JP2005184033A - Ｌｅｄランプ及びその製造方法 - Google Patents

Ｌｅｄランプ及びその製造方法 Download PDF

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Publication number
JP2005184033A
JP2005184033A JP2005073174A JP2005073174A JP2005184033A JP 2005184033 A JP2005184033 A JP 2005184033A JP 2005073174 A JP2005073174 A JP 2005073174A JP 2005073174 A JP2005073174 A JP 2005073174A JP 2005184033 A JP2005184033 A JP 2005184033A
Authority
JP
Japan
Prior art keywords
lead
led lamp
light emitting
emitting element
mold member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005073174A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005184033A5 (cg-RX-API-DMAC7.html
Inventor
Ikuya Arai
育也 新居
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2005073174A priority Critical patent/JP2005184033A/ja
Publication of JP2005184033A publication Critical patent/JP2005184033A/ja
Publication of JP2005184033A5 publication Critical patent/JP2005184033A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005073174A 1999-12-08 2005-03-15 Ｌｅｄランプ及びその製造方法 Pending JP2005184033A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005073174A JP2005184033A (ja) 1999-12-08 2005-03-15 Ｌｅｄランプ及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34828299 1999-12-08
JP2005073174A JP2005184033A (ja) 1999-12-08 2005-03-15 Ｌｅｄランプ及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000374864A Division JP3685057B2 (ja) 1999-12-08 2000-12-08 Ｌｅｄランプ及びその製造方法

Publications (2)

Publication Number Publication Date
JP2005184033A true JP2005184033A (ja) 2005-07-07
JP2005184033A5 JP2005184033A5 (cg-RX-API-DMAC7.html) 2005-11-17

Family

ID=34796961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005073174A Pending JP2005184033A (ja) 1999-12-08 2005-03-15 Ｌｅｄランプ及びその製造方法

Country Status (1)

Country Link
JP (1) JP2005184033A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109119A (ja) * 2008-10-30 2010-05-13 Sanyo Electric Co Ltd 発光モジュール及びその製造方法
JP2011077188A (ja) * 2009-09-29 2011-04-14 Toyoda Gosei Co Ltd 照明装置
JP2014220312A (ja) * 2013-05-07 2014-11-20 三菱電機株式会社 Ｌｅｄ表示素子および映像表示装置
JP2022125901A (ja) * 2021-02-17 2022-08-29 日亜化学工業株式会社 発光装置及び光源装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207051U (cg-RX-API-DMAC7.html) * 1985-06-18 1986-12-27
JPS6333642U (cg-RX-API-DMAC7.html) * 1986-08-19 1988-03-04
JPH0677374A (ja) * 1992-08-27 1994-03-18 Nec Corp 半導体装置用リードおよびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207051U (cg-RX-API-DMAC7.html) * 1985-06-18 1986-12-27
JPS6333642U (cg-RX-API-DMAC7.html) * 1986-08-19 1988-03-04
JPH0677374A (ja) * 1992-08-27 1994-03-18 Nec Corp 半導体装置用リードおよびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010109119A (ja) * 2008-10-30 2010-05-13 Sanyo Electric Co Ltd 発光モジュール及びその製造方法
JP2011077188A (ja) * 2009-09-29 2011-04-14 Toyoda Gosei Co Ltd 照明装置
JP2014220312A (ja) * 2013-05-07 2014-11-20 三菱電機株式会社 Ｌｅｄ表示素子および映像表示装置
JP2022125901A (ja) * 2021-02-17 2022-08-29 日亜化学工業株式会社 発光装置及び光源装置
JP7513900B2 (ja) 2021-02-17 2024-07-10 日亜化学工業株式会社 発光装置及び光源装置

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