JP2005247646A - Method of manufacturing display element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of stably cutting a brittle substrate having a coating film applied at least on one surface from the coating film side without suppressing the damage of the substrate. <P>SOLUTION: In this method of manufacturing a display element which has a process for cutting the brittle substrate having the coating film applied at least on one surface from the coating film side, the substrate is soda glass having ≤0.4 mm thickness and the thickness of the coating film is ≤100 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a brittle substrate coated with a coating on at least one side, particularly a soda glass substrate used in an STN liquid crystal display panel, with a coating side of a thin laminated glass substrate having a thickness of 0.4 mm or less on one side. It is related with the manufacturing method of the display element which has the process of parting and isolate | separating with a parting blade.

  A display element such as a liquid crystal display panel is usually manufactured through a process in which two glass substrates are bonded together, liquid crystal is injected into the gap, and then divided into unit substrates.

In Patent Documents 1 to 3, a scribe line is formed on a bonded mother substrate using a cutter foil, and then the substrate is divided into unit substrates having a desired size along the formed scribe line. A configuration is disclosed.
Japanese Patent Laid-Open No. 11-116260 Patent 3,074,143 specification International Publication No. 02/081392 Pamphlet

  As the bonded glass substrate, glass substrates having various thicknesses are used depending on applications, but a thin bonded glass substrate having a thickness of 0.4 mm or less is used in a portable terminal device such as a mobile phone.

  When such a thin bonded glass substrate is scribed and cut using a cutter wheel, there is a risk of generating distortion inside the substrate, thereby causing undesirable cracks and chipping of the substrate. Therefore, in order to ensure the end face strength of the substrate after the division, there is a method in which a film is formed on the surface of the substrate, and the unit film having a desired size is divided by scribing from the formed film using a cutter wheel. It is used.

  However, if the strength of the coating is low, it is difficult to ensure the strength of the end face of the substrate after the separation even if the coating is formed on the substrate surface. Moreover, when the strength of the coating is high, it becomes difficult to form a scribe line on the substrate surface using a normal cutting edge.

  The present invention has been made in view of such conventional problems, and at the time of cutting a brittle substrate coated with a coating on at least one side from the coating with a cutting blade, the substrate is prevented from being damaged and stably cut. It aims to provide a way to make it possible.

  According to the present invention, in a method for manufacturing a display element having a step of dividing and separating a brittle substrate coated with a coating on at least one side from the coating side by a cutting blade, the substrate is made of soda glass having a thickness of 0.4 mm or less. There is provided a method for producing a display element, wherein the film thickness is 100 μm or less.

  That is, the inventors of the present application have found a cutting condition for stably cutting a thin bonded glass substrate with high accuracy, and have completed the present invention.

  In the manufacturing method of the display element of the present invention, by applying the condition that the thickness of the substrate on one side is 0.4 mm or less and the film thickness of the film is 100 μm or less, the substrate is prevented from being damaged and is stably divided. Became possible.

  The film preferably has a film hardness in the range of 3H to 5H. When the film hardness exceeds 5H, the cutting margin for ensuring the cutting accuracy is lowered, and when the film hardness is 3H or less, a large cutting pressure is required.

  In the display element manufacturing method of the present invention, a substrate made of soda glass is an object.

  If the substrate is a bonded glass substrate formed by bonding two glass plates, the method for manufacturing a display element of the present invention is applied.

  In the present invention, examples of the coating include a resin layer having a thickness of 15 μm to 100 μm formed by applying a material containing a resin. If the thickness is less than 15 μm, the cutting margin that can ensure the cutting accuracy is reduced. Moreover, when thickness exceeds 100 micrometers, a big parting pressure will be needed.

  When cutting the substrate from the coating side with a cutting blade, it includes a step of placing the substrate on a table including a porous body on the surface and fixing the substrate on the table by performing suction through the porous body. The substrate can be firmly fixed without bending.

  The cutting blade is preferably a cutter wheel in which a V-shaped blade is formed along the circumferential portion of the wheel, and the blade edge rolls on the coating.

