JP2005244640A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator suitable for miniaturization of the entire structure. <P>SOLUTION: The piezoelectric oscillator is configured in such a way that an IC element 7 for outputting an oscillation signal corresponding to an oscillation frequency of a piezoelectric resonance element 5, and mounting legs 12 consisting of metal posts disposed along the bottom surface periphery of a container 1, are attached on the bottom surface of the container 1 accommodating the piezoelectric resonance element 5 in its inside. In this oscillator, the IC element 7 is covered with a resin material 13, the external periphery of the resin material 13 is extended to the external periphery of the container 1, and the side surfaces of the mounting leg portions 12 are covered with the extending portion. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piezoelectric oscillator used as a timing device for communication equipment, electronic equipment, and the like.

  Conventionally, a piezoelectric oscillator such as a temperature-compensated crystal oscillator has been used as a timing device for a portable communication device or the like.

  For example, as shown in FIG. 5, the conventional temperature-compensated crystal oscillator includes a container body 23 in which a crystal resonator element 24 is accommodated, a recess 25 in the central region of the upper surface, and a plurality of external terminals 22 on the lower surface. And an IC element that controls the oscillation output based on the vibration of the crystal resonator element 24 in a region surrounded by the lower surface of the container body 21 and the inner surface of the recess 25. The thing of the structure which accommodated 26 is known (for example, refer patent document 1).

The container body 23 and the mounting base 21 are usually made of a ceramic material such as alumina ceramics, and a predetermined wiring pattern is formed inside and on the surface, and a conventionally known green sheet laminating method or the like is adopted. It is produced by. A plurality of bonding electrodes are provided at corresponding positions on the lower surface of the container body 23 and the upper surface of the mounting substrate 21, and these bonding electrodes are bonded to each other via a conductive bonding material. As a result, the container body 23 was fixed to the upper surface of the mounting base 21.
JP-A-10-98151

  However, in the above-described conventional piezoelectric oscillator, since the inner wall of the recess 25 provided in the mounting base 21 is arranged so as to surround the IC element 26, the area of the mounting base 21 is vertical. In any of the lateral directions, the size is larger than that of the IC element 26, which makes it difficult to reduce the size of the piezoelectric oscillator.

  The present invention has been devised in view of the above-described drawbacks, and an object thereof is to provide a piezoelectric oscillator having a structure suitable for downsizing the entire structure.

  The piezoelectric oscillator of the present invention includes an IC element that outputs an oscillation signal corresponding to the oscillation frequency of the piezoelectric vibration element on the lower surface of the container body that accommodates the piezoelectric vibration element therein, and an outer periphery of the lower surface of the container body. A piezoelectric oscillator comprising a mounting leg portion made of a metal post, wherein the IC element is covered with a resin material, and the outer peripheral portion of the resin material extends to the outer peripheral portion of the container body. In addition, the side surface of the mounting leg portion is covered with the extended portion.

  In the piezoelectric oscillator of the present invention, a quartz crystal vibrating element is used as the piezoelectric vibrating element, and temperature compensation data for correcting the oscillation signal according to a temperature state is stored in the IC element. A write control terminal made of a metal post for writing temperature compensation data to the IC element is attached to the lower surface of the body with the outer side surface exposed.

  Furthermore, in the piezoelectric oscillator of the present invention, the lower end of the write control terminal is positioned above the lower end of the mounting leg, and the lower end of the write control terminal is covered with the extending portion of the resin material. It is characterized by this.

  Furthermore, the piezoelectric oscillator of the present invention is characterized in that the mounting legs are attached to the four corners of the lower surface of the container body.

  According to the piezoelectric oscillator of the present invention, the oscillation output IC element on the lower surface of the container body housing the piezoelectric vibration element, and the mounting leg portion including the metal post disposed along the outer periphery of the lower surface of the container body, Since the mounting leg portion of the lower surface of the container body does not exist, it can be used for mounting IC elements and other electronic component elements. In the case of providing only at the four corners, the length of the container body can be made substantially equal to the length of the IC element by designing so that both ends of the IC element are arranged between the adjacent mounting legs. As a result, the overall structure of the piezoelectric oscillator can be reduced in size.

