JP2005199571A - Manufacturing process of recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To contribute to a highly reliable recording head manufacturing process by forming an ink channel surely. <P>SOLUTION: In the manufacturing process of recording head where a second member including an ink channel for supplying ink externally into a liquid chamber is bonded to a first member including a nozzle for ejecting ink, a liquid chamber for supplying ink to the nozzle, first and second modules including an element generating energy for ejecting ink and a drive circuit, and a module connection means for electrically connecting the first and second modules, the first and second members abut against each other while inclining previously, first sealing agent is injected to the abutting part and second sealing agent is formed at the abutting part after elapsing a predetermined time. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to an ink jet recording head that performs recording by ejecting a recording liquid (ink or the like) from a discharge port (orifice) as a flying droplet and depositing it on a recording medium, an ink jet recording apparatus equipped with the recording head, and The present invention relates to a method for manufacturing the head.

  In general, a recording head used in an inkjet recording apparatus communicates an ejection port for ejecting ink, a liquid chamber for temporarily storing ink supplied to the ejection port, and the ejection port and the liquid chamber. Depending on the shape of the liquid flow path, the energy generating element for generating the energy for discharging ink provided in a part of the liquid flow path, the supply port for supplying ink from the outside to the liquid chamber, etc. Although the shape is changed, the ink passage member is configured to supply ink in communication with the supply port.

Hereinafter, the configuration of an ink jet recording head (hereinafter referred to as a recording head) according to the prior art will be described in detail. FIG. 1 is an exploded view of the recording head, and FIG. 2 is a partially enlarged view. Reference numeral 110 denotes a ceramic base plate, for example.

  The base plate 110 fixes the printed circuit board 120 and the silicon chip 150 including nozzles, nozzle heaters, and the like for discharging ink after positioning. After being fixed, the printed circuit board 120 and the silicon chip are electrically connected by wire bonding 190.

  FIG. 3 is a combined cross-sectional view. The above-described silicon chip 150 includes an ink discharge port (nozzle) 151, a liquid chamber (A) 153 for temporarily storing ink supplied to the discharge port 151, the discharge port 151 and the liquid. An ink flow path 152 communicating with the chamber (A) 153, a nozzle heater 154 provided in the ink flow path 152, and the like are provided.

  The nozzle heater 154 is provided independently for each of a large number of ink discharge ports (nozzles) 151 included in the recording head, and is selectively heated according to image data.

  Hereinafter, the base plate 110, the silicon chip 150, and the printed circuit board 120 that are integrally connected will be referred to as an ink discharge element 160.

Returning to FIG. 1, after appropriate positioning with respect to the combined ink discharge element 160, the ink passage member 210 is further combined.
The ink passage member 210 that supplies ink to the ink supply port 155 (see FIGS. 2 and 3) needs to be made of a material that is not easily plastically deformed even if heated to some extent. The material used in this recording head is polyphenylene sulfide (PPS). However, if the heat-resistant temperature is high and the ink used in the recording head and the precipitates that are immersed in the high-temperature, high-pressure environment do not adversely affect the nozzle heater 154 in the discharge element, the other Material may be used.

  4 and 5 are diagrams showing the completion of the head.

  Ink supplied from a detachable ink tank (not shown) is filtered by a filter 215 to prevent dust and dirt from entering the liquid chamber 153 of the recording head. The filter 215 is made of, for example, metal fibers woven at intervals of 8 μm on all sides, that is, dust up to 8 μm on all sides is trapped by the filter 215.

  The ink passage member 210 is provided with an ink passage from the filter 215 to the ink supply port 155 provided in the silicon chip 150.

FIG. 6 is a cross-sectional view that well represents the configuration of the head.
Since it is necessary to shut off the ink flow path (220 to 155) and the outside at the joint between the silicon chip 150 and the ink passage member 210, the ink discharge element 160 and the ink passage member 210 are joined and sealed. There is a step of injecting a stopper. The sealing step is divided into two steps, and the ink flow path from the outside by the sealing agent 301 injected from the sealing agent injection port 240 and the sealing agent 302 injected from the injection port 241 from the outside. Blocked.

