JP2005191333A - Semiconductor device and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the stability when a projection part of a chip lamination type semiconductor device is machined by preventing a die pad from shifting in resin sealing and keeping the strength of the projection part sufficient. <P>SOLUTION: A plurality of semiconductor chips 2 and 3 are mounted on the die pad 5 supported by a plurality of suspension leads 4, a lead frame is sandwiched between a bottom mold and a top mold 14 of a sealing mold 12 and sealing resin 10 is injected into the sealing mold 12 to form a resin-sealed semiconductor device. On a suspension lead 4, the projection part 17 which projects toward an inner wall surface 13a of the bottom mold 13 is formed through depression processing and has a 1st-step bent part and a 2nd-step bent part formed by bending a portion of the suspension lead 4 along the plate thickness and divided into two steps, a projection end 17g of the projection part 17 being exposed on the reverse surface of the sealing resin 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a chip stacked type semiconductor device in which a plurality of semiconductor chips are mounted in one package, and a method for manufacturing the same.

  The standardized surface-mount type semiconductor package technology now has a semiconductor chip mounted on a die pad of a copper (Cu) alloy or iron-nickel (Fe-Ni) alloy lead frame by die bonding, and the bonding pad ( The electrode pad) and the tip of the lead frame lead portion are wire-bonded with a fine metal wire such as a gold (Au) wire, and resin-sealed (resin-molded) with a sealing mold having a predetermined shape. Is configured.

  2. Description of the Related Art With the recent increase in functionality, size, and thickness of electronic devices, semiconductor devices are becoming thinner. Therefore, in such a thin semiconductor device, since a lead frame with a narrow suspension lead is used, it is necessary to design in consideration of die pad shift at the time of resin sealing due to a decrease in strength of the suspension lead. .

Hereinafter, a conventional surface-mount type semiconductor device will be described with reference to FIGS.
As shown in FIG. 17, in a conventional semiconductor device 40, a semiconductor chip 43 is mounted on a die pad 42 of a lead frame 41 by die bonding via an adhesive 44, and a bonding pad (not shown) of the semiconductor chip 43 and a lead are mounted. The tip of the inner lead portion 44a of the frame 41 is wire-bonded with a thin metal wire 45 to be electrically connected, and is molded with a sealing resin 46 with a sealing mold having a predetermined shape to constitute the semiconductor device 40. doing. Further, the outer lead portion 44b of the lead frame 41 is processed into a predetermined lead shape by a lead forming die. The die pad 42 is supported by a plurality of suspension leads 47, and each suspension lead 47 is formed with a protrusion 48 that protrudes to the opposite side (lower side) of the surface of the die pad 42 on which the semiconductor chip 43 is mounted. ing.

  As shown in FIG. 18, the protruding portion 48 includes an inner bent portion 48a bent obliquely downward from an inner flat portion 47a continuous to the die pad 42, and an outer flat portion facing the inner flat portion 47a. An outer bent portion 48b bent obliquely downward from 47b and a projecting end 48c formed flat between the lower ends of the bent portions 48a, 48b. As shown in FIG. 17B, the lower surface of the protrusion 48 c is exposed from the lower surface of the sealing resin 46.

  As shown in FIG. 19B, the die pad 42 is positioned so as to be lower than the inner lead portion 44 a of the lead frame 41 and higher than the protruding end 48 c of the protruding portion 48. Further, as shown in FIG. 18 (a), the height H1 from the lower surface of the protrusion 48c to the lower surface of the outer flat portion 47b is from an inner wall surface 52a of the lower mold 52 described later as shown in FIG. 21 (b). It substantially coincides with the height H2 up to the lower surface of the inner lead portion 44a.

Next, a conventional method for manufacturing the semiconductor device 40 will be described.
First, a lead frame 41 is formed by processing a metal thin plate into a desired electrode shape by etching or pressing. As shown in FIG. 19, the lead frame 41 is formed with a die pad 42 on which the semiconductor chip 43 is mounted, an inner lead portion 44 a for connecting to the semiconductor chip 43, and a suspension lead 47 that supports the die pad 42. ing.

  In addition, as shown in FIG. 18, a protrusion 48 is formed by applying a depression process to a part of the suspension lead 47. Since both the bent portions 48a and 48b of the projecting portion 48 formed by the above-described pressing process are extended downward, the plate thickness t of the bent portions 48a and 48b is equivalent to the plate thickness T (= (Thickness of the lead frame 41).

  Next, as shown in FIG. 20, the semiconductor chip 43 is mounted on the die pad 42 and bonded using an adhesive 44, and the bonding pad (not shown) of the semiconductor chip 43 and the inner lead 44 a are connected by the thin metal wire 45. To do.

  Then, as shown in FIG. 21, the semiconductor chip 43 is mounted on the die pad 42, and the lead frame 41 electrically connected by the thin metal wire 45 is connected to the lower mold 52 and the upper mold 53 of the sealing mold 51. The sealing resin 46 is injected from the injection gate 54 in the injection direction 55 and sealed with resin. At this time, the protruding end 48 c of the protruding portion 48 of the suspension lead 47 is in contact with the inner wall surface 52 a of the lower mold 52. After the sealing resin 46 is cured, the lower mold 52 and the upper mold 53 of the sealing mold 51 are opened, whereby the semiconductor device 40 is manufactured as shown in FIG.

  In this type semiconductor device 40, as shown in FIG. 21 (b), the protrusion 48c of each protrusion 48 comes into contact with the inner wall surface 57a of the lower mold 52 at the time of resin sealing, so that the lower end surface of the protrusion 48 is provided. Is fixed. As a result, the die pad 42 connected to the suspension lead 47 is fixed at a certain height in the sealing mold 51, and the position accuracy of the die pad 42 is stabilized to prevent die pad shift (up and down fluctuation of the die pad). Can be sealed with resin. Therefore, the semiconductor device 40 with stable quality can be manufactured.

