JP2005235507A - Light source device and manufacturing method therefor, and flat-shaped illuminating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source device in which its mechanical strength can be satisfied while trying to make it increasingly thinner, and a leaking light and a transmitting light from the light source device can be blocked if it is formed integrally with a light guide plate. <P>SOLUTION: In a light source device 2 for launching a light on the incident end surface 11 of a light guide plate 10, one side of a lead frame is made as a top surface 5 in an upward side of an outcoming surface 3 of semiconductor light-emitting devices, and power supply terminals 7, 7b for supplying electric power to semiconductor light-emitting device chips are provided to be exposed at opposite positions to the upward side that becomes top surface 5 or at opposite positions to the outcoming surface portion 3. The lead frame is used for the top surface of the light source device 2 as it is to block a leaking light and a transmitting light. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a light source device used in a liquid crystal display device and the like, a method for manufacturing the light source device, and a flat illumination device, and in the light source device manufacturing method, a part of a lead frame is used as an upper portion of the light source device. The effect of shielding light leakage from the light source device when used, and the release of heat from the semiconductor light emitting element built in the light source device can be released, and the strength is maintained by the lead frame even if the light source device is processed to be thin. The present invention relates to a light source device, a method for manufacturing the light source device, and a flat illumination device.

  Conventionally, a light source device using a plurality of semiconductor light emitting elements in a straight line (array shape) has a thickness having an opening of a certain size.

Further, the conventional flat light emitting device has a light shielding tape for shielding the upper surface portion of the light source device and the vicinity of the incident end surface portion of the light guide plate against leakage light or transmitted light from the light source device near the incident end surface portion of the light guide plate. Or a light-shielding film.
Japanese Patent Laid-Open No. 2001-117097

  A conventional light source device uses a plurality of semiconductor light emitting elements in a straight line (array form) and has a thickness with a certain size of opening, but the opening and the entire size are reduced or made thinner. Therefore, in the case of a light source device having a long length, mechanical strength is insufficient and bending or the like occurs. For this reason, in optical system products and devices, there are problems that light leaks due to bending or the like, or cannot be within the design dimensions when assembled with various parts.

  Further, the conventional flat light emitting device has a light shielding tape for shielding the upper surface portion of the light source device and the vicinity of the incident end surface portion of the light guide plate against leakage light or transmitted light from the light source device near the incident end surface portion of the light guide plate. And a light-shielding film, there is a problem with the recent thinning in particular, and there are also problems with productivity and economy.

  The present invention has been made to solve the above-described problems. By using the lead frame as it is in the upper part of the light source device, the present invention is thinner and can satisfy the mechanical strength. Provided is a light source device and a manufacturing method that can be used, and further provides a light source device that can block leakage light and transmitted light from the light source device when integrated with a light guide plate and a flat illumination device that can always be configured to be flat and thin. There is.

  In order to achieve the above object, a light source device according to claim 1 of the present invention is provided with one side surface portion of a lead frame on an upper side surface of an emission surface portion of a semiconductor light emitting element, and a power supply terminal for supplying power to the semiconductor light emitting element. It is characterized by being exposed at a position opposite to the side surface in the upper direction or a position opposite to the exit surface portion.

  In the light source device according to claim 1, one side surface portion of the lead frame is provided on the side surface in the upper direction of the emission surface portion of the semiconductor light emitting element, and a power supply terminal for supplying power to the semiconductor light emitting element is positioned opposite to the side surface in the upper direction or on the emission surface portion. Since it is exposed at the opposite position, it can satisfy mechanical strength even if it is processed into a light source device with a thin shape, and can block light leaked and transmitted light from above the light source device. Can be directly connected to a substrate or the like.

  The light source device according to claim 2 is characterized in that the upper side surface is a common electrode of the semiconductor light emitting element and / or a light shielding body in the upper direction of the emission surface portion.

  In the light source device according to the second aspect, the upper side surface is used as the common electrode of the semiconductor light emitting element or / and the light shielding body in the upper direction of the emission surface portion. Thus, the light source device itself can shield light without using a light shield in the upper direction of the exit surface portion.

  Furthermore, in the light source device according to the third aspect, the semiconductor light emitting element is mounted on the lead frame between the electrode terminal frame portion that forms the electrode terminal and the upper side surface frame portion that forms the upper side surface. A mounting frame portion is provided.

  The light source device according to claim 3 is a mounting frame in which the semiconductor light emitting element is mounted on the lead frame between the electrode terminal frame portion forming the electrode terminal and the upper side surface frame portion forming the upper side surface. Since the portion is provided, it is possible to mold one side as the upper side frame portion and the other as the electrode terminal frame with the mounting frame portion as the center.

  The light source device according to a fourth aspect is characterized in that the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.

  In the light source device according to the fourth aspect, the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion. Therefore, the upper side frame portion is formed above the opening from which the light emitted from the semiconductor light emitting element chip is emitted. Is expanded.

  Furthermore, the light source device according to claim 5 is characterized in that the power supply terminal is exposed as it is using a part of the lead frame.