  According to the piezoelectric oscillator of the present invention, the IC element is covered with a resin material, and the outer peripheral portion of the resin material is extended to the outer peripheral portion of the container body. Therefore, when mounting the piezoelectric oscillator on an external wiring board such as a mother board by soldering or the like, the solder joining the piezoelectric oscillator and the external wiring board travels down the mounting legs made of metal posts. It is possible to effectively prevent creeping and to obtain a piezoelectric oscillator that is easy to handle.

  In addition, in this case, since the side surfaces of the mounting legs are covered with the resin material, the oxidative corrosion of the metal posts forming the mounting legs is effectively prevented, and the reliability of the piezoelectric oscillator can be maintained high. In addition, there is an advantage that the mounting strength of the mounting leg with respect to the container body can be reinforced with the resin material.

  Further, according to the piezoelectric oscillator of the present invention, a quartz crystal vibration element is used as the piezoelectric vibration element, temperature compensation data for correcting the oscillation signal according to a temperature state is stored in the IC element, and the container body When a piezoelectric oscillator is assembled, a write control terminal made of a metal post for writing temperature compensation data to the IC element is attached to the lower surface of the IC element with the outer side surface exposed. The piezoelectric oscillator can be manufactured simply by attaching the write control terminal to a predetermined position on the lower surface of the container body, and the productivity of the piezoelectric oscillator can be improved.

  Furthermore, according to the piezoelectric oscillator of the present invention, the lower end of the above-described write control terminal is positioned above the lower end of the mounting leg, and the lower end is covered with the extending portion of the resin material. Due to this, when the piezoelectric oscillator is mounted on the external wiring board by soldering or the like, a large stray capacitance is generated between the wiring of the external wiring board on which the piezoelectric oscillator is mounted and the write control terminal. The disadvantage that a part of the solder contacts the write control terminal to cause a short circuit is effectively prevented, and there is an advantage that the handling of the piezoelectric oscillator is simplified.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  1 is an exploded perspective view showing an embodiment in which the piezoelectric oscillator of the present invention is applied to a temperature compensated crystal oscillator, FIG. 2 is a cross-sectional view of the temperature compensated crystal oscillator of FIG. 1, and FIG. 3 is a temperature compensated crystal oscillator of FIG. It is the top view which looked at the crystal oscillator from the lower part, and the temperature compensation type crystal oscillator shown in these figures has the IC element 7 on the lower surface of the rectangular container body 1 containing the crystal vibration element 5 inside, It has a structure in which a plurality of mounting legs 12 are attached.

  The container body 1 is made of, for example, a substrate 2 made of a ceramic material such as glass-ceramic or alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, or phosphor bronze, and a metal similar to the seal ring 3. The container body 1 is formed by attaching the seal ring 3 to the upper surface of the substrate 2 and placing and fixing the lid body 4 on the upper surface of the substrate 2, and is positioned inside the seal ring 3. A crystal resonator element 5 is mounted on the upper surface of the substrate 2 to be operated.

  The container body 1 is for hermetically sealing the quartz resonator element 5 in its interior, specifically, in a space surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. A pair of mounting pads connected to the vibration electrode of the crystal resonator element 5 is provided on the upper surface of the substrate 2, and bonding electrodes are provided on the lower surface of the substrate 2, respectively. Corresponding devices are electrically connected to each other via a wiring pattern on the substrate surface, via-hole conductors embedded in the substrate, internal wiring, and the like.

  When the substrate 2 of the container body 1 is made of alumina ceramic, a conductive paste serving as a wiring pattern is applied to the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent to a predetermined ceramic material powder. It is manufactured by applying conventionally known screen printing or the like, laminating a plurality of these, press-molding, and firing at a high temperature.

  The seal ring 3 and the lid body 4 of the container body 1 are manufactured by forming a metal such as 42 alloy into a predetermined shape by using a conventionally known metal processing method, and the obtained seal ring 3 is attached to the substrate 2. After brazing the conductor layer previously deposited on the upper surface, and subsequently mounting and fixing the crystal vibrating element 5 on the upper surface of the substrate 2 using a conductive adhesive, a well-known conventional technique is applied to the upper surface of the seal ring 3. The container body 1 is assembled by joining the lid body 4 by resistance welding or the like. In this way, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

  On the other hand, the quartz crystal vibrating element 5 accommodated in the container body 1 is formed by attaching and forming a pair of vibrating electrodes on both main surfaces of a crystal piece cut along a predetermined crystal axis, and a variable voltage from the outside. Is applied to the quartz crystal piece via a pair of vibrating electrodes, thickness shear vibration is caused at a predetermined oscillation frequency.