As the semiconductor device 40 in which the protruding portion 48 is formed on the suspension lead 47 as described above, for example, the following Patent Document 1 is proposed. That is, a semiconductor chip is mounted on the die pad, a pair of suspension leads are formed integrally with the die pad, and a pair of protrusions projecting toward the mounting surface side (upper side) of the semiconductor chip is formed on the pair of suspension leads. . At the time of resin sealing, resin sealing is performed while the lower surface of the die pad is brought into contact with the inner wall surface of the lower mold and the top protrusion of the protrusion is brought into contact with the inner wall surface of the upper mold. Thereby, the displacement of the die pad at the time of sealing is suppressed.
JP 2001-177035 A

  In the conventional semiconductor device 40 described above, a single semiconductor chip 43 is mounted on the die pad 42. As a chip stacked type semiconductor device mounted with a plurality of semiconductor chips, there are those shown in FIGS.

  That is, in the chip stacked type semiconductor device 60 shown in FIG. 22, the first semiconductor chip 43 a is die-bonded to the surface (upper surface) of the die pad 42 of the lead frame 41 by the adhesive 44, and the back surface (lower surface) of the die pad 42. The second semiconductor chip 43b is die-bonded, and the first and second semiconductor chips 43a, 43b and the inner lead portions 44a are electrically connected to the front surface (upper surface) and the rear surface (lower surface) by the thin metal wires 45a, 45b. And molded with a sealing resin 46 to form two chips in one package.

  Further, in the chip stacked type semiconductor device 61 shown in FIG. 23, the bottom surface of the first semiconductor chip 43a is die-bonded to the surface (upper surface) of the die pad 42 of the lead frame 41 by the adhesive 44, and the first semiconductor chip. The second semiconductor chip 43b is die-bonded on the surface (upper surface) of 43a via the thermoplastic sheet 62 on the bottom surface side, and the surfaces (first and second semiconductor chips 43a, 43b) are formed by metal thin wires 45a, 45b. The upper surface) and the surface (upper surface) of each inner lead portion 44a are electrically connected and molded with a sealing resin 46 to form two chips as one package.

  Since each of the chip stacked type semiconductor devices 60 and 61 includes a plurality of semiconductor chips 43a and 43b, the amount of heat generated in each of the semiconductor devices 60 and 61 becomes larger, and the heat dissipation is reduced. It is necessary to design with consideration. Therefore, for example, it is conceivable to increase the thickness of the sealing resin 46 and disperse the heat generated from the semiconductor chips 43a and 43b in the sealing resin 46. In general, it is known that when the volume of the sealing resin 46 is increased, the thermal resistance value is reduced. However, according to previous experiments, when the thickness of the sealing resin 46 is increased by 1.4 times, The thermal resistance value is about 10% smaller.

  However, in the chip stacked type semiconductor devices 60 and 61 as shown in FIGS. 22 and 23, when the sealing resin 46 is made thick as described above, the protrusions 48 c of the protrusions 48 are located inside the sealing resin 46. It is buried and is not exposed from the lower surface (or upper surface) of the sealing resin 46. Therefore, as shown in FIG. 24, the projecting ends 48c of the protrusions 48 are positioned above the inner wall surface 52a of the lower mold 52 and do not contact the inner wall surface 57a. There was a problem that occurred. Similarly, in the semiconductor device described in Japanese Patent Application Laid-Open No. 2001-177035, the protruding end of the protruding portion formed on the suspension lead is positioned below the inner wall surface of the upper mold and contacts the inner wall surface. Therefore, there is a problem that a die pad shift occurs during resin sealing.

  As a countermeasure against the above-described problem, as shown in FIG. 25B, the depression amount D (= drop amount) of the protrusion 48 is deepened, and the protrusion 48 c of the protrusion 48 is made of the sealing resin 46. It is conceivable to expose the lower surface. In this case, since the projecting end 48c of the projecting portion 48 contacts the inner wall surface 57a of the lower mold 52 at the time of resin sealing, die pad shift can be prevented. In general, however, the amount of depression D is limited to about twice the plate thickness T of the lead frame 41, and if a greater amount of depression D is desired, both the plate thickness t smaller than the suspension lead 47 are obtained. Since the bent portions 48a and 48b are extended downward, the length L of both the bent portions 48a and 48b becomes longer and the strength is insufficient, thereby causing a problem that the stability of the pressing process is lowered. .

  In a semiconductor device having a plurality of semiconductor chips mounted on a die pad, the present invention prevents the occurrence of a die pad shift at the time of resin sealing, and further maintains the strength of the protruding portion to stabilize the protruding portion. An object of the present invention is to provide a semiconductor device capable of improving the performance and a method for manufacturing the same.

In order to achieve the above object, according to the first invention, a plurality of semiconductor chips are mounted on a die pad supported by a suspension lead,
The lead frame is electrically connected to each of the semiconductor chips with a fine metal wire,
A semiconductor device in which the lead frame is sandwiched between an upper mold and a lower mold of a sealing mold, and a sealing resin is injected into the sealing mold to be resin-sealed,
A protruding portion that protrudes toward the inner wall surface of either the upper die or the lower die is formed on the suspension lead,
The protrusion has a bent portion formed by bending a part of the suspension lead in the plate thickness direction and divided into a plurality of stages.
The protruding end of the protruding portion is exposed on the surface of the sealing resin.

  According to this, since the protruding end of the protruding portion is exposed on the surface of the sealing resin, at the time of resin sealing, the protruding end of the protruding portion comes into contact with the inner wall surface of either the upper mold or the lower mold, The suspension lead is fixed in the sealing mold, and die pad shift is prevented.

  In addition, when forming the projecting part by processing the suspension lead, even if the thickness of the bent part of the projecting part is thinner than the thickness of the suspension lead, the bent part is divided into a plurality of steps. Is sufficiently maintained, and stability when the protrusion is processed is improved.

In the second invention, a support member is attached to the protrusion,
The protruding end of the protruding portion is exposed on either the upper or lower surface of the sealing resin,
The end of the support member opposite to the protruding portion is exposed on either the upper or lower surface of the sealing resin.

  According to this, at the time of resin sealing, the protruding end of the projecting part comes into contact with the inner wall surface of either the upper mold or the lower mold, and the end of the support member is connected to the upper mold and the lower mold. Since it abuts on the other inner wall surface, the suspension lead is more firmly fixed in the sealing mold, and the die pad shift is surely prevented.

