JP2005179528A - Improved thermoplastic resin composition - Google Patents
Improved thermoplastic resin composition Download PDFInfo
- Publication number
- JP2005179528A JP2005179528A JP2003423182A JP2003423182A JP2005179528A JP 2005179528 A JP2005179528 A JP 2005179528A JP 2003423182 A JP2003423182 A JP 2003423182A JP 2003423182 A JP2003423182 A JP 2003423182A JP 2005179528 A JP2005179528 A JP 2005179528A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin composition
- resin
- polyamide
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 34
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 34
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 21
- 239000000178 monomer Substances 0.000 claims abstract description 18
- 229920001577 copolymer Polymers 0.000 claims abstract description 16
- 125000000524 functional group Chemical group 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims description 28
- 229920005672 polyolefin resin Polymers 0.000 claims description 13
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 4
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 claims 1
- 230000004888 barrier function Effects 0.000 abstract description 26
- 239000000203 mixture Substances 0.000 abstract description 24
- 229920005989 resin Polymers 0.000 abstract description 23
- 239000011347 resin Substances 0.000 abstract description 23
- 238000000465 moulding Methods 0.000 abstract description 16
- 239000007788 liquid Substances 0.000 abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 150000001336 alkenes Chemical class 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 23
- 238000004898 kneading Methods 0.000 description 19
- 239000007789 gas Substances 0.000 description 18
- -1 ethylene hydrocarbons Chemical class 0.000 description 15
- 239000000126 substance Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 9
- 229920013716 polyethylene resin Polymers 0.000 description 8
- 229920002302 Nylon 6,6 Polymers 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 229920002647 polyamide Polymers 0.000 description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004952 Polyamide Substances 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 4
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000000635 electron micrograph Methods 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000005003 food packaging material Substances 0.000 description 3
- 239000003502 gasoline Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 229920010126 Linear Low Density Polyethylene (LLDPE) Polymers 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- 229920000572 Nylon 6/12 Polymers 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001413 amino acids Chemical class 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- 229910052586 apatite Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000071 blow moulding Methods 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229920006038 crystalline resin Polymers 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910001872 inorganic gas Inorganic materials 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- VSIIXMUUUJUKCM-UHFFFAOYSA-D pentacalcium;fluoride;triphosphate Chemical compound [F-].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O VSIIXMUUUJUKCM-UHFFFAOYSA-D 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LSWYGACWGAICNM-UHFFFAOYSA-N 2-(prop-2-enoxymethyl)oxirane Chemical compound C=CCOCC1CO1 LSWYGACWGAICNM-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- CVEPFOUZABPRMK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;styrene Chemical compound CC(=C)C(O)=O.C=CC1=CC=CC=C1 CVEPFOUZABPRMK-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- MBRGOFWKNLPACT-UHFFFAOYSA-N 5-methylnonane-1,9-diamine Chemical compound NCCCCC(C)CCCCN MBRGOFWKNLPACT-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
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- 239000004925 Acrylic resin Substances 0.000 description 1
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- 101100102504 Caenorhabditis elegans ver-4 gene Proteins 0.000 description 1
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- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
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- 229920003189 Nylon 4,6 Polymers 0.000 description 1
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- 239000000539 dimer Substances 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
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- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
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Abstract
Description
本発明は気体/液体バリア性、成形性、耐熱性、水蒸気バリア性、耐衝撃性に優れた熱可塑性樹脂組成物に関する。特に、ポリアミド樹脂、オレフィン系樹脂、及び特定の相容化剤を所定の比率で配合することにより得られる改良された熱可塑性樹脂組成物、及びそれから得られる成形体、シート、フィルムに関する。 The present invention relates to a thermoplastic resin composition having excellent gas / liquid barrier properties, moldability, heat resistance, water vapor barrier properties, and impact resistance. In particular, the present invention relates to an improved thermoplastic resin composition obtained by blending a polyamide resin, an olefin resin, and a specific compatibilizer in a predetermined ratio, and a molded article, a sheet, and a film obtained therefrom.
ポリアミド樹脂は、耐薬品性に優れ且つ酸素バリア性に優れるため食品包装材、食品容器等の分野に使用されている。また、ガソリンやオイル等の耐薬品性、バリア性に優れる為、自動車部品等の分野にも広く使用されている。
しかし、ポリアミド樹脂は、成形温度での溶融張力が小さく、フィルム、シート、ブローといった成形が難しいという欠点を有している。
このためポリアミド樹脂の特徴を維持し、成形性を改良する目的でポリオレフィン系樹脂とのアロイ化が検討されている。
ポリアミド樹脂とポリオレフィン系樹脂とのアロイの場合、ポリアミド樹脂の特徴、例えば気体/液体バリア性の機能を最大限発揮するためには、ポリアミド樹脂を連続相(海)、ポリオレフィン系樹脂を分散相(島)とすることが最も好ましい。
Polyamide resins are used in the fields of food packaging materials, food containers and the like because of their excellent chemical resistance and oxygen barrier properties. In addition, since it has excellent chemical resistance and barrier properties such as gasoline and oil, it is widely used in the field of automobile parts.
However, the polyamide resin has a drawback that it has a low melt tension at the molding temperature and is difficult to mold such as a film, a sheet, and a blow.
For this reason, alloying with a polyolefin resin has been studied for the purpose of maintaining the characteristics of the polyamide resin and improving moldability.
In the case of an alloy of a polyamide resin and a polyolefin resin, in order to maximize the characteristics of the polyamide resin, for example, the gas / liquid barrier function, the polyamide resin is a continuous phase (sea) and the polyolefin resin is a dispersed phase ( Island) is most preferable.
このような相構造を持つポリアミド樹脂とポリオレフィン系樹脂とのアロイについては、既に知られている(特許文献1、2、3、4参照)。
しかしながら、特許文献1は、単にポリアミド樹脂とポリオレフィン樹脂を特定の溶融粘度条件下で混練したものであるため、機械物性面で充分ではなかった。また、特許文献2では、特定溶融粘度のポリアミド樹脂とジカルボン酸変性ポリオレフィンからなる組成物であるため、熱安定性に劣るという問題点および組成物構成成分の全てが吸湿性の物であり、吸湿により気体/液体バリア性が悪くなるという問題点があった。
また、特許文献3、4では多量のポリアミド系樹脂が連続相であるためフィルム、シート、ブロー等の成形が難しく、且つポリアミド組成比が高いためコスト高になるといった問題点があった。
An alloy of a polyamide resin having such a phase structure and a polyolefin resin is already known (see Patent Documents 1, 2, 3, and 4).
However, since Patent Document 1 is simply a kneaded polyamide resin and polyolefin resin under specific melt viscosity conditions, the mechanical properties are not sufficient. Further, in Patent Document 2, since it is a composition comprising a polyamide resin having a specific melt viscosity and a dicarboxylic acid-modified polyolefin, all of the problems of poor thermal stability and the composition components are hygroscopic. Therefore, there is a problem that the gas / liquid barrier property is deteriorated.
Further, Patent Documents 3 and 4 have a problem in that since a large amount of polyamide-based resin is a continuous phase, it is difficult to form films, sheets, blows, and the like, and the polyamide composition ratio is high, resulting in high costs.
