard ring 361 and the barcode 360 have a stacked structure in which the same layer as the data line 314 and the same layer as the pixel electrode 348 are patterned. Accordingly, when the data line 314 is formed, the plurality of data lines 314 are short-circuited to each other by the first layer 361 of the guard ring 361. By providing the guard ring 361 in this way, even if static electricity occurs after the formation of the guard ring 361 on the array substrate 140b ′, more precisely after the formation of the data line 314 and the first layer 361a of the guard ring 361, Static electricity is dispersed within the substrate surface without locally charging the substrate, and TFD destruction due to static electricity can be prevented.

  Next, the counter substrate 140a and the array substrate 140b ′ are bonded to each other through a sealing material 111 provided with a sealing port, and the liquid crystal 160 is sealed between the substrates through the sealing port. Thereafter, the sealing port is sealed with the sealing material 112 to manufacture the liquid crystal panel 140 ′.

  In the state of the liquid crystal panel 140 ′, as shown in FIGS. 11 and 12, the guard ring 361, the data line 341, and the scanning line 241 are electrically connected. As shown in FIG. 11, all the data lines 314 are surrounded by the guard ring 361, whereas the scanning line 214 is partially surrounded by the guard ring 361 and the lead-out wiring 372 is surrounded. There is no state. This is because the counter substrate 140a provided with the scanning lines 214 has higher pressure resistance than the array substrate 140b provided with the data lines 314, TFD 320, and the like. This is because it is not necessary to provide the guard ring 361 so as to surround the entire 372. The TFD 320 that is a semiconductor element has a significantly lower withstand voltage than other wirings, and the withstand voltage of the array substrate 140b on which the TFD 320 is disposed can be regarded as substantially the same as the withstand voltage of the TFD 320 that is a semiconductor element. Here, the pressure resistance refers to the electrical pressure resistance of the substrate against short-circuiting or disconnection of wirings arranged on the substrate, or destruction of semiconductor elements such as TFD. For example, the withstand voltage of the array substrate 140b is 100v, whereas the withstand voltage of the counter substrate 140a is 1 kv, and the counter substrate 140a has higher withstand voltage than the array substrate 140b. In the liquid crystal panel 140 ′, the plurality of data lines 314 and the plurality of scanning lines 214 are short-circuited to each other by the guard ring 361, and even if static electricity occurs, the charges are dispersed within the substrate surface and locally charged. And the destruction of the TFD 320 due to static electricity can be prevented. In the liquid crystal panel 140 ′, the scanning line 214 is electrically connected to the data line 314 through the guard ring 361 and the lead wiring 372, and the scanning line 213 and the data line 314 have the same potential. Yes. Therefore, even if static electricity or the like occurs, the potential difference between the array substrate 140b ′ and the counter substrate 140a becomes zero, and destruction of the TFD 320 can be prevented. In addition, the connection portion between the guard ring 361 and the lead-out wiring 372, the connection portion between the guard ring 361 and the scanning line 214, and the barcode 360 electrically connected to the guard ring 361 are positioned at the overhang portion 300a of the substrate 300. In the liquid crystal panel 140 ′, they are exposed.

  Next, as shown in FIG. 11, a connection portion between the guard ring 361 and the data line 314 and a connection portion between the guard ring 361 and the lead-out wiring 372 provided on the extended portion 300a of the array substrate 140b ′ of the liquid crystal panel 140 ′. Is cut by a laser along the cutting line 362 (cutting step). Thereby, the liquid crystal panel 140 having the array substrate 140b in which the plurality of data lines 314 and the plurality of scanning lines 214 are disconnected from each other as shown in FIG. 4A can be obtained.

  Next, neutralization and lighting inspection are performed using the inspection apparatus 400 described above.

  First, as shown in FIG. 8, the liquid crystal panel 140, which is an inspection object, is installed and fixed by a jig (not shown) so that the array substrate 140b is on the upper side and the counter substrate 140a is on the lower side. The liquid crystal panel 140 is located above the inspection apparatus 400. The driver mounting regions 350a and 251a where the end of the data line 214 as the input terminal and the end of the lead-out wiring 372 are located, and the barcode 360 as the conductive member for grounding are arranged on the same surface of the substrate 300. This surface is disposed to face the first surface 401 a of the stage 401 of the inspection apparatus 400.

