JP2005168134A - Liquid-cooled type power converter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid-cooled type power converter optimum for the prolongment of a service lifetime of a semiconductor element. <P>SOLUTION: The liquid-cooled type power converter has a cooling body with a flow passage for making a cooling liquid flow inside, a heat exchanger 5 for executing heat exchange, a pump 3 for circulating the cooling liquid, piping 4 for connecting the cooling body, the heat exchanger 5, and the pump 3, bypass piping 11 provided so as to bypass the heat exchanger 5, a first openable/closable valve 12 provided to the bypass piping 11, a second valve 12a provided to the in-flow side to the heat exchanger 5, and a third valve 12b provided to the out-flow side from the heat exchanger 5. The first valve 12 is closed and the second/third valves 12a, 12b are opened when a railroad vehicle travels. The first valve 12 is opened and the second/third valves 12a, 12b are closed when the railroad vehicle is stopped. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to a liquid-cooled power converter.

A conventional liquid-cooled power converter will be described in detail with reference to the drawings. Fig.8 (a) is a piping block diagram of the conventional liquid cooling type power converter device.

In a conventional liquid-cooled power converter, the semiconductor element 1 is attached to a liquid-cooled fin 2 that serves as a cooling body. The liquid cooling fin 2 has a flow path through which the cooling liquid flows. Inside the liquid cooling fin, the cooling liquid is forcedly circulated by the pump 3. The pipe 4 connects the pump 3 and the liquid cooling fin 2, and further connects the liquid cooling fin 2 and the heat exchanger 5, and the heat exchanger 5 and the pump 3 in a series loop shape to form a circulation system. The coolant is forcibly circulated by driving the pump 3, and the heat loss generated from the semiconductor element 1 is input to the coolant inside the liquid cooling fin 2 via the liquid cooling fin 2, and the atmosphere on the heat exchanger 5 side. Although the heat is dissipated, the circulating coolant performs this heat transport. The heat exchanger 5 is forcedly blown by the electric blower 6 to dissipate heat to the outside air.

In FIG. 8A, a single cooling piping system diagram is shown in which the liquid cooling fins 2 are in the circulation system. However, a plurality of liquid cooling fins 2 are connected in series or connected in parallel. However, since there is no difference in the explanation of the present invention, the case where there is one liquid cooling fin 2 will be described below.

The liquid-cooled power conversion device configured as described above forcibly circulates the coolant as compared with the boiling cooling method using the phase change of the refrigerant, the heat pipe cooling method, and the cooling method using the air-cooling fins that do not use the refrigerant. The heat transfer rate is high and the cooling capacity is excellent, and the temperature rise of the semiconductor element can be reduced and it is suitable for cooling a large-capacity semiconductor element. There is a characteristic that the rise change is quick.
JP 09-219904 A

The liquid-cooled power converter configured in this way is more compulsory than power converters that employ a boiling cooling system that uses the phase change of the refrigerant, a heat pipe cooling system, and a cooling system that uses air-cooling fins that do not use a refrigerant. The coolant is circulated in a high temperature so that the heat transfer rate is high and the cooling capacity is excellent. Therefore, the temperature rise of the semiconductor element can be reduced and suitable for cooling a large-capacity semiconductor element. However, since the thermal time constant is small and the thermal response is good, there is a feature that the temperature rise change is fast. That is, since the thermal time constant of the cooling system is small, the thermal responsiveness is good with respect to the intermittent generated heat loss pattern, and the increase and decrease of the temperature rise value is large compared to other cooling systems. The increase / decrease in the temperature rise of the semiconductor element in the liquid-cooled power conversion device will be specifically described with reference to the drawings. FIG. 8B shows changes in the semiconductor element case temperature (contact surface with the cooling fin) 7 and the temperature 8 of the cooling liquid when the liquid cooling system is applied to the power conversion device that performs electric railcar drive control. It is.

During power running and braking of the railway vehicle, the semiconductor element in the power conversion device generates heat loss due to electrical energization or switching operation of the semiconductor element, and the semiconductor element case temperature 7 rises. On the other hand, when the railway vehicle coasts and stops, there is no heat loss from the semiconductor elements, and the case temperature 7 decreases. The semiconductor device case temperature 7 repeats a small temperature change (ΔTc1) 9 during running, which is repeated from power running to coasting, coasting to power running, or power running to coasting to braking, but it takes longer than when running at a station when it stops at the station. Since no heat loss is generated from the semiconductor element, the semiconductor element case temperature 7 is greatly reduced as compared with the traveling time, resulting in a large temperature change (ΔTc2) 10.

