JP2005266549A - Optical fiber array - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical fiber array which is free of the generating of position shift and deformation or the like of an optical fiber and has superior reliability. <P>SOLUTION: In the optical fiber array, a resin layer having a plurality of grooves is formed in a portion of the surface of a substrate and optical fibers are stored in the grooves. A lid part is formed on the resin layer to store a portion of the optical fibers. A recessed section is formed on the surface which is opposed to the resin layer of the lid part to store the optical fibers in block. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to an optical fiber array.

In recent years, attention has been focused on optical fibers mainly in the communication field. In particular, in the IT (information technology) field, communication technology using optical fibers is required to develop a high-speed Internet network.
The optical fiber has features such as (1) low loss, (2) high bandwidth, (9) small diameter and light weight, (4) non-induction, and (5) resource saving. Compared with communication systems using conventional metallic cables, the number of repeaters can be greatly reduced, making construction and maintenance easier, and making communication systems more economical and more reliable. Can be planned.

In addition, with optical fiber, not only one wavelength of light but also many different wavelengths of light can be simultaneously multiplexed using a single optical fiber, so a large-capacity transmission line that can be used for a variety of applications. It has a great advantage that it can be realized and can be used for video services and the like.

Further, in optical fiber communication, in order to connect a light receiving element and a terminal device (personal computer, mobile, game, etc.) from an optical fiber through an optical waveguide, a plurality of optical fibers are arranged at predetermined intervals. There is a need and an optical fiber array is used to achieve this.

Conventionally, as an optical fiber array, for example, a plurality of grooves for storing optical fibers are formed in a substrate made of a hard material such as ceramic, quartz, or silicon, and a part or all of the optical fiber is formed in each of the grooves. An optical fiber array in which the optical fiber array is accommodated and an optical fiber array in which a pressing member is further attached via an adhesive or the like on a substrate in which such an optical fiber is accommodated are disclosed (for example, Patent Document 1). , reference 2).

Also, optical components that are optically connected to conventional optical fiber arrays manufactured using hard materials such as ceramic, quartz, and silicon (for example, optical multiplexing / demultiplexing with a filter inserted in a slit portion of a splitter or optical waveguide) The material of the container and the like was a similar hard material or a material having a thermal expansion coefficient close to those of the same hard material.

Furthermore, for optical waveguides formed on various optical components, an optical waveguide made of a ceramic heater is formed on a ceramic substrate, an optical waveguide made of quartz is formed on a quartz substrate, and an optical waveguide made of quartz is formed on a silicon substrate. It had been.
The optical fiber array and the optical component are usually connected using a transparent optical adhesive.

The optical fiber array and the optical component (including the optical waveguide) connected in this manner do not cause positional misalignment between the optical fiber of the optical fiber array and the optical waveguide of the optical component in the usage environment and reliability test. Therefore, it is desirable to connect an approximation of the thermal expansion coefficient.

In recent years, polymer optical waveguides have been developed, and inexpensive optical parts using the polymer optical waveguides have been developed. When forming a polymer optical waveguide made of fluorinated polyimide for an optical component using such a polymer optical waveguide, the curing temperature at the time of forming the optical waveguide requires 200 ° C. or higher. A waveguide could not be formed.
However, when a resin material having a low curing temperature of 100 to 180 ° C., such as an epoxy resin, an acrylic resin, or a silicone resin, is used, a polymer optical waveguide can be formed on the resin substrate.

JP-6-331851 discloses JP-8-190033 discloses

In a conventional optical fiber array, when grooves are formed on a substrate made of a hard material by machining, the grooves cannot be formed at one time, and the grooves must be formed individually one by one. May cause a relative positional shift between optical fibers, and in some cases may cause deformation, disconnection, cracking, etc. in the optical fiber. It was.
When such positional deviation or deformation occurs, information cannot be accurately transmitted through the optical fiber.

Further, in the conventional optical fiber array, the upper surface of the substrate housing the optical fibers, when mounting the holding member, as the pressing member, a plate-like or pressing member made of a hard material,
A pressing member or the like is used in which grooves for accommodating portions not accommodated in the grooves formed on the optical fiber substrate are individually formed.

However, when such a pressing member is a simple plate-like body, when the optical fiber array receives an impact from above, the impact is received only by the optical fiber through the pressing member. In some cases, the optical fiber may be deformed, disconnected or cracked.

In addition to the hard materials such as ceramic, quartz, silicon, etc., as the materials for optical components (including optical waveguides), resin materials are used as optical fiber arrays as the above-mentioned resin materials are used. There is also a demand for an optical component having a thermal expansion coefficient close to that of the optical component.

Accordingly, as a result of intensive studies to solve the above-described problems, the present inventors collectively put a part of the optical fiber (the part that was not accommodated in the groove of the optical fiber) into the pressing member (lid part). As a result, the present invention has been completed.
Furthermore, it has also been found that an optical fiber array connected to an optical component having a polymer optical waveguide formed on a resin substrate preferably has a lid having the above-described shape made of resin.

That is, in the optical fiber array of the present invention, a resin layer having a plurality of grooves is formed on a part of the substrate, and optical fibers are accommodated in the grooves.
An optical fiber array in which a lid for storing a part of the optical fiber is formed on the resin layer,
A concave portion for collectively storing the optical fibers is formed on a surface of the lid portion facing the resin layer.

In the optical fiber array of the present invention, a groove for housing the optical fiber is formed in the resin layer, and the resin is softer than a hard base material such as ceramic or glass, so that the groove has unevenness, swelling, etc. Even if the deformation occurs, the optical fiber is less likely to be damaged or deformed, and an increase in connection loss due to the deformation can be prevented. In addition, when an adhesive is filled around the optical fiber housed in the groove, dust, foreign matter, and the like hardly adhere to the surface of the optical fiber.
Further, when the grooves are formed in the resin layer, the grooves can be easily formed in a lump, so that there is no variation in shape between the grooves.
In addition, the optical fiber array can be manufactured at a low cost because there are more parts made of resin compared to a conventional optical fiber array made of ceramic or the like.

Further, the optical fiber array of the present invention is provided with a lid portion formed with a recess for collectively storing a part of the optical fibers on the resin layer in which the optical fiber is accommodated. The outer edge part of the surface on which the optical fiber is formed is attached to the resin layer. Therefore, when the optical fiber array receives an impact from the outside, in particular, an impact from above, the impact is passed through the lid. Since it is received even by the resin layer, the force acting on the optical fiber itself is reduced. Therefore, even when an impact is applied from the outside, the optical fiber is not displaced and the optical fiber array is excellent in reliability.

