JP2005236323A - Electronic component mounting method and electronic component mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounter which can stably and securely perform the image recognition of an article and an electronic component by an image pickup means and prolong the life of a lighting means at low cost. <P>SOLUTION: Image information is obtained by momentarily lighting up an article (b) in a stopping or moving state by the lighting means 2 made of a light emitting diodes and picking up an image of the lit article (b) by the image pickup means 1 consisting of a CCD camera; and the lighting by the lighting means 2 is performed by supplying a current larger than the rate current value of the light emitting diode to the light emitting diode and obtaining the quantity of light larger than that corresponding to the rated current value that the light emitting diode has and the image pickup operation by the image pickup means 1 is carried out during a series of successive moving states without any stop of the image pickup means 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting method and an electronic component mounting apparatus capable of stably and reliably performing image recognition of an electronic component or an article by an imaging unit and performing high-speed processing of the electronic component or article.

  Conventionally, it is known that measurement values for inspection are obtained by image recognition using a CCD camera in inspection of articles, and even in the industry of assembling and mounting electronic components, The measuring means is incorporated in the electronic component mounting apparatus.

  In this electronic component mounting apparatus, in order to mount the electronic component with high accuracy, the electronic component is imaged by the CCD camera while the electronic component is attracted and held by the suction nozzle and moved to the mounting portion, The captured image information is converted into an electrical signal, and image processing is performed to obtain a predetermined measurement value.

  If the information differs from the predetermined information based on the measured value, the electronic component is mounted on the printed circuit board while correcting the mounting position during movement of the electronic component.

  In order to obtain an image with high accuracy with few errors, it is necessary to use an illumination device having a light amount greater than or equal to a predetermined amount. Means such as continuous lighting with a lamp were used.

  However, these strobes and halogen lamps have short lifespans and do not provide a stable amount of light for a long period of time in an electronic component mounting device. Therefore, it is necessary to replace the bulbs frequently. It was.

  In particular, halogen lamps are expensive, and due to their structure, the entire lighting device is large, and in an electronic component mounting device where each mechanism is relatively dense, there is no room for installation space. Is not fully available.

  On the other hand, when a conventional CCD camera used for imaging an electronic component does not have a shutter function, when the moving article b is imaged, as shown in FIG. b, after exposing the odd-numbered part (ODD) scanning line as shown by circle 2 and then exposing the even-numbered part (EVEN) scanning line as shown by circle 3, it causes temporal image blur, As indicated by a circle 4, the frame image has a drawback of blurring.

  Further, even when the moving electronic component b is imaged by a normal camera having a shutter function, the electronic component b in the circle 1 has an odd portion (as shown in the circle 2) as shown in FIG. Since only ODD scanning lines are exposed, there is no even-numbered (EVEN) exposure as shown by circle 3, and the half resolution is shown in circle 4, so in either case However, accurate image information of the electronic component b could not be obtained.

  Further, the video signal output in the conventional CCD camera is a single line, and as shown in FIG. 8, after the odd-numbered part (ODD) video signal was output, the even-numbered part (EVEN) video signal was output. Compared with a camera capable of outputting a video signal with double lines, the image capture time (image output time) is twice as long.

  For this reason, the time for recognizing the image of the electronic component b is lengthened, the mounting tact time of the electronic component b is shortened, and the great purpose of speeding up the operation of the entire electronic component mounting apparatus is not achieved. Etc. have various problems.

  The present invention has been made to solve the above-described problems, and an illumination unit comprising a light emitting diode is used to instantaneously illuminate an article in a stopped state or a moving state, and the article at the time of illumination is imaged by an imaging unit. Thus, the illumination by the illuminating means supplies the light emitting diode with a current equal to or higher than the rated current value of the light emitting diode, and from the light amount of the rated current value of the light emitting diode. An electronic component mounting method and an electronic component that can stably and reliably recognize an image of an article or an electronic component by an imaging unit by obtaining a large amount of light, and can achieve a long life at low cost. The object is to provide a mounting device.