  After installing the liquid crystal panel 140, the lifting mechanism 410 of the inspection apparatus 400 is operated to raise the stage 401. First, when the grounding probe 403 contacts the bar code 360, the movement of the inspection apparatus 400 is stopped for a while. Thus, by contacting the probe pin 404 of the grounding probe 403 and the barcode 360 connected to the guard ring 361, the array substrate 140b is grounded, and unnecessary charges charged on the array substrate 140b due to static electricity are removed ( Step of removing electricity by contact between the barcode 360 and the probe pin 404). Here, for example, the bar code 360 and the guard ring 361 may not be electrically connected, and the grounding probe may be brought into contact with a part of the guard ring 361 for static elimination. In this case, since the width of the guard ring 361 is narrow, the number of probe pins 404 of the grounding probe 403 may be one. On the other hand, in the present embodiment, since the barcode 360 as the grounding conductive member has a large area, the probe pin 404 of the grounding probe 403 and the barcode 360 can be easily contacted. Furthermore, by setting the number of probe pins 404 to two, the probability that the probe pins 404 and the barcode 360 are in contact with each other can be increased. In the present embodiment, the probe pins 404 are arranged so that a line connecting the positions of the two probe pins 404 is obliquely positioned with respect to the sides of the rectangular barcode 360. As a result, compared to the case where the probe pin 404 is arranged so that the line connecting the positions of the two probe pins 404 is parallel to the side of the rectangular barcode 360, the bar is not used during the static elimination process. Even if there is a slight misalignment between the cord 360 and the grounding probe 403, the probability of contact between the probe pin 404 and the bar code 360 can be increased. Here, as described above, the counter substrate 140a has higher pressure resistance than the array substrate 140b. Therefore, as in this embodiment, a guard ring 361 and a bar code 360 that is electrically connected to the guard ring 361 are provided on the side of the array substrate 140b having low pressure resistance, and the array substrate 140b is grounded via the bar code 360, thereby providing a guard. Even after the short circuit between the ring 361 and the data line 341 and the scanning line 214 is cut, the TFD 320 or the like can be prevented from being damaged by static electricity.

  After the static elimination process (contact process between the barcode 360 and the probe pin 404), the lifting mechanism 410 of the inspection apparatus 400 is operated again to raise the stage 401, and the X driver inspection probe 402a and the Y driver inspection probe 402b are moved. These are brought into contact with the X driver mounting area 350a and the Y driver mounting area 251a, respectively. At this time, the probe pin 404 of the grounding probe 403 is pushed into the holder 405 while maintaining contact with the barcode 360. Thereafter, signals are supplied to the data line 314 and the lead-out wiring 372 by the X driver inspection probe 402a and the Y driver inspection probe 402b, and a lighting inspection is performed (the driver inspection probes 402a and 402b and the data line 314). And a contact step with the lead wiring 372).

  As described above, in this embodiment, since unnecessary charges previously charged on the liquid crystal panel 140 are removed before the lighting inspection, the driver inspection probes 402a and 402b, the data line 314, and the lead-out wiring 372 are in contact with each other. Even so, the charged charge does not flow rapidly, and the TFD 320 is not destroyed. Furthermore, at the time of lighting inspection, a voltage or current having a desired inspection specification can be passed through the liquid crystal panel 140. A voltage higher than the withstand voltage of the TFD 320 is not applied to the array substrate 140b, and the TFD 320 is not damaged by static electricity. In the inspection apparatus 400, since the driver inspection probes 402a and 402b and the grounding probe 403 are provided on the same stage 401, the static elimination process and the lighting inspection process are continuously performed in one operation procedure of raising the stage. It can be carried out. In the present embodiment, in the drawing, the liquid crystal panel 140 is disposed above and the inspection apparatus 400 is disposed below. However, the liquid crystal panel 140 is disposed below and the inspection apparatus 400 is disposed above. In this case, the static elimination process and the lighting inspection process can be continuously performed by lowering the stage.

  The X driver 350 and the Y driver 251 are mounted on the X driver mounting area 350a and the Y driver mounting area 251a on the liquid crystal panel 140 that is determined to be non-defective in the lighting inspection. Thereafter, the FPC board 150 and the circuit board are connected to the liquid crystal panel 140, the phase difference plates 133 and 123, the polarizing plates 131 and 121 are disposed, and the backlight is provided on the counter substrate 140a side, whereby the liquid crystal device 100 is completed.

  In this embodiment, a bar code is used as a grounding conductive member when grounding, but the present invention is not limited to this, and any conductive member may be used. In the present embodiment, only the stage of the inspection apparatus is moved during the lighting inspection, but the position of the stage of the inspection apparatus may be fixed and the liquid crystal panel that is the inspection object may be moved.

  In this embodiment, after the static elimination process (contact process between the barcode 360 and the probe pin 404), the movement of the stage 401 is stopped, the stage 401 is operated again, and the lighting inspection process (driver inspection probes 402a and 402b). However, the stage does not have to be stopped if static electricity can be sufficiently removed while the stage is raised, for example.

  In this embodiment, the position of the liquid crystal panel 140 is fixed and the stage 401 can be moved up and down. However, the stage 401 provided with the driver inspection probes 402a and 402b and the grounding probe 403 is fixed and inspected. It is good also as a structure which becomes the structure which can raise / lower the liquid crystal panel 140 which is a target object.