  In the light source device according to the fifth aspect, since the power supply terminal is exposed as it is by using a part of the lead frame, it does not require post-processing, soldering, and the like, and is excellent in strength and electricity.

  The light source device according to claim 6 is characterized in that a noble metal such as gold plating is plated on the power supply terminal or / and the mounting frame portion.

  In the light source device according to the sixth aspect, the noble metal such as gold plating is plated on the power supply terminal or / and the mounting frame portion, so that it is excellent in oxidation resistance and can be used for a long period of time, and also has an excellent electrical conductivity.

Further, the flat illumination device according to claim 7 is provided on the side surface in the upper direction of the electrode terminal frame part for forming the electrode terminal, the mounting frame part for mounting the chip-like semiconductor light emitting element, and the emission surface part of the semiconductor light emitting element. The upper-side side frame portion is positioned on the lead frame, and the upper-side side frame portion is bent at a substantially right angle with respect to the mounting frame portion. A light source device configured to
A light guide plate provided on a front surface portion and a back surface portion with a side surface portion provided to contact the light source device and a light deflection element for emitting light from the light source device;
A light source device and a light guide plate are placed, and a reflective case is provided on the opposite side of the emission surface portion.

According to a seventh aspect of the present invention, there is provided a planar illumination device positioned on an upper side surface of an electrode terminal frame portion for forming electrode terminals, a mounting frame portion for mounting a chip-like semiconductor light emitting element, and an emission surface portion of the semiconductor light emitting element. An upper side frame is provided on the lead frame, and the upper side frame is bent at a substantially right angle with respect to the mounting frame, thereby forming a common electrode of the semiconductor light emitting element and / or a light shielding body in the upper direction of the emission surface. A light source device,
A light guide plate provided on a front surface portion and a back surface portion with a side surface portion provided to contact the light source device and a light deflection element for emitting light from the light source device;
Since the light source device and the light guide plate are placed and a reflective case is provided on the opposite side of the emission surface portion, leakage light from the emission surface of the flat illumination device or light source device without requiring shielding resistance The transmitted light is shielded, and the mechanical strength can be maintained even if the light source device portion is long.

In the manufacture of the light source device according to the eighth aspect, step 1: pattern pressing is performed on the thin lead frame.
Step 2: Insert molding the thin plate subjected to the pattern press with resin.
Step 3: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: A plurality of the light source devices formed on the lead frame are cut and separated into individual light source devices, and the manufacturing is performed according to the above steps.

The light source device according to the eighth aspect is manufactured by step 1: pattern pressing is performed on the thin lead frame.
Step 2: Insert molding the thin plate subjected to the pattern press with resin.
Step 3: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: A plurality of the light source devices formed on the lead frame are cut and separated into the individual light source devices, so that the mechanical strength can be continuously satisfied. It is possible to manufacture a light source device having a thin shape capable of shielding leakage light and transmitted light from above.

Furthermore, in the manufacture of the light source device according to claim 9, step 1: pattern pressing is performed on the thin lead frame.
Step 2: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 3: Insert molding is performed with a resin on a necessary portion of the thin plate subjected to the pattern press.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: A plurality of the light source devices formed on the lead frame are cut and separated into individual light source devices, and the manufacturing is performed according to the above steps.

The light source device according to the ninth aspect is manufactured by step 1: pattern pressing is performed on the thin lead frame.
Step 2: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 3: Insert molding is performed with a resin on a necessary portion of the thin plate subjected to the pattern press.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: A plurality of the light source devices formed on the lead frame are cut and separated into the individual light source devices, so that the mechanical strength can be continuously satisfied. It is possible to manufacture a light source device having a thin shape capable of shielding leakage light and transmitted light from above.

  Furthermore, the light source device according to claim 10 includes a step of performing pattern press on the thin plate lead frame, a step of performing insert molding with a resin on a necessary portion of the thin plate subjected to pattern press, and an upper side frame portion. A step of bending at a substantially right angle with respect to the mounting frame, a step of placing the semiconductor light emitting element on the position where the semiconductor light emitting element is mounted (die bonder), and a transparent adhesive carried into the thermostat Semiconductor light-emitting element and gold wire with transparent resin mixed and defoamed in sub-process Formed in the lead frame, the step of filling the entire recess formed by insert molding, the step of carrying into the thermostat and curing the filled transparent resin, and the like. By cutting the number of the light source device, characterized in that it is manufactured by a step of separating into individual light source device.

  The light source device according to claim 10 includes a step of performing pattern press on the thin plate lead frame, a step of performing insert molding with a resin on a necessary portion of the thin plate subjected to pattern press, and an upper side frame portion as a mounting frame portion. Bending the semiconductor light-emitting element at a position where the semiconductor light-emitting element is placed, placing the semiconductor light-emitting element on a position where the semiconductor light-emitting element is placed (die bonder), and carrying it into a thermostat to cure the transparent adhesive Inserting semiconductor light-emitting elements and gold wires with transparent resin mixed and defoamed in the sub-process, and wire bonding with gold wires that electrically connect the electrodes and thin plates of the semiconductor light-emitting elements A step of filling the entire recess formed by molding, a step of carrying into a thermostat and curing the filled transparent resin, and a plurality of light source devices formed on the lead frame. Is manufactured by a process of cutting and separating into individual light source devices, so that a thin-shaped light source device that can satisfy mechanical strength and can block light leaked and transmitted light from above is manufactured. It can be manufactured continuously.

