JP2005183574A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To supply an electronic component simultaneously realizing the antipodal specifications of an improvement in a performance and the improvement in a durability in which electronic equipment is miniaturized, a high-density mounting is enabled and an adverse effect on the equipment is eliminated, by a simple constitution. <P>SOLUTION: The electronic component has a plurality of elements, pairs of terminal sections formed to each of a plurality of the elements and packaging materials covering the elements and parts of the terminals. In the electronic component, the generation of a leakage current or the like among terminals led out to the outside of the armoring materials is prevented by a constitution in which nonconductive shielding sections are formed among the adjacent terminal sections led out to the outside of the packaging materials. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic component suitably used for an electronic device such as a modem, a power supply circuit, a liquid crystal power supply, a DC-DC converter, and a power line communication device.

  Many electronic components are mounted in electronic devices such as modems and power supply circuits. For example, a capacitor is often used for noise removal or DC component cut.

  Here, electronic devices are required to be reduced in size and cost, and accordingly, electronic components are also required to be significantly reduced in size and cost. Furthermore, surface mounting electronic components are often required in order to reduce mounting cost and mounting area by automatic mounting. On the other hand, conflicting specifications such as high performance, reduction of characteristic variation, and improvement of durability have been demanded together with downsizing.

  Furthermore, with the increase in the number of pins of LSI and the like and the increase in the number of bits of signal lines, there is a need for high-density mounting in which a plurality of electronic components are mounted in a place where the line spacing is very narrow.

  In particular, a modem or the like often has a set of two lines for data input and data output, and two electronic components must be mounted on the line.

In order to satisfy these requirements, various electronic devices have been proposed (see, for example, Patent Document 1 and Patent Document 2).
JP 2001-110691 A JP 2002-43170 A

  However, when trying to achieve the respective objectives of miniaturization and high performance, they are mutually contradictory objectives, and there is a problem that the other objective cannot be satisfied.

  For example, in order to cope with reduction of performance and characteristic variation or improvement of durability, electronic parts have been proposed in which electronic parts are molded with an exterior material such as resin. Since the electronic parts are molded, there is a problem of increasing the size. In addition, it cannot cope with a board with a narrow line interval, and there are problems such as an increase in the size of the board due to the routing of the line to widen the line spacing of the signal line, a problem of line radiation, or a performance deterioration due to a signal delay due to the routing. there were.

  Conversely, when mounting bare electronic parts that are not molded in order to achieve miniaturization and high-density mounting, short circuit due to the occurrence of electric field coupling between the electronic parts, signal crosstalk, etc. The problem was occurring. In addition, problems such as failure of electronic devices have occurred.

  In order to solve these problems, when a plurality of elements are molded, the element interval is narrowed in order to realize the miniaturization, and as a result, the distance between adjacent terminals drawn out of the exterior material becomes very narrow. Cause problems. For this reason, the insulation resistance between the terminals is lowered and a leak current is generated, which causes problems such as destruction of electronic components and failure of electronic devices accompanying this.

  The present invention solves the above-mentioned problems with a simple configuration, and achieves electronic components that simultaneously achieve the contradictory specifications of downsizing and high-density mounting of electronic equipment, and performance improvement and durability improvement that eliminate adverse effects on the equipment. The purpose is to supply.

  The present invention is an electronic component having a plurality of elements, a pair of terminal portions provided in each of the plurality of elements, and an exterior material that covers a part of the elements and the terminal portions, and is pulled out of the exterior material A non-conductive shielding portion is provided between adjacent terminal portions.

  The present invention has a configuration in which a plurality of elements, particularly a multilayer capacitor, is molded with a single exterior material and the terminals are exposed to the outside, so that a plurality of electronic components can be mounted at one time, reducing the mounting procedure, and Reduction of mounting cost can be realized.

  In addition, since a plurality of elements are sealed in one exterior material, the mounting area can be reduced as compared with the case where individual electronic components are mounted, and the electronic device can be downsized. Further, the line spacing on the mounting board can be narrowed, the enlargement of the mounting board due to extra routing of the lines can be avoided, and performance degradation such as line radiation can be eliminated.

  Furthermore, it is possible to eliminate performance deterioration due to electric field coupling between the elements and insufficient breakdown voltage, and deterioration of durability, which occur when a plurality of elements are individually mounted at a narrow interval. Further, by being molded with an exterior material, durability against changes in the surrounding environment is increased, impact resistance and the like can be improved, and a long life of the electronic device can be realized.

  In addition, by defining the adjacent spacing between the terminals drawn out of the exterior material to a certain level or more, voltage leakage and insulation deterioration between adjacent terminals can be prevented, and the withstand voltage required for mounting on equipment can be reduced. Can be realized.

  Furthermore, at the adjacent interval between the terminals drawn to the outside of the exterior material, a convex part is provided on the exterior material or a shielding part is formed by connecting a member from the outside, thereby further ensuring insulation between the terminals. As a result, generation of voltage leakage and insulation resistance is prevented. As a result, it is possible to achieve a withstand voltage required for mounting on equipment.

