JP2005223169A - Connection structure of package element and circuit board, and optical module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To facilitate the connection work of a package element and a circuit board by narrowing an interval therebetween. <P>SOLUTION: The package element 1 disposes a terminal pin protrusion forming surface 2P of the package case 2 of the package element while making the forming surface face the end surface 4T of a circuit board 4. On the terminal pin protrusion forming surface 2P of the package element 1 there are provided surface connection terminal pins 3A, 3B extending in a straight line toward a circuit board surface 4F, rear surface connection terminal pins 3C, 3D extending in a straight line toward a circuit board rear surface 4B, and an end surface connection terminal pin 3E extending in a straight line toward the circuit board end surface 4T. The end surface connection terminal pin 3E is adapted to abut on and is connected with the end surface electrode 6 of the circuit board end surface 4T at its tip end surface. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a connection structure between a package element in which a plurality of terminal pins are protruded and a circuit board on which an electric circuit is formed, and an optical module including the connection structure.

  FIG. 9A shows an example of an optical module with a part cut away (see, for example, Patent Document 1). The optical module 30 has a configuration in which a package element (light receiving element) 31 on the light receiving side, a package element (light emitting element) 32 on the light transmitting side, and a circuit board 33 are accommodated in a housing 34. I have.

  The package element 31 on the light receiving side incorporates a component that converts an optical signal incident from the outside into an electrical signal and outputs the electrical signal in the package case. The package element 32 on the optical transmission side incorporates a component that converts an input electric signal into an optical signal and outputs the optical signal in the package case. Each of the package element 31 on the optical receiving side and the package element 32 on the optical transmitting side has terminal pins for electrically connecting the inside and outside of the package case to the circuit board 33 side in the example of FIG. It is formed to project toward.

  FIG. 9B schematically shows the circuit board 33 extracted. An electric circuit is formed on the circuit board 33, and flexible portions 35 a and 35 b in which a wiring pattern of the electric circuit is formed projectingly formed on one end side of the circuit board 33. The flexible part 35a is provided with a hole through which the terminal pin of the light receiving side package element 31 is inserted, and the flexible part 35b is inserted through the terminal pin of the light transmitting side package element 32. A hole is provided. As shown in FIG. 9 (c), the terminal pins of the respective package elements 31 and 32 on the corresponding optical receiving side and optical transmitting side are respectively inserted into the respective hole portions and formed in the flexible portions 35a and 35b, respectively. The formed wiring pattern and the package elements 31 and 32 are electrically connected. As shown in FIG. 9 (d), the flexible portions 35 a and 35 b are bent so that the terminal pin protrusion forming surfaces of the package elements 31 and 32 on the light receiving side and the light transmitting side face the end surface of the circuit board 33. In this state, as shown in FIG. 9A, the package elements 31 and 32 on the optical reception side and the optical transmission side, and the circuit board 33 are accommodated in the housing 34.

  Note that reference numeral 36 in FIG. 9 denotes a lead pin for connecting an electric circuit formed on the circuit board 33 to the outside of the housing 34.

JP 2001-298217 A JP 2003-107300 A

  In the configuration of FIG. 9A, the package elements 31 and 32 and the electric circuit of the circuit board 33 are electrically connected using the wiring patterns of the flexible portions 35a and 35b that are bent and deformed. is there. For this reason, an interval is required between the package elements 31 and 32 and the end face of the circuit board 33 so that the flexible portions 35a and 35b can be bent and deformed while preventing damage to the wiring pattern. For this reason, there is a limit to narrowing the space between the package elements 31 and 32 and the end face of the circuit board 33, which may hinder downsizing of the optical module 30.

  Further, since the flexible portions 35a and 35b must be provided on the circuit board 33, there arises a problem that the cost increases accordingly. Further, in the manufacturing process of the optical module 30, after the package elements 31 and 32 on the optical receiving side and the optical transmitting side are connected to the flexible parts 35a and 35b of the circuit board 33, the flexible parts 35a and 35b are bent and deformed. Is necessary and cumbersome.

