JP2005267804A - Lamination type optical recording medium, manufacturing method of optical recording medium and manufacturing apparatus of optical recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamination type optical recording medium having enhanced dynamic balance, excellent mechanical characteristics and high quality, and to provide a manufacturing method of the optical recording medium and a manufacturing apparatus of the optical recording medium. <P>SOLUTION: The manufacturing method of the lamination type optical recording medium having at least a recording layer between two substrates includes at least a superposing step for superposing the two substrates via an adhesive so that the recording layer is positioned on the inner side thereof, a spin-off step for rotating the superposed substrates and spinning-off the residual adhesive from the inner part to the outer part of the substrates by centrifugal force to form an adhesive layer and a leveling step for making a leveling means abut upon or approximating to the protruded adhesive of an outer peripheral end part of the substrates and removing and smoothing the protruded adhesive. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a bonded optical recording medium having improved dynamic balance, excellent mechanical properties, and high quality, an optical recording medium manufacturing method, and an optical recording medium manufacturing apparatus.

  Conventionally, as a method for producing a bonded optical recording medium (for example, a DVD medium), for example, an application step of applying an ultraviolet curable adhesive to one or both of two bonded substrates, A process of superimposing the adhesives facing each other so that the adhesive is on the inside, and rotating the superposed substrates to discharge the excess adhesive and stretching the adhesive by the centrifugal force to form an adhesive layer, There is known a method including a shaking-off process for causing excess adhesive to go out and a curing process for curing the adhesive layer by irradiating the superimposed substrate on which the adhesive layer is formed with ultraviolet rays.

However, the bonded optical recording medium manufactured by the optical recording medium manufacturing method is a substrate (bonded optical recording medium) 5 in which an upper substrate 3 and a lower substrate 2 are overlapped as shown in FIG. A part of the excess adhesive protrudes and remains attached to the outer peripheral edge of the sheet. The protruding adhesive 4 that protrudes is generated at random positions depending on the wettability of the adhesive surface.
The DVD media cured by irradiating ultraviolet light onto the overlapping substrate with the adhesive adhered to the random position adhered thereto has a poor appearance, poor adhesion between the upper substrate and the lower substrate (decrease in mechanical properties), and Problems such as degradation of dynamic balance occur.

  In recent years, recording and reproduction speeds of 4 × speed or higher have been demanded, and the rotation speed of media has increased from the current 3000 rpm range to a high speed rotation of 6000 rpm or more, and accordingly, the “dynamic balance” is desired to be improved. “Deterioration of dynamic balance” due to the adhesive at the outer peripheral edge is particularly regarded as a problem.

  Therefore, as a method of removing and smoothing the random adhesive adhesive at the outer peripheral edge of the superposed substrate, for example, (1) a method of cutting with a blade after the adhesive is cured (see Patent Document 1) (2) A method of re-applying the adhesive only to the outer peripheral edge after the adhesive is cured (see Patent Document 2 and Patent Document 3), (3) Preliminarily forming the substrate large, and press-cutting after curing (4) A method of sucking the adhesive by bringing the vacuum nozzle close after shaking (5) A method of sucking the adhesive at a high speed (for example, 4000 to 10000 rpm) at the time of shaking. A method of swinging out has been proposed.

  However, in the method (1), the removed adhesive becomes swarf and adheres to the media, so that a cleaning step is indispensable. In the method (2), a step of removing burrs generated at the time of cutting is required, and since the adhesive is further applied on the adhesive adhesive, the outer diameter of the product becomes large. No improvement can be expected. In the method (3), since burrs and scraps are generated at the time of press cutting, there is a problem that the efficiency of the member is poor, and post-processing is required, resulting in an increase in cost. In the method (4), since there are places where the adhesive is present on the outer peripheral edge of the substrate, if the vacuum pressure is adjusted in a place where the adhesive is present, The adhesive is also sucked out from the adhesive layer. On the other hand, when the vacuum pressure is adjusted in a place where there is no adhesive, there is a problem that the adhesive cannot be sucked. In the method (5), the film thickness distribution of the adhesive layer changes, the inner peripheral part is thinner than the predetermined film thickness, the outer peripheral part is thick, and the film thickness uniformity is impaired. is there.