When attention is paid to the change in the temperature 8 of the forced circulating coolant in the cooling system, the temperature change of the coolant temperature 8 is very small when the semiconductor case temperature 7 is small (ΔTc1) 9. The semiconductor element case temperature 7 changes due to the thermal constant of the vicinity of the fin 2 where the semiconductor element 1 is in contact. This means that the same temperature change is exhibited not only in this liquid cooling system but also in other cases such as heat pipe cooling.

On the other hand, at the time of a large temperature change (ΔTc2) 10 of the semiconductor case temperature 7, the temperature is reduced by substantially the same value as the reduction of the temperature rise value of the coolant temperature 8. That is, in the liquid cooling type, the coolant is forcibly circulated and cooled, so that the liquid temperature is greatly reduced when the station stops.

By the way, various materials are used inside the semiconductor element, and since they are joined by solder or the like, the temperature change of the semiconductor element is caused by thermal fatigue caused by the difference in the coefficient of thermal expansion of the material. It is a factor. For this reason, the temperature change greatly affects the life of the semiconductor element. Therefore, it is important to extend the life of the semiconductor element by reducing the temperature change width or reducing the number of cycles of the temperature change. For the purpose of suppressing the maximum temperature rise value of the semiconductor element, the liquid cooling type is an excellent cooling system with a small cooling system thermal resistance (large heat transfer coefficient), but the temperature change range is large. From the point of view of life, it is an alarming point.

Accordingly, an object of the present invention is to provide a liquid-cooled power conversion device that reduces the change width during the large temperature change (ΔTc2) described above and is optimal for extending the life of the semiconductor element.

The above-mentioned problems include a cooling body having a semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, and the cooling body and the heat exchanger. A pump for circulating the coolant, and a pipe for connecting the coolant, the heat exchanger, and the pump, provided in order of the coolant, the heat exchanger, and the pump; A bypass pipe provided to bypass the heat exchanger so that coolant flows in the order of the cooling body and the pump; a first valve provided in the bypass pipe that can be opened and closed; and the heat exchanger. A second valve that can be opened and closed, and a third valve that can be opened and closed on the pipe on the outflow side from the heat exchanger. , Close the first valve Opening the second valve and the third valve, when the railway vehicle is stopped, it opens the first valve can be achieved by closing the second valve and the third valve.

The above-mentioned problems include a cooling body having a semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, and the cooling body and the heat exchanger. A pump for circulating the coolant, and a pipe for connecting the coolant, the heat exchanger, and the pump, provided in order of the coolant, the heat exchanger, and the pump; A bypass pipe provided to bypass the pump and circulate a coolant between the cooling body and the heat exchanger, a first valve provided in the bypass pipe and openable and closable, and to the pump A second valve that can be opened and closed, and a third valve that can be opened and closed on the pipe on the outflow side from the pump. Close the first valve, Valve and opening the third valve, when the railway vehicle is stopped, opens the first valve can be achieved by closing the second valve and the third valve.

The above-mentioned problems include a cooling body having a semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, and the cooling body and the heat exchanger. A pump for circulating the coolant, and a pipe for connecting the coolant, the heat exchanger, and the pump, provided in order of the coolant, the heat exchanger, and the pump; A bypass pipe provided to bypass the cooling body and to circulate a coolant between the pump and the heat exchanger, a first valve provided in the bypass pipe and openable and closable, and the cooling body A second valve that can be opened and closed provided in the pipe on the inflow side of the vehicle, and a third valve that can be opened and closed provided on the pipe on the outflow side from the cooling body. , Closing the first valve, Valve and opening the third valve, when the railway vehicle is stopped, opens the first valve can be achieved by closing the second valve and the third valve.

  The above-mentioned problems include a cooling body having a semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, and the cooling body and the heat exchanger. This can be achieved by having a pump for circulating the coolant and a blower for cooling to the heat exchanger, operating the blower when traveling on a railway vehicle, and stopping the blower when the railway vehicle is stopped.

