JP2005212067A - Ultrasonic polishing method and its device - Google Patents

Ultrasonic polishing method and its device Download PDF

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JP2005212067A
JP2005212067A JP2004023722A JP2004023722A JP2005212067A JP 2005212067 A JP2005212067 A JP 2005212067A JP 2004023722 A JP2004023722 A JP 2004023722A JP 2004023722 A JP2004023722 A JP 2004023722A JP 2005212067 A JP2005212067 A JP 2005212067A
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polishing
polished
fluid
ultrasonic
container
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Nobuyuki Yokoyama
信之 横山
Tomoyasu Murakami
友康 村上
Kenta Ito
健太 伊藤
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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<P>PROBLEM TO BE SOLVED: To provide an ultrasonic polishing method for uniformly and accurately polishing a surface formed with complicated shapes and fine irregular shapes and its device. <P>SOLUTION: After a polishing object surface 11 of a workpiece 1 is transferred to viscous fluid 3 stored into a container 4, polishing fluid 2 mixed with abrasive agent is injected into a transferred recessed part, the workpiece 1 is placed on the polishing fluid 2, fixed pressure is applied to the workpiece 1, and ultrasonic vibration is impressed from a vibrator 12 excited from an ultrasonic oscillator 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、超音波振動により被研磨物を研磨する超音波研磨方法及びその装置に関し、特に複雑な形状の被研磨物の表面を精密に研磨することができる超音波研磨方法及びその装置に関するものである。   The present invention relates to an ultrasonic polishing method and apparatus for polishing an object to be polished by ultrasonic vibration, and more particularly to an ultrasonic polishing method and apparatus for accurately polishing the surface of an object having a complicated shape. It is.

従来の超音波研磨加工として、研磨材を混入させた研磨用液体の中に被研磨物を浸し、密閉した状態で超音波振動を加え、キャビテーションによって生じた気泡の振動によって研磨材の流動を促進して被研磨物を研磨する方法が知られている(特許文献1参照)。   As a conventional ultrasonic polishing process, an object to be polished is immersed in a polishing liquid mixed with an abrasive, and ultrasonic vibration is applied in a sealed state, and the flow of the abrasive is promoted by vibration of bubbles generated by cavitation. A method of polishing an object to be polished is known (see Patent Document 1).

上記従来技術は、図5に示すように、容器101内に被研磨物103を収容し、容器101内に研磨材を混入させた研磨用液体104を供給して被研磨物103が研磨用液体に浸された状態とする。この容器101の開口部をパッキン106を介して蓋体105で閉じ、締め具107によって蓋体105を容器101に密着させて容器101内を気密状態にする。次いで、空気圧力調整弁112を調整して空気圧縮機113から容器101内に空気を供給し、容器101内の圧力を所定値に高める。この状態で超音波発振器110を作動させると超音波振動子109が超音波振動し、研磨用液体104に超音波振動が伝わり、超音波の進行方向に直進流が発生する。更に、超音波振動に基づくキャビテーションの生成及び破裂による効果と、キャビテーションで生じた気泡の振動により被研磨物103の近傍に小さな流れが生じて研磨用液体104の流れが促進される。この構成によりキャビテーションが高いエネルギーで生成、破裂されるため被研磨物の表面研磨がなされる。   In the above prior art, as shown in FIG. 5, an object to be polished 103 is accommodated in a container 101, an abrasive liquid 104 mixed with an abrasive is supplied into the container 101, and the object to be polished 103 becomes an abrasive liquid. Soaked in water. The opening of the container 101 is closed with a lid 105 via a packing 106, and the lid 105 is brought into close contact with the container 101 with a fastener 107 to make the inside of the container 101 airtight. Next, the air pressure adjusting valve 112 is adjusted to supply air from the air compressor 113 into the container 101, and the pressure in the container 101 is increased to a predetermined value. When the ultrasonic oscillator 110 is operated in this state, the ultrasonic vibrator 109 vibrates ultrasonically, the ultrasonic vibration is transmitted to the polishing liquid 104, and a straight flow is generated in the traveling direction of the ultrasonic wave. Further, the flow of the polishing liquid 104 is promoted by the effect of the generation and bursting of cavitation based on ultrasonic vibration and the flow of bubbles generated by the cavitation to generate a small flow in the vicinity of the workpiece 103. With this configuration, since the cavitation is generated and ruptured with high energy, the surface of the object to be polished is polished.

