JP2005260140A - Jig and method for transferring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transferring jig 1 capable of suppressing a glitch in manufacturing and capable of low-cost manufacturing in a process wherein electronic components etc. are joined to the surface of a thin printed wiring board including a flexible printed wiring board, or in a process wherein the printed wiring board is manufactured. <P>SOLUTION: The printed wiring board is placed and held on the transferring jig having holes capable of vacuum sucking. A printing process, a mounting process, and a reflow process are carried out to manufacture the printed wiring board. Further, a transferring jig having a lamination structure of an adherent layer and an intermediate layer may be used. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a suitable transport jig, method, and system in a process of mounting electronic components or the like on the surface of a thin printed wiring board such as a flexible printed wiring board or a process of manufacturing the printed wiring board. It is.

  Currently, printed wiring boards are used in all types of electronic equipment, from mass production equipment such as TVs to equipment that requires high reliability such as rockets, for the purpose of improving productivity, ensuring mass production quality, and improving reliability. Has been. In general, this printed wiring board has a configuration in which a conductive pattern is provided on the surface of an insulating substrate, but in recent years, a conductive pattern is provided on the surface of a film-like insulating substrate in order to cope with the reduction in size and weight of electronic devices. Flexible printed wiring boards are provided. In this substrate, a so-called surface mounting method in which electronic components are mounted on the surface of the conductor pattern is widely adopted.

This surface mounting method is generally performed as follows. First, the adhesive layer 22 is formed on the surface of the plate-shaped conveyance jig 1 (FIGS. 1 and 2), and the substrate 9 is attached thereon. Then, after performing a solder paste printing process, an electronic component mounting process, and a reflow process, the substrate 9 is removed and completed (see, for example, Patent Document 1).
JP 2003-137632 A

  By the way, according to the conventional conveying jig, (1) it is necessary to form an adhesive in accordance with the pattern of the substrate. The reason is that if the adhesive is larger than the substrate, ink adheres to the adhesive in the printing process. As a result, there is a problem that if the substrate changes, the adhesive must be changed or the conveying jig itself must be changed. (2) Although it is necessary to replace the pressure-sensitive adhesive due to the deterioration of the pressure-sensitive adhesive, since the pressure-sensitive adhesive cannot be removed from the transport jig, a new transport jig has to be created, which takes cost and time. (3) When the adhesive is deteriorated, the substrate does not adhere firmly to the conveying jig, so that there is a problem that a failure occurs suddenly in the printing, mounting, and reflow processes.

  The present invention has been made in consideration of such circumstances, and is manufactured in a step of bonding electronic components or the like to the surface of a thin printed wiring board such as a substrate, or a step of manufacturing the printed wiring board. An object of the present invention is to provide a conveyance jig and a holding conveyance method capable of suppressing the above problems and capable of low-cost production.

  In order to solve the above problems and achieve such an object, the following transport jig, transport method, and mounting system are used.

  In order to manufacture a printed circuit board, it is a conveyance jig provided with an opening on the surface of the plate on which the board is placed, and has a sealed structure that can be directly connected to the opening and maintain a reduced pressure state. Use the featured transport jig.

  In the above transport jig, a transport jig characterized in that the suction force at the portion corresponding to the central portion of the substrate is larger than the suction force at the peripheral portion of the substrate.

  In the above conveying jig, the conveying jig is used, wherein the suction opening is arranged at a position corresponding to the pattern of the substrate.

  In the above conveying jig, a conveying jig in which the size of the opening is equal to or smaller than the width of the pattern is used.

  In a transport jig for mounting a substrate for manufacturing a printed wiring board, a transport jig comprising an intermediate layer formed on the surface and an adhesive layer on the intermediate layer is used.

  In this transport jig, a transport jig characterized in that the adhesive force between the intermediate layer and the transport jig is stronger than the adhesive force between the intermediate layer and the adhesive layer.

  In this transport jig, a transport jig characterized in that the intermediate layer has a laminated structure is used.

Regarding the adhesive layer formed on the surface of the conveying jig on which the substrate for manufacturing the printed wiring board is placed, the adhesive layer is in the form of a sheet,
The conveyance jig is characterized in that the adhesion of the adhesive layer to the surface in contact with the conveyance jig is physical adhesion without using an adhesive.