  When the cutter wheel is provided with a projection having a predetermined shape on the blade edge, when rolling on the substrate, a vertical crack that is long enough to penetrate the substrate is generated by the projection, and the cutter wheel bites into the substrate due to the projection. Due to the point contact, the generated stress is suppressed, and thereby unnecessary horizontal cracks can be suppressed.

  Examples of the coating include those containing as a material a thermosetting resin, a UV curable resin, or a mixture thereof.

  Examples of the coating include those containing as a material at least one resin selected from an acrylic resin, an epoxy resin, a polyether sulfone resin, a polyurethane resin, and a vinyl acetate resin.

  Examples of the coating include those containing a mixed material composed of an epoxy resin, inorganic colloidal particles of silica, and an organic binder resin.

  In the present invention, the substrate is preferably a glass substrate for an STN (Super Twisted Nematic) liquid crystal panel display.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  The present invention can be applied not only to glass substrates but also to other ceramic substrates and semiconductor substrates that are brittle substrates.

  In the following embodiments, when manufacturing a panel substrate of an STN liquid crystal display device, an example is shown in which a mother substrate on which a pair of glass substrates is bonded is divided into unit substrates, but the substrate cutting method of the present invention is applied. The object is not limited to these.

  FIG. 1 is a plan view of a mother substrate to which the substrate cutting method of the present invention is applied, and FIG. 2 is an enlarged front view of part A of FIG. 1 before the film formation of the present invention is performed. These are the A section enlarged front views of FIG. 1 after the film formation of this invention was given.

In FIG. 1, a mother substrate 10 is a mother substrate in which a pair of rectangular glass substrates are bonded together. S1 indicated by a solid line is a vertical scribe line, and S2 indicated by a broken line is a horizontal scribe line intersecting with S1. As will be described later, the mother substrate 10 is divided into unit substrates along the scribe lines S1 and S2.
An example of a method for manufacturing the mother substrate 10 will be described with reference to FIGS.

  First, as shown in FIG. 2, a sealing material 3 patterned by screen printing or the like is printed on the surface of a soda glass 1 having a thickness of 0.2 to 0.4 mm. The sealing material 3 serves as a spacer for securing a space where liquid crystal is injected. The formation method of the sealing material 3 is not limited to screen printing.

  Next, a soda glass 2 having a thickness of 0.2 mm is superposed on the surface of the soda glass 1, and a heat and pressure treatment is applied to cure the sealing material 3 to join the two soda glasses 1 and 2 together.

Next, the coating material is adjusted. Here, as the coating material, a coating solution containing a mixed material composed of epoxy resin, silica inorganic colloidal particles and organic binder resin was used. Two examples of blending the coating liquid and adjusting the hardness (3H to 5H) will be described below.
[Adjustment Example 1]
Methoxy group-containing silane-modified epoxy resin solution [Arakawa Chemical Industries, Composeran E102A] (epoxy resin: bisphenol type epoxy resin epoxy equivalent 480 g / equivalent, tetramethoxysilane partial condensate: Si average number of nuclei 4, solvent : Consisting of 100 g of diethylene glycol dimethyl ether, 50% by weight of the cured residue and 36% by weight of the silica in the cured residue) 50% of hexahydrophthalic anhydride [manufactured by Nippon Kayaku Co., Ltd., Rikajit HH] A coating solution (A) was prepared by blending 21 g of a curing agent solution diluted to% by weight.
[Adjustment Example 2]
Methoxy group-containing silane-modified epoxy resin solution [Arakawa Chemical Industries, Composeran E103A] (epoxy resin: bisphenol type epoxy resin, epoxy equivalent 480 g / equivalent, methyltrimethoxysilane partial condensate: Si average nucleus number 4, Solvent; composed of diethylene glycol dimethyl ether, 100g of cured residue 50% by weight, silica content 35% by weight of cured residue), hexahydrophthalic anhydride [manufactured by Shin Nippon Rika Co., Ltd., Rikajit HH] with diethylene glycol dimethyl ether A coating solution (B) was prepared by blending 21 g of a curing agent solution diluted to 50% by weight.
[Adjustment Example 3]
Methoxy group-containing silane-modified epoxy resin solution [Arakawa Chemical Industries, Ltd., HBEP120] (epoxy resin: bisphenol type epoxy resin epoxy equivalent 480 g / equivalent, methyltrimethoxysilane partial condensate: Si average number of nuclei 2.8 , Solvent: composed of diethylene glycol dimethyl ether, 100g of cured residue 50% by weight, silica content 30% by weight of cured residue), hexahydrophthalic anhydride [manufactured by Shin Nippon Rika Co., Ltd., Rikajit HH] diethylene glycol dimethyl ether The coating solution (C) was prepared by blending 22 g of the curing agent solution diluted to 50% by weight.