また、被研磨物の凹部となっている部位を研磨するために、砥粒を含む液体を被研磨物の形状に合わせて固化もしくはゲル化させ、被研磨物との間に相対運動を与えて研磨する研磨方法が知られている(特許文献2参照)。   In addition, in order to polish the concave portion of the object to be polished, a liquid containing abrasive grains is solidified or gelled according to the shape of the object to be polished, and a relative motion is given to the object to be polished. A polishing method for polishing is known (see Patent Document 2).

図6に(1)〜(6)の順に示す手順のように、被研磨物204の被加工面204´内に所定量の磁性砥粒203を含有する磁性流体201を流し込み、加工面204´内を埋めた状態にする(1)。この被研磨物204を磁界発生手段205上に載せると、液体202内に混入された磁性砥粒203の配列や分布密度を制御することができる(2)。この状態で被研磨物204を低温環境下に置くことによって磁性砥粒203が(2)の状態に制御した状態で磁性流体201は凍結固化される(3)。次に、ヒータ206により被研磨物204を磁性流体201の融点を少し上回る程度に加熱し、磁性流体201の加工面204´との接触面を薄く融解させる(4)。固化している磁性流体201に固定手段207を打ち込み(5)、被研磨物204との間に相対運動を与えると(6)、被研磨物204の加工面204´が研磨される。
特開平02−030463号公報(第5〜6頁、図1) 特開平11−165252号公報(第4〜5頁、図1)
Like the procedure shown in the order of (1) to (6) in FIG. 6, a magnetic fluid 201 containing a predetermined amount of magnetic abrasive grains 203 is poured into the processed surface 204 ′ of the workpiece 204, and the processed surface 204 ′. The interior is filled (1). When this object 204 is placed on the magnetic field generating means 205, the arrangement and distribution density of the magnetic abrasive grains 203 mixed in the liquid 202 can be controlled (2). In this state, the magnetic fluid 201 is frozen and solidified with the magnetic abrasive grains 203 controlled to the state (2) by placing the workpiece 204 in a low temperature environment (3). Next, the workpiece 204 is heated by the heater 206 to a degree slightly higher than the melting point of the magnetic fluid 201, and the contact surface of the magnetic fluid 201 with the processed surface 204 'is melted thinly (4). When the fixing means 207 is driven into the solidified magnetic fluid 201 (5) and a relative motion is given to the workpiece 204 (6), the processed surface 204 ′ of the workpiece 204 is polished.
Japanese Patent Laid-Open No. 02-030463 (pages 5-6, FIG. 1) Japanese Patent Laid-Open No. 11-165252 (pages 4-5, FIG. 1)

しかしながら、特許文献1として開示された従来技術では、研磨用液体104に圧力を加えてもののキャビテーションの生成及び破裂のエネルギーを用いて研磨効果を得ているため、前加工で表面にうねりが残る。これは定盤に柔らかい布を貼り付けて研磨するラップ加工と似ており、見た目の光沢はよくなるが細かい凹凸は除去されず、表面が滑らかになるだけで超精密な表面粗さが得られない課題があった。   However, in the prior art disclosed as Patent Document 1, since the polishing effect is obtained by using the energy of cavitation generation and rupture even when pressure is applied to the polishing liquid 104, undulations remain on the surface in the pre-processing. This is similar to lapping with a soft cloth affixed to the surface plate, and the appearance is improved, but fine irregularities are not removed. There was a problem.