In the third invention, the plurality of semiconductor chips are stacked and mounted on the upper surface of the die pad,
The protruding part protrudes toward the inner wall surface of the lower mold,
The protruding end of the protruding portion is exposed on the lower surface of the sealing resin.

According to this, at the time of resin sealing, since the protruding end of the protruding portion comes into contact with the inner wall surface of the lower mold, the suspension lead is fixed in the sealing mold and die pad shift is prevented.
In the fourth invention, the plurality of semiconductor chips are stacked and mounted on the upper surface of the die pad,
The protruding part protrudes toward the inner wall surface of the lower mold,
The protruding end of the protruding portion is exposed on the lower surface of the sealing resin,
The upper end portion of the support member is exposed on the upper surface of the sealing resin.

  According to this, the projecting end of the protruding portion contacts the inner wall surface of the lower mold and the upper end portion of the support member contacts the inner wall surface of the upper mold, so that the suspension lead is more firmly fixed in the sealing mold. Thus, die pad shift is surely prevented.

The fifth invention is a manufacturing method for manufacturing the semiconductor device according to any one of the first to fourth inventions,
Forming a die pad and a suspension lead integrally on a lead frame using a metal flat plate, and forming a protrusion by depressing a part of the suspension lead; and
A mounting process for mounting a plurality of semiconductor chips on a die pad;
A connection step of electrically connecting each of the semiconductor chips and the lead frame with a thin metal wire;
Each of the semiconductor chips, the fine metal wires, and the lead frame are housed in a sealing mold, and the projecting portion is sealed in a state where the protruding end of the protruding portion is in contact with the inner wall surface of either the upper mold or the lower mold. A sealing step of injecting a sealing resin into the die and sealing the resin.

According to this, the strength of the protruding portion is sufficiently maintained, and the stability when the protruding portion is pressed is improved.
This 6th invention attaches a supporting member to a projection part in a formation process,
In the sealing step, the support member is sealed in the sealing mold in a state where the end of the support member opposite to the protruding portion is in contact with the other inner wall surface of the upper mold or the lower mold. A resin is injected to seal the resin.

In the seventh invention, in the mounting process, a plurality of semiconductor chips are stacked and mounted on the upper surface of the die pad,
In the sealing step, the sealing resin is injected into the sealing mold in a state where the protruding end of the protruding portion is in contact with the inner wall surface of the lower mold.

In the eighth invention, in the mounting process, a plurality of semiconductor chips are stacked and mounted on the upper surface of the die pad,
In the sealing step, the sealing resin is placed in the sealing mold in a state where the protruding end of the protruding portion is in contact with the inner wall surface of the lower mold and the upper end portion of the support member is in contact with the inner wall surface of the upper mold. Is to inject.

According to the ninth aspect of the present invention, in the sealing step, the sealing resin is injected into the sealing mold from the injection port formed in the mold on the side opposite to the upper or lower mold with which the protruding end of the protruding portion abuts. Is.
According to this, in the sealing process, the protruding portion is pushed by the sealing resin injected into the sealing mold, and the force that presses the protruding end of the protruding portion against the inner wall surface of either the upper or lower mold works. The protruding end of the portion reliably contacts the inner wall surface of either the upper or lower mold. Thereby, the position accuracy of the die pad can be stabilized and the die pad shift can be surely prevented.

In the tenth aspect of the present invention, a plurality of semiconductor chips are mounted on a die pad supported by a suspension lead,
The lead frame is electrically connected to each of the semiconductor chips with a fine metal wire,
A semiconductor device in which the lead frame is sandwiched between an upper mold and a lower mold of a sealing mold, and a sealing resin is injected into the sealing mold to be resin-sealed,
A support member separate from the suspension lead is attached to the suspension lead,
The support member protrudes toward the inner wall surface of either the upper mold or the lower mold,
The front end portion of the support member is exposed on the surface of the sealing resin.

  According to this, since the front end portion of the support member is exposed on the surface of the sealing resin, the front end portion of the support member abuts against the inner wall surface of either the upper mold or the lower mold during resin sealing. The suspension leads are fixed in the sealing mold and the die pad shift is prevented.

  In addition, when the projecting portion is formed by subjecting the suspension lead to a pressing process, by attaching the support member to the projecting end of the projecting section, the amount of pressing of the projecting section during the pressing process can be reduced. . Therefore, the strength of the protruding portion is sufficiently maintained, and stability when the protruding portion is pressed is improved.

In the eleventh aspect of the invention, a first support member protruding toward the inner wall surface side of the lower mold is attached to the lower surface of the suspension lead,
A second support member protruding toward the inner wall surface side of the upper mold is attached to the upper surface of the suspension lead,
The tip of the first support member is exposed on the lower surface of the sealing resin,
The tip of the second support member is exposed on the upper surface of the sealing resin.

  According to this, the tip of the first support member is exposed on the lower surface of the sealing resin, and the tip of the second support member is exposed on the upper surface of the sealing resin. The distal end portion of the first support member contacts the inner wall surface of the lower mold, and the distal end portion of the second support member contacts the inner wall surface of the upper mold. Thereby, the suspension lead is more firmly fixed in the sealing mold, and the die pad shift is surely prevented.

  In addition, when the projecting part is formed by subjecting the suspension lead to a pressing process, by attaching the first and second support members to the projecting end of the projecting part, the amount of pressing of the projecting part during the pressing process is reduced. Can be shallow. Therefore, the strength of the protruding portion is sufficiently maintained, and stability when the protruding portion is pressed is improved.

The twelfth invention is a manufacturing method for manufacturing the semiconductor device according to the tenth invention or the eleventh invention,
Forming the die pad and the suspension lead integrally using a metal flat plate, and attaching the support member to the suspension lead; and
A mounting process for mounting a plurality of semiconductor chips on a die pad;
A connection step of electrically connecting each of the semiconductor chips and the lead frame with a thin metal wire;
The semiconductor chip, the fine metal wire, and the lead frame are stored in a sealing mold, and the tip of the support member is in contact with the inner wall surface of either the upper mold or the lower mold. And a sealing step of sealing the resin by injecting a sealing resin into the sealing mold.