  Next, the above coating solutions (A), (B) and (C) are applied to one side of the soda glass 1 or 2 using a spin coater so that the cured film thickness is about 20 μm, and the coating liquid is applied at 130 ° C. for 30 minutes. Drying and curing were performed to prepare epoxy resin-silica hybrid coated substrates (A), (B), and (C), respectively.

  The epoxy resin-silica hybrid coated substrates (A), (B), and (C) having the resin layer 5 manufactured as described above are shown in FIG. In addition, when apply | coating the coating liquid used as a film material to the glass surface, it is preferable to apply | coat so that the film thickness of a film may be 100 micrometers or less.

  The hardness of each resin layer 5 was measured with respect to the produced epoxy resin-silica hybrid coated substrates (A), (B), and (C). The hardness was measured by a pencil scratch test according to a paint general method of JIS K-5400.

  Table 1 shows the evaluation of the pencil scratch test.

表１から、作製されたエポキシ樹脂−シリカハイブリッド塗布基板（Ａ）（Ｂ）および（Ｃ）は、それぞれの樹脂層５の硬度が、５Ｈ，４Ｈおよび３Ｈに調整されていることが確認できた。

From Table 1, it was confirmed that the prepared epoxy resin-silica hybrid coated substrates (A), (B), and (C) had their respective resin layers 5 having a hardness adjusted to 5H, 4H, and 3H. .

  In this embodiment, an epoxy resin having high adhesion to a glass substrate, a hybrid resin composed of silica colloidal particles and an organic binder resin is used as the coating material, but the coating material is limited to this. However, generally used thermosetting resins and UV curable resins can be used. Specific examples include acrylic resins, epoxy resins, polyethersulfane (PES) resins, polyurethane resins, and vinyl acetate resins.

  An example of a method for dividing the mother substrate 10 (FIG. 1) on which the resin layer 5 (FIG. 3) serving as a coating is formed will be described with reference to FIGS. 4 to 7.

  FIG. 4 is a perspective view of a scribing apparatus used in the substrate cutting method according to the present invention.

  The scribe device 40 will be described with reference to FIG.

  As shown in FIG. 4, the scribing device 40 includes a table 41 on which the mother substrate 10 (not shown) is placed. A rotary table 42 is disposed on the table 41.

  The rotary table 42 supports the mother substrate 10 in the horizontal direction and can move on the table 41 in the Y1 direction. A porous plate 70 is attached to the surface of the rotary table 42. The lower surface of the porous plate 70 is connected to a vacuum suction source (not shown). For the porous plate 70, ceramics, plastics, sintered metal, or the like can be used, and the substrate placed by the fine pores dispersed on the surface can be firmly fixed without being partially bent. it can.

  Further, a cutter head 44 on which a cutter wheel 20 described later is mounted so as to be able to roll is supported along the rail 45 so as to be movable in the X1 direction.

  The cutter head 44 has a scribe pressure (cutting pressure) setting means for setting the rotational torque of a built-in servo motor and transmitting the torque to the cutting edge of the cutter wheel 20.

  When scribing using the scribing device 40, first, the scribing pressure is set by the scribing pressure setting means. Next, each time the rotary table 42 is moved in the Y1 direction at a predetermined pitch, the glass plate placed on the rotary table 42 is scribed in the X1 direction by moving the cutter head 44 in the X1 direction.