また、特許文献2として開示された従来技術では、微細な凹凸形状における凹部の底面や凸部の立ち上がり部分が研磨しがたく、被研磨物が複雑な形状になると、相対運動のストロークを小さくしなければならないので、研磨レートが遅くなる課題があった。また、三次元のストロークでは溝部底面のような形状のコーナーは他の部分に比して研磨し難くなるので、超精密研磨加工には適用できない課題があった。   Further, in the conventional technique disclosed as Patent Document 2, the bottom surface of the concave portion or the rising portion of the convex portion in the fine concave and convex shape is difficult to polish, and when the object to be polished has a complicated shape, the stroke of the relative motion is reduced. Therefore, there has been a problem that the polishing rate becomes slow. In addition, since a corner having a shape such as a groove bottom surface is difficult to polish in a three-dimensional stroke as compared with other portions, there is a problem that cannot be applied to ultra-precision polishing.

本発明が目的とするところは、複雑な形状を有する被研磨物の表面あるいは微細な凹凸形状が形成されている被研磨物の表面を短時間で超精密に研磨することを可能にする超音波研磨方法及びその装置を提供することにある。   An object of the present invention is to provide an ultrasonic wave that can polish a surface of an object having a complicated shape or a surface of an object having a fine concavo-convex shape in a short period of time with high precision. A polishing method and an apparatus therefor are provided.

上記目的を達成するために本願第1発明に係る超音波研磨方法は、容器内に所定粘度に調整された粘性流体を収容し、その上に前記粘性流体より粘度が低く研磨材が混合された研磨流体を注入し、前記研磨流体に研磨対象表面が接するようにして被研磨物を配して前記容器内を密閉し、一定の圧力を被研磨物、研磨流体及び粘性流体に加えた状態で被研磨物に超音波振動を印加して研磨流体により前記研磨対象表面を超音波研磨することを特徴とする。   In order to achieve the above object, the ultrasonic polishing method according to the first invention of the present application accommodates a viscous fluid adjusted to a predetermined viscosity in a container, and an abrasive having a viscosity lower than that of the viscous fluid is mixed thereon. Injecting the polishing fluid, placing the object to be polished so that the surface to be polished is in contact with the polishing fluid, sealing the inside of the container, and applying a certain pressure to the object to be polished, the polishing fluid and the viscous fluid Ultrasonic vibration is applied to the object to be polished, and the surface to be polished is ultrasonically polished with a polishing fluid.

上記研磨方法によれば、研磨流体に被研磨物の研磨対象表面が接した状態にして容器内の収容物を加圧しながら超音波振動が加えられるので、粘性流体と研磨対象表面との間に層状に介在する研磨流体に研磨対象表面が押し付けられ、研磨流体は研磨対象表面の複雑な形状部分や微細な凹凸形状部分にも侵入し、超音波振動が加えられることにより研磨流体が流動して研磨対象表面は研磨流体中の研磨材によって研磨される。   According to the above polishing method, since the ultrasonic vibration is applied while pressurizing the contents in the container in a state where the polishing target surface of the object to be polished is in contact with the polishing fluid, the polishing fluid is interposed between the viscous fluid and the polishing target surface. The polishing target surface is pressed against the layered polishing fluid, and the polishing fluid penetrates into the complicated shape portion or fine uneven shape portion of the polishing target surface, and ultrasonic vibration is applied to cause the polishing fluid to flow. The surface to be polished is polished by an abrasive in the polishing fluid.

上記研磨方法において、容器に温度制御された冷却水を循環させて研磨流体及び粘性流体の粘度を維持して超音波研磨することにより、粘度の変化による研磨流体が研磨対象表面から外れた部分に移動することがなく、層状に介在した状態を維持して超音波研磨を実施することができる。   In the above polishing method, the temperature-controlled cooling water is circulated in the container to maintain the viscosity of the polishing fluid and the viscous fluid, and ultrasonic polishing is performed, so that the polishing fluid due to the change in viscosity is removed from the surface to be polished. Ultrasonic polishing can be performed while maintaining the state of being interposed in layers without moving.