The means of the present invention for achieving the above-described object is that the electronic parts are sucked and held by the suction nozzle that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by the driving means. In the electronic component mounting method of taking out from the part and mounting it at a predetermined position on the substrate where the mounting part is positioned
A suction step in which the suction nozzle sucks an electronic component of the supply unit; a moving step in which the electronic component sucked in the suction nozzle is moved to a substrate; and a mounting step in which the moved electronic component is mounted on the substrate. An imaging unit having an electronic shutter mechanism capable of imaging at the full resolution of the CCD camera with a single exposure, and imaging the holding state of the electronic component sucked and held at the tip of the suction nozzle during the suction nozzle moving process There is an electronic component mounting method.

In addition, the suction nozzle that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by the drive means sucks and holds the electronic component from the supply unit, and then on the substrate on which the mounting unit is positioned. In the electronic component mounting apparatus to be mounted at a predetermined position of
The image pickup means includes an image pickup means for picking up and holding an electronic component held by suction at the tip of the suction nozzle together with the pickup nozzle, and the image pickup means is composed of a CCD camera. The electronic component mounting apparatus has an electronic shutter mechanism capable of imaging at all resolutions.

In addition, the suction nozzle that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by the drive means sucks and holds the electronic component from the supply unit, and then on the substrate on which the mounting unit is positioned. In the electronic component mounting apparatus to be mounted at a predetermined position of
The image pickup device includes an image pickup unit that picks up and holds the electronic component held and held at the tip of the suction nozzle together with the suction nozzle, and an illumination unit including a light emitting diode. Thus, the electronic component mounting apparatus has an electronic shutter mechanism that can capture images at the full resolution of the CCD camera in a single exposure.

  As described above, according to the present invention, a large amount of light exceeding the rated current value can be obtained by causing a large amount of current to flow instantaneously to the light emitting diode used for illumination of the imaging means.

  Further, by using a light emitting diode for the illumination means, the life of the illumination means is extended, the configuration of the illumination means itself can be made compact, and it can be used even in a small installation space.

  In particular, the imaging of the electronic component of the imaging unit by using the illumination unit described above is performed while the imaging unit is moving below the electronic component, that is, in a series of continuous moving states without stopping the imaging unit. The image reading process is greatly shortened, and the imaging process in the position measurement in the image processing of the electronic component sucked and held by the suction nozzle is greatly speeded up.

  The position measurement by the imaging means for imaging of the electronic component and the image processing is completed in the process in which the suction nozzle sucks and holds the electronic component in the supply unit and then moves to the mounting unit in the body. The purpose of significant time savings is achieved.

  Since the imaging unit captures an image of the electronic component that is indirectly displayed by the light image incident unit, the height of the imaging unit can be reduced, and the movement distance of the Z axis can be shortened. . Therefore, it is possible to shorten the mounting time of the electronic component. It has a special effect such as.

  Next, an example of an electronic component mounting method and an electronic component mounting apparatus according to the present invention will be described with reference to the drawings.

  In FIG. 1 and FIG. 3, A is an electronic component mounting apparatus that employs the electronic component mounting method of the embodiment of the present invention, and comprises an imaging means 1 and an illumination means 2.

  In FIG. 1, reference numeral 3 denotes a transfer means such as a belt conveyor for transferring the article b continuously from one direction to the other direction at a predetermined speed.

  The above-described imaging means 1 converts an optical video signal into an electrical signal by using an electronic camera using a CCD (charge coupled device) to obtain image information of the article b, and has a shutter function. For example, the illuminating means 2 to be described later can suppress the adverse effect of disturbance light, and the electronic shutter speed can be arbitrarily converted depending on the setting of the camera, but is 1/60 to 1/100. The exposure time is controlled in the range of about 1,000 seconds, and preferably about 1/1000 to 1 / 10,000 seconds.

  The obtained image signal is sent to the image processing means 4 and compared with a predetermined numerical value inputted in advance, and desired recognition of the article b is made.

  The illuminating means 2 described above illuminates the article b in a stopped state or a moving state instantaneously (flash) to improve the imaging accuracy of the article b by the imaging means 1 as much as possible. A light emitting diode consisting of individual groups is used.

