JP2005235939A - Electronic apparatus equipped with circuit board - Google Patents

Electronic apparatus equipped with circuit board Download PDF

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JP2005235939A
JP2005235939A JP2004041654A JP2004041654A JP2005235939A JP 2005235939 A JP2005235939 A JP 2005235939A JP 2004041654 A JP2004041654 A JP 2004041654A JP 2004041654 A JP2004041654 A JP 2004041654A JP 2005235939 A JP2005235939 A JP 2005235939A
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circuit board
holes
oblique
circuit
pattern
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JP3872794B2 (en
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Toshio Ishimoto
敏男 石本
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Orion Electric Co Ltd
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Orion Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board which has resistivity against bending stress such as warpage and in which peelability is improved in a circuit pattern and various electronic components installed in the circuit board. <P>SOLUTION: The various electronic components are mounted on the rectangular circuit board 10 fitted to an electronic apparatus 1, and the circuit pattern 12 having conductivity on a surface is formed. A plurality of slanting ellipse holes 15 which are slantingly arranged with respect to the circuit board 10 are formed in the short-hand direction of the circuit board 10. Thus, bending in a vertical direction to the circuit board 10 is effectively set free, and damage to the circuit board 10 and the peeling of the circuit pattern 12 from the circuit board 10 can be prevented. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、回路基板を内蔵するテレビジョン受像機やDVD装置などの電子機器、特に、回路基板に対して斜楕円の貫通孔を形成することで、回路基板が反るようにして撓んだ際に、回路基板に作用する曲げ応力を貫通孔から逃がして破損することを回避すると共に、回路基板の表面に設けられた回路パターン、各種電子部品などが、回路基板から剥離することを防止する回路基板を備えた電子機器に関する。   The present invention is an electronic device such as a television receiver or a DVD device with a built-in circuit board, in particular, a slanted elliptical through hole is formed in the circuit board so that the circuit board is bent and warped. In this case, the bending stress acting on the circuit board is prevented from escaping from the through hole and being damaged, and the circuit pattern and various electronic components provided on the surface of the circuit board are prevented from being peeled off from the circuit board. The present invention relates to an electronic device including a circuit board.

一般的に用いられている電子機器などは、比較的大型且つ重量の重いトランスなどの電子部品が回路基板に実装され、各種電子部品から突設する複数の接続端子が、回路基板に設けられている回路パターンに半田付けなどにより各々接続されている。   Generally used electronic devices and the like have relatively large and heavy transformers and other electronic components mounted on a circuit board, and a plurality of connection terminals protruding from various electronic components are provided on the circuit board. Each circuit pattern is connected by soldering or the like.

ところで、図5及び図6に示す従来から用いられている回路基板100においては、その本体の形状が長方形などの比較的長めの矩形型に形成されているものが多く、回路基板の表面に各種電子部品などを実装するものが使用されており、図5に示すように一文字型の直線状のスリット孔101や、或いは、図6に示すように、回路基板の外形に対し、縦又は横の何れかの方向に沿って複数の連続するスリット孔102を並列して形成しているものが知られている。   By the way, in the circuit board 100 conventionally used shown in FIG.5 and FIG.6, the shape of the main body is often formed in a relatively long rectangular shape such as a rectangle, and there are various types on the surface of the circuit board. A device for mounting electronic components or the like is used, and as shown in FIG. 5, a single-character linear slit hole 101, or as shown in FIG. It is known that a plurality of continuous slit holes 102 are formed in parallel along any direction.

また、特許文献1には、回路基板に切込み溝を形成し、回路基板に曲げ応力が加わっても、切込み溝から曲げ応力を逃がし、電子部品が回路基板へ接続されている接続部に応力が集中することを抑制し電子部品が回路基板より剥離することを防止するものが開示されている。また、特許文献2には、部品の破壊を防止するといった同様の目的で、回路基板にスリットを設けたものが開示されている。   Further, in Patent Document 1, a cut groove is formed in a circuit board, and even if bending stress is applied to the circuit board, the bending stress is released from the cut groove, and stress is applied to the connection part where the electronic component is connected to the circuit board. The thing which suppresses that it concentrates and prevents that an electronic component peels from a circuit board is disclosed. Patent Document 2 discloses a circuit board provided with a slit for the same purpose of preventing destruction of components.