In the thirteenth invention, in the forming step, the first support member is attached to the lower surface of the suspension lead, and the second support member is attached to the upper surface of the suspension lead.
In the sealing step, the sealing metal mold with the tip of the first support member in contact with the inner wall surface of the lower mold and the tip of the second support member in contact with the inner wall surface of the upper mold. A sealing resin is injected into the mold and sealed with resin.

  According to the present invention, it is possible to prevent die pad shift, maintain sufficient strength of the protruding portion, and improve stability when processing the protruding portion. Thereby, a plurality of semiconductor chips can be stacked with high reliability and mounted on a die pad, and a semiconductor device can be manufactured with high production versatility, high reliability, and high density mounting.

Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 1 to 3, reference numeral 1 denotes a chip stacked type semiconductor device in which two semiconductor chips 2 and 3 are mounted in one package. Of these, the first semiconductor chip 2 is bonded to the surface (upper surface) of the die pad 5 supported by the four suspension leads 4 with an adhesive 6, and the second semiconductor chip 3 is bonded to the first sheet by the thermoplastic sheet 7. Bonded on the semiconductor chip 2. In addition, a plurality of leads 8 are arranged around the die pad 5, and the lead frame 9 is configured by the suspension leads 4, the leads 8, and the die pad 5.

  Each bonding pad (not shown) of the first and second semiconductor chips 2 and 3 is electrically connected to the inner lead portion 8a of the lead 8 via the first and second thin metal wires 19 and 20. ing. The suspension lead 4, the lead 8, the die pad 5, and the semiconductor chips 2 and 3 are sealed with a sealing resin 10 (resin mold).

  Each suspension lead 4 is formed with a projecting portion 17 projecting downward toward the inner wall surface 13a of the lower mold 13 of the sealing mold 12 described later. That is, as shown in FIG. 4, the protrusions 17 are formed on the inner first step bent portion 17a bent obliquely downward from the inner flat portion 4a continuous to the die pad 5, and on the lower end of the bent portion 17a. The formed inner intermediate flat portion 17b, the inner second step bent portion 17c bent obliquely downward from the outer end of the intermediate flat portion 17b, and the outer flat portion 4b facing the inner flat portion 4a. The outer first step bent portion 17d that is bent obliquely downward from, the outer intermediate flat portion 17e formed at the lower end of the bent portion 17d, and the inner flat end 17e bent obliquely downward. The outer second step bent portion 17f and a projecting end 17g formed flat between the lower ends of the second step bent portions 17c and 17f.

  As shown in FIG. 2, the die pad 5 is formed at a position lower than the inner lead portion 8 a of the lead 8 and higher than the protruding end 17 g of the protruding portion 17. Further, as shown in FIG. 1, the protruding end 17 g of each protruding portion 17 is exposed on the lower surface of the sealing resin 10.

Next, a method for manufacturing the semiconductor device 1 will be described.
The manufacturing method includes a forming process, a mounting process, a connecting process, and a sealing process.
First, in the forming step, as shown in FIG. 2, a lead frame 9 is formed by processing a thin metal plate into a desired electrode shape by etching or pressing. The suspension frame 4, the die pad 5, and the lead 8 are integrally formed on the lead frame 9. A projecting portion 17 is formed by applying a stepped depression process to a part of the suspension lead 4.

  Next, as shown in FIG. 3, in the mounting process, the first semiconductor chip 2 is bonded to the die pad 5 using an adhesive 6, and the second semiconductor chip 3 is bonded using a thermoplastic sheet 7. 1 is bonded to the semiconductor chip 2.

  Thereafter, in the connecting step, a bonding pad (not shown) of the first semiconductor chip 2 and the inner lead portion 8a of the lead 8 are connected by the first thin metal wire 19 to bond the second semiconductor chip 3. The pad (not shown) and the inner lead portion 8 a of the lead 8 are connected by the second thin metal wire 20.

  Next, as shown in FIG. 5, in the sealing step, resin sealing is performed using a sealing mold 12. That is, the sealing mold 12 includes a lower mold 13 and an upper mold 14, and an injection gate 15 (injection port) for injecting the sealing resin 10 is provided at any one of the four corners of the lower mold 13. Example) is formed. The semiconductor chips 2, 3, the lead frame 9, and the fine metal wires 19, 20 are accommodated in the sealing mold 12, the lead frame 9 is sandwiched between the lower mold 13 and the upper mold 14, and each protrusion 17 The lower surface of the protruding end 17g is brought into contact with the inner wall surface 13a of the lower mold 13, and in this state, the sealing resin 10 is injected from the injection gate 15 in the injection direction 22 to fill the sealing mold 12. After the sealing resin 10 is cured, the lower mold 13 and the upper mold 14 are opened to manufacture the resin-sealed semiconductor device 1 as shown in FIG. At this time, the lower surface of the protruding end 17 g of each protruding portion 17 is exposed on the lower surface of the sealing resin 10.

  As shown in FIG. 5B, the sealing resin 10 passes through the injection gate 15 and is injected into the sealing mold 12 from the same side (that is, the lower side) as the protrusion 17 with respect to the suspension lead 4. Is done. Further, as shown in FIG. 4, the height from the lower surface of the protrusion 17g to the upper surface of the outer flat portion 4b is H1, and as shown in FIG. 5B, the inner wall surface 13a of the lower mold 13 to the upper mold 14 When the height to the lower end of the outer edge portion is H2, the dimensions are set so that H1 = H2. The height H1 substantially matches the height from the inner wall surface 13a of the lower mold 13 to the upper surface of the inner lead portion 8a.

The operation of the semiconductor device 1 manufactured as described above will be described below.
As shown in FIG. 5, in the sealing step, the lower surface of the projecting end 17 g of each protrusion 17 abuts against the inner wall surface 13 a of the lower mold 13, so that each suspension lead 4 is fixed in the sealing mold 12. Thus, die pad shift (up and down fluctuation of the die pad 5) is prevented, whereby the semiconductor device 1 with stable quality can be manufactured.

