JP2005203537A - Lightweight high rigid ceramic member - Google Patents

Lightweight high rigid ceramic member Download PDF

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Publication number
JP2005203537A
JP2005203537A JP2004007804A JP2004007804A JP2005203537A JP 2005203537 A JP2005203537 A JP 2005203537A JP 2004007804 A JP2004007804 A JP 2004007804A JP 2004007804 A JP2004007804 A JP 2004007804A JP 2005203537 A JP2005203537 A JP 2005203537A
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honeycomb structure
ceramic
ceramic member
lightweight high
partition wall
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Hiroyuki Tsuto
宏之 津戸
Yoshibumi Takei
義文 武井
Ichiro Aoki
一郎 青木
Tomoyuki Hikita
友幸 引田
Tatsuya Shiogai
達也 塩貝
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Taiheiyo Cement Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a lightweight high rigid ceramic member which is suitable for a member moving fast in a semiconductor manufacturing equipment, or the like. <P>SOLUTION: The ceramic member 10 has a honeycomb structure member 13 having a plurality of columnar space 12 partitioned by a bulkhead 11, and a plate member 14. The aperture of the honeycomb structure member 13 is set to 3 mm to 20 mm, a Young's modulus of the bulkhead 11 is set to 200 GPa or more, and the thickness of the bulkhead 11 is set to 0.2 mm to 3 mm. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、例えば、半導体製造装置に装備される可動ステージ等に好適に用いられる軽量高剛性セラミック部材に関する。   The present invention relates to a lightweight high-rigidity ceramic member suitably used for, for example, a movable stage equipped in a semiconductor manufacturing apparatus.

例えば、半導体装置の製造過程においては、フォトリソグラフィ技術によって半導体ウエハに所定のパターンを形成しており、このフォトリソグラフィ工程で用いられる露光装置において半導体ウエハを保持し移動させるステージには、近時の半導体装置の回路パターンの微細化と高集積化に対応した高精度の位置決め機能と、経済的に露光処理を行うための高速移動機能が求められている。   For example, in the manufacturing process of a semiconductor device, a predetermined pattern is formed on a semiconductor wafer by photolithography, and a stage for holding and moving the semiconductor wafer in an exposure apparatus used in this photolithography process There is a need for a high-precision positioning function that can cope with miniaturization and high integration of circuit patterns of semiconductor devices and a high-speed movement function for performing exposure processing economically.

しかしながら、ステージを高速で移動させると必然的に振動が発生し、位置決め精度を低下させることとなる。特に、露光装置の可動部は、移動と静止を繰り返しており、静止時には慣性力による振動が発生する。このような振動は露光精度に影響するため、その大きさが許容レベル以下に減衰するまで待機する必要があり、それがスループット向上の阻害要因となってしまう。   However, if the stage is moved at a high speed, vibrations are inevitably generated and the positioning accuracy is lowered. In particular, the movable part of the exposure apparatus repeats moving and stationary, and vibration due to inertial force occurs when stationary. Since such vibration affects exposure accuracy, it is necessary to wait until the magnitude is attenuated to an allowable level or less, which becomes an obstacle to improving the throughput.

ステージを一定の駆動力のもとで高速で動かすためには、可動部全体の軽量化が必要であり、移動、停止の振動による精度低下を抑制するためには荷重変形が小さい構造であることが好ましい。したがって、このように高速化と高位置決め精度を両立させるためには、軽量かつ荷重変形が小さい構造および材料が必要となる。ここで、慣性力による振動の大きさは部材の比剛性と相関関係があり、部材比剛性が大きいほど振動の大きさが小さくなるから、荷重変形を小さくすることは、比剛性を大きくすることと等価である。   In order to move the stage at a high speed under a constant driving force, it is necessary to reduce the weight of the entire movable part, and to prevent a decrease in accuracy due to vibration during movement and stop, the load deformation must be small. Is preferred. Therefore, in order to achieve both high speed and high positioning accuracy in this way, a structure and material that is lightweight and has little load deformation are required. Here, the magnitude of vibration due to inertial force has a correlation with the specific rigidity of the member, and the greater the member specific rigidity, the smaller the magnitude of vibration. Therefore, reducing the load deformation increases the specific rigidity. Is equivalent to

