JP2005246424A - Apparatus and method for forming solder wicking prevention zone and connector member - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for forming a more effective solder wicking prevention zone in an electronic part, with a simple and inexpensive apparatus structure and with high positional accuracy. <P>SOLUTION: This is the apparatus for forming a solder wicking prevention zone 5 which hinders the solder from spreading in a wettable manner to a contact site 2 of a connector member 3 when the connector member 3 is processed using molten solder. The apparatus includes a forming agent tank 12 which stores a forming agent K used to form the solder wicking prevention zone, a dispenser 14 which is equipped with a nozzle 15 for ejecting the forming agent K stored in the forming agent tank 12, an overall control section 24 which controls the ejection quantity and speed of the forming agent K ejected from the nozzle 15, and a solidifying means such as a ultraviolet ray lamp 30 which solidifies the forming agent K applied to a predetermined position by being ejected from the dispenser. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for forming a solder rise prevention band, and an electronic component. TECHNICAL FIELD The present invention relates to an apparatus and method for forming a solder rising prevention band that prevents solder from spreading into a bonding site during a bonding process (hereinafter referred to as “molten soldering process”), and an electronic component on which the solder rising prevention band is formed. Is.

  Usually, a description will be given by taking up a connector member as a representative example of electronic components such as a connector member having an electrical contact, an IC lead frame, a resistor chip, a film carrier tape, and a capacitor. The connector member is generally manufactured through the following steps.

  That is, the first step, mainly pressing the copper alloy material into a predetermined shape, the second step, plating the electronic component, the third molding step, insert molding the electronic component, and the electronic component are completed. This is the fourth assembly process for assembling the product. Of these, the present invention relates to the improvement of the plating technique in the second step.

  A method of punching the pressed copper alloy material individually and barrel-plating the member, and winding the pressed copper alloy material into a coil shape, and then so-called continuous plating while continuously feeding the material There is a plating method. Although this invention can be used conveniently for continuous plating, it is applicable also to barrel plating.

  In the continuous plating method, first, pretreatment such as degreasing and activation is performed, then nickel plating is performed on the entire surface, then partial gold plating is performed on the contact portion, and solder plating is performed on the soldering portion as preliminary solder. On the other hand, as another continuous plating method, there is a method in which after nickel plating is performed on the entire surface, thin gold flash plating is performed on the entire surface, and then gold plating sufficient to obtain a contact effect required for the contact portion is stacked by continuous plating.

  In the fourth process, soldering is done to join with other parts, and the parts are completed. However, there are the following quality problems at the time of soldering, and it is indispensable to provide a soldering prevention band. ing. That is, the surface of solder plating and gold plating is a surface that is very well compatible with molten solder and is easily wetted. For this reason, the molten solder wets and spreads to the gold plating region of the contact part, and the malfunction that the function as a contact of the gold plating region is impaired occurs. For these reasons, it is common to provide a “solder rise prevention band” for the purpose of preventing the wet solder from spreading.

  In the soldering prevention band, a material that is not compatible with molten solder and difficult to wet must be provided by some means, and the following method has been used conventionally. One method is the use of a nickel plating film, and the other method is a method of applying a substance that inhibits solder wetting to the solder prevention zone. However, in any of these methods, it is very complicated and expensive to form a narrow solder prevention band having a width of about 0.5 mm or less.

  After the entire surface is nickel-plated, a method of masking so as not to form solder plating or gold plating film at the location to be used as a solder rising prevention band (hereinafter referred to as “masking method”), and controlling the plating liquid level to prevent the solder rising prevention band There is a method (hereinafter referred to as “liquid level control method”) in which a portion to be exposed is exposed to the atmosphere, and solder plating or gold plating is performed only on a portion requiring a plating film, and nickel is left in the solder rising prevention zone. As another method, after solder plating or gold plating, there is a method (hereinafter referred to as “removal method”) of removing the solder plating or gold plating at a portion that becomes a solder rising prevention zone and exposing the underlying nickel plating portion.

  There are two masking methods as follows. When performing solder plating or gold plating, masking is performed by pressing the belt-shaped shield against the workpiece continuously in synchronization with the speed of the workpiece, and at least before solder plating or gold plating. This is a method of continuously applying a masking material.

There are two removal methods as follows. Other than the part to be removed, the other is a method of coating with a masking agent and etching away with a chemical, and a method of evaporating and removing by irradiating a laser beam.
Patent application 2003-131186

  However, the manufacture of such a conventional connector member has the following problems.

  In other words, the connector member has been further reduced in size and pitch as compared with the conventional one, and the width of the current soldering prevention band has been reduced to 0.5 mm, but there is a strong demand for a further minute width. The current situation is.

  Maintaining the accuracy of the conventional techniques of the masking method and the liquid level control method is no longer limited in terms of technology and manufacturing technology. The laser beam irradiation method of the removal method has the potential among them.

  However, this technique that can irradiate minute portions continuously using a laser beam and precisely control the position accuracy is useful, but has not yet been put into practical use for the following reasons. This is because the solder plating and gold plating film must be volatilized in the atmosphere until the underlying nickel plating is exposed, and even though it is a minute part, it is exposed to a high temperature.

  The melting point of gold is about 1050 ° C., and solder plating differs depending on the type, but Sn-10Pb (solder based on Sn and containing 10 wt% Pb) is 217 ° C. . The gold plating layer is thin but has a high melting point, and the solder plating has a low melting point, but it is a thick film of around 5 μm. At present, the physical properties required of electronic components are damaged by heating, and no solution has been found.

  The problems in the manufacture of electronic parts as described above are summarized as follows.

  1) The connector is used repeatedly as an electrical contact. Therefore, the deterioration of spring characteristics and mechanical strength is positioned as an unacceptable important characteristic. Laser beam irradiation has a problem of impairing these various characteristics in the vicinity of the contact.

  2) Since gold plating and solder plating on nickel plating film reach the melting point or higher by heating, mutual diffusion is unavoidable, and a brittle intermetallic compound is formed, resulting in mechanical strength deterioration and compared to nickel plating film alone. There is a problem that the wettability as a solder rise prevention band is not sufficient.

  3) A laser beam that is cofrent and has excellent straightness is not effective because the laser beam does not directly strike a curved surface or a non-facing surface such as a punched fracture surface. Even if the soldering prevention band is provided only on one surface, the effect is reduced by half. Ideally, it should be provided all around the predetermined position of the electronic component. However, with the laser beam removal method, there is a problem that it is not possible to provide a solder rise prevention band all around the connector with one apparatus.

  4) The laser beam irradiation apparatus is very expensive, and is too large to be mounted on a connector continuous plating line and used as an on-line apparatus. There is a problem in that it has to be processed in a separate line, and it is not possible to obtain a merit that meets the strict required cost.

  As a means for solving these problems, the same applicant proposed Japanese Patent Application No. 2003-131186 (Patent Document 1) relating to the formation of an ink jet type solder-up prevention band, and is a useful means for improving reliability. However, further improvement in the reliability of the solder rise prevention band is becoming necessary.

  With the progress of complicated shapes, narrow pitches, and miniaturization of connectors, the position accuracy of the soldering prevention band is required to be higher. Positioning to satisfy these requirements becomes difficult with the ink jet system of Patent Document 1. And the film thickness of the solder rising prevention band applied by the ink jet method of Patent Document 1 is limited to the one in which the solder rising prevention band forming agent used is reduced in viscosity, resulting in a thin film. .

  A major problem with the prior art prior to the filing of Patent Document 1 is that it is difficult to form a solder rise prevention band on the press fracture surface of an electronic component. In this regard, the ink jet system disclosed in Patent Document 1 solves this problem by arranging a plurality of solder rising prevention band forming devices so as to surround a predetermined position of the electronic component. However, the complexity and cost of installation remains a challenge.

  The present invention has been made in view of such circumstances, and a first object of the invention is to provide an electronic component provided with a solder rise prevention band that effectively prevents solder rise.

  A second object of the present invention is to provide a solder rising prevention band forming apparatus and a forming method capable of providing an electronic component with a solder rising prevention band that effectively prevents solder rising.

  A third object of the present invention is to provide an apparatus and method for forming a soldering-up prevention band that can provide such a soldering-up prevention band on an electronic component with a simple and inexpensive apparatus configuration with higher positional accuracy. Is to provide.

  In order to achieve the above object, the present invention takes the following measures.

