JP2005228871A - Packaging structure, electro-optical device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packaging structure capable of preventing a short-circuit between terminals using a simple structure, an electro-optical device which uses the packaging structure, and an electronic apparatus which uses the electro-optical device. <P>SOLUTION: A space between adjacent bumps for output is filled up with an insulation material 26. Due to this structure, for example, when the bumps 25a for output are electrically connected to a terminal for electrode by an ACF, conductive particles contained in the ACF will not enter the space between the adjacent bumps for output, resulting in preventing the space between the adjacent bumps for output from getting blocked by the conductive particles and short-circuited. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a mounting structure used for a personal computer or a mobile phone, an electro-optical device using the mounting structure, and an electronic apparatus using the electro-optical device.

  2. Description of the Related Art Conventionally, electro-optical devices such as liquid crystal devices have been widely used as display devices for electronic devices such as personal computers and mobile phones, and electronic components such as liquid crystal driving ICs have been used on glass substrates and the like due to the refinement of wiring and the like. Flip chip mounting is used in which mounting is performed and electrical connection is made with a wiring pattern on the substrate.

However, flip chip mounting also has a problem that its manufacturing process is complicated. To solve this problem, a method of forming bumps of electronic parts by electroless plating has been proposed (for example, Patent Document 1). See.)
JP 2003-203940 (paragraphs [0008] to [0045], FIG. 1).

  However, the problem with the mounting process of electronic components mounted on, for example, a liquid crystal panel or a circuit board connected to the liquid crystal panel has been improved by the above-described method. When, for example, an ACF (Anisotropic Conductive Film) is used for electrical connection with a liquid crystal panel or a terminal on the circuit board side, conductive particles in the ACF are clogged between narrow bumps and the like, causing a short circuit.

  The present invention has been made in view of the above-described problems, and a mounting structure capable of preventing a short circuit between terminals with a simple structure, an electro-optical device using the mounting structure, and an electronic apparatus using the electro-optical device The purpose is to provide.

  In order to achieve the above object, a mounting structure according to a main aspect of the present invention includes an electronic component having a first terminal group on a mounting surface and an insulating material that fills between adjacent terminals of the first terminal group. And a mounting base material having a second terminal group electrically connected to the first terminal group on the surface and on which the electronic component is mounted.

  Here, the “mounting structure” refers to a liquid crystal device in which electronic components are mounted on a substrate or the like, and the “electronic component” refers to a liquid crystal driving IC or the like, for example. The term “terminal group” means, for example, bumps that are terminals electrically connected to the liquid crystal driving IC.

  In the present invention, since the adjacent terminals of the first terminal group are filled with the insulating material, for example, when the first terminal group and the second terminal group are electrically connected by the ACF, The conductive particles do not enter between adjacent terminals of the first terminal group, and the conductive particles can be reliably prevented from clogging and short-circuiting between the terminals.

  Further, for example, when the first terminal group and the second terminal group are electrically connected using ACF, by increasing the distance between the terminals of the first terminal group, the conductivity between the terminals is increased. Although clogging of particles can be prevented, recently, the distance between the terminals has been designed to be smaller. Even when such a distance between terminals is small, short-circuiting between terminals can be reliably prevented by filling an insulating material between the terminals.

  A mounting structure according to another aspect of the present invention is provided between an electronic component having a first terminal group on a mounting surface and adjacent terminals of the first terminal group, and a gap is provided between the terminals. And a mounting substrate having a second terminal group electrically connected to the first terminal group on the surface on which the electronic component is mounted.

  In the present invention, since the insulating material is provided between the adjacent terminals of the first terminal group, and there is a gap between the terminals, the conductive particles in the ACF are placed between the terminals by the insulating material between the terminals. It is possible to prevent the short circuit between the terminals. In addition, the gap allows the resin in the ACF to flow between the terminals, thereby reducing the uneven distribution of the resin, reducing internal stress and preventing a decrease in adhesive strength.

  According to an aspect of the present invention, the first terminal group and the second terminal group are electrically connected by an adhesive having conductive particles. Thereby, while being able to give electroconductivity of a single direction between the 1st terminal group and the 2nd terminal group, both terminals can be connected and fixed.

  According to one aspect of the present invention, the first terminal group has a third terminal group in which the pitch between the terminals has the first pitch, and a second pitch that is larger than the first pitch. A fourth terminal group, wherein the insulating material is provided between adjacent terminals of the third terminal group among the third and fourth terminal groups. As a result, when the first terminal group and the second terminal group are electrically connected by, for example, ACF, the resin that is also an adhesive is a fourth terminal in which no insulating material is provided between adjacent terminals. Since it flows between the terminals of the group, the uneven distribution of the resin can be reduced, the internal stress can be reduced, and the decrease in the adhesive strength can be prevented.

  According to an aspect of the present invention, the first terminal group includes a plurality of input terminals and a plurality of output terminals, and the insulating material is between adjacent terminals of the plurality of output terminals. It is provided. Thereby, when the first terminal group and the second terminal group are electrically connected by, for example, ACF, the resin that is also an adhesive is a terminal of an input terminal in which an insulating material is not provided between adjacent terminals. Since it distributes between them, the uneven distribution of the resin can be reduced, the internal stress can be reduced, and the decrease in the adhesive strength can be prevented.

  According to an aspect of the present invention, the insulating material is softer than the hardness of the adjacent terminals. Thereby, when the first terminal group is electrically connected to the second terminal group via the ACF, for example, by thermocompression bonding, it is possible to prevent the adjacent insulating materials from interfering with the crimping.

  According to an aspect of the present invention, the insulating material has a height from the mounting surface that is substantially the same as a height from the mounting surface of the first terminal group, or is higher than the first terminal group. The conductive particles are characterized by being high in length within the range of the particle size length. Thus, when the first terminal group is electrically connected to the second terminal group via the conductive particles by thermocompression bonding, it is possible to prevent the adjacent insulating material from hindering the electrical connection by the conductive particles. .

  According to an embodiment of the present invention, the adjacent terminals are connected to one terminal having first and second ends facing the axis in the arrangement direction of the adjacent terminals and the axis. A third end portion on the same side as the first end portion, and another terminal having a fourth end portion on the same side as the second end portion, and the insulating material includes: Over at least the entire width between the first line connecting the first end and the third end and the second line connecting the second end and the fourth end. It is provided. Thereby, for example, conductive particles of ACF do not collect between adjacent terminals, and a short circuit between terminals due to clogging of conductive particles can be prevented.

