JP2005223217A - Substrate positioning mechanism and in-line vacuum processor equipped therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate positioning mechanism in which, even if such difference as a positional precision or an assembling precision exists in a plurality of substrate holders, a substrate can always and stably be attached to and detached from the substrate holder, and provide a vacuum processor equipped with such a substrate positioning mechanism. <P>SOLUTION: In the in-line vacuum processor, when a rectangular glass substrate S is attached to and detached from an inside of a frame 41 of a rectangular substrate holder 40 integrated with a carrier C, imaging regions 42a, 42b are imaged by CCD imaging devices 41a, 41b disposed at two corners on the lower end side of the substrate holder 40. Gaps GX<SB>1</SB>, GY<SB>1</SB>and GX<SB>2</SB>, GY<SB>2</SB>between the end face of the glass substrate S and an inside face of the substrate holder 40 opposed thereto are measured. The glass substrate S is attracted and held by a substrate attaching/detaching robot 21, to adjust its position so that GX<SB>1</SB>is equal to GX<SB>2</SB>, and GY<SB>1</SB>is equal to GY<SB>2</SB>. Then the attraction of the glass substrate S is stopped to be naturally dropped, and the glass substrate S is attached to the substrate holder 40. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a substrate positioning mechanism with respect to a substrate holder used for carrying in / out a substrate to / from an in-line type vacuum processing apparatus, and more specifically, a rectangular substrate smaller than the substrate holder is attached to a rectangular substrate holder. The present invention relates to a substrate positioning mechanism that can be positioned, attached, and detached so that the substrate does not come into contact with the substrate holder, and a vacuum processing apparatus equipped with such a substrate positioning mechanism.

  In recent years, LCDs (liquid crystal display panels) with millions of TFTs (thin film transistors) are widely used in televisions and small computers, and PDPs (plasma display panels) are also used in televisions. It has become. All of these display panels are subjected to film formation by sputtering, CVD (Chemical Vapor Deposition), vapor deposition, etc. under vacuum on one surface of the glass substrate using an in-line vacuum processing apparatus. In this case, the substrate is manufactured by preheating the substrate, cooling the substrate after film formation, and the like.

For example, in an in-line vacuum processing apparatus that forms a film by sputtering, an undeposited glass substrate is loaded on the upstream side of a series of vacuum processing chambers including the film forming chamber, and the formed glass substrate is placed downstream of the vacuum processing chamber. A carrier is used to unload from the side, and a substrate attachment / detachment robot attaches an undeposited glass substrate to the substrate holder of the carrier and removes a deposited glass substrate from the substrate holder. (For example, see Patent Document 1 and Patent Document 2).
JP-A-8-274142 JP 2002-176090 A

FIG. 7 is a plan view of an example of an inline-type vacuum processing apparatus that the present inventors have been involved in development, for forming a film of ITO (indium / tin oxide) by sputtering on a glass substrate conveyed by a carrier. Device. In an in-line vacuum processing apparatus 100 shown in FIG. 7, the connected vacuum processing chambers 81, 82, 83, 84, 85 are divided by a partition wall 89 provided in the connecting direction, and the divided processing chamber 81a is connected. , 82a, 83a, 84a, 85a, and connected divided processing chambers 81b, 82b, 83b, 84b, 85b.

Among them, the division processing chambers 84a and 84b are sputtering chambers, and a film forming unit 84e including a target and a cathode is attached to each outer wall surface. Further, a substrate holder reversing chamber 86 is connected to the vacuum processing chamber 85, and the conveying direction of the carrier C sent from the division processing chamber 85a is reversed and sent to the division processing chamber 85b. Further, a load lock chamber 80a having gate valves G on both sides is connected to the divided vacuum processing chamber 81a which is the upstream end, and an unload lock having gate valves G on both sides is connected to the divided processing chamber 81b which is the downstream end. The chamber 80b is connected, and the carrier C is conveyed in the order of the load lock chamber 80a under vacuum, the divided processing chambers 81a to 85a, the return chamber 86, the divided processing chambers 85b to 81b, and the unload lock chamber 80b.

On the atmosphere side of the unload lock chamber 80b, there is provided a turntable chamber 91 provided with a turntable 92 on which the carrier C that has been transported is placed and rotated by 180 degrees or 90 degrees. By rotation, the carrier C is shifted downward in the figure and gets on the return line 94 of the carrier C. Further, during maintenance of the apparatus 3, the turntable 92 is rotated 90 degrees to guide the carrier C to the carrier stocker 99. The return line 94 for the carrier C includes a line 94a for transporting the carrier C in the width direction, a line 94b for transporting the carrier C in a direction perpendicular to the width direction, and a load lock chamber for transporting the carrier C in the width direction again. The line 94c reaches 80a. In the line 94a, the attachment / detachment positions P ₁ and P ₂ of the substrate S are set. In addition, a cassette 97 for storing the vacuum-processed substrate S and a cassette 98 for storing the unprocessed substrate S are arranged in the vicinity.