このような状況において、特許文献1には、リブ構造を持つ部材の、リブ構造部分の内部構造がリブ構造である露光装置用部材が提案されている。この技術では、ステージ等の露光装置用部材を通常のリブ構造の場合よりも軽量化することができる。しかし、比剛性はリブ部分の空隙率が高い分だけ低くなり、またその構造上局所的な荷重変形量を考慮してリブの配置を設計しなければならず、また通常のリブ構造の荷重変形量以下の変形量とすることは困難である。
特開2003−109892号公報
Under such circumstances, Patent Document 1 proposes a member for an exposure apparatus in which the internal structure of the rib structure portion of the member having the rib structure is a rib structure. With this technique, the exposure apparatus member such as a stage can be made lighter than in the case of a normal rib structure. However, the specific rigidity is lowered due to the high porosity of the rib part, and the arrangement of the ribs must be designed in consideration of the local load deformation due to the structure, and the load deformation of the normal rib structure It is difficult to make the deformation amount less than the amount.
JP 2003-109982 A

本発明はこのような事情に鑑みてなされたものであり、半導体製造装置等において高速で移動させる部材に適した、軽量高剛性セラミック部材を提供することを目的とする。   This invention is made | formed in view of such a situation, and it aims at providing the lightweight high-rigidity ceramic member suitable for the member moved at high speed in a semiconductor manufacturing apparatus etc.

すなわち、本発明によれば、所定のセラミックス材料からなり、隔壁により仕切られた多数の柱状空隙部を有するハニカム構造部材と、
所定のセラミックス材料からなり、前記ハニカム構造部材の少なくとも一方の、前記柱状空隙部の長手方向に垂直な面に取り付けられる板部材と、を有する軽量高剛性セラミック部材であって、
前記ハニカム構造部材の目開きは3mm〜20mmであり、前記隔壁のヤング率が200GPa以上であり、前記隔壁の厚さが0.2mm〜3mmであることを特徴とする軽量高剛性セラミック部材、が提供される。
この軽量高剛性セラミック部材においては、隔壁の比重が4.5未満であることが好ましい。
That is, according to the present invention, a honeycomb structural member made of a predetermined ceramic material and having a number of columnar voids partitioned by partition walls;
A plate member that is made of a predetermined ceramic material and is attached to a surface of at least one of the honeycomb structure members that is perpendicular to the longitudinal direction of the columnar voids,
The honeycomb structure member has a mesh opening of 3 mm to 20 mm, a Young's modulus of the partition wall of 200 GPa or more, and a thickness of the partition wall of 0.2 mm to 3 mm. Provided.
In this lightweight and highly rigid ceramic member, the specific gravity of the partition walls is preferably less than 4.5.

本発明によれば、軽量で高い剛性を有するセラミック部材が得られる。したがって、本発明の軽量高剛性セラミック部材を、例えば半導体装置の製造に用いられる露光装置や検査装置の可動ステージ等として用いた場合には、高いスループットと高い位置決め精度を得ることができる。   According to the present invention, a ceramic member that is lightweight and has high rigidity can be obtained. Therefore, when the lightweight high-rigidity ceramic member of the present invention is used as, for example, a movable stage of an exposure apparatus or an inspection apparatus used for manufacturing a semiconductor device, high throughput and high positioning accuracy can be obtained.

以下、本発明の実施の形態について図面を参照しながら説明する。図1は本発明に係る軽量高剛性セラミック部材(以下単に「セラミック部材」という)10の概略構造を示す斜視図であり、図2は図1に示す矢視AAの断面図、図3は図2の部分拡大図である。
セラミック部材10は、隔壁11により仕切られた多数の柱状空隙部12を有するハニカム構造部材13と、ハニカム構造部材13の少なくとも一方の、柱状空隙部12の長手方向に垂直な面(以下「開口面」という)に設けられる板部材14とを有しており、ハニカム構造部材13と板部材14とは、後述するように、所定の接合剤(図1に示さず)により接合されている。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a schematic structure of a lightweight high-rigidity ceramic member (hereinafter simply referred to as “ceramic member”) 10 according to the present invention, FIG. 2 is a cross-sectional view taken along line AA shown in FIG. FIG.
The ceramic member 10 includes a honeycomb structural member 13 having a large number of columnar voids 12 partitioned by partition walls 11 and a surface perpendicular to the longitudinal direction of the columnar voids 12 (hereinafter referred to as “opening surface”). The honeycomb structure member 13 and the plate member 14 are bonded by a predetermined bonding agent (not shown in FIG. 1), as will be described later.