  FIG. 8A shows a configuration example in which the terminal pins of the package elements 31 and 32 on the optical receiving side and the optical transmitting side are directly connected to the edge of the circuit board 33 (for example, Patent Document 2).

  In this example, the terminal pin protrusion forming surface 31a of the optical receiving side package element 31 has terminal pins at positions A to E shown in the front view of the terminal pin protrusion forming surface of FIG. 38 (38A to 38E) are formed to protrude. Further, the terminal pin protrusion forming surface 32a of the optical transmission side package element 32 is provided with terminal pins 38 (in the positions A to C shown in the front view of the terminal pin protrusion forming surface of FIG. 38A to 38C) are formed to protrude. The package elements 31 and 32 are disposed with terminal pin protrusion formation surfaces 31 a and 32 a facing the end surface of the circuit board 33, respectively, and the terminal pins 38 A, 38 B, and 38 E of the package element 31 and the terminal pins of the package element 32. The tip portions of 38A and 38B are connected to electrode pads (not shown) for electric circuit connection formed on the surface of the circuit board 33, for example, by solder or the like. The terminal pins 38C and 38D of the package element 31 and the terminal pins 38C of the package element 32 are electrode pads for electrical circuit connection (not shown), each having a tip portion formed on the back surface of the circuit board 33. For example, it is connected with solder or the like.

  FIG. 8B shows a cross-sectional view of the α-α portion of FIG. As shown in this cross-sectional view, in this example, the terminal pins 38E of the package element 31 on the light receiving side are lower than the surface position of the circuit board 33 on the terminal pin protruding formation surface 31a. Since it protrudes from the end face facing portion, in order to connect the tip portion of the terminal pin 38E to the electrode pad on the surface of the circuit board 33, the terminal pin 38E is bent and the tip portion of the terminal pin 38E is connected to the circuit board. It is necessary to guide from the position facing the end surface to the surface of the circuit board 33. Between the package element 31 and the end face of the circuit board 33, a space for arranging the bent portion of the terminal pin 38E is required. As a result, the package elements 31 and 32, the end face of the circuit board 33, There is a limit to narrowing the interval between the two. In addition, since the terminal pin 38E must be bent in the manufacturing process, there is a problem that the manufacturing process becomes complicated.

  The present invention has been made to solve the above-described problems, and the object thereof is to easily reduce the interval between the circuit board and the package element, and to connect the circuit board and the package element. It is an object of the present invention to provide a connection structure between a package element and a circuit board with a simple process and an optical module including the connection structure.

  In order to achieve the above object, the present invention has the following configuration as means for solving the above problems. That is, the package element and the circuit board of the present invention include a package element having a configuration in which a plurality of terminal pins for electrically connecting the inside and outside of the package case are formed to protrude outward from one surface of the package case; It is a connection structure with a circuit board on which an electric circuit is formed, and the package element is arranged with the terminal pin protruding formation surface of the package case facing the end surface of the circuit board, and the package case terminal On the pin protrusion forming surface, a terminal pin for surface connection that is linearly extended toward the surface of the circuit board, and a terminal pin for back surface connection that is linearly extended toward the back surface of the circuit board A terminal pin for connecting the end surface that is linearly extended toward the end surface of the circuit board, and the terminal pin for connecting the surface is at least the tip The terminal is connected to the electrode pad for connecting the electric circuit formed on the surface of the circuit board and is arranged along the surface of the circuit board. At least the tip of the terminal pin for connecting the back surface is on the back surface of the circuit board. The terminal pins for connecting the end face are connected to the electrode pads for connecting the electric circuit formed on the back surface of the circuit board, and the end face of the terminal pin for connecting the end face is formed on the end face of the circuit board. It is characterized in that it is abutted and connected to an end face electrode. The optical module of the present invention includes a connection structure between a package element and a circuit board having a configuration unique to the present invention, and the package element is an optical-electrical conversion that converts an electrical signal into an optical signal in the package case. The part is built in.

