JP2005235760A - Photosensitive conductive composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive conductive composition for plasma display panels for forming a firm electrode. <P>SOLUTION: The photosensitive composition is allowed to contain a silane compound, a photosensitive organic vehicle, glass frit, and conductive powder. In a baking process for forming the electrode, the adhesion force between a conductive particle, or the like that is the component of the electrode and a glass substrate is improved by oxidizing the silane compound contained in the photosensitive conductive composition into an SiO<SB>2</SB>form. In a sandblasting process that is one of partition formation processes in processes for manufacturing a plasma display panel by reinforcing the bonding force between particles when the conductive particle is baked, the photosensitive conductive composition plays a role of preventing the conductive particle from falling from the substrate or deformation and preventing failure, such as the falling-off, and disconnection at the terminal section from occurring. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a photosensitive conductive composition, and particularly to a photosensitive conductive composition for a plasma display panel.

  In general, an address electrode which is a lower substrate electrode of a plasma display panel is a patterned conductive film. Conventionally, in order to form such a patterned conductive film, a screen printing method is generally used. With the enhancement of performance and miniaturization of products using patterned conductive films, miniaturization and thickening of conductive film patterns have been demanded, but there is a problem that the screen printing method cannot follow the resolution. Occurred. Therefore, recently, a fine conductive film having a large thickness is formed by photolithography using a photosensitive conductive paste.

  In this method, the photosensitive conductive paste is printed on the entire surface of a glass substrate such as a plasma display panel, and then exposed to light using an ultraviolet exposure apparatus equipped with a photomask after being subjected to a predetermined drying process, and is then shielded by the photomask. The uncured portion is developed and removed with a predetermined developer. Thereafter, the cured film remaining after being cured is baked at a predetermined temperature to form a patterned conductive film.

  After forming a patterned conductive film, a dielectric layer is formed on the conductive film by a predetermined process, and then a partition is formed on the dielectric layer. In the partition wall formation method, a partition wall paste is printed on a dielectric layer by a screen printing method, and after drying, a DFR (dry resist film) is overlaid on the dried partition wall paste. Then, by irradiating the DFR with ultraviolet rays using an exposure apparatus equipped with a photomask, a crosslinking reaction occurred at the irradiated DFR site, and in the next development process, the irradiated DFR site remained and was not irradiated. The DFR site is developed and removed to form a patterned DFR. After that, sandblasting is performed on the DFR surface that remains as a pattern using a sandblaster. At this time, the DFR remains on the surface while protecting the lower layer during sandblasting to prevent damage. The part which does not exist becomes a recessed part when the lower layer is scraped and lost during sandblasting, and the uncut part around the recessed part forms a partition.

  However, during the grinding operation as described above, the terminal portion of the address electrode that is covered with the dielectric layer and the barrier rib paste and formed of the conductive film may be damaged.

  In general, the address electrode terminal is rarely damaged by the first sandblasting process. However, if a defect in the partition is found in the inspection process after the partition is formed, the defective partition layer is removed and then again on the dielectric layer. However, there is a problem that the terminal portion of the address electrode is dropped or disconnected in the second sandblasting process.

  Therefore, the present invention has been made in view of such problems, and the object of the present invention is to form the address electrode firmly, and to prevent the electrode terminal portion from dropping or breaking even in the process of spraying sand twice or more. It is in providing the photosensitive electrically conductive composition which does not arise.

  In order to solve the above problems, according to an aspect of the present invention, there is provided a photosensitive conductive composition for a plasma display panel, which includes a silane compound, a photosensitive organic vehicle, a glass frit, and a conductive powder. The

  The content of the silane compound may be 0.1 to 10.0% by weight.

  The silane compound may be represented by the following chemical formula 1.

In the above chemical formula, R ₁ , R ₂ , R ₃ and R ₄ are hydrogen, alkyl group, vinyl group, silane group, halogenated alkyl group, halogenated group, aryl group, alkoxy group, ether group (alkoxyalkyl group). The same or different are selected from the group consisting of epoxide groups, alcohol groups, ester groups, amine groups and acid groups. That is, from those listed in the above group, R ₁ , R ₂ , R ₃ and R ₄ may all be selected the same, or partly selected to be the same, or all You may choose to be different. In other words, R ₁ , R ₂ , R ₃ and R ₄ are the same or selected from the above group independently of each other.