  That is, in order to achieve the first object, the electronic component according to the first aspect of the present invention is to apply a solder rising prevention band that prevents the solder from spreading during molten solder processing, by applying a material that does not wet the solder. I have.

  Therefore, in the electronic component according to the first aspect of the present invention, by taking the above-described means, it is possible to provide an electronic component provided with a solder rising prevention band that effectively prevents solder rising.

  In order to achieve the first object, the invention of claim 2 is the electronic component according to claim 1, wherein the substance that does not wet with solder is at least one or more of resin, ceramic, carbon, and glass. Is used.

  Therefore, in the electronic component according to the second aspect of the present invention, by taking the above-described means, it is possible to provide an electronic component provided with a solder rising prevention band that effectively prevents solder rising.

  According to a third aspect of the present invention, in order to achieve the first object, in the electronic component according to the first or second aspect, the solder rising prevention band has a color that is distinguishable from the surface to be coated. It is colored.

  Therefore, in the electronic component according to the third aspect of the present invention, it is only possible to provide an electronic component provided with a solder rising prevention band that effectively prevents solder rising by taking the above-described means. In addition, it is possible to easily distinguish between electronic parts with a soldering-up prevention band and electronic parts without a soldering-up prevention band, and further distinguish between electronic parts by color-coding the soldering prevention band. Becomes easy.

  In order to achieve the second object, the invention according to claim 4 is an apparatus for forming a solder rising prevention band that prevents the solder from spreading outside the joining part of the electronic component during the molten soldering process of the electronic component. , A storage means for storing a forming agent for forming a solder rise prevention band, a discharge means for discharging the forming agent stored in the storage means, and a discharge amount and a discharge speed of the forming agent discharged from the discharge means are controlled. And a solidifying means for solidifying the forming agent applied to a predetermined position of the electronic component by being discharged from the discharging means. Examples of the solidifying means include a method of solidifying the forming agent by heating, a method of solidifying the forming agent by baking and decomposition, a method of solidifying by irradiation with light such as ultraviolet rays or an electron beam, and the like.

  Therefore, in the apparatus for forming a soldering-up prevention band according to the fourth aspect of the invention, it is possible to provide the electronic component with a soldering-up prevention band that effectively prevents soldering by taking the above-described means. .

  According to a fifth aspect of the present invention, in order to achieve the second object, in the apparatus according to the fourth aspect of the present invention, a plurality of discharge means are arranged so as to surround a predetermined position of the electronic component and discharged from each discharge means. By controlling the discharge amount and discharge speed of the forming agent by the control means, the forming agent is applied to a predetermined position.

  Therefore, in the apparatus for forming a soldering-up prevention band according to the fifth aspect of the invention, it is possible to reliably provide the electronic component with a soldering-up prevention band that effectively prevents soldering by taking the above-described means. It becomes.

  According to a sixth aspect of the present invention, in order to achieve the second object, in the apparatus according to the fourth or fifth aspect, an ultraviolet curable resin is used as a forming agent, and ultraviolet rays are applied to the forming agent applied at a predetermined position. UV irradiation means is further provided.

  Therefore, in the apparatus for forming the soldering prevention band according to the invention of claim 6, by taking the above-described means, the soldering prevention band for effectively preventing soldering can be provided in the electronic component in a short time. It becomes possible.

  According to a seventh aspect of the present invention, in order to achieve the second and third objects, in the apparatus according to any one of the fourth to sixth aspects, a dispenser is used as the discharge means.

  Therefore, in the apparatus for forming a soldering-up prevention band according to the invention of claim 7, the soldering-up prevention band that effectively prevents the soldering-up can be obtained with a simple and inexpensive apparatus configuration by taking the above-described means. In addition, it is possible to provide the electronic component with higher positional accuracy.

  In order to achieve the second and third objects, the invention according to claim 8 is a method for forming a solder rising prevention band that prevents the solder from spreading outside the joint part of the electronic component during the molten soldering process of the electronic component. A forming agent for forming a solder rise prevention band is applied to a predetermined position of an electronic component by discharging from a nozzle of a dispenser at a predetermined discharge amount and discharge speed, and the applied forming agent The solder rise prevention band is formed by solidifying.

  Therefore, in the method for forming a soldering-up prevention band according to the invention of claim 8, the soldering-up prevention band that effectively prevents the soldering-up by adopting the above-described means can be formed with a simple and inexpensive apparatus configuration. In addition, it is possible to provide the electronic component with higher positional accuracy.

  According to a ninth aspect of the present invention, in the method of the eighth aspect, an ultraviolet curable resin is used as a forming agent, and the forming agent applied at a predetermined position is irradiated with ultraviolet rays to solidify the forming agent.

  Therefore, in the method for forming a soldering-up prevention band according to the invention of claim 9, the soldering-up prevention band that effectively prevents the soldering-up can be obtained with a simple and inexpensive apparatus configuration by taking the above-described means. Furthermore, it is possible to provide the electronic component with high positional accuracy in a short time.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the electronic component provided with the solder rise prevention band which prevents solder rise effectively.

  In addition, it is possible to provide a solder rising prevention band forming apparatus and a forming method capable of providing an electronic component with a solder rising prevention band that effectively prevents solder rising.

  Furthermore, it is possible to provide a solder rising prevention band forming apparatus and a forming method capable of providing such a solder rising prevention band on an electronic component with a simple and inexpensive apparatus configuration with higher positional accuracy. Become.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is an elevational sectional view showing an example of a connector member having a solder rise prevention band. Here, using FIG. 1 as an example, the connector member 3 is inserted into the through hole 35 of the printed circuit board 32 formed by copper plating 34 around the glass / epoxy base material 33 and soldered by flow soldering. explain.

  That is, as shown in the example of FIG. 1, the solder rising prevention band forming apparatus to which the solder rising prevention band forming method according to the embodiment of the present invention is applied, for example, a gold plating contact provided on the flash gold plating 1. When the molten solder 4 is applied to an electronic component such as the connector member 3 having the portion 2, the solder rising prevention band 5 prevents the molten solder 4 from rising and getting wet to the gold plating contact portion 2. Is a device for forming The connector member 3 is made of, for example, a copper alloy and further plated with nickel 7 on the entire surface.

  The solder rise prevention band formed by the solder rise prevention band forming apparatus to which the solder rise prevention band forming method according to the embodiment is applied is provided on the surface plated with nickel as shown in FIG. However, the present invention is not limited to this case. When the solder rising prevention band 5 is provided directly on the material as shown in FIG. 2 (a), the solder rising on the flash gold plating 1 as shown in FIG. 2 (b). For example, the prevention band 5 may be provided. Instead of the flash gold plating 1, thick gold plating may be used.

  When the solder rising prevention band 5 provided in this way must be narrowed to a width of 0.5 mm or less, the solder exceeds the solder prevention band 5 as shown in FIG. There is a risk of spreading to the side of the. In order to prevent such danger, it is effective to increase the height of the solder rising prevention band 5 as shown in FIG. Since the solder rising prevention band forming method using a dispenser as described later can use a forming agent having a higher viscosity (more active ingredients) than the ink jet method applied in Patent Document 1, such a method is used. Is advantageous in some cases.

  As an example of a method for molding the electronic member, a method for molding the connector member 3 will be described with reference to FIG.

  The connector member 3 is processed into a shape as shown in FIG. 4B by pressing a base material 6 made of, for example, a copper alloy as shown in FIG. Further, positioning holes 9 are formed at a constant pitch in the flat plate portion 8 where the connector member 3 is not formed.

  Next, as shown in FIG. 5, the nickel plating 7 is applied so as to cover the entire surface of the connector member 3 and the flat plate portion 8, and the gold plating contact portion 2 is formed by applying a partial plating with gold to the connector member 3. Then, solder plating is performed on the leg portion side of the connector member 3 as the preliminary solder 4a. Thereafter, the connector member 3 is separated from the flat plate portion 8, and the preliminary solder portion 4 a is integrated with the molten solder 4 to be joined to other components.

  At this time, if there is no solder rising prevention band 5, as shown in FIG. 6, the molten solder 4 may spread to the height of the gold-plated contact portion 2 and may not function as a contact.

  FIG. 7 is a functional block showing a configuration example of a solder rising prevention band forming apparatus 10 which is developed to form such a solder rising prevention band 5 and to which the solder rising prevention band forming method according to the embodiment is applied. FIG. That is, the solder rising prevention band forming apparatus 10 according to the embodiment includes a forming agent tank 12, a dispenser 14, a dispenser driving unit 21, a position sensor 22, an overall control unit 24, and an ultraviolet lamp 30. ing.