  According to the present invention, the terminal pins for front surface connection, back surface connection, and end surface connection formed on the terminal pin protrusion forming surface of the package case of the package element are bent in a straight state, respectively. It was set as the structure directly connected to a circuit board, without processing. For this reason, it is not necessary to interpose a connecting member such as the flexible part described above for connecting the package element and the electric circuit of the circuit board between the package element and the end face of the circuit board. Since it is not necessary to provide a space for arranging the bending deformation portion of the terminal pin, it is easy to narrow the distance between the package element and the end face of the circuit board.

  In addition, the terminal pins for connecting the front surface, the back surface, and the end surface of the package element have a configuration in which the bending process is not performed in a straight state. For this reason, in the structure of this invention, in the connection process of the terminal pin of a package element, and a circuit board, troublesome operations, such as a bending process of a terminal pin, are eliminated, and a manufacturing process can be simplified.

  Furthermore, for example, when the number of terminal pins must be increased, if the number of terminal pins for end face connection is increased, it is not necessary to increase the number of electrode pads formed on the front and back surfaces of the circuit board. Therefore, for example, the problem of increasing the size of the circuit board (that is, the problem of increasing the size of the circuit board due to the need to increase the area of the circuit board as the electrode pads are increased) can be suppressed.

  The terminal pin for connecting the end face extends linearly from the terminal pin protrusion forming surface not to the end face of the circuit board facing the terminal pin protrusion forming face but to the end face of the circuit board connected to the end face. Even in the case of a device having a formed structure, as described above, the effect that the distance between the package element and the circuit board can be narrowed, and the bending process of the terminal pin is not necessary, and The effect that simplification can be achieved can be obtained.

  By the way, when the terminal pin becomes long, the conduction loss of the electric signal passing through the terminal pin increases. Further, as the terminal pin becomes longer, the inductance component of the terminal pin becomes larger, and there is a possibility that the problem that the ground of the package element shifts from the ground of the electric circuit of the circuit board may occur. On the other hand, in the present invention, since the distance between the package element and the circuit board can be reduced, the length of the terminal pin can also be reduced, and this is caused by the length of the terminal pin. It is possible to suppress the occurrence of problems.

  The terminal pins for connecting the end face that are linearly extended from the terminal pin protrusion forming surface of the package element toward the end face of the circuit board facing the terminal pin protrusion forming surface are for other surface connection and back surface connection. Since it is shorter than each terminal pin, the terminal pin for connecting the end face is used for ground connection, so that there is almost no adverse effect of the length of the terminal pin for ground connection, and the ground of the package element is reduced. It can be stabilized to the ground of the circuit board. Thereby, for example, there is no problem that the circuit operation of the package element becomes unstable, and the reliability of the circuit operation of the package element can be improved.

  By applying the package element and circuit board connection structure characteristic of the present invention to the connection between the package element and the circuit board constituting the optical module, the manufacturing process of the optical module can be simplified, In addition, the optical module can be reduced in size.

  In addition, when the optical-electrical conversion unit built in the package element of the optical module is configured to include an optical transmission unit and an optical reception unit, the optical transmission electrically connected to the optical transmission unit Crosstalk between the terminal pin on the side of the optical receiver and the terminal pin on the side of the optical receiver that is electrically connected to the optical receiver becomes a problem. That is, the terminal pin functions as an antenna. For example, an electromagnetic wave caused by an electrical signal that conducts the terminal pin on the optical transmission unit side is radiated from the terminal pin on the optical transmission unit side, and the radiated electromagnetic wave is transmitted as light. There is a concern about the occurrence of a problem (crosstalk) in which noise is generated in an electrical signal that is picked up by a terminal pin on the receiver side and conducted through the terminal pin on the optical receiver side. Crosstalk becomes a serious problem as the length of the terminal pin becomes longer, but the terminal pin of the package element can be shortened by applying the connection structure of the package element and the circuit board of the present invention. Therefore, the crosstalk between the terminal pin on the optical transmission unit side and the terminal pin on the optical reception unit side can be reduced.

  Embodiments according to the present invention will be described below with reference to the drawings.