また、粘性流体と研磨流体との間を膜状体で仕切るようにして超音波研磨すると、研磨流体と粘性流体とが混合してしまうことを効果的に防止することができる。   In addition, when ultrasonic polishing is performed so that the viscous fluid and the polishing fluid are partitioned by a film-like body, mixing of the polishing fluid and the viscous fluid can be effectively prevented.

また、容器内に収容した粘性流体に被研磨物の研磨対象表面を押し付けて研磨対象表面の形状を転写し、形状転写された上に研磨流体を注入し、研磨流体上に被研磨物を配して超音波研磨すると、複雑な形状の研磨対象表面であっても研磨流体が全ての研磨対象表面に接することになり、均一な研磨状態に加工することができる。   In addition, the surface of the object to be polished is pressed against the viscous fluid stored in the container to transfer the shape of the surface to be polished, the shape is transferred, and then the polishing fluid is injected, and the object to be polished is arranged on the polishing fluid. Then, when ultrasonic polishing is performed, the polishing fluid comes into contact with all the polishing target surfaces even on the polishing target surface having a complicated shape, and can be processed into a uniform polishing state.

また、本願第2発明に係る超音波研磨装置は、所定粘度に調整された粘性流体、この前記粘性流体より粘度が低く研磨材が混合された研磨流体、この研磨流体に研磨対象表面が接するようにして配置される被研磨物の順に収容する容器と、この容器の開口部を閉じる蓋体と、前記容器内の収容物に所定圧力を加える加圧手段と、この加圧手段により加圧された状態で被研磨物に超音波振動を印加する超音波加振手段とを備えてなることを特徴とする。   The ultrasonic polishing apparatus according to the second invention of the present application is such that a viscous fluid adjusted to a predetermined viscosity, a polishing fluid having a lower viscosity than the viscous fluid and mixed with an abrasive, and a surface to be polished are in contact with the polishing fluid. A container for accommodating the objects to be polished arranged in this order, a lid for closing the opening of the container, a pressurizing means for applying a predetermined pressure to the contents in the container, and a pressure applied by the pressurizing means. And ultrasonic vibration means for applying ultrasonic vibration to the object to be polished.

上記構成によれば、研磨流体に被研磨物の研磨対象表面が接した状態にして加圧手段により容器内の収容物を加圧しながら超音波加振手段から超音波振動が加えられるので、粘性流体と研磨対象表面との間に層状に介在する研磨流体に研磨対象表面が押し付けられ、研磨流体は研磨対象表面の複雑な形状部分や微細な凹凸形状部分にも侵入し、超音波振動が加えられることにより研磨流体が流動して研磨対象表面は研磨流体中の研磨材によって研磨される。   According to the above configuration, since the ultrasonic vibration is applied from the ultrasonic vibration means while pressurizing the contents in the container with the pressurizing means with the polishing target surface in contact with the polishing fluid, the viscosity is The surface to be polished is pressed against the polishing fluid that is layered between the fluid and the surface to be polished, and the polishing fluid penetrates into the complicated shape portion or fine uneven shape portion of the surface to be polished, and ultrasonic vibration is applied. As a result, the polishing fluid flows and the surface to be polished is polished by the polishing material in the polishing fluid.

上記構成において、粘性流体及び研磨流体を所定温度に維持する冷却手段を設けることが望ましく、超音波振動によって粘性流体及び研磨流体が発熱し、粘度が変化することによって粘性流体上に層状に研磨流体が存在する状態が崩れることがない。   In the above configuration, it is desirable to provide a cooling means for maintaining the viscous fluid and the polishing fluid at a predetermined temperature. The viscous fluid and the polishing fluid generate heat due to ultrasonic vibration, and the viscosity is changed so that the polishing fluid is layered on the viscous fluid. The state where there is no collapse.