特開平8−186142号公報JP-A-8-186142 実開平5−95074号公報Japanese Utility Model Publication No. 5-95074

しかし、比較的長手方向に長い形状の回路基板に、一文字型のスリット孔をその長手方向と同方向に形成されているものについては、スリット孔が回路基板に形成されていたとしても、回路基板が撓んで破損するといったことはほとんど起こることはないが、一文字型のスリット孔が回路基板の短手方向に形成されていると、回路基板が外部からの力により上下方向に撓むことにより、スリット孔に曲げ応力が局所的に集中することから、強い曲げ応力が加わると、回路基板が折れるなどして破損してしまうことがある。また、仮に、回路基板が破損しなかったとしても、回路基板に設けられている回路パターンが剥離したり、或いは、トランスなどの重量の重い電子部品を回路基板に実装して、半田付けによって回路パターンに取り付けられている状態においては、回路基板の撓みに伴って半田により取り付けられている接続部分が取れてしまうといった問題を有していた。   However, for a circuit board having a shape that is relatively long in the longitudinal direction and one-letter type slit hole formed in the same direction as the longitudinal direction, even if the slit hole is formed in the circuit board, the circuit board However, if a single-character slit hole is formed in the short direction of the circuit board, the circuit board bends in the vertical direction by external force, Since bending stress is locally concentrated in the slit hole, when strong bending stress is applied, the circuit board may be broken and damaged. Even if the circuit board is not damaged, the circuit pattern provided on the circuit board may be peeled off, or a heavy electronic component such as a transformer may be mounted on the circuit board and soldered. In the state of being attached to the pattern, there has been a problem that the connection part attached by soldering is removed along with the bending of the circuit board.

本発明は、上記課題を解決するものであり、回路基板に対して斜めに斜貫通孔を形成することにより、回路基板に撓ませようとする曲げ応力が作用した際に、曲げ応力を逃がし、回路基板の回路パターンや各種電子部品などに局所的に曲げ応力が集中することを軽減することで、反りなどの曲げ応力に強いと共に、回路基板に設けられている回路パターンや各種電子部品の耐剥離性を向上させた回路基板を備えた電子機器に関する。   The present invention solves the above-mentioned problem, by forming a diagonal through hole obliquely with respect to the circuit board, when the bending stress to be bent acts on the circuit board, the bending stress is released, By reducing the concentration of bending stress locally on the circuit pattern of the circuit board and various electronic components, it is resistant to bending stress such as warping and the resistance of the circuit pattern and various electronic components provided on the circuit board. The present invention relates to an electronic device including a circuit board with improved peelability.

本発明の請求項1の回路基板を備えた電子機器は、電子機器内に取り付けられているほぼ矩形の回路基板の表面に回路パターンを設け、この回路パターンに接続される各種電子部品を前記回路基板に実装し、この回路基板に斜めに配置したスリット状の複数の斜貫通孔を前記回路基板の短手方向に配列したことを特徴とする。   According to a first aspect of the present invention, there is provided an electronic apparatus including the circuit board, wherein a circuit pattern is provided on a surface of a substantially rectangular circuit board mounted in the electronic apparatus, and various electronic components connected to the circuit pattern are connected to the circuit. A plurality of slit-shaped oblique through holes mounted on a substrate and arranged obliquely on the circuit board are arranged in the short direction of the circuit board.

請求項1の構成により、外的要因により回路基板が撓んだ際、回路基板の特定の部位に曲げ応力を局所的に集中させずに、複数配列された斜貫通孔の範囲に応力を集中させて曲げ応力を逃がすことができるから、回路基板は破損することなく電子機器内に保持される。   With the configuration of claim 1, when the circuit board is bent due to an external factor, the stress is concentrated in the range of the oblique through holes arranged in a plurality without locally concentrating the bending stress on a specific part of the circuit board. Therefore, the bending stress can be released, so that the circuit board is held in the electronic device without being damaged.

本発明の請求項2の回路基板を備えた電子機器は、前記請求項1記載の回路基板を備えた電子機器において、前記斜貫通孔の隣接端部同士は、前記回路基板の長手方向に重なる位置に配置したことを特徴とする。   An electronic device comprising the circuit board according to claim 2 of the present invention is the electronic device comprising the circuit board according to claim 1, wherein adjacent end portions of the oblique through holes overlap in the longitudinal direction of the circuit board. It is characterized by being arranged at a position.

請求項2の構成により、回路基板の長手方向に重なるように斜貫通孔を配置したから、回路基板の短手方向に途切れないように斜貫通孔が配列されることになるので、回路基板の撓み時に、斜貫通孔形成された範囲より一層応力を集中させて曲げ応力を逃がすことができる。   According to the configuration of the second aspect, since the oblique through holes are arranged so as to overlap with the longitudinal direction of the circuit board, the oblique through holes are arranged so as not to be interrupted in the short direction of the circuit board. At the time of bending, the stress can be concentrated more than the range where the oblique through holes are formed, and the bending stress can be released.

本発明の請求項3の回路基板を備えた電子機器は、請求項2記載の回路基板を備えた電子機器において、前記隣接端部の重なり幅を1〜3mm、好ましくは2mmに設定したことを特徴とする。   An electronic device comprising the circuit board according to claim 3 of the present invention is the electronic device comprising the circuit board according to claim 2, wherein the overlapping width of the adjacent end portions is set to 1 to 3 mm, preferably 2 mm. Features.

請求項3の構成により、回路基板に荷重が加わった際、その曲げ応力が斜貫通孔により吸収される。   According to the configuration of claim 3, when a load is applied to the circuit board, the bending stress is absorbed by the oblique through hole.