In addition, since the concave portion formed in the lid portion has a shape that can accommodate optical fibers in a lump, the lid portion has grooves or the like that can individually accommodate individual optical fibers. In addition, since there is a gap between the optical fibers housed in the recesses, relative displacement of the optical fiber is less likely to occur. It is easy to fill the inside with an adhesive or the like.
In addition, in the optical fiber array of the present invention, unlike the optical fiber array in which a lid having a recess (groove) that can accommodate each optical fiber separately is formed, the position caused by the variation in the shape of the recess. Problems such as misalignment and deformation of the optical fiber do not naturally occur, and the reliability is excellent.

In the optical fiber array of the present invention, a resin layer having a plurality of grooves is formed on a part of the substrate, and optical fibers are accommodated in the grooves.
An optical fiber array in which a lid for storing a part of the optical fiber is formed on the resin layer,
A concave portion for collectively storing the optical fibers is formed on a surface of the lid portion facing the resin layer.

The optical fiber array of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view schematically showing an embodiment of the optical fiber array of the present invention. 2 is an exploded perspective view of the optical fiber array shown in FIG. 1, and FIG. 3 is a cross-sectional view taken along line AA of the optical fiber array shown in FIG.

As shown in FIGS. 1 to 3, the optical fiber array 100 includes a resin layer 112 on a plate-like substrate 111, and a groove 113 for housing the optical fiber 115 is formed in the resin layer 112. The optical fiber 115 from which the surrounding coating resin 116 is peeled is accommodated in the groove 113 in parallel.
Further, a lid portion 101 is formed on the resin layer 112, and a part of the optical fiber 115 (a portion of the optical fiber that was not accommodated in the groove 113) is collectively accommodated in the lid portion 101. A concave portion 101a is formed.
In addition, an outer edge portion 101 c on the lower surface (the surface on the side where the recess 101 a is formed) of the lid 101 is attached to the resin layer 112. Therefore, when the optical fiber array receives an impact from the outside, in particular, an impact from above, the impact is also received by the resin layer 112 via the outer edge portion 101 c of the lid 101, and thus acts on the optical fiber 115. Impact is reduced.

In addition to the groove 113, the resin layer 112 of the optical fiber array 100 is formed with a recess 117 for housing the optical fiber 115 together with the coating resin 116 formed in the periphery thereof. Furthermore, a concave portion 101b for accommodating a part of the optical fiber 115 together with the coating resin 116 formed around it is formed on the surface of the lid portion 101 that faces the concave portion 117.

As shown in FIG. 3, the concave portion 101 a formed in the lid portion 101 is formed such that its wall surface is substantially perpendicular to the upper surface of the resin layer 112.
The size of the recess 101a is such a size that a part of the optical fiber 115 can be accommodated together.
Further, the shape is not limited to a shape combining only planes intersecting at substantially right angles as shown in FIG. 3, and a shape in which a wall surface is inclined, a shape formed by a curved surface, a combination of a plane and a curved surface are combined. It may be a shape or the like.

Moreover, it is desirable that the depth of the concave portion is ½ or less of the diameter of the optical fiber. The depth of the recess exceeds half the diameter of the optical fiber, depending on the depth of the groove formed in the resin layer, less the portion occupied by the optical fiber in the recess, an optical fiber is a misalignment in the vertical direction It may happen.
Note that the depth of the recess is preferably the same as the height of the portion of the optical fiber housed in the recess.

In the optical fiber array 100, an adhesive layer 119 is formed on the optical fiber non-accommodating portion of the concave portion formed in the lid portion. In this way, by forming the adhesive layer 119, the optical fiber can be more reliably accommodated in a predetermined position. Note that the adhesive layer 119 may be formed as necessary, and may not be formed when the optical fiber can be stored in a predetermined position without forming the adhesive layer. Moreover, the said adhesive bond layer may be formed only in a part of optical fiber non-accommodating part.

In the optical fiber array of the present invention, the lid is usually attached to the resin layer via an adhesive layer. In addition, what is necessary is just to form the said adhesive bond layer as needed, and when there is sufficient adhesiveness between the said cover part and the said resin layer, it is not necessary to form.

Further, the groove 113 formed in the resin layer 112 is formed so that the wall surface thereof is substantially perpendicular to the upper surface of the substrate 111, and the size of the cross section of the groove 113 is such that the optical fiber 115 includes both the wall surface and the bottom surface. Is inscribed in the size.
The groove may be formed with an inclined wall surface or a curved surface so that the width of the bottom surface is narrowed. Specifically, the cross-sectional shape of the groove may be a substantially arc shape or a U shape.
In particular, when a substantially arc-shaped or U-shaped groove is formed, the optical fiber can be accommodated by surface contact, so that the optical fiber can be more securely fixed at a predetermined position.
In this specification, the U-shape includes not only a shape combining parallel lines and semicircles but also a shape combining two arcs whose widths are narrowed downward and an arc.

Further, the depth of the groove is desirably 1/2 or more and less than 1/1 of the diameter of the optical fiber 15.
This is because within this range, the optical fibers can be securely stored in a predetermined position, and can be accurately and collectively formed by exposure and development processing or the like at a low cost.

In general, considering the diameter of an optical fiber used for optical communication, the depth of the groove is preferably 50 μm or more and less than 400 μm.
Specifically, when an optical fiber having a diameter of 125 μm is used, the depth of the groove is preferably 62.5 to 100 μm.

The width of the groove is not particularly limited, but is preferably 100 to 400 μm, and more preferably 150 to 250 μm. If the thickness is less than 100 μm, the optical fiber 15 may not be accommodated. On the other hand, a groove having a diameter exceeding 400 μm rarely uses an optical fiber having a diameter exceeding 400 μm. However, when using an optical fiber having a diameter exceeding 400 μm, a groove having a width exceeding 400 μm may be formed.

In the optical fiber array 100, an adhesive layer 118 is formed in the optical fiber non-accommodating portion of the groove. Thus, by forming the adhesive layer 118, the optical fiber can be more reliably accommodated in a predetermined position. The adhesive layer may be formed as necessary, but it is desirable that the adhesive layer is formed when the width of the groove is larger than the diameter of the optical fiber. Moreover, the said adhesive bond layer may be formed only in a part of optical fiber non-accommodating part.