  Thereafter, when the rotary table 42 is rotated 90 ° and scribed in the same manner, the glass plate can form a scribe line orthogonal to the previously formed scribe line.

  In the scribing device described above, 46 is a motor for moving a cutter head 44, which is rotatably supported by a cutter wheel 20, which will be described later, mounted along a rail, and 47 is on the rotary table 42. A CCD camera 48 for monitoring the substrate to be scribed is a monitor that displays alignment marks recognized by the CCD camera 47.

  One embodiment of the cutter wheel 20 mounted on the cutter head 44 of the scribe device will be described with reference to FIGS. 5 to 7.

  FIG. 5 is a front view seen from a direction orthogonal to the rotation axis of the cutter wheel 20, and FIG. 6 is a side view of FIG.

  As shown in FIG. 5, the cutter wheel 20 has a disk shape with a wheel diameter φ and a wheel thickness W, and a cutting edge having an obtuse cutting edge angle α is formed on the outer peripheral portion of the wheel.

  Furthermore, as shown in FIGS. 5 and 6, the cutter wheel 20 has irregularities formed on the ridgeline portion 20 a where the cutting edge is formed. That is, in this example, as shown in FIG. 6, a U-shaped or V-shaped groove 20b is formed. The groove 20b is formed by cutting out from the flat ridgeline portion 20a to the depth h at every pitch P. By forming the groove 20b as described above, a protrusion j having a height h is formed for each pitch P. The groove 20b has a size on the order of μm that cannot be seen with the naked eye.

  Next, an embodiment of a method for dividing the mother substrate 10 using the cutter wheel 20 will be described.

  FIGS. 7A and 7B are cross-sectional views illustrating a method for dividing the mother substrate 10 for each process using a scribing device including the cutter wheel 20. In this example, the two soda glasses 1 and 2 forming the mother substrate 10 are hereinafter referred to as an A-side substrate and a B-side substrate, and a resin layer 5 serving as a coating is formed on each substrate surface. And

(1) When scribing using a scribing device, first, a scribing pressure is set by a scribing pressure setting means.

  Next, as shown in FIG. 7A, the mother substrate 10 is placed on the rotary table 42 of the scribe device 40 with the A-side substrate facing upward.

  When the vacuum suction source connected to the porous plate 70 is driven, the mother substrate 10 is firmly fixed to the surface of the turntable 42. In the conventional adsorption plate in which relatively large pores that do not use the porous plate 70 are regularly or randomly perforated, the substrate is bent at the portion of the pores during adsorption. In the case where the formed porous plate 70 is used, since such a bending of the substrate does not occur, a precise scribe line can be formed on the substrate held flat.

  Next, the scribe line Sa is formed on the A-side substrate from above the resin layer 5 using the cutter wheel 20. The formed scribe line Sa becomes a deep vertical crack that reaches the vicinity of the lower surface of the A-plane substrate.

  (2) Next, as shown in FIG. 7B, after driving the vacuum suction source is stopped and the substrate is fixed on the porous plate 70, the mother substrate 10 is turned upside down to be a B-side substrate. Place on the scribing device with the side facing up. Next, after driving the vacuum suction source of the porous plate 70 to fix the substrate, a scribe line Sb is formed on the B-side substrate from above the resin layer 5 using the cutter wheel 20. The formed scribe line Sb becomes a deep vertical crack that reaches the vicinity of the lower surface of the B-side substrate.

  At this time, since the scribing of the mother substrate 10 is performed on the resin layer 5, even if the cullet is generated, it is only scattered on the resin layer 5 and does not adhere to the A-plane substrate. You can avoid sticking.

  By sequentially performing the steps (1) and (2), the mother substrate 10 is divided into unit substrates.

  As shown in the above-described embodiment, by using the cutter wheel 20, the substrate can be divided only by forming a scribe line.