  FIG. 1 shows a simplified model diagram of a connection structure between a package element and a circuit board according to the first embodiment. 1A is a top view showing a connection structure between the package element and the circuit board according to the first embodiment, FIG. 1B is a side view thereof, and FIG. 1C is a front view. It is.

  In the first embodiment, the package element 1 is a 5-terminal type TO can as shown in the model diagram of FIG. The package element 1 has a package case 2. The package case 2 has five terminal pins 3 (3A to 3E) for electrically connecting the inside and outside of the package case 2 on one side of the package case 2. (Terminal Pin Projection Forming Surface) It is formed to project linearly outward from 2P.

  One terminal pin 3 (3E) is formed so as to protrude from the central portion of the terminal pin protrusion forming surface 2P of the package case 2 as shown in FIG. In the connection structure between the package element and the circuit board according to the first embodiment, the package element 1 is arranged with the central portion of the terminal pin protruding formation surface 2P of the package case 2 facing the end face 4T of the circuit board 4. The terminal pin 3E at the center of the terminal pin protrusion forming surface 2P is in contact with the end surface 4T of the circuit board 4 at the tip end surface.

  An end face electrode 6 for connecting an electric circuit to be connected to an electric circuit (not shown) formed on the circuit board 4 is formed on the portion of the circuit board end face 4T with which the terminal pin 3E abuts. The terminal pin 3E is electrically connected to the end surface of the terminal pin 3E in contact with the end surface electrode 6, and is also electrically connected to the end surface electrode 6 by a joining means such as solder. That is, in the first embodiment, the terminal pin 3E provided at the center portion of the terminal pin protrusion forming surface 2P of the package case 2 is used for connecting the end surface to the end surface electrode 6 of the end surface 4T of the circuit board 4. It consists of a terminal pin. It is conceivable that the terminal pin 3E for end face connection functions as a ground connection. In this case, the end face electrode 6 is connected to the ground of the electric circuit formed on the circuit board 4. Of course, the terminal pin 3E for end face connection may be configured to function as a power supply for supplying power to the inside of the package case 2, for example. The function of the terminal pin 3E for end face connection is It is appropriately set in consideration of the internal configuration of case 2 and the like, and is not particularly limited.

  Of the other four terminal pins 3 (3A to 3D), the two terminal pins 3A and 3B are each linearly extended from the terminal pin protrusion forming surface 2P toward the surface 4F of the circuit board 4. ing. On the front surface 4F of the circuit board 4, there are formed electrode pads 7 (7A, 7B) for electrical circuit connection that are separately connected to the terminal pins 3A, 3B, respectively, and the tip of the terminal pin 3A is the electrode pad 7A. In addition, the tip of the terminal pin 3B is in contact with and electrically connected to the electrode pad 7B, and is also electrically connected by a joining means such as solder. That is, the terminal pins 3A and 3B are surface connection terminal pins.

  Further, the terminal pins 3C and 3D are each formed to extend linearly from the terminal pin protrusion forming surface 2P toward the back surface 4B of the circuit board 4. On the back surface 4B of the circuit board 4, there are formed electrode pads 7 (7C, 7D) for electrical circuit connection that are separately connected to the terminal pins 3C, 3D, respectively, and the tip of the terminal pin 3C is the electrode pad 7C. In addition, the terminal pins 3D are in contact with and electrically connected to the electrode pads 7D, respectively, and are also electrically connected by a joining means such as solder. That is, the terminal pins 3C and 3D are terminal pins for connecting the back surface.

  As described above, in the first embodiment, the surface connection terminal pins 3A, 3B of the package element 1 are arranged so as to follow the surface 4F of the circuit board 4, and the back surface connection terminal pins 3C, 3D is arranged so as to follow the back surface 4B of the circuit board 4, and the surface connection terminal pins 3A and 3B and the back surface connection terminal pins 3C and 3D are the surface connection terminal pins 3A and 3B, respectively. The circuit board 4 is connected to the electrode pads 7 of the circuit board 4 in such a manner that the circuit board 4 is sandwiched between the terminal pins 3C and 3D for back surface connection.