  Also, if the element to be molded is a capacitor that requires a high breakdown voltage, a large current may be short-circuited due to the occurrence of a leakage current, which may cause a failure of the electronic device. It is something that can be done.

  Due to the above effects, it is possible to reduce the size and increase the life of electronic devices.

  The invention according to claim 1 of the present invention is an electronic component having a plurality of elements, a pair of terminal portions provided on each of the plurality of elements, and an exterior material that covers a part of the elements and the terminal portions, An electronic component characterized in that a non-conductive shielding portion is provided between adjacent terminal portions drawn out of the exterior material, such as leakage current generated between the terminal portions drawn out of the exterior material, etc. Can prevent the destruction of electronic components and the failure of electronic devices, so that the distance between devices and terminals can be reduced while molding multiple devices with a single exterior material. Miniaturization and mounting area can be reduced.

The invention described in claim 2 of the present invention is characterized in that the shielding portion is a protruding portion of the exterior material that is a part of the exterior material and is formed between adjacent terminal portions. The shielding part can be easily formed by processing the exterior material.

  According to a third aspect of the present invention, in the electronic component according to the first aspect, the shielding portion is a non-conductive member provided by being connected to the exterior material between the adjacent portions of the terminal portion. Therefore, the shielding part can be formed by a simple procedure of connecting a member formed separately to the exterior material.

  The invention according to claim 4 of the present invention is characterized in that the shielding part protrudes more than the protruding amount of the terminal part drawn out of the exterior material. It is a component, and it is possible to reliably prevent a leakage current generated between the terminals.

  The invention according to claim 5 of the present invention is characterized in that the shielding part has a protruding thickness rather than the thickness of the terminal part drawn out of the exterior material. It is a component, and it is possible to reliably prevent a leakage current generated between the terminals.

  The invention according to claim 6 of the present invention is characterized in that the protruding thickness of the shielding part is 0.2 mm or more thicker than the thickness of the terminal part drawn out of the exterior material. It is a component, and it is possible to more reliably prevent the occurrence of a leak current generated between terminals.

  The invention according to claim 7 of the present invention is a position having a distance between adjacent terminals wider than a distance between adjacent terminals in a drawing position from the exterior material in a distance between adjacent terminals pulled out of the exterior material. The electronic component according to any one of claims 1 to 6, wherein the electronic component is pulled out to the outside of the exterior member without widening an interval between elements to be molded. The distance between adjacent terminals can be increased, and the occurrence of a leakage current can be prevented with a simple configuration.

  The invention according to claim 8 of the present invention is the electronic component according to claim 7, characterized in that the terminal portion drawn out of the exterior material has a bent portion that increases the distance between adjacent portions. In addition, the distance between adjacent terminals drawn out of the exterior material can be increased, and the occurrence of leakage current can be prevented with a simple configuration.

  According to a ninth aspect of the present invention, there is provided a dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate, and a pair of terminal portions. An electronic component having a plurality of multilayer capacitors and an exterior material covering a part of the lead terminal, and a non-conductive shielding portion is provided between adjacent lead terminals drawn out of the exterior material. It is an electronic component characterized by being provided, and it prevents leakage current generated between the lead terminal portions drawn outside the exterior material, thereby preventing destruction of the electronic component and failure of the electronic device. As a result, it is possible to reduce the distance between the capacitors and the terminals while molding a plurality of multilayer capacitors with a single exterior material, so that it is possible to reduce the size of electronic components and the mounting area.

  The invention according to claim 10 of the present invention is characterized in that the shielding portion is a protruding portion of the exterior material that is a part of the exterior material and is formed between adjacent lead terminals. The shielding part can be easily formed by processing the exterior material.

  According to an eleventh aspect of the present invention, in the electronic component according to the ninth aspect, the shielding portion is a non-conductive member provided to be connected to the exterior member between adjacent terminal portions. Therefore, the shielding part can be formed by a simple procedure of connecting a member formed separately to the exterior material.

The invention according to claim 12 of the present invention is characterized in that the shielding portion protrudes more than the protruding amount of the lead terminal drawn out of the exterior material. It is a component, and it is possible to reliably prevent a leakage current generated between the terminals.

  The invention according to claim 13 of the present invention is characterized in that the shielding part has a protruding thickness rather than the thickness of the lead terminal drawn out of the exterior material. It is a component, and it is possible to reliably prevent a leakage current generated between the terminals.

  The invention according to claim 14 of the present invention is characterized in that the protruding thickness of the shielding portion is 0.2 mm or more thicker than the thickness of the terminal portion drawn out of the exterior material. It is a component, and it is possible to more reliably prevent leakage current generated between terminals.

  According to the fifteenth aspect of the present invention, in the distance between adjacent lead terminals drawn out of the exterior material, the position having an adjacent distance larger than the distance between adjacent terminal portions at the position pulled out from the exterior material The electronic component according to any one of claims 9 to 14, wherein the electronic component is pulled out of the exterior material without widening an interval between molded elements. The distance between adjacent terminals can be increased, and the occurrence of a leakage current can be prevented with a simple configuration.

