JP2005216942A - Laminated coil - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated coil in which a DC resistance value is not increased even when the number of turns in a coil is augmented in a limited chip size, and from which a high impedance is obtained. <P>SOLUTION: First type band-shaped coil conductor patterns 11a, 11b and 11c and via holes 21, 22, 23 and 24 for an inter-layer connection constitute spiral sections wound in one turn or more respectively at the places of virtual surfaces S1 and S2 vertical in the direction of the coil axis of the coil L1. The ends of the two spiral sections constituted at each place of the two adjacent virtual surfaces S1 and S2 are connected by a second type band-shaped coil conductor pattern 12 parallel in the direction of the coil axis of the coil L1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a laminated coil component, and more particularly to a laminated coil component such as a laminated inductor or a laminated impedance element.

  2. Description of the Related Art Conventionally, as a laminated coil component incorporating a vertically laminated horizontally wound coil, the one described in Patent Document 1 is known. As shown in FIG. 4, the multilayer inductor 81 includes an insulating sheet 93 provided with a plurality of strip-shaped coil conductor patterns 82 and interlayer connection via holes 84, an insulating sheet 94 provided with a plurality of strip-shaped coil conductor patterns 83, The insulating sheet 95 provided with the interlayer connection via hole 84 and the insulating sheet 96 for the outer layer.

  After the sheets 93 to 96 are stacked and pressure-bonded, they are integrally fired to form a laminated body 85 having a rectangular parallelepiped shape as shown in FIG. An end portion of the strip-shaped coil conductor pattern 82 disposed on the upper portion of the multilayer body 85 is electrically connected to an end portion of the strip-shaped coil conductor pattern 83 disposed on the lower portion of the multilayer body 85 via the interlayer connection via hole 84. By doing so, the strip coil conductor patterns 82 and 83 are alternately electrically connected in series to form the spiral coil L3. The coil axis of the coil L3 is orthogonal to the stacking direction of the insulating sheets 93-96. That is, the coil L3 is a vertically laminated horizontally wound type coil. Input / output external electrodes 86 and 87 are formed on the left and right ends of the laminate 85. A coil L3 is electrically connected between the input / output external electrodes 86 and 87.

  In this structure, since approximately half of the coil L3 is formed by the interlayer connection via hole 84, the direct current resistance can be reduced as compared with the conventional horizontally laminated horizontally wound coil. This is because the cross-sectional area of the interlayer connection via hole 84 is larger than the cross-sectional area of the strip coil conductor patterns 82 and 83.

However, if the number of turns of the coil L3 is increased in order to obtain a high impedance with a limited chip size, the diameter of the interlayer connection via hole 84 is reduced and the conductor width of the strip coil conductor patterns 82 and 83 is also reduced. The DC resistance becomes high.
JP 2002-252117 A

  Therefore, an object of the present invention is to provide a laminated coil component that does not have a high DC resistance value and can provide a high impedance even when the number of turns of the coil is increased with a limited chip size.

In order to achieve the above object, a laminated coil component according to the present invention includes:
(A) a ceramic laminate formed by stacking a plurality of ceramic layers;
(B) a plurality of strip coil conductor patterns in which the pattern surface is arranged in parallel to the surface of the ceramic layer inside the ceramic laminate;
(C) A plurality of interlayer connection via holes in which an axis is arranged in parallel to the stacking direction of the ceramic layers, inside the ceramic laminate,
(D) connecting predetermined ends of a plurality of strip-shaped coil conductor patterns with a plurality of interlayer connection via holes to constitute a coil whose coil axis is orthogonal to the stacking direction of the ceramic layers;
(E) the coil has made one turn or more at each position of a plurality of virtual planes perpendicular to the direction of the coil axis;
It is characterized by.

