JP2005230404A - Signal cable connection structure of electronic endoscope - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a signal cable connection structure of an electronic endoscope in which a signal line and a soldered part have excellent durability by preventing strong tension from acting on individual thin signal lines. <P>SOLUTION: In the signal cable connection structure of the electronic endoscope in which the tip parts of a plurality of shielded lines 11, 12, 13 and 14 inside a signal cable 7 inserted and arranged inside an insertion part 1 are connected to a circuit board 6 arranged adjacently on the rear side of a solid-state image pickup element 5 arranged inside the tip of the insertion part 1, two sets of shield twisted parts 1112 and 1314 for which the shields 11c and 12c/13c and 14c of at least two shielded lines 11 and 12/13 and 14 of the plurality of shielded lines 11, 12, 13 and 14 are twisted at the tip are formed, and the two sets of the shield twisted parts 1112 and 1314 formed in such a manner are distributed to both sides across the center line X in a width direction of the circuit board 6 and fixed to the circuit board 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a signal cable connection structure for an electronic endoscope.

In an electronic endoscope, the tips of a plurality of shield wires in a signal cable inserted into the insertion portion on a circuit board arranged adjacent to the rear side of the solid-state imaging device arranged in the tip of the insertion portion The parts are connected by soldering or the like (for example, Patent Document 1).
JP-A-1-161602

The insertion portion of the endoscope needs to be formed as thin as possible due to the particularity of being inserted into the human body. Therefore, a very thin signal line inserted and disposed therein is used.
Therefore, in the signal cable connection structure of the conventional electronic endoscope in which the tip portions of the plurality of shield wires are simply soldered to the circuit board, the insertion portion of the endoscope is repeatedly bent in an irregular direction. When a large tension is applied to the signal line, the signal line or the soldered part may be damaged.

  Accordingly, an object of the present invention is to provide a signal cable connection structure for an electronic endoscope in which a signal line and a soldered portion have excellent durability so that a strong tension does not act on each thin signal line. .

  In order to achieve the above object, a signal cable connection structure for an electronic endoscope according to the present invention includes a circuit board disposed adjacent to the rear side of a solid-state imaging device disposed in the distal end of the insertion portion, In the signal cable connection structure of an electronic endoscope in which the tip portions of a plurality of shielded wires in a signal cable inserted through are connected, the shields of at least two shielded wires among the plurality of shielded wires Two sets of twisted shield twisted portions are formed, and the two sets of shield twisted portions thus formed are distributed to both sides of the center line in the width direction of the circuit board and fixed to the circuit board. It is.

  In addition, when the two sets of shield twisted portions are fixed to the circuit board at substantially symmetrical positions across the center line in the width direction of the circuit board, the action of the tension on the circuit board becomes uniform left and right.

  According to the present invention, the two sets of shield twisted portions are distributed on both sides of the center line in the width direction of the circuit board and fixed to the circuit board, so that no strong tension acts on each thin signal line. Therefore, the signal line and the soldered portion can obtain excellent durability.

  An electronic interior in which the tip portions of a plurality of shield wires in a signal cable inserted in the insertion portion are connected to a circuit board arranged adjacent to the rear side of the solid-state imaging device arranged in the tip of the insertion portion. In the signal cable connection structure of the endoscope, two sets of shield twisted portions in which the shields of at least two of the plurality of shield wires are twisted at the tip are formed, and the two sets of the two formed as described above The shield twisted portion is fixed to the circuit board at a substantially symmetrical position across the center line in the width direction of the circuit board.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 2 shows a portion near the distal end of the insertion portion 1 of the electronic endoscope, and an observation window 3 and the like are arranged on the distal end surface of the distal end portion main body 2 connected to the most distal position of the insertion portion 1. .

  At the projection position of the subject by the objective optical system 4 built in the back of the observation window 3, the imaging surface of the solid-state imaging device 5 is arranged in a direction orthogonal to the axial direction of the distal end body 2. Is connected to the rear end portion of the circuit board 6 disposed adjacent to the rear side of the solid-state imaging device 5 so as to hold the signal cable 7.

FIG. 1 is a plan view of a circuit board 6 portion, and FIGS. 3 and 4 are a right side view and a left side view thereof.
A transparent cover glass 8 is fixed to the light receiving surface of the solid-state imaging device 5, and a lead 51 extending backward from the side surface portion of the solid-state imaging device 5 is connected and fixed to the circuit board 6 side.

  The circuit board 6 of this embodiment has a rigid rigid board 6A and a flexible flexible board 6B, each of which has a tip disposed at the upper and lower side surfaces (or the left and right side surfaces) of the solid-state imaging device 5. The rigid substrate 6A is arranged in a direction perpendicular to the solid-state imaging device 5, the flexible substrate 6B is arranged so as to be inclined toward the rigid substrate 6A as going backward, and both the substrates 6A and 6B are arranged in the width direction. Are aligned.