ハニカム構造部材13の目開きLは3mm〜20mmとする。ここで、「目開き」とは、柱状空隙部12の長手方向に垂直な断面における形状(以下、「開口形状」という)が正多角形の場合には、その一辺の長さをいうものとする。目開きLが3mm未満では軽量化の効果が得られ難く、一方、目開きLが20mm超では、板部材14の撓みが大きくなるために、好ましくない。ハニカム構造部材13の目開きLは、5mm〜18mmとすることが、より好ましい。   The opening L of the honeycomb structure member 13 is 3 mm to 20 mm. Here, “aperture” refers to the length of one side when the shape in the cross section perpendicular to the longitudinal direction of the columnar gap 12 (hereinafter referred to as “opening shape”) is a regular polygon. To do. If the mesh opening L is less than 3 mm, the effect of reducing the weight is difficult to obtain. On the other hand, if the mesh opening L exceeds 20 mm, the plate member 14 is greatly bent, which is not preferable. The aperture L of the honeycomb structure member 13 is more preferably 5 mm to 18 mm.

なお、ハニカム構造部材の柱状空隙部の開口形状は正多角形に限定されるものではなく、例えば、柱状空隙部の開口形状が長方形の場合には、短辺と長辺の両方の長さが前記範囲に収まっている必要があり、柱状空隙部の開口形状が円形の場合には、その直径が前記範囲に収まっている必要がある。   Note that the opening shape of the columnar void portion of the honeycomb structure member is not limited to a regular polygon. For example, when the opening shape of the columnar void portion is rectangular, the length of both the short side and the long side is When the opening shape of the columnar gap is circular, the diameter needs to be within the range.

ハニカム構造部材13の隔壁11のヤング率は200GPa以上とする。隔壁11のヤング率が200GPa未満の場合には、板部材14の撓みが大きくなるために好ましくない。さらに、隔壁11の厚さtは0.2mm〜3mmとする。隔壁11の厚さtが0.2mm未満ではハニカム構造部材13が破損しやすくなり、一方、隔壁11の厚さtが3mm超では、軽量化の効果が得られ難い。   The Young's modulus of the partition walls 11 of the honeycomb structure member 13 is set to 200 GPa or more. When the Young's modulus of the partition wall 11 is less than 200 GPa, the plate member 14 is largely bent, which is not preferable. Further, the thickness t of the partition wall 11 is set to 0.2 mm to 3 mm. When the thickness t of the partition walls 11 is less than 0.2 mm, the honeycomb structure member 13 is likely to be damaged. On the other hand, when the thickness t of the partition walls 11 exceeds 3 mm, it is difficult to obtain a light weight effect.

隔壁11の比重は4.5未満であることが好ましい。隔壁11の比重が4.5以上の場合には、軽量化の効果が得られ難い。隔壁11の比重はハニカム構造部材13を構成するセラミック材料とその組織に依存する。ハニカム構造部材13に適用されるセラミックス材料としては、Al、Si、SiC、サイアロン、SiC/Al複合材料、SiC/Si複合材料等を挙げることができる。但し、セラミックス材料は、ヤング率が200GPa以上であり、好ましくは比重が4.5未満であれば、これらに限定されるものではない。板部材14には、ハニカム構造部材13と同じセラミックス材料が好適に用いられる。 The specific gravity of the partition wall 11 is preferably less than 4.5. When the specific gravity of the partition wall 11 is 4.5 or more, it is difficult to obtain an effect of weight reduction. The specific gravity of the partition walls 11 depends on the ceramic material constituting the honeycomb structure member 13 and the structure thereof. Examples of the ceramic material applied to the honeycomb structure member 13 include Al 2 O 3 , Si 3 N 4 , SiC, sialon, SiC / Al composite material, SiC / Si composite material, and the like. However, the ceramic material is not limited to these as long as the Young's modulus is 200 GPa or more and preferably the specific gravity is less than 4.5. For the plate member 14, the same ceramic material as that of the honeycomb structure member 13 is preferably used.