  Therefore, random adhesive adhesive on the outer peripheral edge of the superimposed substrate is removed and smoothed, and there is no deterioration of dynamic balance, excellent mechanical properties, and high-quality bonded optical recording medium is efficiently manufactured. However, it is difficult to provide them promptly.

JP 2001-14734 A Utility Model Registration No. 2555944 Japanese Patent Laid-Open No. 9-7230 JP 2001-23253 A

  This invention is made | formed in view of this present condition, and makes it a subject to solve the said various problems in the past and to achieve the following objectives. That is, the present invention removes the random adhesion adhesive on the outer peripheral edge of the superposed substrate and smoothes it, thereby improving dynamic balance, excellent mechanical properties and appearance, and a high-quality bonding die. An object of the present invention is to provide an optical recording medium manufacturing method and an optical recording medium manufacturing apparatus capable of efficiently manufacturing an optical recording medium.

Means for solving the problems are as follows. That is,
<1> A method for producing a bonded optical recording medium having at least a recording layer between two substrates, wherein the two substrates are overlapped with an adhesive so that the recording layer is on the inside. Overlaying step, turning off the overlaid substrate, and shaking off excess adhesive from the inside of the substrate to the outside by the centrifugal force to form an adhesive layer, and bonding that protrudes from the outer peripheral edge of the substrate An optical recording medium manufacturing method comprising at least a leveling step of removing and smoothing the protruding adhesive by bringing a leveling means into contact with or close to the leveling agent. In the method for producing an optical recording medium described in <1>, the leveling means can be uniformly leveled (smoothed) by bringing the leveling means into contact with or close to the adhesive that protrudes randomly at the outer peripheral edge of the substrate. In addition, a high-quality bonded optical recording medium with good dynamic balance can be produced efficiently.

<2> The method for producing an optical recording medium according to <1>, further including an adhesive detection step in which an adhesive detection unit detects the degree of protrusion of the adhesive at the outer peripheral edge of the substrate.
<3> The method for producing an optical recording medium according to <2>, wherein the adhesive detection means is either a CCD camera or a CMOS sensor.
<4> The method for producing an optical recording medium according to any one of <2> to <3>, wherein the leveling means adjusts a distance in contact with or close to the adhesive according to a degree of protrusion of the adhesive. is there.
<5> At least one of the cases where the amount of the adhesive protruding from the outer peripheral edge of the substrate is small, and when the adhesive is unevenly distributed, while applying the adhesive to the outer peripheral edge of the substrate by the adhesive applying means, The method for producing an optical recording medium according to any one of <2> to <4>, wherein the adhesive protruding by the leveling means is removed and smoothed.
<6> The method for producing an optical recording medium according to <5>, wherein the adhesive application unit is a quantitative discharge pump.
In the method for manufacturing an optical recording medium according to any one of <2> to <6>, the degree of protrusion of the adhesive is detected by a CCD camera, and the result is fed back to the leveling means, and the leveling means By adjusting the proximity or contact amount, a uniform [end surface leveling surface] (a protruding layer having a uniform thickness on the entire outer periphery end portion) can be obtained.

<7> The method for producing an optical recording medium according to any one of <1> to <6>, wherein the leveling means is any one of a steel band and a wire.
<8> The optical recording medium according to <7>, wherein either the steel band or the wire is sequentially sent out while rotating the superposed substrate and is brought into contact with or close to the protruding adhesive at the outer peripheral edge of the substrate. It is a manufacturing method.
In the method for producing an optical recording medium according to any one of <7> to <8>, the missing adhesive is accumulated on the steel band or the like by rotating the steel band or the like used in the leveling means. In addition, reattachment to the substrate being processed can be prevented.

