JP2005209790A - Electronic device package - Google Patents

Electronic device package Download PDF

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JP2005209790A
JP2005209790A JP2004013073A JP2004013073A JP2005209790A JP 2005209790 A JP2005209790 A JP 2005209790A JP 2004013073 A JP2004013073 A JP 2004013073A JP 2004013073 A JP2004013073 A JP 2004013073A JP 2005209790 A JP2005209790 A JP 2005209790A
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electronic device
substrate
adhesive layer
adhesive
sealing member
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JP4361379B2 (en
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Sayaka Hirafune
さやか 平船
Tatsuo Suemasu
龍夫 末益
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Fujikura Ltd
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Fujikura Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device package which has a high air-tightness and the constant thickness of an adhesive layer and relaxes external stresses on the adhesive layer. <P>SOLUTION: The electronic device package 40 comprises a substrate 11, an electronic device 12 provided on one surface 11a of the substrate 11, and a seal member 30 fixed through an adhesive layer 20 to the substrate 11 so as to cover the electronic device 12 with leaving a space 41 between the electronic device 12 and the seal member 30. The adhesive layer 20 is formed with an adhesive 21 having a water absorption ratio of 1% or less and many grains 22 having a substantially uniform grain size, and the content of the grains 22 in the adhesive layer 20 is 70 vol.% or less. The thermal expansion coefficient of the grain 22 is a median value between the thermal expansion coefficients of the substrate 11 and the seal member 30 or nearer either of both. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電子デバイスを外部環境から保護するための封止部材が、接着剤層を介して所定の固定面に固定され、電子デバイスと封止部材との間に空隙が設けられてなる電子デバイスパッケージに関するものである。   The present invention provides an electronic device in which a sealing member for protecting an electronic device from the external environment is fixed to a predetermined fixing surface via an adhesive layer, and a gap is provided between the electronic device and the sealing member. It relates to device packages.

電子デバイスは、一般的な半導体デバイスと同様に、外部環境からの保護を目的として、パッケージングされた状態で使用されている。   Similar to general semiconductor devices, electronic devices are used in a packaged state for the purpose of protection from the external environment.

電子デバイスのパッケージングでは、カバーガラスなどの封止部材が、電子デバイスを覆うように配され、接着剤を介して電子デバイスの設けられた基板に固定されている（例えば、特許文献１参照。）。
電子デバイスによっては、各種センサなどの感応部を備えているものがある。そのため、感度を劣化させることなく、電子デバイスを正常に機能させるためには、この感応部の湿気などによる機能低下を防止するために、電子デバイスのパッケージは気密性の高い構造である必要がある。 In packaging of an electronic device, a sealing member such as a cover glass is disposed so as to cover the electronic device, and is fixed to a substrate provided with the electronic device via an adhesive (see, for example, Patent Document 1). ).
Some electronic devices include sensitive parts such as various sensors. Therefore, in order to allow the electronic device to function normally without degrading the sensitivity, the package of the electronic device needs to have a highly airtight structure in order to prevent a functional deterioration due to moisture or the like of the sensitive portion. .

また、感応部の感度を劣化させることなく、電子デバイスを正常に機能させるためには、電子デバイスと封止部材との間には空隙が必要となる場合がある。この場合、感応部の感度を劣化させないためには、空隙の大きさがパッケージの全域において均一、すなわち、電子デバイスと封止部材との距離が常に一定でなければならない。   Moreover, in order to make an electronic device function normally without deteriorating the sensitivity of a sensitive part, a space | gap may be needed between an electronic device and a sealing member. In this case, in order not to deteriorate the sensitivity of the sensitive part, the size of the air gap must be uniform throughout the package, that is, the distance between the electronic device and the sealing member must always be constant.

しかしながら、半導体パッケージなどで、半導体デバイスを封止するために一般的に用いられる接着剤の中には透湿性の高いものがある。このような透湿性の高い接着剤を用いて電子デバイスのパッケージを作製すると、電子デバイスの機能が劣化するおそれがあった。   However, some adhesives commonly used for sealing semiconductor devices in semiconductor packages and the like have high moisture permeability. When an electronic device package is manufactured using such a highly moisture-permeable adhesive, the function of the electronic device may be deteriorated.