Then, the carrier C is carried in from the atmosphere side via the load lock chamber 80a, is sequentially conveyed through the divided processing chambers 81a to 85a as indicated by white arrows, passes through the substrate holder reversing chamber 86, and is divided into the divided processing chambers 85b to 85b. It is conveyed in the order of 81b, is carried out from the unload lock chamber 80b to the atmosphere side, and returns to the load lock chamber 80a via the return line 94. That is, the carrier C circulates through the vacuum processing chambers 81 to 85 and the return line 94 on the atmosphere side, and during that time, ITO is deposited on the glass substrate in the divided processing chamber 84a and the divided processing chamber 84b that pass therethrough.

Then, near the line 94a is the upstream portion of the return line 94 of the carrier C which is the atmosphere side is a removable stage 90 of the glass substrate, the position P ₁ and the position P ₂ for attaching and detaching the glass substrates The position is set strictly. In addition, a cassette 97 for storing a glass substrate on which a film has been formed and a cassette 98 for storing an undeposited glass substrate are arranged. A substrate attaching / detaching robot 95 installed at a predetermined position and having an arm operation range 96 indicated by an alternate long and short dash line removes the film-formed glass substrate from the carrier C at the positions P ₁ and P ₂ and accommodates it in the cassette 97. The undeposited glass substrate taken out from the cassette 98 is attached to the emptied carrier C. At this time, the glass substrate is attached / detached by the arm of the substrate attaching / detaching robot 95 previously taught. That is, the substrate S is attached / detached at positions P ₁ and P ₂ based on the three-dimensional coordinates with the installation position of the substrate attaching / detaching robot 95 as a reference point.

  A rectangular substrate holder into which a glass substrate is fitted is integrally attached to the carrier, and the glass substrate is held without being fixed while being fitted. That is, for easy attachment and detachment of the glass substrate, and for freely expanding and contracting the glass substrate when heated and cooled during the process.

Therefore, the space for fitting the glass substrate in the substrate holder has only a margin that can be supported without being fixed to the outer dimensions of the glass substrate. Therefore, a slight difference in the stop position at the substrate mounting / removal position, that is, a slight difference in the position of the substrate holder, a difference in assembly accuracy of the substrate holder during maintenance, and a difference in thermal deformation of the substrate holder due to heating in the process Because the mounting position of the substrate with respect to the substrate holder varies slightly depending on the substrate holder, etc., the glass substrate collides with the substrate holder when it is attached or detached, resulting in damage. In some cases, the glass substrate was dropped from the substrate holder during the transfer, causing troubles.

  The present invention has been made in view of the above problems, and even when there is a difference in the positional accuracy of the substrate holder, the assembly accuracy of the substrate holder, and the degree of thermal deformation when attaching and detaching the substrate, the substrate is always stably attached to and detached from the substrate holder. It is an object of the present invention to provide a substrate positioning mechanism that can be used, and an in-line vacuum processing apparatus including such a substrate positioning mechanism.

  The above-mentioned problem can be solved by the structure of claim 1 or claim 5. The solution means will be described as follows.

The substrate positioning mechanism according to claim 1 is a substrate positioning mechanism that is used when a substrate is attached to or detached from a substrate holder that is integrally attached to a carrier that carries the substrate in and out of the in-line vacuum processing apparatus. Yes, it is a board positioning mechanism that is used when a board is attached to or detached from a board-shaped fitting part that is slightly larger than the board formed on the board holder, and when the board is fitted into the fitting part, Measuring means for measuring the distance between the inner surface of the opposing substrate holder in a non-contact manner;
Based on the measurement results of the measuring means, the above-mentioned distances at both end faces in the vertical direction (Y direction) of the substrate are equal, and the above-mentioned distances at both ends of the bottom end face in the horizontal direction (X direction) of the substrate Is a mechanism comprising a substrate moving means capable of moving the substrate in the X direction, the Y direction, and the Z direction perpendicular thereto.

  Such a substrate positioning mechanism is used at least in the lateral direction of the substrate even if there is a difference in the position accuracy of the substrate holder, the assembly accuracy of the substrate holder, and the degree of thermal deformation of the substrate holder between the plurality of substrate holders. The substrates can be positioned at equal intervals from the inner side surfaces on both sides of the substrate holder, and the substrates can be attached and detached without colliding with the substrate holder when the substrates are attached to or removed from the substrate holder.

According to a second aspect of the present invention, there is provided the substrate positioning mechanism according to the first aspect, wherein the substrate has a longitudinal end surface at one corner of at least two corners on the lower end side of the substrate when the substrate is fitted into the fitting portion. A first optical measuring means capable of measuring a distance GX ₁ between the inner surface of the substrate holder facing the substrate and a distance GY ₁ between the lower end surface of the substrate and the inner surface of the substrate holder facing the substrate; It is possible to measure the distance GX ₂ between the vertical end surface of the substrate at the corner and the inner side surface of the substrate holder facing it, and the distance GY ₂ between the lower end surface of the substrate and the inner side surface of the substrate holder facing it. The second optical measuring means that can be formed and the substrate so that the distance GX ₁ = the distance GX ₂ and the distance GY ₁ = the distance GY ₂ based on the measurement results of the first optical measuring means and the second optical measuring means Adjust the position of A substrate moving means for obtaining a mechanism consisting of.