  Further, as shown in FIG. 4, each protrusion 17 is formed by pressing, so that the thickness t of the first step bent portions 17a, 17d and the second step bent portions 17c, 17f is the suspension lead 4. However, the inner bent portions 17a and 17c are divided into two steps with the inner intermediate flat portion 17b interposed therebetween, and similarly, the outer bent portions 17a and 17c are divided into outer bends. Since the portions 17d and 17f are divided into two short portions across the outer intermediate flat portion 17e, the portions 17d and 17f are divided into short lengths L of the individual bent portions 17a, 17c, 17d and 17f. In spite of the fact that the pressing amount D of 17 is larger than that of the conventional one, the strength of the protruding portion 17 is sufficiently maintained, and the stability when the protruding portion 17 is pressed is improved.

  In the first embodiment, the height H1 (see FIG. 4) from the lower surface of the protrusion 17g to the upper surface of the outer flat portion 4b and the outer edge portion of the upper mold 14 from the inner wall surface 13a of the lower mold 13 However, H2 may be slightly lower than H1 (H1> H2). In this case, when the lead frame 9 is sandwiched between the lower mold 13 and the upper mold 14, the flat portion 4 b outside the suspension lead 4 is pressed downward by the lower end of the outer edge portion of the upper mold 14. 4 is firmly fixed in the sealing mold 12.

  In the first embodiment, the protrusion 17 is protruded downward, and the protrusion 17g is brought into contact with the inner wall surface 13a of the lower mold 13, so that the protrusion 17g is exposed on the lower surface of the sealing resin 10. The protruding portion 17 may protrude upward, and the protruding end 17 g may be in contact with the inner wall surface 14 a of the upper mold 14, so that the protruding end 17 g is exposed on the upper surface of the sealing resin 10.

Next, a second embodiment of the present invention will be described with reference to FIGS.
As shown in FIGS. 6 and 7, a round bar-like support member 26 is fixed to the upper surface of the projecting end 17g of each projecting portion 17 with an adhesive (not shown). The upper end portion of the support member 26 (that is, the end portion opposite to the protruding portion 17) is exposed on the upper surface of the sealing resin 10. The material of the support member 26 and the adhesive is preferably a thermosetting resin used for the sealing resin 10. Further, the height H3 of the support member 26 substantially coincides with the height from the upper surface of the protruding end 17g of the protruding portion 17 to the inner wall surface 14a of the upper mold 14.

Next, a method for manufacturing the semiconductor device 1 will be described.
First, in the forming step, the lead frame 9 is created, and as shown in FIG. 7, a stepped depression process is performed on a part of the suspension lead 4 to form the protruding portion 17. Further, the support member 26 is bonded to each protrusion 17 using an adhesive.

Then, a mounting process and a connection process are performed.
Next, in the sealing step, as shown in FIG. 8, the semiconductor chips 2 and 3, the lead frame 9, and the fine metal wires 19 and 20 are accommodated in the sealing mold 12, and the outer end portion of the lead frame 9 is stored. Is sandwiched between the lower mold 13 and the upper mold 14, the lower surface of the projecting end 17 g of each projection 17 is brought into contact with the inner wall surface 13 a of the lower mold 13, and the upper end of each support member 26 is connected to the upper mold. In this state, the sealing resin 10 is injected from the injection gate 15 in the injection direction 22 to fill the sealing mold 12. After the sealing resin 10 is cured, the lower mold 13 and the upper mold 14 are opened, whereby the resin-sealed semiconductor device 1 is manufactured as shown in FIG. At this time, the lower surface of the projecting end 17 g of each projecting portion 17 is exposed on the lower surface of the sealing resin 10, and the upper end portion of each supporting member 26 is exposed on the upper surface of the sealing resin 10.

The operation of the semiconductor device 1 manufactured as described above will be described below.
As shown in FIG. 8, in the sealing step, the lower surface of the projecting end 17 g of each projecting portion 17 abuts on the inner wall surface 13 a of the lower mold 13, and the upper end portion of each support member 26 is inside the upper mold 14. Since each abutment lead 4 is in contact with the wall surface 14a, the suspension leads 4 are more firmly fixed in the sealing mold 12, the positional accuracy of the die pad 5 is stabilized, and the die pad shift is reliably prevented. Thereby, the semiconductor device 1 with more stable quality can be manufactured.

  In the second embodiment, the protrusion 17 is protruded downward, and the protrusion 17g is brought into contact with the inner wall surface 13a of the lower mold 13, so that the protrusion 17g is exposed on the lower surface of the sealing resin 10, and The support member 26 is attached to the upper surface of the protruding end 17g, and the upper end portion of the support member 26 is brought into contact with the inner wall surface 14a of the upper mold 14 so that the upper end portion of the support member 26 is exposed on the upper surface of the sealing resin 10. However, by projecting the projecting portion 17 upward and bringing the projecting end 17g into contact with the inner wall surface 14a of the upper mold 14, the projecting end 17g is exposed on the upper surface of the sealing resin 10, and further, the lower surface of the projecting end 17g. Even if the lower end portion of the support member 26 is exposed to the lower surface of the sealing resin 10 by attaching the lower end portion of the support member 26 to the inner wall surface 13 a of the lower mold 13. Good.

  In the first and second embodiments, the projecting portion 17 has a bent portion divided into two steps, that is, a first step bent portion 17a, 17d and a second step bent portion 17c, 17f. It may have a bent portion divided into three or more stages.

Next, a third embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 11, each suspension lead 4 is formed with a protrusion 48 that is the same as the conventional one shown in FIG. That is, the protrusion 48 is bent obliquely downward from the inner bent portion 48a bent obliquely downward from the inner flat portion 4a continuous to the die pad 5 and the outer flat portion 4b opposed to the inner flat portion 4a. The outer bent portion 48b and a projecting end 48c formed flat between the lower ends of both the bent portions 48a and 48b. Note that the pressing amount D of the protrusion 48 is the same as that of the conventional one shown in FIG. 18 and is shallow, so that, as shown in FIG. It is located above the inner wall surface 13 a and is buried in the sealing resin 6.

  As shown in FIG. 11, a round bar-like support member 30, which is a separate member from the suspension lead 4, is bonded to the lower surface of the protruding end 48 c of each protruding portion 48 via an adhesive (not shown). . The material of the support member 30 and the adhesive is preferably a thermosetting resin used for the sealing resin 10. Each support member 30 protrudes downward toward the inner wall surface 13 a of the lower mold 13, and the lower end portion of each support member 30 is exposed on the lower surface of the sealing resin 10 as shown in FIG. 9. .