本発明の請求項4の回路基板を備えた電子機器は、前記請求項1〜3の何れか1項に記載の回路基板を備えた電子機器において、前記各種電子部品の内の1つは、前記回路パターンに接続する複数の接続端子が間隔をおいて並設され、前記回路パターンに前記接続端子を挿通する挿通孔を形成するとともに、この挿通孔が前記回路基板の長手方向に間隔を空けて2列に並設され、この挿通孔に挿通した接続端子間に前記斜貫通孔を形成したことを特徴とする。   An electronic device provided with the circuit board according to claim 4 of the present invention is an electronic device provided with the circuit board according to any one of claims 1 to 3, wherein one of the various electronic components is: A plurality of connection terminals connected to the circuit pattern are juxtaposed at intervals to form an insertion hole for inserting the connection terminal in the circuit pattern, and the insertion hole is spaced in the longitudinal direction of the circuit board. The oblique through holes are formed between the connection terminals that are arranged in parallel in two rows and are inserted into the insertion holes.

請求項4の構成により、電子部品に設けられた2列の接続端子間に斜貫通孔を形成したことから、電子部品の重量によって回路基板が撓んだ際に、接続端子に曲げ応力が作用することを軽減する。これにより、強度的に弱い接続端子と回路パターンの接続部が破損することがない。   According to the configuration of the fourth aspect, since the oblique through holes are formed between the two rows of connection terminals provided in the electronic component, a bending stress acts on the connection terminal when the circuit board is bent due to the weight of the electronic component. To reduce. As a result, the connection portion between the connection terminal and the circuit pattern, which is weak in strength, is not damaged.

本発明の請求項5の回路基板を備えた電子機器は、前記請求項4記載の回路基板を備えた電子機器において、前記電子部品は、トランスであることを特徴とする。   According to a fifth aspect of the present invention, there is provided an electronic apparatus including the circuit board according to the fourth aspect, wherein the electronic component is a transformer.

請求項5の構成により、トランスは、鉄心や複数の巻き線を備え、例えば、抵抗やコンデンサなどの小型の電子部品に比べ非常に重量が重いもので、このような重量の重い電子部品を実装した回路基板の撓みを斜貫通孔により効果的に軽減できるから、回路基板からトランスが剥離することがない。   According to the configuration of claim 5, the transformer includes an iron core and a plurality of windings. For example, the transformer is very heavy compared to a small electronic component such as a resistor or a capacitor. Since the deflection of the circuit board can be effectively reduced by the oblique through hole, the transformer does not peel from the circuit board.

本発明の請求項1の回路基板を備えた電子機器によれば、電子機器内に取り付けられているほぼ矩形の回路基板の表面に回路パターンを設け、この回路パターンに接続される各種電子部品を前記回路基板に実装し、この回路基板に斜めに配置したスリット状の複数の斜貫通孔を前記回路基板の短手方向に配列したので、輸送、落下などにより回路基板が撓んだ際に、故障することのない振動や衝撃に強い回路基板を備えた電子機器を提供することができる。   According to the electronic apparatus having the circuit board of claim 1 of the present invention, a circuit pattern is provided on the surface of a substantially rectangular circuit board attached to the electronic apparatus, and various electronic components connected to the circuit pattern are provided. Since a plurality of slit-shaped oblique through holes mounted on the circuit board and arranged obliquely on the circuit board are arranged in the short direction of the circuit board, when the circuit board is bent due to transportation, dropping, etc. It is possible to provide an electronic device including a circuit board that is resistant to vibration and impact without causing a failure.

本発明の請求項2の回路基板を備えた電子機器は、前記請求項1記載の回路基板を備えた電子機において、前記斜貫通孔の隣接端部同士は、前記回路基板の長手方向に重なる位置に配置したので、斜貫通孔が回路基板の短手方向に途切れないように配列され曲げ応力を一層逃がし易くすることができる。   According to a second aspect of the present invention, there is provided an electronic apparatus including the circuit board according to the first aspect, wherein the adjacent end portions of the oblique through holes overlap with each other in the longitudinal direction of the circuit board. Since the inclined through holes are arranged so as not to be interrupted in the short direction of the circuit board, the bending stress can be more easily released.

本発明の請求項3の回路基板を備えた電子機器は、前記請求項2記載の回路基板を備えた電子機において、前記隣接端部の重なり幅を1〜3mm、好ましくは2mmに設定したので、回路基板に荷重が加わった際、その曲げ応力が斜貫通孔によって効果的に吸収することにより、回路パターンや各種電子部品の耐剥離性を向上することができる。   Since the electronic device provided with the circuit board according to claim 3 of the present invention is an electronic machine provided with the circuit board according to claim 2, the overlapping width of the adjacent end portions is set to 1 to 3 mm, preferably 2 mm. When a load is applied to the circuit board, the bending stress is effectively absorbed by the oblique through holes, so that the peel resistance of the circuit pattern and various electronic components can be improved.

