JP2005203433A - Method of forming fine wiring and electronic component having the fine wiring - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of forming the fine wiring of a nanometer size on a base. <P>SOLUTION: The fine wiring forming method comprises a step of preparing a hydrophilic-hydrophobic linear polypeptide 20 having at least one hydrophilic portion 22 and at least one hydrophobic portion 24A, 24B in the axial direction, a step of forming a polypeptide thin film 50A composed of the polypeptide portions regularly arranged on the surface of a specified base, a step of feeding the polypeptide thin film with conductive particulates 40 having hydrophobic groups to add the particulates to the hydrophobic portion of the polypeptide thin film through the hydrophobic group, and a step of eliminating the hydrophobic group of the conductive particulates and the polypeptide to form fine wiring composed of the conductive particulates corresponding to a regularly arranged pattern of the polypeptide. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for producing a nanometer-sized fine wiring on a substrate, and relates to the manufacture of an electronic component provided with such a fine wiring.

In recent years, along with the downsizing and high performance of electronic information equipment, electronic parts (devices) that can be used in such equipment are required to be smaller and more highly integrated.
One means for realizing such a requirement is miniaturization of wiring (specifically, wiring width and wiring thickness) formed in a semiconductor device such as a semiconductor package wiring board or DRAM. Therefore, in order to form finer wiring, in addition to so-called lithography technology for exposing a resist material with an electron beam or the like, application of inkjet printing technology is considered. For example, Patent Documents 1 and 2 describe a method of forming fine wiring on a substrate by inkjet printing a paste containing metal fine particles having an average particle diameter of 1 to 100 nm.

JP 2002-324966 A JP 2003-31944 A JP 2002-284900 A JP 2002-285000 A

However, the width of wiring formed by the current lithography technique is limited to about 0.1 μm at most. In addition, it is difficult to form nano-sized ultrafine wiring with a size of 0.1 μm or less by the ink jet technique. Therefore, in order to achieve further miniaturization and higher integration of the device, a fine wiring manufacturing method that realizes a nano-sized wiring width of, for example, about 1 to 100 nm is desired.
The present invention has been developed to meet such a demand, and an object thereof is to provide a method for producing nano-sized fine wiring on a substrate. Another object is to provide a microelectronic component such as an ultra-highly integrated semiconductor device having a fine wiring manufactured by such a method.

The inventor regularly uses the amphiphile as described in Patent Documents 3 and 4 as a carrier of conductive ultrafine particles to regularly form nano-sized fine wiring on the substrate surface. The method of forming was found and the present invention was completed.
That is, one method disclosed in the present specification is a method of forming nano-sized (typically about 1 to 100 nm) fine wiring on a substrate. In this method, a step of preparing an amphipathic linear polypeptide in which at least one hydrophilic part and a hydrophobic part are formed in the axial direction (longitudinal direction), and on the surface of a predetermined substrate, A step of forming a polypeptide thin film in which the polypeptides are regularly arranged; and a conductive fine particle having a hydrophobic group is supplied to the polypeptide thin film, and the hydrophobic portion of the polypeptide thin film is interposed through the hydrophobic group. And adding a conductive fine particle. Typically, by heating the substrate, the hydrophobic groups of the polypeptide and the conductive fine particles disappear (typically burned out), and the conductive fine particles correspond to the regular arrangement pattern of the polypeptide. The method further includes a step of forming fine wiring.

  In addition, another micro-wiring fabrication method disclosed herein includes an amphiphilic linear polypeptide in which at least one hydrophilic portion and one hydrophobic portion are formed in the axial direction (longitudinal direction). A step of supplying the conductive fine particles having a hydrophobic group to the polypeptide, and adding the conductive fine particles to the hydrophobic portion of the polypeptide via the hydrophobic group; and a surface of a predetermined substrate. And forming a polypeptide thin film in which the polypeptides to which the conductive fine particles are added are regularly arranged. Typically, by heating the substrate, the hydrophobic groups of the polypeptide and the conductive fine particles disappear (typically burned out), and the conductive fine particles correspond to the regular arrangement pattern of the polypeptide. The method further includes a step of forming fine wiring.