  The above-mentioned problems include a cooling body having a semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, and the cooling body and the heat exchanger. And a pump for circulating the coolant. When the railway vehicle is running, the pump is operated by the driver, and when the railway vehicle is stopped, the pump is stopped.

  The above-mentioned problems include a cooling body having a semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, and the cooling body and the heat exchanger. A pump for circulating the coolant; a blower for cooling to the heat exchanger; and a temperature detecting means for detecting the temperature of the semiconductor element, and a temperature change of the semiconductor element detected by the temperature detecting means. This can be achieved by performing the acceleration / deceleration operation of the blower so as to suppress it.

  The above-mentioned problems include a cooling body having a semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, and the cooling body and the heat exchanger. A pump for circulating the coolant; a blower for cooling to the heat exchanger; and a temperature detecting means for detecting the temperature of the semiconductor element, and a temperature change of the semiconductor element detected by the temperature detecting means. This can be achieved by performing the acceleration / deceleration operation of the pump so as to suppress it.

  The above-described problems include a semiconductor element that performs switching, a cooling body that has the semiconductor element mounted therein and a flow path through which a coolant flows, a heat exchanger that performs heat exchange between the cooling body and air, A cooling body and a pump for circulating a coolant to the heat exchanger, forcibly cooling the semiconductor element when the railway vehicle is running, and forcibly cooling the semiconductor element when the railway vehicle is stopped. It can be achieved by self-cooling.

It is possible to provide a liquid-cooled power conversion device that is optimal for extending the life of semiconductor elements.

(First embodiment)
A liquid-cooled power converter according to a first embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1A is a cooling piping system diagram of the liquid-cooled power converter according to the first embodiment of the present invention. FIG. 1B shows changes in the semiconductor element case temperature (contact surface with the cooling fin) 7 and the coolant temperature 8 of the liquid-cooled power converter according to the first embodiment of the present invention. It is. 8 that are structurally the same as those described in FIG.

In the liquid-cooled power conversion device according to the first embodiment of the present invention, the semiconductor element 1 is attached to a liquid-cooled fin 2 serving as a cooling body. The liquid-cooled fin 2 is a flow path through which the coolant flows. The cooling liquid is forcibly circulated inside by the pump 3. The pipe 4 connects the pump 3 and the liquid cooling fin 2, and further connects the liquid cooling fin 2 and the heat exchanger 5, and the heat exchanger 5 and the pump 3 in a series loop shape to form a circulation system. A bypass pipe 11 is connected to the circulation system so as to bypass the heat exchanger 5. One end of the bypass pipe 11 is connected to a pipe connecting the cooling fin 2 and the heat exchanger 5, and the other end is connected to a pipe connecting the pump 3 and the heat exchanger 5. A valve 12 is provided, a second valve 12a is provided on the heat exchanger 5 side of the connection portion of the bypass pipe 11 of the pipe between the cooling fin 2 and the heat exchanger 5, and a pipe between the pump 3 and the heat exchanger 5 is provided. A third valve 12b is provided on the heat exchanger 5 side of the connection portion of the bypass pipe 11. Here, each of the first to third valves 12, 12a, 12b is a valve that can be opened and closed by an electric signal. The heat exchanger 5 is forcibly blown by an electric blower 6.

In the liquid-cooled power conversion device configured as described above, the second valve 12a and the third valve 12b are opened and the first valve 12 is closed and the coolant is moved to the heat exchanger 5 side when the railway vehicle is running. A circulatory system is circulated. In other words, the coolant does not circulate in the bypass pipe 11 because the first valve 12 is closed.

In the liquid-cooled power converter configured as described above, the coolant is forcibly circulated by driving the pump 3, but heat loss generated from the semiconductor element 1 is caused by the liquid-cooled fin 2 via the liquid-cooled fin 2. Heat is transferred to the internal coolant and heat is dissipated to the atmosphere on the heat exchanger 5 side, but the circulating coolant performs this heat transport, and the heat exchanger 5 is forcibly blown by the electric blower 6 and dissipates heat to the outside air. It is carried out.