また、接着剤を介して、電子デバイスの設けられた基板と封止部材とを固定する際、接着剤の存在する領域には、熱および荷重が加えられる。すると、接着剤が変形し、そのままの状態で硬化してしまうので、電子デバイスと封止部材との距離（空隙の大きさ）を所定の大きさにすることができなかった。   Moreover, when fixing the board | substrate with which the electronic device was provided, and the sealing member via an adhesive agent, a heat | fever and a load are applied to the area | region where an adhesive agent exists. As a result, the adhesive is deformed and is cured as it is, so that the distance between the electronic device and the sealing member (the size of the gap) cannot be set to a predetermined size.

さらに、接着剤、基板、封止部材はそれぞれ材質が異なるから、これらの熱膨張係数も異なる。そのため、温度変化のある環境下では、これらの熱膨張率の格差により生じた応力により、基板、封止部材、電子デバイスなどに亀裂が生じて、使用できなくなることがあった。
特開平７−２０２１５２号公報 Furthermore, since the adhesive, the substrate, and the sealing member are made of different materials, their thermal expansion coefficients are also different. For this reason, in an environment where the temperature changes, the stress generated by the difference in the thermal expansion coefficient may cause cracks in the substrate, the sealing member, the electronic device, and the like, which may make it unusable.
JP-A-7-202152

本発明は、前記事情に鑑みてなされたもので、気密性が高く、接着剤層の厚みが一定で、かつ、接着剤層において、外部応力を緩和することのできる電子デバイスパッケージを提供することを目的とする。   The present invention has been made in view of the above circumstances, and provides an electronic device package that is highly airtight, has a constant thickness of an adhesive layer, and can relieve external stress in the adhesive layer. With the goal.

本発明は、上記課題を解決するために、基板と、該基板の一方の面に設けられた電子デバイスと、該電子デバイスを覆うように配され、接着剤層を介して前記基板に固定された封止部材とを備え、前記電子デバイスと前記封止部材との間に空隙が設けられてなる電子デバイスパッケージであって、前記接着剤層は、接着剤と、実質的に均一な粒径の多数の粒子とからなる電子デバイスパッケージを提供する。   In order to solve the above problems, the present invention is arranged to cover a substrate, an electronic device provided on one surface of the substrate, and to cover the electronic device, and is fixed to the substrate via an adhesive layer. An electronic device package having a gap between the electronic device and the sealing member, wherein the adhesive layer has an adhesive and a substantially uniform particle size. An electronic device package comprising a large number of particles is provided.

上記構成の電子デバイスパッケージにおいて、前記電子デバイスは、固体撮像素子であることが好ましい。   In the electronic device package having the above configuration, the electronic device is preferably a solid-state imaging element.

上記構成の電子デバイスパッケージにおいて、前記接着剤層における前記粒子の含有量は７０体積％以下であることが好ましい。   In the electronic device package having the above configuration, the content of the particles in the adhesive layer is preferably 70% by volume or less.

上記構成の電子デバイスパッケージにおいて、前記粒子の熱膨張係数は、前記基板の熱膨張係数と前記封止部材の熱膨張係数との中間の値、または、両者のどちらか一方に近い値であることが好ましい。   In the electronic device package having the above-described configuration, the thermal expansion coefficient of the particles is an intermediate value between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the sealing member, or a value close to one of both. Is preferred.