本発明の目的は、気体/液体バリア性、成形性、耐熱性、水蒸気バリア性、耐衝撃性に優れた熱可塑性樹脂組成物、及びそれから得られる成形体、シート、フィルムを提供することである。 An object of the present invention is to provide a thermoplastic resin composition excellent in gas / liquid barrier property, moldability, heat resistance, water vapor barrier property, and impact resistance, and a molded article, sheet and film obtained therefrom. .
本発明者は、この目的を達成すべく鋭意検討した結果、ポリアミド樹脂、オレフィン系樹脂、及び特定の相容化剤を所定の比率で配合することにより得られる熱可塑性樹脂組成物が、気体/液体バリア性、成形性、耐熱性、水蒸気バリア性に優れ、且つ高い衝撃強度を有することを見出し、本発明を完成するに至った。 As a result of intensive studies to achieve this object, the present inventors have found that a thermoplastic resin composition obtained by blending a polyamide resin, an olefinic resin, and a specific compatibilizer in a predetermined ratio is a gas / It has been found that it has excellent liquid barrier properties, moldability, heat resistance, water vapor barrier properties and high impact strength, and has completed the present invention.
すなわち本発明は、(1)(A)オレフィン−官能基含有単量体共重合体0.1〜20重量%、(B)ポリアミド樹脂1〜50重量%、および(C)オレフィン系樹脂、30〜98重量%からなり、(B)が連続相、(C)が分散相であることを特徴とする熱可塑性樹脂組成物、(2)(A)、(B)、(C)の比率が、各々1〜10重量%、10〜40重量%、及び50〜85重量%である前記(1)の熱可塑性樹脂組成物、(3)(A)の官能基含有単量体が、α,β−不飽和カルボン酸及び/またはその誘導体であることを特徴とする前記(1)または(2)のいずれかの熱可塑性樹脂組成物、(4)(A)の官能基含有単量体が、α,β−不飽和ジカルボン酸無水物であることを特徴とする前記(1)〜(3)のいずれかの熱可塑性樹脂組成物、(5)(A)が、エチレン−(メタ)アクリル酸エステル−無水マレイン酸共重合体である前記(1)〜(4)のいずれかの熱可塑性樹脂組成物、(6)(C)の平均円換算粒子径が10μm以下である前記(1)〜(5)のいずれかの熱可塑性樹脂組成物、(7)前記(1)〜(6)のいずれか1項に記載の熱可塑性樹脂組成物から得られる成形体、(8)前記(1)〜(6)のいずれか1項に記載の熱可塑性樹脂組成物から得られるシート、(9)前記(1)〜(6)のいずれか1項に記載の熱可塑性樹脂組成物から得られるフィルムである。 That is, the present invention provides (1) (A) an olefin-functional group-containing monomer copolymer of 0.1 to 20% by weight, (B) a polyamide resin of 1 to 50% by weight, and (C) an olefinic resin, 30 A thermoplastic resin composition characterized by comprising ~ 98% by weight, wherein (B) is a continuous phase and (C) is a dispersed phase, and the ratio of (2) (A), (B), (C) is 1 to 10% by weight, 10 to 40% by weight, and 50 to 85% by weight of the thermoplastic resin composition of (1), and (3) the functional group-containing monomer of (A) is α, The thermoplastic resin composition according to (1) or (2) above, which is a β-unsaturated carboxylic acid and / or a derivative thereof, (4) a functional group-containing monomer of (A) The thermoplastic tree according to any one of (1) to (3) above, which is an α, β-unsaturated dicarboxylic acid anhydride The composition, (5) The thermoplastic resin composition according to any one of (1) to (4), wherein (A) is an ethylene- (meth) acrylic acid ester-maleic anhydride copolymer, (6) ( The average circle-converted particle size of C) is 10 μm or less, the thermoplastic resin composition according to any one of (1) to (5), and (7) any one of (1) to (6). Molded product obtained from thermoplastic resin composition, (8) Sheet obtained from thermoplastic resin composition according to any one of (1) to (6), (9) Said (1) to (6 The film obtained from the thermoplastic resin composition according to any one of the above.
本発明の熱可塑性組成物は、ポリアミド樹脂、オレフィン系樹脂、及び特定の相容化剤を所定の比率で配合することにより、気体/液体バリア性、成形性、耐熱性、水蒸気バリア性、耐衝撃性に優れる。 The thermoplastic composition of the present invention contains a polyamide resin, an olefin resin, and a specific compatibilizer in a predetermined ratio, thereby allowing gas / liquid barrier properties, moldability, heat resistance, water vapor barrier properties, Excellent impact.
本発明の組成物における(A)オレフィン−官能基含有単量体共重合体を構成するオレフィン成分としては、エチレン、プロピレン等の炭素数2以上のエチレン系炭化水素の一種以上が挙げられる。この好ましい例としては、エチレン、プロピレンが挙げられる。官能基含有単量体成分としては、(メタ)アクリル酸、イタコン酸、マレイン酸、フマル酸、桂皮酸等の不飽和カルボン酸、無水マレイン酸、無水イタコン酸等の不飽和カルボン酸無水物、グリシジル(メタ)アクリレート、グリシジルアリルエーテル等のエポキシ基含有不飽和単量体が挙げられる。好ましくは、(メタ)アクリル酸、無水マレイン酸、グリシジル(メタ)アクリレートである。これら官能基含有単量体は、単独、あるいは2種類以上を用いても構わない。 Examples of the olefin component constituting the (A) olefin-functional group-containing monomer copolymer in the composition of the present invention include one or more ethylene hydrocarbons having 2 or more carbon atoms such as ethylene and propylene. Preferred examples of this include ethylene and propylene. As the functional group-containing monomer component, unsaturated carboxylic acid such as (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid and cinnamic acid, unsaturated carboxylic acid anhydride such as maleic anhydride and itaconic anhydride, Examples include epoxy group-containing unsaturated monomers such as glycidyl (meth) acrylate and glycidyl allyl ether. Preferred are (meth) acrylic acid, maleic anhydride, and glycidyl (meth) acrylate. These functional group-containing monomers may be used alone or in combination of two or more.
これらオレフィン成分、及び官能基含有単量体成分の他に、共重合可能な単量体成分を構成成分として含有しても構わない。このような共重合可能な単量体成分としては、スチレン等のビニル芳香族化合物、メチル(メタ)アクリレート等の不飽和カルボン酸エステル、(メタ)アクリロニトリル等の不飽和ニトリル化合物等が挙げられる。
このようなオレフィン−官能基含有単量体共重合体としては、例えばエチレン−(メタ)アクリル酸共重合体、エチレン−(メタ)アクリル酸−(メタ)アクリル酸エステル共重合体、エチレン−無水マレイン酸−(メタ)アクリル酸(エステル)共重合体などが挙げられ、エチレン−無水マレイン酸−(メタ)アクリル酸エステル共重合体が成形性、物性の面から好ましい。これらは単独、或いは2種類以上を混合して用いても構わない。
In addition to the olefin component and the functional group-containing monomer component, a copolymerizable monomer component may be contained as a constituent component. Examples of such copolymerizable monomer components include vinyl aromatic compounds such as styrene, unsaturated carboxylic acid esters such as methyl (meth) acrylate, and unsaturated nitrile compounds such as (meth) acrylonitrile.
