JP2005190822A - Dehydrating method for substrate and dehydrating device - Google Patents

Dehydrating method for substrate and dehydrating device Download PDF

Info

Publication number
JP2005190822A
JP2005190822A JP2003430638A JP2003430638A JP2005190822A JP 2005190822 A JP2005190822 A JP 2005190822A JP 2003430638 A JP2003430638 A JP 2003430638A JP 2003430638 A JP2003430638 A JP 2003430638A JP 2005190822 A JP2005190822 A JP 2005190822A
Authority
JP
Japan
Prior art keywords
substrate
dehydrating
temperature
atmosphere
dehydration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003430638A
Other languages
Japanese (ja)
Other versions
JP4147585B2 (en
Inventor
Katsuji Yoshikawa
勝司 吉川
Kazuya Naito
和哉 内藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seiki Co Ltd
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Priority to JP2003430638A priority Critical patent/JP4147585B2/en
Publication of JP2005190822A publication Critical patent/JP2005190822A/en
Application granted granted Critical
Publication of JP4147585B2 publication Critical patent/JP4147585B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dehydrating method for a substrate and a dehydrating device, which obtain an enough dehydrating effect by suppressing the readsorption of water to a component of an organic electroluminescence element after thermal dehydration process. <P>SOLUTION: The dehydrating device A dehydrates a substrate (supporting substrate) 10 provided with the organic electroluminescence element where a first electrode formed in a predetermined shape, an insulating layer, an organic layer having at least a light-emitting layer, and a second electrode, are sequentially laminated. The dehydrating device A comprises a heat chamber 3 for performing thermal dehydration process by heating the substrate 10 provided with at least the insulating layer, and a temperature-lowering chamber 4 for a temperature-lowering process where the temperature of the substrate 10 is lowered while keeping an atmosphere in a low dew point after the thermal dehydration process. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、少なくとも発光層を有する有機層を一対の電極で挟持した有機EL(エレクトロルミネッセンス)素子が配設される基板の脱水方法及び脱水装置に関する。   The present invention relates to a substrate dehydration method and a dehydration apparatus in which an organic EL (electroluminescence) element in which an organic layer having at least a light emitting layer is sandwiched between a pair of electrodes is disposed.

有機EL素子を用いた有機ELパネルとしては、ガラス材料からなる透光性の支持基板(基板)上に、陽極となるITO(Indium Tin Oxide)等からなる透明電極(第一電極)と、絶縁層と、正孔注入層,正孔輸送層,発光層及び電子輸送層等からなる有機層と、陰極となるアルミニウム(Al)等からなる非透光性の背面電極(第二電極)と、を順次積層して前記有機EL素子を形成し、前記有機EL素子を気密的に覆うようにガラス材料からなる封止部材を配設して構成されるものが知られている。(例えば、特許文献1参照)   As an organic EL panel using an organic EL element, a transparent electrode (first electrode) made of ITO (Indium Tin Oxide) or the like serving as an anode is insulated on a translucent support substrate (substrate) made of a glass material. An organic layer composed of a layer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like, and a non-transparent back electrode (second electrode) composed of aluminum (Al) or the like serving as a cathode, The organic EL element is formed by sequentially laminating layers, and a sealing member made of a glass material is disposed so as to hermetically cover the organic EL element. (For example, see Patent Document 1)

かかる有機ELパネルにおいては、前記封止部材によって前記有機EL素子を気密的に覆うことによって、水分が前記有機EL素子内に侵入し、ダークスポットと呼ばれる非発光部分の発生及びその面積の拡大を防止している。   In such an organic EL panel, the organic EL element is hermetically covered by the sealing member, so that moisture penetrates into the organic EL element, thereby generating a non-light-emitting portion called a dark spot and expanding its area. It is preventing.

また、ダークスポット発生の原因となる水分は前記有機ELパネルの構成部材そのものにも吸着しており、かかる水分を脱離させるために、前記有機ELパネルの構成部材のすくなくとも一部が形成された前記支持基板に対して低露点雰囲気中で加熱脱水処理等を行う方法が知られている。(例えば、特許文献2参照)特に、前記絶縁層は吸着性の高いポリイミド系やフェノール系等の絶縁材料を用いることが多く、多量の水分が吸着されているため脱水処理を行う必要性が高い。
特開平11−162635号公報 特開2000−150147号公報
In addition, the water that causes dark spots is adsorbed to the constituent members of the organic EL panel itself, and at least a part of the constituent members of the organic EL panel is formed to desorb the water. A method is known in which heat dehydration is performed on the support substrate in a low dew point atmosphere. (See, for example, Patent Document 2) In particular, the insulating layer often uses a highly adsorbing polyimide-based or phenol-based insulating material, and a large amount of moisture is adsorbed, so there is a high need for dehydration treatment. .
JP-A-11-162635 JP 2000-150147 A

しかしながら、前記加熱脱水処理においては、加熱後に前記支持基板の温度を下げる際に雰囲気の温度が低下することによって雰囲気中の水分が凝固して前記構成部材に再び吸着し、前記加熱脱水処理による脱水効果を十分に得ることができないという問題を有していた。なお、雰囲気中の水分には、加熱によって前記構成部材から脱離された水分も含まれる。   However, in the heat dehydration process, when the temperature of the support substrate is lowered after heating, the temperature of the atmosphere is reduced, so that moisture in the atmosphere is solidified and adsorbed again to the constituent members. There was a problem that sufficient effects could not be obtained. Note that the moisture in the atmosphere includes moisture desorbed from the component members by heating.

本発明は、このような問題に鑑み、加熱脱水処理後の有機ELパネルの構成部材への水分の再吸着を抑制し、十分な脱水効果を得ることが可能な基板の脱水方法及び脱水装置を提供することを目的とする。   In view of such a problem, the present invention provides a substrate dehydration method and a dehydration apparatus capable of suppressing re-adsorption of moisture to components of an organic EL panel after heat dehydration and obtaining a sufficient dehydration effect. The purpose is to provide.