  The ultraviolet lamp 30 is used only when an ultraviolet curable resin is used as a forming agent. When a forming agent other than the ultraviolet curable resin is used, a solidification suitable for solidifying the forming agent to be used is used. Change to law. Further, the ultraviolet lamp 30 does not necessarily have to be integrated with the solder rising prevention band forming device 10 and may be provided as a separate device. When using other solidification methods, they need not be integrated in the same way.

  The forming agent tank 12 stores a forming agent for forming the solder rising prevention band 5 therein. Such a forming agent can be arbitrarily selected from a low viscosity of 1 (Pa · s) or less to a high viscosity like a grease, and is adapted to the performance required for the solder rising prevention band 5. A substance suitable for the solder rising prevention band 5 having an optimum viscosity for the film thickness can be selected and used. As such a substance, for example, a substance containing one or more of a resin, preferably an ultraviolet curable resin, ceramic, carbon, and glass is used. Further, a water / oil repellent material such as a flux bleeding-inhibiting agent may be used. Further, in such a forming agent, a coloring agent for coloring the solder rising prevention band 5 so that the solder rising prevention band 5 is formed on the connector member 3 and the distinction from other parts can be easily recognized. May be mixed as appropriate.

  The above-described forming agent stored in the forming agent tank 12 is discharged from the tip of the nozzle 15 of the dispenser 14 at a discharge amount and a discharge speed in accordance with control from the overall control unit 24.

  When the position sensor 22 detects that the connector member 3 is at the application position where the forming agent K is applied, the position sensor 22 outputs a detection signal to the overall control unit 24. An example of this detection method will be described later.

  When the detection signal is output from the position sensor 22, the overall control unit 24 sends a signal to the dispenser driving unit 21 and sets the tip of the nozzle 15 at a predetermined position. The forming agent tank 12 is supplied with a predetermined pressure according to the properties of the forming agent that is sent to the forming agent tank 12 and stored, the material of the connector member 3, and the width and thickness of the solder rising prevention band 5 to be formed. Add. With this pressure, the forming agent stored in the forming agent tank 12 is pushed out to the dispenser 14 and further discharged from the tip of the nozzle 15 at a predetermined discharge amount and discharge speed. The method of setting the tip of the nozzle 15 at a predetermined position may be separated from the overall control unit 24 and may be made independent, or may be performed manually.

  Since various types of nozzles 15 made of metal or resin are commercially available, the nozzle 15 is selected from among them according to the application. The tip direction of the nozzle 15 is adjusted in advance so that the discharged forming agent is applied to a predetermined position of the connector member 3. Since the tip shape of the commercially available nozzle 15 can be thin, long, or bent, the shape of the nozzle 15 is processed according to the configuration of the apparatus as shown in FIG. It is easy to install the tip of the connector corresponding to the predetermined position of the connector member 3. As shown in FIG. 9, a multi-nozzle 16 having a plurality of discharge ports for multi-point discharge is also commercially available and can be used as required.

  Further, since the diameter of the tip of the nozzle 15 determines the width of the solder rising prevention band 5 to be formed, a nozzle having an appropriate size is used according to the width of the solder rising prevention band 5 to be formed. The nozzle 15 is commercially available and can be arbitrarily selected from 0.1 to several mmφ, and has a high degree of freedom that it can be selected according to the application. The price is also low.

  As the positional relationship between the tip of the nozzle 15 and the connector member 3, for example, as shown in FIG. 10 (a), the tip of the nozzle 15 may be set slightly apart from the surface of the connector member 3. As shown to (b), you may press and install so that the connector member 3 may not deform | transform. Alternatively, as shown in FIG. 10 (c), the tip of the nozzle 15 may be installed completely away from the surface of the connector member 3. The connector member 3 and the flat plate portion 8 shown in FIG. 10 are views seen from the direction of the AA line shown in FIG.

  In the case shown in FIG. 10A, the forming agent K discharged from the tip of the nozzle 15 grows into droplets, and these droplets are applied to the connector member 3. In addition, since the tip of the nozzle 15 and the connector member 3 are not in contact with each other, the connector member 3 is not damaged.

  In the case shown in FIG. 10B, the forming agent K discharged from the tip of the nozzle 15 is applied directly to the connector member 3 before growing into droplets.

  In the case shown in FIG. 10C, the forming agent K discharged from the tip of the nozzle 15 is skipped and applied to the connector member 3. In this case, since the control can be performed in a short time in units of milliseconds per shot and the discharge distance of 10 mm length can be accurately skipped, the relatively deformable member and the nozzle 15 cannot be brought close to each other. Suitable for the connector member 3. The formation of the solder rise prevention band 5 on the connector member 3, particularly the solder rise prevention band 5 on the press fracture surface, is arranged with the tip of the nozzle 15 inclined with respect to the target position.

  By appropriately arranging the nozzles 15 in this manner, the forming agent K can be reliably applied to any predetermined position even for the connector member 3 that tends to be further miniaturized and complicated. Further, in order to more reliably prevent the solder from rising, even if a plurality of solder rising prevention bands 5 are provided on the connector member 3, this is facilitated.

  When an ultraviolet curable resin is used as the forming agent K, the ultraviolet lamp 30 irradiates the ultraviolet curable resin applied to the connector member 3 with ultraviolet rays, thereby curing the ultraviolet curable resin.

  FIG. 11 is a schematic diagram showing an example of the arrangement of such a solder rising prevention band forming device 10, and the connector member 3 and the flat plate portion 8 shown in the drawing are taken along line AA shown in FIG. 4 (b). It is the figure seen from the direction. In FIG. 11, a pair of one-side dispensers 14 (# 1, # 2) and dispensers (# 3, # 4) are provided, and the nozzle 15 (# 1) of the dispenser 14 (# 1) and the nozzle of the dispenser 14 (# 4) 15 (# 4), and the nozzle 15 (# 2) of the dispenser 14 (# 2) and the nozzle 15 (# 3) of the dispenser 14 (# 3) are provided in opposite directions. Thus, a plurality of dispensers 14 and nozzles 15 may be provided. Then, the forming agent K discharged from the nozzles 15 (# 1, # 2) is discharged from the nozzles 15 (# 3, # 4) to the outer periphery of one half of the connector member 3 as shown in FIG. The forming agent K is applied to the outer periphery of the remaining half of the connector member 3 to form the solder rising prevention band 5. Of course, when the thickness of the base material 6 is thin, the dispenser 14 and the nozzle 15 may be provided only on one side.

  In addition, when applying to the connector member 3 while flying the forming agent K, as shown in FIG. 11, a pair of nozzles 15 (# 1, # 2) on one side and nozzles 15 (# 3, # 4) are It is preferable to arrange them so as to face each other while being inclined with respect to the transport direction F.

  In addition, the solder rise prevention band forming apparatus 10 is provided with a conveying means (not shown), thereby conveying the connector member 3 continuously or intermittently along the conveying direction F together with the flat plate portion 8.

  As shown in FIG. 11, the connector member 3 is transported along the transport direction F by a transport means (not shown), and the connector member 3 comes to the closest point to each nozzle 15 (# 1, # 2, # 3, # 4). If this happens, the position sensor 22 detects this and outputs a detection signal to the overall control unit 24. The position sensor 22 can use a combination of a photodiode and a light receiving sensor or a method such as image processing.

  When the detection signal is output from the position sensor 22 in this way, the overall control unit 24 sends a signal to the dispenser driving unit 21 to set the tip of the nozzle 15 at a predetermined position. In addition, a predetermined pressure is applied to the forming agent tank 12 according to the properties of the forming agent K stored by sending a signal to the forming agent tank 12, the material of the connector member 3, and the width and thickness of the soldering prevention band 5 to be formed. Add. With this pressure, the forming agent K stored in the forming agent tank 12 is pushed out to the dispenser 14 and further discharged from the tip of the nozzle 15 at a predetermined discharge amount and discharge speed.