セラミック部材10の部材比重、つまりセラミック部材10の単位体積当たりの重さは、セラミック部材10全体を軽量化する観点から、1.6以下であることが好ましい。   The member specific gravity of the ceramic member 10, that is, the weight per unit volume of the ceramic member 10, is preferably 1.6 or less from the viewpoint of reducing the weight of the entire ceramic member 10.

板部材14の製造方法としては、セラミックス原料粉末にバインダー等の成形助剤を添加して造粒処理し、これをプレス成形法等により板状に成形した後、脱脂、焼成して板状焼結体を得て、これを切削,研削,研磨加工する方法が挙げられる。また、SiC/Si複合材料の場合には、最初にプレス成形法等によりSiC粉末とカーボン粉末を混合、成形してプリフォームを作製し、このプリフォームと金属Siとを不活性雰囲気において1600℃程度に加熱して金属Siを溶融させ、溶融Siをプリフォームに含浸させることにより、SiC−Si複合材料を得ることができる。   As a manufacturing method of the plate member 14, a forming aid such as a binder is added to the ceramic raw material powder and granulated, which is formed into a plate shape by a press forming method or the like, and then degreased and fired to obtain a plate-like baking. Examples of the method include obtaining a bonded body, and cutting, grinding, and polishing this. In the case of a SiC / Si composite material, first, a SiC powder and a carbon powder are mixed and molded by a press molding method or the like to prepare a preform, and the preform and metal Si are heated at 1600 ° C. in an inert atmosphere. A SiC-Si composite material can be obtained by heating to a certain extent to melt metal Si and impregnating the preform with molten Si.

ハニカム構造部材13の製造方法としては、既知の押出成形法が好適に用いられる。すなわち、セラミックス原料粉末にバインダー等の成形助剤等を添加して混練し、得られた混練土を押出成形法によりハニカム形状に成形し、脱脂、焼成する方法が好適に用いられる。また、例えば、SiC/Si複合材料の場合には、SiC粉末とカーボン粉末の混練土を押出成形して、ハニカム形状のプリフォームを形成し、前記含浸法によりSiC/Si複合材料を得る方法を採用することができる。   As a method for manufacturing the honeycomb structure member 13, a known extrusion method is preferably used. That is, a method in which a forming aid such as a binder is added to the ceramic raw material powder and kneaded, and the obtained kneaded soil is formed into a honeycomb shape by an extrusion molding method, degreased and fired is preferably used. Also, for example, in the case of SiC / Si composite material, there is a method of extruding a kneaded soil of SiC powder and carbon powder to form a honeycomb-shaped preform and obtaining the SiC / Si composite material by the impregnation method. Can be adopted.

ハニカム構造部材13と板部材14との接合方法としては、慣用の方法、例えば、金属ろう材(Auろう、Agろう、Al合金ろう、Si合金ろう等)によるろう付け、ガラスペーストやセラミックスペーストを溶融させることによる接合方法等が用いられる。   As a method of joining the honeycomb structure member 13 and the plate member 14, a conventional method, for example, brazing with a metal brazing material (Au brazing, Ag brazing, Al alloy brazing, Si alloy brazing, etc.), glass paste or ceramic paste is used. A joining method by melting is used.

本発明のセラミック部材は、上記セラミック部材10のように、ハニカム構造部材13の一方の開口面に板部材14が設けられた構成に限定されるものではなく、図4の斜視図に示すセラミック部材20のように、ハニカム構造部材13の両方の開口面にそれぞれ板部材14・15を設けたサンドイッチパネル状の構造としてもよい。セラミック部材10・20では、板部材14(または15)に必要に応じて穴部やネジ切り溝を形成し、このような穴部等を利用してステージ等を作製することができる。   The ceramic member of the present invention is not limited to the configuration in which the plate member 14 is provided on one opening surface of the honeycomb structure member 13 as in the ceramic member 10, but the ceramic member shown in the perspective view of FIG. 20, a sandwich panel structure in which plate members 14 and 15 are provided on both opening surfaces of the honeycomb structure member 13 may be used. In the ceramic members 10 and 20, holes or threaded grooves are formed in the plate member 14 (or 15) as necessary, and a stage or the like can be manufactured using such holes.