本発明の請求項4の回路基板を備えた電子機器は、前記請求項1〜3記載の回路基板を備えた電子機において、前記各種電子部品の内の1つは、前記回路パターンに接続する複数の接続端子が間隔をおいて並設され、前記回路パターンに前記接続端子を挿通する挿通孔を形成するとともに、この挿通孔が前記回路基板の長手方向に間隔を空けて2列に並設され、この挿通孔に挿通した接続端子間に前記斜貫通孔を形成したので、強度的に弱い接続端子と回路パターンの接続部が破損することがない。   According to a fourth aspect of the present invention, there is provided an electronic apparatus including the circuit board according to the first aspect, wherein one of the various electronic components is connected to the circuit pattern. A plurality of connection terminals are arranged in parallel at intervals to form an insertion hole through which the connection terminal is inserted, and the insertion holes are arranged in parallel in two rows at intervals in the longitudinal direction of the circuit board. And since the said diagonal through-hole was formed between the connection terminals penetrated by this penetration hole, the connection part of a weak connection terminal and a circuit pattern is not damaged.

本発明の請求項5の回路基板を備えた電子機器は、前記請求項4記載の回路基板を備えた電子機器において、前記電子部品をトランスとしたので、このような重量の重い電子部品であっても、回路基板から剥離することを防止することができる。   The electronic device including the circuit board according to claim 5 of the present invention is such a heavy electronic component because the electronic component is a transformer in the electronic device including the circuit board according to claim 4. However, peeling from the circuit board can be prevented.

以下、図1〜図4を参照しながら、本発明を実施するための最良の形態としての実施例を以下に説明する。もちろん、本発明は、その発明の趣旨に反しない範囲で、実施例において説明した以外の構成のものに対しても容易に適用可能なことは説明を要するまでもない。   Hereinafter, an embodiment as the best mode for carrying out the present invention will be described below with reference to FIGS. Needless to say, the present invention can be easily applied to configurations other than those described in the embodiments without departing from the spirit of the invention.

図1は、テレビジョン受像機、DVD装置などの電子機器内に備えられている回路基板の一例を示す下面図であり、図2は回路基板に形成されている貫通孔を示す要部拡大図である。   FIG. 1 is a bottom view showing an example of a circuit board provided in an electronic apparatus such as a television receiver and a DVD device, and FIG. 2 is an enlarged view of a main part showing a through hole formed in the circuit board. It is.

本実施例における回路基板10は、その角部近傍にねじ孔11が形成されており電子機器1の外形を形成するキャビネット2の内側にネジ9などにより取り付け固定されている。この回路基板10の上面には、トランス20、抵抗、コンデンサなどの種々の電子部品などが実装されており、図1に示すように、回路基板10の下面のほぼ全周に亘って回路パターン12が形成されており、回路基板の材質は、紙フェノール、ガラス布などの合成樹脂などの弾性部材であり、その厚さを1.6mmとする薄型の長手方向に長い回路基板10である。なお、抵抗、コンデンサなどの各種電子部品は、本発明の要旨とはならないため、その図示を省略している。   A screw hole 11 is formed in the vicinity of the corner of the circuit board 10 in this embodiment, and the circuit board 10 is attached and fixed to the inside of the cabinet 2 that forms the outer shape of the electronic device 1 with screws 9 or the like. Various electronic components such as a transformer 20, a resistor, and a capacitor are mounted on the upper surface of the circuit board 10. As shown in FIG. 1, the circuit pattern 12 extends over almost the entire circumference of the lower surface of the circuit board 10. The circuit board is made of an elastic member such as synthetic resin such as paper phenol or glass cloth, and is a thin circuit board 10 having a thickness of 1.6 mm and long in the longitudinal direction. Various electronic parts such as resistors and capacitors are not shown in the gist of the present invention, and are not shown.

回路基板10には、トランス20などの各種電子部品に設けられた接続端子21が挿通される挿通孔13が形成されており、この挿通孔13に接続端子21を挿通して、回路基板下面に設けられている回路パターン12に半田付けにより接続されて取り付けられている。   The circuit board 10 is formed with an insertion hole 13 through which a connection terminal 21 provided in various electronic components such as the transformer 20 is inserted. The connection terminal 21 is inserted into the insertion hole 13 and is formed on the lower surface of the circuit board. The circuit pattern 12 is connected and attached by soldering.