In the fine wiring manufacturing method of the present invention, the conductive fine particles having the hydrophobic group can be adsorbed to the hydrophobic portion of the amphiphilic linear polypeptide by utilizing the hydrophobic interaction of the hydrophobic group. it can. Then, by regularly arranging the linear polypeptides on the surface of the substrate, the regular arrangement of the conductive fine particle groups adsorbed on the hydrophobic portion of the polypeptide as a result on the substrate is realized. In this state, the whole substrate is heated, or laser irradiation is performed to eliminate the polypeptide and hydrophobic groups present on the substrate surface (burnout, transpiration), thereby forming a linear array of conductive fine particles arranged regularly. An object, that is, a fine wiring is formed on the substrate.
Thus, according to the method of the present invention, nano-sized fine wirings regularly arranged according to the regular arrangement of the amphipathic polypeptide as a carrier can be easily prepared.

Preferably, at least a part of the polypeptide thin film is aligned in the axial direction so that the hydrophobic portions of the polypeptide are juxtaposed adjacent to each other in the horizontal direction of the substrate (that is, uniaxially oriented). ) A polypeptide thin film is formed so as to be constituted by polypeptide aggregates. In this case, the polypeptide thin film is particularly preferably a monomolecular film or a cumulative film (LB film) formed on the basis of the Langmuir-Blodgett technique.
When such a polypeptide thin film is formed, nano-sized fine wirings with particularly narrow wiring width (for example, 1 to 50 nm) and orderly arrangement can be produced.

Preferably, fine particles made of a metal or alloy having an average particle size of 100 nm or less (for example, 1 to 100 nm) are used as the conductive fine particles. Thereby, a nano-sized fine wiring with high conductivity can be obtained.
Preferably, as the conductive fine particles having the hydrophobic group, an amphiphile having a long chain hydrocarbon group (typically a long chain hydrocarbon group having 10 or more carbon atoms, preferably an alkyl group) on the fine particle. A product obtained by binding a sex molecule is used. The conductive fine particles having such a hydrophobic group can exhibit a high hydrophobic interaction with the hydrophobic portion of the amphipathic polypeptide. For this reason, the conductive fine particles can be easily and densely adsorbed to the hydrophobic portion of the polypeptide. As a result, a higher density nano-sized fine wiring can be produced.

In addition, an electronic component including a fine wiring having a predetermined pattern manufactured by any of the methods disclosed in the present specification is provided.
Here, the “electronic component” includes various devices, elements, circuits and the like to which the present invention can be applied (that is, an electronic component having a fine wiring and a substrate (substrate) for forming the wiring). For example, an IC (chip) such as an LSI having fine wiring is a typical example included in the electronic component here.

  Hereinafter, preferred embodiments of the present invention will be described. It should be noted that technical matters other than the contents particularly mentioned in the present specification and necessary for the implementation of the present invention can be grasped as design matters for those skilled in the art based on the prior art. The present invention can be carried out based on the technical contents disclosed in the present specification and drawings and the common general technical knowledge in the field.

In the fine wiring manufacturing method of the present invention, an amphiphilic linear (chain) polypeptide in which at least one hydrophilic portion and one hydrophobic portion are formed in the axial direction is used. Such an amphipathic polypeptide only needs to have suitable molecular linearity and amphipathic properties capable of forming a regular arrangement on the carrier and substrate (substrate) of the conductive fine particles, and constitutes the polypeptide. It is not limited by the content of the amino acid sequence, the number of amino acid residues, the presence or absence of side chains, the type of side chains, and the like.
The number of amino acid residues constituting the polypeptide chain is preferably about 10 or more and 1000 or less. If the total number of amino acid residues is less than 10, it is not suitable because it is difficult to be amphiphilic. In addition, if the total number of amino acid residues exceeds 1000, it is not preferable because it is difficult to regularly arrange them on the substrate.

