JP2005161460A - Cutting device and cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting device capable of highly accurately cutting two channels of a cutting object by injection of a high pressure liquid, and capable of holding individual chips after cutting work. <P>SOLUTION: This cutting device is provided for cutting and dividing the first and second channels of the cutting object into a plurality of chips by injection of the high pressure liquid. This cutting device is characterized by first cutting the first channel in single stroke drawing by injection of the high pressure liquid while supporting a base board by a first support member 30-1 formed with a first through-groove 32-1 corresponding to the first channel, and next cutting the second channel in the single stroke drawing by injection of the high pressure liquid while supporting the base board by a second support member 30-2 formed with a second through-groove 32-2 corresponding to the second channel. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a cutting apparatus and a cutting method for cutting an object by jetting high-pressure liquid.

  The water jet is a jet of high-pressure water formed by applying energy to water by an ultra-high pressure pump or the like, and has a flow velocity of 2 to 3 times the speed of sound, for example. In recent years, methods and apparatuses for cutting various workpieces (workpieces) using this water jet have been developed (see Patent Document 1). In particular, in order to improve cutting efficiency, attention has been focused on abrasive jets in which high-pressure water is mixed with a solid abrasive. This abrasive is a granular material of, for example, about several tens of microns made of a hard material such as garnet, alumina, or silicon carbide. However, these abrasives collide with the object to be cut together with high-pressure water at high speed. Destroy and cut part of the cut material.

  Such water jet cutting has the advantage that cutting can be performed without affecting the object to be cut and the occurrence of burrs on the cut surface can be reduced by the abrasive. Furthermore, even if the cutting line is a curve, in addition to being able to cut without problems, there is also an advantage that it is suitable for cutting composite materials and difficult-to-cut materials. For this reason, in recent years, in order to dice a semiconductor substrate, particularly a packaged substrate, a cutting process using a water jet instead of a conventional cutting blade has been studied.

  By the way, for example, when a thin substrate having a thickness of 1 mm or less is cut by a water jet, the substrate is easily deformed by the water pressure of the water jet, so that it is difficult to cut with high accuracy. Therefore, it is necessary to prevent the deformation of the substrate by placing the substrate to be cut on the support member and cutting the substrate while supporting the substrate by the support member.

  However, in the cutting process using a water jet, not only the substrate but also the support member is simultaneously cut by simply placing the substrate on the support member. For this reason, there is a problem that not only the cutting speed is slowed but also the substrate is lifted up due to the rebound of high-pressure water generated when the support member is cut, and the substrate cannot be cut with high accuracy.

  In order to solve such a problem, as described in Patent Document 2, a through hole is formed in the support member along the cutting line of the substrate, and high pressure water penetrating the substrate is released downward through the through hole. There has been proposed a technique for preventing high-pressure water from hitting and supporting the high-pressure water.

Japanese Utility Model Publication No. 2-15300 JP 2000-246696 A

  However, in order to divide the substrate into a lattice and divide it into a plurality of chips, all the cutting lines in the same direction (first channel) and all the cutting lines in the direction substantially orthogonal to the first channel (first channel) It is necessary to cut two channels (two channels). However, in the method described in Patent Document 2, there is no specific description for dividing the substrate into chips. If the substrate is divided into chips, the support member has two through-holes corresponding to two channels. Cannot be implemented at the same time. For this reason, one of the channels can be cut with high precision by providing a through hole for high pressure water escape in the support member, but the other channel cannot be cut with high precision because there is no through hole. There was a problem.

  Even in the case of a thick substrate that does not need to be supported by a support member during the cutting process, the substrate is completely divided into chips after the first and second channels are cut. It was necessary to hold this chip in some way to prevent it from falling apart.

  Therefore, the present invention has been made in view of the above-described problems, and it is possible to cut two channels of an object to be cut with high precision by jetting high-pressure liquid and to hold individual chips after cutting. It is an object of the present invention to provide a new and improved cutting device and cutting method that are possible.

  In order to solve the above-described problem, according to a first aspect of the present invention, there is provided a cutting apparatus that divides a workpiece into a plurality of chips by cutting a plurality of channels of the workpiece by injection of high-pressure liquid. Provided. The cutting apparatus includes: a high-pressure liquid ejecting unit that ejects a high-pressure liquid onto an object to be cut; and at least one support member having a through groove continuously formed at a position corresponding to one-stroke cutting of any one channel; And one of the channels is cut by one stroke by ejecting the high pressure liquid by the high pressure liquid ejecting means while supporting the object to be cut by any one of the supporting members.

  Here, the “channel” means all cutting lines in the same direction. In addition, “one-stroke cutting” means that the object to be cut is continuously cut by one cutting line without stopping the injection of the high-pressure liquid. Also, “one-line cutting of a channel” means that a line obtained by connecting all the cutting lines included in the channel with one stroke is continuously cut.

  With such a configuration, when at least one channel is cut by one stroke by jetting high-pressure liquid, the workpiece can be cut while being supported by the support member having a through groove corresponding to the channel. For this reason, even when the workpiece is thin, the workpiece can be prevented from being deformed by the pressure of the high-pressure liquid. In addition, the jet of high-pressure liquid that has penetrated the object to be cut can pass through the through groove of the support member and escape. For this reason, it is possible to prevent the jet of the high-pressure liquid from being rebounded by the support member and causing the workpiece to be lifted. Therefore, at least one channel of the object to be cut can be cut with a single stroke with high accuracy.

  The plurality of channels include a first channel and a second channel that is substantially orthogonal to the first channel, and the support member is formed continuously at a position corresponding to one-stroke cutting of the first channel. The first support member having one through groove and the second support member having a second through groove continuously formed at a position corresponding to one-stroke cutting of the second channel are configured. Also good.

  With this configuration, the object to be cut can be divided into a plurality of substantially rectangular chips by cutting the first channel and the second channel orthogonal to each other. When the first channel is cut with a single stroke, the object to be cut can be supported by a first support member having a continuous first through groove that can cut the first channel with a single stroke. On the other hand, when the second channel is cut with a single stroke, the object to be cut can be supported by the second support member having a continuous second through groove that can cut the second channel with a single stroke.

  Thus, by providing the two support members corresponding to the first channel or the second channel, the two channels of the object to be cut can be suitably cut without the support member being divided into a lattice shape. can do. Also, when cutting the first channel, the first support member may not necessarily be used depending on the thickness of the object to be cut, but when cutting the second channel, by using the second support member, An object to be cut that is divided into chips can be held.