Examples of such olefin-functional group-containing monomer copolymers include ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid- (meth) acrylic acid ester copolymers, and ethylene-anhydrous. Examples thereof include maleic acid- (meth) acrylic acid (ester) copolymers, and ethylene-maleic anhydride- (meth) acrylic acid ester copolymers are preferable from the viewpoints of moldability and physical properties. These may be used alone or in combination of two or more.
(A)オレフィン−官能基含有単量体共重合体の替わりに、グラフト変性タイプのポリオレフィン等、例えばポリオレフィンやSEBS等に無水マレイン酸等を付加させたものを使用すると、樹脂の熱変色性に劣ったり、成形時のガス発生による外観トラブルが発生する場合がある。
本発明の組成物中の(A)の割合は、0.1〜20重量%、好ましくは1〜10重量%である。(A)の割合がこの範囲にあることが、耐衝撃性、成形加工性、バリア性の点で好ましい。
(A) In place of the olefin-functional group-containing monomer copolymer, if a graft-modified polyolefin or the like, for example, a product obtained by adding maleic anhydride or the like to polyolefin or SEBS is used, the thermochromic property of the resin is improved. It may be inferior or appearance troubles may occur due to gas generation during molding.
The proportion of (A) in the composition of the present invention is 0.1 to 20% by weight, preferably 1 to 10% by weight. It is preferable that the ratio of (A) is in this range in terms of impact resistance, molding processability, and barrier properties.
本発明の組成物における(B)ポリアミド樹脂とは、アミノ酸、ラクタム、あるいはジアミンとジカルボン酸を主たる構成成分とするポリアミド系樹脂である。構成成分の具体例を挙げると、ε−カプロラクタム、エナントラクタム、ω−アミノカプロン酸、11−アミノウンデカン酸、12−アミノドデカン酸などのアミノ酸、テトラメチレンジアミン、ヘキサメチレンジアミン、ウンデカメチレンジアミン、ドデカメチレンジアミン、2,2,4−トリメチルヘキサメチレンジアミン、2,4,4−トリメチルヘキサメチレンジアミン、5−メチルノナメチレンジアミン、m−キシリレンジアミン、p−キシリレンジアミン、1,3−ビスアミノメチルシクロヘキサン、1,4−ビスアミノメチルシクロヘキサン、ビス−p−アミノシクロヘキシルメタン、ビス−p−アミノシクロヘキシルプロパン、イソホロンジアミン、メタキシリレンジアミンなどのジアミン、アジピン酸、スベリン酸、アゼライン酸、セバシン酸、ドデカン二酸、1,4−シクロヘキサンジカルボン酸、1,3−シクロヘキサンジカルボン酸、テレフタル酸、イソフタル酸、ナフタレンジカルボン酸、ダイマー酸などのジカルボン酸がある。これらの構成成分は、単独あるいは二種以上の混合物の形で重合に供され、そうして得られるポリアミドホモポリマー、コポリマーいずれも本発明で用いることが出来る。 The (B) polyamide resin in the composition of the present invention is a polyamide-based resin mainly composed of amino acids, lactams, or diamines and dicarboxylic acids. Specific examples of the constituents include ε-caprolactam, enantolactam, ω-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and other amino acids, tetramethylenediamine, hexamethylenediamine, undecamethylenediamine, dodeca Methylenediamine, 2,2,4-trimethylhexamethylenediamine, 2,4,4-trimethylhexamethylenediamine, 5-methylnonamethylenediamine, m-xylylenediamine, p-xylylenediamine, 1,3-bisamino Diamines such as methylcyclohexane, 1,4-bisaminomethylcyclohexane, bis-p-aminocyclohexylmethane, bis-p-aminocyclohexylpropane, isophoronediamine, metaxylylenediamine, adipic acid, suberic acid, azela There are dicarboxylic acids such as inic acid, sebacic acid, dodecanedioic acid, 1,4-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, and dimer acid. These constituent components are used for polymerization alone or in the form of a mixture of two or more, and any of the polyamide homopolymers and copolymers thus obtained can be used in the present invention.
例えば、ジアミンとジカルボン酸との重縮合で得られるポリアミド66、ポリアミド610、ポリアミド612、ポリアミド46、ポリアミドMXD(メタキシリレンジアミン)6等があり、また、ラクタムの開環重合で得られるポリアミド6、ポリアミド12等が挙げられる。またポリアミド共重合物として、ポリアミド66/6、ポリアミド66/610、ポリアミド66/612、ポリアミド66/6T(Tはテレフタル酸成分)、ポリアミド66/6I(Iはイソフタル酸成分)、ポリアミド6T/6I等が挙げられる。またこれらのポリアミド樹脂のブレンド物も挙げられる。好ましいものはポリアミド6、ポリアミド66、ポリアミドMXD6である。これらのポリアミド樹脂の製造方法は、一般に公知に行われている方法で良い。(B)のポリアミド樹脂は2種以上を併用しても構わない。 For example, there are polyamide 66, polyamide 610, polyamide 612, polyamide 46, polyamide MXD (metaxylylenediamine) 6 obtained by polycondensation of diamine and dicarboxylic acid, and polyamide 6 obtained by ring-opening polymerization of lactam. , Polyamide 12 and the like. As polyamide copolymers, polyamide 66/6, polyamide 66/610, polyamide 66/612, polyamide 66 / 6T (T is terephthalic acid component), polyamide 66 / 6I (I is isophthalic acid component), polyamide 6T / 6I Etc. Moreover, the blended material of these polyamide resins is also mentioned. Preferred are polyamide 6, polyamide 66, and polyamide MXD6. These polyamide resins can be produced by a generally known method. Two or more types of polyamide resin (B) may be used in combination.
本発明の組成物中の(B)の割合は、1〜50重量%、好ましくは10〜40重量%である。(B)の割合がこの範囲にあることが、耐熱性、耐衝撃性、成形加工性、バリア性の点で好ましい。
本発明の組成物における(C)オレフィン系樹脂としては、大きく分けてポリエチレン系樹脂、ポリプロピレン系樹脂あるいはポリエチレン系樹脂とポリプロピレン系樹脂の混合物が挙げられる。
ポリエチレン系樹脂としては、高密度ポリエチレン(HDPE)、低密度ポリエチレン(LDPE)、直鎖状低密度ポリエチレン(LLDPE)、(メタ)アクリル酸エステルとエチレンとの共重合体(EEA、EMMA等)あるいは酢酸ビニルモノマーとエチレンとの共重合体(EVA)等を挙げることができる。しかしながら、これらの中でも高密度ポリエチレン(HDPE)、低密度ポリエチレン(LDPE)及び直鎖状低密度ポリエチレン(LLDPE)が、安価に入手できる為、特に好ましい。これらのポリエチレン系樹脂は、単独で用いても良いし、又、2種以上を組み合わせて用いても良い。
The proportion of (B) in the composition of the present invention is 1 to 50% by weight, preferably 10 to 40% by weight. It is preferable that the ratio of (B) is in this range in terms of heat resistance, impact resistance, molding processability, and barrier properties.
The (C) olefin resin in the composition of the present invention can be broadly classified into a polyethylene resin, a polypropylene resin, or a mixture of a polyethylene resin and a polypropylene resin.