  According to an aspect of the present invention, the first terminal group and the second terminal group are electrically connected by an adhesive having conductive particles, and the length of the gap is the conductive layer. It is characterized by being shorter than the length of the particle diameter. As a result, the resin flow of the adhesive also occurs in the gap, reducing the resin bias and reducing the internal stress at the time of curing, and the fluidity of the resin due to the conductive particles entering the gap and collecting the conductive particles between the terminals. Since the deterioration of the resin can be prevented, the unevenness of the resin can be prevented.

  A mounting structure according to another aspect of the present invention has an electronic component having a first terminal group on a mounting surface and a second terminal group electrically connected to the first terminal group on the surface. A mounting base material on which the electronic component is mounted and an insulating material that fills between adjacent terminals of the second terminal group are provided.

  In the present invention, since the adjacent terminals of the second terminal group on the mounting base material side having the second terminal group on the surface are filled with an insulating material, the conductive particles are interposed between the terminals on the mounting base material side. Can be prevented, and a short circuit between the terminals can be surely prevented.

  An electro-optical device according to another aspect of the present invention includes the above-described mounting structure.

  Since the present invention has a mounting structure that can easily and surely prevent a short circuit due to clogging of conductive particles between terminals, a manufacturing cost can be reduced and a high-quality electro-optical device can be provided.

  An electro-optical device according to another aspect of the present invention has first and second substrates sandwiching an electro-optic material, and is mounted on the first substrate, and has a first terminal group on the mounting surface. An electronic component, an insulating material that fills between adjacent terminals of the first terminal group, and a second terminal group that is provided on the first substrate and is electrically connected to the first terminal group It is characterized by comprising.

  In the present invention, since the adjacent terminals of the first terminal group are filled with the insulating material, for example, when the first terminal group and the second terminal group are electrically connected by the ACF, An electro-optical device can be provided in which the conductive particles do not enter between adjacent terminals of the first terminal group, and the conductive particles can be reliably prevented from clogging between the terminals.

  An electro-optical device according to another aspect of the present invention has first and second substrates sandwiching an electro-optic material, and is mounted on the first substrate, and has a first terminal group on the mounting surface. An electronic component and an insulating material provided between adjacent terminals of the first terminal group and having a gap between the terminals; provided on the first substrate; and the first terminal group And a second terminal group electrically connected.

  In the present invention, since the insulating material is provided between the adjacent terminals of the first terminal group, and there is a gap between the terminals, the conductive particles in the ACF, for example, are connected to the terminals by the insulating material between the terminals. It is possible to prevent a short circuit between terminals by preventing intrusion between the terminals. In addition, the gap allows the resin in the ACF to flow between the terminals, thereby reducing the uneven distribution of the resin, reducing internal stress and preventing a decrease in adhesive strength.

  An electronic apparatus according to another aspect of the invention includes the above-described electro-optical device.

  The present invention includes an electro-optical device that can easily and surely prevent a short circuit due to clogging of conductive particles between terminals. Therefore, it is possible to reduce the manufacturing cost and provide a high-quality electronic apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description of the embodiment, a liquid crystal device as an example of an electro-optical device, specifically, a reflective transflective passive matrix liquid crystal device, and an electronic apparatus using the liquid crystal device will be described. It is not limited to this. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

(First embodiment)

  1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 (the liquid crystal driving IC is not cut), and FIG. FIG. 4 is a schematic explanatory diagram of the mounting surface of the liquid crystal driving IC, FIG. 5 is an explanatory diagram of the relationship between the bump and the insulating material, and FIG. 6 is a diagram of the relationship between the cylindrical bump and the insulating material. FIG. 7 is a partial perspective view of the structure of the bump and the insulating material in FIG. 4, and FIG. 8 is a partial perspective view when the insulating material is larger than the bump.

  (Configuration of liquid crystal device)

  For example, as shown in FIG. 1, the liquid crystal device 1 includes a liquid crystal panel 2, part of which is also a mounting structure, and a circuit board 3 connected to the liquid crystal panel 2. Here, in addition to the circuit board 3, the liquid crystal device 1 is provided with an illumination device such as a backlight and other incidental mechanisms as necessary (not shown).

  As shown in FIGS. 1 and 2, the liquid crystal panel 2 includes a first substrate 5 and a second substrate 6 which are a pair of substrates bonded via a sealing material 4, and an electric current sealed in a gap between the two substrates. And an optical material, for example, STN (Super Twisted Nematic) type liquid crystal 7.

  On the first substrate 5, for example, as shown in FIG. 2, a plurality of segment electrodes 8 are formed in a predetermined pattern on the liquid crystal 7 side surface.

  An overcoat layer 9 is formed on the segment electrode 8, and an alignment film 10 is further formed thereon. A polarizing plate 11 and the like are disposed outside the first substrate 5 (on the side opposite to the liquid crystal 7).

  On the other hand, on the second substrate 6, for example, as shown in FIG. 2, a plurality of common electrodes 12 are formed in a predetermined pattern on the surface of the liquid crystal 7, and an overcoat layer 13 is formed on the common electrode 12. In addition, an alignment film 14 is formed thereon. Further, a polarizing plate 15 and the like are disposed outside the second substrate 6 (on the side opposite to the liquid crystal 7).

  In addition, although not shown in figure in the inner surface of either one of the 1st board | substrate 5 and the 2nd board | substrate 6, a base layer, a reflection layer, a colored layer, a light shielding layer, etc. are formed as needed.

  Here, as shown in FIGS. 1 and 2, the first substrate 5 and the second substrate 6 are plate-like members formed of a light transmissive material such as glass or synthetic resin, and the first substrate 5. Has an overhang region 16 (hereinafter referred to as an “overhang portion”) that protrudes outward with respect to the other substrate. This projecting portion 16 is one of the mounting structures of the liquid crystal device 1 that is an electro-optical device.

  The segment electrode 8 is formed of a transparent conductive material such as ITO (Indium Tin Oxide), for example, and has a stripe shape so as to be parallel in one direction (Y-axis direction in the drawing) as shown in FIGS. A plurality are formed.

  The common electrode 12 is formed in a plurality of stripes with a transparent conductive material such as ITO, like the segment electrode 8, but as shown in FIG. 1 and FIG. It is formed in the axial direction. The intersection of the segment electrode 8 and the common electrode 12 is a pixel for displaying an image.

  In FIG. 1 and FIG. 2, the segment electrodes 8 and the common electrodes 12 etc. are schematically shown with a wider interval than the actual one in order to make it easy to understand. .