  In the light source device according to claim 1, one side surface portion of the lead frame is provided on the side surface in the upper direction of the emission surface portion of the semiconductor light emitting element, and a power supply terminal for supplying power to the semiconductor light emitting element is positioned opposite to the side surface in the upper direction or on the emission surface portion. Since it is exposed at the opposite position, it can satisfy mechanical strength even if it is processed into a light source device with a thin shape, and can block light leaked and transmitted light from above the light source device. Can be directly connected to a substrate or the like. For this reason, a thin flat illumination device as a whole can be realized together with a thin light source device.

  In the light source device according to the second aspect, the upper side surface is used as the common electrode of the semiconductor light emitting element or / and the light shielding body in the upper direction of the emission surface portion. Thus, the light source device itself can shield light without using a light shield in the upper direction of the exit surface portion. For this reason, it is suitable for size reduction and thickness reduction.

  The light source device according to claim 3 is a mounting frame in which the semiconductor light emitting element is mounted on the lead frame between the electrode terminal frame portion forming the electrode terminal and the upper side surface frame portion forming the upper side surface. Since the portion is provided, it is possible to mold one side as the upper side frame portion and the other as the electrode terminal frame with the mounting frame portion as the center. For this reason, it is excellent in productivity and economy.

  In the light source device according to the fourth aspect, the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion. Therefore, the upper side frame portion is formed above the opening from which the light emitted from the semiconductor light emitting element chip is emitted. Is expanded. For this reason, it is possible to increase the mechanical strength of the light source device itself in the upper part of the light source device, and to shield the leakage light and transmitted light from the semiconductor light emitting element.

  In the light source device according to the fifth aspect, since the power supply terminal is exposed as it is by using a part of the lead frame, it does not require post-processing, soldering, and the like, and is excellent in strength and electricity. For this reason, it is excellent in workability and productivity.

  In the light source device according to the sixth aspect, the noble metal such as gold plating is plated on the power supply terminal or / and the mounting frame portion, so that it is excellent in oxidation resistance and can be used for a long period of time, and also has an excellent electrical conductivity. For this reason, generation | occurrence | production of a defect etc. is suppressed and it is excellent in reliability and economical efficiency.

According to a seventh aspect of the present invention, there is provided a planar illumination device positioned on an upper side surface of an electrode terminal frame portion for forming electrode terminals, a mounting frame portion for mounting a chip-like semiconductor light emitting element, and an emission surface portion of the semiconductor light emitting element. An upper side frame is provided on the lead frame, and the upper side frame is bent at a substantially right angle with respect to the mounting frame, thereby forming a common electrode of the semiconductor light emitting element and / or a light shielding body in the upper direction of the emission surface. A light source device,
A light guide plate provided on a front surface portion and a back surface portion with a side surface portion provided to contact the light source device and a light deflection element for emitting light from the light source device;
Since the light source device and the light guide plate are placed and a reflective case is provided on the opposite side of the emission surface portion, leakage light from the emission surface of the flat illumination device or light source device without requiring shielding resistance The transmitted light is shielded, and the mechanical strength can be maintained even if the light source device portion is long. For this reason, it is possible to obtain high-intensity outgoing light that is thin and free from outgoing spots.

The light source device according to the eighth aspect is manufactured by step 1: pattern pressing is performed on the thin lead frame.
Step 2: Insert molding the thin plate subjected to the pattern press with resin.
Step 3: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: A plurality of the light source devices formed on the lead frame are cut and separated into the individual light source devices, so that the mechanical strength can be continuously satisfied. It is possible to manufacture a light source device having a thin shape capable of shielding leakage light and transmitted light from above. For this reason, the light source device excellent in productivity and economy can be obtained.

The light source device according to the ninth aspect is manufactured by step 1: pattern pressing is performed on the thin lead frame.
Step 2: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 3: Insert molding is performed with a resin on a necessary portion of the thin plate subjected to the pattern press.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: A plurality of the light source devices formed on the lead frame are cut and separated into the individual light source devices, so that the mechanical strength can be continuously satisfied. It is possible to manufacture a light source device having a thin shape capable of shielding leakage light and transmitted light from above. For this reason, the light source device excellent in productivity and economy can be obtained.