On the other hand, when the railway vehicle stops, the second valve 12a and the third valve 12b are closed, the first valve 12 is opened, and the coolant is circulated to the bypass pipe 11 side. At this time, the cooling liquid is not circulated to the heat exchanger 5 side, and the cooling liquid is not forcibly radiated on the bypassed circulation system side, and the temperature reduction of the cooling liquid is suppressed.

In the liquid-cooled power conversion apparatus configured as described above, the change width of the large temperature change (ΔTc2 ′) 10a of the semiconductor element case temperature 7 when the station stops is small. As a result, the lifetime of the semiconductor element can be extended. That is, when the station is stopped, the valves 12, 12a, and 12b are opened and closed so that the coolant circulates on the bypass pipe 11 side, so that the coolant is not circulated in the heat exchanger 5, so that the coolant temperature 8 increases. There is no reduction, and the change width of the large temperature change (ΔTc2 ′) 10a of the semiconductor element case temperature 7 is also small (see FIG. 1B).

The liquid-cooled power converter configured in this way has a reduced temperature change width (ΔTc) and a double logarithmic graph, so that the number of repetitions (N) is greatly increased, and the life of the semiconductor element can be extended ( See FIG. 1C: Life curve with repeated temperature change of semiconductor element, temperature change width (ΔTc) and logarithmic graph of number of repetitions (N) descending to the right).

In the liquid-cooled power converter according to the present embodiment, valves are provided at two locations on the inflow side and the outflow side from the bypass piping 11 to the heat exchanger 5, and the second valve 12 a and the third valve 12 b are provided. However, it goes without saying that the same action and effect can be obtained even if a valve is provided in only one of them.

The liquid-cooled power conversion device configured as described above forcibly cools the semiconductor element when the railway vehicle is running and does not forcibly cool the semiconductor element when the railway vehicle is stopped. It is possible to provide a liquid-cooled power conversion device that has a reduced temperature change width and is optimal for extending the life of a semiconductor element.

(Second Embodiment)
A liquid cooling power converter according to a second embodiment of the present invention will be described in detail with reference to the drawings. FIG. 2 is a cooling piping system diagram of the liquid-cooled power converter according to the second embodiment of the present invention.

In the liquid-cooled power converter according to the first embodiment of the present invention, the bypass pipe 11 is provided so as to bypass the heat exchanger 5, but here both the liquid-cooled fins 2 and the heat exchanger 5 are provided. A bypass pipe 11a is provided to bypass. That is, the bypass pipe 11a is connected in parallel with the pump 3 to the two pipe parts on the inflow side and the outflow side to the pump 3, and this pipe forms a circulation system bypassing the liquid cooling fin 2 and the heat exchanger 5. The bypass pipe 11a has one end connected to the pipe connecting the pump 3 and the liquid cooling fin 2, and the other end connected to the pump 3 and the heat exchanger 5. The first valve 12 is provided in the middle of the bypass pipe 11a, and the second valve 12c is provided on the liquid cooling fin 2 side of the bypass pipe 11a connection part of the pipe between the pump 3 and the liquid cooling fin 2, A third valve 12d is provided closer to the heat exchanger 5 than a bypass pipe 11a connecting portion of the pipe between the pump 3 and the heat exchanger 5.

In the liquid-cooled power conversion device configured as described above, the second valve 12c and the third valve 12d are opened and the first valve 12 is closed and the liquid-cooled fins 2 and the heat exchanger 5 are opened when the railway vehicle is running. The coolant is circulated to the side, and when the station is stopped, the second valve 12c and the third valve 12d are closed, the first valve 12 is opened, and the coolant is circulated to the bypass pipe 11a side. As a result, the bypass pipe 11a is closed when the railway vehicle is running, and the coolant flows through the liquid cooling fin 2 and the circulation system on the heat exchanger 5 side, and when stopped, the coolant circulates through the bypass pipe 11a side and the liquid cooling fin 2 Since the coolant on the heat exchanger 5 side does not circulate, the temperature of the coolant does not greatly decrease, and the variation range of the large temperature change (ΔTc2) of the semiconductor element case temperature is reduced, thereby extending the life of the semiconductor element. it can. That is, there is an effect similar to that of the first embodiment.

The liquid-cooled power converter configured as described above can provide a liquid-cooled power converter optimal for extending the life of the semiconductor element.

In this case, even if the second valve 12c and the third valve 12d for bypassing are installed only in one of them, the same operation and effect are obtained.