  According to a sixteenth aspect of the present invention, in the electronic component according to the fifteenth aspect, the lead terminals drawn out of the exterior material are bent so that the distance between adjacent terminals is increased. Thus, the distance between adjacent terminals drawn out of the exterior material can be increased, and the occurrence of leakage current can be prevented with a simple configuration.

  The invention according to claim 17 of the present invention is an electronic component having a plurality of elements, a pair of terminal portions provided on each of the plurality of elements, and an exterior material covering a part of the elements and the terminal portions. An electronic component having a distance between adjacent terminals of at least 0.5 mm and not more than 5 mm drawn out of the exterior material, and prevents leakage current between the terminals. be able to.

  According to an eighteenth aspect of the present invention, there is provided a dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate, and a pair of terminal portions. An electronic component having a pair of lead terminals, a plurality of multilayer capacitors, and an exterior material covering a part of the lead terminals, wherein a distance between adjacent lead terminal portions drawn out of the exterior material is at least 0.5 mm An electronic component having a thickness of 5 mm or less can prevent leakage current between lead terminals drawn to the outside of the exterior material.

  In this specification, a multilayer capacitor is described as an example of an element. However, the present invention is not limited to this, and various elements such as a normal capacitor, a resistor, an inductance, and a filter that are not multilayer may be used. It is the same.

  In addition, the term “terminal” means that even if a part of the lead terminal connected to the multilayer capacitor is drawn out of the exterior material, a part of the terminal connected in advance to the element is outside the exterior material. The same applies to those that are drawn out. In the specification, the distance between adjacent terminals is a distance between adjacent terminals at a position where lead terminals drawn out of the exterior material or terminals are adjacent to each other.

  Hereinafter, it demonstrates using drawing.

1 is a side view of a multilayer capacitor according to an embodiment of the present invention, FIG. 2 is a connection configuration diagram of the multilayer capacitor according to the embodiment of the present invention, and FIG. 3 is a layout of the multilayer capacitor according to the embodiment of the present invention. 4 (a) is a perspective view of an electronic component in the embodiment of the present invention, FIG. 4 (b) is a front view of the electronic component in the embodiment of the present invention, and FIG. 4 (c) is the present invention. FIG. 5, FIG. 6, FIG. 7 is a perspective view of the electronic component in the embodiment of the present invention, and FIGS. 8 and 9 are front views of the electronic component in the embodiment of the present invention. FIG. 10 (a) is an adjacent distance and electrical breakdown experiment graph in the embodiment of the present invention, and FIG. 10 (b) is a leakage current experiment graph between the shielding part and the terminal in the embodiment of the present invention. FIG. 11A is a mounting diagram of a conventional electronic component, 11 (b) is a mounting view of an electronic component in the embodiment of the present invention.

  DESCRIPTION OF SYMBOLS 1 is a multilayer capacitor, 2 is a dielectric substrate, 3 is an internal electrode, 4 is a terminal part, 5 and 6 are lead terminals, 5a and 6a are mounting parts, 7 is an electronic component, 8 is an exterior material, 9 is adjacent to a terminal , 10 is a shielding part, 11 is a drawing part adjacent distance, 12 is a mounting part adjacent distance, 13 is a bent part, 14 and 15 are mounting boards, and 16, 17, 18, and 19 are lines.

  The multilayer capacitor 1 is an example of an element, and may be various types such as a non-multilayer capacitor, resistor, inductor, filter, and the like, and is an element including a so-called wide variety.

  As apparent from FIGS. 1 to 4, lead terminals 5 and 6 are connected to the two multilayer capacitors 1, respectively, and the two multilayer capacitors 1 and a part of the lead terminals 5 and 6 are molded by the exterior material 8. The mounting portions 5a and 6a, which are part of the lead terminals 5 and 6 drawn out to the outside, are used for mounting on a mounting board or the like.

  Further, the distance between the terminal adjacent portions 9 that are adjacent portions of the lead terminals 5 drawn out of the exterior material or the adjacent portions of the lead terminals 6 is specified to be 0.5 mm or more, so that the terminals are adjacent to each other. A leak current is not generated in the portion 9.

  As a result, the electronic component 7 becomes a four-terminal electronic component and can be mounted on a two-line line at a time, thereby enabling miniaturization. Further, the mounting process is shortened, the mounting cost is reduced, and the mounting area is also reduced. Furthermore, adverse effects on electronic devices can be avoided.

  Details of each part will be described below.

  First, the multilayer capacitor 1 will be described with reference to FIG.

  The dielectric base 2 is a base made of a dielectric, and a dielectric material such as titanium oxide or barium titanate is preferably used. Alternatively, alumina or the like is also used. Using such a material, it is appropriately formed in a necessary shape and size.