  The overcoat layers 9 and 13 are made of, for example, silicon oxide, titanium oxide, or a mixture thereof, and the alignment films 10 and 14 are made of, for example, a polyimide resin.

  Next, as shown in FIGS. 1, 2, and 3, the projecting portion 16 extends from the region where the segment electrode 8 and the common electrode 12 are surrounded by the sealing material 4 (hereinafter referred to as “liquid crystal region”) to the projecting portion 16. For example, a segment electrode wiring 17 and a common electrode wiring 18 which are electrode portions, and a liquid crystal driving IC 19 which is an electronic component for supplying a liquid crystal driving current to the electrode wirings. Therefore, the first substrate 5 which is the overhanging portion 16 is also a mounting base material.

  In addition, the overhanging portion 16 includes a plurality of electrode terminals 20 as a second terminal group provided in a mounting region on the first substrate 5 corresponding to the mounting surface of the liquid crystal driving IC 19, and further from the circuit board 3. A plurality of input terminals 21 for inputting a current to the liquid crystal driving IC 19 are provided. The electrode terminal 20 is electrically connected to the segment electrode wiring 17 and the common electrode wiring 18, respectively.

  Furthermore, the overhanging portion 16 includes an external terminal 22 that receives a current from the circuit board 3, an input wiring 23 that supplies the external current to the input terminal 21, and the like.

  The segment electrode wiring 17 and the common electrode wiring 18 are formed of a transparent conductive material such as ITO, for example, like the segment electrode 8 and the common electrode 12.

  When the liquid crystal driving IC 19 receives various signals related to a display image or the like via the circuit board 3 and the input wiring 23, for example, the liquid crystal driving IC 19 generates a driving signal corresponding to the signal, and the driving signal is a segment electrode. The power supply wiring 17 and the common electrode wiring 18 are supplied.

  For example, as shown in FIG. 1, the liquid crystal driving IC 19 has a substantially rectangular outer shape with long sides in the X-axis direction, and the back surface, which is the mounting surface 24 to the projecting portion 16, has electrode terminals 20 and A plurality of bumps 25 as a first terminal group to be electrically connected to the input terminal 21 and an insulating material 26 filling a part of the bumps 25 are provided. This electrical connection is made through the ACF 27 between the electrode terminal 20 and the input terminal 21 and the bumps 25 (25a, 25b).

  Here, the bump 25 is, for example, a third terminal group electrically connected to the electrode terminal 20 via the ACF 27 and also an output bump 25a which is also an output terminal, and the input terminal 21 is electrically connected via the ACF 27. And a fourth terminal group connected together and an input bump 25b which is also an input terminal. For example, as shown in FIG. 4, the output bump 25a has a first edge pitch (B in FIGS. 4 and 5) and a long side edge near the liquid crystal region (upper part of FIG. 4) in FIG. And the right and left short side peripheral edges are arranged in approximately one row.

  Here, for example, as shown in FIG. 4, the output bump 25a is connected to the output bump 25a at the end on the long side and the output bump 25a at the end on the left and right short sides by an insulating material 26 or the like. It is formed so that there is a gap. Accordingly, the degree of freedom in routing the segment electrode wiring and the common electrode wiring electrically connected to the electrode terminal 20 corresponding to the output bump 25a is secured, and the arrow E in FIG. As described above, the resin in the ACF flows and the uneven distribution of the resin can be reduced, the internal stress can be reduced, and the decrease in the adhesive strength of the ACF can be prevented.

  Further, the input bump 25b is, for example, as shown in FIG. 4 between the input bumps 25b having a second pitch larger than the pitch (B in FIGS. 4 and 5) between the output bumps 25a being the first pitch. 4 (C in FIG. 4 and FIG. 5), they are arranged in a row substantially on the long side edge near the circuit board of FIG. 1 (downward in FIG. 4). 4 and 5, the bumps 25 (25a, 25b) are shown in a substantially rectangular parallelepiped shape. However, the present invention is not limited to this, and may have a cylindrical shape, for example, nickel (Ni), copper (Cu). , Gold (Au) or the like.

  Further, for example, as shown in FIG. 2 and FIG. 3, the ACF 27 is a film-like resin 27b mainly composed of epoxy or acrylic having a thickness of 10 to 50 μm and conductive particles 27a plated with Ni / Au around a spherical resin core. The resin 27b acts as an adhesive that joins the liquid crystal driving IC 19 to a predetermined mounting region of the projecting portion 16, and the conductive particles 27a are, for example, liquid crystal as shown in FIG. It acts as a conductive member that electrically connects the bump 25 of the driving IC 19 to the electrode terminal 20 and the input terminal 21.

  Next, for example, as shown in FIG. 4, the insulating material 26 is formed so as to fill a space between adjacent bumps of the output bump 25 a which is a third terminal group and also an output terminal. However, the insulating material 26 is buried only between the terminals arranged in the same row as shown in FIG. 4, for example, and is buried between both ends of the arrangement on the long side and the terminals on the left and right short sides. Not.

  Further, as shown in FIGS. 4, 5 and 7, for example, the insulating material 26 is a bump side surface that is not in contact with the insulating material 26 of the adjacent output bumps 25a (the long side output bump 25a in FIG. In the short side output bump 25a, the left side surface and the right side surface) 28 and the insulating material side surface 29 of the insulating material 26 in the same direction are formed continuously.

  This point will be described in detail with reference to FIG. For example, as shown in FIG. 5, the plurality of output bumps 25a on the long side are arranged in a line, and the arrangement direction is the D-axis direction of FIG. Each of the output bumps 25a is an end facing the D axis, for example, one first terminal (one of the adjacent terminals) 37 of the output bump 25a. Second ends 39 and 40 are provided. Similarly, if the second terminal 38 (the other terminal with respect to one terminal) 38 adjacent to the first terminal 37, the third end 41 and the end 40 are on the same side as the end 39. A fourth end 42 is provided.

  The insulating material 26 has the second end portion 40 and the fourth end portion 42 on the opposite side when the line segment connecting the first end portion 39 and the third end portion 41 is the first line segment 43. As a second line segment 44, the first line segment 43 is provided over the entire width (F in FIG. 5) between the first line segment 43 and the second line segment 44 (the first line segment 44). Between the line segment 43 and the second line segment 44, although not shown by hatching for the sake of explanation, the insulating material 26 is buried), the side wall thereof becomes the insulating material side surface 29.