  The flashing time of the light emitting diode flashes within the exposure time based on the electronic shutter speed of the imaging unit 1, and the light amount of the illumination unit 2 can be adjusted by adjusting the flashing time.

  As the light amount of the light emitting diode, the larger the current value flowing through the light emitting diode, the larger the light amount can be obtained, but normally only a current of 10 to 20 mA (rated current value, which differs depending on each light emitting diode) flows. .

  However, if the duty ratio of the flashing time in the light emitting diode is about 1/10, it is possible to flow a current of up to about 100 mA to the same light emitting diode, which is about 10 times that of normal (at the rated current value) light emission. The amount of light can be obtained.

  That is, as indicated by circle 1 in FIG. 2, when the flash of the light emitting diode is in the same cycle as that of the non-flash, the duty ratio becomes 1/2 and the time for the next flash becomes extremely short. Only a current equal to or lower than the rated current value can flow through the light emitting diode, and therefore, a light amount greater than the light amount based on the rated current value cannot be obtained.

  However, as shown by circles 2 and 3 in FIG. 2, if the light emitting diodes are set to flash at a predetermined interval, the duty ratio becomes 1/10 and 1/24, so that the light emitting diodes can be used once. A current (pulse permissible forward current) about 10 times the rated current value can be flowed with respect to the flashlight, and this causes flashing with a large amount of light.

  The above-described duty ratio is obtained by “pulse width f / repetition period g” in the circle 4 shown in FIG. 2. The pulse allowable forward current e flowing through the light-emitting diode is represented by the pulse width f or The allowable value varies depending on the driving conditions such as the duty ratio, and is obtained from a predetermined characteristic diagram.

  Therefore, the embodiment of the present invention configured as described above has the following effects.

  As shown in FIG. 1, when the article b is supplied onto the transfer means 3, the transfer means 3 is operated at a predetermined speed, and the detection means 5 detects that the article b has reached the imaging position of the imaging means 1. , Issue a trigger signal.

  This trigger signal is transmitted to the imaging means 1 and the illumination means 2 synchronized with the imaging means 1 via the control means 6, and the electronic shutter of the imaging means 1 is operated together with the flash of the light emitting diode.

  At this time, since the flashing time of the light emitting diode is set so as to flash within the exposure time of the imaging means 1, a sufficient amount of light can be obtained.

  As a result, an image of the article b is taken into the CCD camera, and an electric signal thereof is sent to the image processing means 4, and a predetermined image processing is performed to make a desired recognition of the article b. To prepare for the next process.

  At this time, the illumination by the illuminating means 2 is supplied with a current equal to or higher than the rated current value of the light emitting diode to the light emitting diode, thereby obtaining a light amount larger than the light amount of the rated current value of the light emitting diode. Therefore, sufficient illumination for imaging the article b is provided.

  An electronic component mounting apparatus A shown in FIG. 3 shows an example in which the imaging means 1 and the illumination means 2 are attached to the movable arm 8 of the robot 7, and captures an image of the article b in a stopped state or a moving state. The operation and effect are obtained in the same manner as the electronic component mounting apparatus A shown in FIG. 1 described above, and the same image is taken even when the movable arm 8 of the robot 7 is moving.

  It should be noted that the electronic component mounting apparatus A can be applied to other various modes not illustrated as long as the apparatus has the configuration of the imaging unit 1 and the illumination unit 2 described above.

  Further, the image pickup means 1 in the embodiment of the present invention uses a camera having a shutter function capable of taking a full frame, so that the article b that is moving at high speed (even if the image pickup means 1 moves at high speed). For example, a high-resolution image can be captured.

  That is, according to the general NTSC signal system (television signal standard), the screen of the television is subjected to interlace scanning (interlaced scanning), and the vertical synchronization frequency is flicker (over the entire screen with respect to human eyes). The horizontal synchronization frequency is determined to be 262.5 (525/2) times the vertical synchronization frequency.