  The internal electrode 3 is an electrode embedded in the dielectric substrate 2, and the constituent material of the internal electrode 3 includes a metal material containing at least one of Ni, Ag, Pd, Cu, Au and the like. In particular, using Ni alone or an Ni alloy is advantageous in terms of cost. Moreover, these alloys and the thing by which the plating process was given to the surface may be used. Of course, an alloy or the like may be used. The internal electrode 3 has a thickness of 1 to 5 μm. Moreover, it is preferable that the space | interval of adjacent internal electrodes 3 shall be 15 micrometers or more.

  The internal electrode 3 is electrically connected to the terminal portion 4. The internal electrode 3 connected to only one of the terminal portions 4 and the internal electrode 3 connected to only the other of the terminal portions 4 are opposed to each other. Main capacitance is generated between the internal electrodes 3.

  The terminal portion 4 is connected to the internal electrode 3 and is provided as a pair on the dielectric substrate 2 and is usually provided at both ends thereof, but may be provided at other ends. For example, it is formed on the upper and lower sides of the dielectric substrate 2, and terminal portions 4 formed on the upper and lower sides may be connected to lead terminals 5 and 6 described later. The terminal portion 4 is made of a material containing at least one of Cu, Zn, Ni, Ag, Au, etc., and the surface thereof may be subjected to single layer or multilayer plating.

  Further, the terminal portion 4 may be configured by bonding a metal cap to the dielectric substrate 2. Furthermore, it is preferable that the outermost part (outermost part) of the terminal part 4 is composed of a conductive material having a melting point of 200 degrees or more. Even if a high temperature is applied to the electronic component 7 by reflow or the like, The terminal portion 4 is not thermally damaged and stable reflow characteristics can be obtained.

  As an example of a specific manufacturing method of the multilayer capacitor 1, a plurality of dielectric sheets coated with the internal electrode 3 on one surface are prepared, and these dielectric sheets are stacked so that the electrodes do not directly contact each other. It is created by forming terminal portions 4 at both ends of this laminate.

At this time, the size of the multilayer capacitor 1 is as follows: L1 is the length, L2 is the height, and L3 is the width.
3.0mm ≦ L1 ≦ 5.5mm
0.5mm ≦ L2 ≦ 2.5mm
1.5mm ≦ L3 ≦ 3.5mm
It comprised so that it might become. Of course, it may be formed in a size larger than this.

  If L1 to L3 are made smaller than the above lower limit value, the formation area of the internal electrodes 3 becomes insufficient, the interval between the internal electrodes 3 inevitably becomes narrow, and the number of internal electrodes 3 must be reduced. It becomes difficult to obtain a large capacity value, and it becomes difficult to obtain an electronic component having a wide capacity.

  The plurality of multilayer capacitors 1 may have different capacitance values. For example, when mounted on a pair line of an output line and an input line such as a modem or a power line communication module, This is suitable when the required capacity values are different. Further, in FIG. 1 and the like, the case where there are two multilayer capacitors 1 as elements is shown, but the same applies to the case where there are three or more. The element to be molded may be a multilayer capacitor and a normal capacitor, or a capacitor and an inductor.

  Next, the lead terminals 5 and 6 will be described.

  As is apparent from FIGS. 2 and 3, the lead terminals 5 and 6 are connected to the terminal portion 4 of the multilayer capacitor 1 so that the lead terminals 5 and 6 can be pulled out to the outside. As a result, even if molded into the outer packaging material 8 described later, the lead terminals that can be electrically connected to the exterior of the outer packaging material 8 can be drawn out, mounted on the mounting board, and molded into the multilayer capacitor 1 inside. It becomes possible to make electrical connection with elements such as

  As the material constituting the surface of the lead terminals 5 and 6, a metal material selected from at least one of Fe, Cu, and Ni is preferably selected. Use of these materials is advantageous in terms of electrical characteristics and workability. It is. Moreover, an alloy of these metals may be used, and the surface may be subjected to single layer or multilayer plating.

As a general structure of the lead terminals 5 and 6, the terminal part 4 is connected with a joint part, and an extended part extending toward the external report of the exterior member 8 can be further bent and mounted on a mounting board. Mounting parts 5a and 6a. In addition, as shown in FIG. 4C, the mounting portions 5a and 6a may be bent in a direction facing each other, but may be a so-called gull wing type that bends in different directions. In addition, it is desirable that the joint portion that joins the terminal portion 4 and the lead terminals 5 and 6 is made of a joining material having a melting point of 200 degrees or more. In this case, a thermal influence such as reflow in mounting the electronic component 7 is caused. It is possible to prevent the deterioration of characteristics without receiving.

  In addition, when the terminal portions 4 are provided on the top and bottom of the dielectric substrate 2 instead of at both ends, the terminals 4 may be alternately connected up and down in accordance with this, and then drawn out of the exterior material 8. .

  In addition, the lead terminals 5 and 6 are pulled out from the opposing surfaces of the outer packaging material 8, respectively, so that the space between the lead terminal 5 and the lead terminal 6 can be widened and the balance after mounting is improved.