  The content of the photosensitive organic vehicle may be 15 to 60% by weight.

  The photosensitive organic vehicle may contain a binder, a crosslinking agent, a photopolymerization initiator, an additive, and a solvent.

  The glass frit content may be 0.5 to 5.0% by weight.

  The content of the conductive powder may be 40 to 80% by weight.

As described above, according to the present invention, the adhesion between the conductive particles and the like, which are constituent components of the electrode, and the glass substrate while the silane compound contained is oxidized to the SiO ₂ form in the firing step of electrode formation. In the sand spraying process which is one of the partition wall forming processes in the manufacturing process of the plasma display panel by improving the force and strengthening the bonding force between the particles when the conductive particles etc. are sintered, It plays a role of preventing the conductive particles and the like from falling off or being deformed from the substrate, and can prevent defects such as dropout and disconnection of the terminal portion.

  Exemplary embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In addition, in this specification and drawing, about the component which has the substantially same function structure, duplication description is abbreviate | omitted by attaching | subjecting the same code | symbol.

  The present embodiment relates to a photosensitive conductive composition used for forming an address electrode in the manufacture of a plasma display panel (Plasma Display Panel, hereinafter referred to as PDP), and further includes a silane compound as compared with a conventional composition. The present invention relates to a photosensitive conductive composition. This silane compound plays a role of improving the adhesive force between the address electrode and the glass substrate and the bonding force between the conductive particles forming the address electrode.

  In the photosensitive conductive composition of the present embodiment, the content of the silane compound is preferably 0.1 to 10.0% by weight and more preferably 0.3 to 3.0% by weight relative to the total weight of the composition. If the content of the silane compound is less than 0.1% by weight, it is insufficient to prevent the electrode film from dropping or cutting during the sand spraying process. If the content exceeds 10.0% by weight relative to the total weight of the composition, There arises a problem that the process characteristics are deteriorated and the resistance value of the electrode is increased.

  The silane compound improves the adhesive force between the glass substrate and the address electrode, and the bonding force between the conductive particles forming the address electrode, so that in the sand spraying process for manufacturing the partition wall, which is a subsequent process, It is possible to prevent damage such as dropping or cutting of the terminal portion.

Principle, conductive silane compounds present in the composition is a component of while being oxidized to SiO ₂ form electrode during firing step silane compound is prevented from falling off or disconnection of the address electrode terminals are added at the time of spraying sand When the particles are bonded to the glass substrate, and the conductive particles are sintered, the bonding force between the particles is strengthened, so that the conductive particles are dropped from the substrate or deformed when sandblasting. It is to prevent that.

  When such a silane compound is used in a photosensitive conductive composition, it should be used as it is contained in the binder by adding and polymerizing it as a monomer during the synthesis of the binder, which is one of the organic vehicle components. Can do. Alternatively, the silane compound can be used by coating the glass substrate in advance before printing the photosensitive conductive composition on the glass substrate. In consideration of workability and processability, it is preferable to add to the organic vehicle.

  As the silane compound, a compound having the structure of the following chemical formula 1 is used.

In the above chemical formula 1, R ₁ , R ₂ , R ₃ and R ₄ are hydrogen, alkyl group, vinyl group, silane group, halogenated alkyl compound group, halogenated group, aryl group, alkoxy group, ether group (alkoxyalkyl). Group), epoxide group, alcohol group, ester group, amine group and acid group, the same or different ones are selected.

  The silane compound of Chemical Formula 1 can be either aliphatic or aromatic, but preferably has a boiling point of 150 ° C. or higher so that it does not volatilize during the production of the composition. If the silane compound is a solid, it must be dissolved in the organic vehicle component. If the silane compound is a liquid, it must be well mixed in the organic vehicle so that phase separation does not occur, and the physical properties of the composition must be changed by altering the composition. Don't be.

Examples of preferred silane compounds are listed below. Among R _{1 to} R ₄ , at least one having —H or an alkyl group includes tripropylsilane, triisopropylsilane, tributylsilane, triisobutylsilane, trihexylsilane, dimethyloctadecylsilane, tetraethylsilane, Examples include diisopropyloctylsilane, trimethyl (3-methyl-2-butyl) -silane.