The resin layer may be composed of two or more layers. It is because it may be suitable for forming the groove | channel of a desired shape to comprise the said resin layer by two or more layers. This will be described in detail when the method for manufacturing the optical fiber array of the present invention is described.
It is to be noted that the structure of the resin layer is two layers, a resin layer that is superior in adhesion to the substrate is formed in the lower layer, and a resin layer that is excellent in shape retention is formed in the upper layer, thereby providing a higher quality optical fiber array Become.

In the optical fiber array 100, the resin layer 112 is formed with a recess 117 for housing the optical fiber 115 together with the coating resin 116 formed around the resin layer 112. The recess 117 is covered with the coating resin 116. has been left of the optical fiber is housed. With such a configuration, the holding and stability of the optical fiber 15 are improved, and the positional deviation of the optical fiber is less likely to occur.

Next, each member constituting the optical fiber array of the present invention will be described in detail sequentially.
Examples of the material of the substrate constituting the optical fiber array include inorganic materials such as ceramic, aluminum nitride, mullite, zirconia, silicon carbide, alumina, silicon, quartz, and glass; metal materials such as copper, iron, and nickel; Examples thereof include organic materials such as curable resins, thermoplastic resins, photosensitive resins, and composites thereof, and those obtained by impregnating reinforcing materials such as glass fibers in these organic materials.
In addition, as a specific example of organic materials, such as the said thermosetting resin, the thing similar to what is demonstrated in the resin layer mentioned later can be mentioned, for example.

The shape of the substrate is not particularly limited, but is usually a plate shape, and the size may be appropriately selected according to the size of the optical fiber array.
Further, a groove-shaped guide may be formed on the upper surface of the substrate (the portion exposed at the bottom surface of the groove formed in the resin layer). This is because by forming the guide, there is less possibility that the optical fiber is displaced in the left-right direction.

Moreover, the shape of the cross section of the guide is not particularly limited, and examples thereof include a rectangular shape, an inverted triangular shape, and an inverted trapezoidal shape.
Further, it is desirable that such a guide is formed so as to be exposed at the central portion of the bottom surface of the groove when the resin layer having the groove is formed on the substrate.

Further, a roughening process or a smut process may be performed on the portion of the substrate that contacts the resin layer, or a coating material layer may be formed. This is because the adhesion to the resin layer can be improved.

Further, it is desirable that the surface of the substrate that contacts the resin layer has a flatness of 10 μm or less. If the thickness exceeds 10 μm, the optical fiber may be misaligned, or the optical fiber may be deformed, disconnected, cracked, or the like.

Moreover, the said board | substrate may adhere | attach two board | substrates from which thickness differs.
This is because, for example, when a relatively thick substrate and a relatively thin substrate are bonded with their bottom surfaces aligned to form a single substrate, the height of each top surface is different, and therefore processing is performed. This is because the optical fiber from which the surrounding coating resin has been peeled can be placed on the thick substrate, and the optical fiber with the coating resin still formed can be placed on the thin substrate.

Examples of the material of the resin layer include a thermoplastic resin, a thermosetting resin, a resin in which a part of the thermosetting resin is sensitized, and a resin composition including at least one of the photosensitive resins. Can be mentioned.
Examples of the thermosetting resin include epoxy resins, phenol resins, polyimide resins, bismaleimide resins, polyphenylene resins, polyolefin resins, and fluororesins.
Specific examples of the epoxy resin include novolak type epoxy resins such as phenol novolac type and cresol novolak type, and dicyclopentadiene-modified alicyclic epoxy resins.

Moreover, as a specific example of a polyimide resin, the polyimide etc. which are shown to following Chemical formula (1)-(4) are mentioned, for example.

(In the formula, n represents an integer of 1 to 5.)

(Wherein, m represents an integer of 1 to 5.)

(Wherein, l represents an integer of 1 to 5.)

(Wherein, p is integer of 1 to 5..)

Examples of the polyolefin resin include polyethylene, polypropylene, polyisobutylene, polybutadiene, polyisoprene, cycloolefin resins, and copolymers of these resins.
Examples of the cycloolefin-based resin include homopolymers or copolymers of monomers composed of 2-norbornene, 5-ethylidene-2-norbornene, or derivatives thereof.

Examples of the sensitized thermosetting resin include those obtained by imparting photosensitivity to the above-described thermosetting resin. As a method for imparting photosensitivity to the thermosetting resin, for example, methacrylic acid or acrylic acid is reacted with a thermosetting group (for example, an epoxy group in an epoxy resin) of the thermosetting resin to give an acrylic group. A method or the like can be used.
Moreover, as said photosensitive resin, an acrylic resin etc. are mentioned, for example.

Examples of the thermoplastic resin include phenoxy resin, polyether sulfone (PES), polysulfone (PSF), polyphenylene sulfone (PPS) polyphenylene sulfide (PPES), polyphenyl ether (PPE), and polyetherimide (PI). ), and the like.

Moreover, the resin composition for forming the resin layer may contain two or more of a thermoplastic resin, a thermosetting resin, and a photosensitive resin, and the combination thereof includes a thermosetting resin and a thermosetting resin. A combination with a plastic resin or a combination of a photosensitive resin (hereinafter also including a sensitized thermosetting resin) and a thermoplastic resin is desirable.

Examples of the combination of the thermosetting resin and the thermoplastic resin include a combination of phenol resin and polyether sulfone, polyimide resin and polysulfone, epoxy resin and polyether sulfone, epoxy resin and phenoxy resin, and the like.
The mixing ratio in the case of combining the thermosetting resin and the thermoplastic resin is preferably thermosetting resin / thermoplastic resin = 95/5 to 50/50 (weight ratio).
This is because, within this range, the toughness value is high, and it is difficult to deform when subjected to an impact from the outside.

Examples of the combination of the photosensitive resin and the thermoplastic resin include a combination of an epoxy resin and polyether sulfone in which at least a part of the epoxy group is acrylated, an acrylic resin and a phenoxy resin, and the like.
Further, the mixing ratio when combining the photosensitive resin and the thermoplastic resin is desirably photosensitive resin / thermoplastic resin = 95/5 to 50/50 (weight ratio).
This is because, within this range, the toughness value is high, and it is difficult to deform when subjected to an impact from the outside.

