JP2005251630A - Sealing type display panel, sealing type display panel substrate, and manufacturing method of sealing type display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To secure airtightness of a sealing part in which a display part is formed, and maintain superior display performances. <P>SOLUTION: In the sealing type display panel provided with the sealing part to seal the display part formed on a support substrate 11 from the open air and in which a lead wiring 12 drawn from the display part to an outside of the sealing part is wired on the support substrate 11, a flattening layer 13 to flatten a convexo-concave pattern of the lead wiring 12 is installed on the lead wire 12 corresponding to an adhering region of the sealing part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a sealed display panel, a sealed display panel substrate, and a method for forming a sealed display panel.

  Various types of display panels, such as liquid crystal display (LCD) panels, plasma display panels (PDP), and organic EL (electroluminescence) display panels, have been developed as display panels on a substrate. ing.

  Some of these display panels have a common structure in that the display portion is formed in a sealed portion that is shielded from the outside air, although the display principle is different. For example, in the case of an LCD panel, a sealing portion for holding liquid crystal is formed between the substrates, and in the case of a PDP, a sealing portion for forming a discharge space is formed. In addition, since the display performance of the organic EL panel is deteriorated when the components of the organic EL element are exposed to the outside air (particularly moisture), a sealing portion is formed to block the organic EL element from the outside air. ing.

  In a display panel in which such a display portion is formed in the sealing portion (hereinafter referred to as a sealing display panel), the electrode of the display portion formed in the sealing portion is drawn out of the sealing portion. The lead-out wiring is formed so as to be drawn out on the support substrate outside the sealing portion across the adhesion region forming the sealing portion on the support substrate.

The following Patent Document 1 shows the structure of the lead-out wiring in the organic EL panel as shown in FIG. 1 (FIG. 1 (a) is a plan view, FIG. 1 (b) is a cross-sectional view taken along line I-I, FIG. (C) shows a II-II sectional view.) In the organic EL panel J, a display portion J2 made of an organic EL element is formed on a glass substrate J1, and a lead-out wiring J3 drawn out from the display portion J2 is wired toward, for example, one side of the glass substrate J1. An adhesive region J5 is formed around the display portion J2 so as to cross the lead wire J3, and the dummy pattern Jd is formed in a range not crossing the lead wire J3 in the bond region J5. Is formed. According to this, the uniform thickness of the adhesive layer J5 ₁ to form a bonding area J5, sealing member J4 is adapted to be adhered on the adhesive regions J5 that is flat throughout. In this example, adhesive is used that spacer J5 ₂ are mixed in the adhesion area J5.

JP 2001-189190 A

In the conventional example described above, it is possible to prevent inclination of the sealing member J4 to a uniform thickness of the adhesive layer J5 _1. However, as shown in FIG. 1C, because the lead-out wiring J3 is drawn across the adhesion region J5, the adhesion region J5 has to be formed on the concavo-convex pattern of the lead-out wiring J3. This is not limited to the conventional organic EL panel, and the above-described various sealing display panels also require a structure in which an adhesive region is formed on the concave / convex pattern of the lead wiring.

In such a lead wiring structure, there is a concern about the problem of airtightness deterioration due to bubbles as shown in FIG. That is, when forming the adhesive layer J5 ₁ on the uneven pattern of the lead wire J3, fine bubbles p contained in the adhesive layer J5 ₁ under the influence of the ambient pressure changes or the like at the time of panel formation the lead wiring J3 A phenomenon of gathering at the corner with the support substrate J1 occurs. When the bubbles p are thus focused on the corners of the lead-out wiring J3 and the support substrate J1, a continuous bubble line along the lead-out wiring J3 is formed, and the lead-out wiring J3 forms an adhesive region. Since they are traversing, this bubble line creates a condition that substantially narrows the width of the bonded area.

