JP2005272835A5 - - Google Patents

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JP2005272835A5
JP2005272835A5 JP2005051463A JP2005051463A JP2005272835A5 JP 2005272835 A5 JP2005272835 A5 JP 2005272835A5 JP 2005051463 A JP2005051463 A JP 2005051463A JP 2005051463 A JP2005051463 A JP 2005051463A JP 2005272835 A5 JP2005272835 A5 JP 2005272835A5
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component
weight
parts
silicon
liquid composition
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JP2005051463A
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Japanese (ja)
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JP2005272835A (en
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Priority to JP2005051463A priority Critical patent/JP2005272835A/en
Priority claimed from JP2005051463A external-priority patent/JP2005272835A/en
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Claims (20)

水の濃度が50重量%以上であり、光線透過率が70%以上であるケイ素含有液状組成物であって、該ケイ素含有液状組成物は、水の接触角が60度以上である基体上に造膜できる組成物であることを特徴とする、ケイ素含有液状組成物。   A silicon-containing liquid composition having a water concentration of 50% by weight or more and a light transmittance of 70% or more, wherein the silicon-containing liquid composition is formed on a substrate having a water contact angle of 60 degrees or more. A silicon-containing liquid composition, which is a composition capable of forming a film. 下記の成分(A)〜(E)を配合して成り、成分(A)の濃度がSiO2換算で6重量
%以下であり、成分(C)の濃度が50重量%以上であることを特徴とする請求項1に記載のケイ素含有液状組成物。
成分(A) オルガノシリケートないしはそのオリゴマー
SiO2換算で100重量部
成分(B) 加水分解縮合触媒 0.1〜10重量部
成分(C) 水 100〜50000重量部
成分(D) 有機溶剤 100〜50000重量部
成分(E) 水性樹脂成分 固形分として10〜1000重量部
The following components (A) to (E) are blended, the concentration of the component (A) is 6% by weight or less in terms of SiO2, and the concentration of the component (C) is 50% by weight or more. The silicon-containing liquid composition according to claim 1 .
Component (A) Organosilicate or oligomer thereof
100 parts by weight in terms of SiO 2 Component (B) Hydrolysis condensation catalyst 0.1 to 10 parts by weight Component (C) Water 100 to 50000 parts by weight Component (D) Organic solvent 100 to 50000 parts by weight Component (E) Aqueous resin component 10 to 1000 parts by weight as solid content
下記の成分(A)〜(E)を配合して成り、成分(A)の濃度がSiO2換算で6重量
%以下であり、成分(C)の濃度が50重量%以上であることを特徴とする請求項1に記載のケイ素含有液状組成物。
成分(A) オルガノシリケートないしはそのオリゴマー
SiO2換算で100重量部
成分(B) 加水分解縮合触媒 0.5〜5重量部
成分(C) 水 500〜25000重量部
成分(D) 有機溶剤 200〜10000重量部
成分(E) 水性樹脂成分 固形分として10〜1000重量部
The following components (A) to (E) are blended, the concentration of the component (A) is 6% by weight or less in terms of SiO2, and the concentration of the component (C) is 50% by weight or more. The silicon-containing liquid composition according to claim 1 .
Component (A) Organosilicate or oligomer thereof
100 parts by weight in terms of SiO 2 Component (B) Hydrolysis condensation catalyst 0.5-5 parts by weight Component (C) Water 500-25000 parts by weight Component (D) Organic solvent 200-10000 parts by weight Component (E) Aqueous resin component 10 to 1000 parts by weight as solid content