Hydrophobic moieties in amphipathic polypeptides include: valine (Val), leucine (Leu), isoleucine (Ile), methionine (Met), phenylalanine (Phe), tryptophan (Trp), glycine (Gly), alanine (Ala) It can be composed mainly of hydrophobic amino acids such as proline (Pro). On the other hand, the hydrophilic moiety includes aspartic acid (Asp), glutamic acid (Glu), arginine (Arg), lysine (Lys), histidine (His), serine (Ser), threonine (Thr), asparagine (Asn), glutamine ( Gln), tyrosine (Tyr), and other hydrophilic amino acids may be mainly used.
The hydrophobic part or the hydrophilic part can also be formed by modifying or altering the side chain part of the amino acid residue constituting the polypeptide chain. For example, the side chain carboxyl group can be esterified to make it hydrophobic. Moreover, as described later, the portion can be made hydrophilic by hydrolyzing such esterified carboxyl group.

  The length of the polypeptide chain constituting the hydrophobic part (that is, the number of amino acid residues) is appropriately determined depending on the width (thickness and size) of the linear aggregate of conductive fine particles to be produced on the substrate, that is, the fine wiring. It is good to make it different. On the other hand, the length of the polypeptide chain constituting the hydrophilic portion may be appropriately changed depending on the distance between wirings in a circuit (fine wiring) having a predetermined pattern to be produced on the substrate.

The shape (higher order structure) of the amphipathic polypeptide used is the type of amino acid constituting the polypeptide chain (for example, aspartic acid (Asp), glutamic acid (Glu), arginine (Arg), lysine (Lys). Histidine (His), asparagine (Asn), glutamine (Gln), serine (Ser), threonine (Thr), alanine (Ala), valine (Val), leucine (Leu), isoleucine (Ile), cysteine (Cys) , Methionine (Met), tyrosine (Tyr), phenylalanine (Phe), or tryptophan (Trp)) and their desired shapes (α helix structure, β sheet structure, random coil structure, and mixed structures thereof) It is possible to design.
A polypeptide having at least a hydrophobic portion having an α-helix structure is preferred. The α helix may have a chain structure with a very small diameter (for example, 1 to 2 nm). For this reason, when the hydrophobic portion has an α-helix structure, it is easy to form an extremely thin wiring (for example, a wiring having a thickness of 10 nm or less) composed of a group of conductive fine particles applied thereto. Particularly preferred are polypeptides in which the entire molecule including the hydrophilic moiety has an α-helix structure. By arranging such helix-structured linear polypeptides regularly, a denser polypeptide thin film can be formed.
The amphipathic polypeptide to be used can be prepared by generally known chemical synthesis or genetic engineering biosynthesis depending on the amino acid sequence and chain length. Since the polypeptide synthesis method itself does not characterize the present invention, a detailed description thereof will be omitted.

1 and 2 schematically show typical structures of polypeptides preferably used in the practice of the present invention. The linear polypeptide 10 shown in FIG. 1 is an amphipathic polypeptide (hereinafter referred to as “diblock polypeptide”) in which a hydrophilic portion 12 and a hydrophobic portion 14 are arranged in a single section in the axial direction. ). On the other hand, the linear polypeptide 20 shown in FIG. 2 has an amphipathic polypeptide 20 (one hydrophobic portion 24A, 24B is formed on both sides in the axial direction with one hydrophilic portion 22 sandwiched therebetween ( Hereinafter referred to as “triblock polypeptide”). By using these linear diblock type polypeptide and triblock type polypeptide, for example, based on the Langmuir-Blodgett method (hereinafter abbreviated as “LB method”), they are arranged with their axial directions aligned ( Monomolecular films or cumulative films (preferably uniaxially oriented), typically monomolecular films or cumulative films in which the hydrophobic portions of individual polypeptide molecules are adjacent and juxtaposed can be readily formed.
Although not intended to be particularly limited, the polypeptides represented by the following chemical structural formulas 1 and 2, respectively, are suitable examples of amphiphilic polypeptides that are preferably used in the practice of the present invention.