<9> The method for producing an optical recording medium according to any one of <7> to <8>, including an adhesive removal step of removing an adhesive adhered to either the steel band or the wire.
<10> The method for producing an optical recording medium according to any one of <1> to <9>, wherein the adhesive is an ultraviolet curable adhesive.
<11> Any one of the above <7> to <10>, in which a solid adhesive cured by irradiating ultraviolet rays to an ultraviolet curable adhesive attached to either a steel band or a wire is removed by frictional contact. It is a manufacturing method of the optical recording medium as described.
In the method for producing an optical recording medium according to any one of <9> to <11>, the adhesive attached to the steel band used in the leveling means is irradiated with ultraviolet rays to be solidified. The adhesive can be efficiently peeled off from the steel band.

  <12> A bonded optical recording medium manufactured by the method for manufacturing an optical recording medium according to any one of <1> to <11>. The bonded optical recording medium according to <12> is manufactured by the method for manufacturing an optical recording medium of the present invention, so that dynamic balance is improved, mechanical properties and appearance are excellent, and high quality bonding is performed. Type optical recording medium is obtained.

<13> An apparatus for producing a bonded optical recording medium having at least a recording layer between two substrates, wherein the two substrates are stacked with an adhesive so that the recording layer is on the inside. Superimposing means for matching, rotating means for rotating the superposed substrate and shaking off excess adhesive from the inside of the substrate by the centrifugal force to form an adhesive layer, and curing after forming the adhesive layer An apparatus for producing an optical recording medium, characterized by comprising a smoothing means that removes and smoothes the adhesive that has previously protruded from the outer peripheral edge of the substrate in contact with or close to the adhesive.
<14> The apparatus for producing an optical recording medium according to <13>, wherein the leveling means is a steel band or a wire.
<15> The optical recording medium manufacturing apparatus according to <14>, further including a speed adjusting unit that adjusts a speed of feeding either the steel band or the wire. In the optical recording medium manufacturing apparatus according to <15>, a splash (adhesive fineness of adhesive) is removed by controlling the rotation speed of the steel band to synchronize with the rotation of the substrate. (Splash) can be suppressed.

  According to the present invention, various problems in the prior art can be solved, and the dynamic balance is improved by bringing the leveling means of the adhesive that protrudes randomly from the outer peripheral edge of the superimposed substrate into uniform contact or proximity. Further, it is possible to efficiently produce a high-quality bonded optical recording medium having excellent mechanical properties and appearance.

(Optical recording medium manufacturing method and optical recording medium manufacturing apparatus)
The method for producing an optical recording medium of the present invention is a method for producing a bonded optical recording medium having at least a recording layer between two substrates, and includes an overlaying step, a shaking step, and a smoothing step. And other processes appropriately selected as necessary, for example, an adhesive detection means, an adhesive layer curing process, an adhesive adhesive removing process, a recycling process, a control process, and the like.
The optical recording medium manufacturing apparatus of the present invention is an apparatus for manufacturing a bonded optical recording medium having at least a recording layer between two substrates, and includes an overlaying means, a swinging means, and a smoothing means. And other means appropriately selected as necessary, for example, an adhesive amount detecting means, an adhesive layer curing means, a recycling means, a speed adjusting means, a control means, and the like.

The method for producing an optical recording medium of the present invention can be preferably carried out by the apparatus for producing an optical recording medium of the present invention, the superimposing step can be performed by the superimposing means, The leveling step can be performed by the leveling unit, the leveling step can be performed by the leveling unit, and the other steps can be performed by the other units.
In the method for producing an optical recording medium of the present invention, a bonded optical recording medium can be produced efficiently according to the flowchart shown in FIG. That is, the lower substrate is taken out, cleaned, and an adhesive is applied. On the other hand, the upper substrate is taken out, cleaned, and inverted if necessary. Then, the lower substrate and the upper substrate to which the adhesive is applied are superposed, shaken off, and the protruding adhesive is removed by bringing the leveling means into contact or close to each other and smoothing. Thereafter, the laminated optical recording medium can be manufactured by curing by UV irradiation and performing an appearance inspection or the like. Hereinafter, each step will be described in detail.