ところで、トランス20について詳しく説明すると、このトランス20は、回路基板10の長手方向のほぼ中央に設けられ、回路基板10上に実装されている電子部品の中では鉄心や複数の巻き線を構成することにより比較的大型、且つ重量の重い部品の1つであり、このトランス20から回路基板10側に突設する複数の接続端子21は、図1に示すように、回路基板10の長手方向に間隔を空けて並設する2列の接続端子21が設けられ、その接続端子21の挿入される位置に対応して回路基板10に設けられた挿通孔13も同様に2列に並列して形成されている。そして、挿通孔13に接続端子21を挿入した状態で回路パターン12に半田付けにより取り付けられている。なお、上記挿通孔13及び接続端子21の列は、回路基板10の長手方向と直交する、回路基板10の短手方向に長い列となるように配置されている。   By the way, the transformer 20 will be described in detail. The transformer 20 is provided at substantially the center in the longitudinal direction of the circuit board 10 and constitutes an iron core and a plurality of windings in the electronic components mounted on the circuit board 10. Accordingly, a plurality of connection terminals 21 protruding from the transformer 20 toward the circuit board 10 side are arranged in the longitudinal direction of the circuit board 10 as shown in FIG. Two rows of connection terminals 21 arranged in parallel at intervals are provided, and the insertion holes 13 provided in the circuit board 10 corresponding to the positions where the connection terminals 21 are inserted are similarly formed in parallel in two rows. Has been. And it is attached to the circuit pattern 12 by soldering with the connection terminal 21 inserted in the insertion hole 13. The rows of the insertion holes 13 and the connection terminals 21 are arranged so as to be long in the short direction of the circuit board 10, which is orthogonal to the longitudinal direction of the circuit board 10.

また、トランス20と回路基板10との間には隙間があり、トランス20の下面の臨む位置であると共に、回路基板10の短手方向に位置するトランス20の中央に複数の斜貫通孔15が規則的に並べて形成されていて、上述した回路基板の長手方向に2列に間隔を空けて並設した挿通孔13に挿通した接続端子21間に斜貫通孔15を形成している。   Further, there is a gap between the transformer 20 and the circuit board 10, the position where the lower surface of the transformer 20 faces, and a plurality of oblique through holes 15 in the center of the transformer 20 located in the short direction of the circuit board 10. The oblique through-holes 15 are formed between the connection terminals 21 that are regularly arranged and inserted into the insertion holes 13 that are arranged in parallel in the longitudinal direction of the circuit board in two rows at intervals.

本実施例における斜貫通孔15及び後述する貫通孔16の形状は、長手方向に細く回路基板10が撓んだ際に破損することがないように、その両端部15a、16aが同一形状の円弧状に形成されていて、これらの両端部15a、16aを直線状に結ぶようにしてなる楕円型に形成されている。なお、本実施例における貫通孔15,16の長手方向の長さは、5mm以上が望ましく、実際には10mmに形成されている。また、これら貫通孔15,16の幅は、0.7mm〜1.5mmが望ましく、実際には1.2mmとなっている。   The oblique through holes 15 and the through holes 16 to be described later in this embodiment are thin in the longitudinal direction so that both end portions 15a and 16a have the same shape so as not to be damaged when the circuit board 10 is bent. It is formed in an arc shape and is formed in an elliptical shape in which both end portions 15a and 16a are connected in a straight line. In addition, the length in the longitudinal direction of the through holes 15 and 16 in the present embodiment is desirably 5 mm or more, and is actually formed to 10 mm. Further, the width of the through holes 15 and 16 is preferably 0.7 mm to 1.5 mm, and is actually 1.2 mm.

また、各々の斜貫通孔15の端部15aは、その隣に配置されている斜貫通孔15や貫通孔16の端部15a、16aと、回路基板10の長手方向の直線上に重なるようにして配置されている。本実施例においては、重なるようにして配置した重複部aは、図2に示すように回路基板10の短手方向に1〜3mm程度重なるようにして配置し、複数の隣り合う斜貫通孔15a,15a、15a,16a同士の重複部aの間隔は、回路基板10の厚さ以上の間隔、すなわち、本実施例においては、1.6mm以上離すことで、薄型の回路基板10であっても、回路基板10の上下方向に曲げ応力が作用した際に、割れたりして破損しないようになっている。なお、重複部aの間隔は、1〜3mmにするのが望ましく、2mmにするのが最も望ましい。このように配置することにより、回路基板10への曲げ応力を、斜貫通孔15及び貫通孔16により効果的に吸収して逃がすことができるようになっている。   Further, the end 15 a of each oblique through-hole 15 overlaps with the oblique through-hole 15 and the ends 15 a and 16 a of the through-hole 16 arranged adjacent to each other on a straight line in the longitudinal direction of the circuit board 10. Are arranged. In this embodiment, the overlapping portions a arranged so as to overlap each other are arranged so as to overlap each other by about 1 to 3 mm in the short direction of the circuit board 10 as shown in FIG. , 15a, 15a, and 16a are spaced apart from each other by a distance equal to or greater than the thickness of the circuit board 10, that is, in the present embodiment, the distance between the overlapping parts a is 1.6 mm or more. When the bending stress is applied in the vertical direction of the circuit board 10, it is not broken or broken. The interval between the overlapping portions a is preferably 1 to 3 mm, and most preferably 2 mm. By arranging in this way, the bending stress to the circuit board 10 can be effectively absorbed by the oblique through holes 15 and the through holes 16 and released.