本発明の電子デバイスパッケージは、接着剤と、実質的に均一な粒径の多数の粒子とからなる接着剤層を介して、電子デバイスが設けられた基板に封止部材が固定されているから、電子デバイスパッケージの気密性が十分に確保され、湿気によって電子デバイスの機能が劣化するのを防止することができる。また、接着剤層に含まれる粒子によって、電子デバイスと封止部材との距離が一定に保たれ、両者の間に空隙が形成されるから、電子デバイスがイメージセンサなどである場合、その機能が損なわれることなく、十分に発揮される。また、接着剤と、基板および封止部材との接着面積が小さくなるので、接着剤層は、封止部材からの外部応力を電子デバイス側に直接伝えない応力緩和機能を発揮することができる。   In the electronic device package of the present invention, the sealing member is fixed to the substrate on which the electronic device is provided via an adhesive layer composed of an adhesive and a large number of particles having a substantially uniform particle size. The airtightness of the electronic device package is sufficiently ensured, and the function of the electronic device can be prevented from being deteriorated by moisture. Moreover, since the distance between the electronic device and the sealing member is kept constant by the particles contained in the adhesive layer, and a gap is formed between the two, the function of the electronic device is an image sensor or the like. It is fully demonstrated without being damaged. In addition, since the adhesive area between the adhesive, the substrate, and the sealing member is reduced, the adhesive layer can exhibit a stress relaxation function that does not directly transmit external stress from the sealing member to the electronic device side.

また、接着剤層における粒子の含有量を７０体積％以下とすれば、電子デバイスパッケージの気密性を損なうことなく、電子デバイスと封止部材との距離を一定に保つことができる。   Moreover, if the content of the particles in the adhesive layer is 70% by volume or less, the distance between the electronic device and the sealing member can be kept constant without impairing the airtightness of the electronic device package.

また、接着剤層における粒子の粒子の熱膨張係数を、基板の熱膨張係数と封止部材の熱膨張係数との中間の値、または、両者のどちらか一方に近い値とすることにより、温度変化のある環境下においても、熱膨張係数の格差により生じた応力により、基板、電子デバイス、封止部材などに亀裂が生じるのを防止することができる。   In addition, by setting the thermal expansion coefficient of the particles in the adhesive layer to an intermediate value between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the sealing member, or a value close to one of the two, Even in a changing environment, it is possible to prevent the substrate, the electronic device, the sealing member, and the like from being cracked due to the stress caused by the difference in thermal expansion coefficient.

以下、本発明を実施した電子デバイスパッケージについて、図面を参照して説明する。   Hereinafter, an electronic device package embodying the present invention will be described with reference to the drawings.

図１は、本発明に係る電子デバイスパッケージの一実施形態を示す概略断面図である。図２は、図１中の符号Ａで示す領域を拡大した概略断面図である。
図１、２中、符号１１は基板、１２は電子デバイス、２０は接着剤層、２１は接着剤、２２は粒子、３０は封止部材、４０は電子デバイスパッケージ、４１は空隙をそれぞれ示している。 FIG. 1 is a schematic cross-sectional view showing an embodiment of an electronic device package according to the present invention. FIG. 2 is an enlarged schematic cross-sectional view of a region indicated by a symbol A in FIG.
1 and 2, reference numeral 11 denotes a substrate, 12 denotes an electronic device, 20 denotes an adhesive layer, 21 denotes an adhesive, 22 denotes particles, 30 denotes a sealing member, 40 denotes an electronic device package, and 41 denotes a gap. Yes.

この実施形態において、電子デバイスパッケージ４０は、基板１１と、基板１１の一方の面１１ａに設けられた電子デバイス１２と、接着剤層２０と、封止部材３０とから概略構成されている。   In this embodiment, the electronic device package 40 is schematically configured from a substrate 11, an electronic device 12 provided on one surface 11 a of the substrate 11, an adhesive layer 20, and a sealing member 30.