  Further, the terminal pin 3E disposed between the formation position of the terminal pins 3A and 3B for front surface connection and the formation position of the terminal pins 3C and 3D for rear surface connection has an end surface at the end surface of the circuit board 4 The terminal pin 3E is in contact with 4T and connected to the end face electrode 6, and the terminal pin 3E is shorter than the terminal pins 3A to 3D.

  The second embodiment will be described below. In the description of the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and duplicate descriptions of common portions are omitted.

  In the connection structure between the package element and the circuit board according to the second embodiment, as shown in the side view of FIG. 3A, the top view of FIG. 3B, and the front view of FIG. The substrate 4 is provided with a notch 10, and the package element 1 is disposed in the notch 10 with the terminal pin protrusion forming surface 2 </ b> P of the package case 2 facing the wall surface 10 a of the notch 10.

  In the second embodiment, terminal pins 3A and 3B for surface connection similar to those in the first embodiment are provided on the surface 4F of the circuit board 4 on the terminal pin protrusion forming surface 2P of the package case 2 of the package element 1. Further, terminal pins 3C and 3D for back surface connection similar to those in the first embodiment are formed to project linearly toward the back surface 4B of the circuit board 4. As a result, also in the second embodiment, as in the first embodiment, the front surface connection terminal pins 3A and 3B and the back surface connection terminal pins 3C and 3D are arranged on both sides of the circuit board 4. The terminal pins 3A to 3D are connected to the electrode pads 7 (7A to 7D) of the corresponding circuit board 4, respectively.

  In the second embodiment, the package element 1 is disposed in the notch 10 by projecting a part of the terminal pin protrusion forming surface 2P outward from the wall surface 10a of the notch 10 of the circuit board 4. It is made. A terminal pin 3E is provided on a portion of the terminal pin protrusion forming surface 2P protruding outward. The terminal pin 3E constitutes a terminal pin for connecting an end face. The terminal pin 3E is formed to extend linearly toward the circuit board end face 4T connected to the notch wall surface 10a, and the tip portion thereof is a circuit. In addition to being in contact with the end face electrode 6 formed on the circuit board end face 4T by being arranged along the board end face 4T, it is also electrically connected by connection means such as solder.

  In the second embodiment, no terminal pin is provided in a space portion sandwiched between the wall surface 10a of the notch 10 of the circuit board 4 and the terminal pin protrusion forming surface 2P of the package element 1 facing the notch 10a. Therefore, the distance between the package element 1 and the circuit board 4 can be reduced without being blocked by the terminal pins. Also in the second embodiment, since the bending of all the terminal pins 3A to 3E is unnecessary as in the first embodiment, the manufacturing process can be simplified.

  In the second embodiment, the package element 1 is arranged in the notch 10 of the circuit board 4. However, for example, the package element 1 has a terminal as in the first embodiment. Even when the pin protrusion forming surface 2P is arranged facing the end surface 4T of the circuit board 4, as shown in the top view of FIG. 4, the terminal pin 3E for connecting the end surface is the same as the second embodiment. The package element 1 and the circuit board 4 may be connected with the same configuration.

  That is, in the configuration of FIG. 4, the package element 1 faces the terminal pin protrusion formation surface 2P to the end surface 4T of the circuit board 4 and eats a part of the terminal pin protrusion formation surface 2P from the circuit board end surface 4T. It is made to arrange. The terminal pin protrusion forming surface 2P is provided with surface connection terminal pins 3A and 3B similar to those of the first embodiment, and with back surface connection terminal pins 3C and 3D. The terminal pin protrusion forming surface 2P is provided with terminal pins 3E for end face connection at portions protruding from the circuit board end face 4T. This terminal pin 3E for end face connection is formed to extend linearly toward the circuit board end face 4T ′ connected to the circuit board end face 4T facing the terminal pin protrusion forming face 2P, and the tip portion thereof is a circuit. In addition to being in contact with and connected to the end face electrode 6 disposed on the circuit board end face 4T ′ along the board end face 4T ′, it is also connected by solder or the like.