  As a result, in a sealed display panel having a conventional lead-out wiring structure, particularly when there is a pressure difference between the inside and outside of the sealed portion, sealing is performed when the width of the adhesive region is substantially narrowed due to the above-described bubbles. There is a problem in that the breakage of the stop occurs, and effective airtightness in the sealing portion cannot be obtained.

  In particular, in the organic EL panel, when the hermeticity of the sealing portion is lowered, the performance deterioration of the organic EL element forming the display portion is advanced, so that there is a problem that the panel life and the display performance are lowered.

  This invention makes it an example of a subject to cope with such a problem. That is, in the sealing type display panel, it is an object of the present invention to ensure the airtightness of the sealing portion where the display portion is formed and to maintain good display performance.

  In order to achieve such an object, the present invention comprises at least the configurations according to the following independent claims.

  [Claim 1] Sealing provided with a sealing portion for blocking a display portion formed on a support substrate from outside air, and a lead-out wiring led out of the sealing portion from the display portion is wired on the support substrate In the type display panel, a flattening layer for flattening the concavo-convex pattern of the lead-out wiring is provided on at least the lead-out wiring corresponding to the adhesion region of the sealing portion.

  [Claim 4] A sealed display panel substrate comprising a display unit sealed by a sealing unit and wired with a lead-out line led out from the display unit to the outside of the sealing unit. A sealing type display panel substrate, wherein a flattening layer for flattening the concave-convex pattern of the lead-out wiring is provided on the lead-out wiring corresponding to the adhesion region of the stopper.

  [Claim 5] A sealing device comprising a sealing portion that shields a display portion formed on a support substrate from outside air, and a lead-out wiring led out from the sealing portion from the display portion is wired on the support substrate. In the method for forming a mold-type display panel, at the same time as the step of forming the lead-out wiring on the support substrate and the insulating film formed on the display portion, at least on the lead-out wiring corresponding to the adhesion region of the sealing portion And a step of forming a flattening layer for flattening the concavo-convex pattern of the lead-out wiring.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 3 is an explanatory diagram showing a configuration of a sealed display panel according to an embodiment of the present invention. The sealed display panel 1 includes a sealed portion that shields the display portion 1A formed on the support substrate 11 (sealed display panel substrate 10) from outside air, and is drawn out of the sealed portion from the display portion 1A. It is assumed that the extracted wiring 12 is wired on the support substrate 11. In the example shown here, the sealing portion is formed by bonding the sealing member 14 to the support substrate 11 via the adhesive region 15, but the display portion is not limited to this and is formed on the support substrate 11. Any structure that can block 1A from outside air may be used.

  FIG. 4 shows an enlarged cross section of a portion A in FIG. As shown in the figure, the sealed display panel 1 according to the embodiment of the present invention is flattened so as to flatten the concave / convex pattern of the lead-out wiring 12 on at least the lead-out wiring 12 corresponding to the adhesion region 15 of the sealing portion. The layer 13 is provided. That is, the planarization layer 13 is formed on the lead-out wiring 12 corresponding to the adhesion region 15, and the adhesive layer 15A that forms the adhesion region 15 is formed on the planarization layer 13, and the adhesive layer 15A The support substrate 11 and the sealing member 14 are bonded together.

  If necessary, a surface 13A to be polished by a polishing process is formed on the surface of the planarizing layer 13, and an adhesive layer 15A of an adhesive region 15 is formed on the surface 13A to be polished.

  Therefore, when the configuration is shown by paying attention to the above-described sealing type display panel substrate 10, the display portion 1A sealed by the sealing portion is provided, and the lead-out wiring 12 drawn out of the sealing portion from the display portion 1A. Is a substrate on which is provided a flattening layer 13 for flattening the concavo-convex pattern of the lead-out wiring 12 on at least the lead-out wiring 12 corresponding to the adhesion region 15 of the sealing portion.