  The light source device according to claim 10 includes a step of performing pattern press on the thin plate lead frame, a step of performing insert molding with a resin on a necessary portion of the thin plate subjected to pattern press, and an upper side frame portion as a mounting frame portion. Bending the semiconductor light-emitting element at a position where the semiconductor light-emitting element is placed, placing the semiconductor light-emitting element on a position where the semiconductor light-emitting element is placed (die bonder), and carrying it into a thermostat to cure the transparent adhesive Inserting semiconductor light-emitting elements and gold wires with transparent resin mixed and defoamed in the sub-process, and wire bonding with gold wires that electrically connect the electrodes and thin plates of the semiconductor light-emitting elements A step of filling the entire recess formed by molding, a step of carrying into a thermostat and curing the filled transparent resin, and a plurality of light source devices formed on the lead frame. Is manufactured by a process of cutting and separating into individual light source devices, so that a thin-shaped light source device that can satisfy mechanical strength and can block light leaked and transmitted light from above is manufactured. It can be manufactured continuously. For this reason, the light source device excellent in productivity and economy can be obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the present invention, a part of a lead frame can be used to sufficiently withstand an elongated light source device, and heat of a semiconductor light emitting element used in the light source device can be obtained by exposing a part of the lead frame to the outside. The light source device can serve as a heat sink that can radiate the light to the outside, can provide a downsized light source device and a downsized flat illumination device that matches the light source device, and can effectively use the lead frame And a method of manufacturing a light source device and a flat illumination device.

  1 is a schematic perspective view of a flat illumination device including a light source device according to the present invention, FIG. 2 is a schematic perspective view of the light source device according to the present invention, FIG. 3 is a schematic side view and a front view of the light source device, and FIG. FIG. 5 is a schematic diagram of a lead frame of the light source device according to FIG. 5, illustrating a usage example of terminals when semiconductor light emitting elements are connected in parallel; FIG. 5 is a diagram illustrating an example of using terminals when semiconductor light emitting elements are connected in series; FIG. 6 is a view showing an example of use of terminals when semiconductor light emitting elements connected in parallel are connected in series, and FIGS. 7 and 8 are views showing a process flow of a method of manufacturing a light source device according to the present invention.

  As shown in FIG. 1, the flat light emitting device 1 includes a light source device 2 and a light guide plate 10. The light source device 2 and the light guide plate 10 are mounted or integrated so as to be in contact with each other by a case 17 or the like. I'm allowed.

  The light source device 2 is of an injection or transfer mold type. The light source device 2 is formed on the lead frame 8 by inserting a lead frame 8 made of a phosphor bronze material or the like in which a pattern as shown in FIGS.

  However, as shown in FIG. 2, the region where the semiconductor light emitting element 9 is placed and the opening 3 a that emits light from the semiconductor light emitting element 9 are empty spaces.

  In addition, the resin to be formed is made of an insulating material such as modified polyamide, polybutylene terephthalate, nylon 46 or aromatic polyester, etc., in order to improve light reflectivity and to obtain light shielding properties. A mixture in which white powder such as barium acid is mixed is heated and injection molded.

  In addition, an opening 3a is provided on the emission surface 3 side of the semiconductor light emitting element 9 placed on the lead frame 8, and the semiconductor light emitting element 9 is powered on the side surface 6 that intersects the opposite side surface 4 facing the opening 3a at a right angle. The power supply terminal 7 and the like for supplying are exposed.

  Although not shown here, the power supply terminal 7 or the like may be provided by bending a part of the lead frame 8 to the side surface 4 in the opposite direction of the opening 3a.

  Further, the light source device 2 is provided so as to directly expose the upper surface portion 5 in which a part of the lead frame 8 is bent in a direction opposite to the side surface 6 side (a direction perpendicular to the emission surface portion 3 side). An upper surface portion 5 formed by a part of the lead frame 8 is exposed on a longitudinal side surface (an opposite side surface facing the side surface 6 in FIG. 2) that intersects the emission surface portion 3 at a substantially right angle.

  Further, although not shown, the light source device 2 projects the lead frame 8 of the upper surface portion 5 slightly from the emission surface portion 3 side (opening portion 3a), and the incident end surface portion 11 of the light guide plate 10 corresponding to the emission surface portion 3 side. And can be fitted.

  Further, in the light source device 2, the opening 3a after the semiconductor light emitting element 9 is placed and wired is filled with a transparent resin or the like that is colorless and transparent or the same color as the emitted light. Thereby, the semiconductor light emitting element 9 and the wiring are fixed.

  In FIG. 2, the space filled with the transparent resin or the like is inclined in a fan shape, but the light emitted from the semiconductor light emitting element 9 may be efficiently reflected by the space wall, and the shape is not particularly limited. .

  As shown in FIG. 4, the lead frame 8 is made of a thin plate of a conductive alloy material such as phosphor bronze having electrical conductivity and elasticity. The lead frame 8 is formed by forming a circuit pattern such as a semiconductor light emitting element (not shown) or a wire electrically connected to the semiconductor light emitting element 9 and punching it with a punch press or the like.

  As shown in FIG. 4, the lead frame 8 includes an upper side frame 8A in which an upper surface (upper side) 5 is formed, an electrode terminal frame 8B in which power terminals and electrode terminals are formed, and a chip-like semiconductor. It has a mounting frame portion 8C on which the light emitting element 9 is mounted.