セラミック部材10においては、1枚の板部材14と1個のハニカム構造部材13とが接合されているが、これに限定されず、1枚の板部材14に複数のハニカム構造部材が取り付けられた構造としてもよい。また、セラミック部材10の外径は図1に示すような直方体に限定されるものではなく、円柱状であってもよい。   In the ceramic member 10, one plate member 14 and one honeycomb structure member 13 are joined. However, the present invention is not limited to this, and a plurality of honeycomb structure members are attached to one plate member 14. It is good also as a structure. Further, the outer diameter of the ceramic member 10 is not limited to a rectangular parallelepiped as shown in FIG.

図4に示すサンドイッチパネル構造において各部の寸法を表1に示す値に設定したセラミック部材のモデルをCADで作製し、有限要素法により、各モデルの部材比重と撓みを求めた。ここで、ハニカム構造部材の柱状空隙部の開口形状は正方形としており、表1中の目開きLの値はこの正方形の一辺の長さである。また、ハニカム構造部材の外寸を縦100mm×横100mm×高さ(厚さ)30mm、板部材の形状を縦100mm×横100mm×厚さ5mmとした。なお、モデル1〜7の隔壁の比重(=2.7)はSiC/Siの一般的な比重である。   In the sandwich panel structure shown in FIG. 4, a model of a ceramic member in which the dimensions of each part were set to the values shown in Table 1 was produced by CAD, and the member specific gravity and deflection of each model were obtained by a finite element method. Here, the opening shape of the columnar voids of the honeycomb structure member is a square, and the value of the opening L in Table 1 is the length of one side of the square. Further, the outer dimensions of the honeycomb structure member were 100 mm long × 100 mm wide × 30 mm high (thickness), and the shape of the plate member was 100 mm long × 100 mm wide × 5 mm thick. The specific gravity (= 2.7) of the partition walls of models 1 to 7 is a general specific gravity of SiC / Si.

モデルの解析では、セラミック部材の下側四隅(つまり、一方の板部材の角部)を拘束し、上面中央(つまり、他方の板部材の中央部)20mm×20mmの領域に5kgの負荷を与えた。解析結果において、部材比重が1.6以下であり、かつ、撓みが200nm以下となる場合を、実使用を考慮して、合格基準とした。   In the analysis of the model, the lower four corners of the ceramic member (that is, the corner of one plate member) are constrained, and a load of 5 kg is applied to the upper surface center (that is, the center portion of the other plate member) 20 mm × 20 mm It was. In the analysis result, the case where the specific gravity of the member is 1.6 or less and the deflection is 200 nm or less is set as an acceptance criterion in consideration of actual use.

結果を表1に併記する。モデル1〜4のように、目開きが3〜20mmの範囲にある場合には、いずれも部材比重は1.6以下と軽量であり、かつ、撓みが200nm以下と小さくなった。これに対して、モデル5のように目開きが2mmと小さい場合やモデル6のように隔壁厚さが4mmと厚い場合、モデル9のように隔壁の比重が4.5と大きい場合には、いずれの場合でも部材比重が1.6よりも大きくなった。部材比重が1.6よりも大きくなったモデルについては撓み解析は行っていない。また、モデル7のように目開きが24mmと大きい場合とモデル8のようにヤング率が小さい場合には、撓みがそれぞれ225nm、484nmであり、合格基準として定めた200nmよりも大きくなった。   The results are also shown in Table 1. As in models 1 to 4, when the mesh opening was in the range of 3 to 20 mm, the specific gravity of each member was as light as 1.6 or less, and the deflection was as small as 200 nm or less. On the other hand, when the aperture is as small as 2 mm as in the model 5, or when the partition wall thickness is as thick as 4 mm as in the model 6, or when the specific gravity of the partition wall is as large as 4.5 as in the model 9, In either case, the member specific gravity was larger than 1.6. The bending analysis is not performed for the model whose member specific gravity is larger than 1.6. Further, when the mesh opening was as large as 24 mm as in the model 7 and when the Young's modulus was small as in the model 8, the deflections were 225 nm and 484 nm, respectively, which were larger than 200 nm determined as the acceptance criteria.