Polypeptide of formula 1 above can be prepared by polymerization of amino acid anhydride (NCA) poly (ε-carbobenzoxy L-lysine) -poly (γ-methyl L-glutamate) (PLLZ ₂₅ -PMLG ₆₀ : 25 and 60 are the number average degree of polymerization.) Diblock type polypeptide (PLLZ ₂₅ -P () which can be obtained by partially hydrolyzing the PMLG segment of L) to partially L-glutamic acid (LGA). MLG ₄₂ -LGA ₁₈ )).
This PLLZ ₂₅ -P (MLG ₄₂ -LGA ₁₈ ) typically has an axial length of 12.8 nm, and a hydrophobic portion (portion indicated by reference numeral 14 in FIG. 1) has a length of 3.8 nm. The diameter may be 1.7 nm, the length of the hydrophilic portion (the portion indicated by reference numeral 12 in FIG. 1) may be 9.0 nm, and its diameter may be 1.2 nm.
In addition, the length (chain length) of the hydrophobic portion and / or the hydrophilic portion in such a diblock polypeptide can be easily changed by adjusting the number of amino acid residues constituting the portion. . Further, the diameter (the thickness of the molecular structure) in the hydrophobic portion and / or the hydrophilic portion is changed by changing the type of amino acid residue constituting the portion (the presence or absence of the side chain and the size thereof). It can be easily changed.

On the other hand, the polypeptide of formula 2 is poly (L-leucine) -poly (γ-benzyl L-glutamate) -poly (L-leucine) (PLL ₅₄ -PBLG) which can be prepared by polymerization of amino acid anhydride (NCA). ₈₀ -PLL _54:. where 54,80 is the number average polymerization degree of each triblock polypeptide of PBLG segments can be obtained by all hydrolyze L- glutamic acid (PLGA) of) (PLL ₅₄ -PLGA ₈₀ -PLL ₅₄ ).
This PLL ₅₄ -PLGA ₈₀ -PLL ₅₄ typically has an axial length of 28.2 nm, and hydrophobic portions (portions shown by reference numerals 24A and 24B in FIG. 2) each have a length of 8.1 nm. The diameter may be 1.3 nm, the length of the hydrophilic portion (the portion indicated by reference numeral 22 in FIG. 2) may be 12.0 nm, and the diameter may be 1.2 nm.
As with the diblock type, the length (chain length) of each hydrophobic portion and / or hydrophilic portion in such a triblock polypeptide can be adjusted by adjusting the number of amino acid residues constituting the portion. Can be easily changed. In addition, the diameter (the thickness of the molecular structure) in each hydrophobic part and / or hydrophilic part can be easily changed by changing the type of amino acid residue constituting the part.