  In so-called television, interlaced scanning is used to alternately display field images (half resolution images) by using the optical illusion of human eyes, and shifting odd portions (ODD) and even portions (EVEN) alternately. The frame image (one image) is displayed by the method.

  Therefore, as described in the prior art described above, when the moving article b is imaged with a normal camera that does not have a shutter function, the article b in the circle 1 is a circle as shown in FIG. 2, the odd-numbered part (ODD) scanning lines are exposed at an imaging time of 1/60 seconds, and the even-numbered part (EVEN) scanning lines are exposed at an imaging time of 1/60 seconds as shown by circle 3. The exposure is performed twice with the passage of time, and the two exposures take a total of 1/30 seconds.

  Therefore, as shown in FIG. 7A, a temporal error occurs between the first exposure and the second exposure, and this error causes an image blur. As shown by a circle 4, the frame image blurs. End up.

  Further, when the moving object b is imaged by a normal camera having a shutter function, the object b in the circle 1 is scanned in the odd part (ODD) as shown in the circle 2 as shown in FIG. Since only the line is exposed, the vertical resolution can be used only half of the original CCD, and even numbered (EVEN) exposure is eliminated as indicated by circle 3, and an image with half resolution as indicated by circle 4 ( Field image).

  However, when the article b in motion is imaged using a so-called full frame shutter camera that enables imaging at the full resolution of the CCD camera by one exposure in the imaging means 1 of the embodiment of the present invention, FIG. As shown in (c), the article b in the circle 1 is exposed to the odd-numbered part (ODD) and the even-numbered part (EVEN) simultaneously as shown in the circle 2.

  That is, the vertical synchronization signal cycle is about 1/60 Hz, and the imaging time for reading out all pixel information is 1/60 seconds in accordance with the vertical synchronization signal cycle of the NTSC signal system. Imaging at full resolution is possible.

  Therefore, temporal blurring is minimized, and as shown by a circle 4 in FIG. 7C, a high-resolution image can be taken with respect to the article b that is moving at high speed.

  Furthermore, as shown in FIG. 8 (b), this full frame shutter camera can output video signals simultaneously with double lines (odd part and even part), so that the image capture time (image output time) is conventional. This can be half the time of the camera, and speeding up of the imaging process is achieved.

  Next, an electronic component mounting apparatus W adopting the electronic component mounting method of the embodiment of the present invention will be described with reference to FIGS. 4 to 6 and FIG.

  As shown in FIG. 4, the electronic component mounting apparatus W receives an electronic component b such as a chip component or an IC component, which is an article, from the supply unit m, transfers it to the mounting unit n, and prints on the mounting unit n Predetermined components are mounted at predetermined locations on the substrate c.

  The mounting position is obtained with high accuracy in accordance with a predetermined program input to the control means 6 by a conventional computer or the like. The mounting head 10 arbitrarily moves in the X-axis and Y-axis directions and the mounting head 10. Further, the suction nozzle 11 is provided that can arbitrarily move in the Z-axis direction and obtain an arbitrary θ angle (rotation angle).

  In addition, as shown in FIG. 4, the supply part m for the electronic component b described above is arranged in a large number in a predetermined parallel as shown in FIG. The provided tape feeder M or the like is used, and these are provided in the machine body 12.

  The detailed structure is such that the advancing / retracting body 14 is attached to the body 12 and arbitrarily moved in the front-rear direction (Y-axis) by the advancing / retreating means 13, and the left-right direction (X-axis) is attached to the advancing / retreating body 14 by the moving means 15. The suction nozzle 11 is attached to the movable body 16 arbitrarily moving to the movable body 16 and the mounting head 10 engaged with the movable body 16 so that the suction nozzle 11 can be moved up and down by the lifting and lowering means 17. The θ angle (rotation angle) is freely rotatable, and each of the driving means 13 and 15, 17, 18 is operated with high accuracy by a numerically controllable servo motor or the like.

  The mounting head 10 is provided with a suction nozzle type that suctions the upper surface of the electronic component b, a chucking type that grips the outer periphery thereof, etc., and may be a single head. Alternatively, as shown in FIG. 6, if a plurality of heads are used, the mounting efficiency of the electronic component b is improved.