  Of course, the insulating material 26 may be longer or shorter than the full width within the range of the particle size of the conductive particles 27a, as will be described later. If it is within the range of the length of the particle size of the conductive particles 27a, the conductive particles 27a can be prevented from accumulating without causing a short circuit between the bumps. However, the insulating material 26 is preferably buried over at least the entire width (F in FIG. 5) between the first line segment 43 and the second line segment 44, and more preferably As shown in FIGS. 4 and 5, the insulating material 26 is preferably buried over the entire width (F in FIG. 5) between the first line segment 43 and the second line segment 44. Thereby, since the conductive particles 27a do not move and accumulate smoothly on the insulating material side surface 29, it is possible to further prevent a short circuit between the bumps.

  In addition, even if there is a dent on the insulating material side surface 29, there is no problem as long as the conductive particle 27a is a dent that does not line up in a row.

  Further, as described above, the output bump 25a is not limited to a rectangular parallelepiped, and may be, for example, a cylindrical shape as shown in FIG. In this case, the insulating material 26 is provided over the entire width between the first line segment 43 and the second line segment 44. For example, as shown in FIG. This is a state in which the entire region to be covered is filled with the insulating material 26 (portion indicated by hatching in FIG. 6).

  Next, as shown in FIG. 7, the insulating material 26 is formed to have a height substantially equal to the height of the output bump 25a from the mounting surface 24 of the liquid crystal driving IC 19 (G in FIG. 7). Thereby, when thermocompression bonding is performed to the electrode terminal 20 via the ACF 27, the pressure is applied to the insulating material 26, and it is possible to prevent the necessary pressure from being applied to the output bump 25a.

  Of course, the insulating material 26 may be higher or lower than G within the range of the particle size of the conductive particles 27a as described later. If the particle size is larger, the conductive particles 27a between the output bumps 25a and the electrode terminals 20 are not sufficiently crimped and the electrical connection becomes unstable. Conversely, if the particle size is smaller than the particle size, the output bumps 25a are adjacent to each other. This is because the conductive particles 27a may enter between the matching bumps, causing a short circuit between the bumps.

  However, the insulating material 26 is preferably substantially the same height as the height from the mounting surface 24 (G in FIG. 7) as described above or the particle size of the conductive particles 27a from the output bumps 25a as shown in FIG. It is desirable to be high within the range of length. Thereby, the insulation effect increases.

  The insulating material 26 is made of, for example, an organic resin such as an epoxy resin or a polyimide resin.

  On the other hand, the insulating material 26 is not formed between the input bumps 25b as shown in FIG. This is because the conductive particles 27a in the ACF 27 stay and are not clogged and short-circuited because the input bumps 25b can be formed relatively wide. As a result, as shown by an arrow E in FIG. 4, the resin 27b in the ACF 27 flows from the gap between the input bumps 25b, and the uneven distribution of the resin 27b can be reduced. A decrease in adhesive strength can be prevented.

  Next, a wiring pattern 31 and the like are formed and mounted on the base substrate 30 on the circuit board 3 as shown in FIG.

  Here, the base substrate 30 is a flexible film-like member, and the wiring pattern 31 is made of, for example, copper or the like, and a connection terminal (not shown) is formed at the end on the overhanging portion side. Yes. The connection terminal is electrically connected to the external terminal 22 via the external connection ACF 32. The external connection ACF 32 has almost the same configuration as the ACF 27, but the size of the conductive particles is changed as necessary.

  As shown in FIG. 8, the insulating material 26 may be higher than the height of the output bump 25a from the mounting surface 24 (G in FIG. 8) within the range of the particle size of the conductive particles 27a. That is, if H in FIG. 8 is within the range of the particle size of the conductive particles 27a, the conductive particles 27a between the output bumps 25a and the electrode terminals 20 are sufficiently crimped to stabilize the electrical connection.

  Further, as shown in the figure, the insulating material 26 has a first and a second end portion between the ends facing each other with the axis in the arrangement direction of the adjacent output bumps 25a within the range of the particle size of the conductive particles 27a. It may be longer than the entire width between the two line segments. For example, if J in FIG. 8 is within the range of half the length of the particle size of the conductive particles 27a, the conductive particles 27a can be prevented from accumulating and shorting between the bumps can be prevented.

  (Manufacturing method of liquid crystal device)

  Next, a method for manufacturing the liquid crystal device 1 will be briefly described.

  First, ITO or the like, which is a material for the segment electrode 8, is deposited on the first substrate 5 by a sputtering method and patterned by a photolithography method to form a segment in a stripe shape in the Y-axis direction as shown in FIGS. The electrode 8 is formed. Further, an overcoat layer 9 is formed thereon, an alignment film 10 is further formed thereon, and a rubbing process is performed to form the first substrate side. When the segment electrode 8 is formed, the segment electrode wiring 17, the common electrode wiring 18, the input wiring 23, and the like of the overhang portion 16 may be formed at the same time.

  Next, the common electrode 12 is similarly formed on the second substrate 6 in a stripe shape in the X-axis direction as shown in FIGS. 1 and 2, and an overcoat layer 13 and an alignment film 14 are further formed. The substrate side is formed.

  Further, the gap material 33 is sprayed on the second substrate 6 by dry spraying or the like, and the first substrate side and the second substrate side are bonded through the seal material 4. Thereafter, liquid crystal 7 is injected from the opening of the sealing material 4, and the opening of the sealing material 4 is sealed with a sealing material such as an ultraviolet curable resin. Further, the polarizing plates 11 and 15 are attached to the outer surfaces of the first substrate 5 and the second substrate 6 by a method such as sticking.

  Next, bumps 25 electrically connected to the pads are formed in a predetermined shape on a pad (not shown) which is an electrode of an integrated circuit formed in the liquid crystal driving IC 19 by electroless plating or the like. Then, the insulating material 26 is formed so as to completely fill the space between the output bumps 25a by a method such as screen printing. Further, unnecessary portions and the like are removed from the insulating material 26 in accordance with the height and width of the output bumps 25a by using etching or photolithography, and the mounting surface 24 of the liquid crystal driving IC 19 is shown in FIGS. Thus, the insulating material 26 is formed.

  That is, the insulating material 26 is formed to have substantially the same height as the height (G in FIG. 7) of the output bump 25a from the mounting surface 24 of the liquid crystal driving IC 19. As shown in FIGS. 4 and 5, the insulating material 26 has bump side surfaces that are not in contact with the insulating material 26 of the adjacent output bumps 25a (on the long side output bumps 25a in FIG. 4, the downward side surface and the upward side surface). Yes, in the short side output bump 25a, the left side surface and the right side surface) 28 and the insulating material side surface 29 of the insulating material 26 in the same direction are continuous, and the first connecting the end portions of the adjacent output bumps 25a. Are formed so as to fill the entire width (F in FIG. 5) between the line segment 43 and the second line segment 44.