  The third embodiment will be described below. The third embodiment relates to an optical module. In FIG. 5A, the main components of the optical module of the third embodiment are extracted and simplified.

  The optical module 12 according to the third embodiment has a configuration in which the package element 1 and the circuit board 4 are connected and accommodated in the housing 13. The package element 1 of the optical module 12 includes an optical-electric conversion unit for converting an electrical signal and an optical signal in a package case 2, and in the third embodiment, the optical-electrical conversion is performed. The unit includes both an optical transmitter and an optical receiver as described below. The optical transmission unit converts an electrical signal into an optical signal and outputs the optical signal, and includes a laser diode, for example. The optical receiver converts an optical signal into an electrical signal and outputs the electrical signal, and includes, for example, a photodiode.

The package case 2 of the package element 1 has adjacent surfaces 2a and 2b orthogonal to each other, and the surfaces 2a and 2b are respectively formed as terminal pin protrusion formation surfaces. In the example of FIG. On the terminal pin protrusion forming surface 2a, five terminal pins 3 (3A _{RX to} 3E _RX ) on the side of the optical receiver that are electrically connected to the optical receiver are the terminals shown in the first embodiment. In a manner similar to that of the terminal pin 3 (3A to 3E) on the pin protrusion formation surface 2P, the protrusion is formed. In addition, the four terminal pins 3 (3A _{TX to} 3D _TX ) on the side of the optical pin that are electrically connected to the optical transmitter are shown on the terminal pin protrusion forming surface 2b as shown in the first embodiment. The protrusions are formed in the same manner as the terminal pins 3 (3A to 3D) of the terminal pin protrusion formation surface 2P.

  The package case 2 is provided with a ferrule mounting portion 14 for drawing and fixing an optical fiber propagating an optical signal into the package case 2. Further, the housing 13 of the optical module 12 is provided with an optical connector (optical adapter) 15 for connecting a ferrule (optical fiber) attached to the package case 2 to a ferrule (optical fiber) of a connection partner. It has been.

  The circuit board 4 is provided with a notch 10 for disposing a package element. The notch 10 has adjacent wall surfaces 10 a and 10 b that are orthogonal to each other, and the package element 1 has the terminal pin protrusion forming surfaces 2 a and 2 b of the package case 2 that are orthogonal to each other. It is arranged to face the orthogonal wall surfaces 10a and 10b.

In the third embodiment, the connection configuration between the terminal pin 3 (3A _{RX to} 3E _RX ) on the optical receiver side provided on the terminal pin protrusion forming surface 2a of the package element 1 and the circuit board 4 is as shown in FIG. As shown in the top view of FIG. 5B and the cross-sectional view of FIG. 5C, the connection configuration between the terminal pins 3 and the circuit board 4 shown in the first embodiment is applied. That is, the terminal pins 3A _RX and 3B _RX are terminal pins for surface connection and are connected to the electrode pads 7 on the surface 4F of the circuit board 4. In addition, the code | symbol 9 in FIG.5 (b), (c) has shown joining means, such as solder.

The terminal pins 3C _RX and 3D _RX are connected to the electrode pads 7 on the back surface 4B of the circuit board 4 as terminal pins for back surface connection. Further, the terminal pin 3E _RX is a terminal pin for end face connection. In the example of FIGS. 5B and 5C, a recess is formed in the notch wall surface 10a where the tip surface of the terminal pin 3E _RX faces, and the end surface electrode 6 is provided on the recess wall surface. The tip end surface of the terminal pin 3E _RX is in contact with and connected to the electrode 6. As described above, the recess is formed in the notched wall surface 10a (the end face of the circuit board), and the tip of the terminal pin 3E _RX for connecting the end face enters the recess, thereby forming the terminal pin protrusion of the package element 1. The space | interval between the surface 2a and the notch wall surface 10a of the circuit board 4 can be made still narrower.

In the third embodiment, the terminal pins 3E _RX for end face connection are for ground connection, and the end face electrodes 6 of the circuit board 4 are connected to the ground layer 16 formed in the inner layer of the circuit board 4. (See FIG. 5C).