  According to the sealed display panel 1 or the sealed display panel substrate 10 according to such an embodiment, the adhesive region 15A formed by the adhesive layer 15A is formed on the surface of the planarizing layer 13, so The concave / convex pattern of the lead-out wiring 12 does not enter. Therefore, even if fine bubbles are present in the adhesive layer 15A, they do not converge linearly, and good airtightness corresponding to the width in which the adhesive region 15 is formed can be ensured.

Here, it goes without saying that it is necessary to select a material that does not generate bubbles for the planarizing layer 13 and to cover the lead-out wiring 12, so that an insulating material is naturally selected. Further, considering the formation of the adhesive layer 15A on the surface, it is desirable to select a material having excellent adhesiveness with the adhesive. From the above viewpoint, insulating materials such as SiN and SiO ₂ can be cited as appropriate materials.

  FIG. 5 is an explanatory view showing a method for forming such a sealed display panel (the reference numerals of the respective parts in the sealed display panel shown in the following description are based on FIG. 3 or FIG. 4). . First, a preparatory step (S1) is performed on the support substrate 11 to perform pre-processing such as cleaning, polishing, and coating. Film and patterning) are performed (S2). The lead-out wiring 12 can be formed simultaneously with the electrode formation of the display portion 1A.

  Next, the insulating film in the display portion 1A and the above-described planarization layer 13 are formed (film formation and patterning) on the support substrate 11 on which the electrodes and the lead wirings 12 are formed (S3). The insulating film here is formed for the purpose of partitioning the display unit in the display unit 1A, etc., and has a function of insulating electrodes that should be arranged independently in the display unit 1A. It has various forms depending on the type of the stationary panel. As described above, it is necessary to select a material having an insulating property for the planarizing layer 13, but it is effective without increasing the number of steps by simultaneously forming the same material as the insulating film formed on the display portion 1 </ b> A. A smooth planarizing layer 13 can be formed.

  Thereafter, other elements of the display unit 1A are formed as needed (S4), and then a sealing unit for blocking the display unit 1A from outside air is formed (S5). As described above, the sealing portion is formed by bonding the support substrate 11 and the sealing member 14 by forming the adhesion region 15 on the planarizing layer 13 or the like.

  According to such a method for forming the sealed display panel 1, the planarization layer 13 can be formed without any particular process addition to the conventional process for forming the sealed display panel. It is possible to obtain the sealed display panel 1 that can ensure the airtightness of the display.

  Hereinafter, specific examples of the sealed display panel of the present invention will be described using an organic EL panel as an example. However, the embodiment of the present invention is not limited to this, and various sealed display panels can be targeted.

6 and 7 are explanatory views showing the structure of the organic EL panel which is an embodiment of the present invention (FIG. 6 shows a cross-sectional view taken along line A ₂ -A _{2 in} FIG. 7, and FIG. 7 shows the structure in FIG. A ₁ -A ₁ sectional view is shown.) Although this organic EL panel 100 shows what formed the display part mentioned above by the some organic EL element 20, not only this but a display part may be formed by a single organic EL element. . Here, the above-described sealing portion is formed by bonding the sealing member 14 to the support substrate 11 via the adhesive region 15.

  The basic structure of the organic EL panel 100 will be described in more detail with reference to the drawings. An organic material layer 23 including an organic light emitting functional layer is sandwiched between a lower electrode 21 and an upper electrode 22 to support the substrate 11 (sealing). A plurality of organic EL elements 20 are formed on a type display panel substrate 10). In this example, a silicon coating layer 11a is formed on a support substrate 11, and a lower electrode 21 formed thereon is made of ITO or the like. The bottom electrode system is configured so that light is extracted from the support substrate 11 side by setting the upper electrode 22 as a cathode made of a metal material such as Al.

  As the organic material layer 23, an example of a three-layer structure of a hole transport layer 23A, a light emitting layer 23B, and an electron transport layer 23C is shown. And the sealing space M is formed by bonding the support substrate 11 and the sealing member 14 through the adhesive layer 15 </ b> A of the bonding region 15, and the display unit including the organic EL element 20 is formed in the sealing space M. Forming.