  Further, for example, as shown in FIGS. 2 and 3, the ACF 27 is disposed and attached to the mounting region of the liquid crystal driving IC 19 of the overhanging portion 16 so as to cover the electrode terminal 20 and the input terminal 21.

  Then, the liquid crystal driving IC 19 is disposed on the ACF 27 so that the bumps 25 are positioned corresponding to the electrode terminals and the like, and the liquid crystal driving IC 19 is pressed to heat the ACF 27. Then, for example, as shown in FIG. 3, the conductive particles 27a are sandwiched between the bumps 25 and the electrode terminals 20 and the input terminals 21 to have conductivity in a single direction, and the output bumps 25a and the input bumps 25b. Are electrically connected to the electrode terminal 20 and the input terminal 21.

  Further, when pressurized, the resin 27b in the ACF 27 flows as indicated by an arrow E in FIGS. 4 and 7, and is distributed evenly on the mounting surface 24, for example, and can reduce internal stress during curing. At this time, since the conductive particles 27a are also caused to flow by the pressure of the flow of the resin 27b indicated by the arrow E in FIG. 7, the conductive particles 27a stay on the bump side surfaces 28 of the output bumps 25a and the insulating material side surfaces 29 of the insulating material 26. Thus, no short circuit occurs between the output bumps 25a.

  Further, necessary electronic components and the like are mounted on the circuit board 3, and the connection terminals electrically connected to the wiring pattern 31 of the circuit board 3 are connected to the external terminals via the external connection ACF 32 as shown in FIG. 22 is electrically connected.

  Finally, the other illumination device, the case body, and the like are attached to complete the liquid crystal device 1 which is an electro-optical device.

  As described above, according to the present embodiment, the gap between the adjacent output bumps is filled with the insulating material 26. For example, when the output bump 25a and the electrode terminal 20 are electrically connected by the ACF 27, The conductive particles 27a do not enter between adjacent output bumps, and the conductive particles 27a can be reliably prevented from clogging between the output bumps.

  The bumps 25 include output bumps 25a whose pitch between the bumps is B, for example, and input bumps 25b having a pitch C larger than the pitch, and the insulating material 26 is the output bumps 25a and input bumps. 25b, the gap between adjacent bumps of the output bump 25a is filled. Therefore, when the bump 25, the electrode terminal 20 and the input terminal 21 are electrically connected by the ACF 27, the resin 27b Between adjacent bumps can be circulated between the bumps of the input bumps 25b not filled with the insulating material 26, etc., and the uneven distribution of the resin 27b can be reduced, the internal stress is reduced and the adhesive strength is reduced. Can be prevented.

  Furthermore, since the insulating material 26 that fills the space between the adjacent bumps is softer than the hardness of the adjacent bumps, the bump 25 is electrically connected to the electrode terminal 20 and the input terminal 21 via the ACF 27 by thermocompression bonding. In addition, pressure is applied to the upper end surface of the bump 25, and it is possible to prevent the insulating material 26 on both sides from interfering with the pressure bonding.

  In addition, since the height of the insulating material 26 from the mounting surface 24 is substantially the same as the height of the bump 25 from the mounting surface 24, or the length within the range of the particle size of the conductive particles 27a is high. When the bumps 25 are electrically connected to the electrode terminals 20 via the conductive particles 27a by thermocompression bonding, it is possible to prevent the adjacent insulating materials 26 from hindering electrical connection by the conductive particles 27a.

  Further, the insulating material 26 is formed over the entire width between the first and second line segments 43 and 44 between the respective end portions facing the axis D in the arrangement direction of the adjacent output bumps 25a. For example, the conductive particles 27a of the ACF 27 do not collect on the side walls of the insulating material 26, and a short circuit between the bumps due to the clogging of the conductive particles 27a can be prevented.

  (Second Embodiment)

  Next, a second embodiment of the liquid crystal device according to the present invention will be described. In the present embodiment, since the shape of the insulating material is different from that of the first embodiment, this point will be mainly described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 9 is a schematic explanatory view of the mounting surface of the liquid crystal driving IC of the liquid crystal device according to the second embodiment of the present invention, FIG. 10 is an explanatory view of the relationship between the bump and the insulating material, and FIG. FIG. 12 is a partially enlarged perspective view showing the structure of FIG. 12 and FIG. 12 is a partial perspective view when the insulating material is larger than the bump.

  (Configuration of liquid crystal device)

  As shown in FIGS. 9, 10, and 11, the insulating material 34 is provided between the adjacent output bumps 25a, and a gap is formed between the adjacent output bumps 25a.

  Specifically, a plurality of output bumps 25a are formed on the liquid crystal region side long side (the upper long side in FIG. 9) and the left and right short sides of the mounting surface 24 of the liquid crystal driving IC 19, for example, the input bumps 25b. They are arranged in parallel at an equal pitch (B in FIG. 9) smaller than the pitch (C in FIG. 9). An insulating material 34 is formed substantially in the middle between the output bumps 25a, and a gap 35 is formed so as not to be in direct contact with the adjacent output bumps 25a. Here, the length of the gap 35 (L in FIGS. 10, 11 and 12) is formed to be smaller than the particle size of the conductive particles 27a of the ACF 27, for example. As a result, as shown in FIG. 11, the flow of the resin 27b to the extent that the flow of the resin 27b of the ACF 27 indicated by the arrow E does not disappear is also generated in the gap 35 as the arrow K, and the bias of the resin 27b is further reduced to reduce the inside of the cured resin. The stress can be reduced. Further, it is possible to prevent the conductive particles 27a from collecting around the gap 35.

  Further, for example, as shown in FIG. 10, the plurality of output bumps 25a on the long side are arranged in a line, and the arrangement direction is the D-axis direction in FIG. Each of the output bumps 25a is an end facing the D axis, for example, one first terminal (one of the adjacent terminals) 37 of the output bump 25a. Second ends 39 and 40 are provided. Similarly, if the second terminal 38 (the other terminal with respect to one terminal) 38 adjacent to the first terminal 37, the third end 41 and the end 40 are on the same side as the end 39. A fourth end 42 is provided.