The connection configuration between the terminal pins 3 (3A _{TX to} 3D _TX ) on the optical transmitter side of the terminal pin protrusion forming surface 2b and the circuit board 4 is the connection between the terminal pins 3 and the circuit board 4 shown in the first embodiment. The configuration is the same as the configuration in which the terminal pins 3E for end face connection are omitted. That is, the terminal pins 3A _TX and 3B _TX are terminal pins for surface connection and are connected to the electrode pads 7 on the surface 4F of the circuit board 4. The terminal pins 3C _TX and 3D _TX are connected to the electrode pads 7 on the back surface 4B of the circuit board 4 as terminal pins for back surface connection.

The present invention is not limited to the first to third embodiments, and various embodiments can be adopted. For example, in the third embodiment, the connection configuration between the terminal pins 3 (3A _{RX to} 3E _RX ) on the optical receiver side of the package element 1 and the circuit board 4 is the same as that of the terminal pin 3 shown in the first embodiment. The connection configuration of the circuit board 4 has been applied. For example, as shown in the perspective view of FIG. 6A and the top view of FIG. 6B, the terminal pin 3 (3A _RX to 3A _RX . 3E _RX ) and the circuit board 4 may be connected to the terminal pins 3 and the circuit board 4 shown in the second embodiment.

  In the optical module 12 of the third embodiment, both the optical transmitter and the optical receiver are built in one package element 1. For example, the optical module 12 in FIG. 7 (a) and 7 (b), the package element 1 (1RX) with a built-in optical receiver (photo-electric converter) and a built-in optical transmitter (photo-electric converter) The package element 1 (1TX) may be provided. 7A shows an example in which the connection structure between the package element and the circuit board according to the first embodiment is applied as the connection structure between the package element 1 (1RX) and the circuit board 4 on the optical receiver side. FIG. FIG. 7B shows an example in which the connection structure between the package element of the second embodiment and the circuit board is applied as the connection structure between the package element 1 (1RX) on the optical receiver side and the circuit board 4. It is a figure.

  Further, in the third embodiment, the optical module 12 has the package element 1 in which the optical transmission unit and the optical reception unit are incorporated. For example, the optical module 12 has a package in which only the optical reception unit is incorporated. A configuration including only the element 1 may be adopted. In this case as well, as in each of the first to third embodiments, the package element 1 and the circuit board 4 are connected to each other, so that the first to third elements are connected. The same effects as those of the embodiments can be obtained. Further, in the example of the optical module described above, the package element and the circuit shown in the first and second embodiments are used for the connection configuration between the terminal pin 3 and the circuit board 4 that are electrically connected to the optical receiver of the package element 1. Although the example which applied the connection structure of the board | substrate was shown, for example, when the number of the terminal pins which conduct to the optical transmission part of the package element 1 increases, the connection between the terminal pin conducted to the optical transmission part and the circuit board For the configuration, the connection configuration of the package element and the circuit board shown in the first and second embodiments may be applied.

  Furthermore, in each of the first and second embodiments, the end face electrode 6 is formed on the flat circuit board end face 4T. For example, as shown in the third embodiment, the end face electrode 6 is formed on the circuit board end face 4T. It is good also as a structure which forms a recessed part and forms the end surface electrode 6 in this recessed part wall surface.

  Further, in each of the first to third embodiments, when five terminal pins 3 project from one surface of the package element 1, the connection between the five terminal pins and the circuit board is used. Although an example in which the specific configuration of the present invention is applied has been shown, the present invention is not limited to the number of terminal pins as long as three or more terminal pins protrude from one surface of the package element. A specific configuration may be applied. Furthermore, the connection structure between the package element 1 and the circuit board 4 shown in the first and second embodiments is not limited to the case where the package element 1 is an optical component.