  In this embodiment, the suction nozzle type is shown, and the suction nozzle 11 is detachably attached to the lower end portion of the mounting head 10.

  The movable body 16 or the mounting head 10 has the imaging unit 1 and the illumination unit 2 in the electronic component mounting apparatus A in one direction (including reciprocation), that is, in the case of a plurality of heads, The reciprocating means 20 is controlled by a servo motor or the like capable of numerical control on the side, and is attached so as to be movable in the parallel direction of the mounting head 10 via an attachment body 21.

  The image pickup means 1 picks up and measures the suction posture of the electronic component b taken out from the supply unit m in the machine body 12 by the mounting head 10, and includes a visual sensor 22 and a light image incident means 23. .

  Among these, the visual sensor 22 is attached to one side of the substantially horizontal attachment body 21 and is disposed laterally with respect to the electronic component b held by the mounting head 10, and is a CCD (Charge Coupled Device). If an electronic video camera is used to convert an optical video signal into an electrical signal to obtain image information of the electronic component b, and the CCD camera has a shutter function, the illumination means 2 to be described later The electronic shutter speed can be arbitrarily converted according to camera settings, but the exposure time is in the range of about 1/60 to 1 / 100,000 seconds. Is controlled, preferably about 1/1000 to 1 / 10,000 seconds.

  The obtained image signal is sent to the image processing means 4 and compared with a predetermined numerical value inputted in advance, and a desired recognition of the electronic component b is performed.

  In the image recognition described above, the overall size of the electronic component b held by suction, the overall position in the front-rear and left-right directions, the rotation angle (θ angle) of the electronic component b, the lead pitch, the lead bending, and the number of leads As a result of the position correction, the center position of the electronic component b is made to coincide with the center of the mounting position on the printed circuit board c, that is, the determined correct position as a result of the position correction. .

  The light image incident means 23 is mounted on the movement locus of the mounting body 21 just below the electronic component b of the mounting head 10 on the other side of the mounting body 21 corresponding to the visual sensor 22. A prism or a surface-deposited mirror is used, and the light incident surface corresponds to the visual sensor 22 and the lower surface of the electronic component b adsorbed by the adsorption nozzle 11, respectively.

  By capturing an image of the electronic component that is indirectly projected by the light image incident means 23, the height dimension of the visual sensor 22 can be shortened, and the entire electronic component mounting apparatus A can be made compact. .

  In the light image incident means 23, when a surface vapor deposition mirror is used, there is an advantage that it is cheaper and takes less space than a prism. When a prism is used, the reflectance is higher and clearer than the surface vapor deposition mirror. Image quality.

  Further, as shown in FIG. 9 (a), the optical image incident means 23 is provided as one, so that the exposure direction of the visual sensor 22 becomes horizontal, and as shown in FIG. The exposure direction of the sensor 22 is vertical.

  The illuminating means 2 described above illuminates the electronic component b in a stopped state or moving state instantaneously (flashing) to improve the imaging accuracy of the article b by the imaging means 1 as much as possible. A light emitting diode consisting of a large number of groups is used, and as shown in FIGS. 5 and 6, it is fixed to the upper part of the light image incident means 23 in the imaging means 1 by an attachment member 29.

  The flashing time of the light emitting diode flashes within the exposure time based on the electronic shutter speed of the imaging unit 1, and the light amount of the illumination unit 2 can be adjusted by adjusting the flashing time.

  Further, as the light amount of the light emitting diode, the larger the current value flowing through the light emitting diode, the larger the light amount can be obtained, but normally only a current of 10 to 20 mA (the rated current value, which differs depending on each light emitting diode) flows. Absent.

  However, if the duty ratio of the flashing time in the light emitting diode (the ratio of the signal period in one cycle) is 1/10 or less, it is possible to flow a current of up to about 100 mA to the same light emitting diode. An amount of light about 10 times that at the time of light emission (in current value) is obtained.