  Regarding the adhesive layer formed on the surface of the conveying jig on which the substrate for manufacturing the printed wiring board is placed, the adhesion of the adhesive layer to the surface in contact with the conveying jig does not use an adhesive. A conveyance jig characterized by adhesion is used.

  Regarding the adhesive layer formed on the surface of the conveyance jig on which the substrate for manufacturing the printed wiring board is placed, the adhesion area between the adhesive layer and the surface in contact with the conveyance jig is A conveyance jig characterized by being smaller than the contact area is used.

  A mounting method for mounting a component on a substrate using the transfer jig described in any of the above is used.

  A mounting system that mounts a component on a board using the transfer jig described above is used.

  According to the first aspect of the present invention, the substrate is held in a sealed structure that is provided with an opening on the surface of the plate on which the substrate is placed and can be directly connected to the opening to maintain a reduced pressure state. Therefore, it is possible to realize good conveyance that can suppress the occurrence of manufacturing problems in the manufacturing process of the printed wiring board. The transfer jig is hard to get dirty with paste and can be wiped off even if it gets dirty. Unlike the case of holding with an adhesive, there is little deterioration and change with time, and less maintenance is required.

  According to the invention of claim 2, the suction force at the portion of the substrate transport jig corresponding to the central portion of the substrate is larger than the suction force at the portion corresponding to the peripheral portion of the substrate. Since the described substrate transport jig is used, the same operation as the operation of the transport jig according to claim 1 is achieved. In addition, since the substrate can be held without using the transfer jig, it is difficult to cause defects in the printing process, the mounting process, and the reflow process.

  According to the invention according to claim 3, the suction opening is arranged at a position corresponding to the pattern of the substrate. In addition to the effects of 1 and 2, the substrate can be fixed without being soiled or distorted according to the pattern of the printed wiring board on the jig. A substrate 9 with stable quality can be produced.

  According to the invention of claim 4, the size of the opening is equal to or less than the width of the pattern. It becomes possible to make it favorable without generating. Holds the slack of the substrate due to suction to the minimum, and allows good printing, mounting, and reflow.

  According to the invention which concerns on Claim 5, in the conveyance jig which mounts the board | substrate for manufacturing a printed wiring board, it consists of the intermediate | middle layer formed in the surface, and the adhesion layer on the said intermediate | middle layer upper part. Therefore, the operation similar to the operation by the conveyance jig according to the first aspect is exhibited. Since the replacement can be performed simply by replacing the intermediate body, maintenance of the transport jig can be simplified, and the transport jig 1 can be used without waste. It can respond to product changeover in a short time.

  According to the invention according to claim 6, since the adhesive force between the intermediate layer and the conveying jig is stronger than the adhesive force between the intermediate layer and the adhesive layer, the conveying jig according to claim 5, The exchange of the intermediate is easy and the maintenance is easy. Occurrence of defects can be prevented by frequent replacement.

  According to the invention of claim 7, since the intermediate layer has a laminated structure, the transfer jig according to claim 6, the replacement of the intermediate body is facilitated, and the maintenance is easy. The occurrence of defects can be prevented by frequently changing the intermediate layer.

  According to the invention which concerns on Claim 8, regarding the adhesion layer formed in the surface of the conveyance jig which mounts and hold | maintains the board | substrate for manufacturing a printed wiring board, the said adhesion layer is a sheet form, The said adhesion layer Since the conveyance jig is characterized in that the adhesion to the surface in contact with the conveyance jig is physical adhesion without using a pressure-sensitive adhesive, the adhesive layer can be easily replaced and maintenance is easy. Occurrence of defects can be prevented by frequent replacement.

  According to the ninth aspect of the present invention, with respect to the adhesive layer formed on the surface of the transport jig for mounting and holding the substrate for manufacturing the printed wiring board, the surface of the adhesive layer that contacts the transport jig; Since the transfer jig is characterized in that the adhesion is physical adhesion without using an adhesive, the adhesive layer can be easily replaced and maintenance is easy. Occurrence of defects can be prevented by frequently exchanging the adhesive layer.

  According to the invention which concerns on Claim 10 and 11, regarding the adhesion layer formed in the surface of the conveyance jig which mounts the board | substrate for manufacturing a printed wiring board, the surface which contact | connects the said conveyance jig of the said adhesion layer, Since the transfer jig is characterized in that the adhesive area is smaller than the contact area between the adhesive layer and the adhesive layer, the adhesive layer can be easily exchanged and maintenance is easy. Occurrence of defects can be prevented by frequent replacement.

