JP2005183529A - Component mounting substrate and module component using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting substrate which can reduce the possibility of insulation breakdown between electrodes, and to provide a module component using the same. <P>SOLUTION: The component mounting substrate includes a component mounting face whereon electrodes for mounting components are formed, a rear face opposite to the component mounting face, and a side face which is nearly perpendicular to both the component mounting face and the rear face and is formed with terminal electrodes. Of the terminal electrodes, at least one terminal electrode 6a is formed at a space 7a from a first ridge line portion 8a which connects the component mounting face 2 and the side face. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a component mounting board and a module component using the same, and more particularly to a component mounting board in which a component mounting electrode and a terminal electrode are close to each other and a module component using the same.

  As an example of a module component such as a voltage controlled oscillator (VCO) or a duplexer, for example, there is a module component shown in FIG.

  The module component shown in FIG. 1 of Patent Document 1 includes a component mounting board and an electronic component mounted thereon. In the component mounting board, a component mounting electrode is formed on a component mounting surface which is one main surface of the multilayer substrate body, and a terminal electrode is further formed from the side surface to the back surface. The terminal electrode is considered to be formed from a ridge line portion connecting the side surface and the component mounting surface.

  For example, electronic components such as inductors and capacitors are mounted on the component mounting electrodes. The terminal electrode includes a terminal electrode having a GND potential, a power supply terminal electrode connected to an external power supply, an output terminal electrode for deriving an oscillation output, and the like. Among these, the GND potential terminal electrode is joined to the leg portion of the shield cover that is mounted so as to cover the mounted electronic component, and the electromagnetic wave on the shield cover is provided on the mounting substrate through the GND potential terminal electrode. Guided to the electrodes, the entire module component functions in an electrically stable state.

In recent years, there has been an increasing demand for high-density component mounting so that more electronic components can be mounted on a component mounting board used for such module components to achieve higher functionality. For this reason, fine wiring and high-density wiring are being promoted for component mounting electrodes that are inevitably connected to electronic components.
JP 2003-258633 A

  However, if the component mounting electrodes are to be wired with high density while maintaining or reducing the size of the component mounting board, electrodes will be formed even in a small space on the component mounting surface. It will extend to the vicinity of the ridgeline between the sides. On the other hand, when the terminal electrode is formed from a ridge line portion connecting the side surface and the component mounting surface, the distance between the two electrodes approaches when the component mounting electrode reaches the vicinity of the ridge line portion. When the component mounting electrode and the terminal electrode are at the same potential, there is no problem even if they are close to each other. However, when the component mounting electrode and the terminal electrode are close to each other, there is a high possibility that a problem of dielectric breakdown between both electrodes will occur.

  Therefore, an object of the present invention is to provide a component mounting board that can solve the above-described problems and a module component using the same.

  In order to solve the above problems, the component mounting board of the present invention includes a component mounting surface on which a component mounting electrode is formed, a back surface facing the component mounting surface, and substantially perpendicular to the component mounting surface and the back surface. And at least one of the terminal electrodes is formed at a distance from a first ridge line portion connecting the component mounting surface and the side surface.

  In addition, at least one terminal that is formed at a distance from the second ridge line portion that connects the back surface and the side surface, and is connected to a connection electrode with a mounting substrate formed on the back surface via an internal electrode. It is also directed to a component mounting board having electrodes.

  Further, the present invention is also directed to a module component that includes the above-described substrate and in which an electronic component is mounted while being connected to a component mounting electrode.

  If the component mounting substrate of the present invention is used, even if the component mounting electrode is formed up to the vicinity of the ridge line portion between the component mounting surface and the side surface, there is a certain distance between the terminal electrode formed on the substrate side surface. Will be provided. As a result, the possibility of dielectric breakdown between the component mounting electrode and the terminal electrode can be reduced.

  FIG. 1 is an external perspective view of a module component including a component mounting board according to a first embodiment of the present invention. The component mounting board 1a is a laminated body in which a plurality of resin layers are stacked, and has a component mounting surface 2, a back surface 3 facing the component mounting surface 2, and side surfaces substantially perpendicular to both surfaces. Component mounting electrodes 4 are formed on the component mounting surface 2 so that other electronic components 5 can be mounted. Also, a plurality of recesses are provided on the side surface, and in each recess, a terminal electrode 9a for joining with a shield cover that covers the component mounting surface 2 and the electronic component 5 and a terminal electrode 6a for signal output are provided. Is formed. The terminal electrode 9 a has a conventional shape and is formed from the first ridge line portion 8 a connecting the component mounting surface 2 and the side surface to the back surface 3.

  On the other hand, the terminal electrode 6a has a shape that is a characteristic part of the present invention, and is formed with a first ridge line portion 8a connecting the component mounting surface 2 and the side surface with a space 7a. In the case of this embodiment, the distance 7a corresponds to the thickness of the uppermost resin layer. Although not shown in the figure, the component mounting board 1a has internal electrodes formed between the resin layers, and the internal electrodes of each layer and the terminal electrode 6a may be connected in some cases. Therefore, even if the distance 7a is provided, there is no problem in connecting the terminal electrode 6a to the internal electrode between the uppermost layer and the resin layer immediately below the terminal electrode 6a. Furthermore, when this interval 7a corresponds to a distance that does not cause dielectric breakdown between different potential conductors, the component mounting of the present invention is possible even if the component mounting electrode 4 is formed as close as possible to the vicinity of the first ridge line portion 8a. The substrate 1a and the module component 10 including the substrate 1a do not cause dielectric breakdown between the component mounting electrode 4 and the terminal electrode 6a.