  In this example, the display unit composed of the organic EL element 20 has the lower electrode 21 partitioned by an insulating film 24 and the upper electrode 22 insulated by a cathode partition wall 25. Unit display areas (20R, 20G, 20B) are formed by the organic EL element 20. Further, a drying means 26 is attached to the inner surface of the sealing member 14 that forms the sealing space M to prevent the deterioration of the organic EL element 20 due to moisture.

Here, FIG. 6 shows the lead-out wiring of the upper electrode 22 serving as the cathode. The lead-out wiring 12 ₁ of the upper electrode 22, the same material as the lower electrode 21, the second wiring layer 12 1 _b formed in the same step as the lower electrode 21 is patterned in a state of being insulated by the insulating film 24 ing. The pulled-out portion of the second wiring layer 12 ₁ b, silver palladium (AgPd) is formed a first wiring layer 12 ₁ a which forms a low-resistance wiring comprising alloy, the second wiring layer ₁₂ 1 b The lead wiring arrangement 12 ₁ made of the first electrode layer 12 ₁ a is formed. The end portion 22a of the upper electrode 22 is connected to the lead wiring 12 ₁ in the sealing space M ends.

On the other hand, FIG. 7 shows the lead-out wiring of the lower electrode 21 serving as the anode. In the lead wirings 12 ₂ of the lower electrode 21, to form a lead wire 12 ₂ by drawing out sealing space M extending the lower electrode 21.

In the organic EL panel 100 according to the embodiment of the present invention, the lead-out wiring 12 is formed on the lead-out wirings 12 ₁ and 12 ₂ corresponding to the adhesion region 15 where the support substrate 11 and the sealing member 14 are bonded. _1, 12 planarizing layer 13 for planarizing the uneven pattern ₂ is formed.

According to the organic EL panel 100 according to the embodiment of the present invention, as described above, the adhesive region 15A formed by the adhesive layer 15A is formed on the surface of the planarizing layer 13, so that the extraction wiring is provided in the adhesive region 15. The uneven pattern of 12 ₁ , 12 ₂ does not enter. Therefore, even if fine bubbles are present in the adhesive layer 15A, they do not converge linearly, and good airtightness corresponding to the width in which the adhesive region 15 is formed can be ensured. And since the performance deterioration of the organic EL element 20 can be effectively prevented by ensuring the airtightness in the sealed space M, it is possible to obtain a long life and high performance of the organic EL panel.

FIG. 8 is an explanatory diagram illustrating a method for forming the organic EL panel 100 according to an embodiment of the present invention. First, the support substrate preparation step (S11) as described above is performed, and the lower electrode 21 such as ITO and the lead-out wirings 12 ₁ and 12 ₂ are formed on the support substrate 11 (S12). If necessary, the dummy pattern shown in the prior art can be formed at the same time. In these formations, the constituent material is formed as a thin film by a method such as sputtering, and is patterned into a desired pattern by photolithography or the like.

Next, SiN, SiO ₂ , polyimide, or the like is formed on the support substrate 11 on which the lower electrode 21 and the lead wires 12 ₁ and 12 ₂ (dummy patterns as necessary) are formed by a film forming method such as a spin coat method. A film of the insulating material is formed to have a predetermined coating thickness, and the insulating film 24 and the planarizing layer 13 are patterned (S13). The patterning at this time can also be performed by photolithography using an exposure mask, followed by development processing to obtain a desired pattern. The insulating film 24 is formed in a number of grid patterns such that the unit display regions (20R, 20G, 20B) are opened on the lower electrode 21 and the electrodes are insulated, and the planarizing layer 13 is formed on the bonding region 15. A corresponding pattern is formed. In addition, a surface to be polished is formed on the surface of the planarizing layer 13 as necessary.