  Further, as shown in FIG. 3, in this embodiment, lead terminals 5 and 6 are individually connected to each multilayer capacitor 1 in order to mold two multilayer capacitors 1 into one. In FIG. 3, the lead terminals 5 and 6 are connected to the two multilayer capacitors 1, but three or more multilayer capacitors 1 may be used, and of course, an element other than the multilayer capacitors may be used.

  Furthermore, it is preferable that the parasitic capacitance generated between the lead terminals 5 and 6 is 0.1 pF to 5.0 pF. This is because if the parasitic capacitance is larger than 5.0 pF, the variation in capacitance becomes very large when the electronic component 7 is formed, and if it is smaller than 0.1 pF, there is a problem accompanied by manufacturing difficulties. It is also preferable to trim the lead terminal as necessary to adjust the area and to adjust the parasitic capacitance afterwards.

  In addition, since the lead terminals 5 and 6 have substantially the same shape as each other, the number of parts can be reduced, productivity is improved, and the lead terminals 5 and 6 are mounted on the exterior member 8 from substantially the same height. Since it can be pulled out, and almost the same length can be pulled out, it is possible to manufacture an electronic component with good objectability.

  Next, the exterior material 8 will be described.

  As shown in FIG. 4, the outer packaging material 8 is formed by molding two multilayer capacitors 1 together. A part of the multilayer capacitor 1 and the lead terminals 5 and 6 are molded. By molding with the exterior material 8, the final electronic component 7 is formed, and the outer shape is a shape close to a rectangular parallelepiped, but it is preferable to improve the impact resistance by chamfering each side or corner. is there. Further, the lead terminals 5 and 6 can be pulled out to mount the electronic component 7 on the substrate.

  As the exterior material 8, an epoxy resin such as an optocresol novolak type, a biphenyl type, or a pentadiene type is suitably used.

  Further, by setting the minimum value of the distance between the surface of the outer packaging material 8 and the surface of the multilayer capacitor 1 (the thinnest portion of the outer packaging material 8) to be 0.1 mm or more, the outer skin pressure resistance can be improved.

  Moreover, the base of the lead-out part of the lead terminals 5 and 6 can be strengthened by projecting the part from which the lead terminals 5 and 6 of the exterior material 8 are drawn out from the other parts. As a result, bending of the lead terminals 5 and 6 can be prevented, and entry of moisture from the outside can be easily prevented.

  Here, an example of a method for manufacturing the electronic component 7 will be described.

  First, two element bodies to which the lead terminals 5 and 6 are connected are arranged on the multilayer capacitor 1, and a part of the multilayer capacitor 1 and the lead terminals 5 and 6 is covered using a molding machine or the like. Next, the lead terminals 5 and 6 drawn out from the exterior material 8 are bent as shown in FIG. 4C to complete the electronic component 7.

  Next, the terminal adjacent portion 9 will be described.

  The terminal adjacent portion 9 is a portion adjacent to a plurality of (two in FIG. 4) lead terminals 5 or between the lead terminals 6 when the lead terminal 5 or the lead terminal 6 is pulled out of the exterior material 8. is there. That is, in the electronic component 7 molded with the exterior material 8, the terminal adjacent portions 9 exist at two places drawn out for mounting.

  Here, it is preferable that the adjacent distance of the terminal adjacent part 9 is 0.5 mm or more and 5 mm or less. By setting the adjacent distance to 0.5 mm or more, there is no occurrence of leakage current or reduction in insulation resistance between the drawn lead terminals, and no short circuit occurs between the mounted lines. No adverse effects occur. On the other hand, when it is larger than 5 mm, the element interval becomes too large, and the miniaturization of the electronic component cannot be realized. From this point, it is preferably 5 mm or less. However, depending on the specifications, a larger element spacing may be used.

  Next, an embodiment in which a shielding portion is provided in the terminal adjacent portion 9 between the lead terminals will be described with reference to FIGS.

  The shielding part 10 is provided in the terminal adjacent part 9 between the lead terminals, and prevents the occurrence of leakage current or the like between the lead terminals. As shown in FIG. 5 and FIG. 6, the shielding part 10 may be a protrusion formed integrally with the exterior material 8, and is formed by bonding, fitting, or the like separately formed with a non-conductive material. It may be what was done. However, it is easy in processing by forming it integrally with the exterior material 8. Moreover, although the shielding part 10 is formed with a non-conductive material, when it forms with another member, the adhesion part may be filled with what is called adhesive resin. It is also preferable that a film made of silicon rubber or the like is formed over the outer surface of the shielding part 10.

  Further, as shown in FIG. 6, it is also preferable that a shielding portion 10 is formed in the terminal adjacent portion 9 over the entire range where the lead terminals 5 and 6 are drawn out of the exterior material 8. In this case, it is possible to prevent the occurrence of leakage current or the like in the entire range where the lead terminals 5 or the lead terminals 6 are adjacent to each other.