電子デバイスパッケージ４０では、電子デバイス１２を覆うように配された封止部材３０が、接着剤層２０を介して基板１１の一方の面１１ａにおける電子デバイス１２が設けられていない部分に固定されている。また、接着剤層２０には実質的に均一な粒径をなす多数の球状の粒子２２が含まれており、この粒子２２が基板１１および封止部材３０に当接するように接着剤層２０を設けることにより、電子デバイス１２と封止部材３０との距離が一定に保たれ、両者の間に空隙４１が設けられている。   In the electronic device package 40, the sealing member 30 disposed so as to cover the electronic device 12 is fixed to a portion of the one surface 11 a of the substrate 11 where the electronic device 12 is not provided via the adhesive layer 20. Yes. The adhesive layer 20 includes a large number of spherical particles 22 having a substantially uniform particle diameter, and the adhesive layer 20 is formed so that the particles 22 come into contact with the substrate 11 and the sealing member 30. By providing, the distance between the electronic device 12 and the sealing member 30 is kept constant, and a gap 41 is provided between them.

基板１１としては、特に限定されず、これに設けられる電子デバイス１２の機能や材質に適合させて選択され、その材質もプラスチック、金属、セラミックスなどから適宜選択される。   The substrate 11 is not particularly limited and is selected according to the function and material of the electronic device 12 provided on the substrate 11, and the material is appropriately selected from plastic, metal, ceramics, and the like.

電子デバイス１２としては、ＭＥＭＳ（Ｍｉｃｒｏ Ｅｌｅｃｔｒｏ Ｍｅｃｈａｎｉｃａｌ Ｓｙｓｔｅｍ；微小電子機械システム）デバイス、一般的な半導体デバイスなどが適用される。具体的には、電子デバイス１２としては、ＣＣＤイメージセンサやＣＭＯＳイメージセンサなどの固体撮像素子、半導体圧力センサ、ＬＳＩ、ＩＣ、メモリ、発光素子、受光素子などの半導体素子、それらの半導体素子を搭載した電子回路、電子回路基板、固体撮像素子や半導体圧力センサ以外の各種センサと必要な検出回路を備えたセンサチップなどの各種電子デバイス、可動部を有する各種電子デバイスを適用することができる。   As the electronic device 12, a MEMS (Micro Electro Mechanical System) device, a general semiconductor device, or the like is applied. Specifically, as the electronic device 12, a solid-state imaging device such as a CCD image sensor or a CMOS image sensor, a semiconductor pressure sensor, a semiconductor device such as an LSI, an IC, a memory, a light emitting device, a light receiving device, or the like is mounted. Various electronic devices such as an electronic circuit, an electronic circuit board, various sensors other than a solid-state imaging device and a semiconductor pressure sensor, and a sensor chip including a necessary detection circuit, and various electronic devices having a movable portion can be applied.

接着剤層２０は、接着剤２１と多数の粒子２２とから構成されており、接着剤２１が硬化されて形成されている。粒子２２は、電子デバイス１２と封止部材３０との距離を一定に保つために用いられるが、接着剤２１に粒子２２を配合することにより、接着剤２１と、基板１１および封止部材３０との接着面積が小さくなるので、接着剤層２０は、封止部材３０からの外部応力を電子デバイス１２側に直接伝えない応力緩和機能を発揮することができる。   The adhesive layer 20 is composed of an adhesive 21 and a large number of particles 22, and is formed by curing the adhesive 21. The particles 22 are used to keep the distance between the electronic device 12 and the sealing member 30 constant. By blending the particles 22 with the adhesive 21, the adhesive 21, the substrate 11, and the sealing member 30 Therefore, the adhesive layer 20 can exhibit a stress relaxation function that does not directly transmit external stress from the sealing member 30 to the electronic device 12 side.