Examples of the polyethylene resin include high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene (LLDPE), a copolymer of (meth) acrylic acid ester and ethylene (EEA, EMMA, etc.) or Examples thereof include a copolymer (EVA) of vinyl acetate monomer and ethylene. However, among these, high-density polyethylene (HDPE), low-density polyethylene (LDPE), and linear low-density polyethylene (LLDPE) are particularly preferable because they are available at low cost. These polyethylene resins may be used alone or in combination of two or more.
オレフィン系樹脂にポリエチレン系樹脂を用いる場合、密度0.89g/cm3以上0.95g/cm3以下であることが透明性の観点で望ましく、密度0.90g/cm3以上0.94g/cm3以下であることが更に望ましく、密度0.91g/cm3以上0.94g/cm3以下であることがとりわけ望ましい。単独でも2種以上を組み合わせた場合でも密度がこの範囲に入れば透明性が好ましくなる。
密度0.94〜0.97g/cm3のポリエチレンは、剛性、耐薬品性、バリア性の観点から、好ましく、その中でも密度が高いほど剛性、耐薬品性、バリア性の観点から更に好ましい。
When a polyethylene resin is used as the olefin resin, the density is preferably 0.89 g / cm 3 or more and 0.95 g / cm 3 or less from the viewpoint of transparency, and the density is 0.90 g / cm 3 or more and 0.94 g / cm 3. more desirably 3 or less, it is particularly desirable density 0.91 g / cm 3 or more 0.94 g / cm 3 or less. Even when alone or in combination of two or more, transparency is preferable if the density falls within this range.
Polyethylene having a density of 0.94 to 0.97 g / cm 3 is preferable from the viewpoint of rigidity, chemical resistance, and barrier properties, and among them, the higher the density, the more preferable from the viewpoint of rigidity, chemical resistance, and barrier properties.
ポリプロピレン系樹脂を用いると、本願発明において得られる熱可塑性樹脂組成物及びその成形体は、流動性等の成型加工性、剛性等の機械的性質、ヒンジ特性、振動特性に優れ、剛性に優れる。
ポリプロピレン系樹脂としては、ホモのポリプロピレン、プロピレンとエチレン、ブテン−1、ペンテン−1、ヘキセン−1等の他のα−オレフィンとの共重合樹脂(ブロック、ランダムを含む)等を挙げることができる。
本発明で使用する(C)オレフィン系樹脂には、上述の如くポリエチレン系樹脂および/またはポリプロピレン系樹脂があるが、ポリエチレン系樹脂がポリプロピレン系樹脂と比較して低温衝撃特性、耐候性が高く好ましい。
When a polypropylene resin is used, the thermoplastic resin composition and the molded product obtained in the present invention are excellent in molding processability such as fluidity, mechanical properties such as rigidity, hinge characteristics and vibration characteristics, and excellent in rigidity.
Examples of the polypropylene-based resin include homopolypropylene, copolymer resins of propylene and other α-olefins such as ethylene, butene-1, pentene-1, and hexene-1 (including blocks and random). .
The (C) olefin resin used in the present invention includes a polyethylene resin and / or a polypropylene resin as described above, and the polyethylene resin is preferable because it has a low-temperature impact property and weather resistance as compared with the polypropylene resin. .
本発明の組成物中の(C)の割合は、30〜98重量%、好ましくは40〜94重量%、更に好ましくは50〜85重量%である。(C)の割合がこの範囲にあることが、耐熱性、耐衝撃性、成形加工性、バリア性の点で好ましい。
本発明の組成物においては(B)が連続相を形成しなければならない。(B)が連続相でなければ、目標とする耐熱性、気体/液体バリア性が発現されない。
「(B)が連続相」の連続相とは、例えば2相の樹脂相分離構造を有する場合、他の相に完全に覆われていない相のことを言う。
本発明の組成物に関して言えば、(B)よりなる相の内、(A)、(C)(および他の重合体)よりなる相に完全に覆われていない相が、(B)よりなる連続相である。(B)よりなる連続相の形成は、これらの電子顕微鏡写真(例えば、TEM)等による観察により判断することができる。
The proportion of (C) in the composition of the present invention is 30 to 98% by weight, preferably 40 to 94% by weight, more preferably 50 to 85% by weight. It is preferable that the ratio of (C) is in this range in terms of heat resistance, impact resistance, molding processability, and barrier properties.
In the composition of the present invention, (B) must form a continuous phase. If (B) is not a continuous phase, the target heat resistance and gas / liquid barrier properties will not be exhibited.
The continuous phase of “(B) is a continuous phase” refers to a phase that is not completely covered with other phases, for example, when it has a two-phase resin phase separation structure.
As for the composition of the present invention, among the phase consisting of (B), the phase not completely covered with the phase consisting of (A), (C) (and other polymers) consists of (B). It is a continuous phase. Formation of the continuous phase comprising (B) can be determined by observation with these electron micrographs (for example, TEM).
また、本発明においては、(B)が連続相であり、連続相の平均厚みが2μm以下であることが好ましく、さらに好ましくは1μm以下であり、とりわけ好ましくは0.6μm以下である。連続相の平均厚みがこの範囲にあることが、成形性の点で好ましい。
本発明においては、(C)が分散相であり、分散相の平均円換算粒径が10μm以下が好ましく、更に好ましくは7μmである。(C)よりなる分散相の平均円換算粒径がこの範囲にあることが、耐衝撃性の点で好ましい。
「(C)が分散相」の分散相とは、例えば2相の樹脂相分離構造を有する場合、他の相に完全に覆われている相のことをいう。
In the present invention, (B) is a continuous phase, and the average thickness of the continuous phase is preferably 2 μm or less, more preferably 1 μm or less, and particularly preferably 0.6 μm or less. It is preferable in terms of moldability that the average thickness of the continuous phase is within this range.
In the present invention, (C) is a dispersed phase, and the average circular equivalent particle size of the dispersed phase is preferably 10 μm or less, more preferably 7 μm. It is preferable in terms of impact resistance that the average circular equivalent particle size of the dispersed phase made of (C) is in this range.
The dispersed phase of “(C) is a dispersed phase” refers to a phase that is completely covered with other phases when having a two-phase resin phase separation structure, for example.
本発明の組成物に関して言えば(C)よりなる相の内、(A)、(B)(および他の重合体)よりなる相に完全に覆われている相が(C)よりなる分散相である。
(C)よりなる分散相の形成は、これらの電子顕微鏡写真(例えば、TEM)等による観察により判断することができる。
「(C)の平均円換算粒径」の円換算粒径とは、電子顕微鏡写真(例えば、TEM等)の、ポリマーブレンド組成物内の分散構造確認手段によって分散相の2次元的情報のひとつである面積を求め、それと等しい面積を有する円の直径を算出し、それを分散相の円換算粒径とする。
分散相の平均円換算粒径は、上記の方法で求めた円換算粒径より下式により求める。
平均円換算粒径=(Σdi4*ni)/(Σdi3*ni)
di:i番目の分散相の円換算粒径
ni:i番目の分散相の個数
With regard to the composition of the present invention, among the phases consisting of (C), the phase completely covered with the phases consisting of (A), (B) (and other polymers) is the dispersed phase consisting of (C) It is.
The formation of the dispersed phase comprising (C) can be determined by observation with these electron micrographs (for example, TEM).