(Third embodiment)
A liquid-cooled power converter according to a third embodiment of the present invention will be described in detail with reference to the drawings. FIG. 3 is a cooling piping system diagram of the liquid-cooled power converter according to the third embodiment of the present invention.

In the liquid-cooled power converter according to the third embodiment of the present invention, the bypass pipe 11b is provided so as to bypass the liquid-cooled fins 2. One end of the bypass pipe 11b is connected to the pipe connecting the pump 3 and the liquid cooling fin 2, the other end is connected to the pipe connecting the liquid cooling fin 2 and the heat exchanger 5, and the first bypass pipe 11b is in the middle of the bypass pipe 11b. The second valve 12e is provided closer to the liquid cooling fin 2 side than the bypass piping 11b connecting portion of the piping between the pump 3 and the liquid cooling fin 2, and the piping between the liquid cooling fin 2 and the heat exchanger 5 is provided. A third valve 12f is provided on the liquid cooling fin 2 side of the bypass pipe 11b connecting portion. When the railway vehicle is running, the second valve 12e and the third valve 12f are opened, the first valve 12 is closed and the coolant is circulated to the liquid cooling fin 2 side. When the station is stopped, the second valve 12e and the second valve 12f are circulated. The third valve 12f is closed and the first valve 12 is opened to circulate the coolant to the bypass pipe 11b side. As a result, when the railway vehicle is stopped, the coolant circulates on the bypass pipe 11b side and the coolant of the liquid cooling fin 2 does not circulate, so that the temperature of the coolant inside the liquid cooling fin 2 is not greatly reduced, and the semiconductor element case temperature The change width of the large temperature change (ΔTc2) becomes small, and the life of the semiconductor element can be extended as in the first and second embodiments. That is, there is an effect similar to that of the first embodiment. or. Although the cooling liquid inside the liquid cooling fin 2 is not forcibly cooled when the station is stopped, the cooling liquid is circulated in the pump 3 and the heat exchanger 5, and the heat dissipation from the heat exchanger 5 to the atmosphere is performed. Therefore, the cooling liquid other than the inside of the liquid cooling fin 2 is forcibly cooled. When the railway vehicle resumes running from this state, the circulation system becomes the original piping (bypass piping is closed), and the coolant with reduced temperature begins to flow into the cooling fins 2. It also has the effect of mitigating the initial rapid temperature rise.

The liquid-cooled power converter configured as described above can provide a liquid-cooled power converter optimal for extending the life of the semiconductor element.

Note that the second valve 12e and the third valve 12f for bypassing also have the same operation and effect even if they are installed only in one of them.

(Fourth embodiment)
A liquid-cooled power converter according to a fourth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 4 is a cooling piping system diagram of the liquid-cooled power converter according to the fourth embodiment of the present invention.

In the liquid-cooled power conversion device according to the fourth embodiment of the present invention, the operation of the electric blower 6 that forcibly blows the heat exchanger 5 is made different between when the railway vehicle is running and when it is stopped. The width of change is reduced. That is, the electric blower 6 is supplied with power by the auxiliary power supply 13, but the switch 14 provided between the auxiliary power supply 13 and the electric blower 6 is opened to stop the electric blower 6 when the station stops, or the auxiliary power supply 13 can be set to a variable voltage. By using an AC power source capable of variable frequency control (hereinafter referred to as VVVF), the deceleration operation control of the electric blower 6 is performed so as not to actively blow air to the heat exchanger 5 when the railway vehicle is stopped. FIG. As in the case shown in FIG. 5, a large temperature change of the semiconductor element case temperature can be suppressed. In addition, by performing VVVF control, the acceleration / deceleration operation of the electric blower can be performed smoothly, and there is a merit that leads to a reduction in inrush current at the start of the electric blower and an improvement in the reliability of the electric blower.

The liquid-cooled power converter configured as described above can provide a liquid-cooled power converter optimal for extending the life of the semiconductor element.

(Fifth embodiment)
A liquid-cooled power converter according to a fifth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 5 is a cooling piping system diagram of the liquid-cooled power converter according to the fifth embodiment of the present invention.