本発明の基板の脱水方法は、前記課題を解決するために、所定の形状に形成された第一電極と、絶縁層と、少なくとも発光層を有する有機層と、第二電極と、を順次積層してなる有機EL素子が配設される基板の脱水方法であって、少なくとも前記絶縁層形成後に前記基板を加熱して加熱脱水処理を行う工程と、前記加熱脱水処理後に雰囲気を低露点に保ちながら前記基板の温度を下げる降温処理を行う工程と、を含むことを特徴とする。   In order to solve the above problems, the substrate dehydration method of the present invention sequentially stacks a first electrode formed in a predetermined shape, an insulating layer, an organic layer having at least a light emitting layer, and a second electrode. A method for dehydrating a substrate on which an organic EL element is provided, the method comprising heating at least the substrate after the insulating layer is formed and performing a heat dehydration process, and maintaining the atmosphere at a low dew point after the heat dehydration process. And a step of performing a temperature lowering process for lowering the temperature of the substrate.

また、前記降温処理を、前記雰囲気中の気体を排気するとともに新たな低露点気体を前記雰囲気中に導入しながら行うことを特徴とする。   Further, the temperature lowering process is performed while exhausting a gas in the atmosphere and introducing a new low dew point gas into the atmosphere.

また、前記降温処理において、前記新たな低露点気体を前記基板に吹き付けることを特徴とする。   In the temperature lowering process, the new low dew point gas is blown onto the substrate.

また、前記基板は、ストライプ状に形成された前記第一電極と、前記第一電極及び前記絶縁層上に前記第一電極と交差するように形成される隔壁部とが配設され、前記絶縁層及び前記隔壁部形成後に、前記基板を前記加熱脱水処理及び前記降温処理することを特徴とする。   In addition, the substrate includes the first electrode formed in a stripe shape, and a partition formed on the first electrode and the insulating layer so as to intersect the first electrode, and the insulating After the formation of the layer and the partition wall, the substrate is subjected to the heat dehydration treatment and the temperature lowering treatment.

本発明の脱水装置は、前記課題を解決するために、所定の形状に形成された第一電極と、絶縁層と、少なくとも発光層を有する有機層と、第二電極と、を順次積層してなる有機EL素子が配設される基板を脱水する脱水装置であって、少なくとも前記絶縁層が形成された前記基板を加熱して加熱脱水処理を行う加熱室と、前記加熱脱水処理後に雰囲気を低露点に保ちながら前記基板の温度を下げる降温処理を行う降温室と、前記基板を搬送する搬送手段と、を備えてなることを特徴とする。   In order to solve the above-described problem, the dehydrating apparatus of the present invention is formed by sequentially laminating a first electrode formed in a predetermined shape, an insulating layer, an organic layer having at least a light emitting layer, and a second electrode. A dehydrating apparatus for dehydrating a substrate on which an organic EL element is disposed, wherein a heating chamber for heating and dehydrating the substrate on which at least the insulating layer is formed is heated, and an atmosphere is lowered after the heating and dehydrating process. It is characterized by comprising a temperature-decreasing room for performing a temperature-falling process for lowering the temperature of the substrate while keeping a dew point, and a transport means for transporting the substrate.

また、前記基板を前記加熱室あるいは前記降温室に搬送する搬送手段を備えてなることを特徴とする。   Further, the present invention is characterized in that it comprises transport means for transporting the substrate to the heating chamber or the descending room.

また、前記降温室は、前記雰囲気中の気体を排気する排気部と、前記雰囲気中に新たな低露点気体を導入する導入部と、を備えてなることを特徴とする。   The descending greenhouse is characterized by comprising an exhaust part for exhausting gas in the atmosphere and an introduction part for introducing new low dew point gas into the atmosphere.

また、前記導入部は、前記基板と対向するように設けられ前記新たな低露点気体を前記基板に吹き付ける導入口を備えてなることを特徴とする。   In addition, the introduction unit includes an introduction port that is provided so as to face the substrate and blows the new low dew point gas onto the substrate.

本発明は、少なくとも発光層を有する有機層を一対の電極で挟持した有機EL素子が配設される基板の脱水方法及び脱水装置に関し、加熱脱水処理後の有機ELパネルの構成部材への水分の再吸着を抑制し、十分な脱水効果を得ることが可能となる。   The present invention relates to a substrate dehydration method and a dehydration apparatus in which an organic EL element having at least an organic layer having a light-emitting layer sandwiched between a pair of electrodes is provided, and relates to a method for dehydrating water to components of an organic EL panel after heat dehydration. It is possible to suppress re-adsorption and obtain a sufficient dehydration effect.

以下、本発明の実施の形態を添付の図面に基いて説明する。脱水装置Aは、図1に示すように、投入室1と、搬送ロボット(搬送手段)2と、加熱室3と、降温室4と、搬出室5と、から主に構成されており、後で詳述する支持基板(基板)10の脱水処理を行うものである。   Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. As shown in FIG. 1, the dehydrating apparatus A is mainly composed of an input chamber 1, a transfer robot (transfer means) 2, a heating chamber 3, a descending greenhouse 4, and a carry-out chamber 5. The support substrate (substrate) 10 described in detail in FIG.

投入室1は、基板投入装置Bと接続され、基板投入装置Bに備えられるコンベア等の搬送手段を介して支持基板10が投入されるものである。   The input chamber 1 is connected to the substrate input device B, and the support substrate 10 is input via a conveying means such as a conveyor provided in the substrate input device B.