The circle-converted particle size of “(C) average circle-converted particle size” is one of the two-dimensional information of the dispersed phase obtained by the dispersion structure confirmation means in the polymer blend composition in an electron micrograph (for example, TEM). Is obtained, the diameter of a circle having the same area is calculated, and this is used as the circle equivalent particle diameter of the dispersed phase.
The average circle-equivalent particle size of the dispersed phase is determined by the following formula from the circle-equivalent particle size obtained by the above method.
Average circle equivalent particle size = (Σdi 4 * ni) / (Σdi 3 * ni)
di: Circle equivalent particle diameter of i-th dispersed phase ni: Number of i-th dispersed phase
本発明において、(C)よりなる分散相の平均円換算粒径を10μm以下に制御する方法は、特に限定はしないが以下の方法の単独、あるいは2つ以上の併用が可能である。
(1)(B)と(C)の粘度比を制御する方法
JISK7210に準拠し、(B)の融点以上の温度で、2.16Kg荷重で測定した(B)のメルトフローレート値(MFRB)と(C)のメルトフローレート値(MFRC)の比(MFRB/MFRC)が4000以下であることが好ましい。4000を越えるとMFR値の差が大きくなりすぎ、分散相粒径を10μm以下にすることが困難になる。
In the present invention, the method for controlling the average circular equivalent particle size of the dispersed phase comprising (C) to 10 μm or less is not particularly limited, but the following methods can be used alone or in combination of two or more.
(1) Method of controlling viscosity ratio of (B) and (C) Melt flow rate value (MFRB) of (B) measured according to JISK7210 at a temperature equal to or higher than the melting point of (B) and a load of 2.16 kg. The ratio (MFRB / MFRC) of the melt flow rate value (MFRC) of (C) and (C) is preferably 4000 or less. If it exceeds 4000, the difference in MFR value becomes too large, and it becomes difficult to make the dispersed phase particle size 10 μm or less.
(2)(A)の導入量を制御する方法
(A)の添加量を増やすことで、分散相の粒径は小さくなる傾向にある。ただし、(A)の組成によって(A)の導入量と分散相の粒径の関係は異なる。
(3)混練方法を制御する方法
樹脂を溶融混練する装置として、通常、単軸、同方向2軸、異方向2軸押出機等が使用される。同タイプの押出機、例えば同方向2軸押出機にて混練する場合、混練スクリューの全長(L)とスクリュー径(D)の比(L/D)が大きいほど混練が強くなり、分散相の粒径を小さくできる。
(2) Method of controlling the introduction amount of (A) By increasing the addition amount of (A), the particle size of the dispersed phase tends to be small. However, the relationship between the amount of (A) introduced and the particle size of the dispersed phase differs depending on the composition of (A).
(3) Method of controlling the kneading method As a device for melt-kneading the resin, a single-screw, two-direction twin-screw extruder, two-direction double-screw extruder or the like is usually used. When kneading in the same type of extruder, for example, the same direction twin screw extruder, the kneading becomes stronger as the ratio (L / D) of the total length (L) of the kneading screw to the screw diameter (D) becomes larger. The particle size can be reduced.
また、同方向2軸押出機では通常2カ所の混練ゾーンを設けるが、混練ゾーンの数を多くする、その中のニーディングブロックの数を多くし混練ゾーンの全長を長くする、各混練エレメントのピッチを短くする、等の手法でも分散相の粒径を小さくすることが出来る。
また、スクリュー回転数を高回転にする等樹脂に与えるせん断速度を早くする手法でも分散相粒径を小さくすることができる。
また、ダイス部でのメッシュを細かくする、メッシュ枚数を増やす等の方法でも粒径を小さくすることが出来る。
In the same-direction twin-screw extruder, normally, two kneading zones are provided. The number of kneading zones is increased, the number of kneading blocks is increased, and the total length of the kneading zones is increased. The particle diameter of the dispersed phase can also be reduced by a technique such as shortening the pitch.
The dispersed phase particle size can also be reduced by increasing the shear rate applied to the resin, such as by increasing the screw speed.
The particle size can also be reduced by methods such as making the mesh in the die portion finer or increasing the number of meshes.
(4)混練順序を制御する方法
(B)と(C)のMFR値の比(MFRB/MFRC)が50〜2000の範囲にある場合は、(A)、(B)、(C)を一括混練するまたは(B+C)を混練し、(A)を加えて混練する方法を上げることが出来る。
MFR比が2000を越える場合は(A)と(B)を予め混練後、(C)と混練する方法が有用であり、MFR比が50未満の場合は、(A)と(C)を予め混練後(B)と混練する方法が有用である。
(4) Method of controlling the kneading sequence When the ratio of the MFR values (MFRB / MFRC) of (B) and (C) is in the range of 50 to 2000, (A), (B), (C) are collectively The method of kneading or kneading (B + C) and adding (A) can be raised.
When the MFR ratio exceeds 2000, the method of kneading (A) and (B) in advance and then kneading with (C) is useful. When the MFR ratio is less than 50, (A) and (C) are preliminarily used. A method of kneading with (B) after kneading is useful.
(5)(C)の表面張力をさげる添加剤を加える方法
(C)の溶融時の表面張力を下げる目的で、ステアリン酸塩のような界面活性剤、N,N−ビス(2−ヒドロキシエチル)アルキルアミンのような帯電防止剤を加えても粒径を小さくすることが出来る。
(6)選択的に(C)の粘度を下げる可塑剤を加える方法
(C)への可塑化効果が大きくて、(B)の可塑化効果が小さいオイル等の可塑剤を加えることにより、分散相粒径を小さくすることが出来る。
(5) A method of adding an additive for reducing the surface tension of (C) In order to reduce the surface tension at the time of melting in (C), a surfactant such as stearate, N, N-bis (2-hydroxyethyl) ) The particle size can be reduced by adding an antistatic agent such as alkylamine.
(6) Method of selectively adding a plasticizer that lowers the viscosity of (C) Dispersion by adding a plasticizer such as oil having a large plasticizing effect to (C) and a small plasticizing effect of (B) The phase particle size can be reduced.
(7)無機ガス充填混練方法
(C)への可塑化効果が大きくて、(B)の可塑化効果が小さい無機ガス(窒素、炭酸ガス等)を押出混練機の溶融ゾーンに加圧注入する方法によって(C)の粒径を小さくすることが出来る。
本発明においては、JIS K7210に準拠し、(B)の融点以上、2.16Kg荷重で測定した、(B)のメルトフローレート値(MFRB)と(C)のメルトフローレート値(MFRC)の比(MFRB/MFRC)が4以上であることが好ましく、さらに好ましくは17以上であり、とりわけ好ましくは50以上である。メルトフローレート値(MFRC)の比(MFRB/MFRC)がこの条件を満たす時、(B)を連続相にすることが可能となる。
(7) Inorganic gas filling and kneading method Inorganic gas (nitrogen, carbon dioxide, etc.) having a large plasticizing effect on (C) and a small plasticizing effect on (B) is injected under pressure into the melting zone of the extrusion kneader. Depending on the method, the particle size of (C) can be reduced.
In the present invention, in accordance with JIS K7210, the melt flow rate value (MFRB) of (B) and the melt flow rate value (MFRC) of (C) measured at a load of 2.16 kg or more above the melting point of (B). The ratio (MFRB / MFRC) is preferably 4 or more, more preferably 17 or more, and particularly preferably 50 or more. When the ratio (MFRB / MFRC) of the melt flow rate value (MFRC) satisfies this condition, (B) can be made into a continuous phase.