次に、上記構成に係るその作用について説明する。回路基板10にトランス20などの各種電子部品を実装する際に、電子機器1のキャビネット2の所定の位置に回路基板10の隅に形成されているねじ孔11にネジ9を締め込んで取り付ける。この場合、ネジ9を締め込み過ぎてしまうと、回路基板10に撓みが生じてしまう。また、自動車などによって運送されたりすると自動車の揺れなどに伴って、回路基板10への撓みが生じる。従って、回路基板10の短手方向に配列して、回路基板10に対し斜めの位置となる斜貫通孔15を回路基板10に形成したことで、回路基板10への曲げ応力が、回路基板10上に実装されている各種電子部品や回路パターン12に作用しないように、回路パターンなどの設けられてない回路基板10に形成されている斜貫通孔15に曲げ応力を集中させ、回路基板10への曲げ応力を斜貫通孔15から逃がし、回路基板10の撓みを効果的に緩和できる。なお、本実施例においては、図1に示すように、回路基板10に対して斜めに位置する斜貫通孔15を回路基板10の短手方向に規則的に並列しているが、図3に示す変形例のように、斜貫通孔15間に回路基板10の短手方向と同方向に細長い貫通孔16を設けても、上述した回路基板10と同様に回路基板10の撓みを効果的に緩和できる。従って、図5に示す従来例のように、回路基板100の短手方向と水平に、一文字型のスリット孔101を一本形成し、回路基板100が撓んだ際の曲げ応力が、このスリット孔101に沿って、曲げ応力が局所的に集中して破損するといったことなく回路基板10への曲げ応力を軽減することができるので、回路基板10に強い曲げ応力が加えられたとしても回路基板10が破損することを回避することができる。さらに、一般的に、回路基板10と導電性の有する回路パターン12との材質は異なることから、回路基板12が繰り返し撓んだりすると、回路基板10から回路パターン12が剥離(特にトランス20の接続端子21たるピンの根元からの剥離)することが多々あるが、回路基板10に外部からの曲げ応力が繰り返し作用したりしても、回路パターン12の配置されていない部位、本実施例においては、各種電子部品の内の1つであるトランス20から突設する2列に並ぶように設けられている接続端子21間に、斜貫通孔15や貫通孔16を設けたことで、回路基板10に設けられた回路パターン12や、回路パターン12に半田付けされている各種電子部品の接続部に、曲げ応力が集中することを回避することができるので、回路基板10から回路パターン12が剥離することを回避することができる。さらに、重複部aを回路基板10の長手方向と同じ方向にほぼ重なるように配置すると共に、比較的広範囲に複数の斜貫通孔15、貫通孔16を回路基板10の短手方向に規則的に配列したことから、回路基板10の短手方向の所定の範囲に、曲げ応力を集中させることができ、回路基板10の破損を防止することができる。従って、回路基板10を撓ませようとする曲げ応力が作用したとしても、回路基板10から回路パターン12が剥離することを確実に防止でき、回路基板10および回路パターン12が破損することを防止することができるので、このような回路基板10を備えた各種電子機器1は、故障を引き起こすことを回避することができる。   Next, the effect | action which concerns on the said structure is demonstrated. When various electronic components such as the transformer 20 are mounted on the circuit board 10, the screws 9 are fastened and attached to the screw holes 11 formed in the corners of the circuit board 10 at predetermined positions of the cabinet 2 of the electronic device 1. In this case, if the screw 9 is tightened too much, the circuit board 10 will bend. In addition, when the vehicle is transported by an automobile or the like, the circuit board 10 is bent as the automobile shakes. Therefore, the oblique through holes 15 that are arranged in the short direction of the circuit board 10 and are inclined with respect to the circuit board 10 are formed in the circuit board 10, so that the bending stress to the circuit board 10 is reduced. The bending stress is concentrated on the oblique through hole 15 formed in the circuit board 10 on which no circuit pattern or the like is provided so as not to act on various electronic components and the circuit pattern 12 mounted on the circuit board 10. The bending stress of the circuit board 10 can be effectively relieved by releasing the bending stress from the oblique through hole 15. In this embodiment, as shown in FIG. 1, the oblique through holes 15 that are oblique to the circuit board 10 are regularly arranged in the short direction of the circuit board 10. As in the modification shown, even if the elongated through holes 16 are provided between the oblique through holes 15 in the same direction as the short side of the circuit board 10, the bending of the circuit board 10 is effectively reduced in the same manner as the circuit board 10 described above. Can be relaxed. Therefore, as in the conventional example shown in FIG. 5, a single-character slit hole 101 is formed horizontally with the short direction of the circuit board 100, and the bending stress when the circuit board 100 is bent is caused by this slit. Since the bending stress to the circuit board 10 can be reduced along the hole 101 without bending stress being concentrated locally, even if a strong bending stress is applied to the circuit board 10. 10 can be prevented from being damaged. Further, since the circuit board 10 and the conductive circuit pattern 12 are generally made of different materials, if the circuit board 12 is repeatedly bent, the circuit pattern 12 is peeled off from the circuit board 10 (particularly the connection of the transformer 20). The terminal 21 is often peeled off from the base of the pin), but even if a bending stress from the outside repeatedly acts on the circuit board 10, the part where the circuit pattern 12 is not arranged, in this embodiment By providing the oblique through holes 15 and the through holes 16 between the connection terminals 21 provided so as to be arranged in two rows protruding from the transformer 20 which is one of various electronic components, the circuit board 10 is provided. It is possible to avoid bending stress from being concentrated on the circuit pattern 12 provided in the circuit board and the connection parts of various electronic components soldered to the circuit pattern 12, so that the circuit board 0 it is possible to prevent the circuit pattern 12 is peeled off. Further, the overlapping portion a is arranged so as to substantially overlap in the same direction as the longitudinal direction of the circuit board 10, and a plurality of oblique through holes 15 and through holes 16 are regularly arranged in a short direction of the circuit board 10 in a relatively wide range. Since they are arranged, bending stress can be concentrated in a predetermined range in the short direction of the circuit board 10, and damage to the circuit board 10 can be prevented. Therefore, even if a bending stress is applied to bend the circuit board 10, it is possible to reliably prevent the circuit pattern 12 from peeling from the circuit board 10 and to prevent the circuit board 10 and the circuit pattern 12 from being damaged. Therefore, various electronic devices 1 including such a circuit board 10 can avoid causing a failure.

