JP2005181958A5 - - Google Patents
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- Publication number
- JP2005181958A5 JP2005181958A5 JP2004096538A JP2004096538A JP2005181958A5 JP 2005181958 A5 JP2005181958 A5 JP 2005181958A5 JP 2004096538 A JP2004096538 A JP 2004096538A JP 2004096538 A JP2004096538 A JP 2004096538A JP 2005181958 A5 JP2005181958 A5 JP 2005181958A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US53214503P | 2003-12-22 | 2003-12-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005181958A JP2005181958A (ja) | 2005-07-07 |
JP2005181958A5 true JP2005181958A5 (ja) | 2007-05-24 |
Family
ID=34573056
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004096538A Withdrawn JP2005181958A (ja) | 2003-12-22 | 2004-03-29 | レーザーアブレーションを用いる電子部品および光学部品の形成方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050163415A1 (ja) |
EP (1) | EP1550888A1 (ja) |
JP (1) | JP2005181958A (ja) |
KR (1) | KR20050063687A (ja) |
CN (1) | CN1645988A (ja) |
TW (1) | TWI274198B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2331868A1 (en) * | 2008-08-22 | 2011-06-15 | 3M Innovative Properties Company | Light guides including laser-processed light extractors and methods |
JP4655157B2 (ja) * | 2009-04-17 | 2011-03-23 | 住友ベークライト株式会社 | 光導波路構造体の製造方法 |
US20100307799A1 (en) * | 2009-06-06 | 2010-12-09 | Chiang Cheng-Feng | Carrier Structure for Electronic Components and Fabrication Method of the same |
US7949211B1 (en) | 2010-02-26 | 2011-05-24 | Corning Incorporated | Modular active board subassemblies and printed wiring boards comprising the same |
CN102248288A (zh) * | 2011-06-30 | 2011-11-23 | 昆山市正业电子有限公司 | 一种fpc板插头识别定位方法 |
US8633956B2 (en) | 2011-09-01 | 2014-01-21 | Hewlett-Packard Development Company, L.P. | Patterning of coated printed media |
US9490148B2 (en) | 2012-09-27 | 2016-11-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Adhesion promoter apparatus and method |
US9377595B2 (en) * | 2013-12-11 | 2016-06-28 | Stan C. Petrov | Photoelectric conductive motherboard and modular system |
KR20180043291A (ko) * | 2015-09-15 | 2018-04-27 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 금속 부재의 용접 구조 및 용접 방법 |
US20190193208A1 (en) * | 2016-09-02 | 2019-06-27 | Cyprus University Of Technology | Femtosecond laser inscription |
CN110208906A (zh) * | 2019-05-21 | 2019-09-06 | 中国科学院上海光学精密机械研究所 | 一种基于反应离子刻蚀的薄膜微光学结构的制备方法 |
CN113296178B (zh) * | 2021-06-09 | 2022-07-19 | 中国工程物理研究院激光聚变研究中心 | 一种co2激光在熔石英表面直接制备正弦相位光栅的方法 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4915981A (en) * | 1988-08-12 | 1990-04-10 | Rogers Corporation | Method of laser drilling fluoropolymer materials |
US5169678A (en) * | 1989-12-26 | 1992-12-08 | General Electric Company | Laser ablatable polymer dielectrics and methods |
US5059763A (en) * | 1990-06-06 | 1991-10-22 | Massachusetts Institute Of Technology | Formation of optical quality surfaces in optical material |
US5125054A (en) * | 1991-07-25 | 1992-06-23 | Motorola, Inc. | Laminated polymer optical waveguide interface and method of making same |
US5368900A (en) * | 1991-11-04 | 1994-11-29 | Motorola, Inc. | Multistep laser ablation method for making optical waveguide reflector |
DE4212208A1 (de) * | 1992-04-10 | 1993-10-14 | Bosch Gmbh Robert | Verfahren zur Herstellung optischer Polymerbauelemente mit integrierter Faser-Chip-Kopplung in Abformtechnik |
IL105925A (en) * | 1992-06-22 | 1997-01-10 | Martin Marietta Corp | Ablative process for printed circuit board technology |