本発明によれば、研磨流体に被研磨物の研磨対象表面が接した状態にして加圧手段により容器内の収容物を加圧しながら超音波加振手段から超音波振動が加えられるので、研磨流体は研磨対象表面の複雑な形状部分や微細な凹凸形状部分にも侵入し、それらの部分も確実に研磨され、短時間で一様な研磨状態に仕上げられる。   According to the present invention, the ultrasonic vibration is applied from the ultrasonic vibration means while pressurizing the contents in the container by the pressurizing means with the surface to be polished being in contact with the polishing fluid. The fluid also penetrates into a complicated shape portion or a fine uneven shape portion on the surface to be polished, and these portions are also reliably polished and finished in a uniform polished state in a short time.

図1は、第1の実施形態に係る超音波研磨方法により被研磨物の表面を超音波研磨する超音波研磨装置の構成を示すものである。本装置を用いた超音波研磨方法の手順を以下に順を追って説明する。   FIG. 1 shows the configuration of an ultrasonic polishing apparatus that ultrasonically polishes the surface of an object to be polished by the ultrasonic polishing method according to the first embodiment. The procedure of the ultrasonic polishing method using this apparatus will be described below in order.

まず、図3に示すように、容器4内に粘性流体3を投入し、その上から被研磨物1をその研磨対象表面11が粘性流体3に接するように置き、容器4の開口部をパッキン8を設けた蓋体6で密閉し、超音波発振器7から延出する加圧棒10によって被研磨物1を粘性流体3に押し付け、粘性流体3に被研磨物1の研磨対象表面11の形状を転写する。この転写は、研磨対象表面11に形成された微細な形状まで転写する必要はなく、研磨対象表面11の概略形状が転写されればよいので、粘性流体3の粘度は高めに設定することが望ましい。   First, as shown in FIG. 3, the viscous fluid 3 is put into the container 4, and the object to be polished 1 is placed on the container 4 so that the surface 11 to be polished is in contact with the viscous fluid 3. The object to be polished 1 is pressed against the viscous fluid 3 by the pressure rod 10 extending from the ultrasonic oscillator 7, and the shape of the surface 11 to be polished of the object 1 to be polished is pressed against the viscous fluid 3. Transcript. This transfer does not need to be transferred to a fine shape formed on the surface 11 to be polished, and it is only necessary to transfer the general shape of the surface 11 to be polished. Therefore, it is desirable to set the viscosity of the viscous fluid 3 high. .

上記転写工程により粘性流体3に研磨対象表面11の形状を転写した後、蓋体6を開いて容器4内から被研磨物1を取り出し、粘性流体3の転写凹部内に研磨材を混合した研磨流体2を所定量注入する。前記研磨流体2の粘度は、粘性流体3の粘度より低く、研磨対象表面11に形成された微細な凹部に入り込むことができる粘度に設定される。   After the shape of the surface 11 to be polished is transferred to the viscous fluid 3 by the transfer step, the object 6 is removed from the container 4 by opening the lid 6, and the polishing material is mixed in the transfer recess of the viscous fluid 3. A predetermined amount of fluid 2 is injected. The viscosity of the polishing fluid 2 is set to a viscosity that is lower than the viscosity of the viscous fluid 3 and can enter a fine recess formed in the surface 11 to be polished.

次いで、被研磨物1の研磨対象表面11が研磨流体2に接触するようにして容器4内に戻し、容器4の開口部を蓋体6で閉じ、超音波発振器7の加圧棒(加圧手段)10によって被研磨物1を研磨流体2に押し付けることにより、図1に示すように、被研磨物1の研磨対象表面11と粘性流体3との間に研磨流体2が層となって介在する状態が得られる。研磨流体2は研磨対象表面11に形成された微細な凹部にも入り込んで研磨対象表面11の全体に接触した状態となる。   Next, the surface 11 to be polished of the workpiece 1 is returned to the container 4 so as to be in contact with the polishing fluid 2, the opening of the container 4 is closed with the lid body 6, and the pressure bar (pressurization) of the ultrasonic oscillator 7 is closed. 1) By pressing the object 1 to be polished against the polishing fluid 2 by the means 10, the polishing fluid 2 forms a layer between the surface 11 to be polished of the object 1 and the viscous fluid 3 as shown in FIG. The state to do is obtained. The polishing fluid 2 enters a fine recess formed on the surface 11 to be polished, and comes into contact with the entire surface 11 to be polished.