  The conveying means further conveys the connector member 3 coated with the forming agent K at a predetermined position along the conveying direction F. An ultraviolet lamp 30 is provided at the top of the conveyance, and the forming agent K applied to the connector member 3 is irradiated with ultraviolet rays V emitted from the ultraviolet lamp 30. Thus, when an ultraviolet curable resin is used as the forming agent K, it is efficiently cured. When a substance other than the ultraviolet curable resin is used as the forming agent K, the ultraviolet lamp 30 is unnecessary, but the solidification method is changed to a solidification method suitable for solidifying the forming agent to be used.

  Next, the operation of the solder rising prevention band forming apparatus 10 as shown in FIG. 7 will be described.

  First, when the connector member 3 is transported along the transport direction F by a transport means (not shown) and the connector member 3 comes to the closest point to the nozzle 15, this is detected by the position sensor 22. Then, a detection signal is output from the position sensor 22 to the overall control unit 24.

  When this detection signal is received by the overall control unit 24, a signal is sent from the overall control unit 24 to the dispenser driving unit 21, and the nozzle 15 is set at a predetermined position. At the same time, pressure is applied to the forming agent tank 12. The value of this pressure is determined in advance according to the property of the forming agent K stored in the forming agent tank 12, the material of the connector member 3, and the width and thickness of the solder rising prevention band 5 to be formed.

  By this pressure, the forming agent K stored in the forming agent tank 12 is pushed out to the dispenser 14 and discharged from the tip of the nozzle 15 at a predetermined discharge amount and discharge speed.

  Thereby, the forming agent K is applied to the entire circumference of the connector member 3 in FIG.

  In this way, as shown in FIG. 11, the solder rising prevention band 5 is reliably formed along the outer periphery of the connector member 3 at a predetermined position. In addition, since the use of the dispenser 14 and the nozzle 15 makes it possible to use a higher viscosity forming agent than in the past, the use of such a high viscosity forming agent makes it possible to provide a more stable solder rise prevention band 5. Can also be provided. Further, by previously mixing a colorant with the forming agent K, it is possible to easily recognize that the solder rising prevention band 5 is formed on the connector member 3. Furthermore, by distinguishing the soldering prevention band by color, it becomes easy to distinguish between electronic components.

  Such a solder rise prevention band 6 may be peeled off after the preliminary solder 4a is provided, if necessary, or may be used as it is as a final product. In addition, since the solder rising prevention band 5 as described above may be implemented in any process as long as the purpose can be achieved, it is not limited to the connector member 3 on which the nickel plating 7 is made, and is performed before the nickel plating process. Alternatively, it may be after gold plating after nickel plating.

  As described above, in the solder rise prevention band forming apparatus to which the method for forming a solder rise prevention band according to the embodiment of the present invention is applied, the above-described action causes the connector member 3 along the outer periphery at a predetermined position. The solder rising prevention band 5 can be reliably formed with high positional accuracy, efficiency and stability. Further, by mixing the colorant with the forming agent K, it is possible to easily recognize that the solder rising prevention band 5 is formed on the connector member 3.

  Further, since various types of nozzles 15 made of metal or resin are commercially available, they can be selected from among them according to the application. Further, since the shape of the nozzle 15 can be thin, long or bent according to the configuration of the apparatus, the tip of the nozzle 15 can be easily fixed at a predetermined position of the connector member 3. It is possible to suppress the generation of costs and configure the device at a low cost.

  As described above, the preferred embodiment of the present invention has been described with respect to the connector member 3 with reference to the accompanying drawings, but the present invention is not limited to such a configuration. Within the scope of the invented technical idea of the scope of claims, a person skilled in the art can conceive of various changes and modifications. The technical scope of the present invention is also applicable to these changes and modifications. It is understood that it belongs to.

FIG. 3 is an elevational sectional view showing an example of a connector member having a solder rise prevention band. The fragmentary sectional view which shows an example of the solder rising prevention band provided in the connector member. The fragmentary sectional view which shows an example of the solder rising prevention band provided in the connector member. The elevational sectional view of the connector member and flat plate part which shows an example of the manufacturing method of a connector member. An elevational sectional view showing an example of a connector member not provided with a solder rise prevention band (when solder does not spread to the gold plating joint). Sectional drawing which shows an example of the connector member which is not equipped with the soldering prevention belt | band | zone (when solder spreads to a gold plating junction part). The functional block diagram which shows the structural example of the solder rise prevention band formation apparatus to which the formation method of the solder rise prevention band which concerns on the embodiment is applied. The schematic diagram which shows an example of the front-end | tip shape of a nozzle. The schematic diagram which shows an example of a multi-nozzle. The conceptual diagram which shows the example of the positional relationship of a nozzle and a connector member. The conceptual diagram which shows the example of arrangement | positioning of the nozzle in the case of flying a forming agent toward a connector member.

Explanation of symbols

  F: Transport direction, K: Forming agent, 1 ... Flash gold plating, 2 ... Gold plating joint, 3 ... Connector, 4 ... Molten solder, 4a ... Pre-solder, 5 ... Solder up prevention band, 6 ... Base material, DESCRIPTION OF SYMBOLS 7 ... Nickel plating, 8 ... Flat plate part, 9 ... Positioning hole, 10 ... Solder up prevention band formation apparatus, 12 ... Forming agent tank, 14 ... Dispenser, 15 ... Nozzle, 16 ... Multi nozzle, 21 ... Dispenser drive part, 22 ... position sensor, 24 ... overall control unit, 30 ... ultraviolet lamp, 32 ... printed circuit board, 33 ... glass / epoxy substrate, 34 ... copper plating, 35 ... through hole

The present invention relates to an apparatus and method for forming a solder rise prevention band, and a connector member. When a connector member having electrical contacts is joined using molten solder (hereinafter referred to as “molten solder treatment”), The present invention relates to an apparatus and method for forming a soldering-up prevention band that prevents wetting and spreading at a joint site, and a connector member on which a soldering-up prevention band is formed.

  In general, a connector member provided with electrical contacts is generally manufactured through the following steps.

That finished the first step of mainly pressing a copper alloy material into a predetermined shape, and a second step of plating the connector member and then a third step of molding the insert molding the connector member, the connector member This is the fourth assembly process for assembling the product. Of these, the present invention relates to the improvement of the plating technique in the second step.

  A method of punching the pressed copper alloy material individually and barrel-plating the member, and winding the pressed copper alloy material into a coil shape, and then so-called continuous plating while continuously feeding the material There is a plating method. Although this invention can be used conveniently for continuous plating, it is applicable also to barrel plating.

  In the continuous plating method, first, pretreatment such as degreasing and activation is performed, then nickel plating is performed on the entire surface, then partial gold plating is performed on the contact portion, and solder plating is performed on the soldering portion as a preliminary solder. On the other hand, as another continuous plating method, there is a method in which after nickel plating is performed on the entire surface, thin gold flash plating is performed on the entire surface, and then gold plating sufficient to obtain a contact effect required for the contact portion is stacked by continuous plating.

  In the fourth process, soldering is done to join with other parts, and the parts are completed. However, there are the following quality problems at the time of soldering, and it is indispensable to provide a soldering prevention band. ing. That is, the surface of solder plating and gold plating is a surface that is very well compatible with molten solder and is easily wetted. For this reason, the molten solder wets and spreads to the gold plating region of the contact part, and the malfunction that the function as a contact of the gold plating region is impaired occurs. For these reasons, it is common to provide a “solder rise prevention band” for the purpose of preventing the wet solder from spreading.

  In the soldering prevention band, a material that is not compatible with molten solder and difficult to wet must be provided by some means, and the following method has been used conventionally. One method is the use of a nickel plating film, and the other method is a method of applying a substance that inhibits solder wetting to the solder prevention zone. However, in any of these methods, it is very complicated and expensive to form a narrow solder prevention band having a width of about 0.5 mm or less.

  After the entire surface is nickel-plated, a method of masking so as not to form solder plating or gold plating film at the location to be used as a solder rising prevention band (hereinafter referred to as “masking method”), and controlling the plating liquid level to prevent the solder rising prevention band There is a method (hereinafter referred to as “liquid level control method”) in which a portion to be exposed is exposed to the atmosphere, and solder plating or gold plating is performed only on a portion requiring a plating film, and nickel is left in the solder rising prevention zone. As another method, after solder plating or gold plating, there is a method (hereinafter referred to as “removal method”) in which the solder plating or gold plating in a portion that becomes a solder rise prevention zone is removed and the underlying nickel plating portion is exposed.

  There are two masking methods as follows. When performing solder plating or gold plating, masking is performed by pressing the belt-shaped shield against the workpiece continuously in synchronization with the speed of the workpiece, and at least before solder plating or gold plating. This is a method of continuously applying a masking material.