  That is, as indicated by circle 1 in FIG. 2, when the flash of the light emitting diode is in the same cycle as that of the non-flash, the duty ratio becomes 1/2 and the time for the next flash becomes extremely short. Only a current equal to or lower than the rated current value can flow through the light emitting diode, and therefore, a light amount greater than the light amount based on the rated current value cannot be obtained.

  However, as shown by circles 2 and 3 in FIG. 2, if the light emitting diodes are set to flash at a predetermined interval, the duty ratio becomes 1/10 and 1/24, so that the light emitting diodes can be used once. The current of about 10 times the rated current value can be flowed with respect to the flashlight, and the flashlight is flashed with a large amount of light.

  The above-described duty ratio is obtained by “pulse width f / repetition period g” in the circle 4 shown in FIG. 2. The pulse allowable forward current e flowing through the light-emitting diode is represented by the pulse width f or The allowable value varies depending on the driving conditions such as the duty ratio, and is obtained from a predetermined characteristic diagram.

  The control means 6 receives the detection signal of the image pickup means 1, calculates based on predetermined data, and arbitrarily controls each of the means 13, 15, 17, 18 or the reciprocating means 20 individually. A conventional computer is used.

  In addition, a position detection member 25 that restricts the image pickup position of the image pickup means 1 and the flash position (the same position as the image pickup position) of the illumination means 2 is provided. For example, a photoelectric tube or a proximity switch is used. Thus, the detector 26 is attached to the movable body 16 corresponding to each mounting head 10 at the imaging position of the imaging means 1, that is, the flash position of the illumination means 2, and the detection body 27 corresponding to the detector 26 is attached to the movable body 16. 21.

  Therefore, the electronic component mounting apparatus W according to the embodiment of the present invention configured as described above has the following effects.

  On the printed circuit board c, a predetermined number of electronic components b are respectively mounted at predetermined positions. In this work, each set value, operation order, and the like are determined in advance in the control means 6. Is programmed.

  The electronic component b is mounted by operating the advancing / retreating means 13 and moving means 15, the lifting / lowering means 17, and the rotating means 18, which are driving means, to move the mounting head 10 to the supply part m of the electronic component b. The electronic component b is sucked and held.

  Then, the reciprocating means 20 attached to the mounting head 10 operates, and the imaging means 1 provided in the mounting body 21 together with the illuminating means 2 moves in the left-right direction (the direction of the arrow p in FIG. 6). Move to).

  When the detection body 27 in the position detection member 25 corresponds to the detector 26 that is the imaging position of the imaging means 1, it is detected that the imaging position has been reached, a trigger signal is generated, and the light emitting diode in the illumination means 2 is detected. While being supplied with power, the electronic shutter of the imaging unit 1 is operated, and is captured as image recognition by the visual sensor 22 via the light image incident unit 23 and transmitted to the image processing unit 4 and the control unit 6.

  At this time, the flashing time of the light emitting diode is set to flash within the exposure time of the imaging means 1.

  Further, in the illumination by the illumination means 2, a current that is equal to or higher than the rated current value of the light emitting diode is supplied to the light emitting diode, thereby obtaining a light amount larger than the light amount of the rated current value of the light emitting diode. Thus, sufficient illumination for imaging the article b is provided.

  Note that the imaging operation of the imaging unit 1 may be in either the stopped state or the moving state. However, if the imaging unit 1 is in a moving state that does not stop, the time is increased accordingly. There is no loss, and high-speed electronic component b can be mounted.

  Furthermore, when the imaging unit 1 stops corresponding to the electronic component b that is sucked and held each time, vibration occurs in the reciprocating unit 20 and the imaging unit 1 due to the action of inertial force and the like. If the image pickup means 1 is in a moving state that does not stop, the vibration generation is eliminated and the waiting time is completely eliminated. Time can be shortened.

  Along with this, the control means 6 performs an operation based on the signal obtained by the measurement and previously input data, and performs image information processing of the electronic component b to obtain a correction numerical value.