接着剤層２０における粒子２２の含有量は、７０体積％以下であることが好ましく、１０体積％以上７０体積％以下であることがより好ましい。接着剤層２０における粒子２２の含有量が７０体積％を超えると、接着剤層２０における粒子２２の占める割合が多くなり過ぎて、接着剤２１と、基板１１および封止部材３０との接触面積が小さくなり過ぎる。その結果として、電子デバイスパッケージ４０の気密性が損なわれる。また、接着剤層２０の厚さを球状の粒子２２の粒径で正確に調節するために、接着剤層２０中で粒子２２が多段に積層されることなく一段で存在していなければならない。したがって、接着剤層２０における粒子２２の含有量が７０体積％を超えると、粒子２２が塊を生じ易く、基板１１と封止部材３０との間に一段の粒子２２が並んだ状態にならないおそれがある。   The content of the particles 22 in the adhesive layer 20 is preferably 70% by volume or less, and more preferably 10% by volume or more and 70% by volume or less. When the content of the particles 22 in the adhesive layer 20 exceeds 70% by volume, the proportion of the particles 22 in the adhesive layer 20 is excessive, and the contact area between the adhesive 21 and the substrate 11 and the sealing member 30 is increased. Becomes too small. As a result, the airtightness of the electronic device package 40 is impaired. Further, in order to accurately adjust the thickness of the adhesive layer 20 with the particle size of the spherical particles 22, the particles 22 must be present in a single stage without being stacked in multiple stages in the adhesive layer 20. Therefore, when the content of the particles 22 in the adhesive layer 20 exceeds 70% by volume, the particles 22 are likely to be agglomerated, and there is a possibility that the one-stage particles 22 are not arranged between the substrate 11 and the sealing member 30. There is.

接着剤２１としては、電子デバイスパッケージ４０の気密性を十分に確保し、湿気によって電子デバイス１２の機能が劣化することを防止するために、吸水率が低い接着剤が好ましく、吸水率が１％（質量比）以下の接着剤がより好ましい。本発明では、接着剤の吸水率は、ＡＳＴＭ Ｄ５７０に準じて測定される。なお、吸水率が大きい接着剤を用いると、電子デバイスパッケージ４０の気密性が損なわれ、接着剤層２０を透過して空隙４１内に浸入してきた湿気によって電子デバイス１２の機能が劣化するおそれがある。   As the adhesive 21, an adhesive having a low water absorption rate is preferable in order to ensure sufficient airtightness of the electronic device package 40 and prevent the function of the electronic device 12 from being deteriorated by moisture, and the water absorption rate is 1%. (Mass ratio) The following adhesives are more preferable. In the present invention, the water absorption rate of the adhesive is measured according to ASTM D570. If an adhesive having a high water absorption rate is used, the airtightness of the electronic device package 40 is impaired, and the function of the electronic device 12 may be deteriorated by moisture that has permeated the adhesive layer 20 and entered the gap 41. is there.

接着剤２１としては、例えば、ポリイミド樹脂接着剤、エポキシ樹脂接着剤、シアノアクリレート系接着剤、ホットメルト型接着剤などの各種の接着剤が挙げられるが、これらの中でも、吸水率が非常に低いことや取扱い易さなどの点からポリイミド樹脂接着剤が好ましい。   Examples of the adhesive 21 include various adhesives such as a polyimide resin adhesive, an epoxy resin adhesive, a cyanoacrylate adhesive, and a hot melt adhesive. Among these, the water absorption is very low. A polyimide resin adhesive is preferable from the viewpoints of handling and ease of handling.

粒子２２としては、金属の粒、セラミックス、ガラスなどの無機材料ビーズ、またはポリスチレンビーズ、ポリエチレンビーズなどの合成樹脂ビーズが好適に用いられる。粒子２２の形状は、球状に限定されないが、この球状粒子１４と電子デバイス１１側の面、および球状粒子１４と固定面１３とが点接触状態で接する構造を実現できることから、球状とするのが好ましい。   As the particles 22, inorganic particles such as metal particles, ceramics and glass, or synthetic resin beads such as polystyrene beads and polyethylene beads are preferably used. The shape of the particle 22 is not limited to a spherical shape, but it is possible to realize a structure in which the spherical particle 14 and the surface on the electronic device 11 side and the spherical particle 14 and the fixed surface 13 are in contact with each other in a point contact state. preferable.