There are two removal methods as follows. Other than the part to be removed, the other is a method of coating with a masking agent and etching away with a chemical, and a method of evaporating and removing by irradiating a laser beam.
Patent application 2003-131186

  However, the manufacture of such a conventional connector member has the following problems.

  In other words, the connector member has been further reduced in size and pitch as compared with the conventional one, and the width of the current soldering prevention band has been reduced to 0.5 mm, but there is a strong demand for a further minute width. The current situation is.

  Maintaining the accuracy of the conventional techniques of the masking method and the liquid level control method is no longer limited in terms of technology and manufacturing technology. The laser beam irradiation method of the removal method has the potential among them.

  However, this technique that can irradiate minute portions continuously using a laser beam and precisely control the position accuracy is useful, but has not yet been put into practical use for the following reasons. This is because the solder plating and gold plating film must be volatilized in the atmosphere until the underlying nickel plating is exposed, and even though it is a minute part, it is exposed to a high temperature.

The melting point of gold is about 1050 ° C., and solder plating varies depending on the type, but Sn-10Pb (solder based on Sn and containing 10 wt% Pb) is 217 ° C., which is generally used. . The gold plating layer is thin but has a high melting point, and the solder plating has a low melting point, but it is a thick film of around 5 μm. The physical properties required of connector members are damaged by heating, and no solution has been found at present.

The problems in manufacturing the connector member as described above are summarized as follows.

1) The connector member is repeatedly used as an electrical contact. Therefore, the deterioration of spring characteristics and mechanical strength is positioned as an unacceptable important characteristic. Laser beam irradiation has a problem of impairing these various characteristics in the vicinity of the contact.

  2) Gold plating and solder plating on the nickel plating film reach the melting point or higher by heating, so interdiffusion is inevitable. Compared to the nickel plating film alone, along with mechanical strength deterioration due to the formation of brittle intermetallic compounds. There is a problem that the wettability as a solder rise prevention band is not sufficient.

3) A laser beam that is cofrent and has excellent straightness is not effective because the laser beam does not directly strike a curved surface or a non-facing surface such as a punched fracture surface. Even if the soldering prevention band is provided only on one surface, the effect is reduced by half. Ideally, the connector member should be provided around the entire circumference of the predetermined position. However, with the laser beam removal method, there is a problem that it is not possible to provide a solder rise prevention band all around the connector member with one apparatus.

4) The laser beam irradiation device is very expensive and is too large to be used as an on-line device on a connector member continuous plating line. There is a problem in that it has to be processed in a separate line, and it is not possible to obtain a merit that meets the strict required cost.

  As a means for solving these problems, the same applicant proposed Japanese Patent Application No. 2003-131186 (Patent Document 1) relating to the formation of an ink jet type solder-up prevention band, and is a useful means for improving reliability. However, further improvement in the reliability of the solder rise prevention band is becoming necessary.

With the progress of complicated shape, narrow pitch, and miniaturization of connector members , the position accuracy of the solder rising prevention band is required to be higher, and positioning to satisfy these requirements is difficult with the ink jet system of Patent Document 1. And the film thickness of the solder rising prevention band applied by the ink jet method of Patent Document 1 is limited to the low viscosity of the solder rising prevention band forming agent used. End up.

  A major problem with the prior art prior to the filing of Patent Document 1 is that it is difficult to form a solder rise prevention band on the press fracture surface of an electronic component. In this regard, the ink jet system of Patent Document 1 solves this problem by arranging a plurality of solder rising prevention band forming devices so as to surround a predetermined position of the electronic component. However, the complexity and cost of installation remains a challenge.

The present invention has been made in view of such circumstances, and a first object of the present invention is to provide a connector member provided with a solder rise prevention band that effectively prevents solder rise.

A second object of the present invention is to provide a solder rising prevention band forming apparatus and a forming method capable of providing a connector member with a solder rising prevention band that effectively prevents solder rising.

A third object of the present invention is to provide an apparatus and method for forming a soldering-up prevention band that can provide such a soldering-up prevention band on a connector member with a simple and inexpensive apparatus configuration with higher positional accuracy. Is to provide.

  In order to achieve the above object, the present invention takes the following measures.

In other words, the connector member according to the first aspect of the present invention is a connector member that is continuously manufactured to achieve the first object. By being applied to the position, a solder rise prevention band is provided to prevent the solder from spreading during the molten solder process.
Thus, in the connector member of the invention of claim 1, by taking measures such as described above, it is possible to provide a connector member solder wicking prevention band to prevent solder wicking effectively is provided.

In order to achieve the first object, the connector member according to claim 1 is the connector member according to claim 1, wherein the substance that does not wet with solder is at least one or more of resin, ceramic, carbon, and glass. Is used.

Therefore, in the connector member according to the second aspect of the present invention, by taking the above-described means, it is possible to provide a connector member provided with a solder rise prevention band that effectively prevents solder rise.

According to a third aspect of the present invention, in order to achieve the first object, in the connector member according to the first or second aspect, the solder rising prevention band has a color different from the surface to be coated. It is colored.

Therefore, in the connector member of the invention of claim 3, by providing the above-mentioned means, it is only possible to provide a connector member provided with a solder rise prevention band that effectively prevents solder rise. not, discrimination between the connector member by being color-coded and connector member solder wicking prevention band is provided, to identify easily the connector member solder wicking prevention zone is not provided or, migration prevention bands solder further Becomes easier.

A fourth aspect of the present invention, in order to achieve the second object, an apparatus for solder when melted soldering of the connector member forms a solder wicking prevention zone to prevent the spreading wetting besides junction connector member , A storage means for storing a forming agent for forming a solder rise prevention band, a discharge means for discharging the forming agent stored in the storage means, and a discharge amount and a discharge speed of the forming agent discharged from the discharge means are controlled. And a solidifying means for solidifying the forming agent applied to a predetermined position of the connector member by being discharged from the discharge means. Examples of the solidifying means include a method of solidifying the forming agent by heating, a method of solidifying the forming agent by baking and decomposition, a method of solidifying by irradiation with light such as ultraviolet rays or an electron beam, and the like.

Therefore, in the apparatus for forming a soldering-up prevention band according to the invention of claim 4, it is possible to provide the connector member with a soldering-up prevention band that effectively prevents soldering by taking the above-described means. .

According to a fifth aspect of the present invention, in order to achieve the second object, in the apparatus according to the fourth aspect, a plurality of discharge means are disposed so as to surround a predetermined position of the connector member and discharged from each discharge means. By controlling the discharge amount and discharge speed of the forming agent by the control means, the forming agent is applied to a predetermined position.

Therefore, in the apparatus for forming a soldering-up prevention band according to the fifth aspect of the present invention, it is possible to reliably provide the connector member with a soldering-up prevention band that effectively prevents soldering by taking the above-described means. It becomes.

  According to a sixth aspect of the present invention, in order to achieve the second object, in the apparatus according to the fourth or fifth aspect, an ultraviolet curable resin is used as a forming agent, and ultraviolet rays are applied to the forming agent applied at a predetermined position. UV irradiation means is further provided.

Therefore, in the apparatus for forming a soldering-up prevention band according to the invention of claim 6, the connector member can be provided with a soldering-up prevention band for effectively preventing the soldering up in a short time by taking the above-described means. It becomes possible.

  According to a seventh aspect of the present invention, in order to achieve the second and third objects, in the apparatus according to any one of the fourth to sixth aspects, a dispenser is used as the discharge means.

Therefore, in the apparatus for forming a soldering-up prevention band according to the invention of claim 7, the soldering-up prevention band that effectively prevents the soldering-up can be obtained with a simple and inexpensive apparatus configuration by taking the above-described means. Further, the connector member can be provided with higher positional accuracy.

The invention of claim 8 is a method for achieving the second and third objectives, solder when melted soldering of the connector member forms a solder wicking prevention zone to prevent the spreading wetting besides junction connector member Then, a forming agent for forming a solder rise prevention band is applied to a predetermined position of the connector member by discharging from a nozzle of a dispenser at a predetermined discharge amount and discharge speed, and the applied forming agent The solder rise prevention band is formed by solidifying.

Therefore, in the method for forming a soldering-up prevention band according to the invention of claim 8, the soldering-up prevention band that effectively prevents the soldering-up by adopting the above-described means can be formed with a simple and inexpensive apparatus configuration. Further, the connector member can be provided with higher positional accuracy.