  Here, it is preferable that the thickness of the shielding portion 10 is larger than the thickness of the lead terminals 5 and 6 drawn out of the exterior material 8. The advantage that the thickness of the shielding portion 10 is thicker than the thickness of the lead terminals 5 and 6 can reliably prevent the occurrence of leakage current between the lead terminals 5 or between the lead terminals 6 or the decrease in insulation resistance. There is. When the thickness of the shielding part 10 is made larger than the thickness of the lead terminal, the difference is preferably set to 0.2 mm or more. As will be described later in the experimental results, it is because leakage current can be reliably prevented by having an extra thickness of 0.2 mm or more.

  In addition, when the mounting portions 5a and 6a of the lead terminals 5 and 6 are present on the bottom surface of the electronic component 7, if the thickness of the shielding portion 10 is larger than the thickness of the lead terminals 5 and 6, the mounting substrate 5 In this mounting, mounting can be made possible by providing the mounting land with a height that eliminates the difference in thickness.

Similarly, when the lead terminals 5 and 6 are bent toward the outside rather than the bottom surface of the electronic component and the mounting portions 5a and 6a are present outside the bottom surface of the electronic component, the shielding portion 10 is connected to the lead terminal. It is preferable that the protrusion is larger than the protrusion amount.

  FIG. 7 shows this state. Since the lead terminals 5 and 6 are bent toward the outside of the electronic component, the lead terminals 5 or the lead terminals 6 are adjacent to each other toward the outside. In such a case, the projection thickness of the shielding portion 10 can be dealt with by setting it to a thickness that can cover the projection amount to the tip portions of the lead terminals 5 and 6. In the case where the shielding part 10 is formed integrally with the external image material 8, the protrusion thickness may be increased. When the shielding part 10 is formed separately, the shielding part 10 having a thickness commensurate with this is provided. Is formed on the exterior member 8 by bonding, fitting, or pasting.

  Thus, by providing the shielding portion 10 made of a non-conductive material between the lead terminals 5 or between the lead terminals 6 over the entire area where the lead terminals 5 and 6 exist, the generation of leakage current between the lead terminals and the insulation resistance. Can be prevented.

  In the case of FIG. 7, since the lead terminals 5 and 6 do not exist on the bottom surface side of the electronic component 7, it is not necessary to provide the shielding portion 10 that shields between the lead terminals 5 and 6; There is a merit that it is not necessary to raise the mounting land or solder to prevent the gap between the terminal and the line to be connected.

  Next, a mode for preventing a leakage current and a decrease in insulation resistance by widening the terminal adjacent portion 9 between the lead terminals 5 or between the lead terminals 6 will be described.

  In FIG. 8, in the portion where the lead terminals 5, 6 are pulled out from the exterior material 8, the electronic component 7 has a position on the lead terminals 5, 6 having a distance between adjacent areas that is larger than the distance between adjacent areas in the lead-out portion. Is represented. As is apparent from FIG. 7, the distance between the lead portion adjacent distance 11 and the mounting portion adjacent distance 12 is larger in the latter, and most of the lead terminals 5 and 6 drawn out of the exterior material 8. The distance between adjacent terminals is sufficiently large. That is, since the distance between the adjacent lead terminals 5 can be sufficiently larger than the distance between the multilayer capacitors 1 which are elements molded inside the exterior material 8, the size of the electronic component 7 can be increased. Without increasing the size, the distance between the terminals of the lead terminals 5 and 6 can be made sufficiently wide.

  This is realized by providing the bent portion 13 on the lead terminals 5 and 6. The bent portion 13 may be a two-time bent portion formed not only by bending the lead terminals 5 and 6 three-dimensionally but also by cutting the lead terminals 5 and 6.

  Further, as shown in FIG. 9, the lead terminals 5 and 6 may be pulled out from the exterior material 8 in a C shape to increase the distance between adjacent terminals. Since the lead terminals 5 and 6 are formed in a C shape from where the lead terminals 5 and 6 are pulled out from the exterior material 8, the terminal adjacent portions 9 are gradually widened. As a result, a sufficient distance between adjacent terminals can be ensured at most positions of the lead terminals 5 and 6, and the occurrence of leakage current and a decrease in insulation resistance can be prevented.

  In addition to extending the adjacent distance by providing the bent portions 13 in the lead terminals 5 and 6, or extending the adjacent distance as a C-shape, the terminal adjacent portion 9 is shown in FIGS. It is also preferable to realize further prevention of leakage current by forming the shielding portion 10 shown in FIG. In this case, the shielding part 10 may be matched with the shape of the terminal adjacent part 9, and may have a fixed shape such as a rectangular parallelepiped irrespective of the shape.

  Next, the merit of the electronic component 7 will be described based on the experimental results.

  FIG. 10A shows a graph of experimental results obtained by experimenting the relationship between the distance between adjacent lead terminals and the electrical breakdown value. The abscissa represents the distance between adjacent lead terminals, and the ordinate represents the value of the applied voltage at which leakage current that causes electronic component destruction occurs.

  It can be seen that a normal electronic component requires a withstand voltage against a leak current of 1 KVAC or more, and this can be ensured from 0.5 mm or more. If it is less than 0.5 mm, it can be seen that a leak current is generated if it is less than 1 KVAC, and the sufficient breakdown voltage is not satisfied. If it is 0.5 mm or more, it has sufficient withstand pressure | voltage.