Next, the conductive fine particles will be described. The conductive fine particles can be used without particular limitation as long as they constitute conductors (electric wires, electrodes) in various electronic components. For example, those made of metal, alloy, carbon (carbon black, carbon nanotube, etc.), various conductive ceramics and the like can be mentioned. Among these, conductive fine particles made of a metal or an alloy are preferable. Examples thereof include metals such as gold, silver, copper, iron, platinum, palladium, nickel, chromium, zinc, cobalt, magnesium, and aluminum, alloys thereof, and metal oxides containing these metals as constituent elements. One kind of fine particles may be used, or two or more kinds having different compositions may be used at the same time.
The average particle size of the conductive fine particles to be used (meaning the average particle size based on microscopic observation, X-ray small angle scattering method, light scattering method, etc.) is not particularly limited, but is used for producing finer wiring. It is desirable that the size of fine particles to be reduced is small. It is preferable to use fine particles of a so-called nanoparticle (or cluster) having an average particle size of 100 nm or less (for example, 1 to 100 nm), particularly an average particle size of 10 nm or less (for example, 0.5 to 10 nm). Two or more kinds of fine particles having different average particles may be used at the same time. For example, a dense fine wiring can be formed by simultaneously using main nanoparticles and sub-nanoparticles having an average particle size of about 1/4 or less.
Such nanoparticles are prepared by various methods. In the present invention, nanoparticles prepared by a liquid phase synthesis method, a gas phase synthesis method, a pulverization method, or the like can be used. Chemical reduction method, for example, alcohol reduction method (that is, a method in which an organic metal compound contained in a solution is reduced with a polyhydric alcohol to generate a metal nucleus and is grown to obtain metal nanoparticles), electrolytic method, atomization method Conductive metal nanoparticles such as iron, gold, silver, and platinum obtained by the above can be preferably used.

As a typical method for imparting hydrophobic groups to conductive fine particles, the surface of the nanoparticles is modified with an organic compound having a hydrophobic group (typically a hydrocarbon group such as a long-chain alkyl group having 10 or more carbon atoms) ( Coating). For example, the surface of conductive fine particles such as iron and silver is surface-modified (coated) with an amphiphilic molecule having a hydrophobic group, typically a surfactant (for example, higher fatty acids such as oleic acid and stearic acid). Thus, conductive fine particles having a hydrophobic group suitable for the practice of the present invention can be obtained.
For example, when preparing metal nanoparticles based on the above alcohol reduction method, a surfactant (protective agent) such as a higher fatty acid is added to the reaction solution, so that the surfactant is coated with the surfactant. Metal nanoparticles (clusters) having groups on the surface can be obtained.
In addition, the preparation method of electroconductive fine particles and the surface modification method of the fine particles may be in accordance with a conventionally known method and do not characterize the present invention.

In the present invention, the above-described amphipathic linear polypeptide is used and regularly arranged on the surface of the substrate to form a thin film composed of the polypeptide.
Here, the material, shape, and size of the base material are not particularly limited as long as the target polypeptide can be arranged (attached) on the surface thereof. Various base materials (substrates) made of ceramic, glass, or metal can be used. When it is going to produce the wiring derived from conductive metal fine particles, it is preferable to use a base material made of ceramic or glass such as mica, alumina or silica. In order to facilitate the attachment of amphiphilic polypeptides, the substrate surface is pretreated in advance (for example, hydrophilization treatment using a chemical such as alkoxysilane or plasma, for example, poly (alkyl) siloxane modification treatment such as polymethylsiloxane). It is preferable to keep it.

As a method of forming a polypeptide thin film (polypeptide aggregate) by regularly arranging amphiphilic and linear polypeptides on the substrate surface, a thin film in which molecules such as a monomolecular film are regularly arranged is formed. The conventional method can be applied as it is or after being appropriately modified.
For example, application of the LB method is preferable. According to this method, linear (chain) polypeptides can be uniaxially oriented on the substrate, and the hydrophobic portions of the polypeptides can be juxtaposed in parallel with each other in the substrate horizontal direction. Specifically, the amphiphilic linear polypeptide is first floated on water or a suitable organic solvent. At this time, the polypeptide on the solvent forms a monomolecular film in a regularly arranged state, typically in a uniaxially oriented state. While maintaining this state, the predetermined substrate is raised and lowered vertically with respect to the surface of the solvent (monomolecular film forming layer). Thereby, the monomolecular film on the liquid surface can be transferred and arranged on the surface of the substrate. Thereby, as shown in FIG. 3 which is an example when the triblock type polypeptide 20 is used, the hydrophobic portions 24A and 24B of the amphiphilic polypeptide 20 are adjacent to each other in parallel in the horizontal direction of the base material. Thus, a monomolecular film 50 composed of polypeptide aggregates aligned in the axial direction (that is, uniaxially oriented) can be formed. A similar monomolecular film can also be formed when a diblock polypeptide (see FIG. 1) is used. Then, by repeating the transfer and arrangement of the monomolecular film from the liquid surface to the substrate surface, a cumulative film (LB film) in which the monomolecular film is accumulated can be formed. Since the LB method itself is a well-known method, further detailed description is omitted.