  According to a ninth aspect of the present invention, in the method of the eighth aspect, an ultraviolet curable resin is used as a forming agent, and the forming agent applied at a predetermined position is irradiated with ultraviolet rays to solidify the forming agent.

Therefore, in the method for forming a soldering-up prevention band according to the invention of claim 9, the soldering-up prevention band that effectively prevents the soldering-up can be obtained with a simple and inexpensive apparatus configuration by taking the above-described means. In addition, the connector member can be provided in a short time with high positional accuracy.

  The invention of claim 10 is a method of continuously forming a connector member having a solder rise prevention band while continuously feeding out the connector member pressed into a predetermined shape and wound in a coil shape. In the process of continuously drawing out the connector member, a material that does not wet with solder is applied to a predetermined position of the connector member to form a solder rise prevention band on the connector member.
  Therefore, in the method for forming a soldering-up prevention band according to the tenth aspect of the invention, the connector member having the soldering-up prevention band can be continuously produced by taking the above-described means.

ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to provide the connector member provided with the solder rise prevention band which prevents solder rise effectively.

In addition, it is possible to provide a solder rise prevention band forming apparatus and a formation method capable of providing a connector member with a solder rise prevention band that effectively prevents solder rise.

Furthermore, it is possible to provide a solder rising prevention band forming apparatus and a forming method capable of providing such a solder rising prevention band on a connector member with a simple and inexpensive apparatus configuration with higher positional accuracy. Become.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  FIG. 1 is an elevational sectional view showing an example of a connector member having a solder rise prevention band. Here, using FIG. 1 as an example, the connector member 3 is inserted into the through hole 35 of the printed circuit board 32 formed by copper plating 34 around the glass / epoxy base material 33 and soldered by flow soldering. explain.

  That is, as shown in the example of FIG. 1, the solder rising prevention band forming apparatus to which the solder rising prevention band forming method according to the embodiment of the present invention is applied, for example, a gold plating contact provided on the flash gold plating 1. When the molten solder 4 is applied to an electronic component such as the connector member 3 having the portion 2, the solder rising prevention band 5 prevents the molten solder 4 from rising and getting wet to the gold plating contact portion 2. Is a device for forming The connector member 3 is made of, for example, a copper alloy and further plated with nickel 7 on the entire surface.

  The solder rise prevention band formed by the solder rise prevention band forming apparatus to which the solder rise prevention band forming method according to the embodiment is applied is provided on the surface plated with nickel as shown in FIG. However, the present invention is not limited to the case, and as shown in FIG. 2 (a), when the soldering prevention band 5 is provided directly on the material, the soldering up on the flash gold plating 1 as shown in FIG. 2 (b). For example, the prevention band 5 may be provided. Instead of the flash gold plating 1, thick gold plating may be used.

  When the solder rising prevention band 5 provided in this way must be narrowed to a width of 0.5 mm or less, the solder exceeds the solder prevention band 5 as shown in FIG. There is a risk of spreading to the side of the. In order to prevent such a danger, it is effective to increase the height of the solder rising prevention band 5 as shown in FIG. Since the solder rising prevention band forming method using a dispenser as described later can use a forming agent having a higher viscosity (more active ingredients) than the ink jet method applied in Patent Document 1, such a method is used. Is advantageous in some cases.

  As an example of a method for molding the electronic member, a method for molding the connector member 3 will be described with reference to FIG.

  The connector member 3 is processed into a shape as shown in FIG. 4B by pressing a base material 6 made of, for example, a copper alloy as shown in FIG. Further, positioning holes 9 are formed at a constant pitch in the flat plate portion 8 where the connector member 3 is not formed.

  Next, as shown in FIG. 5, the nickel plating 7 is applied so as to cover the entire surface of the connector member 3 and the flat plate portion 8, and the gold plating contact portion 2 is formed by applying a partial plating with gold to the connector member 3. Then, solder plating is performed on the leg portion side of the connector member 3 as the preliminary solder 4a. Thereafter, the connector member 3 is separated from the flat plate portion 8, and the preliminary solder portion 4 a is integrated with the molten solder 4 to be joined to other components.

  At this time, if there is no solder rising prevention band 5, as shown in FIG. 6, the molten solder 4 may spread to the height of the gold-plated contact portion 2 and may not function as a contact.

  FIG. 7 is a functional block showing a configuration example of a solder rising prevention band forming apparatus 10 which is developed to form such a solder rising prevention band 5 and to which the solder rising prevention band forming method according to the embodiment is applied. FIG. That is, the solder rising prevention band forming apparatus 10 according to the embodiment includes a forming agent tank 12, a dispenser 14, a dispenser driving unit 21, a position sensor 22, an overall control unit 24, and an ultraviolet lamp 30. ing.

  The ultraviolet lamp 30 is used only when an ultraviolet curable resin is used as a forming agent. When a forming agent other than the ultraviolet curable resin is used, a solidification suitable for solidifying the forming agent to be used is used. Change to law. Further, the ultraviolet lamp 30 does not necessarily have to be integrated with the solder rising prevention band forming device 10 and may be provided as a separate device. When using other solidification methods, they need not be integrated in the same way.

  The forming agent tank 12 stores a forming agent for forming the solder rising prevention band 5 therein. Such a forming agent can be arbitrarily selected from a low viscosity of 1 (Pa · s) or less to a high viscosity like a grease, and is adapted to the performance required for the solder rising prevention band 5. A substance suitable for the solder rising prevention band 5 having an optimum viscosity for the film thickness can be selected and used. As such a substance, for example, a substance containing one or more of a resin, preferably an ultraviolet curable resin, ceramic, carbon, and glass is used. Further, a water / oil repellent material such as a flux bleeding-inhibiting agent may be used. Further, in such a forming agent, a coloring agent for coloring the solder rising prevention band 5 so that the solder rising prevention band 5 is formed on the connector member 3 and the distinction from other parts can be easily recognized. May be mixed as appropriate.

  The above-described forming agent stored in the forming agent tank 12 is discharged from the tip of the nozzle 15 of the dispenser 14 at a discharge amount and a discharge speed in accordance with control from the overall control unit 24.

  When the position sensor 22 detects that the connector member 3 is at the application position where the forming agent K is applied, the position sensor 22 outputs a detection signal to the overall control unit 24. An example of this detection method will be described later.

  When the detection signal is output from the position sensor 22, the overall control unit 24 sends a signal to the dispenser driving unit 21 and sets the tip of the nozzle 15 at a predetermined position. The forming agent tank 12 is supplied with a predetermined pressure according to the properties of the forming agent that is sent to the forming agent tank 12 and stored, the material of the connector member 3, and the width and thickness of the solder rising prevention band 5 to be formed. Add. With this pressure, the forming agent stored in the forming agent tank 12 is pushed out to the dispenser 14 and further discharged from the tip of the nozzle 15 at a predetermined discharge amount and discharge speed. The method of setting the tip of the nozzle 15 at a predetermined position may be separated from the overall control unit 24 and may be made independent, or may be performed manually.

  Since various types of nozzles 15 made of metal or resin are commercially available, the nozzle 15 is selected from among them according to the application. The tip direction of the nozzle 15 is adjusted in advance so that the discharged forming agent is applied to a predetermined position of the connector member 3. Since the tip shape of the commercially available nozzle 15 can be thin, long, or bent, the shape of the nozzle 15 is processed according to the configuration of the apparatus as shown in FIG. It is easy to install the tip of the connector corresponding to the predetermined position of the connector member 3. As shown in FIG. 9, a multi-nozzle 16 having a plurality of discharge ports for multi-point discharge is also commercially available and can be used as required.

  Further, since the diameter of the tip of the nozzle 15 determines the width of the solder rising prevention band 5 to be formed, a nozzle having an appropriate size is used according to the width of the solder rising prevention band 5 to be formed. The nozzle 15 is commercially available and can be arbitrarily selected from 0.1 to several mmφ, and has a high degree of freedom that it can be selected according to the application. The price is also low.

  As the positional relationship between the tip of the nozzle 15 and the connector member 3, for example, as shown in FIG. 10 (a), the tip of the nozzle 15 may be set slightly apart from the surface of the connector member 3. As shown to (b), you may press and install so that the connector member 3 may not deform | transform. Alternatively, as shown in FIG. 10 (c), the tip of the nozzle 15 may be installed completely away from the surface of the connector member 3. The connector member 3 and the flat plate portion 8 shown in FIG. 10 are views seen from the direction of the AA line shown in FIG.