In the case where at least one of R _{1 to} R ₄ has a vinyl group, triethylvinylsilane, allyltrimethylsilane, allyltriisopropylsilane, diallyldimethylsilane, tetravinylsilane, tetraallylsilane, triphenylvinylsilane, allyltriphenylsilane, etc. There is.

Among R _{1 to} R ₄ , at least one having a silane group includes bis (trimethylsilyl) methane, tris (trimethylsilyl) methane, hexamethyldisilane, tetrakis (trimethylsilyl) silane, and the like.

Among R _{1 to} R ₄ , at least one having a halogenated alkyl group or a halogenated group is bis (chloromethyl) dimethylsilane, chlorodiisopropylsilane, 1,2-bis (chlorodimethylsilyl) ethane, chloro Examples include triethylsilane and chlorodimethyloctylsilane.

Among R _{1 to} R ₄ , at least one having an aryl group includes dimethylphenylsilane, 1,2-bis (dimethylsilyl) benzene, 1,4-bis (dimethylsilyl) benzene, phenyltrimethylsilane, diphenyl Examples include silane, diphenylmethylsilane, triphenylsilane, tribenzylsilane, benzyltrimethylsilane, and benzyloxytrimethylsilane.

Among R _{1 to} R ₄ , at least one having an alkoxy group (or ether group) is (methoxymethyl) trimethylsilane, ethoxytrimethylsilane, propoxytrimethylsilane, methoxydimethyloctylsilane, methoxydimethyloctadecylsilane, dimethoxy Methyloctylsilane, trimethoxypropylsilane, isobutyltrimethoxysilane, octyltrimethoxysilane, octadecyltrimethoxysilane, methyltrimethoxysilane, ethyltrimethoxysilane, isobutyltriethoxysilane, octyltriethoxysilane, diethoxyphenylsilane, phenyl Trimethoxysilane, phenyltriethoxysilane, vinyltrimethoxysilane, triethoxyvinylsilane, allyltriethoxysilane, And the like squirrels (2-methoxyethoxy) vinylsilane.

As those having an epoxide group in R _{1 to} R ₄ , 3-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, diethoxy (3-glycidyloxypropyl) methylsilane, trimethoxy [2- ( 7-oxabicyclo [4.1.0] heptan-3-yl) ethyl] silane.

Among R _{1 to} R ₄ , as at least one having an alcohol group, (trimethylsilyl) methanol, 1- (trimethylsilyl) ethanol, 2- (trimethylsilyl) ethanol, 3- (trimethylsilyl) -1-propanoltriethylsilanol, There are t-butyldimethylsilanol, 5- (t-butyldimethylsilyloxy) -1-pentanol, 2- (methyldiphenylsilyl) ethanol and the like.

At least one of R _{1 to} R ₄ has an ester group. Trimethylsilyl acetate, trimethylsilylmethyl acetate, methyl (trimethylsilyl) acetate, ethyl (trimethylsilyl) acetate, t-butyl (trimethylsilyl) acetate, ethyl 3- (trimethylsilyl) ) -Propionate, 2-[(trimethylsilyl) methyl] -2-propen-1-yl acetate, trimethylsilyl methacrylate, 2- (trimethylsilyloxy) ethyl methacrylate, 3- (trimethoxysilyl) propyl methacrylate, methyltrimethylsilyl malonate, ethyl Examples include trimethylsilyl malonate and bis (trimethylsilyl) malonate.

Among R _{1 to} R ₄ , N, N-diethyl (trimethylsilylmethyl) amine, Nt-butyltrimethylsilylamine, N, N-diethyltrimethylsilylamine, 1,1′-ethylenebis ( N, N, 1,1-tetramethyl) silaneamine, 1- (trimethylsilyl) pyrrolidine, 4- (trimethylsilyl) morpholine, and the like.

Among R _{1 to} R ₄ , those having at least one acid group include (trimethylsilyl) acetic acid and 3- (trimethylsilyl) propionic acid.

In addition, among R _{1 to} R ₄ , at least one of 3- (triethoxysilyl) propiononitrile, t-butyldiphenylsilylcyan having a nitrile group, and at least one of R _{1 to} R ₄ is an isocyanato group 3- (Triethoxysilyl) propylisocyanate having the formula can also be used. Moreover, these compounds can be used individually or in mixture of 2 or more types.