  Further, the support member may be configured to include vacuum suction means for vacuum suction of the workpiece. Thereby, a to-be-cut object can be stably fixed on a supporting member at the time of a cutting | disconnection.

  Further, the vacuum suction means may be configured to vacuum-suck each chip area constituting the workpiece. Thereby, the vacuum suction means can support each divided chip and prevent each chip from falling off the support member.

  Moreover, you may comprise so that the said supporting member and to-be-cut object may be adhere | attached by the adhesion member. Thereby, at the time of a cutting process, a to-be-cut object can be stably fixed on a support member, and it can prevent more reliably that each chip | tip will become disjoint after a cutting process. In addition, there is a possibility that warpage occurs when only the first channel is cut with a single stroke, but the warpage is corrected by adhering the work to be cut and the support member with an adhesive member. It becomes possible to cut two channels accurately.

  Further, the adhesive member may be configured to have a property that the adhesive force is reduced by receiving ultraviolet rays. Or you may comprise the said adhesive member so that it may have a property in which adhesive force falls by receiving heat. Thus, at the time of cutting, the object to be cut can be stably fixed to the support member by the strong adhesive member, and after the completion of all the cutting operations, the adhesive member is irradiated with ultraviolet rays. Alternatively, by heating, the adhesive force of the adhesive member is reduced, and the divided chips can be easily picked up.

  Moreover, you may comprise the said adhesive member so that it may be an adhesive tape. Thereby, a support member and a to-be-cut object can be adhered quickly and easily.

  The high-pressure liquid may contain an abrasive. With this configuration, the abrasive that has collided with the object to be cut off scrapes a part of the object to be cut, so that the cutting efficiency by the injection of the high-pressure liquid can be further improved.

  In order to solve the above problems, according to another aspect of the present invention, the object to be cut is cut into a plurality of chips by cutting the first channel and the second channel of the object to be cut by jetting high pressure liquid. A cutting method for splitting is provided. This cutting method includes a first channel cutting step of cutting a first channel by spraying high pressure liquid; a second channel cutting step of cutting a second channel of an object to be cut from which the first channel is cut; ;including. In this second channel cutting step, the second support member having the second through groove continuously formed at a position corresponding to the one-channel writing of the second channel is used to support the object to be cut from the first channel. The second channel is cut by one stroke by spraying high pressure liquid. Thus, when the second channel is cut with a single stroke, by using the second support member, the object to be cut can be cut with high accuracy, and the divided chips are held separately by the second support member. Can be prevented.

  Further, in the first channel cutting step, the high pressure liquid is sprayed while the object to be cut is supported by the first support member having the first through groove continuously formed at a position corresponding to the one-line writing cut of the first channel. Accordingly, the first channel may be cut by one stroke. As a result, even when the object to be cut is thin, the object to be cut can be prevented from being deformed by the pressure of the high-pressure liquid at the time of one-stroke drawing of the first channel, and can be cut with high accuracy.

  Further, in the first channel cutting step, the first channel may be cut by one stroke by spraying high pressure liquid without supporting the object to be cut by the support member. When the object to be cut is relatively thick, the first channel can be suitably cut without being supported by the support member. For this reason, the process of attaching / detaching the first support member can be omitted, and rapid processing becomes possible.

  Further, in the first channel cutting step, the first channel may be cut by one stroke along a line that does not divide the workpiece. Thus, since the object to be cut can be prevented from being divided into a plurality of pieces when the first channel is cut, the first support member can be supported in the second state without dropping a part or all of the object to be cut. It becomes possible to exchange for a member.

  As described above, when the object to be cut is thin and easily deformed by the pressure of the high-pressure liquid, the object to be cut is supported by the support member having a through groove corresponding to each channel when cutting each channel. Can be cut with high pressure liquid. For this reason, at the time of cutting each channel, deformation of the object to be cut due to the pressure of the high pressure liquid and a phenomenon that the object to be lifted due to rebound of the high pressure liquid from the support member can be prevented. The channel can be cut with high precision.

  Furthermore, even when the object to be cut is thick and is not easily deformed by the pressure of the high-pressure liquid, the object to be cut is supported by a support member having a through groove corresponding to the channel when cutting the at least second channel. Thus, after the cutting process, it is possible to prevent the chips from being held apart by the support member.

  As described above, according to the present invention, each channel can be individually cut by one stroke by jetting high-pressure liquid while the object to be cut is supported by the support member in which the through hole corresponding to each channel is formed. . Thus, the workpiece can be cut with high accuracy and divided into a plurality of chips. In addition, after the cutting process, the divided chips can be supported by the holding member and can be prevented from falling apart.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
First, the background and outline of the present invention will be described. The present invention relates to a water jet cutting apparatus that cuts a substrate that is an object to be cut by, for example, spraying high-pressure water containing an abrasive. In this water jet cutting device, unlike a dicing device using a cutting blade, when a substrate is placed on a holding table, it is not possible to cut only the substrate without cutting the holding table. Therefore, some device is required to hold the substrate.

  In addition, in a dicing apparatus using a cutting blade, when the cutting blade is moved to the next cutting line after the cutting process of a certain cutting line is completed, the substrate can be moved without being cut. In contrast, in a water jet cutting device, high pressure water is generated and injected using a high pressure pump or the like, and once these devices such as the high pressure pump are stopped, it takes a very long time to restart. It takes. Therefore, in order to maintain the processing efficiency, when the high-pressure water injection means is moved from one cutting line to the next cutting line, the high-pressure water is not stopped and the substrate is moved while being cut while the high-pressure water is being injected. I do not get.

  From the background described above, in the water jet cutting apparatus described below, for example, a plate-like support member is disposed on the lower side of the substrate to support the substrate to be cut, and for example, two support members are provided. A structure is provided in which each support member is provided with a continuous through hole for high-pressure water escape so that only the first channel or the second channel can be cut, and the substrate is cut by one stroke for each channel.

  In particular, in the first cutting process of the first channel, depending on the thickness of the substrate, there is a thing that does not deform due to the water pressure of the injected high-pressure water. In the channel cutting process, since the substrate is finally divided into chips, it is necessary to support the substrate using a support member in order to prevent these chips from falling apart.