  In the case shown in FIG. 10A, the forming agent K discharged from the tip of the nozzle 15 grows into droplets, and these droplets are applied to the connector member 3. In addition, since the tip of the nozzle 15 and the connector member 3 are not in contact with each other, the connector member 3 is not damaged.

  In the case shown in FIG. 10B, the forming agent K discharged from the tip of the nozzle 15 is applied directly to the connector member 3 before growing into droplets.

  In the case shown in FIG. 10C, the forming agent K discharged from the tip of the nozzle 15 is skipped and applied to the connector member 3. In this case, since the control can be performed in a short time in units of milliseconds per shot and the discharge distance of 10 mm length can be accurately skipped, the relatively deformable member and the nozzle 15 cannot be brought close to each other. Suitable for the connector member 3. The formation of the solder rise prevention band 5 on the connector member 3, particularly the solder rise prevention band 5 on the press fracture surface, is arranged with the tip of the nozzle 15 inclined with respect to the target position.

  By appropriately arranging the nozzles 15 in this manner, the forming agent K can be reliably applied to any predetermined position even for the connector member 3 that tends to be further miniaturized and complicated. Further, in order to more reliably prevent the solder from rising, even if a plurality of solder rising prevention bands 5 are provided on the connector member 3, this is facilitated.

  When an ultraviolet curable resin is used as the forming agent K, the ultraviolet lamp 30 irradiates the ultraviolet curable resin applied to the connector member 3 with ultraviolet rays, thereby curing the ultraviolet curable resin.

  FIG. 11 is a schematic diagram showing an example of the arrangement of such a solder rising prevention band forming device 10, and the connector member 3 and the flat plate portion 8 shown in the drawing are taken along line AA shown in FIG. 4 (b). It is the figure seen from the direction. In FIG. 11, a pair of one-side dispensers 14 (# 1, # 2) and dispensers (# 3, # 4) are provided, and the nozzle 15 (# 1) of the dispenser 14 (# 1) and the nozzle of the dispenser 14 (# 4) 15 (# 4), and the nozzle 15 (# 2) of the dispenser 14 (# 2) and the nozzle 15 (# 3) of the dispenser 14 (# 3) are provided in opposite directions. Thus, a plurality of dispensers 14 and nozzles 15 may be provided. Then, the forming agent K discharged from the nozzles 15 (# 1, # 2) is discharged from the nozzles 15 (# 3, # 4) to the outer periphery of one half of the connector member 3 as shown in FIG. The forming agent K is applied to the outer periphery of the remaining half of the connector member 3 to form the solder rising prevention band 5. Of course, when the thickness of the base material 6 is thin, the dispenser 14 and the nozzle 15 may be provided only on one side.

  In addition, when applying to the connector member 3 while flying the forming agent K, as shown in FIG. 11, a pair of nozzles 15 (# 1, # 2) on one side and nozzles 15 (# 3, # 4) are It is preferable to arrange them so as to face each other while being inclined with respect to the transport direction F.

  In addition, the solder rise prevention band forming apparatus 10 is provided with a conveying means (not shown), thereby conveying the connector member 3 continuously or intermittently along the conveying direction F together with the flat plate portion 8.

  As shown in FIG. 11, the connector member 3 is transported along the transport direction F by a transport means (not shown), and the connector member 3 comes to the closest point to each nozzle 15 (# 1, # 2, # 3, # 4). If this happens, the position sensor 22 detects this and outputs a detection signal to the overall control unit 24. The position sensor 22 can use a combination of a photodiode and a light receiving sensor or a method such as image processing.

  When the detection signal is output from the position sensor 22 in this way, the overall control unit 24 sends a signal to the dispenser driving unit 21 to set the tip of the nozzle 15 at a predetermined position. In addition, a predetermined pressure is applied to the forming agent tank 12 according to the properties of the forming agent K stored by sending a signal to the forming agent tank 12, the material of the connector member 3, and the width and thickness of the soldering prevention band 5 to be formed. Add. With this pressure, the forming agent K stored in the forming agent tank 12 is pushed out to the dispenser 14 and further discharged from the tip of the nozzle 15 at a predetermined discharge amount and discharge speed.

  The conveying means further conveys the connector member 3 coated with the forming agent K at a predetermined position along the conveying direction F. An ultraviolet lamp 30 is provided at the top of the conveyance, and the forming agent K applied to the connector member 3 is irradiated with ultraviolet rays V emitted from the ultraviolet lamp 30. Thus, when an ultraviolet curable resin is used as the forming agent K, it is efficiently cured. When a substance other than the ultraviolet curable resin is used as the forming agent K, the ultraviolet lamp 30 is unnecessary, but the solidification method is changed to a solidification method suitable for solidifying the forming agent to be used.

  Next, the operation of the solder rising prevention band forming apparatus 10 as shown in FIG. 7 will be described.

  First, when the connector member 3 is transported along the transport direction F by a transport means (not shown) and the connector member 3 comes to the closest point to the nozzle 15, this is detected by the position sensor 22. Then, a detection signal is output from the position sensor 22 to the overall control unit 24.

  When this detection signal is received by the overall control unit 24, a signal is sent from the overall control unit 24 to the dispenser driving unit 21, and the nozzle 15 is set at a predetermined position. At the same time, pressure is applied to the forming agent tank 12. The value of this pressure is determined in advance according to the property of the forming agent K stored in the forming agent tank 12, the material of the connector member 3, and the width and thickness of the solder rising prevention band 5 to be formed.

  By this pressure, the forming agent K stored in the forming agent tank 12 is pushed out to the dispenser 14 and discharged from the tip of the nozzle 15 at a predetermined discharge amount and discharge speed.

  Thereby, the forming agent K is applied to the entire circumference of the connector member 3 in FIG.

In this way, as shown in FIG. 11, the solder rising prevention band 5 is reliably formed along the outer periphery of the connector member 3 at a predetermined position. In addition, since the use of the dispenser 14 and the nozzle 15 makes it possible to use a higher viscosity forming agent than in the past, the use of such a high viscosity forming agent makes it possible to provide a more stable solder rise prevention band 5. Can also be provided. Further, by previously mixing a colorant with the forming agent K, it is possible to easily recognize that the solder rising prevention band 5 is formed on the connector member 3. Further, the color of the soldering prevention band makes it easy to distinguish between the connector members .

  Such a solder rise prevention band 6 may be peeled off after the preliminary solder 4a is provided, if necessary, or may be used as it is as a final product. In addition, since the solder rising prevention band 5 as described above may be implemented in any process as long as the purpose can be achieved, it is not limited to the connector member 3 on which the nickel plating 7 is made, and is performed before the nickel plating process. Alternatively, it may be after gold plating after nickel plating.

  As described above, in the solder rise prevention band forming apparatus to which the method for forming a solder rise prevention band according to the embodiment of the present invention is applied, the above-described action causes the connector member 3 along the outer periphery at a predetermined position. The solder rising prevention band 5 can be reliably formed with high positional accuracy, efficiency and stability. Further, by mixing the colorant with the forming agent K, it is possible to easily recognize that the solder rising prevention band 5 is formed on the connector member 3.

  Further, since various types of nozzles 15 made of metal or resin are commercially available, they can be selected from among them according to the application. Further, since the shape of the nozzle 15 can be thin, long or bent according to the configuration of the apparatus, the tip of the nozzle 15 can be easily fixed at a predetermined position of the connector member 3. It is possible to suppress the generation of costs and configure the device at a low cost.

  As described above, the preferred embodiment of the present invention has been described with respect to the connector member 3 with reference to the accompanying drawings, but the present invention is not limited to such a configuration. Within the scope of the invented technical idea of the scope of claims, a person skilled in the art can conceive of various changes and modifications. The technical scope of the present invention is also applicable to these changes and modifications. It is understood that it belongs to.