成分(F)として表面張力低下剤を0.1〜2.0重量%の濃度で含有していることを特徴とする請求項1ないしのいずれか1項に記載のケイ素含有液状組成物。 The silicon-containing liquid composition according to any one of claims 1 to 3, wherein a surface tension reducing agent is contained as a component (F) at a concentration of 0.1 to 2.0% by weight. 成分(E)が、水性エマルジョンであることを特徴とする請求項1ないしのいずれか1項に記載のケイ素含有液状組成物。 The silicon-containing liquid composition according to any one of claims 1 to 4 , wherein the component (E) is an aqueous emulsion. 成分(E)が、(メタ)アクリル樹脂系、スチレン-アクリル樹脂系、アクリルシリコン樹脂系、フッ素樹脂系、ウレタン樹脂系及びウレタン-アクリル樹脂系より選ばれた水性エマルジョンであることを特徴とする請求項に記載のケイ素含有液状組成物。 Component (E) is an aqueous emulsion selected from a (meth) acrylic resin system, a styrene-acrylic resin system, an acrylic silicon resin system, a fluororesin system, a urethane resin system, and a urethane-acrylic resin system The silicon-containing liquid composition according to claim 5 . 成分(A)がメチルシリケートないしはそのオリゴマーであることを特徴とする請求項1ないしのいずれか1項に記載のケイ素含有液状組成物。 The silicon-containing liquid composition according to any one of claims 1 to 6 , wherein the component (A) is methyl silicate or an oligomer thereof. 成分(A)が下記示性式で表されるものであることを特徴とする請求項1ないしのいずれか1項に記載のケイ素含有液状組成物。
SiOx(OR)y
(但し、0≦x≦1.2、1.6≦y≦4、2x+y=4)
The silicon-containing liquid composition according to any one of claims 1 to 7 , wherein the component (A) is represented by the following formula.
SiOx (OR) y
(However, 0 ≦ x ≦ 1.2, 1.6 ≦ y ≦ 4, 2x + y = 4)
基体が、有機基材または有機皮膜で覆われた基材であることを特徴とする請求項1ないし8のいずれか1項に記載のケイ素含有液状組成物。 The silicon-containing liquid composition according to any one of claims 1 to 8 , wherein the substrate is an organic substrate or a substrate covered with an organic film. 下記の成分(A)〜(E)を配合して成り、成分(A)の濃度がSiO2換算で6重量
%以下であり、成分(C)の濃度が50重量%以上であることを特徴とするケイ素含有液状組成物。
成分(A) オルガノシリケートないしはそのオリゴマー
SiO2換算で100重量部
成分(B) 加水分解縮合触媒 0.1〜10重量部
成分(C) 水 100〜50000重量部
成分(D) 有機溶剤 100〜50000重量部
成分(E) 水性樹脂成分 固形分として10〜1000重量部
It is formed by blending the following components (A) to (E), the concentration of the component (A) is 6% by weight or less in terms of SiO 2 , and the concentration of the component (C) is 50% by weight or more. A silicon-containing liquid composition.
Component (A) Organosilicate or oligomer thereof
100 parts by weight in terms of SiO 2 Component (B) Hydrolysis condensation catalyst 0.1 to 10 parts by weight Component (C) Water 100 to 50000 parts by weight Component (D) Organic solvent 100 to 50000 parts by weight Component (E) Aqueous resin component 10 to 1000 parts by weight as solid content
下記の成分(A)〜(E)を配合して成り、成分(A)の濃度がSiO2換算で6重量
%以下であり、成分(C)の濃度が50重量%以上であることを特徴とするケイ素含有液状組成物。
成分(A) オルガノシリケートないしはそのオリゴマー
SiO2換算で100重量部
成分(B) 加水分解縮合触媒 0.5〜5重量部
成分(C) 水 500〜25000重量部
成分(D) 有機溶剤 200〜10000重量部
成分(E) 水性樹脂成分 固形分として10〜1000重量部
It is formed by blending the following components (A) to (E), the concentration of the component (A) is 6% by weight or less in terms of SiO 2 , and the concentration of the component (C) is 50% by weight or more. A silicon-containing liquid composition.
Component (A) Organosilicate or oligomer thereof
100 parts by weight in terms of SiO 2 Component (B) Hydrolysis condensation catalyst 0.5-5 parts by weight Component (C) Water 500-25000 parts by weight Component (D) Organic solvent 200-10000 parts by weight Component (E) Aqueous resin component 10 to 1000 parts by weight as solid content
成分(F)として表面張力低下剤を0.1〜2.0重量%の濃度で含有していることを特徴とする請求項10又は11に記載のケイ素含有液状組成物。   The silicon-containing liquid composition according to claim 10 or 11, which contains a surface tension reducing agent as a component (F) at a concentration of 0.1 to 2.0% by weight. 成分(A)が下記示性式で表されるものであることを特徴とする請求項10ないし12のいずれか1項に記載のケイ素含有液状組成物。
SiOx(OR)y
(但し、0≦x≦1.2、1.6≦y≦4、2x+y=4)
The silicon-containing liquid composition according to any one of claims 10 to 12, wherein the component (A) is represented by the following sexual formula.
SiOx (OR) y
(However, 0 ≦ x ≦ 1.2, 1.6 ≦ y ≦ 4, 2x + y = 4)