  As described above, by setting the distance between the lead terminals 5 or between the lead terminals 6 to be 0.5 mm or more, it is possible to reliably prevent the occurrence of leakage current and the decrease in insulation resistance between the lead terminals. It is something that can be done.

  Next, in FIG. 10B, the voltage value at which the leakage current is generated due to the difference in the protrusion amount when the shielding portion 10 is not present and the shielding portion 10 is compared is compared. In (A), when the shielding part 10 is not provided, (B) is when the projection amount of the shielding part 10 is 0.1 mm larger than the thickness of the lead terminal, and (C) is the projection amount of the shielding part 10. When the thickness is 0.2 mm larger than the thickness of the lead terminal outside, (D) shows the case where the protruding amount of the shielding part 10 is 0.3 mm larger than the thickness of the lead terminal.

  As is clear from FIG. 10B, it can be seen that in the case (A) where the shielding portion 10 is not provided, the withstand voltage at which the leak current is generated is considerably smaller than 1 KVAC, and the withstand voltage between the lead terminals is not sufficient. On the other hand, when the shielding portion 10 is provided, the protrusion amount is about 1 KVAC when the protruding amount is 0.1 mm larger than the thickness protruding to the outside of the lead terminal, and the thickness protruding to the outside of the lead terminal. If it is larger than 0.2 mm, it is well over 1 KVAC, and the leakage voltage changes gradually from about 0.3 mm, and it can be seen that 0.2 mm or more is sufficient.

  As a result, with the configuration in which the shielding part 10 is provided, even when the distance between the lead terminals is very narrow, the withstand voltage between the lead terminals can be secured, and the protruding amount of the shielding part 10 is 0.2 mm. If it is abnormal, the effect is certain. Since the shielding portion 10 can secure a leakage withstand voltage, the interval between the lead terminals and the multilayer capacitor 1 molded on the exterior material 8 can be narrowed, so that a very small electronic component 7 can be configured. It becomes. Moreover, if the shielding part 10 is 0.2 mm or more than the thickness of the lead terminal which has come out outside, it turns out that the shielding effect between lead terminals is enough.

  Finally, it will be described with reference to FIG. 11 that the electronic component 7 and the mounting area can be reduced.

  FIG. 11A shows a case where two electronic parts molded with one element as a comparative example are mounted. FIG. 11B shows an electronic device with two elements molded according to the present invention. The case where one component is mounted is shown. Like a modem or a power line communication module, a multilayer capacitor or an electronic component in which a capacitor is molded is mounted on each of two lines of output data and input data for the purpose of noise reduction or the like.

As is clear from FIG. 11 (a), in the conventional electronic component 7 in which a single element is molded, the processing procedure for mounting is required twice, and the size of each electronic component is further increased. Since it is large, the required mounting area becomes large. Further, it is necessary to increase the distance between the lines 18 in accordance with the distance between the adjacent lead terminals 5 and 6 of the two electronic components 7, which naturally requires an increase in mounting area and the routing of the lines. .

  On the other hand, as is clear from FIG. 11B, the electronic component 7 in which two elements are molded reduces the mounting area. Further, since the distance between the adjacent lead terminals 5 and 6 is also narrowed, the distance between the lines 19 can be narrowed, and naturally the downsizing of the mounting area is further promoted. In addition, it is not necessary to route the track. For this reason, there is also a merit that it is possible to avoid line radiation generated by line routing and adverse effects on other mounted components. Of course, when mounting, it can be mounted on the line by a single processing procedure, and the mounting cost can be reduced.

  At this time, between the lead terminals, the adjacent distance has a sufficient distance of 0.5 mm or more, or the shielding part 10 is provided, or the bent part 13 is provided for sufficiently ensuring the adjacent distance. The leakage current withstand voltage between the lead terminals is sufficiently ensured depending on whether or not it is provided. As a result, no element destruction or electronic device failure occurs.

  These have the same effect even when three or more elements are molded in one electronic component 7.

  From the above, in order to reduce the size of electronic components and the mounting area, when using electronic components that are molded with a single exterior material, the distance between adjacent lead terminals is reduced to achieve miniaturization. It can be seen that a decrease in breakdown voltage due to the reduction can be prevented efficiently and reliably. This makes it possible to reduce the size of electronic components, reduce the mounting area, shorten the mounting process and reduce the mounting cost by molding multiple elements with a single exterior material without impairing the durability of the electronic components. It can be realized. Further, since these are realized by a very simple configuration, the cost of electronic parts does not increase.

  In addition, it is also preferable to form a decoding part by mixing an inductor, a capacitor, and the like inside one exterior material 8. Further, the configuration and the effect described above are particularly useful in a high voltage electronic component that requires a high breakdown voltage.

  The present invention is an electronic component having a plurality of elements, a pair of terminal portions provided in each of the plurality of elements, and an exterior material that covers a part of the elements and the terminal portions, and is pulled out of the exterior material With a configuration in which a non-conductive shielding part is provided between adjacent terminals, a plurality of electronic components can be mounted at one time, reducing the mounting procedure, reducing the mounting cost, and reducing leakage current between terminals. It can also be applied to applications where it is necessary to prevent the occurrence.

