JP2005197562A5 - - Google Patents

Claims (13)

A cooling jacket molded from resin and provided with a recess;
A semiconductor module having a heat dissipating surface, the semiconductor module being placed on the cooling jacket and covering the recess with the heat dissipating surface,
A power conversion device characterized in that a region surrounded by the recess and the heat radiating surface is a flow path of cooling water. The semiconductor module comprises a semiconductor module in which at least an insulating substrate having a front surface and a back surface and a semiconductor element mounted on the surface of the insulating substrate are sealed with resin,
The power converter according to claim 1, wherein the heat dissipation surface is a back surface of the insulating substrate. The power converter according to claim 2, wherein the back surface of the insulating substrate is further covered with a metal film. The power converter according to claim 1, further comprising a plate-like pressing member that is placed on the semiconductor module and sandwiches the semiconductor module between the cooling jacket. 5. The power conversion device according to claim 4, wherein the plurality of semiconductor modules are arranged on the cooling jacket at predetermined intervals, and are sandwiched between the cooling jackets by one pressing member. . 6. The power converter according to claim 5, wherein the pressing member is made of a metal plate, and has a bent portion bent from the plate-like plane and a slit sandwiched between portions in contact with the semiconductor module. Further, the cooling jacket includes a wall portion surrounding the periphery of the semiconductor module, an upper end of the wall portion is covered with a lid portion, and a portion surrounded by the wall portion and the lid portion is a casing. The power conversion device according to claim 1. 8. The power conversion apparatus according to claim 7 , wherein a control means for controlling the semiconductor module and a capacitor are provided in the housing . The power conversion device according to claim 1, wherein the cooling jacket and a wiring conductor connected to the semiconductor module are integrally formed. The cooling jacket has a base portion protruding from the bottom surface of the recess,
An inlet-side header channel and an outlet-side header channel provided substantially parallel to each other with the platform interposed therebetween, and the inlet-side header channel and the outlet-side header channel on the platform. The power conversion device according to claim 1, further comprising a cooling flow path connecting the two. A plate-shaped partition plate extending outward from the upper surface of the table portion is placed on the table portion, the upper side of the partition plate serves as the cooling flow path, and the lower side of the partition plate is the inlet-side header stream. The power conversion device according to claim 10 , wherein the power conversion device is a path and the outlet-side header flow path. The power converter according to claim 11 , wherein the partition plate has a protruding portion protruding from the cooling channel on the surface. Furthermore, the opening part was provided in the bottom face of the said recessed part, and this opening part was closed with the metal plate which mounted the capacitor | condenser, The power converter device in any one of Claims 10-12 characterized by the above-mentioned.