  FIG. 7 is a view showing the ink passage member 210, and FIG. 8 is a detailed description of a part thereof. The injection of the sealing agents 301 and 302 is performed after the ink passage member 210 is coupled to the ink discharge element 160 as described with reference to FIG. 6, but in order to facilitate understanding, the sealing agent using the ink passage member 210 alone will be described below. The injection method 301 and 302 and the flow state will be described.

  A groove 211 for encapsulating a sealant is dug around the liquid chamber (B) 220 that communicates with the ink supply port 155 provided in the silicon chip 150 (see FIG. 3). The groove 211 is provided with an injection port 240 leading to the opposite surface, and the sealant injected (see FIGS. 1 and 6) from the opposite surface (see FIGS. 1 and 6) is formed on the silicon chip surface 156. In the range indicated by 215 (see FIG. 8), the liquid chamber (B) 220 is sealed from the outside in the range indicated by 215 (see FIG. 8). Call).

  Further, an upper part of the liquid chamber (B) 220 is similarly provided with an inlet 241 leading to the opposite surface for injecting the sealing agent, and at least the inlet 241 has the liquid chamber (B) 220 downward. In a state where it is inclined, a sealing agent is injected from the injection port 241 on the back surface of the figure (see FIGS. 1 and 6). The sealant 302 injected from the injection port 241 flows in the direction of the liquid chamber (B) 220 due to its own weight. However, as described later, a slight clearance f is formed between the tip end surface of the rib 230 and the silicon chip surface 156. (See Fig. 6) As shown in Fig. 6, the sealant 302 penetrates the clearance f with a capillary force, and the capillary force does not work at the portion g and stops flowing due to its own surface tension. To do.

  Therefore, the liquid chamber 220 is sealed from the outside in the range indicated by 216 in FIG. 8 (this process is hereinafter referred to as back sealing). At this time, since the sealing agent 302 is also sealed in the wire bonding 190 portion, electrical insulation with respect to the ink is also achieved.

  The above-described sealing agent injection is performed by a disperser capable of discharging a certain amount of liquid. For example, the injection port 240 has a hole diameter increased on the opposite surface as shown in FIG. Care is taken so that the tip of the hook can easily enter.

  FIG. 9 shows a cross-sectional view of the ink passage member 210. The ribs 231 and 232 for forming the sealing agent passage 211 at the time of the front sealing and the ribs for blocking the sealing agent 302 at the time of the rear sealing are shown. 230. These ribs are designed such that the rib 230 is lower than the ribs 231 and 232 by h to ensure that at least the ribs 231 and 232 abut against the silicon chip surface 156 when coupled to the ink ejection element 160.

  Specifically, the ink passage member 210 tightens the screw 112 (see FIG. 5) until the boss tip surface 212 (see FIGS. 7 and 9) and the ceramic plate surface 111 (see FIGS. 3 and 6) contact each other. It is fixed to the ink discharge element 160.

  In this process, the ribs 231 and 232 first come into contact with the silicon chip surface 156, and at this point, the clearance is still left between the boss tip surface 212 and the base plate surface 111, and then the screws are tightened until the clearance becomes zero. As a result, the ribs 231 and 232 are pressed against the silicon chip surface 156.

  At this time, the clearance f between the rib 230 and the silicon chip surface 156 is set to be as narrow as possible in consideration of component tolerances. Alternatively, the rib 230 can be brought into contact with the silicon chip surface 156 by using the deflection of the ink passage member 210 by tightening the screws 112 after the ribs 231 and 232 have been brought into contact with the silicon chip surface 156. It needs to be done more strictly.