この粒子２２の粒径は、電子デバイス１２と封止部材３０との距離が一定に保たれ、両者の間に空隙４１が形成されるように、また、接着剤層２０が封止部材３０からの外部応力を電子デバイス１２側に直接伝えない応力緩和機能を発揮するために、接着剤層２０が十分な厚さとなるように設定されており、通常は５μｍ以上、好ましくは１０μｍ〜１００μｍ程度とされる。  The particle size of the particles 22 is such that the distance between the electronic device 12 and the sealing member 30 is kept constant, and a gap 41 is formed between them, and the adhesive layer 20 is separated from the sealing member 30. In order to exhibit a stress relaxation function that does not directly transmit the external stress to the electronic device 12 side, the adhesive layer 20 is set to have a sufficient thickness, and is usually 5 μm or more, preferably about 10 μm to 100 μm. Is done.

また、粒子２２の熱膨張係数（１０−６／Ｋ）は、電子デバイス１２が設けられている基板１１の熱膨張係数と、封止部材３０の熱膨張係数との中間の値、または、両者のどちらか一方に近い値であることが好ましい。粒子２２の熱膨張係数がこのような値であれば、温度変化のある環境下においても、熱膨張係数の格差により生じた応力により、基板１１、電子デバイス１２、封止部材３０などに亀裂が生じるのを防止することができる。 The thermal expansion coefficient (10 −6 / K) of the particles 22 is an intermediate value between the thermal expansion coefficient of the substrate 11 on which the electronic device 12 is provided and the thermal expansion coefficient of the sealing member 30, or both. It is preferable that it is a value close | similar to either one of these. If the thermal expansion coefficient of the particles 22 is such a value, cracks may occur in the substrate 11, the electronic device 12, the sealing member 30, and the like due to the stress caused by the difference in thermal expansion coefficient even in an environment with temperature changes. It can be prevented from occurring.

封止部材３０としては、基板１１との接合時温度における熱膨張係数が基板１１に近い部材を選択することが望ましい。具体的には、パイレックス（登録商標）ガラス、あるいは、液晶基板に一般的に用いられるガラス基板などが好適である。また、電子デバイス１２が、イメージセンサなどの光学特性が要求されるものである場合には、封止部材３０は電子デバイス１２の感度波長域、すなわち有効波長域に対して十分実用的な透過率を有する材料からなるものが用いられる。  As the sealing member 30, it is desirable to select a member having a coefficient of thermal expansion close to that of the substrate 11 at the bonding temperature with the substrate 11. Specifically, Pyrex (registered trademark) glass or a glass substrate generally used for a liquid crystal substrate is suitable. When the electronic device 12 is required to have optical characteristics such as an image sensor, the sealing member 30 has a sufficiently practical transmittance with respect to the sensitivity wavelength region of the electronic device 12, that is, the effective wavelength region. What consists of material which has is used.

また、空隙４１の大きさは、電子デバイス１２の機能に応じて適宜設定されるが、その大きさ（厚み）は、粒子２２の大きさによって決定される。  The size of the void 41 is appropriately set according to the function of the electronic device 12, but the size (thickness) is determined by the size of the particles 22.

次に、図１および図２を用いて、本発明に係る電子デバイスパッケージの製造方法の一例について説明する。
先ず、電子デバイス１２が一方の面１１ａに設けられた基板１１を用意する。
次いで、接着剤層２０を形成するための材料、すなわち接着剤２１と粒子２２を用意する。 Next, an example of a method for manufacturing an electronic device package according to the present invention will be described with reference to FIGS.
First, the board | substrate 11 with which the electronic device 12 was provided in the one surface 11a is prepared.
Next, a material for forming the adhesive layer 20, that is, an adhesive 21 and particles 22 are prepared.

次いで、接着剤２１に、所定量の粒子２２を混合する。
なお、通常、接着剤２１と粒子２２の混合は、基板１１または封止部材３０に塗布する直前になされるが、接着剤２１と粒子２２とが予め混合されている材料を用いてもよい。例えば、接着剤２１として、反応（架橋反応）硬化型の接着剤を用いる場合、接着剤２１が低粘度の時に粒子２２を混合し、所定の面に塗布することが望ましい。 Next, a predetermined amount of particles 22 is mixed with the adhesive 21.
Normally, the adhesive 21 and the particles 22 are mixed immediately before being applied to the substrate 11 or the sealing member 30, but a material in which the adhesive 21 and the particles 22 are mixed in advance may be used. For example, when a reaction (crosslinking reaction) curable adhesive is used as the adhesive 21, it is desirable that the particles 22 are mixed and applied to a predetermined surface when the adhesive 21 has a low viscosity.