また、(A)の量(Wa重量部)と(B)の量(Wb重量部)が、3<Wb/ Wa<100の場合に、(B)を連続相にし、連続相の厚みを本発明の範囲内にすることができ、好ましい。 さらに好ましい範囲は、3<Wb/ Wa<50であり、とりわけ好ましい範囲は、3<Wb/ Wa<30である。
また、本発明の熱可塑性樹脂組成物においては、150℃を超える温度における(B)の結晶性樹脂成分の結晶化エンタルピー(ΔHc1)と(B)の結晶性樹脂成分の融解エンタルピー(ΔHm1)は、X=ΔHc1/ΔHm1≧0.3である(ΔHc1、ΔHm1はDSC法で測定できる)。好ましくは、X≧0.4、さらに好ましくは、X≧0.5、特に好ましくは、X≧0.6、最も好ましくは、X≧0.7である。
また、本発明の熱可塑性樹脂組成物においては、(B)の融点が150℃を超えることが好ましい。150℃以下であると耐熱性が悪化する。好ましくは200℃以上であり、さらに好ましくは210℃以上である。
When the amount of (A) (Wa parts by weight) and the amount of (B) (Wb parts by weight) is 3 <Wb / Wa <100, (B) is the continuous phase, and the thickness of the continuous phase is It can be within the scope of the invention and is preferred. A more preferred range is 3 <Wb / Wa <50, and a particularly preferred range is 3 <Wb / Wa <30.
In the thermoplastic resin composition of the present invention, the crystallization enthalpy (ΔHc1) of the crystalline resin component (B) and the melting enthalpy (ΔHm1) of the crystalline resin component (B) at temperatures exceeding 150 ° C. X = ΔHc1 / ΔHm1 ≧ 0.3 (ΔHc1 and ΔHm1 can be measured by DSC method). Preferably, X ≧ 0.4, more preferably X ≧ 0.5, particularly preferably X ≧ 0.6, and most preferably X ≧ 0.7.
Moreover, in the thermoplastic resin composition of this invention, it is preferable that melting | fusing point of (B) exceeds 150 degreeC. Heat resistance deteriorates that it is 150 degrees C or less. Preferably it is 200 degreeC or more, More preferably, it is 210 degreeC or more.
本発明の熱可塑性樹脂組成物100重量部に対して他の熱可塑性重合体が1〜100重量部まで添加されていても良い。添加することが出来る熱可塑性重合体としては、スチレン系樹脂(例えばスチレン単独重合体、ハイインパクトポリスチレン、スチレンメタクリル酸共重合体、耐候性樹脂であるAES樹脂、ASA樹脂(アクリロニトリル−スチレン−アクリルゴム共重合体)等)、ポリオレフィン系樹脂、ポリアミド系樹脂、ポリエステル系樹脂、ポリアセタール系樹脂、ポリフェニレンエーテル系樹脂、アクリル系樹脂等があげられ、各種相容化剤も使用できる。これらは本発明の目的を損なわない範囲でゴム補強されていてもよい。 Another thermoplastic polymer may be added up to 1 to 100 parts by weight with respect to 100 parts by weight of the thermoplastic resin composition of the present invention. Examples of the thermoplastic polymer that can be added include styrene resins (for example, styrene homopolymer, high impact polystyrene, styrene methacrylic acid copolymer, weather resistant resin, AES resin, ASA resin (acrylonitrile-styrene-acrylic rubber). Copolymer)), polyolefin resins, polyamide resins, polyester resins, polyacetal resins, polyphenylene ether resins, acrylic resins and the like, and various compatibilizers can also be used. These may be reinforced with rubber as long as the object of the present invention is not impaired.
また、本発明の熱可塑性樹脂組成物100重量部に対してゴム成分を1〜100重量部まで添加されていても良い。
添加することが出来るゴム成分としては、スチレンブタジエンランダム共重合体、スチレンイソプレンランダム共重合体、スチレン−イソプレンブロック共重合体、スチレン−ブタジエンブロック共重合体、水素添加スチレン−イソプレンブロック共重合体(SEPS)、水素添加スチレン−ブタジエンブロック共重合体(SEBS)等の水素添加ブロック共重合体、エチレン−プロピレン共重合体、エチレン−ブチレン共重合体、エチレン−オクテン共重合体等のエチレン−α−オレフィン共重合体(メタロセン触媒によるものが好ましい)などがあげられ(ポリマー構造は問わない)、反応性官能基で変性されたものも含まれる。
Moreover, 1-100 weight part of rubber components may be added with respect to 100 weight part of the thermoplastic resin composition of the present invention.
Examples of rubber components that can be added include styrene butadiene random copolymer, styrene isoprene random copolymer, styrene-isoprene block copolymer, styrene-butadiene block copolymer, hydrogenated styrene-isoprene block copolymer ( SEPS), hydrogenated block copolymers such as hydrogenated styrene-butadiene block copolymer (SEBS), ethylene-α- such as ethylene-propylene copolymer, ethylene-butylene copolymer, ethylene-octene copolymer Examples include olefin copolymers (preferably those based on metallocene catalysts) and the like (polymer structures are not limited), and those modified with reactive functional groups are also included.
また本発明における熱可塑性樹脂組成物には、それ自体公知の各種配合剤、例えば炭酸カルシウム、ケイ酸カルシウム、アパタイト、クレー、層状珪酸塩、カオリン、タルク、シリカ、ケイソウ土、雲母粉、アスベスト、アルミナ、硫酸バリウム、硫酸カルシウム、塩基性炭酸マグネシウム、二硫化モリブデン、グラファイト、ガラス繊維、ガラス球、シラスバルーン、カーボン繊維等の充填剤、カーボンブラック、酸化チタン、酸化亜鉛、酸化スズ、金属微粒子亜鉛華、ベンガラ、群青、紺青、アゾ顔料、ニトロソ顔料、レーキ顔料、フタロシアニン顔料、フェノール系、サルファイト系、フォスファイト系、アミン系等の耐熱安定剤、酸化防止剤、光安定剤、紫外線吸収剤、発泡剤、帯電防止剤、金属石ケン、ワックス等の滑剤、などが配合されていても良い。 In the thermoplastic resin composition of the present invention, various known ingredients such as calcium carbonate, calcium silicate, apatite, clay, layered silicate, kaolin, talc, silica, diatomaceous earth, mica powder, asbestos, Alumina, barium sulfate, calcium sulfate, basic magnesium carbonate, molybdenum disulfide, graphite, glass fiber, glass sphere, shirasu balloon, filler for carbon fiber, carbon black, titanium oxide, zinc oxide, tin oxide, metal fine particle zinc Hua, Bengala, Ultramarine, Bituminous, Azo, Nitroso, Lake, Phthalocyanine, Phenol, Sulfite, Phosphite, Amine, etc. , Foaming agents, antistatic agents, metal soaps, lubricants such as wax, etc. It may be engaged.