Such a substrate positioning mechanism measures the distances GX ₁ and GY ₁ and the distances GX ₂ and GY ₂ between the end surface of the substrate and the inner surface of the substrate holder without damaging or soiling the substrate by optical measuring means. Based on the measurement result, the position of the substrate in the substrate holder can be adjusted and mounted so that the interval GX ₁ = the interval GX ₂ and the interval GY ₁ = the interval GY _2. Sometimes the substrate does not collide with the substrate holder.

The substrate positioning mechanism according to claim 3 that is dependent on claim 2 is a mechanism in which the optical measuring means includes an imaging device having the interval and an image processing device that outputs the dimension of the interval from an imaging screen by the imaging device.
Such a substrate positioning mechanism can measure the above-mentioned interval instantaneously with high accuracy and set a preferred position of the substrate in the substrate holder in real time.

The substrate positioning mechanism according to claim 4, which is dependent on claim 2, is such that when the substrate moving means moves the substrate in the X direction, the Y direction, and the Z direction perpendicular thereto, the substrate is abutted against the substrate holder. A sensor for detecting the pressing force generated in contact with the substrate moving means is provided, and when the pressing force reaches a predetermined value, the movement of the substrate in the Z direction by the substrate moving means is stopped. .
Such a substrate positioning mechanism can prevent the substrate from being damaged due to excessive deformation due to the pressing force.

  The in-line type vacuum processing apparatus according to claim 5 is an in-line type vacuum processing apparatus having a carrier for carrying a substrate into and out of a vacuum processing chamber, wherein the substrate has a square shape, and the substrate holder integrated with the carrier is slightly more than the substrate. A large square fitting portion is formed, and when the substrate is attached to and detached from the fitting portion, a measuring means for measuring the distance between the end surface of the substrate and the inner side surface of the substrate holder facing the substrate in a non-contact manner, Substrate moving means capable of adjusting the position of the substrate based on the measurement result so that at least the above-mentioned distances at both ends in the vertical direction of the substrate are equal and the above-mentioned distances at both ends of the lower end of the substrate are equal. Is a device in which a substrate positioning mechanism is used.

  Such an in-line vacuum processing apparatus has a difference in the positional accuracy of the substrate holder when attaching and detaching the substrate, a difference in assembly accuracy of the substrate holder, thermal deformation of the substrate holder, between a plurality of substrate holders transported in the vacuum processing apparatus. Even if there is a difference in the degree, the substrate can be adjusted to a position that is equidistant from the inner surface of the substrate holder, and the substrate can be attached to and removed from the substrate holder without colliding with the substrate holder. Can be removed.

  According to the substrate positioning mechanism of the first aspect, the measurement unit that measures the distance between the end surface of the substrate and the inner surface of the substrate holder facing the substrate in a non-contact manner, and the lateral direction of the substrate based on the measurement result of the measurement unit And a substrate moving means for adjusting the position of the substrate so that the above-mentioned distance is equal at both ends in the vertical direction. Even if there is a difference in position accuracy, assembly accuracy of the substrate holder, and thermal deformation degree, the substrate position is moved appropriately in the X, Y, and Z directions by the substrate moving means, and the substrate is attached to and detached from the substrate holder. Sometimes it is possible to attach and remove a substrate without hitting the substrate holder.

In addition, since the substrate moving means only changes the relative position of the substrate in the substrate holder, it is necessary to attach / detach the substrate to / from the substrate holder on the surface based on the coordinates based on the position of the substrate moving means. Therefore, at the time of start-up after maintenance of the apparatus, detailed teaching for attaching / detaching the substrate to / from the substrate moving means is not required, and the start-up time is greatly shortened and productivity is improved. Also, since the attachment / detachment of the substrate to / from the substrate holder does not depend on the coordinates based on the substrate attachment / detachment robot as in the past, the carrier stop position and the attachment position of the substrate holder to the carrier do not require as much precision as before. Accordingly, the positioning mechanism can be simplified.

According to the substrate positioning mechanism of claim 2, the distance GX ₁ between the vertical end surface of the substrate at one corner and the inner surface of the substrate holder opposite to the two corners on the lower end side of the substrate, and A first optical measuring means capable of measuring a gap GY ₁ between the lower end surface of the substrate and the inner surface of the substrate holder opposed to the substrate; a vertical end surface of the substrate at the other corner; and a substrate opposed thereto A second optical measuring means capable of measuring a distance GX ₂ between the inner side surface of the holder and a distance GY ₂ between the lower end surface of the substrate and the inner side surface of the substrate holder opposed thereto; and first and second optical measurements Since there is a moving means that can adjust the position of the substrate so that the interval GX ₁ = the interval GX ₂ and the interval GY ₁ = the interval GY ₂ based on the measurement results of the means, the end face of the substrate and the substrate Distance from the inner surface of the holder X _1, measured by the optical measuring means spacing GY ₁ and spacing GX _2, the spacing GY ₂ 1 or two, the position of the substrate in the substrate holder was adjusted by the substrate moving means based on the measurement result, It is possible to prevent the occurrence of a trouble such that the substrate is lost when it collides with the substrate holder.

