JP2005244189A5 - - Google Patents

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Publication number
JP2005244189A5
JP2005244189A5 JP2005012150A JP2005012150A JP2005244189A5 JP 2005244189 A5 JP2005244189 A5 JP 2005244189A5 JP 2005012150 A JP2005012150 A JP 2005012150A JP 2005012150 A JP2005012150 A JP 2005012150A JP 2005244189 A5 JP2005244189 A5 JP 2005244189A5
Authority
JP
Japan
Prior art keywords
particle size
fine particles
value
average particle
resin sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005012150A
Other languages
Japanese (ja)
Other versions
JP2005244189A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2005012150A priority Critical patent/JP2005244189A/en
Priority claimed from JP2005012150A external-priority patent/JP2005244189A/en
Publication of JP2005244189A publication Critical patent/JP2005244189A/en
Publication of JP2005244189A5 publication Critical patent/JP2005244189A5/ja
Pending legal-status Critical Current

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Claims (2)

平均粒径が１０〜５００μｍであり、下記式で求められる樹脂微粒子の粒径のＣＶ値が、２％以下である樹脂微粒子を含有することを特徴とする半導体チップ接合用接着性樹脂シート。
粒径のＣＶ値＝（σ2／Ｄｎ2）ラ１００％
（σ2は粒径の標準偏差を表し、Ｄｎ2は数平均粒径を表す） An adhesive resin sheet for semiconductor chip bonding, comprising resin fine particles having an average particle size of 10 to 500 μm and a CV value of the particle size of resin fine particles obtained by the following formula of 2% or less .
CV value of particle size = (σ2 / Dn2) 100%
(Σ2 represents the standard deviation of particle size, and Dn2 represents the number average particle size) 複数の半導体チップが請求項１記載の半導体チップ接合用接着性樹脂シートにより多段に積層されてなることを特徴とする半導体装置。A semiconductor device, wherein a plurality of semiconductor chips are laminated in multiple layers with the adhesive resin sheet for joining semiconductor chips according to claim 1.
JP2005012150A 2004-01-27 2005-01-19 Adhesive resin sheet for bonding semiconductor chip and semiconductor device Pending JP2005244189A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005012150A JP2005244189A (en) 2004-01-27 2005-01-19 Adhesive resin sheet for bonding semiconductor chip and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004019060 2004-01-27
JP2005012150A JP2005244189A (en) 2004-01-27 2005-01-19 Adhesive resin sheet for bonding semiconductor chip and semiconductor device

Publications (2)

Publication Number Publication Date
JP2005244189A JP2005244189A (en) 2005-09-08
JP2005244189A5 true JP2005244189A5 (en) 2007-11-29

Family

ID=35025550

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005012150A Pending JP2005244189A (en) 2004-01-27 2005-01-19 Adhesive resin sheet for bonding semiconductor chip and semiconductor device

Country Status (1)

Country Link
JP (1) JP2005244189A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5738013B2 (en) * 2011-03-07 2015-06-17 デクセリアルズ株式会社 Anisotropic conductive film, method for manufacturing anisotropic conductive film, method for connecting electronic component, anisotropic conductive connector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2983816B2 (en) * 1993-10-29 1999-11-29 住友ベークライト株式会社 Conductive resin paste
DE19701165C1 (en) * 1997-01-15 1998-04-09 Siemens Ag Chip card module
JPH1135893A (en) * 1997-05-22 1999-02-09 Toray Dow Corning Silicone Co Ltd Sheet-like hot-melt adhesive and semiconductor
JP3296306B2 (en) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 Anisotropic conductive adhesive and adhesive film
JPH11329060A (en) * 1998-05-08 1999-11-30 Sekisui Finechem Co Ltd Conductive corpuscle, anisotropic conductive adhesive and conductive connection structure
JP2003060333A (en) * 2001-08-20 2003-02-28 Sekisui Chem Co Ltd Method for connecting electronic component

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