The conductive powder used in the photosensitive conductive composition of the present embodiment is for imparting conductivity to a fired film that has been heat-treated after being developed into a predetermined pattern. Preferred conductive powders include silver and gold. , Copper, aluminum or a mixture thereof, and alloys thereof. The outer shape of the conductive powder particles is not particularly limited, but considering the filling rate, ultraviolet light transmission, and the like, a spherical shape is preferable, and a preferable surface area is 0.3 to 2.0 m ² / g. Moreover, a preferable average particle diameter is 0.1-5.0 micrometers. When the surface area is less than 0.3 m ² / g or the average particle diameter exceeds 5.0 μm, there are disadvantages in that the straightness of the fired film pattern is poor and the fired film has high resistance. When the surface area exceeds 2.0 m ² / g or the average particle size is less than 0.1 μm, there arises a problem that the dispersibility of the paste or the exposure sensitivity becomes poor.

  In the photosensitive conductive composition of the present invention, the content of the conductive powder is preferably 40 to 80% by weight. When the content of the conductive powder is less than 40% by weight, the line width of the conductive film is severely contracted during firing, which may break the wire. When the content of the conductive powder exceeds 80% by weight, a desired pattern cannot be obtained due to insufficient crosslinking reaction due to poor printing and reduced light transmission.

The glass frit (adhesive glass powder) is an element that gives an adhesive force between the conductive powder and the glass substrate by being sintered in the firing step. Examples of the glass frit that can be used in this embodiment include PbO—SiO ₂ , PbO—B ₂ O ₃ —SiO ₂ , ZnO—SiO ₂ , ZnO—B ₂ O ₃ —SiO ₂ , and Bi ₂ O _3. -SiO ₂ system, and the like Bi2O ₃ -B ₂ O ₃ -SiO ₂ system.

  These glass frit components may be used alone or in combination of two or more. The particle shape of the glass frit is not particularly limited, but those having a maximum particle size of 5.0 μm or less are suitable. If the particle size is 5 μm or more, the fired film becomes non-uniform, causing deterioration in straightness.

The thermal expansion coefficient of the glass frit is preferably 50 × 10 ^{−7 to} 100 × 10 ⁻⁷ per degree Celsius. When the thermal expansion coefficient is less than 50 × 10 ⁻⁷ , the glass frit spreads to the periphery of the fired film in addition to the lower part of the fired film, which substantially causes a decrease in the adhesive force between the fired film and the glass substrate. Sometimes. When the thermal expansion coefficient of the glass substrate exceeds 100 × 10 ⁻⁷ , a phenomenon (so-called edge curl) in which both ends of the fired film are rolled up due to the glass frit concentrating on the center of the fired film occurs.

  In the photosensitive conductive composition according to this embodiment, the glass frit content is suitably 0.5 to 5.0% by weight. If the glass frit content is less than 0.5% by weight, the adhesive force between the conductive film and the glass substrate is lowered, causing a problem that the conductive film falls off in the process of the subsequent process. When exceeding, the problem which the resistance of an electrically conductive film increases will arise.

  The vehicle that is an organic component of the photosensitive conductive composition is composed of a binder, a crosslinking agent, a photopolymerization initiator, and a solvent. Additives may be included as necessary.

  For the binder, in order to remove and develop the photosensitive conductive composition with an aqueous alkaline solution, a copolymer having an acidic group, for example, a monomer having a carboxyl group and one or more other monomers is generally used. Used for.

  Monomers having a carboxyl group include acrylic acid, methacrylic acid, fumaric acid, maleic acid, vinyl acetic acid and anhydrides thereof, and other monomers copolymerized with these monomers include methyl acrylate, methyl methacrylate, Ethyl acrylate, ethyl methacrylate, n-butyl acrylate, n-butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, ethylene glycol monomethyl ether acrylate, methacrylic acid Examples include ethylene glycol monomethyl ether.

  The proper molecular weight of the copolymer used for the binder is 5,000 to 100,000 g / mol, and the proper acid value is 20 to 100 mgKOH / g.