搬送ロボット2は、サーボモータ等の駆動手段(図示しない)によって回転可能に設けられ、投入室1,加熱室3,降温室4及び搬出室5の奥行き方向及び高さ方向に移動可能に設けられるものである。搬送ロボット2は、先端部に例えば支持基板10を挟持する爪部からなる固定部材(図示しない)を有し、後述する加熱脱水処理においては投入室1から加熱室3へ支持基板10を搬送し、後述する降温処理においては加熱室3から降温室4へ支持基板を搬送し、降温処理終了後は降温室4から搬出室5へ支持基板10を搬送する。   The transfer robot 2 is rotatably provided by a driving means (not shown) such as a servo motor, and is provided so as to be movable in the depth direction and the height direction of the input chamber 1, the heating chamber 3, the descending chamber 4, and the carry-out chamber 5. Is. The transfer robot 2 has a fixing member (not shown) made of a claw for holding the support substrate 10 at the tip, for example, and transfers the support substrate 10 from the input chamber 1 to the heating chamber 3 in the heat dehydration process described later. In the temperature lowering process, which will be described later, the support substrate is transferred from the heating chamber 3 to the descending chamber 4, and after the temperature lowering process, the support substrate 10 is transferred from the descending chamber 4 to the unloading chamber 5.

加熱室3は、図2に示すように、支持基板10を収納する筒状の収納部材3aと、収納部材3aの外面に捲回される加熱コイル3bとを備えるものである。加熱室3は、搬送ロボット2によって加熱室3内に支持基板10が搬送されると、加熱コイル3bに所定の電流を印加することによって収納部材3aを加熱し、収納部材3aからの熱によって支持基板10を例えば250℃まで加熱して、支持基板10及び支持基板10上に形成される有機EL素子の構成部材に吸着される水分を脱離させる加熱脱水処理を行う。なお、加熱温度としては支持基板10及び前記構成部材に吸着されている水分を蒸発させることが可能な温度であればよい。なお、本実施の形態においては、前記加熱脱水処理は大気中で行われるものであるが、露点が例えば−35℃以下の低露点雰囲気中で行うものであってもよい。   As shown in FIG. 2, the heating chamber 3 includes a cylindrical storage member 3a for storing the support substrate 10 and a heating coil 3b wound around the outer surface of the storage member 3a. When the support substrate 10 is transferred into the heating chamber 3 by the transfer robot 2, the heating chamber 3 heats the storage member 3a by applying a predetermined current to the heating coil 3b, and is supported by the heat from the storage member 3a. The substrate 10 is heated to, for example, 250 ° C., and a heat dehydration process is performed to desorb moisture adsorbed on the support substrate 10 and the constituent members of the organic EL element formed on the support substrate 10. The heating temperature may be any temperature that can evaporate moisture adsorbed on the support substrate 10 and the constituent members. In the present embodiment, the heat dehydration process is performed in the air, but may be performed in a low dew point atmosphere having a dew point of, for example, −35 ° C. or less.

降温室4は、図3に示すように、支持基板を収納する収納部材4aと導入部4bと排気部4cとを備え、前記加熱脱水処理後、搬送ロボット2によって降温室3内に搬送された支持基板10の温度を例えば100℃以下に下げる降温処理を行うものである。なお、前記降温処理においては支持基板10が後の工程で破損しない程度の温度まで下げればよい。降温室3は、導入部4aから窒素を導入して、降温室4内の雰囲気を大気の露点よりも低い低露点とするとともに、排気部4bから降温室4内の雰囲気中の窒素及び水分を自然対流にて排気し、降温室4内の雰囲気を入れ替える。なお、本実施の形態においては、降温室4内の雰囲気は、露点が−35℃以下に保たれている。導入部4bは、新たな窒素の導入によって生じる導入風が支持基板10に吹き付けられるように、新たな窒素が導入される導入口4dが支持基板10と対向するように設けられており、前記降温処理の方法として、窒素の入れ替えによる降温室4内の雰囲気の温度低下と前記導入風とによって支持基板10の温度を下げる方法を用いている。かかる前記降温処理は、降温室4内の雰囲気中の窒素を入れ替えながら行うことにより、前記降温処理を行う間は降温室4内の雰囲気が低露点に保たれるため、支持基板10に水分が再吸着することを抑制可能となっている。   As shown in FIG. 3, the descending room 4 includes a storage member 4 a that houses a support substrate, an introduction part 4 b, and an exhaust part 4 c, and is transported into the descending room 3 by the transport robot 2 after the heating and dehydrating process. A temperature lowering process is performed to lower the temperature of the support substrate 10 to 100 ° C. or lower, for example. In the temperature lowering process, the temperature may be lowered to a level at which the support substrate 10 is not damaged in a later process. The descending greenhouse 3 introduces nitrogen from the introduction part 4a to make the atmosphere in the descending greenhouse 4 a low dew point lower than the dew point of the atmosphere, and also removes nitrogen and moisture in the atmosphere in the descending greenhouse 4 from the exhaust part 4b. The air is exhausted by natural convection and the atmosphere in the descending greenhouse 4 is changed. In the present embodiment, the dew point of the atmosphere in the descending greenhouse 4 is kept at −35 ° C. or lower. The introduction part 4b is provided so that the introduction port 4d into which new nitrogen is introduced faces the support substrate 10 so that the introduction air generated by the introduction of new nitrogen is blown to the support substrate 10, and the temperature drop As a processing method, a method is used in which the temperature of the support substrate 10 is lowered by lowering the temperature of the atmosphere in the descending greenhouse 4 by replacing nitrogen and the introduced air. Since the temperature lowering process is performed while replacing the nitrogen in the atmosphere in the descending greenhouse 4, the atmosphere in the descending greenhouse 4 is maintained at a low dew point during the temperature lowering process. Re-adsorption can be suppressed.