DE4240266A1 (de) * | 1992-12-01 | 1994-06-09 | Bosch Gmbh Robert | Verfahren zur Herstellung optischer Polymerbauelemente mit integrierten vertikalen Koppelstrukturen |
DE69418698T2 (de) * | 1994-04-14 | 1999-10-07 | Hewlett Packard Gmbh | Verfahren zur Herstellung von Leiterplatten |
US5500540A (en) * | 1994-04-15 | 1996-03-19 | Photonics Research Incorporated | Wafer scale optoelectronic package |
JPH10123357A (ja) * | 1996-10-24 | 1998-05-15 | Nippon Sheet Glass Co Ltd | 光導波路に対するレーザ加工方法 |
US5895263A (en) * | 1996-12-19 | 1999-04-20 | International Business Machines Corporation | Process for manufacture of integrated circuit device |
JP3133039B2 (ja) * | 1998-10-05 | 2001-02-05 | 日本電信電話株式会社 | 光導波路用感光性組成物およびその製造方法および高分子光導波路パターン形成方法 |
US6611635B1 (en) * | 1998-10-09 | 2003-08-26 | Fujitsu Limited | Opto-electronic substrates with electrical and optical interconnections and methods for making |
US6177143B1 (en) * | 1999-01-06 | 2001-01-23 | Allied Signal Inc | Electron beam treatment of siloxane resins |
US6313434B1 (en) * | 1999-05-27 | 2001-11-06 | International Business Machines Corporation | Method for creation of inclined microstructures using a scanned laser image |
TWI239798B (en) * | 1999-05-28 | 2005-09-11 | Toppan Printing Co Ltd | Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate |
JP4401540B2 (ja) * | 2000-06-30 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザー装置及びこれを用いた光信号増幅装置 |
AU2001279056A1 (en) * | 2000-07-28 | 2002-02-13 | Goodrich Corporation | Optical waveguides and methods for making the same |
TWI226103B (en) * | 2000-08-31 | 2005-01-01 | Georgia Tech Res Inst | Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same |
KR100841597B1 (ko) * | 2000-09-13 | 2008-06-26 | 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 | 전자 디바이스 제조 |
CA2433873C (en) * | 2000-12-28 | 2010-04-13 | Keio University | Optical signal processing circuit and method for producing same |
US6671950B2 (en) * | 2001-03-08 | 2004-01-06 | Ppg Industries Ohio, Inc. | Multi-layer circuit assembly and process for preparing the same |
US6731857B2 (en) * | 2001-03-29 | 2004-05-04 | Shipley Company, L.L.C. | Photodefinable composition, method of manufacturing an optical waveguide with the photodefinable composition, and optical waveguide formed therefrom |
US7011932B2 (en) * | 2001-05-01 | 2006-03-14 | E. I. Du Pont De Nemours And Company | Polymer waveguide fabrication process |
JP2003131001A (ja) * | 2001-05-25 | 2003-05-08 | Shipley Co Llc | 多孔性光学物質 |
US6661642B2 (en) * | 2001-11-26 | 2003-12-09 | Shipley Company, L.L.C. | Dielectric structure |
US6856745B2 (en) * | 2002-07-02 | 2005-02-15 | Lucent Technologies Inc. | Waveguide and applications therefor |
US6842577B2 (en) * | 2002-12-02 | 2005-01-11 | Shipley Company L.L.C. | Photoimageable waveguide composition and waveguide formed therefrom |
EP1434068A3 (en) * | 2002-12-02 | 2004-07-28 | Shipley Company, L.L.C. | Methods of forming waveguides that are rounded in cross section and waveguides formed therefrom |
-
2004
- 2004-03-29 JP JP2004096538A patent/JP2005181958A/ja not_active Withdrawn
- 2004-12-15 TW TW093138884A patent/TWI274198B/zh not_active IP Right Cessation
- 2004-12-17 KR KR1020040107485A patent/KR20050063687A/ko not_active Application Discontinuation
- 2004-12-18 EP EP04257942A patent/EP1550888A1/en not_active Withdrawn
- 2004-12-21 CN CNA2004100821387A patent/CN1645988A/zh active Pending
- 2004-12-22 US US11/020,521 patent/US20050163415A1/en not_active Abandoned
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