  Next, based on FIG. 1, the outline | summary of the water jet cutting device concerning this embodiment is demonstrated. FIG. 1 is a schematic diagram showing a configuration of a water jet cutting device 10 according to the present embodiment.

  As shown in FIG. 1, the water jet cutting apparatus 10 according to the present embodiment is configured to cut a workpiece with a relatively free cutting line (that is, a water jet) by jetting high-pressure water onto the workpiece. This is an apparatus capable of performing jet processing.

  The water jet cutting device 10 includes, for example, a high pressure water generator 12, an abrasive mixing device 14, an injection nozzle 16, a holding table 18, a support member 30, a table moving device 40, a catch tank 42, And an abrasive recovery device 44.

The high-pressure water generator 12 includes, for example, a high-pressure pump and a motor. The high-pressure water generator 12 pressurizes water supplied from the outside, and has a high pressure of, for example, 600 to 700 bar (1 bar = about 1.02 kgf / cm ² ). Can generate and supply water. The water supplied from the outside is, for example, tap water, but is not limited to this example, and may be pure water or the like. The high-pressure water generated by the high-pressure water generator 12 is supplied to the abrasive mixing device 14 through the high-pressure water pipe.

  The abrasive mixing device 14 mixes abrasives (abrasive grains) at a predetermined ratio with the high-pressure water supplied from the high-pressure water generator 14. This abrasive is a granular material of, for example, about several tens of microns made of a high-hardness material such as garnet, diamond, or alumina, and contributes to increasing the cutting efficiency of high-pressure water. In this embodiment, for example, 40-100 μm alumina oxide is used as the abrasive. The high-pressure water containing such an abrasive is supplied to the injection nozzle 16 via a high-pressure pipe.

  A more specific configuration of the abrasive mixing device 14 will be described. The abrasive mixing device 14 can be composed of, for example, two mixing storage tanks (not shown) and a tank switching device (not shown). The mixed storage tank is a tank for storing water mixed with abrasives. The high-pressure water is supplied from the high-pressure water generator 12 and the abrasives are supplied from an abrasive recovery device 44 described later. The tank switching device is a switching valve or the like for communicating any one of the two mixed storage tanks with the high-pressure water generator 12 and the injection nozzle 16.

  With this configuration, the abrasive and water stored in one of the mixed storage tanks are pushed out at a high pressure and supplied to the injection nozzle 16 by the pressure of the high-pressure water supplied from the high-pressure water generator 12. In the mixed storage tank, the abrasive and water recycled by the abrasive recovery device 44 can be mixed and stored. When the abrasive in one of the mixed storage tanks has decreased below a predetermined level, the mixed storage tank is switched by the tank switching device to supply and store the water containing the abrasive in the same manner as described above. Do. Thereby, the high pressure water mixed with the abrasive can be stably and continuously supplied to the injection nozzle 16.

  The injection nozzle 16 is configured as a high-pressure liquid injection unit according to the present embodiment. For example, high-pressure water mixed with an abrasive as described above is rapidly applied from above to the substrate 20 that is a workpiece. Inject with. During the cutting process, the injection nozzle 16 is stably fixed to a base portion (not shown) of the apparatus by a fixing member such as a screw. In preparation for processing, for example, the injection nozzle 16 can be moved in the Z-axis direction (vertical direction) by loosening the screw. Thereby, according to the kind and magnitude | size of the board | substrate 20, the distance of the Z-axis direction of the injection nozzle 16 and the board | substrate 20 can be adjusted.

  Further, as shown in the partially enlarged view in FIG. 1, an orifice 162 is attached to the tip of the injection nozzle 16. The orifice 162 is a member for reducing the jet diameter of the high-pressure water, and is fixed to the tip of the jet nozzle 16 by screwing the orifice cover 164 with a screw.

  The speed of the jet of high-pressure water (that is, the water jet 168) ejected from the ejection nozzle 16 is about 2 to 3 times the speed of sound, for example. The distance between the tip of the injection nozzle 16 and the substrate 20 is, for example, 50 μm to 1 mm, and is adjusted so that both are as close as possible. Thus, by bringing the injection nozzle 16 and the substrate 20 close to each other, it is possible to suppress the diffusion of the injected high-pressure water as much as possible and prevent the cutting width of the substrate 20 from becoming wide. The diameter of the injection nozzle 16 (the inner diameter of the orifice 166) is, for example, about 250 μm. In this case, the cutting width of the substrate 20 is, for example, about 300 μm.

  Thus, the substrate 20 can be cut by the energy of the high-pressure water by spraying the high-pressure water containing the abrasive onto the substrate 20 by the spray nozzle 16. At this time, the abrasive material collides with the substrate 20 together with the high-pressure water, and a part of the substrate 20 is broken and cut, so that the cutting efficiency can be improved.

  The holding table 18 is a plate-like member made of a hard metal such as stainless steel, for example, and functions as a workpiece holding means for holding and fixing the substrate 20 that is a workpiece. As shown in FIG. 2, the holding table 18 is formed with a table window 182 as an opening for high-pressure liquid passage at a portion where the substrate 20 is fixed. The table window 182 has, for example, a shape (for example, a substantially rectangular shape) corresponding to the substrate 20, and the size thereof is slightly smaller than the outer shape of the substrate 20. By disposing the substrate 20 on the table window 182, the holding table 18 can hold and fix the outer peripheral portion of the base 20, for example. Further, since the high-pressure water sprayed by the spray nozzle 16 passes through the portion of the table window 182, the holding table 18 itself is not cut by the high-pressure water.

  The support member 30 is, for example, a substantially rectangular plate-like member that is mounted on the table window 182 of the holding table 18 and supports the substrate 20 from below. The support member 30 is a characteristic component according to the present embodiment, and details will be described later.

  The table moving device 40 has a function of moving the holding table 18 in the horizontal direction (X-axis and Y-axis directions), for example. As shown in FIG. 2, the table moving device 40 includes a Y-axis direction moving unit 402 and an X-axis direction moving unit, each of which includes a drive mechanism (not shown) such as an electric motor and a gear, and a housing. 404. The Y-axis direction moving unit 402 is connected to, for example, one end of the holding table 18 on the other side of the table window 182 and can move the holding table 18 in the Y-axis direction. The X-axis direction moving unit 404 is connected to one end of the Y-axis direction moving unit 402, for example, and can move the holding table 18 in parallel with the Y-axis direction moving unit 402 in the X-axis direction.