Unlike the other embodiments that have been described so far, the liquid-cooled power converter according to the fifth embodiment of the present invention has the same piping system as the piping system of the conventional apparatus. The difference in temperature of the semiconductor element case is reduced by making the difference between when the railway vehicle is running and when it is stopped. In other words, the pump 3 is supplied with power by the auxiliary power source 13a, but the pump 3 is stopped when the station stops by opening a switch 14a provided between the auxiliary power source 13a and the pump 3, or the auxiliary power source 13a can be controlled by VVVF. By using the power source, the operation of the pump 3 is controlled so that the coolant is not actively cooled when the railway vehicle is stopped. As in the case shown in FIG. Can be suppressed.

The liquid-cooled power converter configured as described above can provide a liquid-cooled power converter optimal for extending the life of the semiconductor element.

(Sixth embodiment)
A liquid-cooled power converter according to a sixth embodiment of the present invention will be described in detail with reference to the drawings. FIG. 6 is a cooling piping system diagram of the liquid-cooled power converter according to the sixth embodiment of the present invention.

In the liquid-cooled power converter of the sixth embodiment based on the present invention, the auxiliary power source 13 for supplying power to the electric blower 6 is an AC power source capable of VVVF control, as in the fourth embodiment. The auxiliary power supply 13 is VVVF controlled by the information of the temperature detection means 15 provided near the semiconductor element 1 of the liquid cooling fin 2.

The liquid-cooled power conversion device configured as described above is not only running when the railway vehicle is stopped, but also when the temperature detection means 15 monitors the temperature rise value change amount of the semiconductor element 1 to be a predetermined value or less. In addition, the acceleration / deceleration operation control of the electric blower 6 can be performed, and a large temperature change of the semiconductor element case temperature can be suppressed.

The liquid-cooled power converter configured as described above can provide a liquid-cooled power converter optimal for extending the life of the semiconductor element.

(Seventh embodiment)
A liquid-cooled power converter according to a seventh embodiment of the present invention will be described in detail with reference to the drawings. FIG. 7 is a cooling piping system diagram of the liquid-cooled power converter according to the seventh embodiment of the present invention.

In the liquid-cooled power converter according to the seventh embodiment based on the present invention, the auxiliary power supply 13a for supplying power to the pump 3 is an AC power supply capable of VVVF control, as in the fifth embodiment. The auxiliary power supply 13a is VVVF controlled by information from the temperature detecting means 15 provided in the vicinity of the semiconductor element 1 of the liquid cooling fin 2.

The liquid-cooled power conversion device configured as described above is not only running when the railway vehicle is stopped, but also when the temperature detection means 15 monitors the temperature rise value change amount of the semiconductor element 1 to be a predetermined value or less. In addition, the acceleration / deceleration operation control of the pump 3 can be performed, and a large temperature change of the semiconductor element case temperature can be suppressed.

The liquid-cooled power converter configured as described above can provide a liquid-cooled power converter optimal for extending the life of the semiconductor element.

(A) It is a block diagram of the liquid cooling type power converter device of 1st Embodiment based on this invention.

(B) It is a figure showing the change of the semiconductor element case temperature (contact surface with a cooling fin) 7 and the temperature 8 of a cooling fluid of the liquid cooling type power converter device of 1st Embodiment based on this invention.

(C) It is a lifetime curve with respect to the temperature change repetition of a semiconductor element.
It is a block diagram of the liquid cooling type power converter device of 2nd Embodiment based on this invention. It is a block diagram of the liquid cooling type power converter device of 3rd Embodiment based on this invention. It is a block diagram of the liquid cooling type power converter device of 4th Embodiment based on this invention. It is a block diagram of the liquid cooling type power converter device of 5th Embodiment based on this invention. It is a block diagram of the liquid cooling type power converter device of 6th Embodiment based on this invention. It is a block diagram of the liquid cooling type power converter device of 7th Embodiment based on this invention. (A) It is a block diagram of the conventional liquid cooling type power converter device.

