JP2005219421A - Internally embossed decorative plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an internally embossed decorative plate which has a clear resin layer formed on the surface of an emboss-finish decorative plate and has embossment formed inside, while the outermost surface thereof is smooth and clear and has a feel of depth. <P>SOLUTION: The internally embossed decorative sheet is manufactured on the basis of steps (a)-(e): the step (a) at which a polyester amide resin having an amino group is applied on a transfer base to obtain a transfer sheet; the step (b) at which core base, amino-formaldehyde resin impregnated paper, the transfer sheet and a shaping material are stacked sequentially and subjected to hot-pressing molding; the step (c) at which the sheet is peeled off after the hot-pressing molding and the polyester amide resin layer is transferred from the transfer base to be made the uppermost layer and is placed on a horizontal plane; and the step (d) at which a resin having an ethylenic double bond and having a hydroxy group and/or a carboxy group is cured on the polyester amide resin layer having the amino group. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an internal embossed decorative board.

Heretofore, thermosetting resin decorative boards such as melamine resin decorative boards and diallyl phthalate resin decorative boards used for home interiors are known. There are two types of finishes for the surface of this decorative board. There are flat finishes with smooth surfaces and embossed finishes with uneven surfaces.
For flat finishes, there are also mirror finish, semi-gloss finish, matte finish, etc., and change the gloss of the surface of the metal plate called push plate as appropriate, and thermosetting when producing thermosetting resin decorative board The sheet is finished in various glosses by hot pressing with a pressing plate superimposed on a thermosetting resin-impregnated paper serving as the surface of the decorative resin decorative plate.
As for embossing, the surface is made uneven by using an embossed material in which unevenness is formed on a metal plate, a plastic plate, a metal foil or the like instead of the flat metal plate.

JP-A-5-277431 JP-A-1-232204 JP2003-11293A JP-A-5-104695 JP 5-208468

However, in the embossed decorative board, unevenness appears on the outermost surface, so that it is difficult to develop a smooth design on the surface, and this is a feeling of depth. Also, because of the unevenness of the surface, it took more time to clean than the flat finish.
As a means to solve such problems, a primer layer such as urethane resin type or epoxy resin type is applied on an embossed decorative decorative board, and after the primer layer is formed, clear coating is applied, and a thick film is laminated. However, since the former requires a polishing step, it is difficult to form uniform unevenness, and it is difficult to form large embosses for the latter.
The present invention has been studied in view of such circumstances, and a clear resin layer is formed on the surface of an embossed decorative board, and the outermost surface is smooth, clear, and has a sense of depth, while embossing is formed inside thereof. An internal embossed decorative board is provided.

The present invention has been studied in view of such circumstances, and is an invention characterized by the following.
That is, the invention described in claim 1 is an internal embossed decorative board characterized by being based on the following steps (a) to (e).
(A) applying a polyesteramide resin having an amino group to a transfer substrate to obtain a transfer sheet;
(B) a step of laminating a core base material, an amino-formaldehyde resin impregnated paper, a transfer sheet, and a molding material in order, and hot pressing;
(C) After hot pressing, the sheet is peeled off, and the polyester amide resin layer having the amino group is transferred from the transfer substrate to form the uppermost layer, which is then placed on a horizontal plane;
(D) A step of curing a resin having an ethylenic double bond and having a hydroxyl group and / or a carboxyl group on the polyesteramide resin layer having the amino group.
The invention according to claim 2 is the internal embossed decorative board according to claim 1, wherein finely divided silica is blended with the polyesteramide resin having an amino group.
The invention according to claim 3 is the internal embossed decorative board according to claim 1 or 2, wherein the polyesteramide resin having an amino group has a softening point of 90 ° C or higher.
Furthermore, in the invention described in claim 4, the step (d) described in claim 1 is a step of extending the resin with a film and peeling the film after curing. Internal embossed decorative board.

The internal embossed decorative board of the present invention expresses a design having an emboss inside the surface while having a smooth and deep feeling on the surface.
Hereinafter, the present invention will be described in detail.