  By moving the holding table 18 in the X-axis and Y-axis directions by such a table moving device 40, the substrate 20 held by the holding table 18 is moved relative to the ejection nozzle 16 in the X-axis and Y-axis directions. Can be made. Thereby, the injection position of the water jet 168 with respect to the board | substrate 20 can be moved, and the board | substrate 20 can be cut | disconnected continuously. The feed rate of the substrate 20 at the time of cutting varies depending on the thickness and material of the substrate 20 to be cut, but is, for example, 20 mm / second.

  The configurations of the holding table 18 and the table moving device 40 are not limited to the example shown in FIG. 2, and various design changes can be made as long as the held base 20 can be moved in the horizontal direction. Further, the holding table 18 may be fixed and the spray nozzle 16 may be configured to be movable in the horizontal direction. In the present embodiment, the substrate 20 is fixed and fixed by the holding table 18, but the present invention is not limited to this example. For example, even if the substrate 20 is held and fixed by various mounting tables, jigs, and the like. Good.

  The catch tank 42 is, for example, a storage tank provided below the holding table 18 and having an open upper surface. The catch tank 42 stores water containing abrasives up to a predetermined height, and the supply and discharge of water are controlled in order to keep the water surface constant. The catch tank 42 uses the stored water as a buffer material to weaken the power of the jet of high-pressure water (that is, the water jet 168) including the abrasive material that cuts and penetrates the substrate 20 as described above. Such high pressure water can be received. Further, the abrasive and water are discharged from the bottom of the catch tank 42. In addition, by introducing the abrasive into the water stored in the catch tank 42, the abrasive can be mixed with water and circulated in the water jet cutting apparatus 10.

  The abrasive recovery device 44 is a device that recovers and reuses the abrasive from the water containing the abrasive discharged from the catch tank 42. The abrasive material recovery device 44 is disposed in, for example, a discharge path, and stores and sends out an abrasive material recovery filter through which an appropriately sized abrasive material can pass and an abrasive material that has passed through the abrasive material recovery filter. A hopper, an abrasive recovery pump for supplying the recovered abrasive to the mixing storage tank of the abrasive mixing device 14, and a drain pump for discharging unnecessary water and abrasive to the outside (none shown) .).

  The abrasive recovery device 44 having such a configuration can recover only the abrasive having a size within a predetermined range suitable for cutting. Specifically, by increasing the flow rate of the water containing the abrasive using the drainage pump, the excessively small abrasive is discharged in the water flow without passing through the abrasive recovery filter. In addition, an excessively large abrasive cannot pass through the abrasive recovery filter and is also discharged together with the waste water. For this reason, only an abrasive having a size within a predetermined range suitable for cutting (for example, when the optimum particle size of the abrasive is about 80 μm, the particle size is in a range of 40 to 120 μm) is used. It is recovered through the recovery filter, sent to the abrasive mixing device 14 and reused. On the other hand, the abrasive and water having a size outside the predetermined range are treated as waste liquid. This is because an excessively small abrasive cannot contribute to polishing even if it is reused, while an excessively large abrasive causes the injection nozzle 16 to be clogged.

  The water jet cutting apparatus 10 configured as described above relatively moves the spray nozzle 16 and the holding table 18 along the cutting line of the substrate 20 while spraying high-pressure water mixed with abrasives from the spray nozzle 16. By doing so, the substrate 20 can be cut. In this cutting process, as described above, once the high-pressure water generator 12 such as a high-pressure pump is stopped, it takes a very long time to restart the operation. It is preferable that a plurality of cutting lines in the same channel are continuously cut (that is, one-stroke cutting) while high-pressure water is jetted from the nozzle 16.

  Next, based on FIG. 3, the board | substrate 20 which is a to-be-cut object concerning this embodiment is demonstrated. FIGS. 3A and 3B are a plan view and a front view showing the substrate 20 that is the object to be cut according to the present embodiment.

  The cutting target of the water jet cutting device 10 as described above is not particularly limited, and examples thereof include a substrate on which a semiconductor element is packaged (hereinafter referred to as a package substrate). Since this package substrate uses a Cu alloy or the like for the lead wire, it is difficult to cut the material depending on the cutting blade. For this reason, in a dicing apparatus using a cutting blade, such a package substrate is regarded as a difficult-to-process material. However, since the water jet cutting apparatus 10 performs the cutting process using the high-pressure water, the package substrate can be suitably cut.

  In the present embodiment, a QFN (Quad Flat Non-Leaded Package) substrate as shown in FIG. 3 will be described as an example of the substrate 20 that is an object to be cut. QFN is one of IC chip packaging methods, and is characterized in that external input / output pins do not appear outside.

  As shown in FIG. 3, the substrate 20 that is a QFN substrate has, for example, a substantially rectangular flat plate shape as a whole, and is formed to protrude from one side of the metal frame 22 as a base and the metal frame 22. And a package portion 24. The package portion 24 is a portion in which a plurality of regularly arranged semiconductor elements are molded with resin, and the outer shape thereof is smaller than the outer shape of the metal frame 22.

  In the package portion 24, in order to divide the package portion 24 into individual semiconductor chips C, first cutting lines Lx1 to Lx6 and second cutting lines Ly1 to Ly5 are defined in a lattice shape, for example. Among these, the first cutting lines Lx1 to Lx6 are a plurality of parallel cutting lines extending in the first direction (X-axis direction), and constitute the first channel CH1. On the other hand, the second cutting lines Ly1 to 5 are a plurality of parallel cutting lines extending in a second direction (Y-axis direction) orthogonal to the first direction, and constitute a second channel CH2. .

  By cutting the first channel CH1 and the second channel CH2 by high-pressure water injection as described above, the package portion 24 of the substrate 20 is diced to form a plurality of semiconductor chips C having a substantially rectangular shape. Can be divided. The first cutting lines Lx 1 to 6 and Ly 1 to 5 are determined to be line segments included inside the substrate 20. Specifically, the first cutting lines Lx1 to Lx6 and the second cutting lines Ly1 to 5 exist only in the inner portion of the substrate 20 where the package portion 24 exists, and the substrate where only the metal frame 22 exists. The outer portion of 20 is not defined. For this reason, even if which cutting line Lx1-6, Ly1-5 is cut | disconnected, the whole board | substrate 20 is not divided into two.