  More specifically, a first type of strip coil conductor pattern that is disposed at each position of the plurality of virtual planes and is substantially orthogonal to the direction of the coil axis, and a predetermined end of the first type of strip coil conductor pattern The inter-layer connection via hole that connects each other forms a spiral portion that circulates at least one turn at each position on the virtual plane. The ends of two adjacent spiral portions are substantially parallel to the direction of the coil axis. Two types of strip coil conductor patterns are connected.

  According to the present invention, since the coil circulates at least one turn at each of a plurality of virtual planes perpendicular to the direction of the coil axis, even if the number of turns of the coil increases with a limited chip size, There is no need to reduce the diameter of the connection via hole or to narrow the conductor width of the strip coil conductor pattern. As a result, even if the number of turns of the coil is increased with a limited chip size, the DC resistance value does not increase, and a laminated coil component having high impedance can be obtained.

  Hereinafter, embodiments of the laminated coil component according to the present invention will be described with reference to the accompanying drawings.

  As shown in FIG. 1, the multilayer inductor 1 includes a ceramic green sheet 2 provided with first-type band-shaped coil conductor patterns 11a, 11b and interlayer connection via holes 21, 22, 23, and a first-type band-shaped coil conductor. Ceramic green sheet 3 provided with pattern 11c and interlayer connection via holes 21, 22, 23, 24; ceramic green sheets 4, 6 provided with interlayer connection via holes 21, 22, 23, 24; The ceramic green sheet 5 provided with the strip coil conductor pattern 12, the lead conductor pattern 13, and the interlayer connection via holes 21, 22, 23, 24, the first type strip coil conductor pattern 11c, and the interlayer connection via holes 21, 22 , 23 and the first type strip-shaped coil conductor patterns 11a, 11b. The ceramic green sheets 8 provided, and a like outer ceramic green sheets 9.

  The ceramic green sheets 2 to 9 are made of, for example, Ni-Cu-Zn ferrite ceramic powder or dielectric ceramic powder, water-based (vinyl acetate, water-soluble acrylic, etc.) binder or organic (polyvinyl butyral, etc.) binder or dispersion. What was kneaded together with an agent, an antifoaming agent, etc. was made into a sheet by a method such as a doctor blade method. The strip coil conductor patterns 11a to 11c, 12 and the lead conductor pattern 13 are made of Ag, Pd, Cu, Au, alloys thereof, or the like, and are formed by a method such as screen printing. Further, via holes 21 to 24 for interlayer connection, which are coil conductors, are formed with holes in the ceramic green sheets 2 to 7 using a laser beam or the like, and Ag, Pd, Cu, Au, and alloys thereof are formed in these holes. It is formed by filling a conductive paste.

  The first type strip-shaped coil conductor patterns 11a and 11b on the ceramic green sheet 2 extend in a direction from the front side to the back side of the sheet 2 and are alternately arranged in parallel. . The length of the strip coil conductor pattern 11b is shorter than that of the strip coil conductor pattern 11a. Each of the first type strip-shaped coil conductor patterns 11c on the ceramic green sheet 3 extends in a direction from the near side to the far side of the sheet 3. The length of the strip coil conductor pattern 11c is shorter than that of the strip coil conductor pattern 11b. When viewed in plan, the position of the strip coil conductor pattern 11a on the ceramic green sheet 2 is set to be equal to the position of the strip coil conductor pattern 11c on the ceramic green sheet 3.

  Each of the second type strip-shaped coil conductor patterns 12 on the ceramic green sheet 5 extends in the direction from the right side to the left side of the sheet 5 and is arranged in a staggered manner in parallel.

  The first type strip-shaped coil conductor patterns 11a and 11b on the ceramic green sheet 8 extend in a direction from the front side to the back side of the sheet 8 and are alternately arranged in parallel. . When viewed in plan, the positions of the strip coil conductor patterns 11a and 11b on the ceramic green sheet 2 are set to be equal to the positions of the strip coil conductor patterns 11b and 11a on the ceramic green sheet 8, respectively. Each of the first type strip-shaped coil conductor patterns 11 c on the ceramic green sheet 7 extends in a direction from the front side of the sheet 7 toward the back side. When viewed in plan, the position of the strip coil conductor pattern 11b on the ceramic green sheet 2 is set to be equal to the position of the strip coil conductor pattern 11c on the ceramic green sheet 7.