特に、本発明の熱可塑性樹脂組成物の(B)成分の相に上記フィラー、特にクレー、層状粘度鉱物、層状珪酸塩、シリカ微粒子、アパタイト等をナノオーダーで分散させると、ガスバリア性を向上することができる。
本発明の熱可塑性樹脂組成物は、射出成形、射出プレス成形、押出成形、ブロー成形、インジェクションブロー成形、延伸ブロー成形、回転成形、スラッシュモールド成形、フィルム成形、シート成形、発泡シート成形、圧縮成形等の通常の成形法を使用でき、他の樹脂と多層成形することもできる。
本発明の組成物からなるシート、フィルム、発泡成形体は、圧空成形法、真空成形法、プラグアシスト成形法、熱板接触圧空成形法などの公知の方法により、二次成形することができる。
In particular, when the filler, especially clay, lamellar viscosity mineral, lamellar silicate, silica fine particles, apatite, etc. are dispersed in the nano order in the phase of the component (B) of the thermoplastic resin composition of the present invention, the gas barrier property is improved. be able to.
The thermoplastic resin composition of the present invention includes injection molding, injection press molding, extrusion molding, blow molding, injection blow molding, stretch blow molding, rotational molding, slush molding, film molding, sheet molding, foam sheet molding, and compression molding. Ordinary molding methods such as these can be used, and multilayer molding with other resins can also be performed.
The sheet, film, and foamed molded article made of the composition of the present invention can be secondarily molded by a known method such as a pressure forming method, a vacuum forming method, a plug assist forming method, or a hot plate contact pressure forming method.
本発明の熱可塑性樹脂組成物は、その優れた気体/液体バリア性、耐衝撃性、成形性を活かし、薬液および/またはガス搬送または貯蔵用容器およびその付属部品として好ましく用いることが出来る。薬液やガスとしては例えば、ガソリン、メタノール、エタノール、イソプロピルアルコール、ブタノール、窒素、酸素、二酸化炭素、メタン、プロパン、天然ガス等の気体/液体バリア性が優れていることより、ガソリン燃料タンク、オイル用タンク、その他シャンプー、リンス、液体石鹸等の各種薬剤用ボトル等の薬液保存容器、またはそれらタンク、ボトルに付属するバルブや継手類、ホース等の燃料チューブ接続部品、オイルチューブ接続部品、ブレーキホース接続部品等の自動車材料に有用に用いることが出来る。 The thermoplastic resin composition of the present invention can be preferably used as a chemical solution and / or gas transport or storage container and its accessory parts, taking advantage of its excellent gas / liquid barrier properties, impact resistance, and moldability. Examples of chemicals and gases include gasoline fuel tanks and oils because of their excellent gas / liquid barrier properties such as gasoline, methanol, ethanol, isopropyl alcohol, butanol, nitrogen, oxygen, carbon dioxide, methane, propane, and natural gas. Tanks, other chemical storage containers such as bottles for various chemicals such as shampoos, rinses, liquid soaps, etc., or fuel tube connection parts such as valves and fittings attached to the tanks and bottles, hoses, oil tube connection parts, brake hoses It can be usefully used for automobile materials such as connecting parts.
また、本発明の熱可塑性樹脂組成物は、成型加工性、耐熱性、酸素バリア性、耐衝撃性に優れる食品包装材、食品容器及びその蓋等にも有用に用いることができる。
さらに本発明の組成物は、その成形体、成形品を粉砕等して成形することにより容易にリサイクル使用できる。
なお、本発明の組成物からなる成形体に塗装、メッキ、シリカコーティング、シリカアルミナコーティング等の二次加工、表面処理をすることも可能である。
Moreover, the thermoplastic resin composition of the present invention can be usefully used for food packaging materials, food containers, lids thereof, and the like that are excellent in molding processability, heat resistance, oxygen barrier properties, and impact resistance.
Furthermore, the composition of the present invention can be easily recycled by pulverizing the molded product or molded product.
In addition, it is also possible to perform secondary processing and surface treatment such as painting, plating, silica coating, silica alumina coating, etc., on the molded body made of the composition of the present invention.
以下実施例により本発明を更に詳しく説明するが、本発明は、これらにより限定されるものではない。
なお、これら実施例および比較例において、各種物性の評価に用いた試験法、原材料は以下の通りである。
1.試験法
(1)バリア性
JIS K7126Bに準拠して、1mmの射出成形平板の酸素透過係数(単位:cm3・mm/m2・24h・atm)を測定した(23℃、65%RH)。
EXAMPLES The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.
In these Examples and Comparative Examples, test methods and raw materials used for evaluation of various physical properties are as follows.
1. Test Method (1) Barrier Property Based on JIS K7126B, the oxygen transmission coefficient (unit: cm 3 · mm / m 2 · 24 h · atm) of an injection molded flat plate of 1 mm was measured (23 ° C., 65% RH).
(2)連続相、分散相の観察、及び分散相の平均円換算粒径の算出
アイゾット試験片の断面を切り出し、リンタングステン酸染色/ルテニウム酸染色、或いはルテニウム酸染色した超薄切片を作成して電子顕微鏡観察を行い、連続相、分散相を観察した。また、電子顕微鏡写真において、倍率5000倍、視野範囲 横36μm×縦44μm に存在する分散相粒子のみを抽出し、その面積をソフトウエア Image Pro Plus Ver4 を使用して求めた。得られた面積と同一の面積を有する円の直径を算出し、それを分散相の円換算粒径とした。100個以上の分散相の円換算粒径を求め、下式により平均円換算粒径を求めた。
平均円換算粒径=(Σdi4*ni)/(Σdi3*ni)
di:i番目の分散相の円換算粒径
(2) Observation of continuous phase, dispersed phase, and calculation of average circular equivalent particle size of dispersed phase Cut out a cross section of an Izod test piece and prepare an ultrathin section stained with phosphotungstic acid / ruthenate or ruthenate. Were observed with an electron microscope, and a continuous phase and a dispersed phase were observed. Further, in the electron micrograph, only the dispersed phase particles existing at a magnification of 5000 times and a visual field range of 36 μm × 44 μm were extracted, and the area thereof was determined using software Image Pro Plus Ver4. The diameter of a circle having the same area as the obtained area was calculated and used as the circle-equivalent particle diameter of the dispersed phase. The circle-converted particle diameter of 100 or more dispersed phases was determined, and the average circle-converted particle diameter was determined by the following formula.
Average circle equivalent particle size = (Σdi 4 * ni) / (Σdi 3 * ni)
di: Diameter in terms of a circle of the i-th dispersed phase
(3)耐衝撃性
JIS K7110に基づき、長さ11.8mm、幅12mm、厚み3mmの射出成形品を得た。得られた成形体よりアイゾット試験片(ノッチ付き)を作成し試験を行った(単位:Kg・cm/cm)。
(4)ガス発生量
250℃での射出成形において、パージ時に発生するガス量を目視で観察し、ガス発生量の少ないものを○、やや多いものを△、明らかに多いものを×とした。
(3) Impact resistance Based on JIS K7110, an injection molded product having a length of 11.8 mm, a width of 12 mm, and a thickness of 3 mm was obtained. An Izod test piece (notched) was prepared from the obtained molded body and tested (unit: Kg · cm / cm).
(4) Gas generation amount In injection molding at 250 ° C., the amount of gas generated at the time of purging was visually observed, with ○ indicating that the amount of generated gas was small, Δ for slightly increasing amount, and × indicating clearly increasing amount.