  In the example of FIG. 6 or FIG. 7, the cathode partition 25 is formed on the insulating film 24, but this may be omitted depending on the subsequent steps. The cathode barrier 25 is formed for the purpose of electrically insulating each line of the adjacent upper electrode 22 or functioning as a shadow mask, and preferably has an inverted trapezoidal cross section. Is preferably formed. When the upper electrode 22 is formed, when the patterning is separately performed with a shadow mask or the like, the cathode partition wall 25 is not particularly required.

  Next, an organic material layer 23 is formed on the lower electrode 21 (S14). The organic material layer 23 is formed by a wet process such as a coating method such as a spin coating method or a dipping method, a printing method such as a screen printing method or an ink jet method, or a dry process such as a vapor deposition method or a laser transfer method. Can do.

  As an example, the hole transport layer 23A, the light emitting layer 23B, and the electron transport layer 23C are sequentially stacked by vapor deposition using respective materials. At this time, when forming the light emitting layer 23B, a film formation mask is used, and materials are separately applied in accordance with a plurality of light emission colors. In this color separation, each organic display material or a combination of a plurality of organic materials that emit light of three colors of RGB is separately applied to each unit display area corresponding to RGB. By forming a film with the same material twice or more in one unit display area, it is possible to prevent an undeposited part from being formed in the unit display area.

  Then, the upper electrode 22 is formed on the formed organic material layer 23 (S15). The upper electrode 22 is formed in a stripe shape so as to be orthogonal to the lower electrode 21, and the organic EL elements 20 are formed in a matrix at intersections with the lower electrode 21 formed in the stripe shape. The upper electrode 22 is formed by forming a metal thin film as a cathode by a method such as vapor deposition or sputtering.

  On the other hand, in parallel with this, a preparation process such as processing of the sealing member 14 and equipment of the drying member 26 is performed on the sealing member 14 (S21). Further, an adhesive layer 15 </ b> A is formed at a location corresponding to the adhesion region 15 in the sealing member 14. The adhesive layer 15A before bonding may be formed on the sealing member 14 side as described above, or may be formed on the support substrate 11 side. Moreover, you may form in the both sides. As an adhesive for forming the adhesive layer 15A, for example, an ultraviolet curable epoxy resin adhesive can be used, and a spacer having a particle diameter of 1 to 300 μm (glass or plastic spacer beads are used as the adhesive). A preferable amount is mixed (about 0.1 to 0.5% by weight) and applied to at least one of the support substrate 11 side and the sealing member 14 side using a dispenser or the like as described above.

  Thereafter, the support substrate 11 and the sealing member 14 that have undergone the above-described steps are bonded together under an inert gas atmosphere such as argon, and when an ultraviolet curable epoxy resin adhesive is used as an adhesive, The adhesive is irradiated with ultraviolet rays from the support substrate 11 side or the sealing member 14 side to be cured. Thus, the organic EL element 20 is sealed in a state where the inert gas is sealed in the sealing space M formed between the support substrate 11 and the sealing member 14 (S16). Thereafter, in the case where a large number of panels are formed simultaneously, a cutting process is performed, and then a necessary inspection process (S17) is performed to obtain a commercialized organic EL panel 100.

  Below, the detail of the organic electroluminescent panel 100 which concerns on the Example of this invention is demonstrated more concretely.

a. Support substrate;
As the support substrate 11 of the organic EL panel 100, glass, plastic, quartz, metal, or the like can be employed. As a method for extracting light from the support substrate 11 side (bottom emission method), it is preferable to use a transparent flat plate or film, and the material is preferably glass or plastic.

b. electrode;
One of the lower electrode 21 and the upper electrode 22 is set on the cathode side, and the other is set on the anode side. The anode side is made of a material having a higher work function than the cathode side, and is transparent such as a metal film such as chromium (Cr), molybdenum (Mo), nickel (Ni), platinum (Pt), or a metal oxide film such as ITO or IZO. A conductive film is used. Conversely, the cathode side is made of a material having a lower work function than the anode side, such as alkali metals (Li, Na, K, Rb, Cs), alkaline earth metals (Be, Mg, Ca, Sr, Ba), rare earth metals, etc. , Metal having a low work function, a compound thereof, or an alloy containing them, amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, and oxides such as Cr ₂ O ₃ , NiO, and Mn ₂ O ₅ are used. it can. Further, when both the lower electrode 21 and the upper electrode 22 are made of a transparent material, a configuration in which a reflective film is provided on the electrode side opposite to the light emission side can also be adopted.