In a preferred embodiment of the present invention, the conductive fine particles having hydrophobic groups as described above are supplied to the polypeptide thin film formed on the substrate, and the conductive fine particles are added to the hydrophobic portion of the polypeptide thin film. . Typically, the conductive fine particles can be easily added to the hydrophobic portion of the polypeptide thin film by a conventionally known solution casting method, spin coating method or the like. For example, a dispersion is prepared by dispersing conductive fine particles having a hydrophobic group in an appropriate solvent (preferably a nonpolar organic solvent such as hexane) at an appropriate concentration, and the dispersion is applied to a polypeptide thin film on a substrate. A casting method characterized by dripping an appropriate amount of and then slowly evaporating the solvent is suitable.
As a result, as shown in FIG. 4 which is an example when the polypeptide thin film 50A made of the triblock type polypeptide 20 is used, the fine particles 40 dispersed on the polypeptide thin film 50A pass through the hydrophobic group on the surface thereof. It is added (adsorbed) to the hydrophobic portions 24A and 24B of the polypeptide 20 constituting the thin film by hydrophobic interaction.

  Alternatively, as another embodiment of the present invention, before forming a thin film on a substrate, conductive fine particles with hydrophobic groups are previously applied to the hydrophobic portion of the polypeptide, and then the polypeptide with fine particles is added. You may arrange regularly on a base material by LB method etc. This embodiment is suitable when the average particle size of the conductive fine particles used is relatively small while the polypeptide chain is relatively long. For example, an appropriate amount of amphiphilic polypeptide is added to a dispersion in which conductive fine particles having a hydrophobic group are dispersed at an appropriate concentration in an appropriate solvent (for example, a nonpolar organic solvent such as hexane), and several minutes to several By maintaining the time, as shown in FIG. 6, the polypeptide 20A in which the conductive fine particles 40 are added to the hydrophobic portions 24A and 24B of the amphiphilic polypeptide (triblock polypeptide in the figure) is prepared. Can do. Then, by performing the LB method as described above using the obtained polypeptide 20A, a polypeptide thin film (typically uniaxial) composed of the polypeptide with conductive fine particles regularly arranged on the substrate. An oriented monomolecular film 50A (see FIG. 4) can be formed.

In the polypeptide thin film produced on the substrate as described above, as shown in FIG. 4, a pattern consisting of conductive fine particles 40 corresponding to the regularly arranged polypeptide hydrophobic portions 24A and 24B, that is, wiring Is formed. Next, the substrate in this state is heated under appropriate conditions, and the organic components constituting the thin film containing the polypeptide and the hydrophobic group are burned out (in other words, the conductive fine particles are baked), as illustrated in FIG. A fine wiring 60 made of an aggregate of conductive fine particles 40 can be produced on a substrate.
In addition, what is necessary is just to set a heating (baking) condition suitably according to the composition of the electroconductive fine particle and / or base material which were used. For example, when metal fine particles of a type that is fired at a relatively low temperature, such as gold or silver, are typically heated to about 500 to 800 ° C. Further, when metal fine particles of a type fired at a relatively high temperature, such as platinum and palladium, are used, it may be heated to about 1000 to 1300 ° C. What is necessary is just to set the atmosphere at the time of a heating suitably according to the use of the composition of electroconductive fine particles, and the use of the electronic component (base material) which it is going to manufacture. For example, when metal fine particles composed of noble metals such as gold and silver are used, it is typically heated in the atmosphere (oxygen-containing atmosphere), and when metal fine particles composed of base metals such as copper and iron are used. Specifically, heating is performed in a non-oxidizing atmosphere such as nitrogen.
Alternatively, instead of means for heating the substrate itself, a thin film containing a polypeptide and a hydrophobic group by irradiating the substrate with laser light of a predetermined wavelength using a laser beam irradiation device such as a carbon dioxide laser or a YAG laser. The constituent organic components may be eliminated (transpiration). According to such laser light irradiation, since it is not necessary to heat the whole substrate, a finer wiring with higher accuracy can be formed. For this purpose, laser beams used in various laser processing apparatuses (for example, laser hardening apparatuses), laser marking apparatuses, laser scalpels, and the like can be applied.