  The insulating material 34 has the second end 40 and the fourth end 42 on the opposite side when a line segment connecting the first end 39 and the third end 41 is a first line 43. A second line segment 44 is defined as the second line segment 44, and is provided across the entire width (F in FIG. 10) between the first line segment 43 and the second line segment 44 (the first line segment 44). The line segment 43 and the second line segment 44 are not shown by hatching for convenience of explanation, but the insulating material 34 is provided so as to have a gap 35 between the output bump 25a.) The side wall becomes the insulating material side surface 36.

  Of course, the insulating material 34 may be longer or shorter than the full width within the range of the particle size of the conductive particles 27a, as will be described later. If it is within the range of the length of the particle size of the conductive particles 27a, the conductive particles 27a can be prevented from accumulating without causing a short circuit between the bumps. However, the insulating material 34 is preferably provided over at least the entire width (F in FIG. 10) between the first line segment 43 and the second line segment 44, and more preferably 9, 10 and 11, the insulating material 34 is provided over the entire width (F in FIG. 10) between the first line segment 43 and the second line segment 44. (Of course, there is a gap 35 between the output bumps 25a).

  In addition, even if there is a depression on the insulating material side surface 36, there is no problem as long as the depression is such that the conductive particles 27a are not arranged in a line.

  As described above, the output bump 25a is not limited to a rectangular parallelepiped, and may be, for example, a cylindrical shape.

  Next, as shown in FIG. 11, the insulating material 34 is formed to have a height substantially equal to the height of the output bump 25a from the mounting surface 24 of the liquid crystal driving IC 19 (G in FIG. 11). Thereby, when thermocompression bonding is performed to the electrode terminal 20 via the ACF 27, the pressure is applied to the insulating material 34, and it is possible to prevent the necessary pressure from being applied to the output bump 25a.

  Of course, the insulating material 34 may be higher or lower than G within the range of the particle size of the conductive particles 27a as described later. If the particle size is larger, the conductive particles 27a between the output bumps 25a and the electrode terminals 20 are not sufficiently crimped and the electrical connection becomes unstable. Conversely, if the particle size is smaller than the particle size, the output bumps 25a are adjacent to each other. This is because the conductive particles 27a may enter between the matching bumps, causing a short circuit between the bumps.

  However, the insulating material 34 preferably has substantially the same height as the height from the mounting surface 24 (G in FIG. 11) as described above or the particle size of the conductive particles 27a from the output bumps 25a as shown in FIG. It is desirable to be high within the range of length. Thereby, the insulation effect increases.

  The material of the insulating material 34 is formed of the same material as that of the insulating material 26.

  Further, the gap 35 between the insulating material 34 and the output bump 25a is formed in a substantially rectangular parallelepiped from the mounting surface 24 to the upper end of the insulating material 34 when viewed from the insulating material side surface 36 as shown in FIG. For example, the gap 35 may be formed so as not to go from the mounting surface 24 to the upper end of the insulating material 34, and the rest may be completely covered with the insulating material 34. As a result, the flow rate of the resin 27b flowing through the gap 35 can be adjusted.

  In the above description, as shown in FIG. 9, the insulating material 34 is not formed between the input bumps as in the first embodiment. However, the present invention is not limited to this, and the case of the first embodiment is not limited thereto. Unlike the output bump 25a, the insulating material 34 may be formed between the input bumps. In that case, a gap 35 is formed between the input bump 25 b and the insulating material 34. Thereby, even when the pitch between the bumps of the input bumps 25b (C in FIG. 6) is narrow, it is possible to prevent short-circuits at the input bumps 25b and to distribute the resin 27b of the ACF 27 to thereby prevent internal stress. Can be prevented and a decrease in the adhesive strength of the ACF 27 can be prevented.

  Further, as shown in FIG. 12, the insulating material 34 may be higher than the height (G in FIG. 12) of the output bump 25a from the mounting surface 24 within the range of the particle size of the conductive particles 27a. That is, if H in FIG. 12 is within the range of the particle size of the conductive particles 27a, the conductive particles 27a between the output bumps 25a and the electrode terminals 20 are sufficiently crimped to stabilize the electrical connection.

  Further, for example, as shown in FIG. 12, the insulating material 34 is within the range of the length of the particle size of the conductive particles 27a, and the first and second ends between the respective end portions facing the axis in the arrangement direction of the adjacent output bumps 25a. It may be longer than the entire width between the two line segments. For example, if J in FIG. 12 is in the range of half the length of the particle size of the conductive particles 27a, the conductive particles 27a can be prevented from accumulating and shorting between the bumps can be prevented.

  (Manufacturing method of liquid crystal device)

  The manufacturing method of the liquid crystal device according to this embodiment is substantially the same as that of the first embodiment, but since the shape of the insulating material is different from that of the first embodiment, this point will be briefly described.

  On a pad (not shown) which is an electrode of an integrated circuit formed in the liquid crystal driving IC 19, a bump 25 electrically connected to the pad is formed in a predetermined shape by electroless plating or the like. Then, the insulating material 34 is formed so as to completely fill the space between the output bumps 25a by a method such as screen printing. Further, unnecessary portions and the like of the insulating material 34 are removed by matching the height and width with the adjacent output bumps 25a by using etching or photolithography.

  Next, a gap 35 is formed between the insulating material 34 and the output bump 25a using a photolithography method or the like, and the bump 25 and the insulation are formed on the mounting surface 24 of the liquid crystal driving IC 19 as shown in FIGS. A material 34 is formed. That is, the insulating material 34 is formed to have substantially the same height as the height of the output bump 25a from the mounting surface 24 of the liquid crystal driving IC 19 (G in FIG. 11).

  Further, as shown in FIG. 10, for example, a gap 35 is provided between the insulating material 34 of the output bump 25a and the output bump 25a, and the first line segment connecting the end portions of the adjacent output bumps 25a. It is formed over the entire width (F in FIG. 10) between 43 and the second line segment 44.

  As described above, according to the present embodiment, the insulating material 34 is provided between the bumps as the first terminal groups adjacent to each other, and the gap between the bumps 25 is provided. 34 prevents the conductive particles 27a in the ACF 27 from entering between the bumps and prevents a short circuit between the bumps. Further, the gap allows the resin 27b in the ACF 27 to flow between the bumps, thereby reducing the uneven distribution of the resin 27b, reducing the internal stress and preventing the adhesive strength from being lowered.

  Further, since the length of the gap 35 between the output bump 25a and the insulating material 34 is shorter than the particle size of the conductive particles 27a, for example, the flow of the resin 27b of the ACF 27 occurs in the gap 35. It is possible to reduce the bias of 27b and reduce the internal stress at the time of curing, and it is possible to prevent a short circuit between the bumps due to the conductive particles 27a entering the gap 35 and collecting the conductive particles 27a between the bumps.