  According to the eleventh aspect of the present invention, since the mounting method is to mount the component on the substrate using the transport jig 1 according to any one of the first to tenth aspects, it is possible to suppress the occurrence of manufacturing defects. It is a good mounting method.

  According to the invention of claim 12, since it is a mounting system that mounts components on a board using the transport jig according to any one of claims 1 to 10, it is possible to suppress the occurrence of manufacturing defects. Can be implemented.

(Embodiment 1)
Embodiments of the present invention will be described below with reference to the drawings. 1 to 9 are schematic views of a conveying jig shown as the first embodiment of the present invention. 1 is a schematic plan view of the transport jig, FIG. 2 is a cross-sectional view of FIG. 1, FIGS. 3 and 4 are diagrams showing the substrate surface of the transport jig, and FIGS. 5 and 6 are diagrams of the transport jig. FIGS. 7, 8, and 9 showing the structure are diagrams showing an example in which a substrate is mounted using a transfer jig.

  Reference numeral 1 shown in FIG. 1 is a conveying jig. The jig 1 has a stopper 12 on a side surface and holds a substrate 9 on the upper surface thereof. The substrate 9 is a sheet-like thin substrate. A flexible printed circuit board is assumed. As shown in FIG. 2, the transport jig 1 has a suction path 14 connected to the opening 13, and sucks the stopper 12 to hold the substrate 9 in the transport jig 1 in a reduced pressure state. As shown in the top view of the conveying jig 1 in FIG. 3A, the opening 13 is formed in a digging manner in accordance with the outer shape of the substrate 9 to be held.

  As the pattern of the openings 13, a plurality of small circular shapes may be formed as shown in FIG. Moreover, you may exclude a certain part like FIG.3 (c). In this case, as shown in FIG. 3D, it is necessary to prevent the portion from becoming dirty with the electrode 19 for connection with other members of the substrate 9. The connection electrode 19 is connected to other members and the substrate. The voltage is concentrated and migration is likely to occur due to impurities, dirt, moisture, and the like. If the size of the hole is large, the substrate 9 is dented. Therefore, the size of the various patterns of the substrate 1 is not more than about 100 microns, more preferably not more than half of the pattern and not more than 50 microns.

  The pattern of the opening holes will be described with reference to FIG. FIG. 4 shows an opening hole pattern of the conveying jig 1. A substrate 9 is placed on the upper portion, and a mounting process is executed. If the area density of the opening holes is increased, the substrate 9 is strongly sucked, but the substrate 9 is soft and may be wrinkled at the center and end portions thereof. Therefore, there is an opening hole pattern shown in FIG.

  4 (a) to 4 (g), the opening 13 is provided on the printing start side where the squeegee first hits in the printing process. A large total area of the opening 13 is provided on the start side. The other portion is additionally provided with an opening 13 from the starting portion toward the opposite side. 4 (a) to 4 (g) can be used. From FIG. 4 (d) and FIG. 4 (e), other than that is preferable. This is because there are two systems of openings 13 in parallel, and wrinkles are likely to occur due to the difference in suction force. If many are provided, the substrate 9 is wrinkled. If it is less, the substrate 9 is displaced from the transport jig 1 when the squeegee is separated in the printing process. As shown in FIG. 4G, it is more difficult for the substrate 9 to be wrinkled when many small ones are provided.

  Next, the operation will be described. The substrate 9 is set on the conveying jig 1 and is sucked and held from the stopper 12. Thereafter, the stopper 12 is closed. Thereafter, in this state, a solder paste pattern is formed on the substrate 9 by a screen printer. When printing paste adheres to a place other than the substrate 9 of the conveying jig 1 during printing, the adhesive layer 22 has conventionally not been wiped off, but the conveying jig 1 does not have the adhesive layer 22. , You can remove the attached material. Conventionally, when the adhesive layer 22 protrudes from the substrate 9, when printing while pressing the substrate 9 in the printing process, the adhesive layer 22 becomes a cushion, and the substrate 9 sinks into the adhesive layer 22. The adhesive layer 22 becomes the printing surface, and the printing paste may adhere, but this conveyance jig 1 does not have the adhesive layer 22 and has no cushioning property, so this does not occur.