  The lead frame 8 that has been punched into a predetermined pattern shape is sandwiched in a plane-symmetric manner from the front and back surfaces by a mold, and is formed into a shape as shown in FIG. 2 by insert molding in which a molten resin is injected into the mold.

  Furthermore, as a feature of the present invention, a part of the lead frame 8 (upper side frame portion) 8A is in a state of being exposed to the outside, and is sandwiched and formed symmetrically by a mold, and then the lead frame 8 is formed. 8A is bent at a substantially right angle to form the upper surface portion 5.

  As another method, the upper surface portion 5 may be formed by bending a portion (upper side surface frame portion) 8A of the lead frame 8 substantially at right angles and sandwiching the lead frame 8 symmetrically with a mold. Therefore, when the semiconductor light emitting element 9 is very small, the mounting portion is also small, and the light source device with a small overall width and a long length (the length of the emission surface 3 side or the opening 3a) has a low mechanical strength. Deflection occurs in the length direction. In the lead frame 8 of this example, the longitudinal side surface of a part (upper side frame portion) 8A of the lead frame 8 is provided as the upper surface portion 5 so as to be in the upper direction on the emission surface portion 3 side (or the opening 3a). Obtains mechanical strength.

  Furthermore, heat from the semiconductor light emitting element 9 can be dissipated by the upper surface portion 5 (upper side surface frame portion 8A which is a part of the lead frame 8) exposed through the lead frame 8.

  At this time, a part of the lead frame 8 is formed by taking it out directly from the vicinity of the molded rectangular part, and is left in a state where it is taken out directly in order to make it directly the power supply terminal 7. Finally, only the power supply terminal 7 becomes a exposed metal part, and the other part is cut and removed.

  Further, a circuit pattern (not shown), the power terminal 7 and the like are subjected to Cu plating, gold plating or gold plating. This treatment is performed for the purpose of improving electrical properties such as contact resistance and conductivity, and chemical properties such as anti-oxidation.

  An anode electrode and a cathode electrode on one surface of the semiconductor light emitting device 9 mounted and fixed (die-bonded) on a transparent resin are bonded to a pattern on the lead frame with a bonding wire made of a gold wire (not shown). Bonded and electrically connected.

  Further, when the opening 3a is filled with a colorless and transparent epoxy resin, silicone resin, or the like, or a transparent epoxy resin or silicone resin adjusted to the same color as the emitted light, it is possible to obtain emitted light of monochromatic light. In addition, a wavelength conversion material made of an inorganic fluorescent pigment, an organic fluorescent dye, or the like is mixed (for example, when a fluorescent material (YAG) is mixed in an epoxy resin, the weight ratio of the epoxy resin to the fluorescent material is If the opening 3a is filled with a transparent epoxy resin, silicone resin, or the like (about 1: 3 to 1: 4), it becomes possible to obtain the emitted light of white light.

  In addition, the blue light emission from these semiconductor light emitting elements 9 is a wavelength conversion material of an orange fluorescent pigment or an orange fluorescent dye made of a YAG (yttrium, aluminum, garnet) system such as (Y, Gd) 3 (Al, Ga) 5 O 12. When projected onto the mixed resin, yellow light is obtained. Then, the color-converted yellow light and the blue light emitted by the semiconductor light emitting element 9 itself are mixed, so that the light emitted from above the semiconductor light emitting element 9 becomes white light.

  Although not shown, a protection diode for protecting the semiconductor light emitting element 9 may be provided in the pattern of the lead frame 8.

  The power terminal 7 is subjected to Cu plating, gold plating or gold plating after the semiconductor light emitting element 9 is mounted, after bonding, or after filling with a transparent and colorless epoxy resin for protection. When projecting at a substantially vertical angle rearward with respect to the emitting surface portion 3 (mounting surface of the semiconductor light emitting element 9) without projecting in parallel with the (mounting surface of the semiconductor light emitting element 9), the emitting surface portion A rectangular power terminal 7 projecting on the side of the third side or the opposite side to the opening 3 a is bent backward in the same direction as the bottom surface 6.

  When the power supply terminal 7 is projected in parallel with the emission surface 3 (the surface on which the semiconductor light emitting element 9 is placed), the power terminal 7 is electrically connected by a plug connection provided on a flat illumination device (not shown) or a substrate of a liquid crystal display device. Connect and fix mechanically.

  Further, when the power supply terminal power supply terminal 7 is provided to project rearward at a substantially right angle with respect to the emission surface portion 3 (mounting surface of the semiconductor light emitting element 9), it is provided on a flat illumination device (not shown) or a substrate of a liquid crystal display device. The circuit pattern on the surface is electrically connected and mechanically fixed in parallel with the substrate by solder or the like.

  The power supply terminal 7 formed by the lead frame 8 is used or disconnected according to the connection state of the semiconductor light emitting element 9. As shown in FIG. 4, when four semiconductor light emitting elements 9 are connected in parallel, for example, the cathode side power supply terminals are 7 (1), 7 (2) and 7 (3), and the anode side power supply terminals are 7 As (4) and 7 (5), 7 (6) and 7 (7) are cut. Then, only the tie bar 8c (h) is left, the other tie bars 8c are cut, and the semiconductor light emitting elements 9 are electrically disconnected.