  According to the substrate positioning mechanism of the third aspect, since the optical measuring means includes the imaging device having the above-described distance and the image processing device for the imaging screen, the distance between the end surface of the substrate and the inner surface of the substrate holder is set. Measurement can be performed instantaneously with high accuracy, and the appropriate position of the substrate in the substrate holder can be set in real time, so that the substrate can be attached to the substrate holder at high speed and smoothly, thereby improving productivity.

  According to the substrate positioning mechanism of the fourth aspect, when the pressing force for moving the substrate in the Z direction perpendicular to the X direction and the Y direction to attach to the substrate holder reaches a predetermined value, the substrate is moved by the substrate moving means. Since the movement in the Z direction is stopped, the excessive pressing force prevents the substrate from being damaged due to an excessive pressing force, and the occurrence of loss is suppressed.

  According to the inline-type vacuum processing apparatus of claim 5, based on the measurement result of the non-contact measuring means for measuring the distance between the end face of the rectangular substrate and the inner side face of the substrate holder opposed to the end face, And a substrate positioning mechanism comprising a substrate moving means for adjusting the position of the substrate so that the distance between the both ends of at least one of the horizontal direction and the vertical direction of the substrate is equal. Even if there is a difference in the position accuracy of the substrate holder when attaching or detaching the substrate, a difference in the assembly accuracy of the substrate holder, or a difference in the thermal deformation degree of the substrate holder, The position of the substrate can be adjusted at evenly spaced positions, and troubles caused by contact between the end surface of the substrate and the inner surface of the substrate holder during transport in the vacuum processing device will not occur. It does not reduce the productivity of the apparatus.

Furthermore, the substrate moving means simply changes the position of the substrate in the substrate holder based on the measurement result of the measuring means for measuring the distance between the end surface of the substrate and the inner surface of the substrate holder facing the substrate. Therefore, it is not necessary for the substrate moving means to be installed at an absolute position. Therefore, the substrate attachment / detachment robot as the substrate moving means requires teaching to deliver the substrate when starting up after maintenance of the apparatus. Instead, it shortens the start-up time of the in-line vacuum processing apparatus and improves productivity.

  As described above, the substrate positioning mechanism of the present invention is a substrate positioning mechanism that is used when a substrate is attached to or detached from a substrate holder that is integrally attached to a carrier that carries in and out of the inline vacuum processing apparatus. Is a substrate positioning mechanism used when the substrate is attached to and detached from the fitting portion of the rectangular shape that is slightly larger than the substrate formed on the substrate holder, and when the substrate is fitted into the fitting portion, Based on the measurement results of the measurement means for measuring the distance between the end face and the inner surface of the substrate holder facing the end face without contact, the distance between the two end faces in the vertical direction (Y direction) of the substrate is The substrate is arranged in the X direction, the Y direction, and these so that the intervals at both ends of the lower end surface in the horizontal direction (X direction) of the substrate are equal intervals. A mechanism consisting of a substrate moving means capable of moving the perpendicular Z direction.

  The inline-type vacuum processing apparatus of the present invention is an inline-type vacuum processing apparatus provided with a carrier for carrying a substrate into and out of a vacuum processing chamber. A measuring means for measuring a gap between the end surface of the substrate and the inner surface of the substrate holder facing the substrate in a non-contact manner when the substrate is attached to and detached from the fitting portion, and a fitting portion having a slightly larger rectangular shape is formed. Based on the measurement results, the substrate movement can be adjusted so that at least the distances at both ends in the vertical direction of the substrate are equal and the distances at both ends of the lower end of the substrate are equal. The apparatus uses a substrate positioning mechanism comprising means.

  A substrate holder that is integrally attached to the substrate holder is usually made of a heat-resistant metal, and among them, a titanium alloy that is lightweight and excellent in strength, heat resistance, and corrosion resistance is preferably used. And a board | substrate is attached without being fixed in the state which contact | connected the lower part to the insertion part of the board | substrate holder. Therefore, the substrate may be in an upright posture, but in order to prevent the substrate from falling off, it is in a posture that falls into contact with the slightly inclined substrate holder, that is, a slightly inclined standing posture. Of course, it may be a sleeping posture. The measuring means for measuring the distance between the inner surface of the fitting portion of the substrate holder and the outer peripheral end surface of the substrate is preferably a non-contact method that does not damage or stain the substrate, and the optical measuring means is suitable for this. .

As an optical measuring means, a method of imaging the interval with a CCD imaging device or a CMOS imaging device is excellent in rapidity and measurement accuracy. In addition, the above-mentioned distance is also obtained by scanning the boundary between the substrate holder and the substrate with a laser beam and observing the reflected light from the surface of the substrate holder that is visible between the inner surface of the substrate holder and the end surface of the substrate. be able to. Further, the interval may be obtained by directly observing with a telescope having a scale in the field of view.