  Thereafter, in the mounting process, components are mounted thereon by a mounting machine. Finally, in the reflow process, the substrate 9 together with the transfer jig is heat-treated in a reflow furnace. As a result, the component and the substrate 9 are joined by solder. During this time, the substrate 9 is held by the transport jig 1 in a sucked state. Thereafter, the vacuum is released from the stopper 12 and the substrate 9 is removed from the transport jig 1. When the substrate 9 is physically firmly attached to the transfer jig 1, the substrate 9 can be easily taken out of the transfer jig 1 by lightly blowing air from the stopper 12.

  After the printing process and the mounting process, it is better to suck the substrate 9 again from the stopper 12 in order to suck the substrate 9 again by the conveying jig 1. Further, it is further preferable that a hose or the like is connected to the stopper 12 and sucked continuously.

  As described above, according to the transport jig 1 according to the present embodiment, the substrate 9 is held by suction. Accordingly, it is possible to suppress problems caused by the adhesive adhesive when the cream 9 is applied to the surface of the substrate 9 while the substrate 9 is held on the surface of the jig 1. Thereby, in the process of bonding electronic components to the surface of the substrate 9, it is possible to suppress the occurrence of manufacturing defects such as bonding defects. In addition, since the substrate 9 can be removed from the transport jig 1 simply by releasing the suction with the stopper, the time for removing or removing the substrate 9 is shortened.

  Moreover, the arrangement of the opening of the conveying jig 1 is made nectar at the center so that the suction force at the center is larger than the periphery. Thereby, when sticking the board | substrate 9 to the conveyance jig 1, it can be made not to wrinkle the board | substrate 9. FIG. Defects are difficult to make in the printing and mounting process.

  Further, an opening is provided in the printing start portion of the conveying jig 1. As a result, in the printing process, printing can be performed without causing the substrate 9 to be rubbed under a firm pressure, and defects do not occur.

  There are various methods for producing the conveying jig 1. You may cast by a metal mold | die, process an outer dimension, and drill. A simple manufacturing method will be described with reference to FIGS. The upper part and the lower part are created separately and combined. On the conveying jig 1-1, a suction hole is drilled in a plate. The lower conveyance jig 1-2 is formed by cutting a metal plate, but the plate may be bonded and welded or bonded. The conveying jig 1 can be easily produced by combining the two together with rubber or the like.

  Next, a mounting system will be described.

  FIG. 7 is a plan view showing a state in which the substrate 9 is held on the transport jig 1. Note that wiring of a plurality of substrate pieces 91 is collectively formed on the substrate 9. Each substrate piece 91 is mounted with an IC package (a mounting target may be various electronic components such as an IC bare chip, a capacitor, a resistor, a coil, and a connector, and hereinafter collectively referred to as “electronic component”). Mounting area 91a. Positioning marks 90 are formed at the four corners of the substrate 9.

  FIGS. 8 and 9 are front views showing the mounting system 5 that mounts electronic components on the mounting area 91a of the board piece 91 in a state where the board 9 is held by the transport jig 1. FIG. The mounting system 5 includes, from upstream, a loader 51 for placing the substrate 9 on the conveying jig 1, a printing device 52 for printing solder paste on the substrate 9, a mounting device 53 for mounting electronic components on the substrate 9, and melting of the solder paste. And a reflow device 54 for solidifying and fixing the electronic component to the substrate 9, an unloader 55 for peeling the substrate 9 from the transport jig 1, and a cleaning device 56 for cleaning the transport jig 1. A conveyor 61 for the forward path of the conveying jig 1 is disposed approximately at the center of each apparatus, and a conveyor 62 for the backward path is disposed below each apparatus.

  In the loader 51, a plurality of trays 951 are stored in a storage device 95 in a state of being stacked one above the other, and the substrate 9 is placed on each tray 951. The loader 51 includes an elevating mechanism 511 that moves the storage device 95 up and down, a protruding mechanism 512 that takes in and out one tray 951 from the storage device 95, a transfer mechanism 513 that takes out the substrate 9 from the protruding tray 951 by suction suction, and A transport jig moving mechanism 514 that moves the transport jig 1 from the end point of the return path conveyor 62 to the start point of the forward path conveyor 61 is provided.