  Further, as shown in FIG. 11 (a), the height H1 from the lower end of the support member 30 to the upper surface of the outer flat portion 4b is set, and as shown in FIG. 12 (b), from the inner wall surface 13a of the lower mold 13 When the height to the lower end of the outer edge portion of the upper mold 14 is H2, the dimensions are set so that H1 = H2. Further, the height of the support member 30 substantially coincides with the height from the inner wall surface 13a of the lower mold 13 to the lower surface of the protruding end 48c of the protruding portion 48.

Next, a method for manufacturing the semiconductor device 1 will be described.
First, as shown in FIG. 10, in the forming step, the lead frame 9 is created, and the projecting portion 48 is formed by applying a pressing process to a part of the suspension lead 4. Further, the support member 30 is bonded to each protrusion 48 using an adhesive.

Then, a mounting process and a connection process are performed.
Next, in the sealing step, as shown in FIG. 12, the semiconductor chips 2 and 3, the lead frame 9, and the fine metal wires 19 and 20 are accommodated in the sealing mold 12, and the lead frame 9 is placed in the lower mold. 13 and the upper mold 14, the lower end of each support member 30 is brought into contact with the inner wall surface 13 a of the lower mold 13, and in this state, the sealing resin 10 is injected from the injection gate 15 in the injection direction 22. Then, the sealing mold 12 is filled. After the sealing resin 10 is cured, the lower mold 13 and the upper mold 14 are opened, whereby the resin-sealed semiconductor device 1 is manufactured as shown in FIG. At this time, the lower end portion of each support member 30 is exposed on the lower surface of the sealing resin 10.

The operation of the semiconductor device 1 manufactured as described above will be described below.
As shown in FIG. 12, in the sealing step, the lower end portion of each support member 30 comes into contact with the inner wall surface 13a of the lower mold 13, so that each suspension lead 4 is fixed in the sealing mold 12, and the die pad Shifting is prevented.

  Further, as shown in FIG. 11, by attaching the support member 30 to the projecting end 48c of the projecting portion 48, the pressing amount D of the projecting portion 48 can be made shallow as in the conventional case. Therefore, the length L of both the bent portions 48a and 48b is shortened as in the conventional case, whereby the strength of the protruding portion 48 is sufficiently maintained, and the stability when the protruding portion 48 is pressed is improved.

  In the third embodiment, the protrusion 48 protrudes downward toward the inner wall surface 13 a of the lower mold 13, and the lower end portion of the support member 30 is brought into contact with the inner wall surface 13 a of the lower mold 13. The lower end of the support member 30 is exposed on the lower surface of the sealing resin 10, but the protrusion 48 protrudes upward toward the inner wall surface 14 a of the upper mold 14, and the support member 30 is protruded from the protrusion 48 c of the protrusion 48. The upper end portion of the support member 30 may be exposed on the upper surface of the sealing resin 10 by bonding to the upper surface and bringing the upper end portion of the support member 30 into contact with the inner wall surface 14a of the upper mold 14.

Next, a fourth embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 14, each suspension lead 4 is formed with a protrusion 48 that is the same as the conventional one shown in FIG. In other words, the protruding portion 48 is composed of bent portions 48a and 48b and a protruding end 48c. The depth D of the protrusion 48 is the same as that of the conventional one shown in FIG. 18 and is shallow, so that the protrusion 48c of the lower mold 13 is formed in the sealing step as shown in FIG. It is located above the inner wall surface 13 a and is buried in the sealing resin 6.

  A round bar-shaped first support member 31, which is a separate member from the suspension lead 4, is bonded to the lower surface of the protruding end 48 c of each protruding portion 48 via an adhesive (not shown). Each of the first support members 31 protrudes downward toward the inner wall surface 13a of the lower mold 13, and the lower end portion of each first support member 31 is the lower surface of the sealing resin 10 as shown in FIG. Is exposed. In addition, a round bar-shaped second support member 32, which is a separate member from the suspension lead 4, is bonded to the upper surface of the protruding end 48 c of each protruding portion 48 via an adhesive (not shown). Each of the second support members 32 protrudes upward toward the inner wall surface 14 a of the upper mold 14, and as shown in FIG. 13, the upper end portion of each second support member 32 is the upper surface of the sealing resin 10. Is exposed. The first and second support members 31 and 32 and the adhesive material are preferably thermosetting resins used for the sealing resin 10.

  Further, the height H1 from the lower end portion of the first support member 31 shown in FIG. 14A to the upper end portion of the second support member 32 is determined from the inner wall surface 13a of the lower mold 13 shown in FIG. The dimensions are set so as to substantially match the height H2 of the upper mold 14 up to the inner wall surface 14a.

Next, a method for manufacturing the semiconductor device 1 will be described.
First, in the forming step, the lead frame 9 is created, and as shown in FIG. Moreover, the 1st support member 31 and the 2nd support member 32 are adhere | attached on each protrusion part 48 using an adhesive agent.

Then, a mounting process and a connection process are performed.
Next, in the sealing step, as shown in FIG. 15, the semiconductor chips 2 and 3, the lead frame 9, and the fine metal wires 19 and 20 are accommodated in the sealing mold 12, and the lead frame 9 is placed in the lower mold. 13 and the upper mold 14, the lower end of each first support member 31 is brought into contact with the inner wall surface 13 a of the lower mold 13, and the upper end of each second support member 32 is connected to the upper mold 14. In this state, the sealing resin 10 is injected from the injection gate 15 in the injection direction 22 to fill the sealing mold 12. After the sealing resin 10 is cured, the lower mold 13 and the upper mold 14 are opened to manufacture the resin-sealed semiconductor device 1 as shown in FIG. At this time, the lower end portion of each first support member 31 is exposed on the lower surface of the sealing resin 10, and the upper end portion of each second support member 32 is exposed on the upper surface of the sealing resin 10.