FIG. 3 is an elevational sectional view showing an example of a connector member having a solder rise prevention band. The fragmentary sectional view which shows an example of the solder rising prevention band provided in the connector member. The fragmentary sectional view which shows an example of the solder rising prevention band provided in the connector member. The elevational sectional view of the connector member and flat plate part which shows an example of the manufacturing method of a connector member. An elevational sectional view showing an example of a connector member not provided with a solder rise prevention band (when solder does not spread to the gold plating joint). Sectional drawing which shows an example of the connector member which is not equipped with the soldering prevention belt | band | zone (when solder spreads to a gold plating junction part). The functional block diagram which shows the structural example of the solder rise prevention band formation apparatus to which the formation method of the solder rise prevention band which concerns on the embodiment is applied. The schematic diagram which shows an example of the front-end | tip shape of a nozzle. The schematic diagram which shows an example of a multi-nozzle. The conceptual diagram which shows the example of the positional relationship of a nozzle and a connector member. The conceptual diagram which shows the example of arrangement | positioning of the nozzle in the case of flying a forming agent toward a connector member.

Explanation of symbols

  F: Transport direction, K: Forming agent, 1 ... Flash gold plating, 2 ... Gold plating joint, 3 ... Connector, 4 ... Molten solder, 4a ... Pre-solder, 5 ... Solder up prevention band, 6 ... Base material, DESCRIPTION OF SYMBOLS 7 ... Nickel plating, 8 ... Flat plate part, 9 ... Positioning hole, 10 ... Solder up prevention band formation apparatus, 12 ... Forming agent tank, 14 ... Dispenser, 15 ... Nozzle, 16 ... Multi nozzle, 21 ... Dispenser drive part, 22 ... position sensor, 24 ... overall control unit, 30 ... ultraviolet lamp, 32 ... printed circuit board, 33 ... glass / epoxy substrate, 34 ... copper plating, 35 ... through hole

That is, the connector member of the invention of claim 1 is a connector member provided with a solder rising prevention band while being continuously conveyed in order to achieve the first object , A substance that does not wet with solder containing at least one or more of resin, ceramic, carbon, and glass is discharged from the dispenser and applied to a predetermined position, so that the solder spreads during the molten solder process. It is a connector member provided with a solder rising prevention band for blocking.

Therefore, in the connector member according to the first aspect of the invention, by taking the above-described means, it is possible to continuously provide a connector member provided with a solder rise prevention band that effectively prevents solder rise. .

In order to achieve the first object, the connector member according to claim 2 is the connector member according to claim 1 , wherein the solder rising prevention band is colored with a color different from the surface to be coated. Has been.

Therefore, in the connector member according to the second aspect of the present invention, it is only possible to provide a connector member provided with a solder rise prevention band that effectively prevents solder rise by taking the above-described means. In addition, it is easy to distinguish between connector members with a solder rise prevention band and connector members without a solder rise prevention band. Becomes easy.

According to a third aspect of the present invention, in order to achieve the second object, a plurality of connector members are provided with a solder rising prevention band that prevents the solder from spreading outside the joint portion of the connector member during the molten soldering process of the connector member. On the other hand, it is an apparatus that forms continuously . In this apparatus, the conveying means for continuously conveying the connector member, the storage means for storing the forming agent for forming the solder rise prevention band, and the forming agent stored in the storage means have been conveyed by the conveying means. a dispenser for ejecting a predetermined position of the connector member, and control means for controlling the discharge amount and discharge speed of the forming agent to be discharged from the dispenser, which is applied to a predetermined position of the connector member by being discharged from the dispenser Solidifying means for solidifying the forming agent. Examples of the solidifying means include a method of solidifying the forming agent by heating, a method of solidifying the forming agent by baking and decomposition, a method of solidifying by irradiation with light such as ultraviolet rays or an electron beam, and the like.

Therefore, in the apparatus for forming a soldering-up prevention band according to the third aspect of the invention, it is possible to provide the connector member with a soldering-up prevention band that effectively prevents soldering by taking the above-described means. .

According to a fourth aspect of the present invention, in order to achieve the second object, in the apparatus according to the third aspect , a plurality of dispensers are arranged so as to surround a predetermined position of the connector member, and the forming agent is discharged from each dispenser. The forming agent is applied to a predetermined position by controlling the discharge amount and the discharge speed by the control means.

Therefore, in the apparatus for forming a soldering-up prevention band according to the invention of claim 4 , it is possible to reliably provide the connector member with the soldering-up prevention band that effectively prevents the soldering by taking the above-described means. It becomes.

According to a fifth aspect of the present invention, in order to achieve the second object, in the apparatus according to the third or fourth aspect , an ultraviolet curable resin is used as a forming agent, and ultraviolet rays are applied to the forming agent applied at a predetermined position. UV irradiation means is further provided.

Therefore, in the apparatus for forming a soldering-up prevention band according to the invention of claim 5 , the soldering prevention band that effectively prevents the soldering-up can be provided in the connector member in a short time by taking the above-described means. It becomes possible.

According to a sixth aspect of the present invention, in order to achieve the second and third objects, a method for forming a solder rise prevention band for preventing the solder from spreading outside the joint portion of the connector member during the molten solder process of the connector member. In the state where the plurality of connector members on which the solder rise prevention band is formed are continuously conveyed in order, a forming agent for forming the solder rise prevention band is formed at a predetermined discharge amount and discharge speed. , Applied by sequentially discharging from the dispenser toward a predetermined position of each connector member conveyed continuously, and solidifying the applied forming agent to continuously solder a plurality of connector members. A rising prevention band is formed.

Therefore, in the method for forming a soldering-up prevention band according to the invention of claim 6 , the soldering-up prevention band that effectively prevents the soldering-up by adopting the above-described means can be realized with a simple and inexpensive apparatus configuration. Further, the connector member can be provided with higher positional accuracy.

According to a seventh aspect of the present invention, in the method of the sixth aspect , an ultraviolet curable resin is used as a forming agent, and the forming agent applied at a predetermined position is irradiated with ultraviolet rays to solidify the forming agent. .

Therefore, in the method of forming the soldering-up prevention band according to the invention of claim 7 , the soldering-up prevention band that effectively prevents the soldering-up by adopting the above-described means can be realized with a simple and inexpensive apparatus configuration. In addition, the connector member can be provided in a short time with high positional accuracy.

In the invention of claim 8 , the connector member that has been pressed into a predetermined shape and wound in a coil shape is continuously fed out, and a substance that does not wet with solder is discharged from the dispenser and applied to a predetermined position of the connector member. Thus, the solder rise prevention band is formed on the connector member.
Therefore, in the method for forming the soldering-up prevention band according to the eighth aspect of the invention, the connector member having the soldering-up prevention band can be continuously manufactured by taking the above-described means.

Claims (9)

  An electronic component equipped with a solder rise prevention band that prevents solder from spreading during molten solder processing by applying a material that does not wet the solder. The electronic component according to claim 1,
The substance that does not wet with the solder is an electronic component including at least one or more of resin, ceramic, carbon, and glass. The electronic component according to claim 1 or 2,
The solder rising prevention band is an electronic component that is colored in a color different from the surface to be coated. An apparatus for forming a solder rising prevention band that prevents the solder from spreading outside the joint part of the electronic component when the soldering process of the electronic component is performed,
A storage means for storing a forming agent for forming the solder rise prevention band;
Discharging means for discharging the forming agent stored in the storage means;
Control means for controlling the discharge amount and discharge speed of the forming agent discharged from the discharge means;
An apparatus comprising: a solidifying unit that solidifies a forming agent applied to a predetermined position of the electronic component by being discharged from the discharge unit. The apparatus according to claim 4.
A plurality of the discharge means are arranged so as to surround a predetermined position of the electronic component, and the discharge amount and discharge speed of the forming agent discharged from each discharge means are controlled by the control means, so that the predetermined position is A device that applies a forming agent. 6. An apparatus according to claim 4 or claim 5,
Using an ultraviolet curable resin as the forming agent,
An apparatus further comprising ultraviolet irradiation means for irradiating the forming agent applied at the predetermined position with ultraviolet rays. The apparatus according to any one of claims 4 to 6,
An apparatus using a dispenser as the discharge means. A method of forming a solder rising prevention band that prevents the solder from spreading outside the joint part of the electronic component during the molten solder processing of the electronic component,
A forming agent for forming the solder rise prevention band is applied to a predetermined position of the electronic component by discharging from a nozzle of a dispenser at a predetermined discharge amount and discharge speed, and the applied forming agent is solidified. A method of forming the solder rising prevention band by doing. The method of claim 8, wherein
A method in which an ultraviolet curable resin is used as the forming agent, and the forming agent applied at the predetermined position is irradiated with ultraviolet rays to solidify the forming agent.

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