Further, the combination of the resin compositions used when the resin layer is composed of two or more layers is not particularly limited. For example, a resin composition of photosensitive resin / thermoplastic resin = 50/50 is used for the lower resin layer, The combination etc. which use the resin composition of photosensitive resin / thermoplastic resin = 90/10 for the upper resin layer are mentioned.
When such a combination is used, the lower resin layer reduces the blending amount of the photosensitive resin, so that the substrate and the resin layer can be securely adhered to each other, and the wall surface thereof is exposed and developed. It is suitable for forming a groove having a curved surface. On the other hand, since the upper resin layer increases the amount of the photosensitive resin, the groove can be surely formed by exposure and development processing.
A specific method for forming the groove will be described in detail later.

Such a resin composition may contain a hardening | curing agent, a solvent, etc. as needed other than the above-mentioned resin component as needed.
The resin composition may contain particles. By adjusting the compounding quantity of particle | grains, the viscosity of the said resin composition can be adjusted, or the shape retainability of the film | membrane formed by apply | coating a resin composition can be improved.
In addition, by adjusting the blending amount of the particles, the thermal expansion coefficient of the resin layer to be formed can be matched with the thermal expansion coefficient of the substrate, etc., and cracks are generated due to the difference in thermal expansion coefficient between them. Etc. can be suppressed. Furthermore, since the particles serve as a buffer against external impacts, cracks and the like are less likely to occur in the resin layer, and as a result, damage and deformation are less likely to occur in the optical fiber.
Further, depending on the type of particles to be contained, the optical fiber array to be produced can be colored in an arbitrary color, and the flame retardancy of the optical fiber array can be improved.

The particles are desirably at least one of resin particles, inorganic particles, and metal particles.
The resin particles, thermosetting resin, thermoplastic resin, photosensitive resin, a part of the thermosetting resin is photosensitized resinous, resin composite of a thermosetting resin and a thermoplastic resin, and a photosensitive What consists of at least 1 type of the resin composite_body | complex of resin and a thermoplastic resin is desirable.

Examples of the thermosetting resin include epoxy resins, phenol resins, polyimide resins, bismaleimide resins, polyphenylene resins, polyolefin resins, and fluororesins.

Examples of the thermoplastic resin include phenoxy resin, polyether sulfone (PES), polysulfone (PSF), polyphenylene sulfone (PPS), polyphenylene sulfide (PPES), polyphenyl ether (PPE), polyetherimide ( PI), and the like.

As said photosensitive resin, an acrylic resin etc. are mentioned, for example.
Examples of the resin in which a part of the thermosetting resin is sensitized include those obtained by imparting photosensitivity to the above-described thermosetting resin.

Examples of the resin composite of the thermosetting resin and the thermoplastic resin include a resin containing at least one of the thermosetting resin and the thermoplastic resin.
In addition, as the resin composite of the photosensitive resin and the thermoplastic resin, for example, at least one of the photosensitive resin and a resin in which a part of the thermosetting resin is sensitized and the thermoplastic resin are used. Resin etc. which contain each are mentioned.
Moreover, as the resin particles, resin particles made of rubber can be used.

Examples of the inorganic particles include aluminum compounds such as alumina and aluminum hydroxide, calcium compounds such as calcium carbonate and calcium hydroxide, potassium compounds such as potassium carbonate, magnesium compounds such as magnesia, dolomite and basic magnesium carbonate, and silica. And those composed of at least one of silicon compounds such as zeolite.

Moreover, as said inorganic particle, you may use what consists of phosphorus and / or a phosphorus compound. When these are used, the flame retardance of the resin layer can be further improved. Moreover, in order to improve stability, the particle | grains which consist of these phosphorus and phosphorus compounds may be coat | covered with resin, such as a phenol resin, inorganic compounds, such as aluminum hydroxide.

Examples of the metal particles include Au, Ag, Cu, Pd, Ni, Pt, Fe, Zn, Pb, Al, Mg, and Ca. Among these, Au, Ag, What consists of Cu, Pd, Ni, and Pt is desirable. In addition, these metal particles may have a surface layer coated with a resin or the like in order to ensure insulation of the resin layer.

The shape of the particles is preferably at least one of a spherical shape, an elliptical spherical shape, a crushed shape, and a polyhedral shape. Among these, a spherical shape is more preferable because cracks are unlikely to occur, and even if stress is generated in the resin layer by heat or thermal shock, the stress is easily relaxed.

The blending amount of the particles is desirably 10 to 80% by weight, and more desirably 20 to 70% by weight. When the amount of the particles is less than 10% by weight, when the optical fiber array is used in a harsh environment (such as in a high temperature environment), the resin layer is cracked or the resin layer has insufficient hardness. sometimes poor durability of the optical fiber array. On the other hand, if the blending amount of the particles exceeds 80% by weight, the resin layer has a sufficiently high hardness, but is brittle and may deteriorate the quality of the optical fiber array. When the grooves are formed in the resin layer, the resin layer (resin composition) may not be sufficiently exposed, and the designed grooves may not be formed.

Examples of the material of the lid include inorganic materials such as aluminum nitride, mullite, zirconia, silicon carbide, alumina, silicon, quartz, and glass; metal materials such as copper, iron, and nickel; thermosetting resins and heat Examples thereof include organic materials such as plastic resins, photosensitive resins, and composites thereof, and those obtained by impregnating these organic materials with a reinforcing material such as glass fiber.

The material of the lid is preferably the same as the material of the resin layer.
In this case, the adhesiveness between the resin layer and the lid is improved, and inconvenience due to the difference in thermal expansion coefficient between the two does not occur.
Moreover, when the material of the said cover part is an inorganic material (hard material), a deformation | transformation etc. do not generate | occur | produce more with respect to the impact from the outside.
The material of the lid may be appropriately selected in consideration of the design of the optical fiber array, the usage environment, and the like. In addition, the formation method of the recessed part which the said cover part has is explained in full detail behind.

Moreover, the said cover part may be comprised from 2 or more layers. As a specific aspect, for example, an aspect in which a layer made of an organic material and a layer made of a hard material are composed of two layers, and a concave portion for accommodating an optical fiber is formed in a layer made of a resin, etc. Can be mentioned.
In such a lid portion, a hard material having excellent mechanical strength provides excellent impact resistance, and the concave portion is formed in a layer made of an organic material, so that the formation is easy and the dimensional accuracy is also excellent. .