なお、降温室4内の雰囲気を入れ替える方法としては、本実施の形態に限定されるものではなく、窒素の導入あるいは排気に専用のポンプを設けて、このポンプによって降温室4内の雰囲気中の窒素を入れ替えてもよい。また、窒素とともに排気される水分を除去する脱水機構を備え、降温室4内に窒素を循環させてもよい。また、前記降温処理の方法としては、例えば支持基板10を冷却された平板部材に接触あるいは近接させて支持基板10の温度を下げる方法を用いてもよい。また、降温室4内に導入される気体は窒素に限定されるものではなく、例えば水分を除去した大気(ドライエアー)を導入して降温室4内の雰囲気を低露点とする方法を用いてもよい。   Note that the method of replacing the atmosphere in the descending room 4 is not limited to the present embodiment, and a dedicated pump is provided for introducing or exhausting nitrogen, and this pump is used in the atmosphere in the descending room 4. Nitrogen may be replaced. Further, a dehydration mechanism for removing moisture exhausted together with nitrogen may be provided, and nitrogen may be circulated in the descending greenhouse 4. Further, as a method for the temperature lowering process, for example, a method of lowering the temperature of the support substrate 10 by bringing the support substrate 10 into contact with or in proximity to a cooled flat plate member may be used. Further, the gas introduced into the descending room 4 is not limited to nitrogen. For example, by using a method in which the atmosphere in the descending room 4 is lowered by introducing air (dry air) from which moisture has been removed. Also good.

搬出室5は、前記加熱脱水処理及び前記降温処理が施され、水分が脱離された支持基板10が搬送ロボット2によって配設されるものであり、支持基板10に前記有機EL素子の構成部材である後述する有機層及び背面電極(第二電極)を蒸着する蒸着装置(図示しない)と接続されるものである。また、搬出室5は、前記蒸着装置へ支持基板10を受け渡す際に室内を真空雰囲気とするものである。   In the carry-out chamber 5, the support substrate 10 that has been subjected to the heat dehydration process and the temperature lowering process and from which moisture has been desorbed is disposed by the transport robot 2, and the component of the organic EL element is disposed on the support substrate 10. It connects with the vapor deposition apparatus (not shown) which vapor-deposits the organic layer and back electrode (2nd electrode) which are mentioned later. The carry-out chamber 5 is a chamber in which a vacuum atmosphere is provided when the support substrate 10 is delivered to the vapor deposition apparatus.

次に、脱水装置1によって前記加熱脱水処理及び前記降温処理される支持基板10について詳述する。   Next, the support substrate 10 subjected to the heat dehydration process and the temperature lowering process by the dehydrator 1 will be described in detail.

支持基板10は、例えばガラス材料等の透光性材料からなり、一方の面上に前記有機EL素子の前記構成部材が形成されるものである。なお、本実施の形態においては、前記加熱脱水処理及び前記降温処理時には、図4及び図5に示すように、支持基板10上には、前記有機EL素子の前記構成部材として、透明電極(第一電極)11と、接続配線部12と、絶縁層13と、隔壁部14と、とが順次積層形成されている。   The support substrate 10 is made of a light-transmitting material such as a glass material, and the constituent member of the organic EL element is formed on one surface. In the present embodiment, at the time of the heat dehydration process and the temperature lowering process, as shown in FIGS. 4 and 5, a transparent electrode (first electrode) is provided on the support substrate 10 as the component of the organic EL element. (One electrode) 11, a connection wiring portion 12, an insulating layer 13, and a partition wall portion 14 are sequentially stacked.

透明電極11は、例えば酸化スズ(SnO2)に酸化インジウム(In2O3)をドープしたITO(Indium Tin Oxide)をスパッタリングあるいは蒸着法等の方法で支持基板10上に層状に形成し、例えばフォトリソグラフィー法にてストライプ状にパターニングしてなるものである。透明電極11は、図5に示すように陽極配線部11a及び陽極部11bを有しており、陽極配線部11aは終端部に外部電源と電気的に接続するための陽極端子部11cを備える。   For example, ITO (Indium Tin Oxide) in which indium oxide (In2O3) is doped into tin oxide (SnO2) is formed in layers on the support substrate 10 by a method such as sputtering or vapor deposition. Patterning in stripes. As shown in FIG. 5, the transparent electrode 11 has an anode wiring part 11a and an anode part 11b, and the anode wiring part 11a includes an anode terminal part 11c for electrical connection to an external power source at the terminal part.

接続配線部12は、透明電極11とともに形成されるものであり、同一材料のITOからなるものである。接続配線部12は、終端部に陰極端子部12aが形成され、他端が後述する陰極配線部と接続される。   The connection wiring part 12 is formed together with the transparent electrode 11 and is made of the same material ITO. The connection wiring part 12 has a cathode terminal part 12a formed at the terminal part and the other end connected to a cathode wiring part described later.

絶縁層13は、ポリイミド系やフェノール系等の絶縁材料からなるものでフォトリソグラフィー法等の手段によって支持基板10上の非発光個所に所定の形状にて形成される。絶縁層13は、透明電極11の各陽極部11bの間に形成されるとともに透明電極11と若干重なるように形成され、透明電極11と後述する背面電極(第二電極)との間を絶縁するものである。   The insulating layer 13 is made of an insulating material such as polyimide or phenol, and is formed in a predetermined shape on a non-light emitting portion on the support substrate 10 by means such as photolithography. The insulating layer 13 is formed between the anode portions 11b of the transparent electrode 11 and is formed so as to slightly overlap the transparent electrode 11, and insulates the transparent electrode 11 from a back electrode (second electrode) described later. Is.

隔壁部14は、例えばフェノール系等の絶縁材料からなるものであり、フォトリソグラフィー法等の手段によって逆テーパー状に形成される。隔壁部14は透明電極11及び絶縁層13上においては陽極部11bと略直角に交わるように形成され、また、支持基板10上の後述する陰極配線部に対応する個所においては図5に示すように支持基板10の前記有機EL素子形成面側から見て円弧状となるように形成される。   The partition wall portion 14 is made of, for example, a phenol-based insulating material, and is formed in a reverse taper shape by means such as a photolithography method. The partition wall portion 14 is formed on the transparent electrode 11 and the insulating layer 13 so as to intersect the anode portion 11b at a substantially right angle, and the portion corresponding to the later-described cathode wiring portion on the support substrate 10 is as shown in FIG. The support substrate 10 is formed to have an arc shape when viewed from the organic EL element forming surface side.