成分(A)〜成分(D)を、成分(A)の濃度がSiO2換算で2〜6重量%となるように配合して成分(A)を加水分解縮合させたのち、成分(C)及び/又は成分(D)を加えて2重量倍以上に稀釈し、これに成分(E)又は成分(E)及び成分(F)を添加することを特徴とする請求項1ないし13のいずれか1項に記載のケイ素含有液状組成物の製造方法。 After component (A) to component (D) are blended so that the concentration of component (A) is 2 to 6% by weight in terms of SiO2, component (A) is hydrolyzed and condensed, and then component (C) And / or component (D) is added to dilute to 2 times or more and component (E) or component (E) and component (F) are added thereto. 2. A method for producing a silicon-containing liquid composition according to item 1. 請求項1ないし13のいずれか1項に記載のケイ素含有液状組成物を、基体の表面に塗布して乾燥させ塗膜を形成させることを特徴とする塗装方法。   14. A coating method comprising applying the silicon-containing liquid composition according to any one of claims 1 to 13 to a surface of a substrate and drying to form a coating film. 請求項1ないし13のいずれか1項に記載のケイ素含有液状組成物を基体に塗布して形成した塗膜。   A coating film formed by applying the silicon-containing liquid composition according to any one of claims 1 to 13 to a substrate. 無色透明であることを特徴とする請求項16に記載の塗膜。   The coating film according to claim 16, which is colorless and transparent. 水の接触角が60゜以下であることを特徴とする請求項16又は17に記載の塗膜。   The coating film according to claim 16 or 17, wherein the contact angle of water is 60 ° or less. 下記の暴露試験法により暴露試験した塗膜の白色度変化(ΔL)が、5以下であることを特徴とする請求項16ないし18のいずれか1項に記載の塗膜。
(暴露試験法)JIS Z2381直接暴露試験法に従い、3ヶ月間、屋外暴露試験を実施する。但し、暴露角度は、水平面から60度とする。
The coating film according to any one of claims 16 to 18, wherein a change in whiteness (ΔL) of the coating film subjected to the exposure test by the following exposure test method is 5 or less.
(Exposure test method) An outdoor exposure test is conducted for 3 months according to the JIS Z2381 direct exposure test method. However, the exposure angle is 60 degrees from the horizontal plane.
請求項16ないし19のいずれか1項に記載の塗膜を有する基材。  The base material which has a coating film of any one of Claims 16 thru | or 19.
JP2005051463A 2004-02-27 2005-02-25 Silicon-containing liquid composition Withdrawn JP2005272835A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005051463A JP2005272835A (en) 2004-02-27 2005-02-25 Silicon-containing liquid composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004054383 2004-02-27
JP2005051463A JP2005272835A (en) 2004-02-27 2005-02-25 Silicon-containing liquid composition

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Publication Number Publication Date
JP2005272835A JP2005272835A (en) 2005-10-06
JP2005272835A5 true JP2005272835A5 (en) 2007-10-25

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007169353A (en) * 2005-12-20 2007-07-05 Nippon Light Metal Co Ltd Corrosion-resistant water-based coating composition and corrosion-resistant coated aluminum material
JP5201930B2 (en) * 2007-02-16 2013-06-05 富士フイルム株式会社 Hydrophilic member and method for producing the same
JP5170396B2 (en) * 2007-11-28 2013-03-27 信越化学工業株式会社 Gas barrier film coating agent and gas barrier film
JPWO2011142463A1 (en) * 2010-05-14 2013-07-22 旭硝子株式会社 UV absorbing film forming coating solution and UV absorbing glass article
JP5785121B2 (en) * 2011-04-28 2015-09-24 信越化学工業株式会社 Pattern formation method
JP5955805B2 (en) * 2013-04-19 2016-07-20 KeePer技研株式会社 Surface modification method, surface modifier and surface modification structure of glass-based coating
JP6846129B2 (en) * 2016-07-14 2021-03-24 日本ペイント株式会社 Method of forming a heat-shielding multi-layer coating film

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