In addition, about the optical fiber array of this invention, the optical fiber array (optical fiber array with a resin-made lid part) using the same resin as the material of a resin layer was used as a material of a cover part, and quartz was used as a material of a cover part. An optical fiber array (an optical fiber array with a quartz lid) is manufactured, and these are made into an optical waveguide component (polymer waveguide component) in which a polymer optical waveguide is formed on a resin substrate or a quartz optical waveguide on a quartz substrate. Connected to the formed optical waveguide component (quartz waveguide component) via an optical adhesive, and then a reliability test (1000 cycles at an air bath temperature cycle of 0 ° C. (30 minutes) / 100 ° C. (30 minutes)) And the positional deviation (core diameter of the optical fiber) between the core of the optical fiber and the core portion of the optical waveguide after the reliability test was measured.

As a result, in the connection between the optical fiber array with the resin lid and the polymer waveguide component, the positional deviation after the reliability test was 10% or less, whereas the optical fiber array with the resin lid and the quartz waveguide were In the connection with the waveguide component, and the connection between the optical fiber array with the quartz lid and the polymer waveguide component, the positional deviation after the reliability test exceeded 15%.
From this, it is clear that when the optical fiber array of the present invention is used for connection with an optical component made of a resin material, it is desirable that the material of the lid is the same as the material of the resin layer.

In the case where an adhesive layer is formed on the optical fiber non-contained part of the recess formed in the lid part or the optical fiber non-contained part formed on the resin layer, examples of the adhesive include thermoplastic resin and thermosetting Examples thereof include a photosensitive resin, a resin in which a part of a thermosetting resin is sensitized, and a photosensitive resin.
Specifically, a thermosetting resin such as an epoxy resin, a phenol resin, or a silicone resin, an ultraviolet curable resin, or the like can be used.

Further, the adhesive used when forming the adhesive layer may contain inorganic particles, resin particles, metal particles, and the like as described above in addition to the resin component described above. This is because the thermal expansion coefficient can be matched and the flame retardancy can be improved.
Moreover, the said adhesive agent may contain the hardening | curing agent, the reaction stabilizer, the photopolymerization agent, the solvent, etc. This is because the fluidity of the adhesive can be improved.

Next, a method for manufacturing the optical fiber array of the present invention will be described in the order of steps.
(1) First, a substrate made of the above ceramic, metal, resin or the like is used as a starting material,
If necessary, the surface is subjected to a smut treatment or a coating layer is formed.
In addition, when the guide is formed on the upper surface of the substrate, it may be formed using a cutting member such as a diamond cutter in this step.
Further, in the case of receiving a part of the optical fiber remains coated resin is formed, a recess for accommodating the optical fiber remains the coating resin is formed or preliminarily formed in this step, or, A material obtained by bonding two substrates having different thicknesses is used as a starting material.

(2) Next, a resin layer is formed on the substrate.
In this step, the resin layer is formed by applying the above-described resin composition on the substrate or pressing the resin film made of the above-described resin composition on the substrate.

When applying a resin composition, apply a solution of a resin composition whose viscosity has been adjusted in advance using a method such as curtain coater, roll coater, or printing, and then perform a drying treatment to form a resin layer. What is necessary is just to crimp a resin composition including a thermosetting resin (including a photosensitive resin having thermosetting property) that has been semi-cured in advance to be in a B-stage state, A resin composition containing a thermoplastic resin (including a thermoplastic resin having thermoplasticity) previously formed into a plate shape may be pressure-bonded. In addition, you may use heat processing together as needed at the time of pressure bonding.

Note that the resin layer formed in this step may be completely cured or in a semi-cured state.
Specifically, in forming a groove in a subsequent step, in the case of using the exposure and development treatment is preferably a semi-cured state, in the case of using the laser process is a fully cured state Alternatively, it may be in a semi-cured state.
Further, in order to form a groove by using the exposure and development process, when the resin layer in a semi-cured state is cured to the extent that the skin layer is formed in a surface portion (semi-cured) is to be desirable.
The skin layer is a hard layer formed on the surface layer portion because the surface layer portion is first hardened at the time of exposure.

(3) Next, a groove for accommodating the optical fiber is formed in the resin layer formed in the step (2).
This step is desirably performed by performing exposure and development treatment when the resin layer is formed using the resin composition containing the photosensitive resin in the step (2). Therefore, in this case, in the step (2), a semi-cured resin layer is formed.
Specifically, first, a mask on which a pattern corresponding to a groove to be formed is placed is placed on the resin layer, and then an exposure process is performed.
As a method of drawing a pattern on the mask, for example, a lift-off method can be used for a mask intended for a negative photosensitive resin, and an etching is performed for a mask intended for a positive photosensitive resin. Processing or the like can be used.

Furthermore, a groove is formed in the resin layer by performing development using a developer.
Further, after the exposure treatment, the resin layer is completely cured using heat treatment or the like as necessary. This is because if the resin layer is not completely cured, the optical fiber may be misaligned when the optical fiber is stored.

The developer is not particularly limited, and a commonly used developer such as an acid solution, an alkali solution, or an organic solvent may be used depending on the type of the resin layer.
Moreover, the said development process can be performed by immersing the board | substrate with which the resin layer was formed in a developing solution, or spraying a developing solution on a resin layer, for example.

The detailed conditions for performing exposure / development processing, that is, the amount of exposure and the type of developer are not particularly limited, and the composition of the resin composition, the thickness of the resin layer to be formed, the shape of the groove, etc. the may be appropriately selected in consideration.

When the resin layer is composed of two or more layers, the step (2) and the step (3) may be repeated.
Such a method of repeatedly performing the resin layer forming step and the groove forming step is to form a groove formed with an inclined wall surface or a groove formed with a curved surface so that the width of the bottom surface is narrowed. Suitable as a method to do.

In this case, by changing the composition of the resin composition used when forming the lower resin layer and the composition of the resin composition used when forming the upper resin layer, the width of the bottom surface is reduced. It is possible to suitably form a groove formed with an inclined wall surface or a groove formed with a curved surface.
Specifically, for example, the lower resin layer is formed using a resin composition having a low photosensitive resin content (for example, photosensitive resin / thermoplastic resin = 50/50), and the upper resin layer is exposed to light. By using a resin composition (for example, photosensitive resin / thermoplastic resin = 90/10) having a high content of the photosensitive resin, a groove formed by a curved surface can be formed.