  Thus, in the case of the four-head type as shown in FIGS. 4 and 6, the same process is performed on the remaining three heads 10, and the suction nozzles 11 attached to the respective mounting heads 10 are changed. The image processing unit 4 and the control unit 6 perform correction processing by a series of continuous operations without stopping the imaging unit 1 at the imaging position of the electronic component b held by suction.

  These operations are all completed in the process in which the suction nozzle 11 sucks and holds the electronic component b in the supply unit m and then moves to the mounting unit n in the machine body 12, and when it reaches the mounting unit n, the printing is immediately performed. Since the electronic component b can be mounted on the substrate c, there is no loss of tact time.

  Next, the operation when the camera (visual sensor 22) having the shutter function that can capture images in the full frame described in detail above is used as the imaging means 1 in the electronic component mounting apparatus W will be described with reference to FIGS. This will be described with reference to the block diagram shown in FIG. 1 and the flowcharts shown in FIGS.

  First, when the electronic component mounting apparatus W starts operation, the driving units 13, 15, 17, and 18 are operated by the signal of the control unit 6, and the plurality of mounting heads 10 provided on the mounting body 21 are supplied to the supply unit m. The desired electronic component b is sucked and held by the suction nozzle 11.

  At this time, with respect to the plurality of suction nozzles 11, the electronic component b is sucked and held by all or necessary portions or by the required number of suction nozzles 11.

  Then, the mounting head 10 moves from the supply unit m to the mounting unit n in the XY-axis direction, and the reciprocating means 20 attached to the mounting head 10 is operated to provide the mounting body 21 with the mounting head 21. The imaging unit 1 moves together with the illumination unit 2 in the left-right direction (the direction of the arrow p in FIG. 6) with respect to the mounting head 10.

  Then, when the detection body 27 in the position detection member 25 corresponds to the detector 26 which is the imaging position of the imaging means 1, it is detected that the imaging position has been reached, and at this time, a trigger that matches the timing of image capture from the outside A signal is input to the random shutter generation circuit (interrupt processing).

  In this random shutter generation circuit, a part of the signal of the synchronization signal generation circuit is reset by the input of the trigger signal and restarted in synchronization with the external trigger signal.

  At this time, power is supplied to the light emitting diode in the illuminating means 2 and the full frame shutter of the imaging means 1 is operated, and is captured as image information by the visual sensor 22 (CCD camera) via the light image incident means 23. In the synchronization signal generation circuit, a vertical synchronization signal and a horizontal synchronization signal necessary for driving the CCD camera are generated and sent to the timing generation circuit.

  The signal generated by the CCD driver is transmitted to the CCD camera (visual sensor 22), and ODD (odd field) and EVEN (even field) are simultaneously output from the CCD camera, and all the pixels of the electronic component b are output. Reading is performed, and the ODD video signal and the EVEN video signal are simultaneously output through the video amplifier and the video signal processing circuit, and transmitted to the image processing means 4 and the control means 6.

  In FIG. 10, the CCD readout timing signal is a signal indicating the timing or period of reading the video signal output from the CCD camera, and the clock signal is the video signal output from the CCD camera. This is a synchronization signal that is the source of the signal.

  In the control means 6, based on the image information of the electronic component b obtained by the imaging means 1 by the above-described process, a comparison operation is performed in advance with the mounting information of the electronic component b input to the control means 6, and the result If there is a positional deviation, the amount of correction is numerically controlled for each means 13, 15, 17, 18, etc. in the electronic component mounting apparatus W to determine the holding state of the electronic component b held by the suction nozzle 11. All the correction operations are completed before the mounting position of the board c of the mounting portion n is reached.

  The imaging of the electronic component b of the imaging unit 1 is performed in a series of continuous movement states while the imaging unit 1 moves below the electronic component b by the reciprocating unit 20, that is, without stopping the imaging unit 1. The image reading process can be greatly shortened, and the synergistic effect by the cooperation with the illuminating means 2 described above allows the electronic component b held by the suction nozzle to be held by the suction nozzle. The imaging process at the time of position measurement in image processing is significantly speeded up, and as a result, the purpose of greatly shortening the mounting tact time of the electronic component b is achieved.