  The quartz vibrating element 5 is mounted on the upper surface of the substrate 2 by electrically connecting a pair of vibrating electrodes to a corresponding mounting pad on the upper surface of the substrate via a conductive adhesive, whereby the quartz vibrating element 5 and the container are mounted. The electrical connection with the body 1 and the mechanical connection are made simultaneously.

  Here, if the lid body 4 of the container body 1 is connected to the mounting legs 12 for ground via the wiring pattern of the container body 1, the lid body 4 is grounded and a shielding function is provided during use. Therefore, the quartz resonator element 5 and the later-described IC element 7 can be protected better than unnecessary electrical effects from the outside. Therefore, it is preferable that the lid body 4 of the container body 1 is connected to the mounting legs 12 for ground via the wiring pattern of the container body 1 or the like.

  A plurality of mounting legs 12 and a plurality of write control terminals 11 are attached to the lower surface of the container body 1 along the outer periphery thereof. In this embodiment, the mounting legs 12 are individually attached and erected at the four corners on the lower surface of the container body, and two write control terminals 11 are further adjacent to each other between the adjacent mounting legs 12. The IC element 7 is mounted in the central region of the lower surface of the container body that is provided side by side and surrounded by the four mounting legs 12 and the two write control terminals 11.

  Further, the plurality of mounting legs 12 attached / standing on the lower surface of the container body 1 are each formed by a metal post formed of a metal material such as copper in the shape of a quadrangular column, and serves as an external terminal. When the temperature compensated crystal oscillator is mounted on an external wiring board such as a mother board (not shown), it is electrically connected to the wiring of the external electric circuit by soldering or the like.

  The four mounting legs 12 described above function as a power supply voltage terminal, a ground terminal, an oscillation output terminal, and an oscillation control terminal, and the lower surface of these mounting legs 12 is bonded to an external wiring board. For example, nickel plating, gold plating, or the like is applied to a predetermined thickness in order to improve the bonding state of solder or the like used for the soldering.

  Here, of the four mounting legs 12, if the ground mounting leg 12 and the oscillation output mounting leg 12 are arranged close to each other, the oscillation signal output from the oscillation output terminal It is possible to effectively prevent noise interference. Therefore, it is preferable that the mounting leg 12 for ground and the mounting leg 12 for oscillation output are arranged close to each other.

  On the other hand, as the IC element 7 attached to the lower surface of the container body 1, for example, a rectangular flip chip IC having a plurality of connection pads on the lower surface is used, and its circuit forming surface (lower surface) Includes a temperature sensing element (thermistor) for detecting an ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristic of the crystal vibration element 5, and a vibration characteristic of the crystal vibration element 5 based on the temperature compensation data. Is provided with a temperature compensation circuit that compensates for changes in temperature, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the oscillation output generated by the oscillation circuit is output to the outside Later, for example, it will be used as a reference signal such as a clock signal.

  The IC element 7 has both end portions arranged between adjacent mounting legs, and adjacent mounting legs in a state in which two end surfaces arranged substantially in parallel are covered with a resin material 13 to be described later. Exposed from between the parts.

  The exposed side surface of the IC element 7 is arranged along the outer peripheral portion of the container body 1 slightly inside the outer peripheral portion of the container body 1, for example, 1 μm to 500 μm inward from the outer periphery of the container body 1. In this case, since the width dimension of the container body 1 in the direction orthogonal to the exposed side surface of the IC element 7 is designed to be substantially equal to the length of one side of the IC element 7, the entire structure of the temperature compensated crystal oscillator Can be made compact.