図1に示す状態で超音波発振器7から振動子(超音波加振手段)12を励起して超音波振動を被研磨物1に加えると、超音波振動により研磨流体2が粘性流体3と研磨対象表面11との間で流動するので、研磨流体2に混合された研磨材により研磨対象表面11が研磨される。このとき、超音波振動の振幅方向を制御すると研磨方向を変更することができるので、研磨対象表面11を研削加工する場合では、図4に示すように、研削筋と交差する方向に超音波振動の振幅方向を変更すると、研削筋の除去が容易であり、表面粗さの向上が図りやすく、研磨速度の向上も図ることができる。   In the state shown in FIG. 1, when the vibrator (ultrasonic vibration means) 12 is excited from the ultrasonic oscillator 7 and ultrasonic vibration is applied to the workpiece 1, the polishing fluid 2 is polished with the viscous fluid 3 by the ultrasonic vibration. Since it flows between the target surface 11, the polishing target surface 11 is polished by the abrasive mixed with the polishing fluid 2. At this time, since the polishing direction can be changed by controlling the amplitude direction of the ultrasonic vibration, when the surface 11 to be polished is ground, as shown in FIG. If the amplitude direction is changed, it is easy to remove the grinding streaks, the surface roughness can be easily improved, and the polishing rate can be improved.

尚、研磨加工中においては、超音波振動によって研磨流体3や粘性流体3が発熱するので、温度制御装置(冷却手段)9によって一定温度に制御された冷却水を容器4内に循環させることにより、研磨流体2及び粘性流体3の粘度が温度上昇によって変化しないように制御することができる。   During the polishing process, since the polishing fluid 3 and the viscous fluid 3 generate heat due to the ultrasonic vibration, the cooling water controlled at a constant temperature by the temperature control device (cooling means) 9 is circulated in the container 4. The viscosity of the polishing fluid 2 and the viscous fluid 3 can be controlled so as not to change due to a temperature rise.

図2は、第2の実施形態に係る超音波研磨装置の構成を示すもので、研磨流体2と粘性流体3との間にフィルム(膜状体)14を介在させて研磨流体2と粘性流体3とが混合しないようにした構成である。他の構成は上述した第1の実施形態の構成を同一であり、共通する構成要素には同一の符号を付し、その説明は省略する。   FIG. 2 shows the configuration of an ultrasonic polishing apparatus according to the second embodiment. A film (film-like body) 14 is interposed between the polishing fluid 2 and the viscous fluid 3, and the polishing fluid 2 and the viscous fluid. 3 is not mixed. Other configurations are the same as those of the first embodiment described above, and common components are denoted by the same reference numerals, and description thereof is omitted.

本構成においては、図3に示したように、容器4内に投入した粘性流体3に被研磨物1の研磨対象表面11の形状を転写した後、形状が転写された粘性流体3の表面に極薄のフィルム14を置き、その上に研磨流体2を一定量注入する。前記フィルム14は、ゴム状材料のような極薄の弾性体を使用することもできる。   In this configuration, as shown in FIG. 3, after the shape of the surface 11 to be polished of the workpiece 1 is transferred to the viscous fluid 3 put into the container 4, the shape is transferred to the surface of the viscous fluid 3 to which the shape is transferred. An ultrathin film 14 is placed, and a certain amount of polishing fluid 2 is injected thereon. The film 14 may be an extremely thin elastic body such as a rubber-like material.

以上の説明の通り本発明によれば、複雑な形状や微細な凹凸形状が形成された表面の研磨加工を超精密に行うことができ、光学デバイスあるいは精密成形金型などの研磨加工に適用して有効なものとなる。   As described above, according to the present invention, it is possible to perform ultra-precision polishing of a surface on which a complicated shape or a fine uneven shape is formed, and it can be applied to polishing of an optical device or a precision molding die. And effective.