It is a figure for demonstrating the connection structure of the package element and circuit board of the example of 1st Embodiment. It is a model figure showing an example of one form of a 5-terminal type package element. It is a figure for demonstrating the connection structure of the package element and circuit board of 2nd Embodiment. It is a model figure for demonstrating the modification of the example of 2nd Embodiment. It is a figure for demonstrating the optical module of the example of 3rd Embodiment. It is a figure for demonstrating the modification of the example of 3rd Embodiment. It is a figure for demonstrating other example embodiments. It is a figure for demonstrating the example of the connection structure of the package element and circuit board which are described in patent document 2. FIG. It is a figure for demonstrating the example of the connection structure of the package element and circuit board which are described in patent document 1. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Package element 2 Package case 3 Terminal pin 4 Circuit board 6 End surface electrode 7 Electrode pad 10 Notch 12 Optical module 16 Ground

Claims (5)

  Connection between a package element having a configuration in which a plurality of terminal pins for electrically connecting the inside and outside of the package case are formed to protrude outward from one surface of the package case, and a circuit board on which the electric circuit is formed The package element is disposed such that the terminal pin protrusion forming surface of the package case faces the end surface of the circuit board, and the terminal pin protrusion forming surface of the package case is disposed on the surface of the circuit board. Terminal pins for surface connection that are linearly extended toward the back, terminal pins for back connection that are linearly extended toward the back surface of the circuit board, and linearly extending toward the end surface of the circuit board A terminal pin for connecting the end surface of the circuit board, and the terminal pin for surface connection is arranged so that at least the tip portion is along the surface of the circuit board. The electric circuit connection electrode pins formed on the front surface and the back surface connection terminal pins are formed on the back surface of the circuit board with at least the tip portion disposed along the back surface of the circuit board. The terminal pin for connecting the end face is connected to the electrode pad for connecting the circuit, and the end face of the terminal pin is in contact with the end face electrode for connecting the electric circuit formed on the end face of the circuit board. Connection structure between package element and circuit board.   The circuit board has a cutout for disposing the package element. The package element faces the protruding surface of the package pin terminal pin against the wall surface of the cutout for disposing the package element. A portion of the terminal pin protrusion forming surface protrudes outward from the wall surface and is provided in a notch for mounting the package element on the circuit board. The terminal pin for connecting the end surface of the package element is a package case. Instead of being formed to extend from the terminal pin protrusion forming surface to the end face of the circuit board facing the terminal pin protrusion forming surface, a notch for disposing a package element is provided from the terminal pin protrusion forming surface of the package case. The electric circuit is formed to extend linearly toward the end face of the circuit board connected to the wall surface of the circuit board, and the tip portion thereof is formed on the end face of the circuit board connected to the wall surface of the notch. Connection structure of the package element and the circuit board according to claim 1, characterized in that it is connected to the end surface electrode for connection.   The terminal pin for connecting the end face of the package element is used for ground connection, and the end face electrode for connecting the electric circuit of the circuit board connected to the terminal pin for connecting the end face is connected to the ground of the electric circuit. The connection structure of a package element and a circuit board according to claim 1 or 2.   An optical module provided with a connection structure between a package element and a circuit board according to claim 1, 2 or 3, wherein the package element converts an electric signal and an optical signal in a package case. An optical module comprising a photoelectric conversion part.   The circuit board has a configuration in which a cutout for disposing the package element is formed, and the wall surface of the cutout for disposing the package element includes adjacent wall surfaces that are orthogonal to each other. The package case has adjacent surfaces that are orthogonal to each other, and the package element faces the surfaces of the adjacent package cases that are orthogonal to each other to adjacent wall surfaces that are orthogonal to each other in the package element placement notch of the circuit board. The optical-electrical conversion unit built in the package element converts the electrical signal into an optical signal and outputs the optical signal, and receives the optical signal to electrically convert the optical signal. And an optical receiver that converts the signal into an electrical signal and outputs an electrical signal. The surfaces of adjacent package cases that are orthogonal to each other form terminal pin protrusion formation surfaces. The terminal pin protrusion forming surface is formed with protruding terminal pins for front surface connection and back surface connection that are electrically connected to the optical transmitter on one side of the terminal pin protrusion forming surface. 5. The optical module according to claim 4, wherein terminal pins for front surface connection, back surface connection, and end surface connection that are electrically connected to the optical receiver are formed to protrude.

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