(Polyesteramide having an amino group)
The polyester amide resin having an amino group is a block copolymer of a polyether ester component and a polyamide component formed by amide or ester bond, a polyether ester skeleton as a soft segment, and a copolymerized polyamide component as a hard segment. Is. Particularly preferably, the softening point is 90 ° C. or higher, and if it is less than the lower limit, a uniform transfer layer cannot be formed by the resin flow during hot-press molding. In the present invention, the polyamide component in the polyesteramide resin has an amino group. The presence of the amino group improves the adhesion between the surface layer resin and the lower layer resin.

(Fine powder silica)
By blending fine powder silica with the polyester amide, a smooth transfer layer can be formed on the film, and the adhesion with the amino-formaldehyde resin can be strengthened. The blending ratio is preferably 10 to 50 parts by weight. If it is less than the lower limit, the adhesion tends to be inferior, and if it exceeds the upper limit, the sharpness tends to be inferior. Examples of the fine powder silica include fumed silica, calcined silica, precipitated silica, and those obtained by treating these surfaces with an organic silyl group, and these can be used alone or in combination of two or more. Commercially available products include AEROSIL (registered trademark Degussa Aktiengesellschaft), Nipsil (registered trademark Tosoh Silica Co., Ltd.), Cabosil (Kibotto Co-Pareiyan), Santo Cell (manufactured by Monsanto Chemical), Fine Seal (registered trademark Tokuyama Corporation ) And the like.

  Examples of the transfer substrate on which the polyester amide is applied include paper, metal foil, and film. A laminate of these films and paper, a metal foil or a different film laminate can be used, but a film is preferable in terms of smoothness. Examples of the film include polyethylene terephthalate, polybutylene terephthalate, and polyethylene. Naphthalate, polyethylene film, polypropylene film, cellophane, diacetyl cellulose film, triacetyl cellulose film, acetyl cellulose butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene Film, polycarbonate film, polymethylpentene film, polysulfone film, polyetheretherketone film, poly Chromatography ether sulfone film, polyether imide film, polyimide film, fluorine resin film, nylon film, vinylon film, acrylic resin film or the like.

The method for applying the polyesteramide resin to the film is not particularly limited, and melt-extrusion coating or dissolved in a solvent, and known methods such as bar coating, knife coating, roll coating, blade coating, die coating, etc. Can be used. After the application, it is dried, and the application amount is preferably 0.3 to 20 g / m ² . When the coating amount is less than the lower limit, the adhesion between the surface layer resin and the lower layer resin is deteriorated, and when it exceeds the upper limit, the wet color feeling and the sharpness like a coated product are not expressed on the decorative surface.

The film coated with polyester amide is hot-pressed together with an amino-formaldehyde resin-impregnated paper and a core substrate. The molding conditions may be the same as when producing an ordinary decorative melamine decorative board. As the core base material, phenol resin-impregnated paper is used in the embodiments, but a woody base material such as plywood, particle board, and MDF, or an inorganic non-combustible base material may be used. After the hot pressing, when the base film is removed, a polyesteramide layer is formed on the surface.
Amino-formaldehyde resins include amino compounds such as melamine, urea, benzoguanamine, acetoguanamine, etc., initial condensates, etherification with lower alcohols such as ethyl alcohol and butyl alcohol, and paratoluenesulfonamide. Those modified with a reactive modifier that promotes plasticization can be applied, and among them, a melamine-formaldehyde resin excellent in adhesion is preferable.

Examples of the resin having an ethylenic double bond applied on the polyester amide layer include epoxy (meth) acrylate, urethane (meth) acrylate, unsaturated polyester, and the like alone, blends thereof, styrene, MMA, and the like. It is used after diluting with the monomer. Among these, epoxy (meth) acrylate having a hydroxyl group in the resin is particularly preferable in terms of adhesion. As the radical polymerization initiator, an organic peroxide, a curing accelerator and the like are blended and applied in a coating thickness range of 20 to 200 μm.
Although it may be simply applied, if it is coated with a film after the application and the film is peeled off after the resin is cured, a clear decorative board excellent in smoothness can be obtained. What is necessary is just to select a film suitably from the above-mentioned film.

  Epoxy (meth) acrylate [representing acrylate and methacrylate as “(meth) acrylate”] is obtained by reacting an epoxy resin with an unsaturated monobasic acid. Examples of the epoxy resin include bisphenol A-based epoxy resins and halogenated bisphenol A. And epoxy resin, diglycidyl ether of an adduct of bisphenol A and alkylene oxide such as ethylene oxide or propylene oxide, bisphenol F epoxy resin, novolac epoxy resin, cresol novolac epoxy resin, and the like.