-Superposition process and superposition means-
The superimposing step is a step of superposing two substrates through an adhesive so that the recording layer is on the inside.
The two substrates are not particularly limited in shape, structure, size, etc., and can be appropriately selected from known ones according to the purpose.
The first substrate to be bonded (sometimes referred to as “upper substrate”) and the second substrate (sometimes referred to as “lower substrate” for arrangement) are stacked and accommodated in a stack pole. . On the lower substrate, at least a recording layer is laminated, and a reflective layer, a protective layer, a barrier layer, and the like are further laminated as necessary.
The method for applying the adhesive is not particularly limited and can be appropriately selected according to the purpose. For example, by turning on / off the discharge valve while rotating the substrate, the adhesive is formed into an annular shape (doughnut shape). A coating method and the like are preferable.
There is no restriction | limiting in particular as said adhesive agent, Although it can select suitably according to the objective, An ultraviolet-ray (UV) curable adhesive is preferable, for example, a radical polymerization type ultraviolet curable adhesive (acrylic type), a low viscosity Type cationic polymerization type UV curable adhesive.

  There is no restriction | limiting in particular as a method of superimposing an upper board | substrate on the lower board | substrate with which the said adhesive agent was apply | coated, According to the objective, it can select suitably from well-known methods. At this time, Japanese Patent Application No. 2001-264726 and European Patent Application No. 1288933 (in order to prevent air bubbles from being involved in the adhesive layer) It is preferable to control by the method described in the bonding method).

-Shaking process and swinging means-
The swing-off step is a step of forming an adhesive layer by rotating the stacked substrates and swinging off the excess adhesive from the inside of the substrate to the outside by the rotational centrifugal force.
There is no restriction | limiting in particular as said swing-off means, According to the objective, it can select suitably, For example, a spinner etc. are mentioned.
In this case, the rotation speed of the superposed substrate is not particularly limited and can be appropriately selected according to the purpose, but usually 500 to 4000 rpm is preferable.

  As shown in FIG. 1, the protruding adhesive is randomly attached to the outer peripheral edge of the superposed substrate after the shaking process. The protruding width of the adhesive is about 100 to 300 μm in the radial direction.

-Adhesive detection step and adhesive detection means-
The adhesive detection step is a step of detecting, by an adhesive detection means, how the adhesive protrudes from the outer peripheral edge of the substrate.
Examples of the adhesive detection means include a CCD camera and a CMOS sensor.
The CCD camera detects the degree of adhesive sticking out, feeds back the result to the leveling means, and adjusts the proximity or contact amount of the leveling means to make the entire circumference of the substrate outer peripheral edge uniform. be able to.
In the adhesive detection step, when the adhesive protrudes little at the outer peripheral edge of the substrate and when the adhesive is unevenly distributed (for example, the right semicircle protrudes but the left semicircle does not protrude) In at least one of the cases where it is not seen), the adhesive that protrudes by the smoothing means is removed and smoothed while the adhesive is applied to the outer peripheral edge of the substrate by the adhesive applying means. it can.
As the adhesive application means, for example, a fixed discharge pump, a dispenser, a discharge syringe, and the like are suitable.

-Leveling process and leveling means-
The leveling step is a step of removing and smoothing the protruding adhesive by bringing the leveling means into contact with or close to the protruding adhesive at the outer peripheral edge of the substrate.
The leveling means is not particularly limited as long as it can remove and smooth out the protruding adhesive at the outer peripheral edge of the substrate, and can be appropriately selected according to the purpose. For example, a steel band and a wire Either is preferred. The steel band or the wire as the leveling means can be brought into contact with or close to the protruding adhesive at the outer peripheral edge of the substrate by sequentially feeding out either the steel band or the wire while rotating the superimposed substrates. preferable.
In this case, it is preferable to have a speed adjusting means for adjusting the speed at which one of the steel band and the wire is sequentially fed out in terms of suppressing the occurrence of splash (adhesive micro splashes) when the protruding adhesive is removed. .
Examples of means for bringing the leveling means into contact with or close to the adhesive include a drive motor, an X-axis drive motor, and a hydraulic / pneumatic cylinder as an actuator that can be linearly driven.