  Further, the substrate 20 has a first cutting start through hole 26 and a second cutting start through hole 28 for waiting the water jet 168 at the start of a single stroke cutting, and a locking pin of the holding table 18 to be described later. For example, the two through holes 29 for the locking pins to be inserted are previously drilled by a drilling means (not shown) separate from the water jet cutting device 10.

  The first cutting start through hole 26 and the second cutting start through hole 28 are larger in diameter than the diameter of the water jet 168 injected from the injection nozzle 16. As described later, the first cutting start through hole 26 and the second cutting start through hole 28 are used for each stroke when cutting the first channel CH1 or the second channel CH2 with high pressure water. It is provided at the location that is the starting point for writing and cutting. For example, the first cutting start through hole 26 is formed at or near the cutting start end of the first cutting line Lx1 to be cut first in the first channel CH1, while the second cutting start through hole is formed. 28 is formed at or near the cutting start end of the second cutting line Ly1 that is cut first in the second channel CH2.

  By forming the first cutting start through-hole 26 and the second cutting start through-hole 28 in advance at the starting point of the one-stroke cutting process, the water jet 168 can It does not act on the substrate 20 through the first cutting start through hole 26 or the second cutting start through hole 28. For this reason, it is possible to reduce the occurrence of fracture burrs and cracks at the starting point of the cutting process of the substrate 20, and it is possible to prevent the substrate 20 from being contaminated by high-pressure water scattering.

  Next, based on FIG. 4, the support member 30 which is the characteristic component of the water jet cutting device 10 concerning this embodiment is demonstrated. 4A is a plan view showing the first support member 30-1 according to the present embodiment, and FIG. 4B is a plan view showing the second support member 30-2 according to the present embodiment. FIG.

  As shown in FIG. 4, the water jet cutting device 10 according to the present embodiment includes, for example, two support members 30 such as a first support member 30-1 and a second support member 30-2. The first support member 30-1 or the second support member 30-2 is selectively attached to the holding table 18.

  Both the first support member 30-1 and the second support member 30-2 are plate members made of metal such as aluminum, and the size thereof corresponds to the package portion 24 of the substrate 20. For example, the length (X-axis direction) is 70 mm, the width (Y-axis direction) is 50 mm, and the thickness (Z-axis direction) is 10 mm. The first support member 30-1 and the second support member 30-2 can support the substrate 20 placed on the upper surface thereof from below.

  The first support member 30-1 and the second support member 30-2 are each formed with a first through groove 32-1 or a second through groove 32-2 continuously in a zigzag shape. Yes. The first through-groove 32-1 and the second through-groove 32-2 (hereinafter may be collectively referred to as the through-groove 32) are a plate-like first support member 30-1 or second support member 30-2. Is formed so as to penetrate in the Z-axis direction, and has a function of cutting the substrate 20 and escaping the high-pressure water penetrating downward. The groove width of the through groove 32 is adjusted to be slightly larger than the diameter of the water jet 168 and the cutting width of the substrate 20 and is, for example, 300 μm or more. Hereinafter, the through groove 32 will be described in more detail.

  First, as shown in FIG. 4A, when the substrate 20 is supported by the first support member 30-1, the first through groove 32-1 has a first cutting line Lx1 that constitutes the first channel CH1. It is continuously formed in a zigzag shape so that .about.6 can be cut with a single stroke. In other words, the first through-groove 32-1 is continuously formed at a position corresponding to the one-line cutting line of the first channel CH1 when the substrate 20 is supported by the first support member 30-1. It is a substantially rectangular wave-shaped through groove.

  Specifically, the first through grooves 32-1 are, for example, six first cutting line escape grooves Vx 1 to 6 that are formed to extend in the direction of the first channel CH 1 (X-axis direction), For example, five first connecting escape grooves Ty1 to T5 that connect end portions of the adjacent first cutting line escape grooves Vx1 to Vx6.

  The first cutting line relief grooves Vx1 to Vx1 to 6 are formed at positions corresponding to the first cutting lines Lx1 to Lx6 of the substrate 20, respectively. For this reason, when the board | substrate 20 is supported by the 1st supporting member 30-1, the 1st cutting line escape grooves Vx1-6 are each arrange | positioned under the 1st cutting line Lx1-6.

  The first connecting relief grooves Ty1 to Ty5 connect the end portions of the adjacent first cutting line escape grooves Vx1 to Vx6 to each other, and are alternately arranged on one side and the other side of the first support member 30-1. Is arranged. Specifically, the first connecting relief groove Ty1 connects one end (for example, the right end) of the first cutting line escape groove Vx1 and one end of Vx2, and Ty2 is the other end (for example, the left end) of Vx2. ) And the other end of Vx3, Ty3 connects one end of Vx3 and one end of Vx4, Ty4 connects the other end of Vx4 and the other end of Vx5, and Ty5 is one end of Vx5. And one end of Vx6 are connected.

  By providing the first through groove 32-1 having such a configuration in the first support member 30-1, when high-pressure water is jetted onto the substrate 20 supported by the first support member 30-1, Without cutting the first support member 30-1, only the first channel CH1 (first cutting lines Lx1 to Lx6) of the substrate 20 can be cut with a single stroke. At this time, since the substrate 20 is supported from below by the first support member 30-1, the substrate 20 is not deformed even when the pressure of the high pressure water is applied from above, and the high pressure water penetrating the substrate 20 is the first through groove. Since it can pass through 32-1 and escape downward, it does not collide with the first support member 30-1 and bounce off to raise the substrate 20.

  Further, at both ends of the first through groove 32-1, for example, a first cutting start through hole 34-1 and a first cutting end through hole 35-1 having a diameter larger than the diameter of the water jet 168 are perforated. Has been. Among these, the 1st cutting start through-hole 34-1 is provided in the position corresponding to the 1st cutting start through-hole 26 of the board | substrate 20 mentioned above. With this configuration, the water jet 168 is passed through the first cutting start through-hole 34-1 or the first cutting end through-hole 35-1 at the start or end of the one-channel writing cutting of the first channel CH1. It is possible to prevent the first support member 30-1 from being damaged by the water jet 168 by waiting.

  On the other hand, as shown in FIG. 4B, when the substrate 20 is supported by the second support member 30-2, the second through-groove 32-2 has a second cutting line Ly1 that constitutes the second channel CH2. It is continuously formed in a zigzag shape so that ˜5 can be cut with a single stroke. In other words, the second through groove 32-2 is continuously formed at a position corresponding to the one-line cutting line of the second channel CH2 when the substrate 20 is supported by the second support member 30-2. It is a substantially rectangular wave-shaped through groove.

