JP2005182717A - Cooling structure of computer - Google Patents

Cooling structure of computer Download PDF

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Publication number
JP2005182717A
JP2005182717A JP2003436653A JP2003436653A JP2005182717A JP 2005182717 A JP2005182717 A JP 2005182717A JP 2003436653 A JP2003436653 A JP 2003436653A JP 2003436653 A JP2003436653 A JP 2003436653A JP 2005182717 A JP2005182717 A JP 2005182717A
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JP
Japan
Prior art keywords
heat source
computer
blower
wind
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003436653A
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Japanese (ja)
Inventor
Osamu Iwamoto
修 岩本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON COMPUTING SYSTEM KK
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NIPPON COMPUTING SYSTEM KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by NIPPON COMPUTING SYSTEM KK filed Critical NIPPON COMPUTING SYSTEM KK
Priority to JP2003436653A priority Critical patent/JP2005182717A/en
Publication of JP2005182717A publication Critical patent/JP2005182717A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To increase cooling efficiency of a computer by providing an efficient cooling structure which gathers distributing cooling wind to a heat source, and cools the heat source. <P>SOLUTION: A wind gathering structure 3 is formed in front of the heat source 2 on the computer 1, and a blower 4 is set up at a front section of the wind gathering structure 3. The wind blown by the blower is gathered and cools the heat source efficiently by installing the wind gathering structure at a middle point of the heat source and the blower installed at a position other than the heat source. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は電子計算機の冷却に関するものである。  The present invention relates to cooling of an electronic computer.

電子計算機は熱に弱く、冷却される必要があり、冷却構造は不可欠である。従来の電子計算機の冷却装置は、配線基板上の熱源それぞれに直接的に送風機を設置し、冷却するものである。または配線基板上の熱源に対し、直接的に送風機を設置せずに、熱源以外の位置に設置された送風機の送風によって熱源を冷却するものもある。  An electronic computer is sensitive to heat and needs to be cooled, and a cooling structure is indispensable. A conventional electronic computer cooling device cools by installing a blower directly on each heat source on a wiring board. Or there is a thing which cools a heat source by ventilation of a blower installed in positions other than a heat source, without installing a blower directly to a heat source on a wiring board.

しかしながら配線基板上の熱源それぞれに直接的に送風機を取り付けず、熱源以外の位置に設置された送風機の送風によって熱源を冷却する場合、従来の装置筺体内の構造では冷却効率が充分ではない。  However, when the heat source is cooled by blowing air from a blower installed at a position other than the heat source without directly attaching the blower to each heat source on the wiring board, the cooling efficiency is not sufficient in the structure inside the conventional apparatus housing.

本発明は、分散する冷却風を熱源に集めて熱源を冷却する、効率的な冷却構造を設ける事により、上記問題を解決する。  The present invention solves the above problem by providing an efficient cooling structure that collects the cooling air to be dispersed in the heat source and cools the heat source.

本発明は、配線基板上の熱源と、熱源以外の位置に設置された送風機の中間地点に集風構造を設置することにより、送風機により吹き付けられた風を集め、効率良く熱源を冷却することができる。  The present invention collects the wind blown by the blower and efficiently cools the heat source by installing a wind collecting structure at a midpoint between the heat source on the wiring board and the blower installed at a position other than the heat source. it can.

本発明は図１に示されるように、計算機１上の熱源２の前面に、集風構造３を設け、集風構造３の前面部分に送風機４を設ける。  In the present invention, as shown in FIG. 1, a wind collecting structure 3 is provided on the front surface of the heat source 2 on the computer 1, and a blower 4 is provided on the front surface portion of the air collecting structure 3.

本発明に係わる計算機冷却構造の概観図である。It is a general-view figure of the computer cooling structure concerning this invention. 本発明に係わる計算機冷却構造の斜視図である。It is a perspective view of the computer cooling structure concerning this invention.

符号の説明Explanation of symbols

１ 計算機
２ 計算機上の熱源
３ 集風構造
４ 送風機DESCRIPTION OF SYMBOLS 1 Computer 2 Heat source on a computer 3 Wind collecting structure 4 Blower

Claims (1)

電子回路素子を搭載し装置筺体に格納された配線基板と、前記配線基板の熱源に対し冷却風を吹き付ける送風機を備えた電子計算機の冷却構造において、冷却風を集めて熱源を冷却することを特徴とする電子計算機の冷却構造。  A cooling structure for an electronic computer including a wiring board mounted with an electronic circuit element and housed in an apparatus housing, and a blower for blowing cooling air to a heat source of the wiring board. The cooling air is collected to cool the heat source. The cooling structure of the computer.
JP2003436653A 2003-12-18 2003-12-18 Cooling structure of computer Pending JP2005182717A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003436653A JP2005182717A (en) 2003-12-18 2003-12-18 Cooling structure of computer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003436653A JP2005182717A (en) 2003-12-18 2003-12-18 Cooling structure of computer

Publications (1)

Publication Number Publication Date
JP2005182717A true JP2005182717A (en) 2005-07-07

Family

ID=34791844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003436653A Pending JP2005182717A (en) 2003-12-18 2003-12-18 Cooling structure of computer

Country Status (1)

Country Link
JP (1) JP2005182717A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007160434A (en) * 2005-12-12 2007-06-28 Honda Motor Co Ltd Head of humanoid robot
WO2021132878A1 (en) * 2019-12-26 2021-07-01 삼성전자주식회사 Board heat dissipation device and circuit board having same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007160434A (en) * 2005-12-12 2007-06-28 Honda Motor Co Ltd Head of humanoid robot
WO2021132878A1 (en) * 2019-12-26 2021-07-01 삼성전자주식회사 Board heat dissipation device and circuit board having same

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