接着剤層２０の厚さを球状の粒子２２の粒径で正確に調節するため、接着剤層２０中で粒子２２を、多段に積層されることなく一段で存在させることが好ましい。粒子２２を一段とするためには、例えば、粒子２２と接着剤２１との混合物を基板１１の一方の面１１ａに塗布した後、接着固定するべき封止部材３０をこの接着剤層２０上に載せ、封止部材３０を数回摺り動かしたり、封止部材３０に振動を加えることによって、封止部材３０と基板１１との間に一段の粒子２２が並んだ状態（図２参照）とすることができる。  In order to accurately adjust the thickness of the adhesive layer 20 with the particle size of the spherical particles 22, it is preferable that the particles 22 exist in the adhesive layer 20 in a single stage without being stacked in multiple stages. In order to make the particles 22 one stage, for example, after applying a mixture of the particles 22 and the adhesive 21 to the one surface 11 a of the substrate 11, a sealing member 30 to be bonded and fixed is placed on the adhesive layer 20. By moving the sealing member 30 several times or applying vibration to the sealing member 30, the single-stage particles 22 are arranged between the sealing member 30 and the substrate 11 (see FIG. 2). Can do.

次に、接着剤２１を加熱または紫外線照射することにより、接着剤２１が硬化する。接着剤２１が硬化すると、図２に示すように、封止部材３０と基板１１との間に粒子２２が一列に並び、各粒子２２間が接着剤２１で埋められた接着剤層２０が形成され、封止部材３０が接着剤層２０を介して基板１１の一方の面１１ａに接着固定され、電子デバイスパッケージ４０が得られる。これにより、封止部材３０と基板１１との距離、すなわち、封止部材３０と電子デバイス１２との距離が、実質的に均一な粒径を有する多数の粒子２２によって所定間隔に保たれ、封止部材３０と基板１１とが極めて平坦な状態で接着固定される。さらに、封止部材３０と基板１１との距離を一定に保つことにより、両者の間に所定の大きさの空隙４１が設けられる。  Next, the adhesive 21 is cured by heating or irradiating the adhesive 21 with ultraviolet rays. When the adhesive 21 is cured, as shown in FIG. 2, particles 22 are arranged in a row between the sealing member 30 and the substrate 11, and an adhesive layer 20 in which the spaces between the particles 22 are filled with the adhesive 21 is formed. Then, the sealing member 30 is bonded and fixed to the one surface 11a of the substrate 11 through the adhesive layer 20, and the electronic device package 40 is obtained. As a result, the distance between the sealing member 30 and the substrate 11, that is, the distance between the sealing member 30 and the electronic device 12, is maintained at a predetermined interval by a large number of particles 22 having a substantially uniform particle size. The stop member 30 and the substrate 11 are bonded and fixed in an extremely flat state. Further, by keeping the distance between the sealing member 30 and the substrate 11 constant, a gap 41 having a predetermined size is provided between them.

なお、この実施形態では、チップ化した電子デバイスパッケージの製造方法について示したが、本発明はこれに限定されない。本発明にあっては、ウエハ状態の電子デバイスパッケージを作製した後、このウエハをダイシングラインに沿ってダイシング加工して、チップ化した電子デバイスパッケージを製造してもよい。ダイシング加工には、一般的なダイシング装置、あるいは、エッチング装置などが適用可能である。   In this embodiment, the method for manufacturing a chip electronic device package is shown, but the present invention is not limited to this. In the present invention, after an electronic device package in a wafer state is manufactured, the wafer may be diced along a dicing line to manufacture a chip-formed electronic device package. For dicing, a general dicing apparatus or an etching apparatus can be applied.