The measurement point of the interval by the optical measuring means is set so that the interval at both ends of at least one of the horizontal direction and the vertical direction of the substrate can be measured.
For example, the distance may be measured at the center in the horizontal direction on both the upper and lower end faces of the substrate, or at the center in the vertical direction on both the left and right end faces of the substrate, but at two corners adjacent in the horizontal direction or the vertical direction. By measuring, it can be excluded that the square substrate is attached to the square substrate holder in an inclined state. When the corner is imaged by, for example, a CCD imaging device or a CMOS imaging device, there is an advantage that the interval in the X direction and the interval in the Y direction can be measured with one shot.

That is, by imaging and processing one corner of two corners adjacent to each other in the X direction, which is the lateral direction, on the lower end side of the substrate in a standing posture, the gap between the end surface of the substrate and the inner surface of the substrate holder The interval GX _{1 in the} X direction and the interval GY _{1 in the} Y direction can be obtained by one-shot imaging. Further, by similarly imaging at the other corner, the X-direction interval GX ₂ and the Y-direction interval GY ₂ between the end surface of the substrate and the inner surface of the substrate holder can be obtained by one-shot imaging. it can. In this case, for example, when the actual size (for example, 0.4 mm) of the interval GX ₁ is imaged by a CCD of 400 pixels in the X direction and the image surface is fully displayed, the image is captured with a resolution of 0.001 mm per pixel. It is sufficiently possible to control ₁ with an accuracy of 0.01 mm.

  In the above, since the CCD imaging device measures the relative positional relationship between the substrate holder and the substrate by imaging the corner of the substrate holder, the two corners are imaged by two CCD imaging devices. The two imaging devices do not need to be arranged at a strictly predetermined interval. That is, both corners only need to be within the imaging range. Of course, one corner may be imaged by a single CCD imaging device, and then the CCD imaging device may be moved to image the other corner. In this case as well, both corners need only be within the imaging range, and it is not necessary to set the movement distance strictly. Further, it may be a combination of three or more CCD imaging devices so that the three corners can be imaged simultaneously.

Then, the substrate moving unit moves the substrate at least in the X direction or the Y direction so that the interval GX ₁ = the interval GX ₂ and the interval GY ₁ = the interval GY ₂ based on the measurement result by the optical measuring unit, It is necessary to be able to adjust the position of the substrate in the substrate holder. As such a substrate moving means, a substrate attaching / detaching robot is usually used. When the gap between the inner surface of the substrate holder and the end surface of the substrate is optically measured according to the present invention, the movement of the substrate is three-dimensional with the position of the substrate attaching / detaching robot as a reference point as in the prior art. The movement direction and distance of the substrate are determined based on the relative position of the substrate with respect to the substrate holder without requiring absolute movement based on the coordinate position of the substrate, especially when the distance between the substrate holder and the substrate is small. There is no need to teach the substrate mounting / removal robot in detail. Therefore, the rise time of the apparatus after maintenance is greatly shortened.

  In addition, when the substrate is, for example, a large-area substrate, the substrate itself may be warped by an inherent stress, and the substrate on which one of the functional films is formed is a film-forming material. Since the thermal expansion coefficient is different from that of the substrate and the film forming temperature is high, the substrate is often warped at room temperature. However, when attaching the substrate having the warp to the substrate holder, the substrate is removed by the substrate attaching / detaching robot. The substrate is pressed against the holder, and the pressing force is excessive, which easily damages the substrate. Therefore, for example, a sensor that can detect the pressing force is provided in the hand portion of the substrate attaching / detaching robot that holds the substrate by suction, and when the pressing force reaches a predetermined value, the movement and pressing of the hand portion are stopped. It is desirable to be.

As a sensor for detecting the pressing force, a piezoelectric body that generates a potential by pressing, a dielectric that becomes thin by pressing and changes its capacitance, and a conductor that changes resistance by pressing are preferably used. Of course, a sensor having a strain gauge may be provided. In particular, it is preferable that a pressure sensor made of a rubber sheet mixed with an organic piezoelectric sheet or inorganic piezoelectric powder is two-dimensionally arranged on the hand portion of the substrate attaching / detaching robot because the distribution of the pressing force applied to the glass substrate can be grasped. In addition to the hand portion, the sensor may be provided on the arm portion of the substrate attaching / detaching robot.

  The substrate positioning mechanism of the present invention is an in-line vacuum processing apparatus, for example, a film forming chamber by sputtering, and a substrate holder that carries the substrate into and out of the vacuum processing chamber connected to the upstream side and the downstream side thereof. Applies to Of course, the vacuum processing may be various types of vacuum processing other than film formation by sputtering, and the substrate may be a silicon substrate or a glass substrate, and the type of the substrate is not limited.