以上のように、本実施例における回路基板10を備えた電子機器1は、トランス20などの大型電子部品を回路基板10上に実装しても、回路基板10の撓みに対して強度的に強いとはいえない箇所への反りなどの曲げ応力の影響を、少なくとも斜貫通孔を形成したことで所望の位置から逃がして軽減できるので、反りなどの撓みに強いと共に回路基板10から回路パターン12が剥離することのない耐剥離性に優れた回路基板10を提供することができ、これらの回路基板10を備えた電子機器1が故障することを防止することができる。   As described above, the electronic device 1 including the circuit board 10 according to the present embodiment is strong in strength against bending of the circuit board 10 even when a large electronic component such as the transformer 20 is mounted on the circuit board 10. The influence of bending stress such as warping to a portion that cannot be said can be reduced by escaping from a desired position by forming at least the oblique through hole. It is possible to provide the circuit board 10 having excellent peeling resistance without peeling, and it is possible to prevent the electronic device 1 including these circuit boards 10 from being damaged.

また、実施例上の効果として、回路基板10の上下に貫通する斜貫通孔15および貫通孔16を複数形成したことから、通気性が向上するので、これら斜貫通孔15、貫通孔16上方に設けられているトランス20などの各種電子部品を、回路基板10に取り付ける際に生じる半田付けによる熱やガスを、貫通孔15,16から効果的に放熱することができる。   Further, as an effect of the embodiment, since a plurality of the oblique through holes 15 and the through holes 16 penetrating up and down of the circuit board 10 are formed, the air permeability is improved. Heat and gas generated by soldering when various electronic components such as the provided transformer 20 are attached to the circuit board 10 can be effectively radiated from the through holes 15 and 16.

さらに、回路基板10の上下方向および水平方向のどちらに対しても回路基板10の強度を確保できるため、肉厚の薄い回路基板10にトランス20などの大型電子部品を搭載しても、反りや回路パターン12の剥離に強いと共に破損し難い強度的に優れた回路基板10を提供することができる。従って、輸送、落下などの振動や衝撃に対して強く故障することが回避できる回路基板10を備えた電子機器1を提供することができる。   Furthermore, since the strength of the circuit board 10 can be secured in both the vertical direction and the horizontal direction of the circuit board 10, even if a large electronic component such as the transformer 20 is mounted on the thin circuit board 10, warping or It is possible to provide the circuit board 10 that is strong in peeling of the circuit pattern 12 and is not easily damaged and excellent in strength. Therefore, it is possible to provide the electronic apparatus 1 including the circuit board 10 that can avoid a strong failure against vibrations and shocks such as transportation and dropping.

なお、回路基板10に対して斜めに配置した斜貫通孔15間に回路基板10の短手方向に細長い貫通孔16を斜貫通孔15と交互に並列して設けているが、この貫通孔16も斜貫通孔15とほぼ同様の形状をなしており、図4に示すように、隣あう貫通孔16と斜貫通孔15の端部とは、回路基板10の長手方向に重複部aが1〜3mm程重なるように配置されており、この場合も上述した実施例と同様の効果を奏することができる。   Note that elongated through holes 16 are provided alternately in parallel with the oblique through holes 15 in the short direction of the circuit board 10 between the oblique through holes 15 arranged obliquely with respect to the circuit board 10. 4 has substantially the same shape as that of the oblique through hole 15, and as shown in FIG. 4, the adjacent through hole 16 and the end of the oblique through hole 15 have one overlapping portion a in the longitudinal direction of the circuit board 10. It arrange | positions so that it may overlap by about 3 mm, The effect similar to the Example mentioned above can be show | played also in this case.