本発明に係る電子デバイスパッケージの一実施形態を示す概略断面図である。It is a schematic sectional drawing which shows one Embodiment of the electronic device package which concerns on this invention. 図１中の符号Ａで示す領域を拡大した概略断面図である。It is the schematic sectional drawing which expanded the area | region shown with the code | symbol A in FIG.

符号の説明Explanation of symbols

１１・・・基板、１２・・・電子デバイス、２０・・・接着剤層、２１・・・接着剤、２２・・・粒子、３０・・・封止部材、４０・・・電子デバイスパッケージ、４１・・・空隙。
DESCRIPTION OF SYMBOLS 11 ... Board | substrate, 12 ... Electronic device, 20 ... Adhesive layer, 21 ... Adhesive, 22 ... Particle | grains, 30 ... Sealing member, 40 ... Electronic device package, 41 ... gap.

Claims (4)

基板と、該基板の一方の面に設けられた電子デバイスと、該電子デバイスを覆うように配され、接着剤層を介して前記基板に固定された封止部材とを備え、前記電子デバイスと前記封止部材との間に空隙が設けられてなる電子デバイスパッケージであって、
前記接着剤層は、接着剤と、実質的に均一な粒径の多数の粒子とからなることを特徴とする電子デバイスパッケージ。 A substrate, an electronic device provided on one surface of the substrate, and a sealing member disposed to cover the electronic device and fixed to the substrate via an adhesive layer, An electronic device package in which a gap is provided between the sealing member,
The electronic device package, wherein the adhesive layer is composed of an adhesive and a large number of particles having a substantially uniform particle size. 前記電子デバイスは、固体撮像素子であることを特徴とする請求項１に記載の電子デバイスパッケージ。   The electronic device package according to claim 1, wherein the electronic device is a solid-state imaging device. 前記接着剤層における前記粒子の含有量は７０体積％以下であることを特徴とする請求項１または２に記載の電子デバイスパッケージ。   The electronic device package according to claim 1, wherein the content of the particles in the adhesive layer is 70% by volume or less. 前記粒子の熱膨張係数は、前記基板の熱膨張係数と前記封止部材の熱膨張係数との中間の値、または、両者のどちらか一方に近い値であることを特徴とする請求項１ないし３のいずれかに記載の電子デバイスパッケージ。

The thermal expansion coefficient of the particles is an intermediate value between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the sealing member, or a value close to one of the both. 4. The electronic device package according to any one of 3.

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023826A1 (en) * 2006-08-25 2008-02-28 Sanyo Electric Co., Ltd. Semiconductor device and its manufacturing method
JP2013243340A (en) * 2012-04-27 2013-12-05 Canon Inc Electronic component, mounting member, electronic apparatus, and manufacturing method of these
US8653612B2 (en) 2006-08-25 2014-02-18 Sanyo Semiconductor Co., Ltd. Semiconductor device
US9034729B2 (en) 2006-08-25 2015-05-19 Semiconductor Components Industries, Llc Semiconductor device and method of manufacturing the same
JP2017120275A (en) * 2015-12-28 2017-07-06 株式会社Ｊｖｃケンウッド Package, manufacturing method of package, and image display device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008023826A1 (en) * 2006-08-25 2008-02-28 Sanyo Electric Co., Ltd. Semiconductor device and its manufacturing method
US8148811B2 (en) 2006-08-25 2012-04-03 Semiconductor Components Industries, Llc Semiconductor device and manufacturing method thereof
US8653612B2 (en) 2006-08-25 2014-02-18 Sanyo Semiconductor Co., Ltd. Semiconductor device
US9034729B2 (en) 2006-08-25 2015-05-19 Semiconductor Components Industries, Llc Semiconductor device and method of manufacturing the same
JP2013243340A (en) * 2012-04-27 2013-12-05 Canon Inc Electronic component, mounting member, electronic apparatus, and manufacturing method of these
JP2017120275A (en) * 2015-12-28 2017-07-06 株式会社Ｊｖｃケンウッド Package, manufacturing method of package, and image display device

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