  Between the rigid substrate 6A and the flexible substrate 6B, for example, electronic components 60 such as capacitors and IC chips are arranged, and these electronic components 60 are fixed to the rigid substrate 6A side by soldering or the like. .

  The flexible substrate 6B arranged obliquely has a rear side shorter than the rigid substrate 6A, and the inner surface of the rigid substrate 6A located behind the rear end of the flexible substrate 6B (the side to which the electronic component 60 is fixed). ) For connecting the signal lines extending from the signal cable 7 to the outer surface of the flexible substrate 6B (the surface not facing the electronic component 60). Is arranged.

  A large number of shield lines extend from the tip of the signal cable 7 and are connected to the circuit board 6. The first shield is arranged in the right half of the center line X in the width direction of the circuit board 6. The core wires 11a and 12a of the wire 11 and the second shield wire 12 are connected and fixed to the lands 21 and 22 provided on the right half of the rigid substrate 6A by soldering or the like. Reference numerals 11b and 12b denote coatings for the respective core wires.

  The third shield line 13 and the fourth shield line 14 are arranged on the left half of the center line X in the width direction of the circuit board 6, and the core wire 13a of the third shield line 13 is the flexible board 6B. The land 23 provided on the left half is connected and fixed by soldering or the like, and the core wire 14a of the fourth shield wire 14 is connected and fixed to the land 24 provided on the left half of the rigid board 6A by soldering or the like. Has been. Reference numerals 13b and 14b denote coatings for the respective core wires.

  The shield 11c of the first shield wire 11 and the shield 12c of the second shield wire 12 are twisted together as shown in FIG. As shown, the shield twisted portion 1112 is hardened with solder or the like, and connected and fixed by soldering or the like to the land 30 provided at the inner surface side rear end of the right half of the rigid substrate 6A.

  Similarly, the shield 13c of the third shield wire 13 and the shield 14c of the fourth shield wire 14 are twisted together to form the shield twisted portion as shown in FIG. 1 and FIG. 1314 is solidified with solder, and is soldered to the land 40 provided at the rear end on the inner surface side of the left half portion symmetrical to the land 30 of the right half portion across the center line X of the rigid board 6A. Connection is fixed.

  With such a configuration, when the insertion portion 1 is repeatedly bent in an irregular direction and the signal cable 7 is pulled, the fixing portion between the two strong pairs of shield twisted portions 1112 and 1314 and the rigid substrate 6A is supported. Thus, strong tension does not act on the individual core wires 11a, 12a, 13a, 14a... And the soldered portions between the lands 21, 22, 23, 24.

  Then, the two sets of shield twisted portions 1112 and 1314 are distributed to both sides of the rigid substrate 6A across the center line X in the width direction and fixed to the rigid substrate 6A. Acts separately on the left and right sides of the rigid substrate 6A, and no force that destroys each part including the fixing part between the circuit board 6 and the solid-state imaging device 5 acts.

  Further, when the two sets of shield twisted portions 1112 and 1314 are fixed to the rigid board 6A at substantially symmetrical positions across the center line X in the width direction of the rigid board 6A, the tension acting on the rigid board 6A from the signal cable 7 is increased. Since the left and right are even, the most excellent durability is obtained.

  In addition, this invention is not limited to the said Example, For example, the number of the shields twisted together may be 3 or more.

It is a top view of the signal cable connection structure of the electronic endoscope of the Example of this invention. It is a top view of the part near the front-end | tip of the insertion part of the electronic endoscope of the Example of this invention. It is a right view of the signal cable connection structure of the electronic endoscope of the Example of this invention. It is a left view of the signal cable connection structure of the electronic endoscope of the Example of this invention. It is a perspective view of the shield twisting part of the Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insertion part 5 Solid-state image sensor 6 Circuit board 6A Rigid board 6B Flexible board 7 Signal cable 11, 12 13, 14 Shield wire 11a, 12a, 13a, 14a Core wire 11c, 12c, 13c, 14c Shield 21, 22, 23, 24 Land 30, 40 Land 60 Electronic parts 1112, 1314 Shield twisted portion X Center line of circuit board in width direction

Claims (2)

An electron in which the tip portions of a plurality of shield wires in a signal cable inserted in the insertion portion are connected to a circuit board arranged adjacent to the rear side of the solid-state imaging device arranged in the tip of the insertion portion. In the signal cable connection structure of the endoscope,
Two sets of shield twisted portions formed by twisting shields of at least two shield wires of the plurality of shield wires at the tip are formed, and the two sets of shield twisted portions thus formed are connected to the circuit. A signal cable connection structure for an electronic endoscope, wherein the signal line is distributed to both sides of a center line in the width direction of the board and fixed to the circuit board. 2. The signal cable connection structure for an electronic endoscope according to claim 1, wherein the two sets of shield twisted portions are fixed to the circuit board at substantially symmetrical positions across a center line in the width direction of the circuit board.

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