  Examples of the monobasic acid include acrylic acid, methacrylic acid, crotonic acid, monomethyl malate, monopropyl malate, sorbic acid or mono (2-ethylhexyl) malate, and are used in combination with an unsaturated monobasic acid. Examples of the polybasic acid include succinic acid, maleic acid, fumaric acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, adipic acid, azelaic acid, 1,12-dodecanedioic acid and other dimer acids. Examples of the dibasic acid anhydride include maleic anhydride and phthalic anhydride. A modified product using trimellitic anhydride as a tribasic acid anhydride can also be used.

Epoxy (meth) acrylate usually contains a polymerizable unsaturated monomer for viscosity adjustment, and this polymerizable unsaturated monomer forms a skeleton of a cured product by polymerization. Examples thereof include aromatic monomers such as acid esters, methacrylic acid esters, styrene and vinyl toluene, and monomers such as acrylonitrile.
In addition to these monomers, monomers that contribute to the formation of a cross-linked structure such as divinylbenzene, diallyl phthalate, and ethylene glycol dimethacrylate, or copolymerizable resins such as unsaturated polyester resins can be used as necessary. .

(Urethane (meth) acrylate)
Urethane (meth) acrylate can be obtained by mixing and reacting a diisocyanate compound, a polyol compound, a hydroxyl group-containing (meth) acrylate, and the like.
As the diisocyanate compound, known compounds can be used. For example, 1,2-diisocyanatoethane, 1,2-diisocyanatopropane, 1,3-diisocyanatopropane, hexamethylene diisocyanate, lysine diisocyanate, Trimethylhexamethylene diisocyanate, tetramethylene diisocyanate, dimer acid diisocyanate, bis (4-isocyanatocyclohexyl) methane, methylcyclohexane 2,4-diisocyanate, methylcyclohexane 2,6-diisocyanate, 1,3-bis (isocyanatomethyl) cyclohexane 1,3-bis (isocyanatoethyl) cyclohexane, 3-isocyanatomethyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-bis (isocyanatomethyl) ) Benzene, 1,3-bis (isocyanato-1-methylethyl) benzene and oligomers is these adducts.
Specific examples of the polyol compound include alkyl diol, polyether diol, and polyester diol.
Examples of the alkyl diol include ethylene glycol, 1,3-propanediol, propylene glycol, 2,3-butanediol, 1,4-butanediol, 2-ethylbutane-1,4-diol, and 1,5-pentadiol. 1,6-hexanediol, 1,7-heptanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,9-decanediol, 1,4-cyclohexanediol, 1,4-dimethylolcyclohexane, 4,8-dihydroxytricyclo [5.2.1.02,6] decane, 4,8-bis (hydroxymethyl) tricyclo [5.2.1.02,6] decane 2,2-bis (4-hydroxycyclohexyl) propane, 2,2-diethylpropane-1,3-diol, 2,2 Dimethylpropane-1,3-diol, 3-methylpentane-1,4-diol, 2,2-diethylbutane-1,3-diol, 4,5-nonanediol, and 2-butene-1,4-diol Etc.

  As the polyether diol, those synthesized by polymerization of aldehyde, alkylene oxide, or glycol by a generally known method can be used. For example, formaldehyde, ethylene oxide, propylene oxide, tetramethylene oxide, epichlorohydrin, etc. are appropriately used. A polyether diol obtained by addition polymerization to an alkyl diol under certain conditions can be mentioned.

  Polyester diols include esterification reaction products obtained by reacting saturated or unsaturated dicarboxylic acids and / or their anhydrides with excess alkyl diols, and alkyl diols with hydroxycarboxylic acids and / or their internals. An esterification reaction product obtained by polymerizing a lactone that is an ester and / or a lactide that is an intermolecular ester can be used.

(Unsaturated polyester resin)
The unsaturated polyester resin comprises an unsaturated polyester and a polymerizable monomer, and comprises an unsaturated dibasic acid and / or an acid anhydride thereof and other saturated acid and / or an acid anhydride used as necessary. The acid component and polyhydric alcohol may be subjected to a dehydration condensation reaction at about 160 to 230 ° C., preferably 210 to 230 ° C. in an inert gas atmosphere such as nitrogen or argon.