以上、本発明の一実施例について詳述したが、本発明は、前記実施例に限定されるものではなく、本発明の要旨の範囲内で種々の変形実施が可能である。例えば、斜楕円孔15の形状を稲妻型としてもよい。また、回路基板10に対して斜めに傾斜して設けている斜貫通孔15の方向を全て同一方向に形成しなくてもよく、例えば、交互にその向きを変えるなど適宜変更が可能である。   As mentioned above, although one Example of this invention was explained in full detail, this invention is not limited to the said Example, A various deformation | transformation implementation is possible within the range of the summary of this invention. For example, the shape of the oblique elliptic hole 15 may be a lightning bolt. Further, it is not necessary to form all the directions of the oblique through-holes 15 provided obliquely with respect to the circuit board 10 in the same direction. For example, the direction can be appropriately changed such as changing the direction alternately.

本発明の電子機器内に備えられている回路基板を示す下面図である。It is a bottom view which shows the circuit board with which the electronic device of this invention is equipped. 同上、回路基板に形成されている斜貫通孔を示す要部拡大図である。It is a principal part enlarged view which shows the diagonal through-hole currently formed in the circuit board same as the above. 他の実施例の電子機器内に備えられている回路基板を示す下面図である。It is a bottom view which shows the circuit board provided in the electronic device of another Example. 同上、回路基板を示す要部拡大図である。It is a principal part enlarged view which shows a circuit board same as the above. 従来例を示す、回路基板の平面図である。It is a top view of a circuit board which shows a conventional example. 従来例を示す、回路基板の平面図である。It is a top view of a circuit board which shows a conventional example.

符号の説明Explanation of symbols

1 電子機器
10 回路基板
12 回路パターン
13 挿通孔
15 斜貫通孔
15a,16a 端部
20 トランス(電子部品)
21 接続端子
DESCRIPTION OF SYMBOLS 1 Electronic device 10 Circuit board 12 Circuit pattern 13 Insertion hole 15 Oblique through-hole 15a, 16a End part 20 Transformer (electronic component)
21 Connection terminal

Claims (5)

電子機器内に取り付けられているほぼ矩形の回路基板の表面に回路パターンを設け、この回路パターンに接続される各種電子部品を前記回路基板に実装し、この回路基板に斜めに配置したスリット状の複数の斜貫通孔を前記回路基板の短手方向に配列したことを特徴とする回路基板を備えた電子機器。   A circuit pattern is provided on the surface of a substantially rectangular circuit board mounted in an electronic device, and various electronic components connected to the circuit pattern are mounted on the circuit board, and slit-like shapes are arranged obliquely on the circuit board. An electronic apparatus comprising a circuit board, wherein a plurality of oblique through holes are arranged in a short direction of the circuit board. 前記斜貫通孔の隣接端部同士は、前記回路基板の長手方向に重なる位置に配置したことを特徴とする請求項1記載の回路基板を備えた電子機器。   2. The electronic apparatus having a circuit board according to claim 1, wherein adjacent end portions of the oblique through holes are arranged at positions overlapping in a longitudinal direction of the circuit board. 前記隣接端部の重なり幅を1〜3mm、好ましくは2mmに設定したことを特徴とする請求項2記載の回路基板を備えた電子機器。   3. The electronic apparatus having a circuit board according to claim 2, wherein an overlapping width of the adjacent end portions is set to 1 to 3 mm, preferably 2 mm. 前記各種電子部品の内の1つは、前記回路パターンに接続する複数の接続端子が間隔をおいて並設され、前記回路パターンに前記接続端子を挿通する挿通孔を形成するとともに、この挿通孔が前記回路基板の長手方向に間隔を空けて2列に並設され、この挿通孔に挿通した接続端子間に前記斜貫通孔を形成したことを特徴とする請求項1〜3の何れか1項に記載の回路基板を備えた電子機器。   In one of the various electronic components, a plurality of connection terminals connected to the circuit pattern are arranged in parallel with each other, forming an insertion hole for inserting the connection terminal in the circuit pattern, and the insertion hole 4. The diagonal through holes are formed between the connection terminals inserted through the insertion holes in parallel with each other in two rows at intervals in the longitudinal direction of the circuit board. An electronic device comprising the circuit board according to the item. 前記電子部品は、トランスであることを特徴とする請求項4記載の回路基板を備えた電子機器。   The electronic device having a circuit board according to claim 4, wherein the electronic component is a transformer.
JP2004041654A 2004-02-18 2004-02-18 Electronic device with circuit board Expired - Fee Related JP3872794B2 (en)

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