次に、支持基板10の脱水方法について説明する。   Next, a method for dehydrating the support substrate 10 will be described.

まず、透明電極11,接続配線部12,絶縁層13及び隔壁部14が形成され、さらに洗浄処理が行われた支持基板10を基板投入装置Bを介して脱水装置Aの投入室1に投入する。   First, the transparent substrate 11, the connection wiring part 12, the insulating layer 13, and the partition wall part 14 are formed, and the support substrate 10 that has been subjected to the cleaning process is put into the loading chamber 1 of the dehydrating apparatus A through the substrate loading apparatus B. .

次に、支持基板10を搬送ロボット2によって加熱室3内に搬送し、支持基板10を加熱室3内で加熱して前記加熱脱水処理を行い、支持基板10,透明電極11,接続配線部12,絶縁層13及び隔壁部14に吸着されている水分を蒸発させる(加熱脱水処理工程,図2参照)。   Next, the support substrate 10 is transferred into the heating chamber 3 by the transfer robot 2, and the support substrate 10 is heated in the heating chamber 3 to perform the heating and dehydration treatment, and the support substrate 10, the transparent electrode 11, and the connection wiring portion 12. The water adsorbed on the insulating layer 13 and the partition wall 14 is evaporated (heat dehydration process, see FIG. 2).

さらに、前記加熱脱水処理後、支持基板10を搬送ロボット2によって降温室4内に搬送し、降温室4内の排気部4cによって雰囲気中の窒素及び水分を排気するととも導入部4bによって新たな窒素を導入しながら、支持基板10を降温室4内で冷却して前記降温処理を行う(降温処理工程,図3参照)。   Further, after the heat dehydration treatment, the support substrate 10 is transported into the descending greenhouse 4 by the transport robot 2, and nitrogen and moisture in the atmosphere are exhausted by the exhaust section 4 c in the descending greenhouse 4 and new nitrogen is introduced by the introducing section 4 b. Then, the support substrate 10 is cooled in the temperature-lowering greenhouse 4 to perform the temperature-lowering process (temperature-lowering process, see FIG. 3).

以上の方法により、支持基板10と支持基板10上に形成される透明電極11,接続配線部12,絶縁層13及び隔壁部14に吸着されている水分を脱離させることができる。   By the above method, the moisture adsorbed on the support substrate 10 and the transparent electrode 11 formed on the support substrate 10, the connection wiring portion 12, the insulating layer 13, and the partition wall portion 14 can be desorbed.

支持基板10は、前記加熱脱水処理及び前記降温処理後、前記蒸着装置によって、正孔注入層,正孔輸送層,発光層及び電子輸送層を順次積層形成して有機層15を形成し、さらにアルミニウムを積層形成して層状の背面電極(第二電極)16を形成する(図6(a)参照)。なお、背面電極16は、積層形成時に隔壁部14によってストライプ状に切断され、円弧状の陰極配線部16a及び透明電極11に略直角に交わる陰極部16bが形成される(図7参照)。また、陰極配線部16aは接続配線部12に電気的に接続されている。   The support substrate 10 is formed by sequentially stacking a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer by the vapor deposition apparatus after the heat dehydration process and the temperature lowering process, thereby forming the organic layer 15. A layered back electrode (second electrode) 16 is formed by laminating aluminum (see FIG. 6A). Note that the back electrode 16 is cut into stripes by the partition wall portion 14 when forming the stacked layers, and the arcuate cathode wiring portion 16a and the cathode portion 16b that intersects the transparent electrode 11 substantially at right angles are formed (see FIG. 7). Further, the cathode wiring portion 16 a is electrically connected to the connection wiring portion 12.

次に、凹形状の封止部材17を、前記有機EL素子を取り囲むように支持基板10上に接着剤17aを介して配設するとともに紫外線を照射して接着剤17aを硬化させ、支持基板10と封止部材17とを気密的に接合する(図6(b)参照)。以上の方法によって、陽極部11bと陰極部16bの対向箇所からなる画素がマトリクス状に設けられた前記有機EL素子を表示部とするドットマトリクス型の有機ELパネルが得られる。   Next, the concave sealing member 17 is disposed on the support substrate 10 via the adhesive 17a so as to surround the organic EL element, and the adhesive 17a is cured by irradiating ultraviolet rays. And the sealing member 17 are hermetically joined (see FIG. 6B). By the above method, a dot matrix type organic EL panel using the organic EL element in which the pixels including the opposing portions of the anode portion 11b and the cathode portion 16b are provided in a matrix form is obtained.

かかる支持基板10の脱水方法は、水分を多く含む絶縁層13及び隔壁部14形成後に支持基板10を加熱して前記加熱脱水処理し、また、前記加熱脱水処理後に、雰囲気を低露点に保ちながら支持基板10の温度を下げる前記降温処理するものである。また、雰囲気中の気体(窒素)を排気するとともに雰囲気中に新たな気体(窒素)を導入しながら前記降温処理を行うものである。   Such a method of dehydrating the support substrate 10 includes heating the support substrate 10 after the formation of the moisture-containing insulating layer 13 and the partition wall 14 and performing the heat dehydration process, and maintaining the atmosphere at a low dew point after the heat dehydration process. The temperature lowering process is performed to lower the temperature of the support substrate 10. Further, the temperature lowering process is performed while exhausting gas (nitrogen) in the atmosphere and introducing new gas (nitrogen) into the atmosphere.