2.原材料
[オレフィン−官能基含有単量体共重合体]
エチレン−メタアクリル酸共重合体(表中N0908Cと略記。三井・デュポンポリケミカル株式会社製、メタアクリル酸含有量=9%、メルトフローレート8g/10分(JIS K 7210に準拠し、230℃、2.16Kg荷重で測定)
エチレン−アクリル酸エステル−酸無水物基含有単量体共重合体(表中ET182と略記。日本ポリオレフィン株式会社製、無水マレイン酸含有量=3%、メルトフローレート g/10分(JIS K 7210に準拠し、230℃、2.16Kg荷重で測定)
2. Raw material [olefin-functional group-containing monomer copolymer]
Ethylene-methacrylic acid copolymer (abbreviated as N0908C in the table. Made by Mitsui DuPont Polychemical Co., Ltd., methacrylic acid content = 9%, melt flow rate 8 g / 10 min (according to JIS K 7210, 230 ° C. , Measured at 2.16 kg load)
Ethylene-acrylic acid ester-anhydride group-containing monomer copolymer (abbreviated as ET182 in the table. Manufactured by Nippon Polyolefin Co., Ltd., maleic anhydride content = 3%, melt flow rate g / 10 min (JIS K 7210 , Measured at 230 ° C and 2.16 kg load)
[無水マレイン酸変性SEBS]
水素添加スチレンブタジエンブロック共重合体である旭化成株式会社製タフテックH1052を5000g、無水マレイン酸60g、パーヘキサ25B(日本油脂製ラジカル開始剤)、エチルベンゼン12gをヘンシェルミキサーで充分混合したあと、二軸押し出し機を用いて200℃、250rpmのもと溶融混練した。得られた無水マレイン酸変性水素添加スチレンブタジエンブロック共重合体(表中M−SEBSと略記)の無水マレイン酸付加量は0.5重量%であった。
[Maleic anhydride-modified SEBS]
A twin screw extruder after thoroughly mixing 5000 g of Tough Tech H1052 manufactured by Asahi Kasei Co., Ltd., a hydrogenated styrene butadiene block copolymer, 60 g of maleic anhydride, Perhexa 25B (a radical initiator made by NOF Corporation) and 12 g of ethylbenzene with a Henschel mixer. Was melt kneaded at 200 ° C. and 250 rpm. The amount of maleic anhydride added to the obtained maleic anhydride-modified hydrogenated styrene butadiene block copolymer (abbreviated as M-SEBS in the table) was 0.5% by weight.
[無水マレイン酸変性ポリエチレン]
無水マレイン酸変性ポリエチレン(表中L6101Mと略記。日本ポリオレフィン株式会社製 アドテックスL6101M、メルトフローレート0.7g/10分(JIS K 7210に準拠し、230℃、2.16Kg荷重で測定)密度0.92g/cm3( JIS K7112 準拠)を用いた。
[ポリアミド樹脂]
ポリアミド6(表中1013Bと略記。宇部興産株式会社製UBEナイロン1013B、メルトフローレート40g/10分(JIS K 7210に準拠し、230℃、2.16Kg荷重で測定)
[オレフィン系樹脂]
ポリエチレン系樹脂(表中B872Aと略記。旭化成株式会社製サンテックB872A、メルトフローレート0.62g/10分、密度0.954g/cm3( JIS K 7210に準拠し、230℃、2.16Kg荷重で測定)
[Maleic anhydride-modified polyethylene]
Maleic anhydride-modified polyethylene (abbreviated as L6101M in the table. Adtex L6101M manufactured by Nippon Polyolefin Co., Ltd., melt flow rate 0.7 g / 10 min (measured in accordance with JIS K 7210 at 230 ° C. and 2.16 kg load) Density 0 .92 g / cm 3 (conforming to JIS K7112) was used.
[Polyamide resin]
Polyamide 6 (abbreviated as 1013B in the table. UBE nylon 1013B manufactured by Ube Industries, Ltd., melt flow rate 40 g / 10 min (measured at 230 ° C. and 2.16 kg load according to JIS K 7210)
[Olefin resin]
Polyethylene resin (abbreviated as B872A in the table. Suntech B872A manufactured by Asahi Kasei Corporation, melt flow rate 0.62 g / 10 min, density 0.954 g / cm 3 (according to JIS K 7210, 230 ° C., 2.16 Kg load) Measurement)
[実施例1〜4、比較例1〜4]
表1に示した比率で原料を配合し、250℃に設定された同方向回転二軸押出機(40mmφ、L/D=48 混練エレメントのピッチ長 =7ミリ ニーディング部全長=270ミリ 回転数=300rpm メッシュ=60/100/60の3枚)により溶融混練し、ペレタイズした。この組成物ペレットを250℃で射出成形し、アイゾット試験片と平板を作成し、各評価を実施した。各評価の結果を表1に示す。
[Examples 1-4, Comparative Examples 1-4]
The raw materials are blended at the ratio shown in Table 1, and the same direction rotating twin-screw extruder set at 250 ° C. (40 mmφ, L / D = 48 Kneading element pitch length = 7 mm Kneading part total length = 270 mm Rotational speed = 300 rpm mesh = 60/100/60) and kneaded and pelletized. This composition pellet was injection-molded at 250 ° C. to prepare an Izod test piece and a flat plate, and each evaluation was performed. The results of each evaluation are shown in Table 1.
本発明の熱可塑性樹脂組成物は、その優れた気体/液体バリア性、耐衝撃性、成形性を活かし、薬液および/またはガス等の各種薬剤用ボトル等の薬液保存容器、またはそれらタンク、ボトルに付属するバルブや継手類、ホース等の燃料チューブ接続部品、オイルチューブ接続部品、ブレーキホース接続部品等の自動車材料、食品包装材、食品容器及びその蓋、建材等に使用される。 The thermoplastic resin composition of the present invention utilizes its excellent gas / liquid barrier properties, impact resistance, and moldability, and stores chemical solutions such as chemical and / or gas chemical bottles, or tanks and bottles thereof. It is used for automobile materials such as valves and fittings, fuel tube connection parts such as hoses, oil tube connection parts, brake hose connection parts, food packaging materials, food containers and their lids, and building materials.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005232353A (en) * | 2004-02-20 | 2005-09-02 | Asahi Kasei Chemicals Corp | Improved thermoplastic resin molded article |
JP2009535452A (en) * | 2006-04-28 | 2009-10-01 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Method for recycling a polyolefin blend composition using an ethylene copolymer compatibilizer |
EP2121844B1 (en) | 2007-02-23 | 2016-08-10 | Rhodia Opérations | Polyamide based thermoplastic polymer composition |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005232353A (en) * | 2004-02-20 | 2005-09-02 | Asahi Kasei Chemicals Corp | Improved thermoplastic resin molded article |
JP4703962B2 (en) * | 2004-02-20 | 2011-06-15 | 旭化成イーマテリアルズ株式会社 | Improved thermoplastic resin molding |
JP2009535452A (en) * | 2006-04-28 | 2009-10-01 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | Method for recycling a polyolefin blend composition using an ethylene copolymer compatibilizer |
EP2121844B1 (en) | 2007-02-23 | 2016-08-10 | Rhodia Opérations | Polyamide based thermoplastic polymer composition |
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