-Adhesive adhesive removal step and adhesive adhesive removal means-
The attached adhesive removing step is a step of removing the adhesive attached to either the steel band or the wire.
The adhesive is an ultraviolet curable adhesive, and it is preferable to remove and remove the solid adhesive cured by irradiating the ultraviolet curable adhesive attached to either the steel band or the wire with ultraviolet rays by frictional contact. .
Examples of the means for removing by frictional contact include a cleaning pulley, a blade, a cutting blade, and a knife edge.
Examples of the means for irradiating with ultraviolet rays include a UV lamp. Examples of the UV lamp include a flash lamp type UV lamp (manufactured by Xenon) and a continuous light type UV lamp.

The adhesive layer curing step is a step in which energy is applied to the stacked substrates, the adhesive layer is cured and bonded, and the upper and lower substrates are integrated.
Examples of the adhesive curing means include a UV lamp and an ultraviolet irradiation device.

The control means is a process for controlling the respective steps, and can be suitably performed by the control means.
The control means is not particularly limited as long as the movement of each means can be controlled, and can be appropriately selected according to the purpose. Examples thereof include devices such as a sequencer and a computer.
The recycling step is a step of collecting and reusing the adhesive removed in the adhesive adhesive removing step, and can be suitably performed by a recycling means.
There is no restriction | limiting in particular as said recycling means, A well-known conveyance means etc. are mentioned.

Finally, rotate the turntable, move the substrate to the delivery position, drive the substrate transfer handler, put it into the tilt inspection machine, perform tilt and appearance inspection, then eject it to the ejection unit and paste it together Type optical recording medium is manufactured.
The above is a series of steps of the bonding process in the embodiment, and a high-quality bonded optical recording medium can be produced efficiently by repeating the series of processes.

  Although the optical recording medium manufacturing method and the optical recording medium manufacturing apparatus of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. It doesn't matter.

  Embodiments of the optical recording medium manufacturing method of the present invention using the optical recording medium manufacturing apparatus of the present invention will be described below with reference to the drawings.

  FIG. 3 is a plan view showing an example of an optical recording medium manufacturing apparatus (bonding apparatus) according to the present invention. This optical recording medium manufacturing apparatus (bonding apparatus) 1 includes a disk substrate (hereinafter referred to as a lower substrate) 2 having at least a recording layer and a translucent disk substrate (hereinafter referred to as an upper substrate) as shown in FIG. It is an apparatus for manufacturing a bonded optical recording medium 5 formed by bonding 3) (referred to as a substrate) with an adhesive layer.

  As shown in FIG. 3, the bonding apparatus 1 includes a lower substrate loading stage 6 for loading the lower substrate 2, an upper substrate loading stage 7 for loading the upper substrate 3, cleaning units 8 and 9, The adhesive application unit 10, the reversing unit 11, the overlapping unit 12, the swing spinner 13, the end removing unit 50, the joining unit 14, and the transport arms 15, 16, and 17 are included.

The upper substrate and the lower substrate to be bonded together are stacked and accommodated on stack poles, and the stack poles are loaded into the substrate loading machine 40.
The lower substrate loading stage 6 and the upper substrate loading stage 7 have a plurality of, for example, two sets of substrate holding portions 19.
The cleaning units 8 and 9 have a spinner 20 and a cleaner 21 having a charge removing unit.
The adhesive application unit 10 includes a disk table 22 and an adhesive application device 23.
The reversing unit 11 has a peripheral chuck 24 and a reversing device 25 that rotates 180 degrees.
The overlapping unit 12 includes a turntable 26, a plurality of, for example, three sets of substrate holding units 27 provided on the turntable 26, a transport arm 28 provided on the adhesive application unit 10 side, and the reversing unit 11. It has a transfer arm 29 provided on the side.
The joining unit 14 includes a turntable 30, for example, four sets of disk holding units 31 provided on the turntable 30, and an ultraviolet irradiation device 32.
The transfer arm 15 transfers, positions, and sets the lower substrate 2 set on the lower substrate loading stage 6 to the adhesive application unit 10 via the cleaning unit 8.
The transfer arm 16 sends the upper substrate 3 set on the upper substrate loading stage 7 to the reversing unit 11 via the cleaning unit 9.
The transfer arm 17 is transferred, positioned and set on the swing spinner 13 with the lower substrate 2 and the upper substrate 3 superimposed by the overlapping section 12, and is positioned from the swing spinner 13 to the insertion position of the joining unit 14. It is transferred to the disk holder 31 and positioned and set.