Further, the groove can be formed in the resin layer by performing laser treatment instead of the exposure / development treatment. When laser treatment is performed, grooves can be formed regardless of the type of resin composition used to form the resin layer.
Examples of the laser used for the laser treatment include a carbon dioxide laser, an excimer laser, a UV laser, and a YAG laser.

These lasers may be used properly in consideration of the shape of the groove to be formed, the composition of the resin composition, and the like.
That is, when laser light from a hologram type excimer laser is irradiated through a mask, grooves can be formed in a lump.
Further, when a short pulse carbon dioxide laser is used, a groove can be formed in the resin layer without further damage.

Also, grooves can be formed in a lump when laser light is irradiated through an optical system lens and a mask.
This is because the entire resin layer can be irradiated with laser light having the same intensity and the same irradiation angle through the optical system lens and the mask.
Such laser treatment may be performed on a semi-cured resin layer or may be performed after the resin layer is completely cured.

In addition, when the groove is formed by laser processing, particularly when the groove is formed using a carbon dioxide laser, it is desirable to perform desmear processing after the laser processing is completed.
The desmear treatment can be performed using, for example, an oxidizing agent made of an aqueous solution such as chromic acid or permanganate. Alternatively, the treatment may be performed by oxygen plasma, mixed plasma of CF ₄ and oxygen, corona discharge, or the like.

In this step, a groove may be formed, and a recess for accommodating the optical fiber together with the coating resin may be formed.
The concave portion can also be formed by exposure / development processing or laser processing.
Further, when the resin layer is formed in the step (2), a recess may be formed by not forming the resin layer in a portion where the optical fiber and the coating resin are accommodated.

In this step, after the groove is formed in the resin layer, the groove may be filled with an uncured adhesive before the optical fiber is accommodated in the step (4) described later.
By filling the groove with an uncured adhesive in advance, the optical fiber can be securely fixed when the uncured adhesive is cured after the optical fiber is accommodated in a subsequent process.

(4) Next, the optical fiber is housed in the groove formed in the resin layer.
In this step, the optical fiber is aligned at a position corresponding to the groove formed in the resin layer using an aligner, and then the optical fiber is accommodated in the groove.
At this time, it is desirable that the optical fiber be accommodated in the groove after removing the coating resin at the end. This is because the coating resin is soft and easily deformed, and when the coating resin is deformed at the time of storage or after storage, this leads to positional deviation of the optical fiber.
Further, the optical fiber may be accommodated so that the end surface thereof and the side surface of the resin layer form the same plane, or the end surface of the optical fiber protrudes from the side surface of the resin layer by a certain length. It may be stored in an aligned manner.

In addition, after forming the groove in the step (3) and filling the groove with an adhesive before housing the optical fiber, the adhesive is cured after housing the optical fiber in this step. In this case, however, it is desirable to hold the optical fiber with an aligner until the adhesive is completely cured. This is because when the adhesive is uncured, the optical fiber may be misaligned.

Also, in this step, after storing the optical fiber, an uncured adhesive is filled in a part of the optical fiber non-storage part of the groove, for example, a space surrounded by the substrate, the resin layer, and the optical fiber, and then The adhesive layer may be formed by curing.
In this case, filling of the adhesive is performed, for example, by pouring uncured adhesive from the side surface of the groove in which the optical fiber is accommodated. As a result, the uncured adhesive is filled in the groove by surface tension.

In addition, in the case of filling the adhesive using such a method, that is, a method of pouring the adhesive from the side surface of the resin layer in which the groove is formed, after performing the subsequent steps until the formation of the lid portion. It is desirable to fill the adhesive.
This is because the adhesive can be simultaneously filled into the optical fiber non-contained portion of the recess formed in the lid and the optical fiber non-contained portion in the groove, so that the number of steps can be reduced.

(5) Next, a lid for covering the optical fiber is formed on the resin layer containing the optical fiber.
The lid is formed by processing the material of the lid in advance into the shape described above and then crimping it, or applying an adhesive on the top surface of the resin layer, and then attaching via the adhesive Can be done.

Specifically, when the material of the lid is a hard material such as glass, the hard material is cut into a plate-like body of a desired size in advance and then cut using a diamond cutter or the like. A recess is formed by processing, and this is crimped to a predetermined position on the resin layer or attached via an adhesive.

In addition, when the material of the lid is a resin composition, the resin composition is molded into a plate-like body having a desired size in advance, and then subjected to exposure development processing, laser processing, or the like. A recess for storing optical fibers in a lump is formed, and this is pressed onto a predetermined position on the resin layer or attached via an adhesive.
In addition, you may form a recessed part by giving the cutting process using a diamond cutter etc. to the plate-shaped body of the resin composition hardened | cured completely.
In addition, when the lid portion is composed of two layers of a layer made of a plate-like hard material and a layer made of an organic material having a recess, the resin composition is added to the plate-like body made of the hard material. After the material is applied and cured as necessary, the recess may be formed by exposure / development processing, laser processing, cutting processing, or the like as described in the step (3).

(6) Next, if necessary, an adhesive layer is formed on the optical fiber non-contained portion of the recess formed in the lid portion or the optical fiber non-contained portion of the groove formed in the resin layer.
The adhesive layer is formed by pouring an uncured adhesive into the optical fiber non-accommodating portion from the side of the lid or the resin layer, and then performing a curing treatment such as heat treatment or light (ultraviolet) treatment. .

In addition, after forming an optical fiber array in this way, irregularities, identification marks, identification numbers, serial numbers, and manufacturing recognitions that serve as a guide for connection between the optical fiber array and waveguides, light receiving elements, light emitting elements, devices, etc. A product recognition mark such as a mark, a product name, a company name, or a barcode may be formed on the substrate or the lid.

In an optical fiber array in which a resin layer having such a groove is formed, optical communication is performed by connecting the optical fiber housed in the optical fiber array to an optical device such as a waveguide, a light receiving element, or a light emitting element. As a result, various modules such as the Internet, TV, game, and mobile can be operated.

Hereinafter, the present invention will be described in more detail.
(Example 1)
(1) A substrate 311 made of silicon having a thickness of 10 mm whose surface was polished after firing was used as a starting material.
(2) Next, the resin composition solution prepared by the following method was applied on the substrate 311 with a curtain coater so that the thickness after curing was 100 μm (thickness at the time of application 115 μm), A drying treatment was performed at 80 ° C. for 10 minutes and at 100 ° C. for 30 minutes to form a semi-cured resin layer. In this semi-cured resin layer, a skin layer was formed on the surface.