  (Third embodiment)

  Next, a third embodiment of the liquid crystal device according to the present invention will be described. In the present embodiment, unlike the first embodiment, the insulating material is provided between terminals adjacent to each other on the substrate surface. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 13 is a schematic perspective view showing the structure of a terminal and an insulating material according to the third embodiment of the present invention.

  (Configuration of liquid crystal device)

  As shown in FIGS. 2 and 13, the insulating material 45 is formed so as to fill a space between electrode terminals arranged in a plurality on the projecting portion 16 of the liquid crystal panel 2.

  Specifically, the height of the insulating material 45 from the first substrate 5 (M in FIG. 13) is substantially the same as that of the electrode terminal 20 as in the first embodiment, and the width (N in FIG. 13). ) Is substantially the same as the electrode terminal 20. Of course, as in the first embodiment, the insulating material 45 may be higher than the height of the electrode terminal 20 from the first substrate 5 (M in FIG. 13) within the range of the particle size of the conductive particles 27a.

  Further, as shown in the figure, the insulating material 45 may be longer or shorter than the width (N in FIG. 13) of the adjacent electrode terminals 20 within the range of the particle size of the conductive particles 27a.

  Furthermore, the insulating material 45 is not limited to be provided between the electrode terminals on the first substrate 5, and may be provided between the input terminals on the same first substrate 5, for example.

  Further, the insulating material 45 is not limited to the one in which the terminals are completely filled as shown in FIG. 13, and for example, the particle size of the conductive particles 27a between the insulating material 45 and the terminals as in the second embodiment. A smaller gap may be provided. Thereby, for example, when the electrical connection between the bump 25 and the electrode terminal 20 is attempted with the ACF 27, the resin 27b of the ACF 27 flows through the gap, and the bias of the resin 27b can be reduced to reduce the internal stress during curing. It is possible to prevent a short circuit between the terminals due to the conductive particles 27a entering the gap 35 and collecting the conductive particles 27a between the terminals.

  Further, the material of the insulating material 45 may be the same material as the insulating material 26.

  (Manufacturing method of liquid crystal device)

  The manufacturing method of the liquid crystal device according to this embodiment is substantially the same as that of the first embodiment, but since the insulating material is provided between the terminals on the substrate side, this point will be briefly described.

  First, ITO or the like, which is a material for the segment electrode 8, is deposited on the first substrate 5 by a sputtering method and patterned by a photolithography method to form a segment in a stripe shape in the Y-axis direction as shown in FIGS. The electrode 8 is formed. When the segment electrode 8 is formed, the segment electrode wiring 17, the common electrode wiring 18, the input wiring 23, the electrode terminal 20, the input terminal 21, and the like of the projecting portion 16 are simultaneously formed.

  Then, the insulating material 45 is formed so as to completely fill the space between the electrode terminals 20 by a method such as screen printing. Further, unnecessary portions and the like are removed from the insulating material 45 in accordance with the height and width of the electrode terminals 20 by using etching or photolithography, and the like as shown in FIG. 13 on the overhanging portion 16 of the first substrate 5. An insulating material 45 is formed on the substrate. In addition, when forming a clearance gap, this unnecessary part etc. can be removed together with removal.

  As described above, according to the present embodiment, since the insulating material 45 is formed so as to fill a space between the plurality of electrode terminals arranged on the projecting portion 16 of the liquid crystal panel 2, the insulating material 45 between the terminals, for example, the ACF 27. The inside conductive particles 27a can be prevented from entering between the electrode terminals, and short-circuiting between the terminals can be reliably prevented.

  (Fourth Embodiment / Electronic Device)

  Next, an electronic apparatus according to the fourth embodiment of the present invention including the above-described liquid crystal device 1 will be described. In addition, about the component which is common in the component of 1st Embodiment, the code | symbol same as the component of 1st Embodiment is attached | subjected, and the description is abbreviate | omitted.

  FIG. 14: is a schematic block diagram which shows the whole structure of the display control system of the electronic device concerning the 4th Embodiment of this invention.

  The electronic device 300 includes a liquid crystal panel 2 and a display control circuit 390 as shown in FIG. 14 as a display control system, for example. The display control circuit 390 includes a display information output source 391, a display information processing circuit 392, a power supply circuit 393, and the like. A timing generator 394 and the like are included.

  In addition, the liquid crystal panel 2 includes a drive circuit 361 that drives the display region I.

  The display information output source 391 includes a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), a storage unit such as a magnetic recording disk or an optical recording disk, and a tuning circuit that tunes and outputs a digital image signal. It has. Further, the display information output source 391 is configured to supply display information to the display information processing circuit 392 in the form of a predetermined format image signal or the like based on various clock signals generated by the timing generator 394.

  The display information processing circuit 392 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is supplied to the drive circuit 361 together with the clock signal CLK. The driving circuit 361 includes a scanning line driving circuit, a data line driving circuit, and an inspection circuit. The power supply circuit 393 supplies a predetermined voltage to each component described above.

  As described above, according to the present embodiment, the liquid crystal device 1 used in the electronic device 300, for example, fills the gap between adjacent bumps with the insulating material 26, so that the bump 25, the electrode terminal 20, and the input When the terminal 21 is electrically connected by the ACF 27, the conductive particles 27a do not enter between adjacent bumps, and the conductive particles 27a can be reliably prevented from clogging between the bumps.

  In particular, portable electronic devices are required to be small in size and capable of exhibiting accurate functions, and it can be said that the present invention that can ensure electrical connection at low cost is of great significance.

  Specific electronic devices include a touch panel equipped with a liquid crystal device in addition to a mobile phone, a personal computer, etc., a projector, a liquid crystal television or a viewfinder type, a monitor direct view type video tape recorder, a car navigation, a pager, an electronic notebook, A calculator, a word processor, a workstation, a video phone, a POS terminal, etc. are mentioned. And it cannot be overemphasized that the liquid crystal device 1 mentioned above is applicable as a display part of these various electronic devices, for example.

  Note that the electro-optical device and the electronic apparatus of the present invention are not limited to the above-described examples, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, all of the electro-optical devices described above are liquid crystal devices having a liquid crystal panel, but inorganic or organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron emission elements (Field Emission Display and Surface). -Various electro-optical devices such as a Conduction Electron-Emitter Display) may be used.

  Although the present invention has been described above with the preferred embodiment, the present invention is not limited to any of the above-described embodiments, and can be implemented with appropriate modifications within the scope of the technical idea of the present invention.