  When the molecular weight of the copolymer is less than 5,000 g / mol, the printability of the composition decreases, and when the molecular weight exceeds 100,000 g / mol, developability deteriorates. Further, if the acid value of the copolymer is less than 20 mgKOH / g, the developability deteriorates, and if it exceeds 100 mgKOH / g, the exposed portion is removed and developed.

  In addition, a binder to which a carboxyl group of the polymer and an ethylenically unsaturated compound are reacted and a component causing a crosslinking reaction in the binder as a result can be used.

  Examples of such ethylenically unsaturated compounds include chrycidyl methacrylate, 3,4-epoxycyclohexylmethyl methacrylate, and 3,4-epoxycyclohexylmethyl acrylate.

  Cellulose derivatives such as cellulose, hydroxymethyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, carboxyethyl cellulose, and carboxyethyl methyl cellulose are mixed with the binder to adjust the viscosity for the purpose of flattening the film and preventing abnormal deformation. May be used. In that case, while improving the flatness, it is possible to reduce the abnormal flow accompanying the decrease in viscosity at high temperature and to prevent abnormal deformation.

  The content of the binder in the photosensitive conductive composition is appropriately 5 to 15% by weight. When the binder content is less than 5% by weight, the printability is deteriorated, and when it exceeds 15% by weight, developability is poor and a residue is generated around the fired film.

  As the crosslinking agent, a polyfunctional monomer is used. For example, ethylene glycol diacrylate, ethylene glycol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, penta Examples include erythritol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, and pentaerythritol tetramethacrylate.

  These crosslinking agent components can be used alone or in combination of two or more. An appropriate amount of the crosslinking agent is 20 to 100 parts by weight with respect to 100 parts by weight of the binder.

  When the content of the crosslinking agent is less than 20 parts by weight relative to the binder, the exposure sensitivity tends to decrease, or the pattern tends to be damaged during the development process. When the cross-linking agent content exceeds 100 parts by weight relative to the binder content, the line width after development widens and the pattern around the pattern becomes unclear, thereby generating a residue after firing.

  Specific examples of the photopolymerization initiator include benzophenone, methyl o-benzoylbenzate, 4,4-bis (dimethylamine) benzophenone, 4,4-bis (diethylamino) benzophenone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, 2-methyl- [4- (methylthio) phenyl] -2-morpholinoprop-1-one, 2-benzyl-2-dimethylamino-1- (4 -Morpholinophenyl) -1-butanone, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, and the like.

  In this invention, these photoinitiators can be used 1 type or in mixture of 2 or more types. 1-50 weight part of a photoinitiator is preferable with respect to 100 weight part of crosslinking agents. When the component of the photopolymerization initiator is less than 1.0 part by weight with respect to 100 parts by weight of the crosslinking agent, the exposure sensitivity of the paste decreases, and when it exceeds 50 parts by weight with respect to 100 parts by weight of the crosslinking agent, There arises a problem that the line width becomes narrow.

  Additives used in the photosensitive conductive composition are a sensitizer that improves sensitivity, a polymerization inhibitor and an antioxidant that improve the storage stability of the paste, an ultraviolet light absorber that improves the resolution, and an eraser that reduces bubbles in the paste. There are a foaming agent, a dispersing agent for improving dispersibility, a planarizing agent for improving flatness of a film at the time of printing, a plasticizer for adjusting thixotropic properties, and the like. These additives are not necessarily used, but are added as necessary. At the time of addition, a generally known amount is appropriately adjusted and used.

  There is no special restriction | limiting in the solvent used for a photosensitive electrically conductive composition. However, the binder and the initiator can be dissolved and mixed well with the crosslinking agent and other additives so long as the boiling point is 150 ° C. or higher. If the boiling point is less than 150 ° C., the problem is that there is a large tendency to not volatilize in the paste manufacturing process, particularly in the process using a three-roll mill, and the solvent is volatilized too quickly during printing. Results in worse. Preferred solvents satisfying the above conditions include ethyl carbitol, butyl carbitol, ethyl carbitol acetate, butyl carbitol acetate, texanol, turpentine oil, dipropylene glycol methyl ether, dipropylene glycol ethyl ether, dipropylene glycol monomethyl ether acetate, Examples include γ-butyrolactone, cellosolve acetate, butyl cellosolve acetate, and tripropylene glycol. These solvents can be used alone or in combination of two or more.