Side view of multilayer capacitor in an embodiment of the present invention Connection configuration diagram of multilayer capacitor in an embodiment of the present invention The perspective view which has arrange | positioned the multilayer capacitor in embodiment of this invention (A) The perspective view of the electronic component in embodiment of this invention, (b) The front view of the electronic component in embodiment of this invention, (c) The side view of the electronic component in embodiment of this invention The perspective view of the electronic component in embodiment of this invention The perspective view of the electronic component in embodiment of this invention The perspective view of the electronic component in embodiment of this invention The front view of the electronic component in embodiment of this invention The front view of the electronic component in embodiment of this invention (A) Inter-adjacent distance and electrical breakdown experiment graph in the embodiment of the present invention, (b) Leakage current experiment graph between the shielding portion and the terminal in the embodiment of the present invention (A) Mounting diagram of conventional electronic component, (b) Mounting diagram of electronic component in the embodiment of the present invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Multilayer capacitor 2 Dielectric substrate 3 Internal electrode 4 Terminal part 5 and 6 Lead terminal 7 Electronic component 8 Exterior material 9 Terminal adjacent part 10 Shielding part 11 Leading part adjacent distance 12 Mounting part adjacent distance 13 Bending part 14 and 15 Mounting substrate 16, 17, 18, 19 tracks

Claims (18)

A plurality of elements;
A pair of terminal portions provided in each of the plurality of elements;
An electronic component having an exterior material covering a part of the element and the terminal portion,
An electronic component, wherein a non-conductive shielding portion is provided between adjacent terminal portions drawn out of the exterior material. The electronic component according to claim 1, wherein the shielding portion is a protruding portion of the exterior material that is a part of the exterior material and is formed between the adjacent terminal portions. 2. The electronic component according to claim 1, wherein the shielding portion is a non-conductive member provided in connection with the exterior member between adjacent terminal portions. The electronic component according to claim 1, wherein the shielding portion protrudes more than a protruding amount of the terminal portion drawn out of the exterior material. The electronic component according to claim 1, wherein the shielding portion has a protruding thickness that is larger than a thickness of a terminal portion drawn out of the exterior material. 6. The electronic component according to claim 5, wherein the protruding thickness of the shielding portion is 0.2 mm or more thicker than the thickness of the terminal portion drawn out of the exterior material. In the distance between adjacent terminals of the terminal part drawn out of the exterior material, there is a position in the extracted terminal part that has a distance between adjacent terminals that is wider than the distance between adjacent terminals in the position where the external material is pulled out. The electronic component according to claim 1, wherein: The electronic component according to claim 7, wherein the terminal portion drawn out of the exterior material has a bent portion that increases a distance between adjacent terminals. A dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate;
A pair of lead terminals connected to the pair of terminal portions;
An electronic component having an exterior material covering a part of the plurality of multilayer capacitors and the lead terminals,
An electronic component characterized in that a non-conductive shielding portion is provided between adjacent lead terminals drawn out of the exterior material. The electronic component according to claim 9, wherein the shielding portion is a protruding portion of the exterior material that is a part of the exterior material and is formed between adjacent lead terminals. 10. The electronic component according to claim 9, wherein the shielding portion is a non-conductive member provided to be connected to the exterior member between adjacent terminal portions. 12. The electronic component according to claim 9, wherein the shielding portion protrudes more than a protruding amount of a lead terminal drawn out of the exterior material. The electronic component according to claim 9, wherein the shielding portion has a protruding thickness that is greater than a thickness of a lead terminal drawn out of the exterior material. 14. The electronic component according to claim 13, wherein the protruding thickness of the shielding portion is 0.2 mm or more thicker than the thickness of the terminal portion drawn out of the exterior material. In the distance between adjacent terminals of the lead terminals drawn to the outside of the exterior material, the position having an adjacent distance larger than the distance between adjacent terminals in the position drawn from the exterior material is in the entire extracted terminal part. The electronic component according to claim 9, wherein the electronic component is present. The electronic component according to claim 15, wherein the lead terminal drawn out of the exterior material is bent so that a distance between adjacent terminals is increased. A plurality of elements;
A pair of terminal portions provided in each of the plurality of elements;
An electronic component having an exterior material covering a part of the element and the terminal portion,
An electronic component, wherein a distance between adjacent terminals of the plurality of terminal portions drawn out of the exterior material is at least 0.5 mm and at most 5 mm. A dielectric substrate having an internal electrode embedded therein, a plurality of multilayer capacitors having a pair of terminal portions provided on the dielectric substrate;
A pair of lead terminals connected to the pair of terminal portions;
An electronic component having an exterior material covering a part of the plurality of multilayer capacitors and the lead terminals,
An electronic component, wherein a distance between adjacent lead terminal portions drawn out of the exterior material is at least 0.5 mm and at most 5 mm.

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