  For example, in the above-described embodiment, the passive matrix type liquid crystal device 1 has been described. However, the present invention is not limited to this. Furthermore, not only a transflective type but also a reflective type and a transmissive type may be used. As a result, even for a wide variety of liquid crystal devices, short-circuiting between terminals can be prevented easily and reliably, and the manufacturing cost of the liquid crystal device can be reduced.

  In the above-described embodiment, the case of COG (Chip On Glass) using a light-transmitting material such as glass or synthetic resin in the liquid crystal device is described as the mounting substrate. However, the present invention is not limited to this. The present invention is also applicable to the case where electronic components are mounted on a circuit board or the like as in the case of Chip On Film). In this case, the substrate may be a flexible substrate (base substrate). Further, it may be a PCB (Print Circuit Board), a rigid substrate, or the like. Thereby, it is possible to easily and surely prevent a short circuit between terminals for a wider variety of liquid crystal devices, and to reduce the manufacturing cost of the liquid crystal devices.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 (the liquid crystal driving IC is not cut). FIG. 3 is a partially enlarged view of the vicinity of the liquid crystal driving IC of FIG. 2. It is a schematic explanatory drawing of the mounting surface of liquid crystal drive IC which concerns on 1st Embodiment. It is explanatory drawing of the relationship between the bump which concerns on 1st Embodiment, and an insulating material. It is explanatory drawing of the relationship between the cylindrical bump and insulating material which concern on 1st Embodiment. It is the elements on larger scale of the structure of the bump of FIG. 4, and an insulating material. It is a fragmentary perspective view in case the insulating material which concerns on 1st Embodiment is larger than a bump. It is a schematic explanatory drawing of the mounting surface of liquid crystal drive IC which concerns on 2nd Embodiment. It is explanatory drawing of the relationship between the bump which concerns on 2nd Embodiment, and an insulating material. It is a fragmentary perspective view which shows the structure of the bump and insulating material which concern on 2nd Embodiment. It is a fragmentary perspective view in case the insulating material which concerns on 2nd Embodiment is larger than a bump. It is a schematic perspective view which shows the structure of the terminal and insulating material which concern on 3rd Embodiment. It is a schematic block diagram of the display control system of the electronic device which concerns on 4th Embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Liquid crystal device, 2 Liquid crystal panel, 3 Circuit board, 4 Seal material, 5 1st board | substrate, 6 2nd board | substrate, 7 Liquid crystal, 8 Segment electrode, 9,13 Overcoat layer, 10,14 Alignment film, 11, DESCRIPTION OF SYMBOLS 15 Polarizing plate, 12 Common electrode, 16 Overhang | projection part, 17 Segment electrode wiring, 18 Common electrode wiring, 19 Liquid crystal drive IC, 20 Electrode terminal, 21 Input terminal, 22 External terminal, 23 Input wiring, 24 Mounting surface, 25 bumps, 25a output bumps, 25b input bumps, 26, 34, 45 insulating material, 27 ACF, 27a conductive particles, 27b resin, 28 bump side surfaces, 29, 36 insulating material side surfaces, 30 base substrate, 31 wiring pattern, 32 ACF for external connection, 33 gap material, 35 gap 37 1st terminal, 38 2nd terminal, 39 1st end, 40 2nd end, 41 3rd end, 42 4th end, 43 1st line segment, 44 2nd Line segment, 300 electronic device, 361 drive circuit, 390 display control circuit

Claims (14)

An electronic component having a first terminal group on the mounting surface;
An insulating material filling between adjacent terminals of the first terminal group;
A mounting structure having a second terminal group electrically connected to the first terminal group on a surface and a mounting base on which the electronic component is mounted. An electronic component having a first terminal group on the mounting surface;
An insulating material provided between adjacent terminals of the first terminal group, and having a gap between the terminals;
A mounting structure having a second terminal group electrically connected to the first terminal group on a surface and a mounting substrate on which the electronic component is mounted.   The mounting structure according to claim 1, wherein the first terminal group and the second terminal group are electrically connected by an adhesive having conductive particles. The first terminal group includes a third terminal group having a first pitch between the terminals, and a fourth terminal group having a second pitch larger than the first pitch.
The said insulating material is provided between the adjacent terminals of a 3rd terminal group among the said 3rd and 4th terminal groups, The any one of Claim 1 thru | or 3 characterized by the above-mentioned. Mounting structure described in 1. The first terminal group includes a plurality of input terminals and a plurality of output terminals.
The mounting structure according to claim 1, wherein the insulating material is provided between adjacent terminals of the plurality of output terminals.   The mounting structure according to claim 1, wherein the insulating material is softer than the hardness of the adjacent terminals.   The insulating material has a height from the mounting surface that is substantially the same as a height from the mounting surface of the first terminal group, or a range of a particle size length of the conductive particles from the first terminal group. The mounting structure according to any one of claims 3 to 6, wherein the mounting structure is high in the inner length. The adjacent terminals are one terminal having first and second ends facing the axis in the arrangement direction of the adjacent terminals,
Having the third end on the same side as the first end and the other terminal having a fourth end on the same side as the second end, with the axis as a boundary,
The insulating material is between a first line segment connecting the first end part and the third end part and a second line segment connecting the second end part and the fourth end part. The mounting structure according to claim 1, wherein the mounting structure is provided over at least the entire width of the mounting structure.   The first terminal group and the second terminal group are electrically connected by an adhesive provided with conductive particles, and the length of the gap is shorter than the particle size of the conductive particles. The mounting structure according to claim 2. An electronic component having a first terminal group on the mounting surface;
A mounting base material on the surface of which a second terminal group electrically connected to the first terminal group is mounted;
A mounting structure comprising: an insulating material filling between adjacent terminals of the second terminal group.   An electro-optical device comprising the mounting structure according to claim 1. First and second substrates sandwiching an electro-optic material;
An electronic component mounted on the first substrate and having a first terminal group on the mounting surface;
An insulating material filling between adjacent terminals of the first terminal group;
An electro-optical device, comprising: a second terminal group provided on the first substrate and electrically connected to the first terminal group. First and second substrates sandwiching an electro-optic material;
An electronic component mounted on the first substrate and having a first terminal group on the mounting surface;
An insulating material provided between adjacent terminals of the first terminal group, and having a gap between the terminals;
An electro-optical device, comprising: a second terminal group provided on the first substrate and electrically connected to the first terminal group.   An electronic apparatus comprising the electro-optical device according to any one of claims 11 to 13.

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