  Specifically, the second through grooves 32-2 are, for example, five second cutting line escape grooves Vy1 to V5 that are formed to extend in the direction of the second channel CH2 (Y-axis direction), For example, four second connecting relief grooves Tx1 to Tx4 that connect end portions of the adjacent second cutting line escape grooves Vy1 to Vy5.

  The second cutting line clearance grooves Vy1 to Vy5 are formed at positions corresponding to the second cutting lines Ly1 to Ly5 of the substrate 20, respectively. For this reason, when the board | substrate 20 is supported by the 2nd supporting member 30-2, the 2nd cutting line relief grooves Vy1-5 are arrange | positioned under 2nd cutting line Ly1-5, respectively.

  The second connecting relief grooves Tx1 to Tx4 connect the ends of the adjacent second cutting line escape grooves Vx1 to Vx6 to each other, and are alternately arranged on one side and the other side of the second support member 30-2. Is arranged. Specifically, the second connecting relief groove Tx1 connects one end (for example, the upper end) of the second cutting line escape groove Vy1 and one end of Vy2, and Tx2 is the other end (for example, the lower end) of Vy2. ) And the other end of Vy3, Tx3 connects one end of Vy3 and one end of Vy4, and Tx4 connects the other end of Vy4 and the other end of Vy5.

  By providing the second through groove 32-2 having such a configuration in the second support member 30-2, when high-pressure water is sprayed onto the substrate 20 supported by the second support member 30-2, the second support member 30-2 is provided. Only the second channel CH2 (second cutting lines Ly1 to 5) of the substrate 20 can be cut by one stroke without cutting the member 30-2. At this time, since the substrate 20 is supported from below by the second support member 30-2, the substrate 20 is not deformed even when high-pressure water is applied from above, and the high-pressure water penetrating the substrate 20 is not in the second through groove. Since it passes through 32-2 and escapes downward, it does not collide with the second support member 30-2 and bounce off to raise the substrate 20. Further, when the second channel is cut by one stroke after the first channel is cut by one stroke, the substrate 20 is divided into a plurality of semiconductor chips C. The semiconductor chip C is separated by the second support member 30-2. Because it is supported, it does not fall apart.

  Further, for example, a second cutting start through hole 34-2 and a second cutting end through hole 35-2 having a diameter larger than the diameter of the water jet 168 are formed at both ends of the second through groove 32-2. Has been. Among these, the 2nd cutting start through-hole 34-2 is provided in the position corresponding to the 2nd cutting start through-hole 28 of the board | substrate 20 mentioned above. With this configuration, the water jet 168 is passed through the second cutting start through-hole 34-2 or the second cutting end through-hole 35-2 at the start or end of one-stroke cutting of the second channel CH2. The second support member 30-2 can be prevented from being damaged by the water jet 168 by waiting.

  Next, a method for attaching the substrate 20 and the support member 30 to the holding table 18 as described above and a configuration for supporting and fixing the substrate 20 more stably by the support member 30 will be described. The following description will be divided into a configuration in which the support member 30 includes vacuum suction means (FIG. 5) and a configuration in which the support member 30 and the substrate 20 are adhered by an adhesive tape (FIG. 6). In addition, the supporting member 30 demonstrated to the following FIG.5 and FIG.6 is applied to any one or both of the said 1st supporting member 30-1 or the 2nd supporting member 30-2.

  First, based on FIG. 5, the aspect which supports and fixes the board | substrate 20 with the supporting member 30 provided with the vacuum suction means concerning this embodiment is demonstrated. 5A is a perspective view showing the configuration of the holding table 18 and the support member 30 according to this embodiment, and FIG. 5B is the support attached to the holding table 18 according to this embodiment. It is sectional drawing which shows the member 30, the board | substrate 20, etc. FIG.

  As shown in FIG. 5A, the holding table 18 is provided with, for example, a cover 184 and, for example, two locking pins 186 on the upper surface side. The cover 184 covers and fixes the substrate 20 from above. The locking pin 186 is inserted into the locking pin through hole 29 of the substrate 20 and the locking pin through hole 186 of the cover 184 to lock the substrate 20 and the cover 184.

  When the substrate 20 is attached to the holding table 18, for example, as shown in FIG. 5B, the metal frame 22 is hooked on the peripheral portion of the table 184 so that the package portion 24 faces downward and is fitted into the table window 184. . At this time, the substrate 20 can be accurately positioned by inserting the locking pin through hole 29 of the substrate 20 into the locking pin 186. Further, the metal frame 22 side of the substrate 20 is covered with a cover 184, and the locking pin 185 is inserted into the locking pin through hole 186 of the cover 184.

  By placing the substrate 20 on the upper side of the holding table 18 in this way, the substrate 20 can be fixed to the holding table 18 so that the substrate 20 is not displaced or dropped during the cutting process. The substrate 20 may be firmly fixed to the holding table 18 by locking the metal frame 22 with a claw-shaped stopper (not shown) provided on the upper surface of the holding table 18.

  On the other hand, the support member 30 is mounted so as to be fitted into the table window 184 from the lower side of the holding table 18, for example. At this time, the support member 30 is fixed to the holding table 18 by hooking the lower portions on both sides of the support member 30 with a fixing member such as a stopper 188. The support member 30 thus mounted can support the package portion 24 of the substrate 20.

  Further, the support member 30 shown in FIG. 5 includes vacuum suction means. The vacuum suction means includes, for example, a plurality of suction holes 36 individually provided for each chip region of the substrate 20 on the upper surface of the support member 30, and is provided inside the support member 30 and communicates with the suction holes 36. The suction path 37 and, for example, two suction pipes 38 that connect the suction path 37 and an external vacuum pump (not shown) are configured. By providing the vacuum suction means having such a configuration, the support member 30 can individually hold each chip region of the substrate 20 placed on the upper surface by vacuum suction. Therefore, the support member 30 can support the substrate 20 more stably when the substrate 20 is cut. Further, after the completion of the cutting of the substrate 20, each semiconductor chip C can be attracted and held individually, so that it is possible to more reliably prevent the semiconductor chips C from falling apart and falling off from the support member 30.