  The present invention will be described in more detail with reference to the following examples. However, the present invention is not intended to be limited to those shown in the examples.

<Example 1>
Iron nanoparticles with long chain alkyl groups were prepared by the alcohol reduction method. That is, iron (III) acetylacetonate (Fe (acac) ₃ ), 1,2-hexadecanediol (reducing agent), oleic acid (surfactant) and dioctyl ether (high-boiling organic solvent) are weighed appropriately. The reaction vessel (flask with mantle heater) was filled. While stirring the solution well using a stirrer, Ar gas was passed through the flask as an inert gas to replace the gas. The solution was then refluxed and heated to near the boiling point of the organic solvent (here, 286 ° C.). By performing the alcohol reduction method, iron nanoparticles having an average particle size of about 7 nm and having a surface coated with oleic acid were prepared. Next, the obtained iron nanoparticles are collected and redispersed in a nonpolar organic solvent (here, n-hexane) to obtain a suspension having a particle concentration of 1.41 × 10 ⁻⁷ mol / L. It was.

On the other hand, the PBLG segment of the hydrophobic polypeptide PLL ₅₄ -PBLG ₈₀ -PLL ₅₄ , which is a polymer of amino acid anhydride (NCA), is completely hydrolyzed to obtain the triblock polypeptide PLL ₅₄ -PLGA ₈₀ -PLL shown in Formula 2. ₅₄ was obtained. Subsequently, PLL ₅₄ -PLGA ₈₀ -PLL ₅₄ is developed on a water surface adjusted to pH 4 and subjected to the LB method, and a polypeptide thin film (monomolecular film) in which PLL ₅₄ -PLGA ₈₀ -PLL ₅₄ is uniaxially oriented is obtained. It was formed on the surface of a mica substrate (14 mm × 15 mm).

Next, 2-5 μL of the iron nanoparticle suspension was dropped onto the thin film on the surface of the mica substrate. Thereafter, the substrate was vacuum-dried for about 1 hour using an aspirator, and n-hexane on the substrate was almost completely evaporated.
After this treatment, the iron nanoparticles arranged on the substrate were observed using an AFM, that is, an atomic force microscope (Digital Instrument product: Nanoscope IIIa (trademark)). Here, the observation was performed in the atmospheric tapping mode. As the probe, a single crystal for tapping mode (Digital Instrument product: Nanoprobe TESP (trademark), cantilever length: 125 μm) was used. FIG. 7 shows an AFM image (about 100 nm × 100 nm) as an observation result.
As shown in FIG. 7, it has been clarified that a large number of fine particles are connected and assembled in a lane shape at regular intervals. The lane interval was about 31 nm. This interval is a value substantially corresponding to the stripe interval (29 nm) of a monomolecular film composed of the amphipathic polypeptide PLL ₅₄ -PLGA ₈₀ -PLL ₅₄ that was the template. This indicates that the iron nanoparticles are selectively adsorbed to the hydrophobic part in the monomolecular film through the hydrophobic group (oleic acid) based on the hydrophobic interaction. Therefore, it was confirmed that the monomolecular film based on the LB method formed in this example is suitable as a template for forming fine wiring on the substrate because of its regular arrangement structure.
After the AFM observation, this base material was heated to 700 ° C. or higher in a nitrogen atmosphere to burn off organic components, and fine wiring (nano wiring), which was a sintered body of iron nanoparticle aggregates, was produced on a mica substrate.

  Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. In addition, the technical elements described in the present specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology illustrated in the present specification or the drawings achieves a plurality of objects at the same time, and has technical utility by achieving one of the objects.

It is a schematic diagram which shows the suitable example (diblock type polypeptide) of an amphipathic linear polypeptide. It is a schematic diagram which shows the suitable example (triblock type polypeptide) of an amphipathic linear polypeptide. It is a figure which illustrates typically the structure of the monomolecular film comprised from the triblock type | mold polypeptide. It is a figure which illustrates typically the state by which electroconductive fine particles were provided (adsorbed) to the monomolecular film comprised from the triblock type | mold polypeptide. It is a figure which illustrates typically the fine wiring which consists of an aggregate | assembly of the electroconductive fine particles formed on the base material. It is a figure which illustrates typically the state by which electroconductive fine particles were provided (adsorbed) to the hydrophobic part of a triblock type polypeptide molecule. It is an atomic force microscope (AFM) image which shows the arrangement | positioning state of the iron nanoparticle in the polypeptide thin film (monomolecular film) obtained in one Example.

Explanation of symbols

10 Amphiphilic linear polypeptide (diblock polypeptide)
20,20A amphipathic linear polypeptide (triblock polypeptide)
12, 22 Hydrophilic part 14, 24A, 24B Hydrophobic part 40 Conductive fine particles 50, 50A Polypeptide thin film (monomolecular film)
60 fine wiring

Claims (7)

A method for producing fine wiring on a substrate, comprising the following steps:
Providing an amphiphilic linear polypeptide in which at least one hydrophilic part and one hydrophobic part are formed in the axial direction;
Forming a polypeptide thin film in which the polypeptides are regularly arranged on the surface of a predetermined substrate;
Supplying conductive fine particles having a hydrophobic group to the polypeptide thin film, and adding the conductive fine particles to the hydrophobic portion of the polypeptide thin film through the hydrophobic group; and hydrophobicity of the polypeptide and the conductive fine particles Eliminating the group and forming a fine wiring composed of conductive fine particles corresponding to the regular arrangement pattern of the polypeptide;
Including the method. A method for producing fine wiring on a substrate, comprising the following steps:
Providing an amphiphilic linear polypeptide in which at least one hydrophilic part and one hydrophobic part are formed in the axial direction;
Supplying conductive fine particles having a hydrophobic group to the polypeptide, and adding the conductive fine particles to the hydrophobic portion of the polypeptide via the hydrophobic group;
Forming a polypeptide thin film in which the polypeptide to which the conductive fine particles are added is regularly arranged on the surface of a predetermined substrate; and eliminating the hydrophobic groups of the polypeptide and the conductive fine particles, Forming a fine wiring composed of conductive fine particles corresponding to a regular arrangement pattern of the polypeptide;
Including the method.   At least a part of the polypeptide thin film is composed of a polypeptide assembly in which the hydrophobic portions of the polypeptide are aligned in the axial direction so as to be adjacent to each other in parallel in the horizontal direction of the base material. The method according to claim 1 or 2.   The method according to claim 3, wherein the polypeptide thin film is a monomolecular film or a cumulative film formed based on the Langmuir-Blodgett method.   The method according to claim 1, wherein the conductive fine particles are fine particles made of a metal or an alloy having an average particle size of 100 nm or less.   The method according to claim 5, wherein the conductive fine particle having a hydrophobic group is obtained by binding an amphiphilic molecule having a long-chain hydrocarbon group to the fine particle. The electronic component provided with the fine wiring of the predetermined pattern produced by the method in any one of Claims 1-6.