JP2005183541A - Printed wiring board prevented from adverse effect of burred edge after cutting - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed wiring board prevented from the adverse effect of cutting-caused burred edges at conductive sections without the need of manpower for removing burrs from the edges. <P>SOLUTION: The printed wiring board comprises a molded board main body 10, a plurality of plated-through holes 11, a plurality of first conductive sections 12, a plurality of nonconductive sections 13, a plurality of second conductive sections 14, and a plurality of cutting areas 15. The plated-through holes 11 are formed in the molded substrate main body 10, the first conductive sections 12 and the second conductive sections 14 are connected to the surroundings of the both sides of the plated-through holes 11, respectively, the nonconductive sections 13 run across the plated-through holes 11 and are separately distributed in the first conductive sections 12 and the second conductive sections 13, and the cutting areas 15 are stacked in the nonconductive sections 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a printed circuit board that can avoid the influence of a burr edge due to cutting, and in particular, can avoid the influence of a burr edge due to cutting that can prevent generation of a burr edge on the joint surface of the printed circuit board after cutting. The present invention relates to a printed circuit board.

  As shown in FIG. 1 and FIG. 2, a general infrared transmitting / receiving apparatus 1a (infrared data association, IRDA) molds a plurality of chips to a printed circuit board 10a at the time of production, and then cuts the printed circuit board 10a. Thus, a plurality of infrared transmission / reception devices 1a are formed, and then the infrared transmission / reception devices 1a are attached to other devices by surface adhesion technology (SMT), and used for signal transmission / reception.

  As shown in FIG. 2, when the printed circuit board 10a is manufactured, a conventional manufacturing method is used as it is, which includes a plated through hole 12a and a bonding pad 13a electrically connected to the plated through hole 12a. By forming it, it is a pre-process that forms the legs of the molding device that follows, and when cutting the printed circuit board 10a, cutting along the arrangement direction of the plated through holes 12a and cutting the plated through holes 12a At the same time, a leg is formed by cutting the bonding pad 13a, a plurality of signal transmitting / receiving chips are molded on the substrate 11a, and the substrate 11a is soldered and attached to an electric circuit substrate of another device.

  However, the conventional printed circuit board still has the defect, that is, when the bonding pads are cut, the burred edges are easily formed, and the bonding pads are formed after the electronic device is miniaturized. Many of these burrs, which can easily be shorted to the bonding pad or adversely affect the manufacturing process of the adhesive surface. The manpower and time required to remove the burred edge of the bonding pad and eliminate the plated through hole may increase manufacturing costs.

  SUMMARY OF THE INVENTION It is an object of the present invention to provide a printed circuit board that can avoid the influence of a burr edge due to cutting without having to manually clear the burr edge of a conductive part after cutting the printed circuit board. Let it be an issue.

  Another object of the present invention is to provide a printed circuit board capable of performing automated manufacturing and capable of improving the yield of the product and capable of avoiding the influence of a burr edge due to cutting.

  In order to achieve the above object, the present invention is used as a molding substrate, which includes a molding substrate body, a plurality of plated through holes, a plurality of first conductive portions, and a plurality of non-conductive portions. Conductive portions and a plurality of cutting areas are provided, wherein the plated through holes are formed in the molding substrate main body, and the first conductive portions are the molding substrate main body. Formed on the side surface, and each is in contact with a part of the periphery of the side where the plating through holes are present, and the non-conductive portions are formed so as to be recessed in the side surface where the printed circuit board is provided, and Each of them is formed so as to cross the plating through-holes and adjacent to the first conductive parts, and the cutting areas are provided in the molding substrate body. Together is the characterized by being stacked formed non conductive portion to each other, to provide a printed circuit board that avoids the influence of burrs with the edge by cutting.

  Hereinafter, preferred embodiments of a “printed circuit board capable of avoiding the influence of a burr edge due to cutting” according to the present invention will be described in detail with reference to the accompanying drawings. For example, as shown in FIGS. 3 to 5, the present invention provides a printed circuit board that can avoid the influence of a burr edge caused by a kind of cutting, and uses the printed circuit board as a molding board. A plurality of plating through holes 11, a plurality of first conductive portions 12, a plurality of non-conductive portions 13, a plurality of second conductive portions 14, and a plurality of cutting areas 15. A plurality of plated through holes 11 are formed in the molding substrate main body 10, and the first conductive portion 12 and the second conductive portion 14 are in contact with a part of the periphery on both sides of the plated through holes 11. In addition, the non-conductive portion 13 crosses the plated through holes 11 and is distributed separately into the first conductive portion 12 and the second conductive portion 13, and the cutting area 15 is located in the non-conductive portion 13. product When the molding substrate main body 10 is cut along the cutting area 15, the first conductive portion 12 is not cut, so that the first conductive portion 12 does not have a burred edge. When the molding substrate 10 is electrically connected to another device, the connection short circuit is not generated without being affected by the burred edge.