FIG. 1 is a plan view of a substrate attaching / detaching stage 10 different from the substrate attaching / detaching stage 90 shown in FIG. In FIG. 1, two cassettes 12b that store undeposited glass substrates S on the right side and two cassettes 12a that store the deposited glass substrates S lie on the glass substrate S. It is arranged to become. Further, on the left side, the glass substrate S in a standing posture after film formation is removed from the carrier C carried out from the unloading chamber, and the glass substrate S 2 without film deposition is placed in an empty carrier C in a posture where it stands. A turntable 30 for mounting is provided. A substrate attachment / detachment robot 21 is installed between the turntable 30 and the four cassettes 12a and 12b, and can reciprocate in the direction indicated by the arrow r. Is.

The turntable 30 for attaching and detaching the glass substrate is provided with a gantry 31 on which the carrier C carried out from the unloading chamber (not shown on the left) is placed at a position aligned with the carrying-out path. At that position, the film-formed glass substrate S is removed from the substrate holder of the carrier C. Further, as shown in a perspective view of FIG. 2 to be described later, the CCD imaging devices 43a and 43b are installed on the turntable 30 at positions facing both ends on the lower end side of the substrate holder 40, respectively. The distance from the substrate is imaged.

When the film-formed glass substrate S is removed, the turntable 30 is rotated 180 degrees, and the gantry 31, the carrier C in which the substrate holder is empty, and the CCD imaging devices 43a and 43b are indicated by alternate long and short dash lines. The glass substrate S that has not been formed is attached to the empty substrate holder of the carrier C. Even when the glass substrate S is attached, the distance between the substrate holder and the glass substrate is imaged. Then, the carrier C to which the non-film-formed glass substrate is attached is carried from the gantry 31 to the left loading chamber (not shown).

  2 is a substrate holder 40 integrally attached to the carrier C on the turntable 30 in FIG. 1, a glass substrate S held by the holder 40, and two corners on the lower end side of the substrate holder 40. It is a perspective view which shows roughly the positional relationship with CCD imaging device 43a, 43b installed in this way. The turntable 30 and the carrier C are not shown. Then, as will be described later, the CCD image pickup devices 43a and 43b are for obtaining an interval dimension by imaging the interval between the inner surface of the substrate holder 40 and the end surface of the glass substrate S at the two corners.

  FIG. 3 is a view of FIG. 2 viewed from the CCD image pickup devices 43a and 43b, but the illustration of the CCD image pickup devices 43a and 43b is omitted. As an alternative, imaging regions 44a and 44b by CCD imaging devices 43a and 43b are surrounded by a dashed line. 3 is a view of the turntable 30 as viewed from the rotation center side in FIG. And in FIG. 3, the back surface side in which the glass substrate S is not formed into a film is shown. The hand unit of the substrate attaching / detaching robot 21 moves the glass substrate by vacuum-sucking the back side of the glass substrate S, but the hand unit is not shown in FIG.

In addition, when the non-film-formed glass substrate S is attached to the substrate holder 40 by the hand unit of the substrate attaching / detaching robot 21, the glass substrate S is attached even after the glass substrate S comes into contact with the substrate holder 40 when the glass substrate S is warped. In some cases, the glass substrate S may be pressed against the substrate holder 40. If this pressing force is excessive, the glass substrate S is damaged.
In order to avoid such a situation, a pressure sensor is attached to the hand unit, and when the pressing force exceeds a predetermined value, the movement is stopped in the pressing direction of the hand unit.

4 is a cross-sectional view taken along the line “4”-“4” in FIG. 3. The substrate holder 40 includes a frame portion 41 and a fitting portion 42, but the glass substrate S is in contact with the surface of the fitting portion 42. Attached but not fixed. Accordingly, in a natural state, the lower end of the glass substrate S is in contact with the substrate holder 40. In FIG. 3, the lower end of the glass substrate S is shown lifted from the substrate holder 40 in order to illustrate a later-described distance between the glass substrate S and the substrate holder 40, but is held by the substrate attaching / detaching robot 21. You may see it because it is.

Then, the distance GX ₁ between the left end surface E ₁ of the glass substrate S imaged in the imaging region 44a by the CCD image pickup device 43a shown in FIG. 3 and the inner side surface F ₁ of the substrate holder 40 facing this, and the glass substrate S The distance GY ₁ between the lower end surface E ₄ and the inner side surface F ₄ of the substrate holder 40 facing the lower end surface E ₄ is subjected to image processing by an image processing device (not shown), and their dimensions are obtained. Further, also in the imaging region 44b by the CCD imaging device 43b, the distance GX ₂ between the right end surface E ₂ of the glass substrate S to be imaged and the inner side surface F ₂ of the substrate holder 40 opposed thereto, and the lower end surface of the glass substrate S The distance GY2 ₂ between E ₄ and the inner side surface F ₄ of the substrate holder 40 facing this is subjected to image processing by the image processing apparatus, and their dimensions are obtained.

As described above, in the case of the first embodiment, since the substrate holder 40 is in a standing posture, the lower end surface E ₄ of the glass substrate S is normally in contact with the inner surface F ₄ of the substrate holder 40. That is, the interval GY ₁ = the interval GY ₂ = 0. Utilizing this fact, when either _{one of} the intervals GY ₁ and GY ₂ is not 0, it is determined that the glass substrate S ₀ is suggested to be distorted or missing.