  Next, based on FIG. 6, the aspect which supports and fixes the board | substrate 20 with the supporting member 30 and the adhesive tape 50 concerning this embodiment is demonstrated. 6A is a perspective view showing the configuration of the holding table 18, the support member 30 and the adhesive tape 50 according to the present embodiment, and FIG. 6B is the holding table 18 according to the present embodiment. It is sectional drawing which shows the supporting member 30, the board | substrate 20, etc. which were attached.

  As shown in FIG. 6, the substrate 20 is attached to the upper side of the holding table 18, and the support member 30 is attached to the lower side of the holding table 18. Since this attachment method is substantially the same as the example of FIG. 5 described above, detailed description thereof is omitted.

  Further, in the example of FIG. 6, a configuration in which the substrate 20 is fixed on the support member 30 by interposing the adhesive tape 50 between the support member 30 and the substrate 20 instead of the vacuum suction means as described above. Adopted. The adhesive tape 50 is, for example, a heat-foaming type or thermosetting type double-sided tape that self-peels by heat. The pressure-sensitive adhesive tape 50 has a relatively strong pressure-sensitive adhesive force at normal times, but has a property that the pressure-sensitive adhesive force decreases when heated (for example, 50 to 100 ° C.) by infrared irradiation or heat conduction.

  By sticking the upper surface of the support member 30 and the package portion 24 of the substrate 20 with the adhesive tape 50, the support member 30 can more stably hold and fix the substrate 20 when the substrate 20 is cut. Can do. In particular, even when the substrate 20 is greatly warped, the substrate 20 can be suitably held to prevent displacement. In addition, various substrates 20 can be fixed using the same adhesive tape 50 having a strong adhesive force regardless of the size, surface state, material, and the like of the substrate 20, so that there are many types depending on the type of the substrate 20. There is no need to prepare different types of adhesive tape. Furthermore, since the adhesive tape 50 is simply cut by jetting high-pressure water, the cutting efficiency is not reduced.

  Further, even after the substrate 20 is divided into chips, the support member 30 can individually hold the semiconductor chips C via the divided adhesive tape 50. For this reason, it can prevent more reliably that the semiconductor chip C falls apart and falls off from the support member 30.

  Furthermore, when picking up the semiconductor chip C, by heating the adhesive tape 50, for example, the adhesive force of the adhesive tape 50 can be reduced to a slightly adhesive property or self-peeled. For this reason, the semiconductor chip C can be easily peeled off from the adhesive tape 50 and picked up.

  Of the two adhesive surfaces of the adhesive tape 50 that is a double-sided tape, the adhesive surface on the side that adheres to the substrate 20 has a greater adhesive force due to heat than the adhesive surface on the side that adheres to the support member 30. You may comprise so that it may fall. Thus, when the semiconductor chip C is picked up, only the semiconductor chip C can be easily picked up from the support member 30 so that peeling occurs between the semiconductor chip C and the adhesive tape 50.

  The pressure-sensitive adhesive tape 50 is not limited to the above-mentioned thermosetting or heat-foaming pressure-sensitive adhesive tape. For example, an ultraviolet-curing pressure-sensitive adhesive tape having the property that the adhesive strength is reduced by receiving ultraviolet light is used. May be. Further, instead of the adhesive tape 50, an adhesive having a property that the adhesive force is reduced by receiving heat or ultraviolet rays may be used as the adhesive member, and the support member 30 and the substrate 20 may be attached. Good.

  Next, based on FIGS. 7-10, the method to cut | disconnect the board | substrate 20 using the water jet cutting device 10 of the said structure is demonstrated in detail. FIG. 7 is a flowchart showing the cutting method according to the present embodiment. 8 to 10 are process explanatory diagrams for explaining the first channel cutting process, the second channel cutting process, and the pickup process of the cutting method according to the present embodiment.

  The cutting method shown in FIG. 7 is a cutting method when, for example, the substrate 20 to be cut is relatively thick, so that the substrate 20 is not deformed by the water pressure of the injected high-pressure water. In this case, it is not always necessary to support the substrate 20 by the support member 30 in the first first channel cutting step. Therefore, in the cutting method described below, the substrate 20 is supported by the support member 30 only in the second second channel cutting step.

  As shown in FIG. 7, first, in step S102, the substrate 20 is placed on the holding table 18 (step S102). As described above, the substrate 20 is attached and fixed to the upper side of the holding table 18 (see FIGS. 5 and 6). However, the first support member 30-1 need not be attached to the lower side of the holding table 18.

  Next, in step S104, as shown in FIG. 8, the first channel CH1 of the substrate 20 is cut by one stroke by relatively moving the injection nozzle 16 and the substrate 20 while injecting high-pressure water by the injection nozzle 16. (Step S104; first channel cutting step).

  More specifically, first, the ejection table 16 is arranged above the first cutting start through hole 26 of the substrate 20 by moving the holding table 18 in the X-axis and Y-axis directions. At this time, the spray nozzle 16 is not spraying high-pressure water. Next, the high pressure water generator 12 is operated to start high pressure water injection from the injection nozzle 16. The high-pressure water jetted in this way passes through the first cutting start through hole 26 and thus does not contact the substrate 20.

  Next, by moving the holding table 18 at a predetermined speed in the negative X-axis direction, high-pressure water is jetted from the left end to the right end of the first cutting line Lx1, and the first cutting line Lx1 is cut in the X-axis positive direction. Thereafter, the holding table 18 is moved in the positive direction of the Y axis at a predetermined speed to cut a line connecting the right end of the first cutting line Lx1 and the right end of the first cutting line Lx2. Further, by moving the holding table 18 at a predetermined speed in the X-axis positive direction, high-pressure water is jetted from the right end to the left end of the first cutting line Lx2, and the first cutting line Lx2 is cut in the X-axis negative direction. Thereafter, similarly, the first cutting lines Lx3, Lx4, Lx5, and Lx6 are cut alternately in the X axis positive direction and the negative direction.

  In this manner, the substrate 20 is moved by moving the injection nozzle 16 relative to the holding table 18 along the zigzag first-channel one-line drawing cutting line as shown by the thick solid line in FIG. The first channel CH1 is cut with one stroke. As a result, all the first cutting lines Lx1 to Lx1-6 constituting the first channel CH1 are cut, but the one-stroke cutting line is inside the substrate 20 and is not crossed. 20 is not divided (for example, divided into two or partly cut off). After the end of this step, for example, the high pressure water generator 12 is stopped and the injection of the high pressure water from the injection nozzle 16 is stopped.