  The interlayer connection via holes 21 are arranged in a row in the direction from the right side to the left side of the sheets 2 to 7 in the vicinity of the back side of the ceramic green sheets 2 to 7. The interlayer connection via holes 22 are arranged in a line in the direction from the right side to the left side of the sheets 2 to 7 in the vicinity of the front side of the ceramic green sheets 2 to 7. The interlayer connection via holes 23 are arranged in a line in the direction from the right side to the left side of the sheets 2 to 7 at a position closer to the center on the back side of the ceramic green sheets 2 to 7. The interlayer connection via holes 24 are arranged in a line in the direction from the right side to the left side of the sheets 3 to 6 at a position near the center of the front side of the ceramic green sheets 3 to 6.

  Further, the via holes 21 for interlayer connection of the ceramic green sheets 2 to 4 are arranged in the stacking direction of the sheets 2 to 4 and connected to each other. The via holes 21 for interlayer connection of the ceramic green sheets 5 to 7 are arranged in the stacking direction of the sheets 5 to 7 and connected to each other. In plan view, the positions of the interlayer connection via holes 21 of the ceramic green sheets 2 to 4 and the positions of the interlayer connection via holes 21 of the ceramic green sheets 5 to 7 are 1 pitch in the direction from the right side to the left side of the sheets 2 to 8. It is off by the minute.

  The via holes 22 for interlayer connection of the ceramic green sheets 2 to 7 are arranged in the stacking direction of the sheets 2 to 8 and connected to each other.

  On the other hand, the via hole 23 for interlayer connection is connected to the ceramic green sheets 2 to 6 and connected to the ceramic green sheets 3 to 7. In plan view, the position of the interlayer connection via hole 23 connected across the ceramic green sheets 2 to 6 and the position of the interlayer connection via hole 23 connected across the ceramic green sheets 3 to 7 are as follows. Is shifted by one pitch in the direction from the right side to the left side.

  The via holes 24 for interlayer connection of the ceramic green sheets 3 and 4 are arranged in the stacking direction of the sheets 3 and 4 and are connected. The via holes 24 for interlayer connection of the ceramic green sheets 5 and 6 are arranged in the stacking direction of the sheets 5 and 6 and are connected. In plan view, the position of the interlayer connection via hole 24 of the ceramic green sheets 3 and 4 and the position of the interlayer connection via hole 24 of the ceramic green sheets 6 and 7 are 1 pitch in the direction from the right side to the left side of the sheets 2 to 8. It is off by the minute.

  Then, the end portions of the strip coil conductor patterns 11a, 11b, 11c, and 12 are electrically connected to each other through the interlayer connection via holes 21, 22, 23, and 24, thereby forming the spiral coil L1.

  Both end portions of the spiral coil L1 are electrically connected to a lead conductor pattern 13 provided on the sheet 5. The lead conductor patterns 13 are exposed on the left and right sides of the sheet 5, respectively.

  Each of the sheets 2 to 9 is stacked and pressure-bonded, and then fired integrally to form a laminated body 31 having a rectangular parallelepiped shape as shown in FIG. Input / output external electrodes 32 and 33 are formed on the left and right end faces of the laminate 31. The external electrodes 32 and 33 are formed by a method such as coating baking, sputtering, or vapor deposition. The lead conductor pattern 13 is connected to the external electrodes 32 and 33, respectively.

  The multilayer inductor 1 having the above configuration includes a spiral coil L1 in which the coil axis is orthogonal to the stacking direction of the sheets 2 to 9 inside the multilayer body 31. Input / output external electrodes 32 and 33 electrically connected to both end portions of the spiral coil L1 are disposed on both left and right end surfaces of the multilayer inductor 1. Therefore, the coil L1 is a so-called “vertical laminated horizontal winding type” coil.