As a result of the above measurement, if the interval GX ₁ ≠ the interval GX ₂ , the glass substrate S is sucked and held on the hand portion of the substrate attaching / detaching robot 21, and the glass substrate S is held by the substrate holder 40 as shown in FIG. The glass substrate S is moved in the X direction, the Y direction, and the Z direction so that the interval GX ₁ = the interval GX ₂ and the interval GY ₁ = the interval GY _2. Then, the vacuum suction is stopped and the glass substrate S is naturally dropped, so that the glass substrate S is naturally dropped and the lower end surface E ₄ comes into contact with the inner side surface F ₄ of the substrate holder 40 as shown in FIG. That is, GY ₁ = GY ₂ = 0 and is held by the substrate holder 40. By the way, the actual size when the distance GX ₁ and the distance GX ₂ are equally spaced on the glass substrate S having a width of 1100 mm in the X direction, a length of 1250 mm in the Y direction, and a thickness of 1 mm is about 0.5 mm. Conversely, when GY ₁ = GY ₂ = 0 does not occur when the glass substrate S is naturally dropped, it is inspected that the glass substrate S has some abnormality, for example, the glass substrate S is defective or deformed. The

Note that the state of FIG. 5 is also a state in which the substrate holder 40 has been carried out of the unload lock chamber together with the carrier C. That is, in this state, the interval GX ₁ and the interval GX ₂ are measured, and it is confirmed that GY ₁ = GY ₂ = 0. That is, in a state where the glass substrate S has been unloaded in the vacuum processing chamber, at least the glass substrate S has moved, and it is normal that the state of GX ₁ = GX ₂ is broken. Then, a movement path of the hand portion of the substrate attaching / detaching robot 21 is established so that the glass substrate S does not come into contact with the substrate holder 40 when being detached from the substrate holder 40, and the glass substrate S is removed from the substrate holder 40. Then, an undeposited glass substrate S is attached to the empty substrate holder 40.

FIG. 6 is a perspective view showing the substrate positioning mechanism of the present invention applied to the substrate mounting / demounting stage 90 of the inline vacuum processing apparatus 100 shown in FIG. That is, when the glass substrate S is attached and detached at adjacent positions P ₁ and P ₂ , in other words, when the glass substrate S is attached and detached with the substrate holders 40 aligned in a line in the transport direction. The positional relationship of the CCD imaging device 43 for measuring the space | interval of the glass substrate S and the substrate holder 40 and the glass substrate S and the substrate holder 40 is shown. For example, at the position P _{1 at} which the glass substrate S is attached and detached, the CCD imaging devices 43a and 43b for imaging the two corners on the lower end side of the substrate holder 40 are transported in the substrate holder 40, that is, the glass substrate S. Are arranged side by side in the horizontal direction (X direction). This also applies to the place P ₂ , and similar elements are denoted by the same reference numerals with (′).

This in-line type vacuum processing apparatus that attaches and detaches a substrate by the optical substrate positioning mechanism is a stand-up after maintenance of the apparatus, as compared with a conventional apparatus that attaches and detaches a substrate by a coordinate axis with the installation position of the substrate attaching and detaching robot as a reference point. It does not require teaching to transfer the substrate to the substrate mounting / removal robot, and the start-up time of the in-line vacuum processing apparatus is shortened to improve productivity. In addition, the glass substrate does not collide with the substrate holder and is not rubbed with the substrate holder, so that the stoppage of the apparatus due to them is eliminated, and the apparatus can be operated stably.

  The substrate positioning mechanism and the vacuum processing apparatus including the substrate positioning mechanism according to the present invention have been described above by way of example. Of course, the present invention is not limited to this, and various modifications can be made based on the technical spirit of the present invention. It is.

For example, in the present embodiment, the case where the substrate positioning mechanism of the present invention is applied to an in-line vacuum processing apparatus in which the substrate holder is circulated together with the carrier is illustrated, but the substrate holder is carried in from one end side and the like. The present invention is also applied to a linear in-line vacuum processing apparatus carried out from the end side.
Further, in the present embodiment, the case where the glass substrate is carried into the vacuum processing chamber in a standing posture and carried out from the vacuum processing chamber is illustrated, but the glass substrate may be carried in and out in a sleeping posture.

  Further, in this embodiment, the case where film formation by sputtering is performed on a glass substrate is exemplified, but the substrate positioning mechanism of the present invention is not limited to this vacuum processing apparatus, for example, film formation by CVD or vapor deposition, ion implantation, heat treatment, etching. The same applies to an in-line type vacuum processing apparatus that performs vacuum processing such as the above.

Further, in the present embodiment, the case where the next step is immediately started after the position adjustment of the glass substrate is shown, but an operation of imaging and confirming the adjustment position may be performed after the position adjustment.
Further, in this embodiment, the case where a square glass substrate is vacuum-processed is exemplified, but the present invention is similarly applied to a substantially square glass substrate with four corners dropped.
In the present embodiment, the case where a glass substrate is used has been exemplified, but the present invention is also applied to the case where a substrate other than glass, for example, a silicon substrate or a metal substrate such as aluminum or titanium is used.