  The holding surface 5131 for holding the substrate 9 of the transfer mechanism 513 is a flat surface in which a large number of openings 13 are formed. The transfer mechanism 513 takes out the substrate 9 from the tray 951 by suction suction, and then on the conveyor 61. A substrate 9 is placed on the transfer jig 1. At this time, while positioning is performed with reference to the mark 90 on the substrate 9 of the transport jig 1, the holding surface 5131 descends and presses the entire substrate 9 toward the transport jig 1 with a predetermined pressure. Accordingly, the entire substrate 9 is held in the decompressed state in the opening 13 of the transport jig 1. The transport jig 1 holding the substrate 9 is transported to the printing device 52 by the conveyor 61.

  The printing apparatus 52 positions and holds the conveying jig 1 with reference to the positioning mark 90 (that is, by inserting a pin) and pushes it up toward the upper screen mask 522, and the screen mask. A printing mechanism 523 for reciprocally moving the solder paste on 522 with a squeegee 5231 is provided. The printing mechanism 523 reciprocates the squeegee 5231 while the substrate 9 on the conveying jig 1 is in contact with the screen mask 522, so that the solder paste adheres to the substrate 9 from the holes formed in the screen mask 522. The board 9 on which the solder paste is printed descends together with the conveying jig 1 and is conveyed to the mounting device 53 by the conveyor 61.

  In addition, since the substrate 9 is uniformly held by the conveying jig 1 regardless of the layout of the substrate piece 91, the regions where the electrodes on the front and back surfaces of the substrate 9 are exposed, the distribution of the insulating regions, and the like, it is possible to prevent deterioration in print quality. Is done.

  The mounting device 53 includes a holding mechanism 531 that holds the transport jig 1 with the mark 90 as a reference, and a mounting mechanism 532 that mounts an electronic component on the substrate 9 on the transport jig 1. The mounting mechanism 532 has a plurality of nozzles 5321 for sucking and adsorbing electronic components, and a nozzle moving mechanism 5322 for moving the nozzle 5321 in the horizontal plane and moving up and down, and a supply mechanism (not shown) (on the tape or The electronic component is received from a mechanism for arranging and preparing the electronic component on the tray), and the electronic component is mounted on the solder paste on the substrate 9. The substrate 9 on which the electronic components are mounted is transported by the conveyor 61 together with the transport jig 1 to the reflow device 54 shown in FIG.

  The reflow device 54 includes a heating unit 541 that performs preheating and main heating on the substrate 9 that is transported by the conveyor 61 while being held by the transport jig 1, and a cooling unit 542 that cools the substrate 9 with air. Prepare. The substrate 9 is heated and cooled while being conveyed, the solder paste is melted and solidified, and the electronic component is fixed onto the substrate 9. As shown in FIG. 7, since the entire substrate 9 is in the state of being attracted to the opening 13 of the transport jig 1, even if heating with hot air or cooling with cold air is performed, a part of the substrate 9 is The peeling from the opening 13 is prevented. After the reflow, the substrate 9 is transferred to the unloader 55 together with the transfer jig 1.

  The unloader 55 includes a holding mechanism 551 that holds the transport jig 1, a transfer mechanism 552 that receives the substrate 9 from the transport jig 1, a lifting mechanism 553 that lifts and lowers the storage device 96 that stores the substrate 9, and the storage device 96. A protruding mechanism (not shown) for inserting and removing the tray is provided. A plurality of trays are stacked in the container 96 in a vertical direction, the protruding mechanism protrudes the tray, and the transfer mechanism 552 receives the substrate 9 from the transport jig 1 and places the substrate 9 on the tray, and then protrudes. The mechanism pulls the tray into the container 96.

  Even when the entire substrate 9 is sucked into the opening 13 of the conveying jig 1 by the above operation, most of the substrate 9 is peeled off by the air. Thus, it is possible to safely peel the substrate 9 from the transfer jig 1 without excessive force acting on the substrate.

  The transport jig 1 from which the substrate 9 has been peeled is transported to the cleaning device 56 by the conveyor 61 as shown in FIG. The cleaning device 56 includes a cleaning mechanism 561 that cleans the transport jig 1 and a transport jig moving mechanism 562 that moves from the end point of the forward conveyor 61 to the start point of the return conveyor 62. The cleaning mechanism 561 unwinds the cloth from the cloth roll 5611 wound around the cloth to which the cleaning liquid is applied, contacts the cloth against the adhesive layer 22 of the conveying jig 1 with the roller 5612, and then places the cloth on the shaft 5613. Turn to collect. Thereby, the dust adhering to the adhesion layer 22 is removed. The cleaned transfer jig 1 is lowered by the transfer jig moving mechanism 562 and moved to the conveyor 62, and is transferred from the cleaning device 56 to the loader 51, and is transferred to the conveyor 61 by the transfer jig moving mechanism 514 of the loader 51. Moving.