  As shown in FIG. 3, the coil L <b> 1 includes the interlayer connection via hole 21 provided in the sheets 2 to 4-the first type strip-shaped coil conductor pattern 11 a provided on the right side of the sheet 2-the interlayer connection provided on the sheets 2 to 7. Via hole 22-first type strip coil conductor pattern 11b provided on the right side of the sheet 8-interlayer connection via hole 23b provided on the sheets 3-7-first type strip coil conductor pattern 11c provided on the right side of the sheet 3 -It is electrically connected to the interlayer connection via holes 24 provided in the sheets 3 and 4 in sequence. The first-type strip-shaped coil conductor patterns 11a, 11b, 11c and the interlayer connection via holes 21, 22, 23, 24 circulate at least one turn at the position of the virtual plane S1 perpendicular to the direction of the coil axis of the coil L1. It constitutes a spiral part. In the present embodiment, 1.5 turns are made at the position of the virtual plane S1, but the number of turns is arbitrary as long as it is 1 turn or more.

  Further, the coil L1 includes the second type strip-shaped coil conductor pattern 12 provided on the right side of the sheet 5, the first type strip-shaped coil conductor pattern 11c provided in the interlayer connection via hole 24 provided in the sheets 5 and 6, and the sheet 7. -Interlayer connection via hole 23 provided in sheets 2-6-First type strip-shaped coil conductor pattern 11b provided in sheet 2-Interlayer connection via hole 22 provided in sheets 2-7-First type provided in sheet 8 The strip-shaped coil conductor patterns 11a-interlayer connection via holes 21 provided in the sheets 5 to 7-is electrically connected sequentially to the first-type strip-shaped coil conductor patterns 11a provided in the sheet 8. The first-type strip-shaped coil conductor patterns 11a, 11b, 11c and the interlayer connection via holes 21, 22, 23, 24 circulate at least one turn at the position of the virtual plane S2 perpendicular to the direction of the coil axis of the coil L1. It constitutes a spiral part.

  The ends of the two spiral portions formed at the positions of the adjacent virtual surfaces S1 and S2 are connected to each other by a second type strip-shaped coil conductor pattern 12 parallel to the direction of the coil axis of the coil L3.

  Similarly, the first type strip-shaped coil conductor patterns 11a, 11b, 11c and the interlayer connection via holes 21, 22, 23, 24 are at least one turn at a virtual plane position perpendicular to the direction of the coil axis of the coil L1. It constitutes a spiral part that circulates. The ends of the two spiral portions formed at the respective positions of the two adjacent virtual surfaces are connected to each other by a second type strip-shaped coil conductor pattern 12 parallel to the direction of the coil axis of the coil L1. ing.

  In the multilayer inductor 1 having the above-described configuration, the coil L1 circulates at least one turn at each of a plurality of virtual planes perpendicular to the direction of the coil axis. Therefore, the number of turns of the coil L1 with a limited chip size Can be increased, and high impedance can be obtained. Further, even if the number of turns of the coil L1 is increased, it is not necessary to reduce the diameter of the interlayer connection via holes 21 to 24 or to reduce the conductor widths of the strip coil conductor patterns 11a to 11c and 12, so that the direct current resistance A coil L1 having a low value is obtained.

  When the number of turns of the coil L1 is not increased, the conductor width of the strip coil conductor patterns 11a to 11c and 12 can be increased, and the diameter of the interlayer connection via holes 21 to 24 can be increased. Mitigation effect is obtained.

  Specifically, the multilayer inductor 1 of the present example and the conventional multilayer inductor 81 shown in FIG. 4 were prepared, and the respective DC resistance values were measured. The sizes of the multilayer inductors 1 and 81 were 3.2 mm in length and 1.6 mm in width. The total length and the number of turns of the coils L1 and L3 are equal to 25 mm and 24 turns, respectively. Furthermore, the gap between the strip coil conductor patterns and the gap between the interlayer connection via holes were both set to 50 μm in order to ensure insulation.