  In the case of a plurality of mounting heads 10, as shown in FIG. 13, in the entire movement process h of the imaging means 1, the movement by the reciprocating means 20 from the standby position to the movement end position is in a state where the movement amount is zero. Is moved from the mounting head 10 of NO1 to the mounting head 10 of NO4 at an equal speed when a predetermined speed is reached. After the imaging is completed, the electrons by the suction nozzle 11 are decelerated after the deceleration. It stops at a position where the mounting operation of the component b is not hindered.

  At this time, the imaging unit 1 may immediately return to the start position in the forward path, but in response to the operation of sucking and holding the next electronic component b, the movement from the movement end position, that is, the standby position to the movement end position on the return path, is performed. You may move, performing a process.

1 is a schematic perspective view showing a first example of implementation of an electronic component mounting apparatus that employs an electronic component mounting method according to the present invention. It is explanatory drawing which shows each example of the duty ratio of the illumination means of the electronic component mounting apparatus in FIG. It is a schematic perspective view which shows the 2nd example of implementation of the electronic component mounting apparatus which employ | adopted the electronic component mounting method regarding this invention. 1 is a schematic plan view showing an example of implementation of an electronic component mounting apparatus employing an electronic component mounting method according to the present invention. It is a schematic side view in FIG. It is a schematic perspective view in FIG. It is explanatory drawing at the time of using a full frame shutter camera for the imaging means in the electronic component mounting method concerning this invention. FIGS. 8A and 7B are explanatory views showing the output state of the video signal of the image pickup means in FIG. 7, where FIG. 7A shows a conventional example, and FIG. It is explanatory drawing which shows each example of the optical image incident means of the imaging means in FIG. It is a block diagram which shows the imaging process of the imaging means in FIG. It is a flowchart figure which shows the imaging start of the imaging process of the imaging means in FIG. It is a flowchart figure which shows the imaging process of the imaging means in FIG. It is explanatory drawing of the operation | movement which shows the imaging process of the imaging means in FIG.

Explanation of symbols

W Electronic component mounting device b Article, electronic component c Printed circuit board m Supply unit n Mounting unit 1 Imaging unit 2 Illuminating unit 13, 15, 17, 18 Driving unit 22 Visual sensor (CCD camera)
23 Optical image incident means

Claims (3)

A suction nozzle that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by the driving means, picks up and holds the electronic component from the supply unit, and places it on the substrate on which the mounting unit is positioned. In an electronic component mounting method for mounting at a position,
A suction step in which the suction nozzle sucks an electronic component in the supply unit; a movement step in which the electronic component sucked in the suction nozzle is moved to a substrate; and a mounting step in which the moved electronic component is mounted on the substrate. An imaging means having an electronic shutter mechanism capable of imaging at the full resolution of the CCD camera with a single exposure, and imaging the holding state of the electronic component sucked and held at the tip of the suction nozzle during the suction nozzle moving step An electronic component mounting method characterized by: A suction nozzle that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by the driving means, picks up and holds the electronic component from the supply unit, and places it on the substrate on which the mounting unit is positioned. In the electronic component mounting device to be mounted at the position,
The image pickup means includes an image pickup means for picking up and holding an electronic component held by suction at the tip of the suction nozzle together with the pickup nozzle, and the image pickup means is composed of a CCD camera. An electronic component mounting apparatus having an electronic shutter mechanism capable of imaging at full resolution. A suction nozzle that performs arbitrary movement in the X, Y, and Z directions and arbitrary rotation in the θ direction by the driving means, picks up and holds the electronic component from the supply unit, and places it on the substrate on which the mounting unit is positioned. In the electronic component mounting device to be mounted at the position,
The image pickup device includes an image pickup unit that picks up and holds the electronic component held and held at the tip of the suction nozzle together with the suction nozzle, and an illumination unit including a light emitting diode. An electronic component mounting apparatus comprising an electronic shutter mechanism capable of imaging at the full resolution of the CCD camera in a single exposure.

Images