  The photosensitive electrically conductive composition concerning this embodiment uses an electrode pattern of a plasma display for formation. Hereinafter, although the example which implements pattern processing using the photosensitive electrically conductive composition concerning this embodiment is demonstrated, the method of implementing pattern processing is not limited to these.

  In order to form the address electrode on the glass substrate, a plurality of grooves are formed at the same interval, and the photosensitive conductive composition according to the present embodiment is applied to the entire surface of the glass substrate including the grooves. As a coating method, any known method such as screen printing, bar coater, or roll coater may be used. The coated material is subjected to an exposure process using a photomask, and then a development process is performed. Thereafter, a firing step is performed in a firing furnace. The firing temperature can be adjusted according to the substrate used. For example, when using a glass substrate, 400-600 degreeC is preferable, and when using a ceramic substrate, 400-1000 degreeC is preferable. When the firing temperature is less than 400 ° C., organic matter decomposition during firing is incomplete, and thus there is a problem that organic matter remains. Further, since the glass frit is not softened, there is a problem that the conductive particles are not completely fused.

When the firing temperature exceeds 600 ° C. or 1000 ° C., when a glass substrate or a ceramic substrate is used, there is a problem that the glass substrate or the ceramic substrate is bent. Through such a baking process, the silane compound contained in the photosensitive conductive composition according to the present embodiment is oxidized to become SiO ₂ , and the conductive particles that are constituent elements of the electrode are bonded to the glass substrate. Try to.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. However, the present invention is not limited to this.

(Examples 1-7 and Comparative Example 1)
The composition ratio shown in Table 1 was mixed, and after stirring with a stirrer, the mixture was kneaded with a three-roll mill to produce a photosensitive conductive paste. At the time of blending, the vehicle (binder, crosslinking agent A, crosslinking agent B, initiator A, B, plasticizer, solvent, storage stabilizer, silane compounds 1 to 4) was first combined, and then glass frit and a conductive material were added. . The numbers listed in Table 1 indicate weight percent with respect to the total weight. The binder weight in Table 1 includes the solvent (ethyl carbitol acetate) used to form the copolymer used as the binder, and the actual binder weight is 8% by weight. The detailed composition of the binder used is shown in Table 2.

  In the case of Example 1, as the silane compound 1, a compound containing an alkyl group and an alkoxy group was added at 1.0% by weight relative to the paste. In Example 2, as the silane compound 2, a compound containing an alkoxy group and a vinyl group was added at 1.0% by weight relative to the paste. In the case of Example 3, the silane compound 3 contains a crosslinkable methacrylate group, and instead of adding 3.0% by weight relative to the paste, the content of the crosslinking agent was reduced by 2.0% by weight. In the case of Example 4, the silane compound 4 contains a storage-stable tertiary amine group, and 3.0% by weight relative to the paste was added, and no storage stabilizer (2.0% by weight) was added. In Example 5, instead of adding 3.0% by weight of each of silane compounds 3 and 4 relative to the paste, the crosslinking agent was reduced and no storage stabilizer was added. Since Examples 6 and 7 were used for studying limit values, Table 1 shows them as Reference Examples 1 and 2. In Reference Example 1, a small amount of silane compound 1 was added to evaluate the minimum content. On the other hand, Reference Example 2 was carried out in order to evaluate the maximum content by excessively adding a silane compound. Comparative Example 1 was an example in which no silane compound was added, and was carried out based on the degree of damage to the address electrode when sand was sprayed.

  Details of each component substance in Table 1 are described in Table 2.

After producing pastes using the components shown in Table 2 only in the contents shown in Table 1, the degree of damage such as address electrode dropout was evaluated during sandblasting using each paste by the following method.
(1) Printing: Printing is performed on a 20 cm × 20 cm glass substrate by a screen printing method.
(2) Drying: Dry at 100 ° C. for 15 minutes using a dry oven.
(3) Exposure: Irradiation is performed at 300 mJ / cm ² using an ultraviolet exposure apparatus equipped with a high-pressure mercury lamp.
(4) Development: A 0.4% sodium carbonate aqueous solution is jetted at a nozzle pressure of 150 kPa (1.5 kgf / cm ² ) to develop.
(5) Firing: The electric firing furnace is baked at 580 ° C. for 12 minutes to form an address electrode.
(6) Sand spraying: Using a sand sprayer manufactured by the applicant, sand powder is sprayed at a pressure of 120.
kPa (1.2 kgf / cm ² ) Spray sand on the address terminal for 1 minute.
(7) Evaluation: The sand sprayed part is observed using an optical microscope.