Examples of the unsaturated dibasic acid and its acid anhydride include maleic acid, fumaric acid, itaconic acid, maleic anhydride and the like, and these may be used alone or in combination of two or more. The unsaturated dibasic acid and its acid anhydride are preferably used in an acid component of 50 to 100 mol%, particularly preferably 60 to 100 mol%.
Other saturated acids and / or acid anhydrides used as necessary include phthalic anhydride, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, hexahydrophthalic acid, tetrahydroanhydride Examples thereof include saturated dibasic acids such as phthalic acid, tetrahydrophthalic acid, adipic acid, and sebacic acid. These may be used alone or in combination of two or more. The blending amount of the saturated acid is 0 to 50 mol%, preferably 0 to 40 mol% in the acid component.

  Polyhydric alcohols include ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol, 1,5-pentadiol, 1,6- Examples thereof include dihydric alcohols such as hexanediol, triethylene glycol and neopentyl glycol, trihydric alcohols such as glycerin and trimethylolpropane, and tetrahydric alcohols such as pentaerythritol. These may be used alone or in combination of two or more. The blending amount is preferably in the range of 100 to 110 mol with respect to the total acid component 100.

(Polymerizable monomer)
Examples of the polymerizable monomer include aromatic polymerizable monomers such as styrene, α-methylstyrene, vinyltoluene and paramethylstyrene, (meth) acrylic monomers such as methyl (meth) acrylate [(meth) acrylate Methacrylate and acrylate are shown. same as below. ], Ethyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, tertiary butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, stearyl ( (Meth) acrylates, (meth) acrylic acid alkyl esters such as cyclohexyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, caprolactone-modified hydroxy Examples include hydroxyl group-containing polymerizable monomers such as (meth) acrylate.

  Other dialkyl esters of unsaturated dibasic salts such as dimethyl maleate, dimethyl fumarate, dibutyl maleate, dibutyl fumarate, dimethyl itaconate, dibutyl itaconate, (meth) acrylamide, N-methylol (meth) acrylamide N-butoxymethylacrylamide, 2- (2′-hydroxy-5′-methacryloxyethylphenyl) -2H-benzotriazole, 2,2,6,6-tetramethylpiperidinyl methacrylate, N-methyl- Examples also include nitrogen-containing polymerizable monomers such as 2,2,6,6-tetramethylpiperidinyl methacrylate, acetate esters such as vinyl acetate, and polymerizable cyano compounds such as (meth) acrylonitrile.

(Curing agent)
Examples of organic peroxides used as radical polymerization initiators include ketone peroxides such as methyl ethyl ketone peroxide, acetylacetone peroxide, and acetoacetate peroxide, cumene hydroperoxide, t-butyl hydroperoxide, and diisopropylbenzene. Hydroperoxides such as peroxide, diacyl peroxides such as acetyl peroxide, isobutyl peroxide, lauroyl peroxide, benzoyl peroxide, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide, etc. Dialkyl peroxides, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexa Peroxydiesters such as diesters, alkyl peresters such as t-butyl peroxybenzoate, diisopropyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis (4-t-butylcyclohexyl) peroxydicarbonate Organic peroxides such as carbonates, peroxyesters such as t-butylperoxyacetate and t-butylperoxyisobutyrate, 2,2-azobis (2,4-dimethylvaleronitrile), 2,2 -Azobisisobutyronitrile, azo compounds such as 1,1-azobis (cyclohexane-1-carbonitrile), and the like can be mentioned, and these can be used alone or in combination of two or more. Preferably, an organic peroxide used in combination with a curing accelerator and having a low decomposition temperature is convenient in terms of curability. Specifically, methyl ethyl ketone peroxide, acetoacetate peroxide, and acetylacetone peroxide are used. Is preferred.

(Curing accelerator)
In the present invention, cobalt soap is adopted as an essential curing accelerator blended for the purpose of accelerating curing in combination with a curing agent, where cobalt soap refers to a fatty acid salt of cobalt, and as a fatty acid, Natural or synthetic saturated or unsaturated fatty acids having a main chain of 6 to 30 carbon atoms or a mixture thereof. Examples of cobalt soaps include cobalt naphthenate, cobalt neodecanoate, and cobalt octylate.