Preparation of resin composition solution 40 parts by weight of novolak type epoxy resin acrylate as resin component, 35 parts by weight of bisphenol A type epoxy resin, 4 parts by weight of imidazole curing agent, average particle diameter as inorganic particles silica particles 10 parts by weight of 10 [mu] m, the photopolymerization initiator 3.0 parts by weight, the amine compound 1.0 part by weight as a reaction stabilizer, and, after mixing toluene 15 parts by weight as a solvent, its viscosity rpm 6min ^{- The} mixture was stirred at 25 ° C. until it became 10 ± 1 Pa · s to obtain a resin composition solution.

(3) Next, a mask in which a portion facing the groove forming portion is drawn in black, that is, a mask in which seven black lines having a width of 150 μm are drawn at intervals of 200 μm is adhered to the semi-cured resin layer. And exposed to light at 1200 mj / cm ² for 15 minutes using an ultra high pressure mercury lamp. Further, after the exposure, development processing was performed using diethylene glycol dimethyl ether (DMDG).

(4) Next, the resin layer that has undergone the development treatment is fully cured under conditions of 30 minutes at 100 ° C. and 3 hours at 150 ° C., and the wall surface is a substrate with a width of 150 μm, a depth of 100 μm, and a groove interval of 200 μm. A resin layer 312 having seven grooves 313 perpendicular to the upper surface of 311 was formed (see FIG. 5A).
In FIG. 5A, only four grooves are formed, but this figure is a schematic view, and in this example, seven grooves were formed as described above.

(5) Next, seven optical fibers (manufactured by Hitachi Cable Co., Ltd.) having a core diameter of 50 μm and a clad diameter of 125 μm are prepared by using a sorter (not shown). The end faces were aligned and aligned at 200 μm intervals.
Thereafter, the optical fiber 315 was stored in the groove 313 of the resin layer 312 while being held by an aligner (not shown) (see FIG. 5B).

(6) Next, the upper surface of the resin layer 312, the adhesive composition of the uncured containing epoxy resin is applied and then allowed to form a recess for collectively accommodating advance optical fiber, thickness The silicon substrate 301 having a thickness of 10 μm was placed as a lid portion, and the resin layer 312 and the lid portion 301 were integrated by curing the adhesive composition by heat treatment (see FIG. 5C).
In addition, the recessed part 301a provided in the cover part 301 was formed by performing the cutting process which used the diamond cutter for the silicon substrate. The recess 301a has a rectangular cross section.

(7) Next, the optical fiber non-accommodating portion of the recess 301a formed in the lid 301 and the optical fiber non-accommodating portion of the groove 313 formed in the resin layer are uncured containing epoxy resin from the side surfaces of the recess and the groove. yelling flowing adhesive composition. Thereafter, heat treatment was performed to cure the adhesive composition, thereby forming adhesive layers 318 and 319 on the optical fiber non-contained portion of the recess and the optical fiber non-contained portion of the groove. Furthermore, an optical fiber array was obtained by removing the aligner that held the optical fibers (see FIG. 5D).

(Example 2)
In the step (6) of Example 1, an optical fiber array was manufactured in the same manner as Example 1 except that a resin substrate having a recess produced by the following method was used as the lid.

After the lid portion made of resin substrate prepared <br/> Example 1 The same resin composition solution and the resin composition solution used in step (2) was applied with a curtain coater onto a PET film, dried ( A resin substrate that was completely cured was prepared by applying a curing treatment (100 ° C. for 30 minutes and 150 ° C. for 3 hours) at 80 ° C. for 10 minutes and 100 ° C. for 30 minutes.
Thereafter, the resin substrate was cut using a diamond cutter to form recesses for collectively storing optical fibers. In addition, the shape of the recessed part formed here is the same as the shape of the recessed part formed in the cover part of Example 1. FIG.

(Example 3)
In the step (1) of the first embodiment, instead of the substrate made of silicon, a substrate made of quartz having a thickness of 10 mm whose surface was subjected to polishing treatment after firing was used. An optical fiber array was manufactured in the same manner as in Example 1 except that a quartz substrate having a recess for collectively storing optical fibers by cutting using a diamond cutter was used instead of a silicon substrate. .

Example 4
(1) A glass substrate 411 having a thickness of 10 mm whose surface was polished after firing was used as a starting material.
(2) Next, the resin film prepared by the following method is pressure-bonded onto the substrate 411 under conditions of a degree of vacuum of 67 Pa, a pressure of 0.4 MPa, a temperature of 80 ° C., and a pressure bonding time of 60 seconds. A resin layer was formed.

Production of resin film 40 parts by weight of a novolak-type epoxy resin acrylate as a resin component, 35 parts by weight of a phenol resin, 4 parts by weight of an imidazole curing agent as a curing agent, and silica particles 10 having an average particle diameter of 10 μm as inorganic particles A resin composition solution was prepared by mixing 2.0 parts by weight of benzophenone as a photopolymerization initiator, 1.0 part by weight of an amine compound as a reaction stabilizer, and 10 parts by weight of toluene as a solvent. The resin composition solution was applied on a PET film using a roll coater, and then dried at 80 ° C. for 10 minutes and at 100 ° C. for 30 minutes to prepare a resin film.

(3) Next, a mask in which a portion facing the groove forming portion is drawn in black, that is, a mask in which seven black lines having a width of 150 μm are drawn at intervals of 200 μm is adhered to the semi-cured resin layer. And exposed to light at 1200 mj / cm ² for 15 minutes using an ultra high pressure mercury lamp. Further, after the exposure, development processing was performed using diethylene glycol dimethyl ether (DMDG).

(4) Next, the resin layer that has undergone development processing is fully cured under the conditions of 100 ° C. for 30 minutes and 150 ° C. for 3 hours, and the groove 413 inclined so that its wall surface becomes narrower toward the bottom surface is 7 The resin layer 412 thus formed was formed (see FIG. 6A). The groove 413 has a bottom surface width of 120 μm, a top surface width of 150 μm, and a depth of 100 μm.
In FIG. 6A, only four grooves are formed, but this figure is a schematic view, and in this example, seven grooves were formed as described above.

(5) Next, an uncured adhesive composition 418 ′ containing an epoxy resin was filled into the groove 412 formed in the step (4) (see FIG. 6B).