(B) It is a figure showing the change of the semiconductor element case temperature (contact surface with a cooling fin) 7 and the temperature 8 of a cooling fluid of the conventional liquid cooling type power converter.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Semiconductor element 2 ... Liquid cooling fin 3 ... Pump 4 ... Piping,
5 ... Heat exchanger 6 ... Electric blower 7 ... Semiconductor element case temperature (contact surface with cooling fin)
8 ... Coolant temperature 9 ... Small temperature change of semiconductor element case temperature (ΔTc1)
10, 10a: Large temperature change of semiconductor element case temperature (ΔTc2)
11, 11a, 11b ... Bypass piping 12, 12a, 12b, 12c, 12d, 12e, 12f ... Valve 13, 13a ... Auxiliary power supply 14, 14a ... Switch 15 ... Temperature detection means

Claims (8)

A cooling body having a flow path in which a semiconductor element is attached and a coolant flows therein;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger;
A pipe for connecting the cooling body, the heat exchanger, and the pump;
Bypass piping provided to bypass the heat exchanger, and the coolant flows in the order of the cooling body and the pump;
A first valve which is provided in the bypass pipe and can be opened and closed;
A second valve that is provided in the pipe on the inflow side to the heat exchanger and can be opened and closed;
A third valve which is provided in the pipe on the outflow side from the heat exchanger and can be opened and closed;
When the railway vehicle is running, the first valve is closed, the second valve and the third valve are opened, and when the railway vehicle is stopped, the first valve is opened, and the second valve and the third valve are opened. A liquid-cooled power converter characterized by closing the valve. A cooling body having a flow path in which a semiconductor element is attached and a coolant flows therein;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger;
A pipe for connecting the cooling body, the heat exchanger, and the pump;
Bypass piping provided to bypass the pump and to circulate coolant between the cooling body and the heat exchanger;
A first valve which is provided in the bypass pipe and can be opened and closed;
A second valve that is provided in the pipe on the inflow side to the pump and can be opened and closed;
A third valve that is provided in the pipe on the outflow side from the pump and can be opened and closed;
When the railway vehicle is running, the first valve is closed, the second valve and the third valve are opened, and when the railway vehicle is stopped, the first valve is opened, and the second valve and the third valve are opened. A liquid-cooled power converter characterized by closing the valve. A cooling body having a flow path in which a semiconductor element is attached and a coolant flows therein;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger;
A pipe for connecting the cooling body, the heat exchanger, and the pump;
Bypass piping provided to bypass the cooling body and to circulate coolant between the pump and the heat exchanger;
A first valve which is provided in the bypass pipe and can be opened and closed;
A second valve that is provided in the pipe on the inflow side to the cooling body and can be opened and closed;
A third valve that is provided in the pipe on the outflow side from the cooling body and can be opened and closed;
When the railway vehicle is running, the first valve is closed, the second valve and the third valve are opened, and when the railway vehicle is stopped, the first valve is opened, and the second valve and the third valve are opened. A liquid-cooled power converter characterized by closing the valve. A cooling body having a flow path in which a semiconductor element is attached and a coolant flows therein;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger;
A fan for cooling the heat exchanger,
A liquid-cooled power conversion device that operates the blower when traveling on a railway vehicle and stops the blower when the railway vehicle stops. A cooling body having a flow path in which a semiconductor element is attached and a coolant flows therein;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger,
A liquid-cooled power converter, wherein the pump is operated when the railway vehicle is running, and the pump is stopped when the railway vehicle is stopped. A cooling body having a flow path in which a semiconductor element is attached and a coolant flows therein;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger;
A fan for cooling the heat exchanger and a temperature detecting means for detecting the temperature of the semiconductor element;
The liquid-cooled power conversion apparatus, wherein the blower performs an acceleration / deceleration operation so as to suppress a temperature change of the semiconductor element detected by the temperature detection means. A cooling body having a flow path in which a semiconductor element is attached and a coolant flows therein;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger;
A fan for cooling the heat exchanger and a temperature detecting means for detecting the temperature of the semiconductor element;
The liquid-cooled power conversion device, wherein the pump performs an acceleration / deceleration operation so as to suppress a temperature change of the semiconductor element detected by the temperature detection means. A semiconductor element for switching;
A cooling body to which the semiconductor element is attached and having a flow path through which a coolant flows;
A heat exchanger for exchanging heat between the cooling body and air;
A pump for circulating a coolant to the cooling body and the heat exchanger,
A liquid-cooled power conversion apparatus characterized in that the semiconductor element is forcibly cooled when traveling on a railway vehicle, and the semiconductor element is not cooled forcibly but is cooled when the railway vehicle is stopped.

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