Figure 2005203537
Figure 2005203537

Si粉末100質量部に対して、C(カーボン)粉末を40質量部、メチルセルロースを15質量部、純水を25質量部添加して混練し、得られた混練土を、押出成形して、ハニカム形状に成形した。この成形体を、アルゴンガス雰囲気中、2000℃で焼成し、SiCハニカム構造部材を得た。このハニカム構造部材の目開きは10mm、隔壁厚さは1mm、外寸は100mm×100mm×30mmである。また、Si粉末とC粉末を前記比率で配合し、これに所定量のバインダを添加して造粒し、得られた造粒粉をプレス成形し、ハニカム構造部材と同じ条件で焼成して板部材を得た。この板部材の外寸は、100mm×100mm×5mmである。こうして作製したハニカム構造部材と板部材をAuろうを用いて接合して、前記表1に示したモデル1と同構成のセラミック部材を作製した。   To 100 parts by mass of Si powder, 40 parts by mass of C (carbon) powder, 15 parts by mass of methylcellulose, and 25 parts by mass of pure water were added and kneaded. Molded into shape. The formed body was fired at 2000 ° C. in an argon gas atmosphere to obtain a SiC honeycomb structure member. The honeycomb structure member has an opening of 10 mm, a partition wall thickness of 1 mm, and an outer dimension of 100 mm × 100 mm × 30 mm. In addition, Si powder and C powder are blended in the above ratio, a predetermined amount of binder is added to this, granulated, and the resulting granulated powder is press-molded and fired under the same conditions as the honeycomb structure member. A member was obtained. The outer dimension of this plate member is 100 mm × 100 mm × 5 mm. The honeycomb structure member thus produced and the plate member were joined using Au brazing to produce a ceramic member having the same configuration as Model 1 shown in Table 1 above.

このセラミック部材の中央部20mm×20mmの領域に5kgの荷重を負荷し、負荷した面の撓み量を電気マイクロ(ミツトヨ製、型番MLH−322)で測定した結果、約100nmとなり、先のモデル解析結果とよく一致した。このことから、表1に示す構造パラメータを設定し、有限要素法解析することで、実質的に本発明に係る軽量で高剛性なセラミック部材の構造パラメータを決めることができる。   A load of 5 kg was applied to the center portion of this ceramic member 20 mm × 20 mm, and the amount of deflection of the loaded surface was measured with an electric micro (Mitutoyo, model number MLH-322), resulting in about 100 nm, and the previous model analysis It was in good agreement with the results. From this, by setting the structural parameters shown in Table 1 and performing the finite element method analysis, the structural parameters of the lightweight and highly rigid ceramic member according to the present invention can be determined substantially.

本発明の軽量高剛性セラミック部材は、例えば、露光装置用ステージや検査装置用ステージ等に好適である。   The lightweight high-rigidity ceramic member of the present invention is suitable for, for example, an exposure apparatus stage and an inspection apparatus stage.

本発明に係る軽量高剛性セラミック部材の一実施形態を示す斜視図。The perspective view which shows one Embodiment of the lightweight highly rigid ceramic member which concerns on this invention. 図1の矢視AA断面図1. AA sectional view of FIG. 図2の部分拡大図。The elements on larger scale of FIG. 本発明に係る軽量高剛性セラミック部材の別の実施形態を示す斜視図。The perspective view which shows another embodiment of the lightweight high-rigidity ceramic member which concerns on this invention.

符号の説明Explanation of symbols

10;セラミック部材
11;隔壁
12;柱状空隙部
13;ハニカム構造部材
14;板部材
15;板部材
20;セラミック部材
DESCRIPTION OF SYMBOLS 10; Ceramic member 11; Partition 12; Columnar space 13; Honeycomb structure member 14; Plate member 15; Plate member 20;

Claims (2)