  As described above, since the conveying jig 1 holds the entire substrate 9 by suction, it is possible to prevent the substrate 9 from being peeled off from the conveying jig 1 when mounting electronic components. Screen printing can be performed easily. Furthermore, the mounted substrate 9 can be easily peeled off from the conveying jig 1 by utilizing the ejection of air. As a result, by using the transfer jig 1, it is possible to easily handle the substrate 9 in the entire mounting line.

(Embodiment 2)
The second embodiment of the present invention will be described below with reference to the drawings. FIG. 10 is a cross-sectional view of the conveying jig 1 shown as the second embodiment of the present invention.

  The conveying jig 1 has an intermediate layer 21 on its upper surface, and further has an adhesive layer 22 on the upper portion thereof. The substrate 9 is bonded to the adhesive layer 22. Various kinds of intermediate layers 21 can be used. For example, in the case of a silicon rubber sheet, no adhesive is required, and it can be physically attached to the conveying jig 1, and an adhesive can be formed thereon. In addition to silicon rubber, a fluorine-based rubber sheet may be used as long as it can be firmly adsorbed on the surface of the conveying jig 1 and is flexible. The adhesive layer 22 may be formed on silicon rubber and attached to the conveying jig 1. If the adhesive force between the intermediate layer 21 and the conveying jig 1 is stronger than the adhesive force between the intermediate layer 21 and the adhesive layer 22, the intermediate layer 21 and the conveying jig 1 are firmly attached in the mounting, printing, and reflow processes. If the intermediate layer 21 is not a rubber sheet but a multilayered sheet such as a multi-layer sheet or a cover tape, when the adhesive layer 22 is re-formed, one sheet can be peeled off to regenerate. it can. Various devices having good adhesion, tape covering products, and a stack of 50 sheets with a thickness of about 80 microns were used. A heat-resistant tape and a polyimide tape were used. The multilayer sheet is applied to a highly accurate metal plate, and an adhesive layer is formed thereon.

  Next, the operation will be described. As shown in FIG. 10, the substrate 9 is set and affixed and held on a conveying jig 1 having an intermediate layer 21 and an adhesive layer on its surface. Thereafter, in this state, a solder paste pattern is formed by screen printing in the same manner as in the first embodiment. After that, the component is mounted by a mounting machine, and finally heat-treated in a reflow furnace, so that the component and the substrate 9 are soldered. Are joined together.

  There are various methods for producing the conveying jig 1. The silicon rubber which is the intermediate layer 21 is placed on the plate whose surface is polished while being pressed so that air does not enter. Since air does not enter between the intermediate layer 21 and the metal plate, the intermediate layer 21 adheres to the metal plate without an adhesive. On top of that, in order to produce the adhesive layer 22, an adhesive paste is applied and dried to produce the adhesive layer 22. A liquid in which an adhesive material is dissolved in a solvent is applied and dried to form the adhesive layer 22.

  The transfer jig 1 may be one that can hold the substrate in the reduced pressure state described in the first embodiment, and the silicon rubber that is the intermediate layer 21 may be fixed under reduced pressure, and the adhesive layer 22 may be placed thereon.

  As described above, according to the transport jig 1 according to the present embodiment, the adhesive layer 22 on the upper side thereof holds the substrate 9 through the intermediate layer 21. Thereby, in the state which hold | maintained the board | substrate 9 on the said jig | tool 1 surface, when passing through the process of apply | coating cream solder to the surface, or the process of forming the board | substrate 9, the malfunction by an adhesive adhesive is suppressed. It becomes possible. Thereby, in the process of bonding electronic components to the surface of the substrate 9, it is possible to suppress the occurrence of manufacturing defects such as bonding defects. Further, since the adhesive layer 22 can be formed again by simple replacement of the intermediate layer 21, the cost for manufacturing the entire transport jig 1 can be reduced. Manufacturing time is shortened.

(Embodiment 3)
The third embodiment of the present invention will be described below with reference to the drawings. 11 (a), 11 (b), and 11 (c) are cross-sectional views of the conveying jig 1 shown as the third embodiment of the present invention.