(Metal soap other than cobalt soap)
Moreover, you may use together with metal soaps other than cobalt soap. Metal soaps other than cobalt soap are metal fatty acid salts like cobalt soap, and preferred examples include potassium soap, calcium soap, copper soap, and zinc soap.
Examples of the potassium soap include potassium octylate, and examples of the calcium soap include calcium neodecanoate, calcium naphthenate, and calcium octylate. Examples of the copper soap include copper naphthenate, and examples of the zinc soap include zinc neodecanoate, zinc naphthenate, and zinc octylate.

(Other curing accelerators)
In addition, organic curing accelerators such as N-pyrodinoacetoacetamide, triethylenediamine, N, N-dimethylacetamide, dimethylaniline, toluidines and the like may be used as curing accelerators other than metal soaps.

(Polymerization inhibitor)
In the resin liquid, for the purpose of stopping the action of the curing agent during storage, p-tertiarybutylcatechol, p-benzoquinone, naphthyquinone, phenanthraquinone, 2,5-diphenyl-p-benzoquinone, paraxiloquinone, Quinones such as p-toluquinone, 2,6-dichloroquinone, 2,5-diacetoxy-p-benzoquinone, 2,5-diacyloxy-p-benzoquinone, hydroquinone, t-butylcatechol, 2,5-di-t-butylhydroquinone , Hydroquinones such as mono-t-butylhydroquinone, amidines such as acetamidine acetate and acetamidine sulfate, phenols such as di-t-butyl paracresol and hydroquinone monomethyl ether, phenylhydrazine hydrochloride, hydrazine hydrochloride, etc. The hydrazine Quaternary ammonium salts such as trimethylbenzylammonium chloride, laurylpyridinium chloride, cetyltrimethylammonium chloride, phenyltrimethylammonium chloride, oximes such as quinonedioxime and cyclohexanone oxime, sulfur compounds such as phenothiazine, etc. The liquid can be appropriately selected and used in consideration of the storage stability of the liquid and the curing time. These can be used alone or in combination of two or more.

(Description of molding material)
The unevenness of the shaping material is preferably 25 to 180 μm. If the unevenness of the shaping material is less than the lower limit, a design feeling having unevenness inside does not appear, and if the upper limit is exceeded, the unevenness appears to the surface and a smooth surface cannot be obtained.

Example 1
A polyesteramide resin having an amino group (softening point 160 ° C.) was applied to a polypropylene film at 2 g / m ² to obtain a transfer sheet.
4 sheets of phenol resin impregnated paper, 1 sheet of melamine resin impregnated decorative paper obtained by impregnating and drying 100g / m ² of melamine-formaldehyde resin on 80g / m ² titanium paper printed with wood grain pattern Then, the transfer sheet (a) and the shaping material (uneven portion 80 μm) are sequentially laminated and molded at a temperature of 140 ° C., a pressure of 60 kg / cm ² , and a time of 90 minutes, whereby the polyesteramide resin having an amino group is placed on the melamine resin side. After transferring, the base film was removed to obtain a decorative board in which the difference between the concave and convex portions on the surface was 80 μm.
Next, the following composition (a) is applied on a polyesteramide resin having an amino group, coated with a polypropylene film having a thickness of 50 μm, spread and deaerated with a roller, and the resin is cured with a thickness of 150 μm, and then the film The internal embossed decorative board of Example 1 was obtained.
Composition (a)
Epoxy methacrylate (containing 20% styrene monomer) 100 parts by weight 55% methyl ethyl ketone peroxide 1.5 parts by weight 8% cobalt octylate 0.15 parts by weight

Example 2
In Example 1, it carried out similarly except having used the composition which mix | blended 20 weight part of fine powder silica with respect to 100 weight part of polyesteramides which have an amino group, and obtained the internal embossing decorative board of Example 2. .

Comparative Example 1 (when the amount of polyester amide applied is less than the lower limit)
In Example 1, it implemented similarly except having applied the application quantity of the polyesteramide which has an amino group to 0.2 g / m < ² >.

Comparative Example 2 (when the coating amount of polyester amide exceeds the upper limit)
In Example 1, it implemented similarly except having applied the application quantity of the polyesteramide which has an amino group to 25 g / m < ² >.