  As shown in FIGS. 3 and 4, a plurality of sets of molding substrate bodies 10 are formed on the printed circuit board, and each of the molding substrate bodies 10 is provided with a plurality of plating through holes 11 and these plating through holes. 11 are arranged in a straight line, the first conductive portion 12 and the second conductive portion 14 are conductive bonding pads, and are formed on the same side surface portion of the molding substrate body 10 and are plated. The first conductive portion 12 is in contact with the peripheral portions of both sides of the through-hole 11, and the second conductive portion 14 is located on the outer peripheral edge of the molding substrate 10. The non-conductive portion 13 is formed to be recessed in a side surface portion of the molding substrate body 10 so as to be arranged in a straight line, and traverses the plating through holes 11 respectively. The first conductive part 12 and the second conductive part 14 are distributed separately, the cutting area 15 is arranged on the molding substrate body 10 and is stacked in the non-conductive part 13, and these non-conductive parts 13 is contracted and formed in the molding substrate body 10 and forms a non-shared surface with the first conductive portion 12 or the second conductive portion 14.

  Further, as shown in FIG. 4, the tangent of the circular peripheral edge of the plating through hole 11 is parallel to the side of the first conductive portion 12, and the tangent and the side of the first conductive portion 12 are The width A is set to 0.05 to 0.2 mm, and the distance B between the side having the cutting area 15 and the side portion of the adjacent first conductive portion 12 is 0 to 0.1 mm. Is set.

  As shown in FIGS. 3 to 5, when the infrared transmitting / receiving chip (IRDA) is formed on the molding substrate body 10 of the printed circuit board, an individual molding device 20 is formed by cutting. When the molding substrate body 10 is cut along the cutting area 15, the plating through hole 11 is cut and thereby the plating through hole is cut in half with the first conductive portion 12 connected to the molding substrate body 10. 11, and the cutting area 15 is provided in the non-conductive portion 13. Therefore, when the molding substrate body 10 is cut along the cutting area 15, the first portion is formed. Cutting the conductive part 12 Therefore, no edge with cutting and burrs is formed on the side portion of the first conductive portion 12, and the molding body 20 uses the first conductive portion 12 and the half-cut plating through-holes 11 of the legs. And is attached to another device by soldering, so that there is no contact short because the leg has a burred edge and the gap is small.

  As described above, in the case of the “printed board capable of avoiding the influence of the burr edge due to cutting” according to the present invention, by cutting the molding substrate body by cutting the non-conductive portion and the cutting area, the conductive portion is cut.・ Because it is possible to avoid the generation of burred edges, it is possible to improve the yield of the product, solve the problem of checking the product with human power, and use the automated manufacturing, so that the manufacturing process of the product can be simplified. In addition, the manufacturing cost can be reduced.

  Further, what has been described above is merely an example in which the present invention can be implemented, and is not intended to limit the claimed scope of the present invention in a narrow sense, and the homology that can be implemented based on the technical gist of the present invention. Needless to say, all modifications, changes, and partial diversions that have the above effect should be delivered within the scope of the claim of the present invention.

It is a bottom view which shows the conventional printed circuit board. It is explanatory drawing which shows the condition of the board | substrate with the burr edge of the conventional infrared transmitter-receiver. It is a bottom view which shows the printed circuit board by this invention. It is explanatory drawing which shows the mode of the one part expansion of A part of FIG. 3 of this invention. It is explanatory drawing which shows the mode of the molding board | substrate which does not have an edge with a burr | flash of the infrared transmitter / receiver of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Molding board body 11 Plating through-hole 12 First conductive part 13 Nonconductive part 14 Second conductive part 15 Cutting area 20 Molding device

Claims (10)

In printed circuit boards that can avoid the influence of burr edges due to cutting used as molding boards,
Molding board body,
A plurality of plated through holes provided in the molding substrate body,
A plurality of first conductive portions formed on a side surface portion of the molding substrate main body and in contact with a part of a circular peripheral edge portion on the side where the plating through holes are located;
A plurality of non-conductive portions that are provided on a side surface portion of the molding substrate main body, cross the plating through holes, and are adjacent to the first conductive portion, and
A printed board capable of avoiding the influence of a burr edge due to cutting, comprising a plurality of cutting areas provided on the molding board body and stacked in the non-conductive portion.   The non-conductive portion is formed on the molding substrate main body and further includes a plurality of second conductive portions that are in contact with the circular peripheral portions on the other side of the plating through holes, and the non-conductive portion is the first conductive portion. 2. The printed circuit board according to claim 1, wherein the printed circuit board is divided into a conductive portion and a second conductive portion, and the influence of an edge with burr due to cutting is avoided.   The cutting according to claim 2, wherein the non-conductive portion is formed to be recessed in the molding substrate body and forms a non-shared surface with the second conductive portion or the first conductive portion. Printed circuit board that can avoid the effects of burrs.   The printed circuit board according to claim 1, wherein the second conductive portion is a conductive bonding pad.   2. The printed circuit board according to claim 1, wherein the non-conductive portions are arranged so as to be linear.   2. The printed circuit board according to claim 1, wherein the molding circuit board body is a molding circuit board body of an infrared transmission / reception chip device.   A distance from the side edge of the first conductive part that is orthogonal to the circular peripheral edge of the plating through holes and parallel to the side of the first conductive part is 0.05 to 0.2 mm. The printed circuit board according to claim 1, further comprising a tangent line, which is set as follows:   The distance between the side having the cutting area and the side part of the adjacent conductive part is set to 0 to 0.1 mm, and the influence of the burr edge due to cutting according to claim 1 can be avoided. Printed board.   The printed circuit board according to claim 1, wherein the first conductive portion is a conductive bonding pad.   2. The printed circuit board according to claim 1, wherein the plated through holes are arranged so as to be linear.

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