c. Lead wiring;
The lead wires 12 ₁ and 12 ₂ are preferably made of a low-resistance metal material, APC, Ag—Pd alloy, Cr, Al, or the like. In the embodiment, the first wiring layer 12 ₁ a is formed simultaneously with the lower electrode by ITO and IZO which are metal oxides, and the first wiring layer 12 ₁ a formed thereon is made of a low resistance metal such as Ag, Ag alloy, Al, Cr or the like. Two wiring layers 12 ₁ b are formed. Each layer is formed as a thin film by a method such as sputtering and patterned by a photolithography method. As a protective layer such as Ag, a material having high oxidation resistance such as Cu, Cr, or Ta can be laminated on the second wiring layer 12 ₁ b to form a three-layer structure.

d. Organic material layer;
The organic material layer 23 includes a single-layer or multilayer organic compound material layer having at least an organic EL light emitting functional layer, but the layer configuration may be formed in any manner. In general, as shown in FIG. 6 or FIG. 7, a layer in which a hole transport layer 23A, a light emitting layer 23B, and an electron transport layer 23C are laminated from the anode side to the cathode side can be used. 23B, the hole transport layer 23A, and the electron transport layer 23C may be provided not only as one layer but also as a plurality of layers, and either one of the hole transport layer 23A and the electron transport layer 23C may be omitted. Both layers may be omitted. It is also possible to insert an organic material layer such as a hole injection layer or an electron injection layer depending on the application. For the hole transport layer 23A, the light emitting layer 23B, and the electron transport layer 23C, a conventionally used material (regardless of a polymer material or a low molecular material) can be appropriately selected and employed. In the light emitting material forming the light emitting layer 23B, either the light emission (fluorescence) when returning from the singlet excited state to the ground state or the light emission (phosphorescence) when returning from the triplet excited state to the ground state. It may be adopted.

e. Sealing member;
The sealing member 14 can be made of metal, glass, plastic, or the like. Further, a glass sealing member in which a sealing recess (regardless of one-stage digging or two-stage digging) is formed by processing such as press molding, etching, blasting, or flat glass is used. What forms the support substrate 11 and the sealing space M with a spacer made of plastic (or plastic) may be employed.

f. adhesive;
As the adhesive for forming the adhesive layer 15A, a thermosetting type, a chemical curing type (two-component mixing), a light (ultraviolet) curing type, or the like can be used. As materials, acrylic resin, epoxy resin, polyester, Polyolefin or the like can be used. In particular, it is preferable to use an ultraviolet curable epoxy resin adhesive.

g. Drying member;
The drying member 26 includes a physical desiccant such as zeolite, silica gel, carbon, and carbon nanotube, a chemical desiccant such as alkali metal oxide, metal halide, and chlorine peroxide, and an organometallic complex such as toluene, xylene, and aliphatic organic. A desiccant dissolved in a petroleum solvent such as a solvent, a desiccant in which desiccant particles are dispersed in a binder such as transparent polyethylene, polyisoprene, and polyvinyl cinnaate can be employed.