第1の実施形態に係る超音波研磨装置の構成を示す断面図。Sectional drawing which shows the structure of the ultrasonic polishing apparatus which concerns on 1st Embodiment. 第2の実施形態に係る超音波研磨装置の構成を示す断面図。Sectional drawing which shows the structure of the ultrasonic polishing apparatus which concerns on 2nd Embodiment. 被研磨物の研磨対象表面を転写する工程を説明する断面図。Sectional drawing explaining the process of transferring the grinding | polishing target surface of a to-be-polished object. 超音波振動の振幅方向と研磨方向との関係を示す図。The figure which shows the relationship between the amplitude direction of ultrasonic vibration, and a grinding | polishing direction. 従来技術に係る超音波研磨装置の構成を示す断面図。Sectional drawing which shows the structure of the ultrasonic polishing apparatus which concerns on a prior art. 従来技術に係る研磨方法の手順を順を追って示す模式図。The schematic diagram which shows the procedure of the grinding | polishing method which concerns on a prior art later on.

符号の説明Explanation of symbols

1 被研磨物
2 研磨流体
3 粘性流体
4 容器
6 蓋体
7 超音波発振器
9 温度制御装置(冷却手段)
10 加圧棒(加圧手段)
11 研磨対象表面
12 振動子(超音波加振手段)
14 フィルム(膜状体)
DESCRIPTION OF SYMBOLS 1 To-be-polished object 2 Polishing fluid 3 Viscous fluid 4 Container 6 Lid body 7 Ultrasonic oscillator 9 Temperature control apparatus (cooling means)
10 Pressurizing rod (Pressurizing means)
11 Surface to be polished 12 Vibrator (Ultrasonic vibration means)
14 Film (Membrane)

Claims (6)

容器内に所定粘度に調整された粘性流体を収容し、その上に前記粘性流体より粘度が低く研磨材が混合された研磨流体を注入し、前記研磨流体に研磨対象表面が接するようにして被研磨物を配して前記容器内を密閉し、一定の圧力を被研磨物、研磨流体及び粘性流体に加えた状態で被研磨物に超音波振動を印加して研磨流体により前記研磨対象表面を超音波研磨することを特徴とする超音波研磨方法。 A viscous fluid adjusted to a predetermined viscosity is contained in a container, and a polishing fluid having a viscosity lower than that of the viscous fluid and mixed with an abrasive is injected onto the container, and the surface to be polished is in contact with the polishing fluid. A polishing object is arranged to seal the inside of the container, and ultrasonic vibration is applied to the object to be polished in a state where a certain pressure is applied to the object to be polished, the polishing fluid and the viscous fluid, and the surface to be polished is polished by the polishing fluid. An ultrasonic polishing method comprising performing ultrasonic polishing. 容器に温度制御された冷却水を循環させて研磨流体及び粘性流体の粘度を維持して超音波研磨する請求項1に記載の超音波研磨方法。 The ultrasonic polishing method according to claim 1, wherein ultrasonic polishing is performed by circulating cooling water whose temperature is controlled in the container to maintain the viscosity of the polishing fluid and the viscous fluid. 粘性流体と研磨流体との間を膜状体で仕切るようにした請求項1又は2に記載の超音波研磨方法。 The ultrasonic polishing method according to claim 1, wherein the viscous fluid and the polishing fluid are partitioned by a film-like body. 容器内に収容した粘性流体に被研磨物の研磨対象表面を押し付けて研磨対象表面の形状を転写し、形状転写された上に研磨流体を注入し、研磨流体上に被研磨物を配する請求項1〜3いずれか一項に記載の超音波研磨方法。 Claim: The surface of the object to be polished is pressed against the viscous fluid stored in the container to transfer the shape of the surface to be polished, the shape is transferred, the polishing fluid is injected, and the object to be polished is disposed on the polishing fluid. Item 4. The ultrasonic polishing method according to any one of Items 1 to 3. 所定粘度に調整された粘性流体、この前記粘性流体より粘度が低く研磨材が混合された研磨流体、この研磨流体に研磨対象表面が接するようにして配置される被研磨物の順に収容する容器と、この容器の開口部を閉じる蓋体と、前記容器内の収容物に所定圧力を加える加圧手段と、この加圧手段により加圧された状態で被研磨物に超音波振動を印加する超音波加振手段とを備えてなることを特徴とする超音波研磨装置。 A container containing in order of a viscous fluid adjusted to a predetermined viscosity, a polishing fluid having a lower viscosity than the viscous fluid and mixed with an abrasive, and an object to be polished arranged so that the surface to be polished is in contact with the polishing fluid; A lid that closes the opening of the container; a pressurizing unit that applies a predetermined pressure to the contents in the container; and an ultrasonic wave that applies ultrasonic vibration to the object to be polished while being pressurized by the pressurizing unit. An ultrasonic polishing apparatus comprising a sonic excitation means. 粘性流体及び研磨流体を所定温度に維持する冷却手段が設けられてなる請求項5に記載の超音波研磨装置。   The ultrasonic polishing apparatus according to claim 5, further comprising a cooling unit that maintains the viscous fluid and the polishing fluid at a predetermined temperature.
JP2004023722A 2004-01-30 2004-01-30 Ultrasonic polishing method and its device Pending JP2005212067A (en)