(6) Next, prepare seven optical fibers (manufactured by Hitachi Cable Co., Ltd.) with a clad diameter of 125 μm from which a part of the coating resin has been peeled off, and align the end faces thereof using an aligner (not shown). And aligned at intervals of 200 μm.
Thereafter, the optical fiber 415 was accommodated in the groove 413 filled with the adhesive composition 418 ′ while being held by an aligner (not shown). Further, the adhesive composition 418 ′ was cured by heat treatment to form an adhesive layer 418, and then the aligner holding the optical fiber was removed (see FIG. 6C).

(7) Next, the upper surface of the resin layer 412, the adhesive composition of the uncured containing epoxy resin is applied and then allowed to form a recess for collectively accommodating advance optical fiber, thickness is placed a glass substrate 401 of 10μm as a lid portion, it is subjected to heat treatment to integrate the resin layer 412 and the lid 401 by curing the adhesive composition.
In addition, the recessed part 401a provided in the cover part 401 was formed by performing the cutting process which used the diamond cutter for the glass substrate. 401a has a rectangular cross-sectional shape.

(8) Next, an epoxy resin is included from the side of the recess and the groove into the optical fiber non-storage portion of the recess 401a formed in the lid portion 401 and a part of the optical fiber non-storage portion of the groove 413 formed in the resin layer. yelling flowing adhesive composition uncured. Thereafter, a heat treatment is performed to cure the adhesive composition, thereby forming an adhesive layer 419 in the optical fiber non-contained portion of the recess and the optical fiber non-contained portion of the groove, thereby forming an optical fiber array (FIG. 6). see (d)).

(Example 5)
In the step (7) of Example 4, an optical fiber array was manufactured in the same manner as in Example 4 except that a resin substrate having a recess produced by the following method was used as the lid.

Production of lid made of resin substrate 40 parts by weight of novolac epoxy resin acrylate as resin component, 35 parts by weight of phenol resin, 4 parts by weight of imidazole curing agent as curing agent, and average particle diameter of 10 μm as inorganic particles silica particles, 10 parts by weight of benzophenone 2.0 part by weight of a photopolymerization initiator, an amine compound 1.0 part by weight as a reaction stabilizer, as well, a resin composition solution prepared by mixing toluene 10 parts by weight as a solvent After coating on a PET film with a curtain coater, drying treatment (10 minutes at 80 ° C. and 30 minutes at 100 ° C.) and curing treatment (30 minutes at 100 ° C. and 3 hours at 150 ° C.) are carried out to complete curing. A resin substrate was prepared.
Thereafter, the resin substrate was cut using a diamond cutter to form recesses for collectively storing optical fibers. In addition, the shape of the recessed part formed here is the same as the shape of the recessed part formed in the cover part of Example 4.

(Example 6)
In the step (1) of Example 4, instead of the glass substrate, a substrate made of silicon having a thickness of 10 mm whose surface was subjected to polishing treatment after firing was used. An optical fiber array was manufactured in the same manner as in Example 4 except that a silicon substrate having a recess for collectively storing optical fibers by cutting using a diamond cutter was used instead of the glass substrate.

(Comparative Example 1)
An optical fiber array was manufactured in the same manner as in Example 1 except that a plate-like silicon substrate having a thickness of 10 μm with no concave portion was attached as an lid with an adhesive.

(Comparative Example 2)
Example except that a lid formed by forming a recess for individually storing each of the seven optical fibers on a plate-like silicon substrate having a thickness of 10 μm was attached through an adhesive as a lid. In the same manner as in No. 1, an optical fiber array was manufactured.

For the optical fiber arrays obtained in Examples 1 to 6 and Comparative Examples 1 and 2, a detector was placed on the end face of the optical fiber on the optical fiber array side, and a light emitting element was used from the other end face of the optical fiber. The storage accuracy of the optical fiber was evaluated by calculating a deviation from the design of the storage position of the optical fiber from the light detection position when the light was introduced. The results are shown in Table 1.
Further, after the optical fiber array was pressed from above with a pressing force of 20 Pa for 20 minutes, the optical fiber accommodation accuracy was measured in the same manner as described above. The results are shown in Table 1.

Incidentally, as shown in Table 1, the optical fiber array according to Examples 1 to 6, the deviation from the design of the storage position of the optical fiber is 10% or less by also to core diameter even after pressing, The optical fiber was stored at a predetermined position with high accuracy.
In contrast, in the optical fiber array according to the comparative example 1, deviation from the design of the storage position of the optical fiber after pressing has a large value exceeding 12% vs. core diameter, the light according to Comparative Example 2 In the fiber array, before pressing, the core diameter was already a large value exceeding 12%, and it was revealed that the storage position was deviated from the design.

Further, after evaluating the storage accuracy, the optical fiber array was disassembled, and the surface of the optical fiber was observed with a microscope. As a result, the surface of the optical fiber according to Examples 1 to 6 was not damaged, No fiber deformation was observed. On the other hand, some of the optical fibers according to Comparative Examples 1 and 2 were deformed.
Furthermore, connected to the light-receiving device and the optical fiber array is disposed seven light receiving elements of Examples 1 to 6 was measured coupling loss, the coupling loss is low, sufficiently satisfy the required quality of a product Was.

It is a perspective view showing typically one embodiment of the optical fiber array of the present invention. It is a disassembled perspective view of the optical fiber array shown in FIG. FIG. 2 is a cross-sectional view of the optical fiber array shown in FIG. 1 taken along line AA. It is a perspective view which shows typically another one Embodiment of the optical fiber array of this invention. It is sectional drawing which shows typically an example of the manufacturing process of the optical fiber array of this invention. It is sectional drawing which shows typically another example of the manufacturing process of the optical fiber array of this invention.

Explanation of symbols

100, 200 Optical fiber array 101, 201, 301, 401 Cover part 111, 211, 311, 411 Substrate 112, 212, 312, 412 Resin layer 113, 213, 313, 413 Groove 115, 215, 315, 415 Optical fiber

Claims (1)

A resin layer having a plurality of grooves is formed on a part of the substrate, and optical fibers are accommodated in the grooves,
An optical fiber array in which a lid for housing a part of the optical fiber is formed on the resin layer,
An optical fiber array, wherein a recess for collectively storing the optical fibers is formed on a surface of the lid portion facing the resin layer.

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