h. Various types of panels;
In the organic EL panel 100 according to the embodiment of the present invention, the pixel electrode is driven by a TFT (Thin Film Transistor) instead of the passive matrix display panel that selectively drives the lower and upper stripe-shaped electrodes as described above. An active matrix display panel can be formed. In addition, a single color display or a multicolor display may be used, but in order to form a multicolor display panel, a color filter or a fluorescent filter is applied to a single color organic EL element 10 such as a white color or a blue color. A method that combines color conversion layers by materials (CF method, CCM method), a method that realizes multi-color light emission by irradiating electromagnetic waves to the light emitting area of a monochromatic light emitting functional layer (photo bleaching method), two or more colors A full color organic EL panel or a multicolor organic EL panel can be formed by a method (SOLED (transparent stacked OLED method), etc.) in which subpixels are vertically stacked to form one pixel. As the organic EL panel 1 according to the embodiment, a bottom emission method in which light is extracted from the panel substrate side or light from the opposite side to the panel substrate can be used. It can also be a top emission type which emit.

  According to such an embodiment or example, it is possible to secure the airtightness of the sealing portion where the display portion 1A is formed and to maintain good display performance. In addition, with respect to the formation method, since no process is added, a high-quality display panel can be obtained without increasing the manufacturing cost. In particular, regarding an organic EL panel, it is possible to maintain good display performance for a long time by ensuring the airtightness of the reliable sealing portion. Further, when the sealing member is made of metal, it is possible to prevent a short circuit between the lead-out wiring and the sealing member by a planarizing layer made of an insulating material that covers the lead-out wiring.

It is explanatory drawing of a prior art. It is explanatory drawing explaining the problem of a prior art. It is explanatory drawing which shows the sealing type display panel which concerns on embodiment of this invention. It is explanatory drawing which shows the principal part of the sealing type display panel which concerns on embodiment of this invention. It is explanatory drawing which shows the formation method of the sealing type display panel which concerns on embodiment of this invention. It is explanatory drawing which shows the organic electroluminescent panel which concerns on the Example of this invention. It is explanatory drawing which shows the organic electroluminescent panel which concerns on the Example of this invention. It is explanatory drawing which shows the formation method of the organic electroluminescent panel which concerns on the Example of this invention.

Explanation of symbols

1 sealed display panel 10 sealed display panel substrate 11 supporting substrate 12, 12 _1, 12 ₂ lead wirings 13 planarization layer 13A polished surface 14 sealing member 15 bonded region 15A adhesive layer 20 organic EL element 21 lower Electrode 22 Upper electrode 23 Organic material layer 24 Insulating film 25 Cathode partition 26 Drying member M Sealing space

Claims (6)

In a sealed display panel comprising a sealing portion that shields the display portion formed on the support substrate from outside air, and a lead-out wiring led out from the sealing portion from the display portion is wired on the support substrate.
A sealing type display panel, wherein a flattening layer for flattening the concave-convex pattern of the lead-out wiring is provided on at least the lead-out wiring corresponding to the adhesion region of the sealing portion.   The sealed display panel according to claim 1, wherein the planarizing layer has a surface to be polished, and the adhesion region is formed on the surface to be polished.   The display unit is formed of one or a plurality of organic EL elements, and the sealing unit is formed by bonding a sealing member on the support substrate via the adhesive region. The sealed display panel described in 1 or 2. A sealing type display panel substrate provided with a display portion sealed by a sealing portion and wired with a lead-out wiring led out from the sealing portion from the display portion,
A sealing type display panel substrate, wherein a flattening layer for flattening the concave-convex pattern of the lead-out wiring is provided on at least the lead-out wiring corresponding to the adhesion region of the sealing portion. Forming a sealed display panel comprising a sealing portion that shields a display portion formed on a support substrate from outside air, and a lead-out wiring led out from the display portion to the outside of the sealing portion is wired on the support substrate In the method
Forming the lead wiring on the support substrate;
And a step of forming a flattening layer for flattening the concavo-convex pattern of the lead wiring on at least the lead wiring corresponding to the adhesion region of the sealing portion simultaneously with the insulating film formed on the display portion. A method for forming a sealed display panel.   6. The sealed display panel according to claim 5, further comprising a step of polishing a surface of the planarizing layer and a step of forming the adhesion region on a surface to be polished of the planarizing layer. Forming method.

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