  The tarbar 8c (h) is mechanically connected to the ground side of 7 (1) and the upper surface portion 5, and can serve as a heat sink for mechanical strength and heat of the entire light source device. At this time, 8c (h2) may be left and 7 (7) may be a common ground with 7 (1).

  As another use example of the power supply terminal 7, for example, when four semiconductor light emitting elements 9 are connected in series, 7 (1) and 7 (7) are used as shown in FIG. (2), 7 (3), 7 (4), 7 (5), 7 (6) are cut, and only the tie bar 8c (h) is left, the other tie bars 8c are cut, and a plurality of semiconductor light emitting devices 9 And electrically disconnect.

  The taber 8c (h) is mechanically connected to the ground side of the light source device 2 connected in series and the upper surface portion 5, and can serve as a heat sink for mechanical strength and heat of the entire light source device. .

  Furthermore, as another example of use of the power supply terminal 7, when a plurality of semiconductor light emitting elements 9 are connected in parallel and connected in series, the semiconductor light emitting elements 9 connected in parallel are shown in FIG. Thus, for example, two series-connected ground sides (cathode sides) are 7 (1) and 7 (3) as electrodes, and these two series-connected same poles are connected in parallel (anode side) ) Can be used as 7 (2). At this time, 7 (4), 7 (5), 7 (6), and 7 (7) are cut. Also at this time, only the tie bar 8c (h) is left, the other tie bars 8c are cut, and the semiconductor light emitting elements 9 are electrically disconnected.

  The tie bar 8c (h) is mechanically connected to the ground side of 7 (1) and the upper surface portion 5, and can serve as a heat sink for mechanical strength and heat of the entire light source device. At this time, the tie bar 8c (h2) may be left, and 7 (7) may be used as a common ground with 7 (1).

  Further, by connecting these lead frames with wire leads, various connections and power terminals can be used.

  The light guide plate 10 is formed of a transparent acrylic resin (PMMA) or polycarbonate (PC) having a refractive index of about 1.4 to 1.7. The light guide plate 10 has a gradation according to the purpose, such as a light deflection element that refracts or totally reflects light from the incident end surface portion 11 connected to the output surface portion 3 from the light source device 2 on the front surface portion 12 and the back surface portion 13. Finally, uniform bright light is emitted from the surface portion 12 and emitted to a liquid crystal display device provided in an upper portion (not shown).

  The light guide plate 10 is fitted to the incident end surface portion 11 below the lead frame 8 (upper side frame portion 8A) of the upper surface portion 5 slightly protruded from the emission surface portion 3 side (opening portion 3a) of the light source device 2. As a result, light from the light source device 2 does not leak and is efficiently guided into the light guide plate 10.

  The light deflection element only needs to have an inclined surface in the direction of incidence of light from the light source device 2. For example, in addition to the arc shape, the kamaboko shape, the triangular prism shape, the cross-sectional shape is an inverted triangle, a rectangle, an arc, or the like. The shape and size of continuous grooves, dots and the like can be freely selected, and other shapes may be used as long as they have an inclined surface with respect to the light from the plurality of light source devices 2.

  Although not shown here, a reflective film is provided on the surface on which the light guide plate 10 is placed (the surface facing the back surface portion 13 of the light guide plate 10), and the light source device 2 is placed and fixed. A reflective film may be affixed to the substrate, a reflective film may be affixed to the bottom 17b of the case 17 to be stored, or a reflective material may be applied. Further, the case 17 in which a white powder such as barium titanate is mixed can be heat-injected to improve reflectivity and light shielding.

  Case 17 is a material in which a white material such as titanium oxide is mixed in a thermoplastic resin, metal deposition such as aluminum is performed on the thermoplastic resin at a position where light guide plate 10 is placed, or metal foil is laminated. And made of metal.

  Further, a reflective film may be attached to the bottom portion 17b of the case 17 or a reflective substance may be applied. Further, the case 17 is provided with a through hole 17c through which the power supply terminal 7 passes at a position where the power supply terminal 7 of the light source device 2 comes.

Next, the manufacturing method of the light source device of this invention is demonstrated.
FIG. 7 is a flowchart showing the process of the method of manufacturing the light source device according to the first embodiment of the present invention.
In step 1, pattern pressing such as an electrical pattern, a lead terminal pattern, a support pattern, and a heat radiation side surface pattern is performed on an unprocessed thin plate lead frame.
Step 2 insert-molds the thin lead frame subjected to the pattern press as a unit with each lead frame made of resin and resin formed by insert formation.
In step 3, the side surface lead frame is bent by a vendor at a substantially right angle with respect to the lead frame on which the semiconductor light emitting element is placed.
In step 4, the semiconductor light emitting element is linearly arranged on the position where the semiconductor light emitting element is placed by adding a transparent adhesive by transfer by a stamper, dropping by a dispenser, printing, coating, or the like. Placed as a unit.
Step 5 carries in a thermostat and hardens a transparent resin adhesive.
In step 6, wire bonding is performed using a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the pattern provided on the thin plate lead frame.
Step 7 is a transparent resin mixed and defoamed in sub-step 1 and is filled with a dispenser or the like into the entire recess formed by insert molding after mounting the semiconductor light-emitting element or bonding with a gold wire or the like.
In step 8, the transparent resin, which is filled in the entire concave portion, is carried into a thermostatic bath and the transparent resin is cured.
In step 9, a plurality of light source devices formed on the plurality of lead frames are cut with a tie bar cutter or the like to separate the light source devices into unit units.
In sub-step 1, in order to cure the transparent resin, the main component of the transparent resin and the curing agent are mixed with a mixer, an attritor or the like, and defoamed with a vacuum device or the like.