  When the lower substrate 2 and the upper substrate 3 are bonded together using the bonding apparatus 1, first, the lower substrate 2 is positioned and positioned on the lower substrate loading stage 6 with the surface on which the adhesive layer 5 is formed facing upward. The upper substrate 3 is positioned and arranged on the upper substrate loading stage 7 with the bonding surface facing downward. The lower substrate 2 set on the lower substrate loading stage 6 is sent to the cleaning unit 8 by the transfer arm 15, and the cleaning unit 8 performs electrostatic removal blow on both surfaces of the substrate to clean the contamination during storage. The cleaned lower substrate 2 is transferred to the adhesive application unit 10 by the transfer arm 15. The adhesive application unit 10 applies the adhesive in an annular shape to the surface (substrate bonding surface) on which the adhesive layer 5 of the transferred lower substrate 2 is formed. In this embodiment, an annular (donut-like) coating is performed by turning ON / OFF the discharge valve while rotating the substrate. The lower substrate 2 coated with the ultraviolet curable resin is transferred to the substrate holding portion 27 at the substrate loading position of the overlapping unit 12 by the transfer arm 28 of the overlapping unit 12.

The lower substrate 2 coated with the adhesive is transferred to the turntable 26 by the transfer arm 15. Next, the turntable 26 is rotated to move the lower substrate 2 on which the adhesive has been applied to the overlapping position.
On the other hand, the upper substrate 3 is transferred to the reversing unit 11 after the cleaner process is completed. Here, if the substrate is upside down when the stack pole is stored (that is, the bonding surface faces upward), the substrate is reversed and the bonding surface is directed downward. The process is performed, but if the stack pole is stored, if it can be pasted, the posture process is not performed and the process passes.

  Next, the cleaned upper substrate 3 is chucked by the transfer arm 16 and is superposed on the lower substrate 2 that has already been transferred to the superposition position. At this time, Japanese Patent Application No. 2001-264726 and European Patent Application No. 1288933 (in order to prevent air bubbles from being involved in the adhesive layer) It is preferable to control by the method described in the bonding method).

Next, the turntable 26 is rotated to move the stacked upper and lower substrates to the delivery position, and is put into the swing-off spinner 13 by the transfer arm 17. In the swing spinner 13, the upper and lower substrates 5 that are overlapped are rotated at a high speed. In this embodiment, the superposed substrate 5 is rotated at a rotational speed of 500 to 4000 rpm. In addition, the rotation speed of a board | substrate can be suitably set according to a board | substrate state.
An adhesive layer having a predetermined uniform film thickness is obtained by spreading the adhesive inside the stacked upper and lower substrates 5 to the outer peripheral side of the substrate using centrifugal force, and further shaking off the excess adhesive to the outside. Can be formed.

  As shown in FIG. 1, the adhesive 4 protrudes randomly from the outer peripheral edge of the superimposed substrate 5 immediately after shaking. The protruding width of the adhesive is about 100 to 300 μm in the radial direction. In this example, a UV curable adhesive (DVD003, manufactured by Nippon Kayaku Co., Ltd.) having a viscosity (room temperature) of about 450 mP · s / is used.

Next, the superposed substrate after the shaking is transferred to the edge removing unit 50 by the transfer arm 17.
4 and 5 are enlarged views of the end removal unit 50. FIG. This end removing unit 50 includes a rotary suction stage 63 that sucks and holds and rotates the superposed substrate 5 after shaking, a rotary blade unit 64 that rotates the steel band 52 to remove the protruding adhesive 4, and a steel band. 52 as a cleaning unit 65 for removing the adhesive on the substrate 52, an adhesive application unit 66 for supplying adhesive to the outer peripheral edge of the substrate, and an adhesive detecting means for detecting the degree of adhesive protruding at the outer peripheral edge of the substrate. CCD camera 51 is provided.