  In addition, the electro-optical device of the present invention is not limited to the above-described example, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, in the above-described embodiment, the liquid crystal device using TFD as the switching element has been described. However, the present invention is not limited to this. For example, a liquid crystal device using TFT (thin film transistor element) as the switching element may be used. The destruction of the TFT due to static electricity can be prevented. Furthermore, not only a transflective type but also a reflective type and a transmissive type may be used.

  In the above-described embodiment, the COG method in which the driver is mounted on the liquid crystal panel is employed. For example, the driver is mounted on a flexible board different from the liquid crystal panel, and the flexible board is electrically connected to the liquid crystal panel. This method can also be applied. In this case, the liquid crystal panel has a structure without the connection terminal 384 of the liquid crystal panel 140 of the above-described embodiment, the end of the lead wiring and the end of the data line are located at the end of the substrate, and these ends are flexible wiring. The structure is electrically connected to the substrate.

  Further, the present invention is not limited to the lighting inspection of the electro-optical device, and any substrate having an input terminal and a grounding conductive member provided on the same surface can be electrically connected to the substrate using the above-described inspection device. It is possible to inspect the properties. In addition, the above-described inspection apparatus can be used for the electrical property inspection of a substrate in which the input terminal and the grounding conductive member are provided on the same surface of the substrate on which the semiconductor element is mounted. It is possible to inspect the electrical characteristics of the substrate while preventing this.

FIG. 3 is an equivalent circuit diagram of the liquid crystal device according to the embodiment. 1 is a schematic perspective view of a liquid crystal device according to an embodiment. FIG. 3 is a schematic cross-sectional view of the liquid crystal device cut along a line AA ′ in FIG. 2. The top view which shows the mode of wiring of the array substrate which concerns on embodiment, and its partial enlarged view. Sectional drawing cut | disconnected by line CC 'of Fig.4 (a). FIG. 3 is a partial plan view of the array substrate according to the embodiment. Sectional drawing cut | disconnected by line DD 'of FIG. The perspective view which shows the mode of the lighting test | inspection of a test | inspection apparatus and a liquid crystal device. The perspective view and top view of the probe for earthing | grounding of an inspection apparatus. The partial expansion perspective view of a test | inspection apparatus. The top view which shows the state in the manufacturing process of the array substrate which concerns on embodiment. FIG. 12 is an equivalent circuit diagram of a liquid crystal panel in which the array substrate shown in FIG. 11 is incorporated.

Explanation of symbols

  100 liquid crystal device, 200, 300 substrate, 314 data line, 320 TFD, 360 barcode, 361 guard ring, 400 inspection device, 401 stage, 401a first surface, 402a X driver inspection probe, 402b Y driver inspection probe, 403 probe for grounding, 404 probe pin, 405 holder, 410 lifting mechanism

Claims (7)

A stage having a first surface;
An inspection terminal provided on the first surface;
An inspection apparatus comprising: a static electricity removing member that can be expanded and contracted to be higher than a height of the inspection terminal with respect to the first surface.   The inspection apparatus according to claim 1, wherein the static electricity removing member is provided on the first surface.   The inspection apparatus according to claim 1, wherein the static electricity removing member is compressible to at least the height of the inspection terminal.   The inspection apparatus according to claim 1, further comprising elevating means for elevating the stage.   The inspection apparatus according to claim 1, wherein a part of the static electricity removing member is covered with a protective member. In the inspection method of the board provided with the input terminal and the conductive member on the same surface,
A stage having a first surface; an inspection terminal provided on the first surface; and a static electricity removing member that can be expanded and contracted to be higher than a height of the inspection terminal with respect to the first surface. Disposing the inspection device and the substrate so that the first surface of the inspection device to be opposed to the surface of the substrate on which the input terminal and the conductive member are provided;
Contacting the static electricity removing member with the conductive member;
And a step of bringing the input terminal and the inspection terminal into contact with each other after the contact step between the static electricity removing member and the conductive member. In a method of manufacturing an electro-optical device having a pair of substrates disposed opposite to each other and a semiconductor element disposed on the substrate,
On the substrate, a plurality of wires, a short-circuit wire that short-circuits the wires, and a conductive member electrically connected to the short-circuit wire are disposed,
Cutting the connection between the short-circuit wiring and the wiring;
A stage having a first surface; an inspection terminal provided on the first surface; and a static electricity removing member that can be expanded and contracted to be higher than a height of the inspection terminal with respect to the first surface. A step of bringing the static electricity removing member of the inspection apparatus into contact with the conductive member;
And a step of bringing the wiring and the inspection terminal into contact with each other after the step of contacting the static eliminating member and the conductive member.

Images