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
JP2011501063A (en) * 2007-10-18 2011-01-06 リガク イノベイティブ テクノロジーズ インコーポレイテッド Magnetic fluid seal manufacturing method with precise control of fluid quantity at each sealing stage, and magnetic fluid seal
CN104786153A (en) * 2015-02-03 2015-07-22 浙江工业大学 Reverse ultrasonic assisted gas-liquid-solid three-phase abrasive particle flow polishing processing method and device
CN104786156A (en) * 2015-02-03 2015-07-22 浙江工业大学 Ultrasonic assisted three-phase abrasive particle flow polishing processing method and device
CN104972404A (en) * 2015-02-03 2015-10-14 浙江工业大学 Flow polishing device for manufacturing ultrasmooth surfaces by gas-liquid-solid abrasive flow
JP2016145927A (en) * 2015-02-09 2016-08-12 Hoya株式会社 Method for manufacturing mask blank substrate, method for manufacturing substrate having multilayer film, method for manufacturing mask blank, and method for manufacturing transfer mask
CN110724803A (en) * 2019-10-25 2020-01-24 中国科学院宁波材料技术与工程研究所 Ultrasonic cavitation shot blasting method and device using same
CN114952444A (en) * 2022-05-20 2022-08-30 广州大学 Cooling device and method for ultrasonic reinforced grinding processing equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011501063A (en) * 2007-10-18 2011-01-06 リガク イノベイティブ テクノロジーズ インコーポレイテッド Magnetic fluid seal manufacturing method with precise control of fluid quantity at each sealing stage, and magnetic fluid seal
CN104786153A (en) * 2015-02-03 2015-07-22 浙江工业大学 Reverse ultrasonic assisted gas-liquid-solid three-phase abrasive particle flow polishing processing method and device
CN104786156A (en) * 2015-02-03 2015-07-22 浙江工业大学 Ultrasonic assisted three-phase abrasive particle flow polishing processing method and device
CN104972404A (en) * 2015-02-03 2015-10-14 浙江工业大学 Flow polishing device for manufacturing ultrasmooth surfaces by gas-liquid-solid abrasive flow
JP2016145927A (en) * 2015-02-09 2016-08-12 Hoya株式会社 Method for manufacturing mask blank substrate, method for manufacturing substrate having multilayer film, method for manufacturing mask blank, and method for manufacturing transfer mask
CN110724803A (en) * 2019-10-25 2020-01-24 中国科学院宁波材料技术与工程研究所 Ultrasonic cavitation shot blasting method and device using same
CN110724803B (en) * 2019-10-25 2021-06-22 中国科学院宁波材料技术与工程研究所 Ultrasonic cavitation shot blasting method and device using same
CN114952444A (en) * 2022-05-20 2022-08-30 广州大学 Cooling device and method for ultrasonic reinforced grinding processing equipment

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