FIG. 8 is a flowchart showing the process of the manufacturing method of the second embodiment of the light source device of the present invention.
In step 1, pattern pressing such as an electrical pattern, a lead terminal pattern, a support pattern, and a heat radiation side surface pattern is performed on an unprocessed thin plate lead frame.
In step 2, the side surface lead frame is bent by a vendor at a substantially right angle to the lead frame on which the semiconductor light emitting element is placed.
In step 3, insert molding is performed by using a thin plate lead frame subjected to pattern pressing as a unit with each lead frame made of resin and resin formed by insert formation.
In step 4, the semiconductor light emitting element is linearly arranged on the position where the semiconductor light emitting element is placed by adding a transparent adhesive by transfer by a stamper, dropping by a dispenser, printing, coating, or the like. Placed as a unit.
Step 5 carries in a thermostat and hardens a transparent resin adhesive.
In step 6, wire bonding is performed using a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the pattern provided on the thin plate lead frame.
Step 7 is a transparent resin mixed and defoamed in sub-step 1 and is filled with a dispenser or the like into the entire recess formed by insert molding after mounting the semiconductor light-emitting element or bonding with a gold wire or the like.
In step 8, the transparent resin, which is filled in the entire concave portion, is carried into a thermostatic bath and the transparent resin is cured.
In step 9, a plurality of light source devices formed on the plurality of lead frames are cut with a tie bar cutter or the like to separate the light source devices into unit units.
In sub-step 1, in order to cure the transparent resin, the main component of the transparent resin and the curing agent are mixed with a mixer, an attritor or the like, and defoamed with a vacuum device or the like.

  In the method for manufacturing a light source device of the present invention, as described in paragraph [0056], the step of plating a circuit pattern, a power supply terminal, etc. is omitted. This is performed after the pattern pressing step of step 1 of the apparatus manufacturing method. Further, in the case of the small light source device 2, these plating steps may be performed before the pattern pressing step of Step 1 of the method of manufacturing the light source device of the present invention.

  As described above, one side surface portion of the lead frame is provided on the side surface in the upper direction of the emission surface portion of the semiconductor light emitting element, and the power supply terminal supplied to the semiconductor light emitting element chip is exposed at the lower surface of the emission surface portion or opposite to the emission surface portion. Therefore, the mechanical strength can be satisfied even if the light source device is processed into a thin shape. In addition, it is possible to block light leaked or transmitted light from above the light source device without requiring a shield. In addition, since the power supply terminal can be directly connected to a substrate or the like, a flat illumination device that can emit high-luminance outgoing light that is thin as a whole and has no emission spots can be obtained together with a thin light source device. Then, these light source devices having a thin shape can be manufactured continuously, and a light source device and a flat illumination device excellent in productivity and economy can be obtained.

1 is a schematic perspective view of a flat illumination device including a light source device according to the present invention. 1 is a schematic perspective view of a light source device according to the present invention. It is a schematic side view and a front view of the light source device according to the present invention. It is a schematic diagram of a lead frame of a light source device according to the present invention, and is a diagram illustrating an example of use of terminals when semiconductor light emitting elements are connected in parallel. It is the schematic of the lead frame of the light source device which concerns on this invention, Comprising: It is a figure which shows the usage example of a terminal when connecting a semiconductor light emitting element in series. It is the schematic of the lead frame of the light source device which concerns on this invention, Comprising: It is a figure which shows the usage example of a terminal when connecting the semiconductor light emitting element connected in parallel in series. It is a process flow figure of the manufacturing method of the 1st form of the light source device concerning the present invention. It is a process flow figure of the manufacturing method of the 2nd form of the light source device concerning the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Planar light-emitting device 2 Light source device 3 Output surface part 3a Opening part 4 Opposite side surface 5 Upper surface part 6 Side surface 7 (7 (1) -7 (7)) Power supply terminal or electrode terminal 8 Lead frame 8A Upper direction side surface frame part 8B Electrode Terminal frame portion 8C Mounting frame portion 8c, 8c (h), 8c (h2) Tie bar 9 Semiconductor light emitting element 10 Light guide plate 11 Incident end surface portion 12 Surface portion 13 Back surface portion 14 Light guide plate anti-incident end surface portion 15 Light guide plate side surface portion 17 Case 17b Case bottom 17c Through hole