  The above processes (1) to (7) were carried out using the pastes prepared in Examples 1 to 5, Reference Example 1 and Comparative Example 1, and optical microscope photographs of the manufactured address electrodes are shown in FIGS. Each shown. However, for Reference Example 2, the experiment was stopped because a phenomenological defect occurred.

  As shown in FIGS. 1 to 7, it can be seen that in the comparative example 1 in which no silane compound is added to the paste and the reference example 1 in which the silane compound content is extremely small, the degree of damage to the terminal electrode is severe. In Example 5 in which the most silane compound was added, it was shown that there was almost no damage to the electrode terminal portion. Other examples show similar results to each other.

As described above, the photosensitive conductive composition for plasma display according to the present embodiment contains a silane compound, and is a constituent component of the electrode while the silane compound is oxidized to the SiO ₂ form in the firing step of electrode formation. In the manufacturing process of the plasma display panel, by improving the adhesion between certain conductive particles and the glass substrate, and strengthening the bonding force between the particles when the conductive particles are sintered, It plays a role of preventing the conductive particles from falling or deforming from the substrate in the sand spraying process, which is one of the partition wall forming processes, and can prevent defects such as dropouts and disconnections of the terminal portions.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  The present invention can be applied to a photosensitive conductive composition, and in particular, can be applied to a photosensitive conductive composition for a plasma display panel.

It is the optical microscope photograph which showed the mode of the electrode, after implementing a sand spraying process to the address electrode formed using the electrically conductive composition of Example 1 of this invention. It is the optical microscope photograph which showed the mode of the electrode, after implementing a sand spraying process to the address electrode formed using the electrically conductive composition of Example 2 of this invention. It is the optical microscope photograph which showed the mode of the electrode, after implementing a sand spraying process to the address electrode formed using the electrically conductive composition of Example 3 of this invention. It is the optical microscope photograph which showed the mode of the electrode, after implementing a sand spraying process to the address electrode formed using the electrically conductive composition of Example 4 of this invention. It is the optical microscope photograph which showed the mode of the electrode, after implementing a sand spraying process to the address electrode formed using the electrically conductive composition of Example 5 of this invention. It is the optical microscope photograph which showed the mode of the electrode, after implementing a sand spraying process to the address electrode formed using the electrically conductive composition of the reference example 1 of this invention. It is the optical microscope photograph which showed the mode of the electrode, after implementing a sand spraying process to the address electrode formed using the electrically conductive composition of the comparative example 1. FIG.

Claims (7)

A photosensitive conductive composition for a plasma display panel comprising:
A silane compound;
With a photosensitive organic vehicle;
With glass frit;
Conductive powder;
The photosensitive electrically conductive composition characterized by including.   The photosensitive conductive composition according to claim 1, wherein a content of the silane compound is 0.1 to 10.0% by weight. The photosensitive conductive composition according to claim 1, wherein the silane compound is represented by the following chemical formula 1.
In the above chemical formula, R ₁ , R ₂ , R ₃ and R ₄ are hydrogen, alkyl group, vinyl group, silane group, halogenated alkyl group, halogenated group, aryl group, alkoxy group, ether group (alkoxyalkyl group). The same or different are selected from the group consisting of epoxide groups, alcohol groups, ester groups, amine groups and acid groups.   The photosensitive conductive composition according to claim 1, wherein a content of the photosensitive organic vehicle is 15 to 60% by weight.   The photosensitive conductive composition according to claim 1, wherein the photosensitive organic vehicle includes a binder, a crosslinking agent, a photopolymerization initiator, an additive, and a solvent.   The photosensitive conductive composition according to claim 1, wherein a content of the glass frit is 0.5 to 5.0% by weight. The photosensitive conductive composition according to claim 1, wherein a content of the conductive powder is 40 to 80% by weight.