  FIG. 2 is an external perspective view of the module component 10 according to the first embodiment of the present invention with a shield cover placed thereon. The four legs 12 indicated by solid lines and broken lines in the shield cover 11 are joined to the terminal electrode 9a. Although illustration is omitted, the terminal electrode 9a is formed over the back surface 3, and when the module component 10 is mounted on the mounting substrate, the terminal electrode 9a formed on the back surface 3 and the mounting substrate side The GND electrode is joined. The electromagnetic wave borne on the shield cover 11 is guided from the four legs 12 to the GND electrode provided on the mounting substrate through the terminal electrode 9a, and the entire module component functions in an electrically stable state.

  Next, each manufacturing process until the component mounting board of the present invention is manufactured will be described along a cross-sectional view showing the manufacturing process of FIG.

  First, as shown to Fig.3 (a), the copper foil 22 is affixed on the resin sheet 21. FIG. This copper foil 22 will later become a component mounting electrode.

  Next, as shown in FIG. 3B, a resist film 24 for photolithography is applied onto the copper foil 22, a photomask on which a desired electrode pattern is drawn is placed, exposed, and developed. As a result, the resist film 24 where light has passed is removed, and the copper foil 22 is exposed at the removed portion 23.

  Next, the exposed portion 25 is etched to produce a resin sheet 21 on which the component mounting electrodes 26 are drawn as shown in FIG. The remaining resist film 24 is removed with a solvent after etching.

  Next, with the resin sheet 21 produced in (c) as the uppermost layer, other resin sheets are laminated and thermoset to produce a laminated body 27 having three layers. On the other resin sheet, an electrode pattern to be an internal electrode may be formed in advance by the same method as that for the resin sheet 21.

  Further, as shown in FIG. 3D, a through hole 28 is provided at a predetermined position of the laminate 27. The through hole 28 becomes a concave side surface where a terminal electrode is formed later.

  Next, as shown in FIG. 3E, a copper electrode 29 is formed on the inner surface of the through hole 28 by plating, and a through hole 31 is formed.

  Next, as shown in FIG. 3F, the through hole 31 is filled with an etching preventing resin 32 up to the height of the second layer resin sheet. Further, a resist film 34 for photolithography is applied to the whole except for the opening of the through hole 31 and the vicinity thereof, and exposure, development, and etching are performed in the same manner as in the above (b) and (c). As a result, as shown in FIG. 3G, the copper electrode 33 and the component mounting electrode 26 in the vicinity of the opening of the through hole 31 indicated by the broken line are removed. The remaining resist film 34 is removed with a solvent after etching.

  Next, the resin 32 is removed by using a removing liquid or the like, and a laminated body 27 having a through hole 31 with a space between the component mounting electrode 26 and the copper electrode 29 as shown in FIG. Is done. The laminated body 27 is divided by an AA line passing through the center of the through hole 31 as shown in FIG. 3 (h), so that the inner surface of the through hole 31 is exposed, and the copper formed on the exposed surface is formed. A component mounting board using the electrode 29 as a terminal electrode is manufactured. The copper electrode 29 corresponds to the terminal electrode 6a in FIG.

  FIG. 4 is an external perspective view of a module component including a component mounting board according to a second embodiment of the present invention.

  Since the terminal electrode 6a provided on the component mounting board 10 shown in FIG. 1 is produced by dividing a through hole, the shape thereof is provided with a semicircular recess. On the other hand, the terminal electrode 6b provided on the component mounting substrate 20 of the present embodiment is obtained by attaching a copper foil to the side surface of the substrate, and the shape thereof is a flat shape without a dent. Although there is a difference in shape as described above, the terminal electrode 6b is formed with an interval 7a to the first ridgeline portion 8a.

  If this interval 7a corresponds to a distance that does not cause dielectric breakdown between different potential conductors, the component mounting board 1b of the present invention can be obtained even if the component mounting electrode 4 is formed as close as possible to the vicinity of the first ridgeline portion 8a. In addition, the module component 20 including the same does not cause dielectric breakdown between the component mounting electrode 4 and the terminal electrode 6b. The effect of the present invention is not impaired by the difference in the shape of the terminal electrode.

  FIG. 5 is an external perspective view of a module component including a component mounting board according to a third embodiment of the present invention. Unlike the component mounting board 1a of the first embodiment, the component mounting board 1c of this embodiment is additionally formed with a terminal electrode 6c for joining with a shield cover on both sides of the terminal electrode 6a. . The terminal electrode 6c is not only formed with a gap 7a between the component mounting surface 2 and the first ridge line portion 8a that connects the side surface, but also the second ridge line portion 8b that connects the back surface 3 and the side surface. It is also formed with a space 7b between them.