以上のことにより、支持基板10の脱水方法は、雰囲気を低露点に保ちながら支持基板10を前記加熱脱水処理による高温状態から所定の温度まで下げることによって、加熱後に支持基板10の温度を下げる際に、雰囲気中の温度が低下した場合であっても雰囲気中の水分が凝固して前記構成部材に吸着することを抑制し、前記加熱脱水処理による脱水効果を十分に得ることが可能となる。したがって、有機ELパネルの製造において、有機EL素子の構成部材に含まれる水分によって発光部にダークスポットが発生することを抑制でき、有機ELパネルの歩留まりを向上させることが可能となる。   As described above, the dehydrating method of the support substrate 10 is performed when the temperature of the support substrate 10 is lowered after heating by lowering the support substrate 10 from a high temperature state by the heat dehydration process to a predetermined temperature while keeping the atmosphere at a low dew point. In addition, even when the temperature in the atmosphere is lowered, it is possible to suppress the moisture in the atmosphere from solidifying and adsorbing to the constituent members, and to sufficiently obtain the dehydration effect by the heat dehydration treatment. Therefore, in the manufacture of the organic EL panel, it is possible to suppress the generation of dark spots in the light emitting portion due to moisture contained in the constituent members of the organic EL element, and the yield of the organic EL panel can be improved.

また、支持基板10の脱水方法は、前記降温処理に際して、導入部4bによって導入される新たな気体(窒素)を支持基板10に吹き付けることで、新たな窒素の導入によって生じる前記導入風を用いて支持基板10を冷却することができ、より短時間で支持基板10を所定の温度まで下げることが可能となり、生産効率を向上させることが可能となる。   Further, the dehydrating method of the support substrate 10 uses the introduced air generated by introducing new nitrogen by blowing a new gas (nitrogen) introduced by the introduction portion 4b onto the support substrate 10 during the temperature lowering process. The support substrate 10 can be cooled, the support substrate 10 can be lowered to a predetermined temperature in a shorter time, and production efficiency can be improved.

かかる脱水装置Aは、支持基板10を加熱して前記加熱脱水処理を行う加熱室3と、前記加熱脱水処理後に雰囲気を低露点に保ちながら支持基板10の温度を下げる前記降温処理を行う降温室4と、を備えてなるものである。また、支持基板10を加熱室3あるいは降温室4に搬送する搬送手段2を備えてなるものである。また、降温室4に、雰囲気中に新たな窒素を導入する導入部4bと雰囲気中の窒素及び水分を排気する排気部4cとを備えるものである。   The dehydrating apparatus A includes a heating chamber 3 that heats the supporting substrate 10 to perform the heating and dehydrating process, and a cooling chamber that performs the temperature-decreasing process for lowering the temperature of the supporting substrate 10 while maintaining an atmosphere at a low dew point after the heating and dehydrating process. 4. In addition, a transporting means 2 for transporting the support substrate 10 to the heating chamber 3 or the descending room 4 is provided. Further, the descending room 4 includes an introduction part 4b for introducing new nitrogen into the atmosphere and an exhaust part 4c for exhausting nitrogen and moisture in the atmosphere.

以上のことにより、脱水装置Aは、前記加熱脱水処理を行う加熱室3とは異なる降温室4内にて前記降温処理を行うことにより、前記加熱脱水処理によって発生した水分を含まない雰囲気中にて支持基板10を前記加熱脱水処理による高温状態から所定の温度まで下げることができ、加熱後に支持基板10の温度を下げる際に、加熱によって有機EL素子3の構成部材から脱離された雰囲気中の水分が前記構成部材に再吸着することを抑制し、前記加熱脱水処理による脱水効果を十分に得ることが可能となる。また、降温室4内の雰囲気を低露点に保ちながら支持基板10を前記加熱脱水処理による高温状態から所定の温度まで下げることによって、加熱後に支持基板10の温度を下げる際に、雰囲気中の温度が低下した場合であっても雰囲気中の水分が凝固して前記構成部材に吸着することを抑制し、前記加熱脱水処理による脱水効果を十分に得ることが可能となる。   As described above, the dehydrating apparatus A performs the temperature lowering process in the temperature descending chamber 4 different from the heating chamber 3 that performs the heat dehydrating process, so that the moisture generated by the heat dehydrating process is not contained in the atmosphere. The support substrate 10 can be lowered from a high temperature state by the heat dehydration process to a predetermined temperature, and when the temperature of the support substrate 10 is lowered after the heating, the atmosphere is desorbed from the constituent members of the organic EL element 3 by heating. It is possible to suppress the re-adsorption of water to the constituent members and to sufficiently obtain the dehydration effect by the heat dehydration treatment. Further, when the temperature of the support substrate 10 is lowered after heating by lowering the support substrate 10 from the high temperature state by the heat dehydration process to a predetermined temperature while keeping the atmosphere in the descending room 4 at a low dew point, the temperature in the atmosphere is reduced. Even when the water content is lowered, it is possible to suppress the moisture in the atmosphere from solidifying and adsorbing to the constituent members, and to sufficiently obtain the dehydration effect by the heat dehydration treatment.

また、脱水装置Aは、導入部4bの導入口4dを支持基板10と対向するように設け、前記降温処理に際して、導入口4dから導入される新たな窒素を支持基板10に吹き付けることにより、新たな窒素の導入によって生じる前記導入風を用いて支持基板10を冷却することができ、より短時間で支持基板10を所定の温度まで下げることが可能となり、生産効率を向上させることが可能となる。   Further, the dehydrating apparatus A is provided with the introduction port 4d of the introduction part 4b so as to face the support substrate 10, and by blowing new nitrogen introduced from the introduction port 4d onto the support substrate 10 during the temperature lowering process, The support substrate 10 can be cooled by using the introduction air generated by the introduction of fresh nitrogen, the support substrate 10 can be lowered to a predetermined temperature in a shorter time, and the production efficiency can be improved. .

なお、本実施の形態はドットマトリクス型の有機ELパネルを構成する支持基板10を脱水するものであったが、セグメント型の有機ELパネルを構成する支持基板にも本発明を適用できることは言うまでもない。また、本実施の形態は、支持基板10上に1つの前記有機EL素子が形成されるものであったが、本発明は、複数の有機EL素子が形成される基板にも適用可能である。   In this embodiment, the support substrate 10 constituting the dot matrix type organic EL panel is dehydrated, but it goes without saying that the present invention can also be applied to the support substrate constituting the segment type organic EL panel. . Further, in the present embodiment, one organic EL element is formed on the support substrate 10, but the present invention can also be applied to a substrate on which a plurality of organic EL elements are formed.