Next, the removal of the protruding adhesive at the outer peripheral edge of the substrate by the edge removing unit will be described.
First, the superposed substrate after shaking transferred to the suction rotation stage 63 is vacuum-sucked and held and fixed to the suction rotation stage 63 by driving a vacuum source (not shown). Next, the protruding state of the adhesive at the outer peripheral edge of the substrate is determined by image processing by the CCD camera 51 as the adhesive detection means. In the image processing, the area of the single molded substrate is subtracted from the projected substrate area, and the degree of protrusion is determined based on the difference amount.
From the determination result, when the degree of sticking out of the adhesive is small or unevenly distributed, the adhesive coating unit 66 is brought close to or in contact with the outer peripheral edge of the substrate while rotating the suction rotary stage 63 at about 30 to 120 rpm. Then, the fixed discharge valve 57 is driven to discharge and adhere the adhesive. At this time, the viscosity of the adhesive is desirably the same as that used in the previous annular application. In this case, it is preferable to adjust the temperature of the same adhesive and lower the viscosity to about 200 mP · s because the outer peripheral end face of the substrate after the next adhesive removal is finished beautifully.

On the other hand, as a result of image processing, when the amount of protrusion at the outer peripheral edge of the substrate is large, the removal work using the steel band is performed as it is without applying the adhesive.
The removal of the sticking adhesive by the steel band keeps the state in which the suction rotation stage 63 is rotated, and then starts to rotate the steel band 52 by rotating the drive motor 59. The linear velocity of the steel band 52 can be varied in synchronization with the rotation speed of the suction rotary table. In this embodiment, the wire speed of the steel band is variable between about 150 to 780 mm / sec.
Next, the X-axis drive motor 55 is driven to bring the steel band 52 close to or in contact with the outer peripheral edge of the substrate. Then, as shown in FIG. 6, the protruding adhesive 4 at the outer peripheral edge of the substrate is cut off by the steel band 52 and sent together with the steel band 52 to the lower part of the cleaning unit 65. As a result, the random protruding adhesive is removed and smoothed at the outer peripheral edge of the substrate, and a thin adhesive layer corresponding to the proximity amount of the steel band is formed. In this example, the adhesive layer had a uniform thickness of about 50 μm.

  Next, the protruding adhesive removed by the steel band 52 is sent to the lower part of the cleaning unit 65 as the steel band rotates. A UV lamp 62 is installed at the lower part of the unit. After the UV lamp 62 is cured by irradiating the adhesive on the steel band 52 with ultraviolet rays, the liquid is changed into a solid, and then the cleaning pulley 61 is used. The adhered adhesive is removed.

  The substrate from which the adhesive at the outer peripheral edge of the substrate has been removed is transferred to the turntable 30 by the transfer arm 17, and the turntable 30 is rotated to move the substrate to the UV irradiation position and irradiate ultraviolet rays. Then, the adhesive layer is cured to integrate the upper and lower substrates.

Next, the turntable is rotated, the substrate is moved to the delivery position, the substrate transfer handler is driven, and the substrate is loaded into the tilt inspection machine 60. After tilt and appearance inspection, the substrate is discharged to the discharge unit 70. It is sent to the next process.
By repeating the above series of steps, a bonded optical recording medium with good dynamic balance can be manufactured very efficiently.

  INDUSTRIAL APPLICABILITY The method and apparatus for producing an optical recording medium of the present invention can efficiently produce a bonded optical recording medium having excellent appearance, high mechanical properties, and good dynamic balance. Furthermore, it can be widely used for bonding not only thin films, plastic plates and glass plates but also curved lenses.