  FIG. 6 is an external perspective view of the module component 30 according to the present embodiment with a shield cover. The eight legs 14 indicated by the solid and broken lines in the shield cover 13 are joined not only to the terminal electrode 9a but also to the terminal electrode 6c which is a characteristic part of the present embodiment. Compared with the module component 10 of the first embodiment, the module component 30 of the present embodiment is formed with four more terminal electrodes that can be joined to the shield cover 13, resulting in a larger number of shield covers. It will join with a leg part and a shielding property will be improved. In producing this effect, the advantage of providing the terminal electrode 6c formed with the interval b as in this embodiment is as follows.

  The first point is that unnecessary connection and approach can be prevented between the electrode formed on the mounting substrate side and the terminal electrode 6c formed on the module component 30 side. FIG. 7 is a cross-sectional view assuming that the module component 30 of FIG. 6 is cut along the line BB, and shows a state assumed to be mounted on a mounting board. Assuming that an electrode having a distance close to the module component 30 is formed on the mounting substrate 45 like the electrode 44, if the terminal electrode 6c is formed up to the second ridge line portion or over the back surface 3, the electrode 44 is provided. As a result, there is a possibility that a problem of dielectric breakdown occurs between the terminal electrode 6c and the electrode 44. In the worst case, the connection may occur unintentionally. The present embodiment shows that it is possible to increase the number of terminal electrodes for joining to the shield cover while preventing such unnecessary connection and approach between the electrodes with the shape like the terminal electrode 6c. .

  The second point is that a terminal electrode for joining with a shield cover on the module component side can be added without increasing the GND electrode on the mounting board side. According to FIG. 7, the terminal electrode 6 c is formed on the end surfaces of the second and third layers of the resin sheet, and the terminal electrode 6 c is connected to the mounting substrate provided on the back surface 3 via the internal electrode 41. The connection electrode 42 is connected. Although not shown, the connection electrode 42 for connection with the mounting substrate is also connected to the terminal electrode 9a.

  Generally, the GND electrode provided on the mounting substrate is provided in a pair with the connection electrode of the module component to be mounted, but the terminal electrode 6c in this embodiment is not formed up to the back surface 3 of the substrate. There is no need to prepare a GND electrode to be paired with the terminal electrode 6c on the mounting substrate side. On the other hand, the module component 30 increases the joint points with the shield cover 11 without affecting the design on the mounting board side. From this, this Example shows that the terminal electrode for a connection with a shield cover can be increased by the design change of the module component 30 independent, without affecting the design by the side of a mounting board.

  In addition, since the terminal electrode 6c of the present embodiment is formed with a space 7a between the component mounting surface 2 and the first ridge line portion 8a that connects the side surfaces, the component mounting described in the first embodiment is performed. There is also an effect that dielectric breakdown does not occur between the working electrode 4 and the terminal electrode 6a.

1 is an external perspective view of a module component including a component mounting board according to a first embodiment of the present invention. FIG. 2 is an external perspective view showing a state where a shield cover is put on the module component of FIG. 1. It is sectional drawing for demonstrating each manufacturing process until the component mounting board | substrate of the module component of FIG. 1 is produced. It is an external appearance perspective view of the module component provided with the component mounting substrate which is the 2nd Example of this invention. It is an external appearance perspective view of the module component provided with the component mounting substrate which is the 3rd Example of this invention. FIG. 6 is an external perspective view in a state where a shield cover is put on the module component of FIG. 5. It is sectional drawing in the state which covered the shield cover on the module component of FIG.

Explanation of symbols

1a, 1b, 1c Component mounting board 2 Component mounting surface 3 Back surface 4 Component mounting electrode 5 Electronic component 6a, 6b, 6c Terminal electrode 7a, 7b Interval 8a First ridge line portion 8b Second ridge line portion 9a, 9b Terminal electrode 10, 20, 30 Module parts 11, 13 Shield cover 12, 14 Shield cover leg 21 Resin sheet 22 Copper foil 23 Removed part 24, 34 Resist film 25 Exposed part 26 Component mounting electrode 27 Laminate 28 Through hole 29 Copper electrode 31 Via hole 32 Resin 33 Copper electrode near the opening of the via hole 41 Internal electrode 42 Electrode for connection with the mounting substrate 43 GND electrode on the mounting substrate 44 Electrode on the mounting substrate 45 Mounting substrate

Claims (3)

In a component mounting board having a component mounting surface on which a component mounting electrode is formed, a back surface facing the component mounting surface, a side surface on which the terminal electrode is formed substantially perpendicular to the component mounting surface and the back surface,
The component mounting board, wherein at least one of the terminal electrodes is formed at a distance from a first ridge line portion connecting the component mounting surface and the side surface. The at least one terminal electrode is formed at a distance from a second ridge line portion connecting the back surface and the side surface, and is connected to a connection electrode with a mounting substrate formed on the back surface via an internal electrode. The component mounting board according to claim 1, wherein: A component mounting board according to claim 1 or 2,
A module component on which an electronic component is mounted in a state of being connected to the component mounting electrode.

Images