It is a top view which shows arrangement | positioning of the turntable for a carrier attachment / detachment, the cassette of a board | substrate, etc. with the CCD imaging device of the ss example board | substrate positioning mechanism of Example 1 provided in an in-line type vacuum processing apparatus, a substrate attachment / detachment robot. It is a perspective view which shows roughly the positional relationship of the substrate holder and glass substrate integral with the carrier corresponding to FIG. 1, and a CCD imaging device. FIG. 3 is a front view corresponding to FIG. 2, an imaging region of a CCD imaging device for imaging both ends of a lower end of the glass substrate, and an end surface of the glass substrate and the substrate holder for knowing the positional relationship between the substrate holder and the glass substrate; it is a rear view showing the measurement point spacing _{GX 1, GY 1, GX 2} , GY 2 of the inner surface. It is sectional drawing of the "4"-"4" line direction in FIG. FIG. 4 is a back view showing a state in which the lath substrate is naturally dropped from the state of FIG. 3. FIG. 5 is a perspective view schematically showing a positional relationship between a glass substrate and a CCD image pickup device in a substrate positioning mechanism of Example 2 in which two substrate holders are arranged in a line, and corresponds to FIG. 2 of Example 1; It is a figure to do. It is a top view of the in-line type vacuum processing apparatus which the present inventors engaged.

Explanation of symbols

10 Substrate attachment / detachment stage, 12a, 12b Glass substrate cassette,
21 Substrate attaching / detaching robot, 22 Operating range of arm part,
30 substrate turntable, 40 substrate holder,
43a, 43b CCD imaging device, 44a, 44b imaging area,
S Glass substrate, P ₁ , P ₂ glass substrate attachment / detachment position,
_{GX 1, GX 2, GY 1} , GY 2 distance between the glass substrate and the substrate holder

Claims (5)

In the substrate positioning mechanism that is used when the substrate is attached to or detached from the substrate holder that is integrally attached to the carrier that carries the substrate into and out of the inline vacuum processing apparatus,
The substrate has a square shape, and is a substrate positioning mechanism used when the substrate is attached to and detached from a fitting portion having a rectangular shape slightly larger than the substrate formed on the substrate holder,
A measuring means for measuring, in a non-contact manner, an interval between an end surface of the substrate and an inner surface of the substrate holder facing the substrate when the substrate is fitted in the fitting portion;
Based on the measurement result of the measuring means, the intervals on both end surfaces in the vertical direction (Y direction) of the substrate are equal intervals, and both end portions of the lower end surface in the horizontal direction (X direction) of the substrate The substrate in the X direction so that the intervals in are equal.
A substrate positioning mechanism comprising: a substrate moving means capable of moving in the Y direction and a Z direction perpendicular thereto. When the substrate is fitted into the fitting portion, at least two corners on the lower end side of the substrate, a vertical end surface of the substrate at one corner and an inner surface of the substrate holder facing the end surface The first optical measuring means capable of measuring the interval GX ₁ and the interval GY ₁ between the lower end surface of the substrate and the inner surface of the substrate holder facing the substrate, and the vertical direction of the substrate at the other corner A second optical that can measure a distance GX ₂ between the end surface of the substrate and the inner side surface of the substrate holder facing the substrate, and a distance GY ₂ between the lower end surface of the substrate and the inner surface of the substrate holder facing the substrate GX ₂ . Measuring means,
Based on the measurement results of the first optical measurement means and the second optical measurement means, the position of the substrate can be adjusted such that the interval GX ₁ = the interval GX ₂ and the interval GY ₁ = the interval GY _2. The substrate positioning mechanism according to claim 1, comprising the substrate moving unit. The substrate positioning mechanism according to claim 2, wherein the optical measurement unit includes an imaging device of the interval and an image processing device that outputs a size of the interval from an imaging screen by the imaging device. When the substrate moving means moves the substrate in the X direction, the Y direction, and a Z direction perpendicular thereto, and attaches the substrate to the substrate holder, the pressing force generated by contacting the substrate with the substrate holder is detected. A sensor is provided in the substrate moving means, and when the pressing force reaches a predetermined value, the movement of the substrate in the Z direction by the substrate moving means is stopped. Item 3. A substrate positioning mechanism according to Item 2. In an in-line type vacuum processing apparatus equipped with a carrier that carries a substrate into and out of the vacuum processing chamber.
The substrate has a square shape, and a rectangular holder that is slightly larger than the substrate is formed in a substrate holder that is integral with the carrier, and when the substrate is attached to and detached from the fitting portion,
Measuring means for measuring the distance between the end surface of the substrate and the inner surface of the substrate holder facing the substrate in a non-contact manner, and the distance between at least both longitudinal end faces of the substrate based on the measurement result of the measuring means And a substrate positioning mechanism comprising substrate moving means capable of adjusting the position of the substrate so that the intervals at both ends of the lower end surface of the substrate are equal. Inline vacuum processing equipment.

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