The operation of the semiconductor device 1 manufactured as described above will be described below.
As shown in FIG. 15, in the sealing step, the lower end portion of the first support member 31 contacts the inner wall surface 13 a of the lower mold 13, and the upper end portion of the second support member 32 is the upper mold 14. In order to contact the inner wall surface 14a, the suspension leads 4 are more firmly fixed in the sealing mold 12, the positional accuracy of the die pad 5 is stabilized, and the die pad shift is reliably prevented. Thereby, the semiconductor device 1 with more stable quality can be manufactured.

  Further, as shown in FIG. 14, by attaching the first and second support members 31 and 32 to the projecting end 48c of the projecting portion 48, the pressing amount D of the projecting portion 48 is made shallow as in the conventional case. Can do. Accordingly, the length L of the bent portions 48a and 48b is shortened as in the conventional case, whereby the strength of the protruding portion 48 is sufficiently maintained, and the stability when the protruding portion 48 is pressed is improved.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
The injection gate 15 (an example of an injection port) of the sealing mold 12 is formed at any one of the four corners of the upper mold 14 that is opposite to the lower mold 13 with which the projecting end 17g of the projecting portion 17 abuts. Yes.

  According to this, at the time of manufacturing the semiconductor device 1, when resin sealing is performed using the sealing mold 12 in the sealing process, the lead frame 9 is sandwiched between the lower mold 13 and the upper mold 14, and the sealing resin 10 is injected from the injection gate 15 in the injection direction 22 to fill the sealing mold 12. At this time, as shown in FIG. 16 (b), the sealing resin 10 is injected into the sealing mold 12 from above (that is, the direction opposite to the protruding portion 17) with respect to the suspension lead 4. The protrusion 17 is pushed downward by the sealing resin 10, and a force is applied to press the protrusion 17 g of the protrusion 17 against the inner wall surface 13 a of the lower mold 13. As a result, the projecting end 17g of the projecting portion 17 is surely brought into contact with the inner wall surface 13a of the lower mold 13, the positional accuracy of the die pad 5 is stabilized, and die pad shift can be reliably prevented.

  In each of the first to fifth embodiments, both semiconductor chips 2 and 3 are mounted on the surface (upper surface) of the die pad 5, but both semiconductor chips 2 and 3 are mounted on the back surface (lower surface) of the die pad 5. May be. Alternatively, either one of the semiconductor chips 2 and 3 may be mounted on the front surface (upper surface) of the die pad 5 and the other may be mounted on the rear surface (lower surface) of the die pad 5. Further, the number of semiconductor chips 2 and 3 is not limited, and three or more semiconductor chips may be mounted.

  In each of the first to fifth embodiments, the die pad 5 is supported by the four suspension leads 4, but is not limited to four, and a plurality of suspension leads 4 other than four are provided. You may support.

  In the semiconductor device 1 and the method for manufacturing the same according to the present invention, the first to fifth embodiments described above may be implemented independently, or a plurality of these embodiments may be combined as appropriate. Good.

  The present invention can also be applied to a semiconductor device or an electronic component that can prevent die pad shift, maintain sufficient strength of the protrusion, and improve the stability when processing the protrusion.

It is sectional drawing of the semiconductor device in the 1st Embodiment of this invention. FIG. 4 is a view of a lead frame of the semiconductor device, where (a) is a plan view and (b) is a view taken along the line XX in (a). FIG. 4 is a view when a process from a formation process to a connection process through a mounting process is performed in the semiconductor device manufacturing method, where (a) is a plan view and (b) is a view taken along line XX in (a). . It is a figure of the protrusion part of a semiconductor device, (a) is a front view, (b) is a perspective view. It is a figure of the sealing process in the manufacturing method of a semiconductor device, (a) is a top view of the semiconductor device accommodated in the sealing metal mold | die, (b) is a XX arrow view in (a). is there. It is sectional drawing of the semiconductor device in the 2nd Embodiment of this invention. It is a figure of the protrusion part of a semiconductor device, (a) is a front view, (b) is a perspective view. FIG. 3 is a cross-sectional view of a semiconductor device housed in a sealing mold in the sealing step of the semiconductor device manufacturing method. It is sectional drawing of the semiconductor device in the 3rd Embodiment of this invention. FIG. 4 is a view of a lead frame of the semiconductor device, where (a) is a plan view and (b) is a view taken along the line XX in (a). It is a figure of the protrusion part of a semiconductor device, (a) is a front view, (b) is a perspective view. It is a figure of the sealing process in the manufacturing method of a semiconductor device, (a) is a top view of the semiconductor device accommodated in the sealing metal mold | die, (b) is a XX arrow view in (a). is there. It is sectional drawing of the semiconductor device in the 4th Embodiment of this invention. It is a figure of the protrusion part of a semiconductor device, (a) is a front view, (b) is a perspective view. FIG. 3 is a cross-sectional view of a semiconductor device housed in a sealing mold in the sealing step of the semiconductor device manufacturing method. It is a figure of the sealing process in the manufacturing method of the semiconductor device in the 5th Embodiment of this invention, (a) is a top view of the semiconductor device accommodated in the sealing metal mold | die, (b) is (a). FIG. It is a figure of the conventional semiconductor device, (a) is a top view, (b) is a XX arrow line view in (a). It is a figure of the protrusion part of a semiconductor device, (a) is a front view, (b) is a perspective view. FIG. 4 is a view of a lead frame of the semiconductor device, where (a) is a plan view and (b) is a view taken along the line XX in (a). FIG. 4 is a view when a process from a formation process to a connection process through a mounting process is performed in the semiconductor device manufacturing method, where (a) is a plan view and (b) is a view taken along line XX in (a). . It is a figure of the sealing process in the manufacturing method of a semiconductor device, (a) is a top view of the semiconductor device accommodated in the sealing metal mold | die, (b) is a XX arrow view in (a). is there. In the conventional semiconductor device, it is a figure of the chip | tip laminated | stacked type semiconductor device which each mounted the semiconductor chip on both the front and back of a die pad, (a) is a top view, (b) is a XX arrow view in (a). is there. In the conventional semiconductor device, it is a figure of the chip | tip laminated | stacked type semiconductor device which mounted several semiconductor chips only on the surface of the die pad, (a) is a top view, (b) is a XX arrow view in (a). It is. It is sectional drawing of the sealing process in the manufacturing method of the conventional semiconductor device, and shows the state which die pad shift generate | occur | produced. It is a figure of the protrusion part of the conventional semiconductor device, (a) is the state where the protrusion end of the protrusion part was buried in sealing resin, (b) expanded the amount of pressing, and the protrusion end of the protrusion part is sealing resin. The state exposed on the lower surface of is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor device 2, 3 Semiconductor chip 4 Hanging lead 5 Die pad 9 Lead frame 10 Sealing resin 12 Sealing die 13 Lower die 13a Inner wall surface 14 Upper die 14a Inner wall surface 15 Injection gate (injection port)
17 Protrusion 17a, 17c, 17d, 17f Bend 17g Protrusion 19, 20 Metal wire 26 Support member 30 Support member 31 First support member 32 Second support member 48 Protrusion