  As a result, the conductor widths of the strip-shaped coil conductor patterns 11a to 11c and 12 of the multilayer inductor 1 of this example were 120 μm, and the diameters of the via holes for interlayer connection 21 to 24 were 120 μm. On the other hand, the conductor width of the strip coil conductor patterns 82 and 83 of the conventional multilayer inductor 81 shown in FIG. 4 is 60 μm, and the diameter of the interlayer connection via hole 84 is 60 μm.

  Then, when the DC resistance values of the multilayer inductors 1 and 81 are measured, the multilayer inductor 1 of the present embodiment is 0.5Ω, the conventional multilayer inductor 81 is 1.5Ω, and the DC resistance value is about 1/3. Reduced. In screen printing, there is a limit to the aspect ratio between the coating thickness and the conductor width of the strip coil conductor pattern. Generally, when the conductor width is reduced, the coating thickness is also reduced. That is, the resistance of the strip coil conductor pattern is not proportional to the conductor width of the strip coil conductor pattern. Therefore, by increasing the conductor width, the coating thickness can be increased and the DC resistance value can be greatly reduced.

  In addition, this invention is not limited to the said Example, It can change variously within the range of the summary. Examples of the laminated coil component include a laminated impedance element, a laminated LC filter, and a laminated transformer in addition to the laminated inductor.

  Moreover, when manufacturing a laminated coil component, it is not necessarily limited to the method of integrally baking after laminating | stacking the ceramic sheet | seat which provided the strip | belt-shaped coil conductor pattern and the via hole. Moreover, you may manufacture a laminated coil component with the construction method demonstrated below. That is, a paste-like ceramic material is applied by a technique such as printing to form a ceramic layer, and then a paste-like conductive material is applied on the ceramic layer to form a strip-shaped coil conductor pattern or a via hole. Further, a paste-like ceramic material is applied from above to form a ceramic layer. By successively applying in this manner, a coil component having a laminated structure can be obtained.

1 is an exploded perspective view showing an embodiment of a laminated coil component according to the present invention. FIG. 2 is an external perspective view of the multilayer coil component shown in FIG. 1. The perspective view for demonstrating the structure of the coil incorporated in the laminated coil component shown in FIG. The exploded perspective view which shows a prior art example. FIG. 5 is an internal perspective view of the laminated coil component shown in FIG. 4.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Multilayer inductor 2-9 ... Ceramic green sheet 11a, 11b, 11c ... 1st type strip | belt-shaped coil conductor pattern 12 ... 2nd type strip | belt-shaped coil conductor pattern 21, 22, 23, 24 ... Interlayer connection via hole 31 ... Multilayer Body L1 ... Spiral coil S1, S2 ... Virtual plane

Claims (2)

A ceramic laminate formed by stacking a plurality of ceramic layers;
Inside the ceramic laminate, a plurality of strip coil conductor patterns in which pattern surfaces are arranged in parallel to the surface of the ceramic layer,
Inside the ceramic laminate, a plurality of interlayer connection via holes whose axis is arranged in parallel to the stacking direction of the ceramic layers,
Connecting predetermined ends of the plurality of strip-shaped coil conductor patterns by the plurality of interlayer connection via holes, and constituting a coil whose coil axis is orthogonal to the stacking direction of the ceramic layers;
The coil circulates at least one turn at each of a plurality of virtual planes perpendicular to the direction of the coil axis;
A laminated coil component characterized by A first type strip-shaped coil conductor pattern that is disposed at each position of the plurality of virtual planes and that is substantially orthogonal to the direction of the coil axis is connected to predetermined ends of the first type strip-shaped coil conductor pattern. With the via hole for interlayer connection, a spiral part that circulates at least one turn at each position of the virtual plane is configured,
The ends of the two adjacent spiral portions are connected to each other with a second type strip-shaped coil conductor pattern substantially parallel to the direction of the coil axis,
The multilayer coil component according to claim 1.

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