所定のセラミックス材料からなり、隔壁により仕切られた多数の柱状空隙部を有するハニカム構造部材と、
所定のセラミックス材料からなり、前記ハニカム構造部材の少なくとも一方の、前記柱状空隙部の長手方向に垂直な面に取り付けられる板部材と、
を有する軽量高剛性セラミック部材であって、
前記ハニカム構造部材の目開きは3mm〜20mmであり、前記隔壁のヤング率が200GPa以上であり、前記隔壁の厚さが0.2mm〜3mmであることを特徴とする軽量高剛性セラミック部材。
A honeycomb structure member made of a predetermined ceramic material and having a number of columnar voids partitioned by partition walls;
A plate member made of a predetermined ceramic material and attached to a surface perpendicular to the longitudinal direction of the columnar voids of at least one of the honeycomb structure members;
A lightweight high-rigidity ceramic member having
The honeycomb structure member has a mesh opening of 3 mm to 20 mm, a Young's modulus of the partition wall of 200 GPa or more, and a thickness of the partition wall of 0.2 mm to 3 mm.
前記隔壁の比重が4.5未満であることを特徴とする請求項1に記載の軽量高剛性セラミック部材。   The lightweight high-rigidity ceramic member according to claim 1, wherein the specific gravity of the partition wall is less than 4.5.
JP2004007804A 2004-01-15 2004-01-15 Lightweight high rigid ceramic member Pending JP2005203537A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006003611A (en) * 2004-06-17 2006-01-05 Tohoku Univ Exposing device
JP2007035999A (en) * 2005-07-28 2007-02-08 Sumitomo Electric Ind Ltd Wafer holding body for wafer prober, and wafer prober for mounting the same
JP2008199006A (en) * 2007-01-24 2008-08-28 Asml Holding Nv Wafer chuck and method of forming wafer chuck
JPWO2014083965A1 (en) * 2012-11-27 2017-01-05 株式会社クリエイティブテクノロジー Electrostatic chuck, glass substrate processing method and glass substrate

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165111A (en) * 1974-11-11 1976-06-05 Norton Co
JPH03131442A (en) * 1989-10-12 1991-06-05 Nippon Tungsten Co Ltd X-y stage
JPH0517227A (en) * 1991-07-02 1993-01-26 Agency Of Ind Science & Technol Silicon carbide/metallic silicon composite body and its production
JPH05174520A (en) * 1991-12-19 1993-07-13 Hitachi Ltd Memory unit and highly rigid support therefor
JPH0894268A (en) * 1994-09-21 1996-04-12 Ngk Insulators Ltd Si-impregnated sic honeycomb structural body and honeycomb-shaped heat storage body using the structure
JPH11100275A (en) * 1997-09-26 1999-04-13 Kyocera Corp Low thermal expansion ceramic and its preparation
JP2003249542A (en) * 2001-12-20 2003-09-05 Nikon Corp Substrate holder, aligner, and method of manufacturing device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165111A (en) * 1974-11-11 1976-06-05 Norton Co
JPH03131442A (en) * 1989-10-12 1991-06-05 Nippon Tungsten Co Ltd X-y stage
JPH0517227A (en) * 1991-07-02 1993-01-26 Agency Of Ind Science & Technol Silicon carbide/metallic silicon composite body and its production
JPH05174520A (en) * 1991-12-19 1993-07-13 Hitachi Ltd Memory unit and highly rigid support therefor
JPH0894268A (en) * 1994-09-21 1996-04-12 Ngk Insulators Ltd Si-impregnated sic honeycomb structural body and honeycomb-shaped heat storage body using the structure
JPH11100275A (en) * 1997-09-26 1999-04-13 Kyocera Corp Low thermal expansion ceramic and its preparation
JP2003249542A (en) * 2001-12-20 2003-09-05 Nikon Corp Substrate holder, aligner, and method of manufacturing device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006003611A (en) * 2004-06-17 2006-01-05 Tohoku Univ Exposing device
JP2007035999A (en) * 2005-07-28 2007-02-08 Sumitomo Electric Ind Ltd Wafer holding body for wafer prober, and wafer prober for mounting the same
JP2008199006A (en) * 2007-01-24 2008-08-28 Asml Holding Nv Wafer chuck and method of forming wafer chuck
JP4719230B2 (en) * 2007-01-24 2011-07-06 エーエスエムエル ホールディング エヌ.ブイ. Wafer chuck and method for forming wafer chuck
US8168017B2 (en) 2007-01-24 2012-05-01 Asml Holding N.V. Bonding silicon silicon carbide to glass ceramics
JPWO2014083965A1 (en) * 2012-11-27 2017-01-05 株式会社クリエイティブテクノロジー Electrostatic chuck, glass substrate processing method and glass substrate
US9866151B2 (en) 2012-11-27 2018-01-09 Creative Technology Corporation Electrostatic chuck, glass substrate processing method, and said glass substrate

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