Claims (10)

In a light source device in which a lead frame is linearly insert-molded with a reflective resin and a plurality of chip-shaped semiconductor light emitting elements are arranged,
One side surface portion of the lead frame is provided on an upper side surface of the emission surface portion of the semiconductor light emitting element, and a power supply terminal for supplying power to the semiconductor light emitting element is exposed at a position opposite to the upper direction side surface or a position opposite to the emission surface portion. A light source device characterized by being provided. The light source device according to claim 1, wherein the upper side surface is a common electrode of the semiconductor light emitting element and / or a light shielding body in an upper direction of the emission surface portion. The lead frame is characterized in that a mounting frame portion for mounting the semiconductor light emitting element is provided between an electrode terminal frame portion forming an electrode terminal and an upper side surface frame portion forming the upper side surface. The light source device according to claim 1. The light source device according to claim 1, wherein the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion. The light source device according to claim 1, wherein the power supply terminal is exposed as it is using a part of the lead frame. The light source device according to claim 1, wherein the power supply terminal or / and the mounting frame portion is plated with a noble metal such as gold plating. An electrode terminal frame part for forming electrode terminals, a mounting frame part for mounting a chip-like semiconductor light emitting element, and an upper side frame part positioned on the upper side surface of the emitting surface part of the semiconductor light emitting element The light source device is provided so that the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion, and serves as a common electrode of the semiconductor light emitting element and / or a light shielding body in the upper direction of the emission surface portion. When,
A light guide plate provided with a side surface provided to contact the light source device and a light deflection element for emitting light from the light source device on a front surface portion or a back surface portion;
A flat illuminating device, comprising: the light source device and the light guide plate; and a reflective case on a side opposite to the emission surface portion. An electrode terminal frame part for forming electrode terminals, a mounting frame part for mounting a chip-like semiconductor light emitting element, and an upper side frame part positioned on the upper side surface of the emitting surface part of the semiconductor light emitting element The light source device is provided so that the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion, and serves as a common electrode of the semiconductor light emitting element and / or a light shielding body in the upper direction of the emission surface portion. In the method of manufacturing
A manufacturing method of a light source device, which is manufactured by the following steps.
Step 1: Pattern press is performed on the thin lead frame.
Step 2: Insert molding the thin plate subjected to the pattern press with resin.
Step 3: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: Cutting the plurality of light source devices formed on the lead frame to separate the light source devices into individual light source devices. An electrode terminal frame part for forming electrode terminals, a mounting frame part for mounting a chip-like semiconductor light emitting element, and an upper side frame part positioned on the upper side surface of the emitting surface part of the semiconductor light emitting element The light source device is provided so that the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion, and serves as a common electrode of the semiconductor light emitting element and / or a light shielding body in the upper direction of the emission surface portion. In the method of manufacturing
A manufacturing method of a light source device, which is manufactured by the following steps.
Step 1: Pattern press is performed on the thin lead frame.
Step 2: The upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion.
Step 3: Insert molding is performed with a resin on a necessary portion of the thin plate subjected to the pattern press.
Step 4: A transparent adhesive is added to a position where the semiconductor light emitting element is placed, and then the semiconductor light emitting element is placed. (Die Bonder)
Step 5: Bring into a thermostat and cure the transparent adhesive.
Step 6: Wire bonding is performed with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting element and the thin plate.
Step 7: Fill the entire recess formed by the insert molding with the transparent resin mixed and defoamed in sub-step 1 with the semiconductor light emitting element and the gold wire.
Step 8: Bring into a thermostat and cure the filled transparent resin.
Step 9: Cutting the plurality of light source devices formed on the lead frame to separate the light source devices into individual light source devices. An electrode terminal frame part for forming electrode terminals, a mounting frame part for mounting a chip-like semiconductor light emitting element, and an upper side frame part positioned on the upper side surface of the emitting surface part of the semiconductor light emitting element The light source device is provided so that the upper side frame portion is bent at a substantially right angle with respect to the mounting frame portion, and serves as a common electrode of the semiconductor light emitting element and / or a light shielding body in the upper direction of the emission surface portion. Because
A step of performing pattern press on the thin plate lead frame, a step of performing insert molding with a resin on a necessary portion of the thin plate subjected to the pattern press, and the upper side frame portion substantially perpendicular to the mounting frame portion. A step of bending, a step of placing the semiconductor light-emitting element on a position where the semiconductor light-emitting element is placed, and then placing the semiconductor light-emitting element (die bonder); a step of bringing the semiconductor light-emitting element into a thermostat and curing the transparent adhesive; , Wire bonding with a gold wire or the like that electrically connects the electrode of the semiconductor light emitting device and the thin plate, and the semiconductor light emitting device or the gold wire with a transparent resin mixed and defoamed in a sub-process Filling the entire recess formed by the insert molding, carrying the resin into a thermostat and curing the filled transparent resin, and the lead frame And cutting the plurality of the light source device formed beam, the light source device characterized in that it is manufactured by a step of separating into individual light source device.

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