Comparative Example 3 (when surface coating thickness is less than the lower limit)
In Example 1, it implemented similarly except having applied the coating thickness of the composition (a) to 10 micrometers.

Comparative Example 4 (when the coating thickness of the surface resin exceeds the upper limit)
In Example 1, it implemented similarly except having applied the coating thickness of the composition (a) to 300 micrometers.

Comparative Example 5 (when the softening point of the polyesteramide is less than the lower limit)
In Example 1, it implemented similarly except having used the polyesteramide which has an amino group with a softening point of 80 degreeC.

Comparative Example 6
The same procedure was carried out as in Example 1 except that no transfer sheet was used.

Comparative Example 7
Four sheets of the same phenol resin-impregnated paper used in Example 1 and 80 g / m ² of titanium paper printed with a wood grain pattern were impregnated and dried to a solid content of 100 g / m ² of melamine-formaldehyde resin. One sheet of melamine resin-impregnated decorative paper and a shaping plate were sequentially laminated and molded at a temperature of 140 ° C., a pressure of 60 kg / cm ² , and a time of 90 minutes to obtain a melamine decorative board.

Comparative Example 8 (when the unevenness of the shaping material is less than the lower limit)
In Example 1, it implemented similarly except the unevenness | corrugation of the shaping material having been 20 micrometers.

Comparative Example 9 (when the unevenness of the shaping material exceeds the upper limit)
In Example 1, it implemented similarly except the unevenness | corrugation of the shaping material having been 160 micrometers.

The evaluation results are shown in Table 1.

The evaluation method was as follows.
Internal embossing: As shown in FIG. 4, the internal embossed decorative board of the example and the decorative board of the comparative example were leaned on the wall at an angle of 45 to 60 degrees, and the decorative board surface was looked into from a place 30 cm away and visually confirmed. Then, the smoothness was confirmed by touching the surface.
○: Embossing can be confirmed visually, and the unevenness is not confirmed on the surface. Δ: Embossing is slightly visible, and the unevenness is not confirmed on the surface. X: Embossing is not confirmed. Alternatively, irregularities can be confirmed on the surface.
Color unevenness: The decorative decorative board and the decorative decorative board of the comparative example were subdivided into 10 cm squares to form one unit, and the color of each unit was visually confirmed.
○: No color unevenness that can be visually confirmed. X: There is color unevenness that can be visually confirmed.
Adhesiveness with polyester amide: evaluated by cross-cut tape peeling (based on JIS 5400 cross-cut test).
A: 95/100 or more remains. ○: 85/100 to 94/100 remain. X: 84/100 or less.
Adhesion with surface layer resin: evaluated by a cross-cut tape peeling test (based on JIS 5400 cross-cut test).
A: 95/100 or more remains. ○: 80/100 to 94/100 remain. Δ: 79/100 or less.

The structure sectional view showing the state before lamination. Sectional drawing which shows the state after lamination | stacking. The structure sectional view of the internal embossing decorative board of the present invention. The perspective view which shows a test method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Molding material 2 Transfer sheet 3 Resin impregnated decorative paper 5 Resin impregnated core paper 7 Embossed 8 Resin coating layer 9 Internal embossed decorative board 10 Test piece

Claims (4)

An internal embossed decorative board comprising the following steps (a) to (e):
(A) applying a polyesteramide resin having an amino group to a transfer substrate to obtain a transfer sheet;
(B) a step of laminating a core base material, an amino-formaldehyde resin impregnated paper, a transfer sheet, and a molding material in order, and hot pressing;
(C) After hot pressing, the sheet is peeled off, and the polyester amide resin layer having the amino group is transferred from the transfer substrate to form the uppermost layer, which is then placed on a horizontal plane;
(D) A step of curing a resin having an ethylenic double bond and having a hydroxyl group and / or a carboxyl group on the polyesteramide resin layer having the amino group. 2. The internal embossed decorative board according to claim 1, wherein finely divided silica is blended with the polyesteramide resin having amino groups. The internal embossed decorative board according to claim 1 or 2, wherein the polyesteramide resin having an amino group has a softening point of 90 ° C or higher. The internal embossed decorative board according to claim 1, wherein the step (d) according to claim 1 is a step of spreading the resin with a film and peeling the film after curing.