  On the lower surface of the container body 1 in which the IC element 7 is disposed, electrode pads corresponding to the connection pads of the IC element 7 are provided on a one-to-one basis, and solder, gold bumps, or the like are provided on these electrode pads. The IC element 7 is attached to and mounted on the lower surface of the container body 1 by bonding the connection pads of the IC element 7 via the conductive bonding material, and the electronic circuit in the IC element 7 is thereby connected to the wiring of the container body 1. It is electrically connected to the crystal resonator element 5 and the mounting leg 12 through a pattern or the like.

  Further, the above-described IC element 7 is covered with a resin material 13 made of, for example, epoxy resin or the like, and the outer peripheral portion of the resin material 13 extends to the outer peripheral portion of the container body 1 and is adjacent to the mounting leg portion. A part of the gap is filled on the surface of the mounting leg 12 so as to cover the side surface of the mounting leg 12.

  The resin material 13 is for protecting the IC element 7, and the outer peripheral portion of the resin material 13 is extended to the outer peripheral portion of the container body 1 as described above. When the temperature-compensated crystal oscillator is mounted on an external wiring board such as a mother board by soldering or the like by covering the side surface of each mounting leg 12 with a thickness of, for example, 20 μm to 250 μm, the temperature-compensated crystal oscillator A solder that joins the external wiring board to the mounting leg portion 12 made of a metal post is effectively prevented from causing a short circuit, and a temperature-compensated crystal oscillator that is easy to handle is obtained. Will be able to.

  In this case, the side surfaces of the mounting legs 12 are covered with the resin material 13, so that the oxidative corrosion of the metal posts forming the mounting legs 12 is effectively prevented, and the reliability of the temperature compensated crystal oscillator is improved. While being able to maintain high, there exists an advantage which can reinforce the attachment strength of the mounting leg part 12 with respect to the container body 1 with the said resin material 13. FIG.

  In addition, it is preferable that 90% or more of the entire surface of the mounting leg 12 is covered with the resin material 13. For example, a region about 25% from the lower end of the mounting leg 12 is used. Even if the side surface is exposed in FIG. 5, if other portions are covered with the resin material 13, it is possible to effectively prevent the occurrence of a short circuit due to the adhesion of solder during mounting on the external wiring board. In addition, there is almost no influence of oxidative corrosion due to contact of moisture contained in the atmosphere. In this case, if the exposed portion of the mounting leg 12 is formed of a metal such as Ni having good solder wettability, a solder fillet is formed in this exposed region, and the mounting strength of the temperature compensated crystal oscillator is improved. There are advantages.

  In addition, if the resin material 13 described above is formed of a transparent material, even if the side surface of the IC element 7 exposed from the adjacent mounting leg portions 12-12 is covered with the resin material 13, the container body 1 is not affected. Since the joint portion can be directly viewed, the joining state of the IC element 7 can be easily confirmed by visual inspection or the like when inspecting the product, and the inspection workability can be improved.

  A plurality of write control terminals 11 for writing temperature compensation data to the IC element 7 are attached to the lower surface of the container body 1 described above.

  The write control terminal 11 is formed by a metal post obtained by forming a metal material such as copper into a columnar shape, like the mounting leg portion 12 described above, and the length dimension of the write control terminal 11 is the same as that of the write control terminal 11. The lower end is formed slightly shorter so as to be positioned higher than the lower end of the mounting leg 12, and is attached to the lower surface of the container body 1 so that a part of the side surface is exposed between adjacent mounting legs.

  These write control terminals 11 are juxtaposed along the edge of the container body 1 and are electrically connected to the IC element 7 via the wiring pattern of the container body 1 and the like. Therefore, after assembling the temperature compensated crystal oscillator, the probe needle of the temperature compensation data writing device is applied to these write control terminals 11 from the side, and the temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 5 is written. As a result, the temperature compensation data is stored in the memory of the IC element 7.

  According to the piezoelectric oscillator of this embodiment, the write control terminal 12 is integrated with other components only by attaching the write control terminal 12 made of a metal post to a predetermined position on the lower surface of the container body. Therefore, the assembly process of the temperature-compensated crystal oscillator is simplified, and the productivity of the temperature-compensated crystal oscillator can be improved.

  In this case, if the extending portion of the resin material 13 is also attached to the lower surface of the write control terminal 11, the temperature compensated crystal oscillator is melted when mounted on the motherboard by soldering or the like. The disadvantage that a part of the solder contacts the write control terminal 11 to cause a short circuit is effectively prevented, and there is an advantage that the temperature compensated crystal oscillator can be handled easily.