As described above, undesirable cracks and chipping of the substrate were not observed in the unit substrate that was separated from the mother substrate 10 through the above steps. As a result, using the substrate cutting method of the present invention, it is apparent that even when a thin bonded glass substrate is scribed and cut using a cutter wheel, the glass substrate can be cut without causing distortion. Became.
[Experiment 1]
In Experiment 1, when the substrate was cut using a wheel cutter, the thickness of the coating applied to the glass substrate and the cutting pressure were changed to measure the cutting property of the substrate.

  FIG. 8 is an evaluation of the severability in Experiment 1.

The cutting conditions are shown below.
Target substrate Laminated glass with coating: (Thickness 0.4mm [0.2mm x 2])
Film thickness: 15-40μm
Cutting blade Pennet (registered trademark) made by Samsung Diamond Industrial Co., Ltd.
Outer diameter: 2mm
Cutting edge spacing: 230 divisions
Cutting edge height: 3 μm
Blade angle: 100 °
Scribe device MS type setting condition made by Samsung Diamond Industrial Co., Ltd. Substrate cutting depth: 0.1mm
Scribe speed: 100mm / sec
Scribe pressure [parting pressure]: 0.05 to 0.2 MPa
FIG. 9 shows the relationship between the scribe pressure and the film thickness.

  From FIG. 9, it can be seen that the pressure required for scribing increases as the film thickness of the coating increases.

  As apparent from FIG. 8, by applying a scribe pressure corresponding to the film thickness of the film in a film thickness range of 15 to 40 μm to the substrate, the cutting accuracy and stability in the scribe can be obtained.

  FIG. 10 is a diagram in which the wheel cutter 20 is used to perform cutting by changing the cutting pressure on a glass substrate having no coating on the surface, and the cutting property is evaluated based on the same criteria as in Experiment 1. .

From FIG. 10, when dividing is performed on a glass substrate that is not coated on the surface, the dividing margin, that is, an appropriate margin, compared to when dividing is performed on a glass substrate that is coated on the surface. It can be seen that the range of cutting conditions is narrow.
[Experiment 2]
In Experiment 2, when the substrate was cut using a wheel cutter, the thickness of the substrate and the cutting pressure were changed.

  FIG. 11 shows the evaluation of severability using the appropriate substrate severing conditions obtained in Experiment 2 as the severing margin. Here, the cutting margin is shown as an appropriate cutting pressure for substrates having different thicknesses.

The cutting conditions are shown below.
Target substrate Laminated glass with coating: (thickness 0.8 mm [0.4 mm × 2 sheets],
Thickness 0.6mm [0.3mm x 2], thickness 0.4mm [0.2mm x 2
Sheet〕)
Film thickness: 20μm
Film hardness: 5H
Cutting blade Pennet (registered trademark) made by Samsung Diamond Industrial Co., Ltd.
Outer diameter: 2mm
Cutting edge spacing: 230 divisions
Cutting edge height: 3 μm
Blade angle: 100 °
Scribe device MS type setting condition made by Samsung Diamond Industrial Co., Ltd. Substrate cutting depth: 0.1mm
Scribe speed: 100mm / sec
Scribe pressure [breaking pressure]: as shown in FIG.
From FIG. 11, it can be seen that the cutting pressure increases as the thickness of the substrate increases, and that the cutting margin, that is, the appropriate cutting pressure, greatly increases.
[Experiment 3]
In Experiment 3, when the substrate was cut using a wheel cutter, the hardness of the coating and the cutting pressure were changed.

  FIG. 12 shows the evaluation of severability using the appropriate substrate slicing conditions obtained in Experiment 3 as the severing margin. Here, the cutting margin is shown as an appropriate cutting pressure for substrates having different film hardnesses.