  The conveying jig 1 has an adhesive body 23 that is an adhesive layer on its upper surface. The substrate 9 is held on the adhesive 23. Various things can be used for the adhesive body 23. For example, in the case of a silicon rubber sheet, an adhesive is not required and can be attached to the conveying jig 1, and an adhesive layer can be formed thereon. An adhesive may be applied to the silicon rubber and attached to the conveying jig 1.

  The adhesive force on the side contacting the substrate 9 of the pressure-sensitive adhesive body 23 was made stronger than that on the conveying jig 1 side. By doing so, it is possible to execute a process of remounting the substrate 9 on the adhesive body 23 and mounting components on the substrate 9 in a state where the adhesive body 23 is firmly fixed to the transport jig 1, and transporting the adhesive body 23. It can be easily removed from the tool 1. Conventionally, since the substrate 9 is fixed to the transport jig 1 with an adhesive material, the adhesive remains on the transport jig 1 and cannot be easily removed. In this case, even if the adhesive 23 is peeled off and the adhesive remains, the adhesive 23 can be peeled from the adhesive.

  Adhesion of the pressure-sensitive adhesive body to the surface in contact with the conveying jig 1 is physical adhesion without using a pressure-sensitive adhesive. In order to do this, for example, the surface unevenness of the pressure-sensitive adhesive body was changed, and the side in contact with the substrate 9 was set to have a larger area than the conveying jig 1 side. In addition, an adhesive may be used on the surface of the pressure-sensitive adhesive body, but by adjusting the amount of the pressure-sensitive adhesive, the adhesive force on the side of the pressure-sensitive adhesive body 23 that comes into contact with the substrate 9 is made weaker than the conveyance jig 1 side. It was carried out.

  As shown in FIG. 11B, if the concave portion 24 on the surface of the adhesive 23 that contacts the substrate 9 has a sealed structure, a vacuum state is maintained between the concave portion 24 of the sealed structure and the substrate 9. When the substrate 9 is pushed into the adhesive 23, the substrate 9 can be firmly fixed to the adhesive 23 as in the first embodiment. What is necessary is just to affix, pushing out from the edge part of the board | substrate 9 using a roller etc. and taking out the air of the recessed part 24. FIG. If the size of the opening of the concave portion 24 is large, the substrate 9 is dented. Therefore, the size of the various patterns of the substrate 9 is not more than about 100 microns, more preferably not more than half the pattern and not more than 50 microns.

  As the conveying jig 1, a material that can hold the substrate in the reduced pressure state described in the first embodiment may be used, and the silicon rubber as the adhesive body 23 may be fixed under reduced pressure.

  Moreover, as shown in FIG.11 (c), it is still more preferable to give an unevenness | corrugation to the surface which contacts the adhesion body 23 of the conveyance jig 1, and to fix the adhesion body 23 firmly. It is more preferable that the adhesive body 23 is fixed on the back surface of the conveying jig 1 as the unevenness by passing through the conveying jig 1.

  Next, the operation will be described. As shown in FIGS. 11 (a), 11 (b), and 11 (c), the substrate 9 is set and affixed to and held by a transport jig 1 having an adhesive body 23 on its surface. Thereafter, in this state, similarly to the first embodiment, a solder paste pattern is formed by screen printing, and then the component is mounted by a mounting machine. Finally, the component and the substrate 9 are soldered by heat treatment in a reflow furnace. Are joined together.

  As described above, according to the transport jig 1 according to the present embodiment, the substrate 9 is held on the upper part through the adhesive 23. Thereby, in the state which hold | maintained the board | substrate 9 on the said jig | tool 1 surface, when passing through the process of apply | coating cream solder to the said surface, or the process of forming the board | substrate 9, etc., the malfunction by an adhesive adhesive is suppressed. It becomes possible to do. Thereby, in the process of bonding electronic components to the surface of the substrate 9, it is possible to suppress the occurrence of manufacturing defects such as bonding defects. Further, since the adhesive layer can be re-formed by the adhesive body, the cost for manufacturing the entire transport substrate 9 can be reduced.

  In the above embodiment, the degree of adhesion is adjusted by the surface roughness, but the adjustment of the degree of adhesion changes the shape of the unevenness of the adhesive surface (for example, a sharp convex shape or a rounded convex shape). May be changed. That is, the degree of adhesion may be changed by making the characteristics of the unevenness pattern for adjusting the degree of adhesion different.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.