また、本実施の形態は、絶縁層13及び隔壁部14形成後に、前記加熱脱水処理及び前記降温処理を行うものであったが、本発明の請求項1から請求項3に記載の本発明は、少なくとも絶縁層形成後に加熱脱水処理及び降温処理を行うものであればよい。また、本発明は、有機層あるいは第二電極形成後に加熱脱水処理及び降温処理を行うものであってもよい。また、本発明における加熱脱水処理及び降温処理を行う回数は1回に限定されるものではなく、数回行うものであってもよい。   Moreover, although this Embodiment performed the said heat | fever dehydration process and the said temperature-fall process after formation of the insulating layer 13 and the partition part 14, this invention of Claim 1-3 of this invention is this. As long as the heat dehydration treatment and the temperature lowering treatment are performed at least after the insulating layer is formed. Moreover, this invention may perform a heat | fever dehydration process and a temperature fall process after formation of an organic layer or a 2nd electrode. Moreover, the frequency | count of performing the heat | fever dehydration process and temperature-fall process in this invention is not limited to 1 time, You may perform several times.

また、本実施の形態は、加熱室3と降温室4とを設け、前記加熱脱水処理と前記降温処理とを異なる室内で行うものであったが、本発明の請求項1に記載の基板の脱水方法において、加熱室内を低露点雰囲気とするとともに、加熱脱水処理後に前記雰囲気中の気体及び水分を排気するとともに新たな低露点気体を導入することで加熱脱水処理によって生じた水分を除去し、同一の前記加熱室内で降温処理を行うものであってもよい。   Moreover, although this Embodiment provided the heating chamber 3 and the temperature falling room 4, and performed the said heat | fever dehydration process and the said temperature-falling process in a different chamber, the board | substrate of Claim 1 of this invention is used. In the dehydration method, the heating chamber has a low dew point atmosphere, and after the heat dehydration process, the gas and moisture in the atmosphere are exhausted and moisture generated by the heat dehydration process is introduced by introducing a new low dew point gas. A temperature lowering process may be performed in the same heating chamber.

本発明の実施の形態である脱水装置を示す図。The figure which shows the spin-drying | dehydration apparatus which is embodiment of this invention. 同上の加熱室を示す図。The figure which shows a heating chamber same as the above. 同上の降温室を示す図。The figure which shows a descending greenhouse. 同上の脱水装置によって脱水される支持基板を示す断面図。Sectional drawing which shows the support substrate dehydrated by the same dehydration apparatus. 同上の脱水装置によって脱水される支持基板を示す図。The figure which shows the support substrate dehydrated by the same dehydration apparatus. 同上の支持基板を有する有機ELパネルの製造工程を示す断面図。Sectional drawing which shows the manufacturing process of the organic electroluminescent panel which has a support substrate same as the above. 同上の支持基板を有する有機ELパネルを示す図。The figure which shows the organic electroluminescent panel which has a support substrate same as the above.

符号の説明Explanation of symbols

A 脱水装置
B 基板投入装置
2 搬送ロボット(搬送手段)
3 加熱室
4 降温室
4b 導入部
4c 排気部
4d 導入口
10 支持基板(基板)
11 透明電極(第一電極)
13 絶縁層
14 隔壁部
15 有機層
16 背面電極(第二電極)
A Dehydrator B Substrate input device 2 Transfer robot (transfer means)
3 Heating room 4 Falling room 4b Introduction part 4c Exhaust part 4d Introduction port 10 Support substrate (substrate)
11 Transparent electrode (first electrode)
13 Insulating layer 14 Partition 15 Organic layer 16 Back electrode (second electrode)

Claims (8)