For reference, when the rib 230 is higher than the ribs 231 and 232, the rib 230 first comes into contact with the silicon chip surface 156, and then the ribs 231 and 232 are in a seesaw state when the screw 112 is tightened. It does not contact the surface 156 and leaks to the outside when the sealant 301 is injected.
Although somewhat different from the above conventional example, there is also a proposal in which a thermal expansion member is provided around the gap between the ink supply port of the recording head and the ink supply member as a clear proposal similar to the object of the present invention.
(For example, Patent Document 1)

JP 07-032597 (pages 3-4, Fig. 3)

  In these ink jet heads, an ink flow path is formed by a method of pressing a component divided into several parts, or a method of bonding sometimes.

  In particular, as described above, the sealant is used to form the ink flow path at the connection portion between the silicon chip supply port and the ink passage member in the ink jet head. In order to reliably perform such a sealing step, it is necessary to consider that the ink flow path is reliably blocked from the outside and that the sealant does not flow into the ink flow path portion.

  However, according to the conventional configuration, it is difficult to make sure that all the ribs for performing the front-rear sealing process are in contact with the silicon chip surface. Therefore, a slight clearance is usually provided between the silicon chip surface and the rib on the back sealing side. However, the flow of the sealing material to be injected is not stable, and the risk of the sealing material flowing into the ink flow path. was there.

  In addition, even if strict part tolerance management is performed and all the ribs for performing the front-rear sealing process are brought into contact with the silicon chip surface, the pressing may be insufficient or non-uniform. There is a risk that the stopper flows into the ink flow path.

  Depending on the amount of the sealant that has flowed into the ink flow path, the ink flow may be adversely affected, and the ink flow path may be blocked in some cases, making the recording characteristics of the recording head unstable.

  Further, even with the improved method according to Patent Document 1 (Japanese Patent Application Laid-Open No. 07-032597), there is still a concern of intrusion into the lower heating element region due to uneven application of the thermal expansion agent and sag in the width direction.

In order to solve the above problems, the present invention has been devised, and each means described below has been implemented.
That is, the recording head manufacturing method according to the present invention includes:
A first and a second module including a nozzle for ejecting ink, a liquid chamber for supplying ink to the nozzle, an energy generating element for generating energy for ejecting the ink, and a drive circuit; the first and second modules; In the recording head manufacturing method for coupling the first member including module connecting means for electrically connecting the module and the second member including an ink passage for supplying ink to the liquid chamber from the outside,
The first and second members are inclined and contacted in advance, a first sealing material is injected into the contact portion, and a second sealing material is formed at the corresponding contact portion after a predetermined time. .

Also, the recording head manufacturing method of the present invention includes:
The region where the first sealing material is formed and is in contact does not include the region where the energy generating element and the liquid chamber are arranged.

Also, the recording head manufacturing method of the present invention includes:
A region where the first sealing material is formed and abutted includes a region where the module connecting means is disposed.

Also, the recording head manufacturing method of the present invention includes:
The region where the second sealing material is formed does not include a region where the liquid chamber and the module connecting means are arranged.

Also, the recording head manufacturing method of the present invention includes:
The first sealing material is a sealing agent that hardens from a fluidity to a non-fluid elastic body.

Also, the recording head manufacturing method of the present invention includes:
The second sealing material is a sealing agent that cures from a fluid to a non-fluid elastic body.

Also, the recording head manufacturing method of the present invention includes:
The first and second sealing materials are the same material.

  By carrying out the present invention, it is possible to reliably form an ink flow path and contribute to a highly reliable recording head manufacturing method.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  10 and 11 show an example of an ink jet recording apparatus equipped with a recording head embodying the present invention.

  The recording head 100 embodying the present invention is mounted on a carriage 600 and supplied with ink from an ink tank 700. 900 is a recovery unit of the recording head, and a sheet (recording medium) 1000 is conveyed by the conveying device 500 in the direction of the arrow.

  A platen 515 provided with sensors S10 and S20 for detecting the sheet 1000 and positioned on the rollers 510 and 530 for conveying the sheet 1000 and having a space in the ink ejection area of the recording head 100, and the conveying roller 510 A support shaft 511 that is detachably supported by 1000, a contact spring 512 that contacts the conveyance roller 510 with the sheet 1000, and a separation solenoid 513 that separates the conveyance roller 510 from the sheet 1000 are provided.

  The carriage 600 includes a rotatable head guide 610 that holds the recording head 100, a carriage shaft 620 that supports the head carriage 600 movably in the H direction in the figure, an actuator 630 that drives the carriage shaft, and driving of the actuator 630. Is transmitted to the head carriage 600.

  The head recovery unit 900 has a cap rubber 910 for capping the head discharge port surface, a wiper blade 920 for wiping the head discharge port surface, and a capping rubber. In addition, an ink reservoir 930 for catching ink that is forcibly sucked from the recording head 100 by an ink pump (not shown) is provided.

  The operation of the recording apparatus will be described.

  The recording apparatus that has received a print command from the user uses a central processing unit (not shown) to mount a carriage 600 on which the recording head 100 that is in a sealed state on the head recovery unit is mounted by an actuator (carriage motor) 630. Move the paper (sheet) 1000 in the width direction. Next, when the user inputs the sheet 1000 in the direction of the sensor S10, the conveyance rollers 510 and 530 start driving, convey the sheet 1000 in the Z direction in the figure, and eventually pass through the sensor S20. The recording apparatus that has detected the leading edge of the sheet 1000 calculates from the detected position and starts a recording operation based on the recording data at the timing when the recording position of the recording head 100 that has been stationary is reached.

  The recording-completed sheet is discharged, then the second sheet 1000 is conveyed, and the recording operation is continuously repeated.

  Since the basic configuration related to the recording head 100 is the same as that described in the conventional example, it will be omitted, and a detailed description will be given below on an embodiment in which the recording head 100 sealing method according to the present invention is applied to the back sealing step.

  The back sealing step according to the present invention is divided into two steps. In the first back sealing step, as shown in FIG. 12, the discharge element 160 is maintained at an inclination of θ1 (0 ≦ θ1 <90) with respect to the horizontal direction. In this state, a sealant 351 is dropped at a position of 0 near the connection portion between the printed circuit board 120 and the wire bonding 190 and filled to the surface of the figure. During dropping, the encapsulant 351 flows in the direction of the lower silicon chip 150 while including the wire bonding 190, beyond the first silicon chip edge 171, and subsequently reaches the second silicon chip edge 172. The flow is stopped by its surface tension. Therefore, it is necessary to adjust the value of the θ1, the amount of the sealing agent 351 to be dropped, and the dropping position so as to exceed the first silicon chip edge 171 and stop at the second silicon chip edge 172.

After completion of the first sealing step, the discharge element 160 is left until the curing of the sealing agent 351 proceeds to a desired value.
Preferably, the process proceeds to the next step after waiting for a semi-cured state in which the skin layer is formed on the surface.

  FIG. 13 shows a cross section showing in detail the vicinity of the contact portion of the ink passage member 250 reflecting the present invention, particularly with the silicon chip surface 156. The ribs 261 and 262 used in the front sealing process are higher than the rib 263 on the rear sealing side by h as in the conventional case, but the rib 264 used for rear sealing newly provided by the present invention is the rib 261. , 262 is provided high.

  FIG. 14 shows a state in which the ink passage member 250 is coupled to the ink discharge element 160 after the first back sealing step, and is formed by the newly provided rib 264 and the first back sealing step. The overlap region P is formed with the cured sealant 351 thus formed. Further, as described in the prior art, the rib 263 is provided with a clearance f between the silicon chip surface 156 so as not to affect the contact state between the front sealing ribs 261 and 262 and the silicon chip surface 156. If there is no problem with the shape of the ink flow path, the clearance f may be enlarged or the rib 263 itself may be eliminated.

  After the ink passage member 250 is coupled to the ink discharge element 160 in this way, as shown in FIG. 15, a pre-sealing process is performed as in the prior art, and then the second sealing is performed from the inlet 270 provided in the ink passage member 250. A second back sealing step for injecting the stop agent 352 is performed.

  According to the present invention, the second sealant 352 injected by the second back sealing step is an overfill of the rib 264 and the cured sealant 351 formed by the first back sealing step. -The flow is blocked at the corresponding contact position by the packing effect obtained by the wrap region P. Since the contact portion is formed on one side by the sealant 351 having elasticity after curing, the height tolerance of the rib 264 can be allowed in a wide range and a highly reliable packing effect can be obtained.

  Further, it is preferable that the position of the overlap region P does not fall within the range T of the wire bonding 190. Thereby, when the ink passage member 250 is coupled, the stress exerted on the wire bonding 190 itself, the connection portion between the silicon chip 150 and the printed circuit board 120 by the deformation of the cured sealing material 351 can be further reduced.

  Further, the shape of the rib 264 is not limited to the shape shown in the present embodiment, and is formed in the first back sealing step when the second sealing agent 352 is injected in the second back sealing step. It is obvious that the same effect can be obtained by providing the ink passage member 250 with a shape that contacts the cured sealant 351.

Further, the cured sealant formed in the first rear sealing step may have a protrusion on the silicon chip surface 156. In this case, a shape in which the rib 264 is lower than the ribs 261 and 262 is also included in the present invention.
Further, the present invention is not limited to the back sealing process, and can be widely applied to inkjet recording heads that require particularly precise assembly.

  According to the present invention, as described in the first embodiment, the desired purpose is achieved by making the back sealing process into two steps and giving the rib the ink passage member a characteristic. The member will be described as a conventional means for achieving the purpose. Specifically, in the first back sealing step, a means for forming a protrusion shape for providing a packing effect with the ink passage member is provided. .

  As shown in FIG. 16, in a state where a tape member 380 having a thickness equivalent to a desired protrusion amount is attached to the silicon chip surface 156 of the discharge element 160, the discharge element 160 is shown as θ2 (0 ≦ θ2 < 90), the sealant 401 is dropped at a position Q near the connection portion between the electric wiring board 120 and the wiring (wire bonding) 190.

  After dripping, the sealant 401 flows downward in the direction of the silicon chip 150 while containing the wire bonding 190, exceeds the first silicon chip edge 171, and the tip of the flowing sealant is on the silicon chip surface 156. When the tape member edge 381 is reached, the flow is stopped by its own surface tension.

  Therefore, it is necessary to adjust the value of θ2, the amount of the sealing agent 401 to be dropped, and the dropping position Q to a value that exceeds the first silicon chip edge 171 and stops at the tape member edge 381.

  After the operation, the discharge element 160 is left in accordance with the curing conditions until the sealant 401 finishes the desired curing. Thereafter, the tape member 380 attached on the silicon chip surface 156 is peeled off to form a cured sealant 401 having a desired projection amount R. After the tape member 380 is peeled off, if the adhesive layer remains on the silicon surface 156, it is difficult to clean. Therefore, the adhesive layer does not remain or the amount of energy formed in the silicon chip 150 does not remain. It is preferable to use an element that can be suppressed to an amount that does not adversely affect the generating element 154 and the ink flow path, or an element that is formed of a substance that does not adversely affect the adhesive layer itself.

  FIG. 17 shows a state in which the ink passage member 210 is assembled to the ejection element 160 after the first back sealing step, and particularly shows the vicinity of the silicon chip 150 in detail. In order to facilitate understanding of the characteristics of this embodiment, the ink passage member is the same as that described in the conventional example.

  The clearance f on the rib 230 used for the second back sealing and the silicon chip surface 156 is filled with the hardened sealant 401 having the protrusion amount R formed by the first back sealing process, and further the overfill. -A wrap region S is formed.

  The second sealing step is the same as that of the first embodiment, and detailed description thereof is omitted. However, the flow of the sealing material dripped by the packing effect obtained by the overlap region S is blocked.

  The tape member 380 may not be attached to the position used in the above description. For example, even if the tape member 380 is provided on the silicon chip surface 156, a similar clearance can be obtained by setting the clearance with the rib 230. It is clear that an effect can be obtained.

  Furthermore, the embodiment described in Example 1 and this example may be used in combination.

  The present invention is not limited to the back sealing process, and can be widely applied to inkjet heads that require particularly precise assembly.

  The present invention can be used in a method for manufacturing a recording head with high reliability.

FIG. 3 is an exploded view of a recording head. It is an exploded view (partially detailed view) of the recording head. It is a fragmentary sectional view of a silicon chip peripheral part. It is an external view of a recording head. It is an external view of a recording head. It is sectional drawing of the silicon chip periphery part in the conventional recording head. It is an external view of an ink passage member. FIG. 6 is a partial detail view of an ink passage member. It is a partial detail sectional view of an ink passage member. It is a schematic diagram showing an example of an ink jet recording apparatus equipped with a recording head according to the present invention. It is a front sectional view showing an example of an ink jet recording apparatus equipped with a recording head according to the present invention. It is sectional drawing showing the 1st back sealing process by the 1st Example of this invention. FIG. 3 is a detailed cross-sectional view of an ink passage member according to the first embodiment of the present invention. FIG. 5 is a detailed cross-sectional view of the ink flow path member when assembled according to the first embodiment of the present invention. FIG. 3 is a detailed cross-sectional view after the sealing step according to the first embodiment of the present invention. It is sectional drawing showing the 1st back sealing process by the 2nd Example of this invention. FIG. 3 is a detailed cross-sectional view when the ink flow path member is assembled according to the first embodiment of the present invention.

Explanation of symbols

100 recording head
110 Base plate
120 PCB
150 silicon chip
151 Nozzle (Discharge port)
152 Ink channel
153 Liquid chamber (A)
154 Nozzle heater (energy generating element)
155 Ink supply port
156 Silicon chip surface
160 Dispensing element
171 First silicon chip edge
172 Second silicon chip edge
190 Wire bonding

220 Liquid chamber (B)
250 Ink passage member

301 Sealant
302 Sealant
351 Sealant

401 Sealant

500 Conveyor
510 Conveyor roller
530 Transport roller

600 carriage
700 ink tank
900 recording head recovery unit
1000 sheets (recording medium)

Claims (7)

A first and a second module including a nozzle for ejecting ink, a liquid chamber for supplying ink to the nozzle, an energy generating element for generating energy for ejecting the ink, and a drive circuit; the first and second modules; In the recording head manufacturing method for coupling the first member including module connecting means for electrically connecting the module and the second member including an ink passage for supplying ink to the liquid chamber from the outside,
The first and second members are inclined and contacted in advance, a first sealing material is injected into the contact portion, and a second sealing material is formed at the corresponding contact portion after a predetermined time. Recording head manufacturing method. 2. The recording head manufacturing method according to claim 1, wherein a region where the first sealing material is formed and abutted does not include a region where the energy generating element and the liquid chamber are arranged. 2. The method for manufacturing a recording head according to claim 1, wherein the area where the first sealing material is formed and abutted includes an area where the module connecting means is disposed. 4. The recording head manufacturing method according to claim 1, wherein a region where the second sealing material is formed does not include a region where the liquid chamber and the module connecting means are arranged. 5. The recording head manufacturing method according to claim 1, wherein the first sealing material is a sealing agent that hardens from a fluidity to a non-fluid elastic body. 2. The recording head manufacturing method according to claim 1, wherein the second sealing material is a sealing agent that hardens from a fluidity to a non-fluid elastic body. 2. The recording head manufacturing method according to claim 1, wherein the first and second sealing materials are the same material.

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