The cutting conditions are shown below.
Target substrate Laminated glass with coating: (Thickness 0.4mm [0.2mm x 2])
Film thickness: 20μm
Film hardness: 3H, 4H, 5H
Cutting blade Pennet (registered trademark) made by Samsung Diamond Industrial Co., Ltd.
Outer diameter: 2mm
Cutting edge spacing: 230 divisions
Cutting edge height: 3 μm
Blade angle: 100 °
Scribe device MS type setting condition made by Samsung Diamond Co., Ltd. Substrate cutting depth: 0.1mm
Scribe speed: 100mm / sec
Scribe pressure [breaking pressure]: as shown in FIG.
From FIG. 12, it can be seen that the cutting pressure increases as the coating film hardness decreases, and that the cutting margin, that is, the appropriate cutting pressure, greatly increases.

  In the method for manufacturing a display element of the present invention, by using the conditions that the thickness of the substrate is 0.4 mm or less and the film thickness is 100 μm or less, the substrate can be prevented from being damaged and can be stably divided. .

It is a top view of the mother board | substrate with which the board | substrate cutting method of this invention is applied. It is the A section enlarged front view of the mother board | substrate of FIG. 1 before the film formation by the board | substrate cutting method of this invention is given. It is the A section enlarged front view of the mother board | substrate of FIG. 1 after the film formation by the board | substrate cutting method of this invention was given. It is a perspective view of the scribe device used for the substrate cutting method of this invention. It is the front view which looked at the cutter wheel used for the board | substrate cutting method of this invention from the direction orthogonal to the rotating shaft. FIG. 6 is a side view of FIG. 5. It is sectional drawing explaining the method of parting a mother board | substrate for every process using the scribing apparatus provided with the cutter wheel. It is the figure which evaluated the parting property with respect to the board | substrate which gave the film in Experiment 1. FIG. It is a figure which shows the relationship between a scribe pressure and a film thickness. It is the figure which evaluated the parting property with respect to the board | substrate with which the film in Experiment 2 is not given. It is the figure which evaluated the parting property in Experiment 2. FIG. It is the figure which evaluated the parting property in Experiment 3. FIG.

Explanation of symbols

1 Soda Glass Plate 2 Soda Glass Plate 3 Sealing Material 5 Resin Layer (Coating)
10 Mother board 20 Cutter wheel 20a Ridge part 20b Groove S1 Vertical scribe line S2 Horizontal scribe line

Claims (11)

  In a method for manufacturing a display element having a step of cutting a brittle substrate coated with a coating on at least one side from the coating with a cutting blade, the substrate is soda glass having a thickness of 0.4 mm or less, and the thickness of the coating is 100 μm or less. A manufacturing method of a display element,   The method of manufacturing a display element according to claim 1, wherein the film has a film hardness in a range of 3H to 5H.   The method for manufacturing a display element according to claim 1, wherein the substrate is a bonded glass substrate obtained by bonding two glass plates.   The method for manufacturing a display element according to claim 1, wherein the coating is a resin layer having a thickness of 15 to 100 μm formed by applying a material containing a resin.   A step of placing the substrate on a table including a porous body on the surface and fixing the substrate on the table by performing suction through the porous body when the substrate is divided by the cutting blade from the coating side. Item 5. The method for manufacturing a display element according to any one of Items 1 to 4.   6. The display element according to claim 1, wherein the cutting blade is a cutter wheel in which a V-shaped blade is formed along a circumferential portion of the wheel, and the blade edge rolls on the film. Production method.   The method of manufacturing a display element according to claim 6, wherein the cutter wheel includes a protrusion having a predetermined shape on the blade edge.   The method for manufacturing a display element according to any one of claims 1 to 7, wherein the coating includes a thermosetting resin, a UV curable resin, or a mixture thereof as a material.   The film according to any one of claims 1 to 8, wherein the coating includes at least one resin selected from an acrylic resin, an epoxy resin, a polyether sulfone resin, a polyurethane resin, and a vinyl acetate resin as a material. The manufacturing method of the display element of description.   10. The method for manufacturing a display element according to claim 1, wherein the coating includes a mixed material composed of an epoxy resin, silica inorganic colloid particles, and an organic binder resin. 11.   The method for manufacturing a display element according to any one of claims 1 to 10, wherein the substrate is a glass substrate for an STN liquid crystal panel display.

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