所定の形状に形成された第一電極と、絶縁層と、少なくとも発光層を有する有機層と、第二電極と、を順次積層してなる有機EL素子が配設される基板の脱水方法であって、少なくとも前記絶縁層形成後に前記基板を加熱して加熱脱水処理を行う工程と、前記加熱脱水処理後に雰囲気を低露点に保ちながら前記基板の温度を下げる降温処理を行う工程と、を含むことを特徴とする基板の脱水方法。 This is a method for dehydrating a substrate in which an organic EL element in which a first electrode formed in a predetermined shape, an insulating layer, an organic layer having at least a light emitting layer, and a second electrode are sequentially laminated is disposed. And a step of performing a heat dehydration process by heating the substrate after forming the insulating layer and a step of performing a temperature lowering process for lowering the temperature of the substrate while maintaining an atmosphere at a low dew point after the heat dehydration process. A method for dehydrating a substrate. 前記降温処理を、前記雰囲気中の気体を排気するとともに新たな低露点気体を前記雰囲気中に導入しながら行うことを特徴とする請求項1に記載の基板の脱水方法。 2. The substrate dehydration method according to claim 1, wherein the temperature lowering process is performed while exhausting a gas in the atmosphere and introducing a new low dew point gas into the atmosphere. 前記降温処理において、前記新たな低露点気体を前記基板に吹き付けることを特徴とする請求項2に記載の基板の脱水方法。 The substrate dehydration method according to claim 2, wherein in the temperature lowering process, the new low dew point gas is blown onto the substrate. 前記基板は、ストライプ状に形成された前記第一電極と、前記第一電極及び前記絶縁層上に前記第一電極と交差するように形成される隔壁部とが配設され、前記絶縁層及び前記隔壁部形成後に前記基板を前記加熱脱水処理及び前記降温処理することを特徴とする請求項1から請求項3の何れかに記載の基板の脱水方法。 The substrate includes the first electrode formed in a stripe shape, and a partition formed on the first electrode and the insulating layer so as to intersect the first electrode, and the insulating layer and The substrate dehydration method according to claim 1, wherein the substrate is subjected to the heat dehydration treatment and the temperature lowering treatment after the partition wall is formed. 所定の形状に形成された第一電極と、絶縁層と、少なくとも発光層を有する有機層と、第二電極と、を順次積層してなる有機EL素子が配設される基板を脱水処理する脱水装置であって、
少なくとも前記絶縁層が形成された前記基板を加熱して加熱脱水処理を行う加熱室と、前記加熱脱水処理後に雰囲気を低露点に保ちながら前記基板の温度を下げる降温処理を行う降温室と、を備えてなることを特徴とする脱水装置。
Dehydration for dehydrating a substrate on which an organic EL element in which a first electrode formed in a predetermined shape, an insulating layer, an organic layer having at least a light emitting layer, and a second electrode are sequentially stacked is disposed. A device,
A heating chamber that heats and dehydrates the substrate on which the insulating layer is formed; and a greenhouse that performs a temperature-decreasing process that lowers the temperature of the substrate while maintaining an atmosphere at a low dew point after the heating and dehydration. A dehydrating apparatus comprising the dehydrating device.
前記基板を前記加熱室あるいは前記降温室に搬送する搬送手段を備えてなることを特徴とする請求項5に記載の脱水装置。 6. The dehydrating apparatus according to claim 5, further comprising transport means for transporting the substrate to the heating chamber or the descending room. 前記降温室は、前記雰囲気中の気体を排気する排気部と、前記雰囲気中に新たな低露点気体を導入する導入部と、を備えてなることを特徴とする請求項5または請求項6に記載の脱水装置。 The said descending greenhouse is equipped with the exhaust part which exhausts the gas in the said atmosphere, and the introducing | transducing part which introduces a new low dew point gas in the said atmosphere, The Claim 5 or Claim 6 characterized by the above-mentioned. Dehydration apparatus as described. 前記導入部は、前記基板と対向するように設けられ前記新たな低露点気体を前記基板に吹き付ける導入口を備えてなることを特徴とする請求項7に記載の脱水装置。 The dehydrating apparatus according to claim 7, wherein the introduction unit includes an introduction port that is provided so as to face the substrate and blows the new low dew point gas onto the substrate.
JP2003430638A 2003-12-25 2003-12-25 Substrate dewatering method and dewatering apparatus Expired - Fee Related JP4147585B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003430638A JP4147585B2 (en) 2003-12-25 2003-12-25 Substrate dewatering method and dewatering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003430638A JP4147585B2 (en) 2003-12-25 2003-12-25 Substrate dewatering method and dewatering apparatus

Publications (2)

Publication Number Publication Date
JP2005190822A true JP2005190822A (en) 2005-07-14
JP4147585B2 JP4147585B2 (en) 2008-09-10

Family

ID=34788950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003430638A Expired - Fee Related JP4147585B2 (en) 2003-12-25 2003-12-25 Substrate dewatering method and dewatering apparatus

Country Status (1)

Country Link
JP (1) JP4147585B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1998390A2 (en) 2007-05-28 2008-12-03 Kabushiki Kaisha Toyoda Jidoshokki Pretreatment method of substrate of organic EL element and manufacturing method for organic EL element
EP2101348A1 (en) * 2008-03-04 2009-09-16 KISCO Corporation Method for removing moisture from substrate coated with transparent electrode
JP2016105476A (en) * 2010-04-23 2016-06-09 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1998390A2 (en) 2007-05-28 2008-12-03 Kabushiki Kaisha Toyoda Jidoshokki Pretreatment method of substrate of organic EL element and manufacturing method for organic EL element
EP2101348A1 (en) * 2008-03-04 2009-09-16 KISCO Corporation Method for removing moisture from substrate coated with transparent electrode
US8176653B2 (en) 2008-03-04 2012-05-15 Kisco Method for removing moisture from substrate coated with transparent electrode
JP2016105476A (en) * 2010-04-23 2016-06-09 株式会社半導体エネルギー研究所 Method for manufacturing semiconductor device
US9978878B2 (en) 2010-04-23 2018-05-22 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JP4147585B2 (en) 2008-09-10

Similar Documents

Publication Publication Date Title
JP4881789B2 (en) Organic electroluminescence device manufacturing method and organic electroluminescence device manufacturing apparatus
JP5268249B2 (en) Manufacturing method of organic light emitting device
JP5593901B2 (en) Organic electroluminescence panel and manufacturing method thereof
JP2004235048A (en) Method for manufacturing organic el panel
JP4147585B2 (en) Substrate dewatering method and dewatering apparatus
JP4782550B2 (en) Method for manufacturing organic electroluminescent device
JP2008159347A (en) Manufacturing method of transparent conductive film, manufacturing method of organic electroluminescent device, and plasma treatment device
JP2011233426A (en) Firing apparatus for organic film and organic element having organic film fired by the apparatus
JP2000123971A (en) Manufacture of organic el
JP2005097730A (en) Film-forming apparatus and manufacturing apparatus
KR100942498B1 (en) Method of producing organic light emitting apparatus
JP2008293957A (en) Manufacturing method of organic light emitting device
JP4391773B2 (en) Method for compressing moisture-sensitive organic materials
JP2003173873A (en) Manufacturing method of organic el element
JP5193465B2 (en) Organic EL device manufacturing method, organic EL device, and organic EL display panel
JP2014232689A (en) Defect inspection device and defect inspection method
JP3924944B2 (en) Organic EL and manufacturing method thereof
JP2008060024A (en) Method of manufacturing organic light emitting device and apparatus of manufacturing organic thin film
JP2008293914A (en) Pre-treatment method of substrate in organic el element manufacturing method
JP2000348864A (en) Manufacture of organic electroluminescent element
JP4045656B2 (en) Method for manufacturing electroluminescent element
JP2005310639A (en) Manufacturing method of organic el element
JP4873736B2 (en) Manufacturing method of organic light emitting device
JP2006019087A (en) Manufacturing method of organic el display device
JP5367344B2 (en) Manufacturing method of organic light emitting device

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070404

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070406

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070515

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080602

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080615

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110704

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 4147585

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140704

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees