JP2005166491A - Connector for base board - Google Patents

Connector for base board Download PDF

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Publication number
JP2005166491A
JP2005166491A JP2003404637A JP2003404637A JP2005166491A JP 2005166491 A JP2005166491 A JP 2005166491A JP 2003404637 A JP2003404637 A JP 2003404637A JP 2003404637 A JP2003404637 A JP 2003404637A JP 2005166491 A JP2005166491 A JP 2005166491A
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Japan
Prior art keywords
board
soldering
connector
housing
substrate
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JP2003404637A
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JP4103788B2 (en
Inventor
Hiroshi Nakano
寛 中野
Hiroyoshi Maeso
宏芳 前岨
Noritomo Okamura
憲知 岡村
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2003404637A priority Critical patent/JP4103788B2/en
Priority to US11/000,864 priority patent/US7134910B2/en
Priority to EP04028607A priority patent/EP1538706B1/en
Priority to DE602004009268T priority patent/DE602004009268T2/en
Priority to CNB2004101001667A priority patent/CN1332480C/en
Priority to KR1020040101251A priority patent/KR100679501B1/en
Publication of JP2005166491A publication Critical patent/JP2005166491A/en
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Publication of JP4103788B2 publication Critical patent/JP4103788B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the total size of a connector for a base board. <P>SOLUTION: A mounting groove 15, in which a base board fixing part 30 made of metal can be inserted, is formed on a housing 10. The base board fixing part 30 is composed of a main body part 31, and a soldering part 32 protruding sideward from a lower end part 35 of the main body part 31. The base board fixing part 30 can be fixed to a base board K by putting the housing 10 on the base board K with the base board fixing part 30 inserted in the mounting groove 15, and by soldering the soldering part 32 of the base plate fixing part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、基板用コネクタに関する。   The present invention relates to a board connector.

従来、基板用コネクタの一例として下記特許文献１に記載されたものが知られている。このものは、図１３に示すように、端子金具１を収容したハウジング２を基板３に固定するにあたり、ハウジング２の両側面下端部に側方へ張り出す基板固定部４を一体形成するとともに、この基板固定部４に形成したねじ締付孔５に対して基板３のねじ挿通孔に通したねじ６を締め付けるようにしている。
特開平５−３２６０４９号公報 Conventionally, what was described in the following patent document 1 is known as an example of the board connector. As shown in FIG. 13, when fixing the housing 2 containing the terminal fitting 1 to the substrate 3, the substrate fixing portion 4 projecting sideways is integrally formed at the lower end portions on both sides of the housing 2, The screw 6 passed through the screw insertion hole of the substrate 3 is tightened to the screw tightening hole 5 formed in the substrate fixing portion 4.
JP-A-5-326049

上記した固定構造では、ねじ締付孔５の孔縁にねじ６を食い付かせるようにしているため、強度を保つために基板固定部４の大きさをある程度確保しなければならず、基板用コネクタ全体が大型化し勝ちであった。
本発明は上記のような事情に基づいて完成されたものであって、小型化を図ることを目的とする。 In the fixing structure described above, since the screw 6 is bitten against the hole edge of the screw tightening hole 5, the size of the substrate fixing portion 4 must be secured to some extent in order to maintain the strength. The entire connector was large and won.
The present invention has been completed based on the above circumstances, and aims to reduce the size.

上記の目的を達成するための手段として、請求項１の発明は、コネクタハウジングを基板に対して固定するための基板固定部を備えたものであって、前記基板固定部は、前記コネクタハウジングとは別体の金属板から構成されるとともに、コネクタハウジングに対して装着された状態で前記基板に対して半田付けにより固定可能とされている構成としたところに特徴を有する。   As means for achieving the above object, the invention of claim 1 is provided with a board fixing part for fixing the connector housing to the board, and the board fixing part is connected to the connector housing. Is composed of a separate metal plate and is characterized in that it can be fixed to the substrate by soldering in a state of being mounted on the connector housing.

請求項２の発明は、請求項１に記載のものにおいて、前記基板固定部と前記コネクタハウジングとの間には、半田付け時に半田の流入を許容する半田流入空間が確保されているところに特徴を有する。
請求項３の発明は、請求項１または請求項２に記載のものにおいて、前記基板固定部は、キャリアに対して複数個並列した状態で連結部を介して連結された状態から、前記連結部を切断した後に前記コネクタハウジングに対して装着されるようになっており、前記基板に対して半田付けされる半田付け部は、前記基板固定部のうち前記連結部を設けた端部とは異なる端部に配されているところに特徴を有する。 According to a second aspect of the present invention, in the first aspect of the present invention, a solder inflow space that allows inflow of solder during soldering is secured between the board fixing portion and the connector housing. Have
According to a third aspect of the invention, there is provided the first or second aspect of the invention, wherein the substrate fixing portion is connected to the carrier via a connecting portion in a state where a plurality of the substrate fixing portions are arranged in parallel. Is attached to the connector housing after cutting, and a soldering portion to be soldered to the substrate is different from an end portion of the substrate fixing portion provided with the connecting portion. It is characterized by being arranged at the end.

請求項４の発明は、請求項１ないし請求項３のいずれかに記載のものにおいて、前記コネクタハウジングには、前記基板固定部を差し込み可能な装着溝が形成されるのに対し、前記基板固定部には、前記装着溝の溝縁に対して食い込むことで抜けを規制可能な抜け止め部を有するとともに、この抜け止め部を装着溝の溝縁から退避させるよう弾性変形可能なアーム部が設けられているところに特徴を有する。   According to a fourth aspect of the present invention, in the device according to any one of the first to third aspects, the connector housing is provided with a mounting groove into which the substrate fixing portion can be inserted, whereas the substrate fixing The part has a retaining part that can be prevented from coming off by biting into the groove edge of the mounting groove, and an arm part that can be elastically deformed to retract the retaining part from the groove edge of the mounting groove. It is characterized by

＜請求項１の発明＞
コネクタハウジングに金属板から構成される基板固定部を装着し、その基板固定部を半田付けにより基板に固定するようにしたから、従来のようにねじによりコネクタハウジングを固定するものと比較すると、基板固定部を小型化することができ、もって基板用コネクタ全体の小型化を図ることができる。 <Invention of Claim 1>
Since the board fixing part composed of a metal plate is mounted on the connector housing, and the board fixing part is fixed to the board by soldering, the board is compared with the conventional case where the connector housing is fixed by screws. The fixing portion can be reduced in size, so that the entire board connector can be reduced in size.

＜請求項２の発明＞
基板固定部を半田付けする際に溶融する半田の量が多かった場合でも、その半田が半田流入空間内に流入されるようになっているので、半田が基板上に流れ出すのを防ぐことができる。 <Invention of Claim 2>
Even when a large amount of solder is melted when soldering the board fixing portion, the solder flows into the solder inflow space, so that the solder can be prevented from flowing out onto the board. .

＜請求項３の発明＞
基板固定部のうち連結部を設けた端部とは異なる端部に半田付け部を配するようにしたから、仮に連結部を切断するのに伴ってバリが生じたとしても、そのバリが半田付けに悪影響を及ぼすのを防ぐことができる。 <Invention of Claim 3>
Since the soldering portion is arranged at the end portion different from the end portion where the connecting portion is provided in the board fixing portion, even if a burr is generated when the connecting portion is cut, the burr is soldered. It can prevent adverse effects on the date.

＜請求項４の発明＞
装着溝に基板固定部を差し込む際には、アーム部が弾性変形することで抜け止め部が装着溝の溝縁から退避するようになっているから、基板固定部の差し込みに必要な操作力を低減することができる。これにより、基板固定部の装着作業性を向上させることができる。 <Invention of Claim 4>
When inserting the board fixing part into the mounting groove, the arm part is elastically deformed so that the retaining part is retracted from the groove edge of the mounting groove. Can be reduced. Thereby, the mounting workability | operativity of a board | substrate fixing | fixed part can be improved.

＜実施形態１＞
本発明の実施形態１を図１ないし図１０によって説明する。本実施形態に示す基板用コネクタは、図１ないし図５に示すように、複数本の端子金具２０と、各端子金具２０が装着されるコネクタハウジング１０（以下、単にハウジング１０という）と、ハウジング１０に装着される一対の基板固定部３０とから構成されている。ハウジング１０は、基板固定部３０により基板Ｋに対して固定されるとともに、図示しない相手のハウジングと嵌合可能とされている。なお以下では、ハウジング１０における相手のハウジングとの嵌合面側（図３の右側）を前方とし、また上下方向については図４を除いた各図を基準とする。 <Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. As shown in FIGS. 1 to 5, the board connector shown in the present embodiment includes a plurality of terminal fittings 20, a connector housing 10 (hereinafter simply referred to as a housing 10) to which each terminal fitting 20 is mounted, a housing 10 and a pair of substrate fixing portions 30 to be mounted. The housing 10 is fixed to the substrate K by the substrate fixing portion 30 and can be fitted to a counterpart housing (not shown). In the following, the fitting surface side (the right side in FIG. 3) of the housing 10 with the mating housing is the front, and the vertical direction is based on each drawing excluding FIG.

ハウジング１０は、図１ないし図３に示すように、全体として横長に形成されるとともに、端子金具２０を保持可能な端子保持部１１と、端子保持部１１の周縁から前方へ突出するフード部１２とから構成されている。端子保持部１１には、後方から端子金具２０を挿入可能な端子挿入孔１３が複数設けられている。各端子挿入孔１３は、幅方向に沿って並列した状態で上下２段に配されており、詳しくは下段側に２２個、上段側に１８個ずつ配置されており、特に上段側については９個ずつ図１に示す左右に分けて配置されている。また上段側の各端子挿入孔１３と下段側の各端子挿入孔１３は、互いに幅方向にずれた位置（互い違いの位置）に配されている。   As shown in FIGS. 1 to 3, the housing 10 is formed in a horizontally long shape as a whole, and includes a terminal holding portion 11 that can hold the terminal fitting 20 and a hood portion 12 that protrudes forward from the periphery of the terminal holding portion 11. It consists of and. The terminal holding portion 11 is provided with a plurality of terminal insertion holes 13 into which the terminal fittings 20 can be inserted from the rear. Each terminal insertion hole 13 is arranged in two upper and lower stages in parallel with each other in the width direction. Specifically, 22 terminals are arranged on the lower stage side and 18 pieces are arranged on the upper stage side. They are arranged separately on the left and right shown in FIG. The upper terminal insertion holes 13 and the lower terminal insertion holes 13 are arranged at positions shifted in the width direction (alternate positions).

フード部１２は、前方へ開口する略角筒状に形成されており、前方からは相手のハウジングが内嵌可能とされている。フード部１２の上部における幅方向略中央位置には、相手のハウジングのロックアームが係止することで両ハウジングを嵌合状態に保持可能なロック部１４が下方（内方）へ突出して設けられている。フード部１２（ハウジング１０）の幅方向両側端部には、各基板固定部３０を個別に装着可能な装着溝１５が一対設けられている。なお装着溝１５の構造については、基板固定部３０と共に後に詳しく説明する。   The hood portion 12 is formed in a substantially rectangular tube shape that opens forward, and a mating housing can be fitted from the front. At a substantially central position in the width direction in the upper part of the hood part 12, a lock part 14 that can hold both housings in a fitted state by being locked by a lock arm of the mating housing is provided protruding downward (inward). ing. A pair of mounting grooves 15 in which the board fixing portions 30 can be mounted individually are provided at both end portions in the width direction of the hood portion 12 (housing 10). The structure of the mounting groove 15 will be described in detail later together with the substrate fixing part 30.

端子金具２０は、端子保持部１１から後方へ突出した部分を所定位置から下方へ向けて屈曲させるとともにその下端部を再度後方へ向けて屈曲させた形状となっている。端子金具２０のうち、端子保持部１１の前面（嵌合面）から前方へ突出するとともにフード部１２により取り囲まれる部分が、相手のハウジングに配された相手端子と導通接続可能なコネクタ側接続部２１となっている。一方、端子金具２０の後端部が基板Ｋにプリントされた導電路（図示せず）に対して半田付けにより導通接続される基板側接続部２２とされている。ハウジング１０に対して装着した状態では、上段の端子金具２０と下段の端子金具２０は、図２ないし図４に示すように、幅方向について互いにずれた位置に配されるとともに、上下各段の端子金具２０における基板側接続部２２が前後方向についてほぼ同じ位置に配される。   The terminal fitting 20 has a shape in which a portion protruding rearward from the terminal holding portion 11 is bent downward from a predetermined position and a lower end portion thereof is bent backward again. A portion of the terminal fitting 20 that protrudes forward from the front surface (fitting surface) of the terminal holding portion 11 and is surrounded by the hood portion 12 is a connector-side connection portion that can be conductively connected to the mating terminal disposed in the mating housing. 21. On the other hand, the rear end portion of the terminal fitting 20 is a board-side connecting portion 22 that is conductively connected to a conductive path (not shown) printed on the board K by soldering. When mounted on the housing 10, the upper terminal fitting 20 and the lower terminal fitting 20 are arranged at positions shifted from each other in the width direction as shown in FIGS. The board-side connecting portions 22 in the terminal fitting 20 are arranged at substantially the same position in the front-rear direction.

続いて、基板固定部３０、及び装着溝１５について詳細に説明する。基板固定部３０は、図４ないし図７に示すように、ハウジング１０とは別体の金属板からなり、金属板を所定形状に打ち抜くとともに曲げ加工などを施すことで成形されている。基板固定部３０は、上下方向に沿う略平板状をなす本体部３１と、本体部３１の下端部３５から幅方向に沿って側方へ突出する半田付け部３２とから構成され、全体が正面または背面から見て略Ｌ字型に形成されている（図７）。一方、この基板固定部３０が装着される装着溝１５は、本体部３１がその板面方向に沿って挿入可能とされる本体部収容部１６と、半田付け部３２がその板面方向と直交する方向に沿って挿入可能とされる半田付け部収容部１７とから構成されている。   Next, the substrate fixing part 30 and the mounting groove 15 will be described in detail. As shown in FIGS. 4 to 7, the substrate fixing portion 30 is made of a metal plate that is separate from the housing 10, and is formed by punching the metal plate into a predetermined shape and performing bending or the like. The board fixing part 30 includes a main body part 31 having a substantially flat plate shape along the vertical direction, and a soldering part 32 protruding laterally from the lower end part 35 of the main body part 31 along the width direction. Or it is formed in the substantially L shape seeing from the back (FIG. 7). On the other hand, the mounting groove 15 in which the board fixing portion 30 is mounted has a main body housing portion 16 into which the main body portion 31 can be inserted along the plate surface direction, and a soldering portion 32 orthogonal to the plate surface direction. It is comprised from the soldering part accommodating part 17 which can be inserted along the direction to do.

基板固定部３０のうち本体部３１は、図６に示すように、上部３３（大幅部）、中部３４（中幅部）、下端部３５（小幅部）の順で幅が狭くなるよう３段階の幅寸法を有する段付き状に形成され、半田付け部３２は、連結される下端部３５とほぼ同じ幅寸法に形成されている。これに対し、装着溝１５のうち本体部収容部１６は、本体部３１の上部３３とほぼ同じかそれよりも大きい幅寸法の幅広部１８と、本体部３１の中部３４とほぼ同じかそれよりも大きい幅寸法の幅狭部１９とを上下に繋げた構成とされ、半田付け部収容部１７は、本体部３１の下端部３５及び半田付け部３２とほぼ同じ幅寸法かそれよりも大きい幅寸法に形成されている。   As shown in FIG. 6, the main body 31 of the substrate fixing part 30 has three stages such that the width becomes narrower in the order of the upper part 33 (large part), the middle part 34 (medium width part), and the lower end part 35 (small width part). The soldering portion 32 is formed to have substantially the same width as the lower end portion 35 to be connected. On the other hand, the body housing portion 16 in the mounting groove 15 is substantially the same as or larger than the wide portion 18 having a width dimension substantially the same as or larger than the upper portion 33 of the body portion 31 and the middle portion 34 of the body portion 31. The narrow part 19 having a larger width dimension is connected to the upper and lower parts, and the soldering part accommodating part 17 has a width substantially the same as or larger than the lower end part 35 and the soldering part 32 of the main body part 31. Dimension is formed.

そして、基板固定部３０を装着溝１５内に差し込むと、本体部３１の上部３３における下端側の段部３３ａが、本体部収容部１６の幅広部１８の下端側の段部１８ａに対して突き当たることで、基板固定部３０の下面がハウジング１０の下面と略面一となる位置に位置決めされる。装着状態では、本体部３１の下端部３５と本体部収容部１６の幅狭部１９との間に所定の隙間が空けられるようになっており、この隙間は、側方外部へ開口するとともに半田付け作業時に半田が流入するのを許容する半田流入空間Ｓとなっている。なお半田付け部収容部１７の溝縁の下端部には、半田が流入し易いよう切り欠き１７ａが形成されている（図５）。本体部３１の中部３４における両側縁からは、一対の抜け止め部３６が側方に突出して形成されており、この抜け止め部３６は、装着に伴って本体部収容部１６の幅狭部１９の溝縁に対して食い込むことで基板固定部３０を装着溝１５から抜け止め状態に保持可能とされている。また半田付け部３２の側方への突出寸法は、半田付け部収容部１７の深さとほぼ同じと設定されているので、装着状態では半田付け部３２の突出外端がハウジング１０の外側面とほぼ面一をなす。   Then, when the substrate fixing portion 30 is inserted into the mounting groove 15, the step portion 33 a on the lower end side of the upper portion 33 of the main body portion 31 abuts against the step portion 18 a on the lower end side of the wide portion 18 of the main body portion accommodating portion 16. Thus, the lower surface of the substrate fixing portion 30 is positioned at a position that is substantially flush with the lower surface of the housing 10. In the mounted state, a predetermined gap is formed between the lower end portion 35 of the main body 31 and the narrow portion 19 of the main body accommodating portion 16, and this gap opens to the outside of the side and is soldered. This is a solder inflow space S that allows solder to flow in during the attaching operation. A notch 17a is formed at the lower end of the groove edge of the soldering portion accommodating portion 17 so that the solder can easily flow in (FIG. 5). A pair of retaining portions 36 are formed so as to protrude laterally from both side edges of the middle portion 34 of the main body portion 31, and the retaining portions 36 are formed in the narrow portions 19 of the main body portion accommodating portion 16 when attached. The board fixing portion 30 can be held from the mounting groove 15 in a state where it is prevented from coming off by biting into the groove edge. In addition, since the lateral protrusion dimension of the soldering part 32 is set to be substantially the same as the depth of the soldering part accommodating part 17, the protruding outer end of the soldering part 32 and the outer surface of the housing 10 in the mounted state. Almost flush.

ところで、基板固定部３０は、製造過程では、図８に示すように、幅方向に沿って延出するキャリア３７に対して複数個幅方向に沿って並列した状態で連結された状態とされる。詳しくは、各基板固定部３０は、本体部３１の上端部（半田付け部３２とは反対側（異なる）端部）に形成された連結部３８を介してキャリア３７に連結されており、ハウジング１０に対して装着するにあたっては連結部３８を切断することで各基板固定部３０をキャリア３７から切り離すようにしている。   By the way, in the manufacturing process, as shown in FIG. 8, the substrate fixing unit 30 is connected to a plurality of carriers 37 extending in the width direction in parallel with each other in the width direction. . Specifically, each board fixing portion 30 is connected to the carrier 37 via a connecting portion 38 formed on the upper end portion of the main body portion 31 (the opposite end (different) from the soldering portion 32). When mounting on the board 10, each board fixing part 30 is separated from the carrier 37 by cutting the connecting part 38.

本実施形態は以上のような構造であり、続いてその作用を説明する。金属板を打ち抜くとともに半田付け部３２を曲げ加工することで、図８に示す連鎖端子を形成した後、連結部３８を途中（本体部３１の上端位置とほぼ同じ位置）で切断することで各端子金具２０をキャリア３７から切り離すようにする。一方、ハウジング１０の各端子挿入孔１３内に各端子金具２０を後方から挿入してその組み付けを行う。   This embodiment has the structure as described above, and the operation thereof will be described subsequently. After forming the chain terminal shown in FIG. 8 by punching the metal plate and bending the soldering portion 32, each of the connection portions 38 is cut in the middle (substantially the same position as the upper end position of the main body portion 31). The terminal fitting 20 is separated from the carrier 37. On the other hand, each terminal fitting 20 is inserted into each terminal insertion hole 13 of the housing 10 from the rear side and assembled.

続いて、基板固定部３０をハウジング１０に対して装着する作業を行う。図９及び図１０に示す状態から基板固定部３０をその本体部３１の板面方向に沿って装着溝１５に対して上方から差し込むと、本体部３１が本体部収容部１６内へ、半田付け部３２が半田付け部収容部１７内へそれぞれ進入する。なおこの装着作業では、本体部３１の上端部（連結部３８側の端部）を図示しない治具などによって押し込むことで行うようにしている。中部３４が幅狭部１９内に進入すると、抜け止め部３６が幅狭部１９の溝縁に対して食い込みつつ下降する。そして、上部３３が幅広部１８に進入した後、図６及び図７に示すように、上部３３の段部３３ａが幅広部１８の段部１８ａに対して突き当たることで、それ以上の差し込み動作が規制される。この状態では、本体部３１及び半田付け部３２の下端面がハウジング１０の下端面とほぼ面一状の位置に位置決めされている。またこの状態では、抜け止め部３６が幅狭部１９の溝縁に対して食い込むことでその上方への抜けが規制可能とされている。なお基板固定部３０の装着作業を先に行ってから端子金具２０の装着作業を行うようにしても構わない。   Subsequently, an operation of mounting the substrate fixing portion 30 on the housing 10 is performed. 9 and 10, when the board fixing portion 30 is inserted into the mounting groove 15 along the plate surface direction of the main body portion 31 from above, the main body portion 31 is soldered into the main body housing portion 16. The parts 32 respectively enter the soldering part accommodating parts 17. This mounting operation is performed by pushing the upper end portion (end portion on the connecting portion 38 side) of the main body portion 31 with a jig or the like (not shown). When the middle part 34 enters the narrow part 19, the retaining part 36 descends while biting into the groove edge of the narrow part 19. Then, after the upper portion 33 enters the wide portion 18, as shown in FIGS. 6 and 7, the step portion 33 a of the upper portion 33 abuts against the step portion 18 a of the wide portion 18, so that further insertion operation is performed. Be regulated. In this state, the lower end surfaces of the main body portion 31 and the soldering portion 32 are positioned at a substantially flush position with the lower end surface of the housing 10. Further, in this state, the retaining portion 36 bites into the groove edge of the narrow portion 19 so that upward disengagement can be restricted. Note that the terminal metal 20 may be mounted after the board fixing portion 30 is mounted first.

次に、両基板固定部３０を装着したハウジング１０を基板Ｋに対して固定する作業を行う。ハウジング１０を基板Ｋ上に載置するとともに両基板固定部３０の半田付け部３２を基板Ｋにおける固定予定位置に配置したら、半田付け部３２の周縁部に溶融した半田を付着させる。このとき、溶融させた半田の量が多かった場合でも、その半田が本体部３１の下端部３５と本体部収容部１６の幅狭部１９との間に確保された半田流入空間Ｓ内に流されるようになっているので、半田が基板Ｋ上に流れ出すのが防がれる。付着した半田が固化することで、基板固定部３０が基板Ｋに対して固定される。   Next, an operation of fixing the housing 10 on which both the substrate fixing portions 30 are mounted to the substrate K is performed. When the housing 10 is placed on the substrate K and the soldering portions 32 of the both substrate fixing portions 30 are arranged at the predetermined fixing positions on the substrate K, molten solder is attached to the peripheral portion of the soldering portion 32. At this time, even when the amount of the melted solder is large, the solder flows into the solder inflow space S secured between the lower end portion 35 of the main body portion 31 and the narrow portion 19 of the main body portion accommodating portion 16. Therefore, the solder is prevented from flowing onto the substrate K. The substrate fixing part 30 is fixed to the substrate K as the attached solder is solidified.

引き続いて、各端子金具２０の半田付け作業を連続して行う。各端子金具２０の基板側接続部２２を基板Ｋにおける対応する導電路に配するとともに、基板側接続部２２の周縁部に半田を付着させる。付着した半田が固化することで、基板側接続部２２が導電路に導通接続された状態で基板Ｋに対して固定される。なお端子金具２０の半田付け作業を先に行ってから基板Ｋへの固定作業を行うようにしても構わないが、その場合でも連続的に半田付けを行うことができる。   Subsequently, the soldering operation of each terminal fitting 20 is continuously performed. The board-side connecting portions 22 of the terminal fittings 20 are arranged on the corresponding conductive paths in the board K, and solder is attached to the peripheral edge of the board-side connecting portion 22. As the adhered solder is solidified, the board-side connecting portion 22 is fixed to the board K in a state of being conductively connected to the conductive path. It should be noted that the soldering operation of the terminal fitting 20 may be performed first and then the fixing operation to the substrate K may be performed, but even in that case, the soldering can be performed continuously.

以上説明したように本実施形態によれば、ハウジング１０に金属板から構成される基板固定部３０を装着し、その基板固定部３０を半田付けにより基板Ｋに対して固定するようにしたから、従来のようにねじによりハウジングを固定するものと比較すると、基板固定部３０を小型化することができ、もって基板用コネクタ全体の小型化を図ることができる。しかも、従来のようなねじ締め作業が不要となるのに加えて、基板固定部３０の固定作業と端子金具２０の半田付け作業とを連続して行うことができるので、作業性が良好なものとなっている。   As described above, according to the present embodiment, the substrate fixing part 30 made of a metal plate is attached to the housing 10, and the substrate fixing part 30 is fixed to the substrate K by soldering. Compared to the conventional case in which the housing is fixed with screws, the board fixing portion 30 can be reduced in size, so that the entire board connector can be reduced in size. In addition to the fact that the conventional screw tightening operation is not required, the fixing operation of the substrate fixing portion 30 and the soldering operation of the terminal fitting 20 can be performed continuously, so that the workability is good. It has become.

さらには、基板固定部３０とハウジング１０との間に半田流入空間Ｓを確保するようにしたから、基板固定部３０を半田付けする際に溶融する半田の量が多かった場合でも、その半田が半田流入空間Ｓ内に流入されるようになっているので、半田が基板Ｋ上に流れ出すのを防ぐことができる。   Furthermore, since the solder inflow space S is secured between the board fixing part 30 and the housing 10, even when the amount of solder that melts when the board fixing part 30 is soldered is large, Since it flows into the solder inflow space S, it is possible to prevent the solder from flowing out onto the substrate K.

しかも、基板固定部３０のうち連結部３８を設けた端部とは異なる端部に半田付け部３２を配するようにしたから、仮に連結部３８を切断するのに伴ってバリが生じたとしても、そのバリが半田付けに悪影響を及ぼすのを防ぐことができる。   In addition, since the soldering portion 32 is arranged at an end portion different from the end portion where the connecting portion 38 is provided in the board fixing portion 30, it is assumed that burrs are generated as the connecting portion 38 is cut. However, the burr can be prevented from adversely affecting the soldering.

その上、本実施形態では、上下各段の端子金具２０を幅方向について互いにずれた配置とするとともに、上下各段の端子金具２０における各基板側接続部２２を前後方向についてほぼ同じ位置に配するようにしている。従って、例えば上下各段の端子金具の各基板側接続部を前後方向に互いにずれた配置としたものが前後方向について長大化し勝ちであるのと比較すると、基板用コネクタ全体を前後方向について小型化することができる。   In addition, in the present embodiment, the upper and lower terminal fittings 20 are arranged so as to be shifted from each other in the width direction, and the board-side connection portions 22 of the upper and lower terminal fittings 20 are arranged at substantially the same position in the front and rear direction. Like to do. Therefore, for example, the board connector as a whole is reduced in size in the front-rear direction compared to the case where the board-side connection parts of the upper and lower terminal fittings are displaced from each other in the front-rear direction, which tends to be longer in the front-rear direction. can do.

＜実施形態２＞
次に、本発明の実施形態２を図１１及び図１２によって説明する。実施形態２では、基板固定部３０Ａの構造を変更したものを示す。なおこの実施形態２では、上記した実施形態１と同様の構成については、同一符号を付し、重複する説明は省略する。 <Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, a structure in which the structure of the substrate fixing portion 30A is changed is shown. In addition, in this Embodiment 2, the same code | symbol is attached | subjected about the structure similar to above-mentioned Embodiment 1, and the overlapping description is abbreviate | omitted.

基板固定部３０Ａの本体部３１には、図１１に示すように、略方形の肉抜き部３９が形成されている。この肉抜き部３９は、本体部３１における中部３４に形成されており、これにより中部３４の両側端部には、両持ち状のアーム部４０が一対形成されている。両アーム部４０は、その外側縁に抜け止め部３６を有するとともに、内方へ弾性変形可能とされている。従って、基板固定部３０Ａを装着溝１５内に差し込む際には、抜け止め部３６が幅狭部１９の溝縁に接触するのに伴ってアーム部４０が溝縁から退避するよう内方へ弾性変形することで、食い込みが緩和されることになるので、上記実施形態１と比較して差し込みに必要な操作力を低減することができる。これにより、治具を用いずとも基板固定部３０Ａの差し込み作業を行うことが可能となり、作業性が良好なものとなる。基板固定部３０Ａを正規深さまで差し込むと、図１２に示すように、抜け止め部３６が幅狭部１９の溝縁に食い込むことでその抜けが規制される。   As shown in FIG. 11, a substantially square lightening portion 39 is formed in the main body portion 31 of the substrate fixing portion 30A. The lightening portion 39 is formed in the middle portion 34 of the main body portion 31, and thereby, a pair of both-end-supported arm portions 40 are formed at both end portions of the middle portion 34. Both arm portions 40 have a retaining portion 36 on the outer edge thereof and are elastically deformable inward. Therefore, when the board fixing portion 30A is inserted into the mounting groove 15, the arm portion 40 is elastically inwardly retracted from the groove edge as the retaining portion 36 contacts the groove edge of the narrow portion 19. Since the bite is relieved by the deformation, the operating force required for insertion can be reduced as compared with the first embodiment. As a result, it is possible to perform the insertion work of the substrate fixing portion 30A without using a jig, and the workability is improved. When the substrate fixing portion 30A is inserted to the normal depth, the removal preventing portion 36 bites into the groove edge of the narrow portion 19 as shown in FIG.

＜他の実施形態＞
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれ、さらに、下記以外にも要旨を逸脱しない範囲内で種々変更して実施することができる。
（１）基板固定部の形状などについては任意に変更可能である。例えば実施形態１に記載の基板固定部にアーム部を形成しないような肉抜き部を設けるようにしてもよい。 <Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) The shape and the like of the substrate fixing part can be arbitrarily changed. For example, a thinned portion that does not form an arm portion may be provided in the substrate fixing portion described in the first embodiment.

（２）上記した実施形態において、ハウジングに位置決め用の突起を設けてその突起を基板に設けた位置決め凹部に嵌めることで、両基板固定部の半田付け部を基板における固定予定位置に、各端子金具の基板側接続部を対応する導電路にそれぞれ位置決めするようにしてもよい。
（３）上記した実施形態では、基板固定部における本体部の下端部を中部よりも幅狭に形成することで半田流入空間を確保するものを示したが、例えば本体部の中部及び下端部を同一幅に形成し、装着溝の幅狭部の下端部を部分的に幅広に形成することで半田流入空間を確保するようにしてもよい。
（４）上記した実施形態では、連結部が本体部における半田付け部と反対側の上端部に配された場合を示したが、例えば本体部の側端部に配するようにしてもよい。また本体部の下端部に配するようにしても構わない。 (2) In the above-described embodiment, the positioning projections are provided on the housing, and the projections are fitted into the positioning recesses provided on the substrates, so that the soldered portions of both the substrate fixing portions are placed at the predetermined fixing positions on the substrates. You may make it each position the board | substrate side connection part of a metal fitting to a corresponding conductive path.
(3) In the above-described embodiment, the solder inflow space is ensured by forming the lower end portion of the main body portion of the board fixing portion narrower than the middle portion. The solder inflow space may be secured by forming the same width and forming the lower end portion of the narrow portion of the mounting groove partially wide.
(4) In the above-described embodiment, the case where the connecting portion is arranged on the upper end portion of the main body portion opposite to the soldering portion has been described. However, for example, the connecting portion may be arranged on the side end portion of the main body portion. Moreover, you may make it distribute | arrange to the lower end part of a main-body part.

（５）上記した実施形態２において、アーム部を片持ち状に形成するようにしたものも本発明に含まれる。
（６）上記した実施形態では、端子金具を半田付けにより基板に接続するものを示したが、基板に基板側接続部を圧入して接続する、いわゆるプレスフィット端子を用いたものにも本発明は適用可能である。また端子金具の形態は、略Ｌ字型のものに限らず、ストレート型のものを用いたコネクタにも本発明は適用可能である。また相手のハウジングに雄端子金具を設けたものであって、コネクタ側接続部を雌型に形成したものにも本発明は適用可能である。 (5) In the above-described second embodiment, the present invention includes an arm portion formed in a cantilever shape.
(6) In the above-described embodiment, the terminal fitting is connected to the substrate by soldering. However, the present invention is also applied to what uses a so-called press-fit terminal in which the board-side connecting portion is press-fitted and connected to the substrate. Is applicable. Moreover, the form of the terminal fitting is not limited to a substantially L-shaped configuration, and the present invention can be applied to a connector using a straight-type configuration. The present invention can also be applied to a housing in which a male terminal fitting is provided in a mating housing and the connector side connection portion is formed in a female shape.

本発明の実施形態１に係る基板用コネクタの正面図The front view of the connector for substrates concerning Embodiment 1 of the present invention. 基板用コネクタの背面図Rear view of board connector 図１のＸ−Ｘ線断面図XX sectional view of FIG. 基板用コネクタの平面図Top view of board connector 基板用コネクタの側面図Side view of board connector 図１及び図４のＹ−Ｙ線断面図A cross-sectional view along line YY in FIGS. 1 and 4 図４のＺ−Ｚ線断面図ZZ sectional view of FIG. 各基板固定部をキャリアに連結した状態を示す側面図Side view showing a state where each board fixing part is connected to a carrier 基板固定部を装着溝に差し込む前の状態を示す図１及び図４のＹ−Ｙ線断面図A cross-sectional view taken along line YY in FIGS. 1 and 4 showing a state before the substrate fixing portion is inserted into the mounting groove. 基板固定部を装着溝に差し込む前の状態を示す図４のＺ−Ｚ線断面図ZZ line sectional view of Drawing 4 showing the state before inserting a substrate fixing part into a mounting slot 本発明の実施形態２に係る基板固定部を装着溝に差し込む前の状態を示す図１及び図４のＹ−Ｙ線断面図Sectional view taken along line YY in FIGS. 1 and 4 showing a state before the substrate fixing portion according to the second embodiment of the present invention is inserted into the mounting groove. 基板固定部を装着した状態を示す図１及び図４のＹ−Ｙ線断面図A cross-sectional view taken along the line YY in FIGS. 従来例の斜視図Perspective view of conventional example

符号の説明Explanation of symbols

１０…ハウジング（コネクタハウジング）
１５…装着溝
３０，３０Ａ…基板固定部
３２…半田付け部
３５…下端部（連結部を設けた端部とは異なる端部）
３６…抜け止め部
３７…キャリア
３８…連結部
４０…アーム部
Ｋ…基板
Ｓ…半田流入空間 10. Housing (connector housing)
DESCRIPTION OF SYMBOLS 15 ... Mounting groove 30, 30A ... Board | substrate fixing | fixed part 32 ... Soldering part 35 ... Lower end part (End part different from the edge part which provided the connection part)
36 ... Retaining part 37 ... Carrier 38 ... Connecting part 40 ... Arm part K ... Substrate S ... Solder inflow space

Claims (4)

コネクタハウジングを基板に対して固定するための基板固定部を備えたものであって、
前記基板固定部は、前記コネクタハウジングとは別体の金属板から構成されるとともに、コネクタハウジングに対して装着された状態で前記基板に対して半田付けにより固定可能とされていることを特徴とする基板用コネクタ。 A board fixing part for fixing the connector housing to the board,
The board fixing portion is made of a metal plate separate from the connector housing, and can be fixed to the board by soldering in a state of being mounted on the connector housing. Board connector. 前記基板固定部と前記コネクタハウジングとの間には、半田付け時に半田の流入を許容する半田流入空間が確保されていることを特徴とする請求項１記載の基板用コネクタ。 The board connector according to claim 1, wherein a solder inflow space that allows inflow of solder during soldering is secured between the board fixing portion and the connector housing. 前記基板固定部は、キャリアに対して複数個並列した状態で連結部を介して連結された状態から、前記連結部を切断した後に前記コネクタハウジングに対して装着されるようになっており、
前記基板に対して半田付けされる半田付け部は、前記基板固定部のうち前記連結部を設けた端部とは異なる端部に配されていることを特徴とする請求項１または請求項２記載の基板用コネクタ。 The board fixing part is configured to be attached to the connector housing after cutting the connecting part from a state where the board fixing part is connected to the carrier through a connecting part in parallel.
3. The soldering portion to be soldered to the substrate is arranged at an end portion different from an end portion where the connecting portion is provided in the substrate fixing portion. The board connector described. 前記コネクタハウジングには、前記基板固定部を差し込み可能な装着溝が形成されるのに対し、前記基板固定部には、前記装着溝の溝縁に対して食い込むことで抜けを規制可能な抜け止め部を有するとともに、この抜け止め部を装着溝の溝縁から退避させるよう弾性変形可能なアーム部が設けられていることを特徴とする請求項１ないし請求項３のいずれかに記載の基板用コネクタ。 The connector housing is formed with a mounting groove into which the board fixing part can be inserted, whereas the board fixing part has a stopper that can be prevented from coming off by biting into the groove edge of the mounting groove. 4. The substrate according to claim 1, further comprising an arm portion that is elastically deformable so as to retract the retaining portion from the groove edge of the mounting groove. connector.
JP2003404637A 2003-12-03 2003-12-03 Board connector Expired - Lifetime JP4103788B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003404637A JP4103788B2 (en) 2003-12-03 2003-12-03 Board connector
US11/000,864 US7134910B2 (en) 2003-12-03 2004-12-01 Circuit board connector
EP04028607A EP1538706B1 (en) 2003-12-03 2004-12-02 A connector fixing bracket
DE602004009268T DE602004009268T2 (en) 2003-12-03 2004-12-02 Interconnects
CNB2004101001667A CN1332480C (en) 2003-12-03 2004-12-03 Connector
KR1020040101251A KR100679501B1 (en) 2003-12-03 2004-12-03 A connector

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Application Number Priority Date Filing Date Title
JP2003404637A JP4103788B2 (en) 2003-12-03 2003-12-03 Board connector

Publications (2)

Publication Number Publication Date
JP2005166491A true JP2005166491A (en) 2005-06-23
JP4103788B2 JP4103788B2 (en) 2008-06-18

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Cited By (11)

* Cited by examiner, † Cited by third party
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WO2007080927A1 (en) * 2006-01-12 2007-07-19 Tyco Electronics Amp K.K. Fixer, surface-mount component using the fixer, and mounting structure using the fixer
US7294018B1 (en) 2006-04-25 2007-11-13 Yazaki Corporation Board connector
US7303445B2 (en) 2005-09-26 2007-12-04 Sumitomo Wiring Systems, Ltd. Connector and a connector assembly
JP2008027611A (en) * 2006-07-18 2008-02-07 Tokai Rika Co Ltd Connector structure
JP2008059856A (en) * 2006-08-30 2008-03-13 Sumitomo Wiring Syst Ltd Board connector
JP2009070599A (en) * 2007-09-11 2009-04-02 Shin Etsu Polymer Co Ltd Press contact type connector for electronic equipment, and its connection structure
DE102009048392A1 (en) 2008-11-04 2010-05-12 Sumitomo Wiring Systems, Ltd., Yokkaichi A connector for an electrical device, such as a printed circuit board, and methods for fixing the same
WO2012014782A1 (en) * 2010-07-27 2012-02-02 矢崎総業株式会社 Bracket for securing parts to be mounted on circuit board
JP2012226856A (en) * 2011-04-15 2012-11-15 Sumitomo Wiring Syst Ltd Board connector
JP2014229383A (en) * 2013-05-20 2014-12-08 矢崎総業株式会社 Connector for substrate
JP2019087413A (en) * 2017-11-07 2019-06-06 住友電装株式会社 Board connector

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7303445B2 (en) 2005-09-26 2007-12-04 Sumitomo Wiring Systems, Ltd. Connector and a connector assembly
WO2007080927A1 (en) * 2006-01-12 2007-07-19 Tyco Electronics Amp K.K. Fixer, surface-mount component using the fixer, and mounting structure using the fixer
EP1993172A1 (en) * 2006-01-12 2008-11-19 Tyco Electronics AMP K.K. Fixer, surface-mount component using the fixer, and mounting structure using the fixer
EP1993172A4 (en) * 2006-01-12 2011-03-09 Tyco Electronics Japan G K Fixer, surface-mount component using the fixer, and mounting structure using the fixer
US7294018B1 (en) 2006-04-25 2007-11-13 Yazaki Corporation Board connector
JP2008027611A (en) * 2006-07-18 2008-02-07 Tokai Rika Co Ltd Connector structure
JP2008059856A (en) * 2006-08-30 2008-03-13 Sumitomo Wiring Syst Ltd Board connector
JP2009070599A (en) * 2007-09-11 2009-04-02 Shin Etsu Polymer Co Ltd Press contact type connector for electronic equipment, and its connection structure
JP2010113848A (en) * 2008-11-04 2010-05-20 Sumitomo Wiring Syst Ltd Connector for base plate
DE102009048392A1 (en) 2008-11-04 2010-05-12 Sumitomo Wiring Systems, Ltd., Yokkaichi A connector for an electrical device, such as a printed circuit board, and methods for fixing the same
DE102009048392B4 (en) * 2008-11-04 2014-07-24 Sumitomo Wiring Systems, Ltd. Connector for a printed circuit board and method for fixing the same
WO2012014782A1 (en) * 2010-07-27 2012-02-02 矢崎総業株式会社 Bracket for securing parts to be mounted on circuit board
JP2012028239A (en) * 2010-07-27 2012-02-09 Yazaki Corp Fixing metal fitting of component to be mounted on circuit board
CN102986092A (en) * 2010-07-27 2013-03-20 矢崎总业株式会社 Bracket for securing parts to be mounted on circuit board
US8659911B2 (en) 2010-07-27 2014-02-25 Yazaki Corporation Fixing metal bracket for component mounted on circuit board
JP2012226856A (en) * 2011-04-15 2012-11-15 Sumitomo Wiring Syst Ltd Board connector
JP2014229383A (en) * 2013-05-20 2014-12-08 矢崎総業株式会社 Connector for substrate
JP2019087413A (en) * 2017-11-07 2019-06-06 住友電装株式会社 Board connector

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