  Thus, the above-described temperature compensated crystal oscillator is mounted on an external wiring board such as a mother board by soldering or the like, and crystal oscillation is performed while correcting the oscillation frequency according to the temperature state using the temperature compensation circuit of the IC element 7. By outputting a predetermined oscillation signal corresponding to the oscillation frequency of the element 5, it functions as a temperature compensated crystal oscillator.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, a crystal oscillator using a crystal resonator element as a piezoelectric resonator element has been described as an example, but instead of this, a piezoelectric vibrator other than a crystal resonator element, specifically, a surface acoustic wave element The present invention can also be applied to the case where a piezoelectric oscillator is configured using a piezoelectric vibration element such as the above.

  In the above-described embodiment, a general conductive bonding material such as solder is used to attach the IC element 7, the write control terminal 11, the mounting leg 12, and the like to the lower surface of the container body 1. However, the present invention is not limited to this. For example, an anisotropic conductive adhesive or the like may be used as the conductive bonding material. In that case, the IC element 7 or the mounting leg 12 or the like for the container body 1 may be used. There is also an advantage that the attaching operation becomes extremely simple and the assembly process of the piezoelectric oscillator is further simplified.

  Further, in the embodiment described above, the lid 4 of the container body 1 is bonded to the substrate 2 via the seal ring 3. Instead, a bonding metallized pattern is formed on the upper surface of the substrate 2. The lid 4 may be welded directly to the metallized pattern.

  Furthermore, in the above-described embodiment, the seal ring 3 is directly attached to the upper surface of the substrate of the container body 1, but instead, the upper surface of the substrate 2 is made of the same ceramic material as the substrate 2. The frame body may be attached integrally, and the seal ring 3 may be attached to the upper surface of the frame body.

  Furthermore, in the above-described embodiment, for example, as shown in FIG. 4, an electronic component element other than an IC element, such as a chip capacitor for noise removal, is provided on the lower surface of the container body 1 located between the adjacent mounting legs 12-12. In this case, since the vacant area on the lower surface of the container body is used more effectively, the piezoelectric oscillator can be further downsized.

It is a disassembled perspective view which shows one Embodiment which applied the piezoelectric oscillator of this invention to the temperature compensation type | mold crystal oscillator. It is sectional drawing of the temperature compensation type | mold crystal oscillator of FIG. It is the top view which looked at the temperature compensation type | mold crystal oscillator of FIG. 1 from the downward direction. It is the top view which looked at the piezoelectric oscillator concerning other embodiment of this invention from the downward direction. It is a disassembled perspective view of the conventional temperature compensation type | mold crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Board | substrate 3 ... Seal ring 4 ... Lid body 5 ... Quartz crystal vibration element (piezoelectric vibration element)
DESCRIPTION OF SYMBOLS 7 ... IC element 7a ... Connection pad 10 ... External terminal 11 ... Write control terminal 12 ... Mounting leg part 13 ... Resin material

Claims (4)

An IC element that outputs an oscillation signal corresponding to the oscillation frequency of the piezoelectric vibration element, and a metal post disposed along the outer periphery of the lower surface of the container body are formed on the lower surface of the container body that houses the piezoelectric vibration element. A piezoelectric oscillator that is attached to a mounting leg,
The IC element is covered with a resin material, the outer peripheral portion of the resin material is extended to the outer peripheral portion of the container body, and the side surface of the mounting leg is covered with the extended portion. Piezoelectric oscillator. A crystal vibrating element is used as the piezoelectric vibrating element, and temperature compensation data for correcting the oscillation signal according to a temperature state is stored in the IC element, and the IC element is provided on the lower surface of the container body. 2. The piezoelectric oscillator according to claim 1, wherein a write control terminal made of a metal post for writing temperature compensation data is attached with the outer side surface exposed. The lower end of the write control terminal is positioned above the lower end of the mounting leg, and the lower end of the write control terminal is covered with an extending portion of the resin material. A piezoelectric oscillator according to 1. The piezoelectric oscillator according to any one of claims 1 to 3, wherein the mounting legs are attached to four corners of the lower surface of the container body.

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