Claims (13)

Multiple semiconductor chips are mounted on the die pad supported by the suspension leads,
The lead frame is electrically connected to each of the semiconductor chips with a fine metal wire,
A semiconductor device in which the lead frame is sandwiched between an upper mold and a lower mold of a sealing mold, and a sealing resin is injected into the sealing mold to be resin-sealed,
A protruding portion that protrudes toward the inner wall surface of either the upper die or the lower die is formed on the suspension lead,
The protrusion has a bent portion formed by bending a part of the suspension lead in the plate thickness direction and divided into a plurality of stages.
A semiconductor device, wherein the protruding end of the protruding portion is exposed on the surface of the sealing resin. A support member is attached to the protrusion,
The protruding end of the protruding portion is exposed on either the upper or lower surface of the sealing resin,
2. The semiconductor device according to claim 1, wherein an end of the support member opposite to the protruding portion is exposed on one of the upper and lower surfaces of the sealing resin. Multiple semiconductor chips are stacked and mounted on the upper surface of the die pad,
The protruding part protrudes toward the inner wall surface of the lower mold,
2. The semiconductor device according to claim 1, wherein a protruding end of the protruding portion is exposed on a lower surface of the sealing resin. Multiple semiconductor chips are stacked and mounted on the upper surface of the die pad,
The protruding part protrudes toward the inner wall surface of the lower mold,
The protruding end of the protruding portion is exposed on the lower surface of the sealing resin,
3. The semiconductor device according to claim 2, wherein an upper end portion of the support member is exposed on an upper surface of the sealing resin. A manufacturing method for manufacturing the semiconductor device according to any one of claims 1 to 4,
Forming a die pad and a suspension lead integrally on a lead frame using a metal flat plate, and forming a protruding portion by pressing a part of the suspension lead; and
A mounting process for mounting a plurality of semiconductor chips on a die pad;
A connection step of electrically connecting each of the semiconductor chips and the lead frame with a thin metal wire;
Each of the semiconductor chips, the fine metal wires, and the lead frame are housed in a sealing mold, and the projecting portion is sealed in a state where the protruding end of the protruding portion is in contact with the inner wall surface of either the upper mold or the lower mold. And a sealing step of injecting a sealing resin into the die and sealing the resin. In the forming process, the support member is attached to the protrusion,
In the sealing step, the support member is sealed in the sealing mold in a state where the end of the support member opposite to the protruding portion is in contact with the other inner wall surface of the upper mold or the lower mold. 6. The method of manufacturing a semiconductor device according to claim 5, wherein resin sealing is performed by injecting resin. In the mounting process, multiple semiconductor chips are stacked and mounted on the upper surface of the die pad,
6. The method of manufacturing a semiconductor device according to claim 5, wherein, in the sealing step, a sealing resin is injected into the sealing mold in a state where the protruding end of the protruding portion is in contact with the inner wall surface of the lower mold. . In the mounting process, multiple semiconductor chips are stacked and mounted on the upper surface of the die pad,
In the sealing step, the sealing resin is placed in the sealing mold in a state where the protruding end of the protruding portion is in contact with the inner wall surface of the lower mold and the upper end portion of the support member is in contact with the inner wall surface of the upper mold. 7. The method of manufacturing a semiconductor device according to claim 6, wherein a semiconductor device is implanted. In the sealing step, a sealing resin is injected into the sealing mold from an injection port formed in a mold on the opposite side of the upper or lower mold with which the protruding end of the protruding portion abuts. The manufacturing method of the semiconductor device in any one of Claims 5-8. Multiple semiconductor chips are mounted on the die pad supported by the suspension leads,
The lead frame is electrically connected to each of the semiconductor chips with a fine metal wire,
A semiconductor device in which the lead frame is sandwiched between an upper mold and a lower mold of a sealing mold, and a sealing resin is injected into the sealing mold to be resin-sealed,
A support member separate from the suspension lead is attached to the suspension lead,
The support member protrudes toward the inner wall surface of either the upper mold or the lower mold,
The semiconductor device according to claim 1, wherein a tip portion of the support member is exposed on a surface of the sealing resin. A first support member protruding toward the inner wall surface side of the lower mold is attached to the lower surface of the suspension lead,
A second support member protruding toward the inner wall surface side of the upper mold is attached to the upper surface of the suspension lead,
The tip of the first support member is exposed on the lower surface of the sealing resin,
11. The semiconductor device according to claim 10, wherein a tip portion of the second support member is exposed on an upper surface of the sealing resin. A manufacturing method for manufacturing the semiconductor device according to claim 10 or 11,
Forming the die pad and the suspension lead integrally using a metal flat plate, and attaching the support member to the suspension lead; and
A mounting process for mounting a plurality of semiconductor chips on a die pad;
A connection step of electrically connecting each of the semiconductor chips and the lead frame with a thin metal wire;
The semiconductor chip, the fine metal wire, and the lead frame are stored in a sealing mold, and the tip of the support member is in contact with the inner wall surface of either the upper mold or the lower mold. And a sealing step of sealing the resin by injecting a sealing resin into the sealing mold. In the forming step, the first support member is attached to the lower surface of the suspension lead, and the second support member is attached to the upper surface of the suspension lead.
In the sealing step, the sealing metal mold with the tip of the first support member in contact with the inner wall surface of the lower mold and the tip of the second support member in contact with the inner wall surface of the upper mold. 13. The method of manufacturing a semiconductor device according to claim 12, wherein a sealing resin is injected into the mold and the resin sealing is performed.

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