1A and 1B are an explanatory view and an enlarged view showing the protruding state of the adhesive at the outer peripheral edge of the stacked substrates. FIG. 2 is a flowchart showing an example of the bonding process. FIG. 3 is a plan view showing an example of an optical recording medium manufacturing apparatus of the present invention. FIG. 4 is an enlarged top view of the edge removal unit of FIG. FIG. 5 is an enlarged side sectional view of the end processing unit of FIG. FIG. 6 is a schematic explanatory view showing a method of removing the protruding adhesive according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Bonding apparatus 2 Lower substrate 3 Upper substrate 6 Lower substrate loading stage 7 Upper substrate loading stage 8, 9 Cleaning unit 10 Adhesive application unit 11 Reversing unit 12 Overlapping unit 13 Shaking spinner 14 Joining unit 15, 16, 18 Transport Arm 19 Substrate holder 20 Spinner 21 Cleaner 22 Disc table 23 Adhesive application device 24 Peripheral chuck 25 Reversing device 26 Turntable 32 Ultraviolet irradiation device 40 Substrate feeder 50 End removal unit 51 CCD camera 52 Steel band 56 Discharge nozzle 57 Fixed amount Discharge valve 58 Drive belt 60 Tilt inspection machine 61 Cleaning pulley 62 UV lamp 63 Rotary adsorption stage 70 Discharge unit

Claims (15)

  A method for manufacturing a bonded optical recording medium having at least a recording layer between two substrates, wherein the two substrates are overlapped with an adhesive so that the recording layer is on the inside. And rotating the overlapped substrate and shaking off the excess adhesive from the inside of the substrate to the outside by the centrifugal force to form an adhesive layer, and the adhesive protruding from the outer peripheral edge of the substrate. A method for producing an optical recording medium, comprising at least a smoothing step of removing and smoothing the protruding adhesive by bringing the contact means into contact or proximity.   The method of manufacturing an optical recording medium according to claim 1, further comprising an adhesive detection step of detecting an adhesive protruding state at the outer peripheral edge of the substrate by an adhesive detection means.   The method for manufacturing an optical recording medium according to claim 2, wherein the adhesive detection means is either a CCD camera or a CMOS sensor.   4. The method of manufacturing an optical recording medium according to claim 2, wherein the leveling means adjusts the distance in contact with or close to the adhesive according to the degree of protrusion of the adhesive.   At least one of the case where the amount of the adhesive protruding from the outer peripheral edge of the substrate is small and the case where the adhesive is unevenly distributed, the leveling means while applying the adhesive to the outer peripheral edge of the substrate by the adhesive applying means The method for producing an optical recording medium according to claim 2, wherein the adhesive that protrudes from the surface is removed and smoothed.   6. The method of manufacturing an optical recording medium according to claim 5, wherein the adhesive application means is a fixed discharge pump.   7. The method of manufacturing an optical recording medium according to claim 1, wherein the leveling means is one of a steel band and a wire.   8. The method of manufacturing an optical recording medium according to claim 7, wherein one of the steel band and the wire is sequentially sent out while rotating the superposed substrate so as to come into contact with or close to the protruding adhesive at the outer peripheral edge of the substrate.   The method for producing an optical recording medium according to claim 7, further comprising an adhesive removal step for removing the adhesive adhered to either the steel band or the wire.   The method for producing an optical recording medium according to claim 1, wherein the adhesive is an ultraviolet curable adhesive.   The optical recording medium according to any one of claims 7 to 10, wherein a solid adhesive cured by irradiating ultraviolet rays onto an ultraviolet curable adhesive attached to either a steel band or a wire is peeled off by frictional contact. Production method.   A bonded optical recording medium manufactured by the method for manufacturing an optical recording medium according to claim 1.   An apparatus for manufacturing a bonded optical recording medium having at least a recording layer between two substrates, wherein the two substrates are overlapped with an adhesive so that the recording layer is inside. Means, a rotating means for rotating the superposed substrate and shaking the excess adhesive from the inside of the substrate to the outside by the centrifugal force to form an adhesive layer, and the substrate after forming the adhesive layer and before curing An apparatus for producing an optical recording medium, comprising: a smoothing unit that removes and smoothes the adhesive at the outer peripheral end in contact with or close to the protruding adhesive.   The optical recording medium manufacturing apparatus according to claim 13, wherein the leveling means is one of a steel band and a wire. The apparatus for producing an optical recording medium according to claim 14, further comprising a speed adjusting unit that adjusts a speed of feeding either the steel band or the wire.

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