  For example, although the conveyance jig 1 is suitable for holding a flexible substrate, the held substrate may be a highly rigid plate-like substrate (for example, a substrate formed of glass epoxy or semiconductor). Good.

  The adhesive material is not limited to silicon rubber or polyurethane rubber, and other materials may be used. Examples of other preferable materials include fluororubber. Since fluororubber has a high mold releasability, the stickiness (or adhesion) is improved by processing the surface into a mirror surface in actual use. For example, the degree of adhesion of the surface of the fluororubber is adjusted by forming fine grooves on the mirror surface. When silicon rubber is used, siloxane acid gas is generated by heating, and there is a possibility that the substrate may be affected by the deposition of insulating siloxane acid. Preventing is realized.

  The present invention relates to a suitable conveying jig 1 and a holding and conveying method in a step of mounting an electronic component or the like on a surface of a thin printed wiring board such as a flexible printed wiring board or a step of manufacturing the printed wiring board. Is.

Model explanatory drawing of the conveyance jig in 1st Embodiment of this invention. The figure which shows the cross section of the conveyance jig shown in FIG. Model explanatory drawing of the conveyance jig in 1st Embodiment of this invention. (A)-(g) Model explanatory drawing of the conveyance jig in 1st Embodiment of this invention. Model explanatory drawing of the conveyance jig in 1st Embodiment of this invention. Model explanatory drawing of the conveyance jig in 1st Embodiment of this invention. Model explanatory drawing of the conveyance jig in 1st Embodiment of this invention. Model explanatory drawing of the mounting system using the conveyance jig in 1st Embodiment of this invention Model explanatory drawing of the mounting system using the conveyance jig in 1st Embodiment of this invention Model explanatory drawing of the conveyance jig in 2nd Embodiment of this invention (A)-(c) Model explanatory drawing of the conveyance jig in 3rd Embodiment of this invention. FIG. 8 shows a conventional conveying jig. The figure which shows the cross section of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer jig 9 Board | substrate 12 Stopper 13 Opening part 14 Suction way 15 Outline of board

Claims (13)

A substrate transfer jig having an opening on a surface on which a substrate is placed, wherein the substrate has a hermetically sealed structure that can be directly connected to the opening and maintain a reduced pressure state. 2. The substrate transport jig according to claim 1, wherein a suction force at a portion of the substrate transport jig corresponding to the central portion of the substrate is larger than a suction force at a portion corresponding to the peripheral portion of the substrate. The conveying jig according to claim 1, wherein the opening is disposed at a position corresponding to the pattern of the substrate. The conveying jig according to claim 1, wherein the size of the opening is equal to or less than the width of the pattern. In the transfer jig to place the substrate,
A conveying jig comprising an intermediate layer formed on the surface and an adhesive layer formed on the intermediate layer. The conveyance jig according to claim 5, wherein an adhesion force between the intermediate layer and the conveyance jig is stronger than an adhesion force between the intermediate layer and the adhesion layer. The conveyance jig according to claim 5, wherein the intermediate layer has a laminated structure. Regarding the adhesive layer formed on the surface of the transfer jig on which the substrate is placed,
The adhesive layer is in the form of a sheet,
The conveyance jig characterized in that the adhesion of the adhesive layer to the surface in contact with the conveyance jig is physical adhesion without using an adhesive. Regarding the adhesive layer formed on the surface of the transfer jig on which the substrate is placed,
The conveyance jig characterized in that the adhesion of the pressure-sensitive adhesive layer to the surface in contact with the conveyance jig is physical adhesion without using an adhesive. Regarding the adhesive layer formed on the surface of the transfer jig on which the substrate is placed,
A conveyance jig, wherein an adhesion area between the adhesive layer and a surface in contact with the conveyance jig is smaller than a contact area between the adhesion layer and the adhesion layer. Regarding the adhesive layer formed on the surface of the transfer jig on which the substrate is placed,
A conveyance jig characterized by having a concave portion with a sealed structure on a surface of the adhesive layer that contacts the conveyance jig. The mounting method which mounts components in a board | substrate using the conveyance jig in any one of Claims 1-11. The mounting system which mounts components in a board | substrate using the conveyance jig in any one of Claims 1-11.

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