  Further, in step S106, the second support member 30-2 is attached to the holding table 18 (step S106). As described above, the second support member 30-2 is attached and fixed to the lower side of the holding table 18 (see FIGS. 5 and 6). Thereby, the board | substrate 20 from which the 1st channel CH1 was cut | disconnected by said step S104 is supported by the 2nd support member 30-2 from the downward direction. Further, the second support member 30-2 to be attached may have, for example, a vacuum suction means as shown in FIG. 5 above, or may adhere to the upper surface as shown in FIG. The tape 50 may be affixed. In any case, the second support member 30-2 can stably hold and fix the substrate 20 on the upper surface thereof.

  After that, in step S108, as shown in FIG. 9, the second channel CH2 of the substrate 20 is cut by one stroke by moving the spray nozzle 16 and the substrate 20 relative to each other while spraying high-pressure water by the spray nozzle 16. (Step S108; second channel cutting step).

  More specifically, first, after the injection nozzle 16 is disposed above the second cutting start through hole 28 of the substrate 20, the operation of the high-pressure water generator 12 is started to inject high-pressure water from the injection nozzle 16. The second cutting start through hole 28 is passed. Next, the line connecting the second cutting start through hole 28 and the lower end of the second cutting line Ly1 is cut by the high-pressure water jetted from the jet nozzle 16. Further, by moving the holding table 18 at a predetermined speed in the Y-axis negative direction, high-pressure water is jetted from the lower end to the upper end of the second cutting line Ly1, and the second cutting line Ly1 is cut in the Y-axis positive direction. Thereafter, the holding table 18 is moved in the X-axis negative direction at a predetermined speed, thereby cutting a line connecting the upper end of the second cutting line Ly1 and the upper end of the second cutting line Ly2. Further, by moving the holding table 18 at a predetermined speed in the Y-axis positive direction, high-pressure water is jetted from the upper end to the lower end of the second cutting line Ly2, and the second cutting line Ly2 is cut in the Y-axis negative direction. Thereafter, similarly, the second cutting lines Ly3, Ly4 and Ly5 are cut alternately in the Y-axis positive direction and the negative direction.

  In this way, the injection nozzle 16 is moved relative to the holding table 18 along the zigzag second channel one-line drawing cutting line as shown by the thick solid line in FIG. The second channel CH2 is cut with one stroke. The one-stroke drawing process of the second channel CH2 of the substrate 20 is performed along the second through groove 32-2 corresponding to the second-channel one-stroke drawing line. Therefore, the water jet 168 penetrating the substrate 20 can escape downward through the second through groove 32-2 as shown in FIGS. 9B and 9C. The board 20 is not lifted up by colliding with the support member 30-2 and rebounding. Furthermore, since the substrate 20 is supported by the second support member 30-2 during the cutting process, the substrate 20 is not deformed by the pressure of the high-pressure water. Accordingly, the second channel CH2 can be cut with high accuracy.

  Further, the substrate 20 is divided into a plurality of semiconductor chips C by cutting the second channel CH2, but since the semiconductor chips C are supported by the second support member 30-2, they are separated. It will not fall out. In particular, the individual semiconductor chips C are placed on the second support member 30-2 by vacuum suction by the vacuum suction means as shown in FIG. 9B or by sticking with the adhesive tape 50 as shown in FIG. 9C. By fixing to the semiconductor chip C, it is possible to prevent the semiconductor chip C from falling off more reliably.

  Next, in step S110, the second support member 30-2 is removed from the holding table 18 (step S110). As shown in FIG. 10A, a plurality of semiconductor chips C are placed on the removed second support member 30-2. For this reason, since the plurality of semiconductor chips C can be carried out together with the second support member 30-2 after the cutting process, the water jet apparatus 10 can immediately start the cutting process of the next substrate 20.

  Further, in step S112, as shown in FIGS. 10B and 10C, the semiconductor chip C is picked up from the second support member 30-2 by the pickup means 60 (step S112). At the time of this pickup, as shown in FIG. 10B, the semiconductor chip C can be easily picked up from the second support member 30-2 by releasing the vacuum suction of the vacuum suction means. Moreover, as shown in FIG.10 (c), the adhesive force of the adhesive tape 50 is reduced by mounting the 2nd supporting member 30-2 on the heating apparatus 70, for example, and heating the adhesive tape 50. FIG. Thereby, the semiconductor chip C can be easily peeled from the adhesive tape 50 and picked up.

  Next, another method for cutting the substrate 20 using the water jet cutting device 10 having the above configuration will be described in detail with reference to FIGS. FIG. 11 is a flowchart showing another cutting method according to this embodiment. Moreover, FIG. 12 is process explanatory drawing for demonstrating the 1st channel cutting process of another cutting method concerning this embodiment.

  The cutting method shown in FIG. 11 is a cutting method when, for example, the substrate 20 to be cut is relatively thin, so that the substrate 20 is deformed by the water pressure of the injected high-pressure water. In this case, it is necessary to support the substrate 20 by the support member 30 not only in the second channel cutting step as described above but also in the first channel cutting step. Therefore, in the cutting method described below, the substrate 20 is supported by the support member 30 in both the first and second channel cutting steps.

  As shown in FIG. 11, first, in step S202, the substrate 20 is placed on the holding table 18 (step S202). As described above, the substrate 20 is attached and fixed to the upper side of the holding table 18 (see FIGS. 5 and 6).

  Next, in step S204, the second support member 30-2 is attached to the holding table 18 (step S204). Since this step is substantially the same as step S106 described above except that the first support member 30-1 and the second support member 30-2 are different, detailed description thereof will be omitted.

  Further, in step S206, as shown in FIG. 12, the first channel CH1 of the substrate 20 is cut by one stroke by moving the spray nozzle 16 and the substrate 20 relative to each other while spraying high-pressure water by the spray nozzle 16. (Step S206; first channel cutting step). Similar to FIG. 8 (a) and step S104, the injection nozzle 16 is positioned relative to the holding table 18 along the zigzag first channel one-line drawing cutting line as shown by the thick line in FIG. 12 (a). By moving, only the first channel CH1 of the substrate 20 is cut by one stroke.

  However, in this step, as shown in FIGS. 12B and 12C, while the substrate 20 is supported by the first support member 30-1, the high-pressure liquid is allowed to flow along the above-mentioned first channel one-line drawing cutting line. The first channel CH1 is disconnected by spraying. For this reason, the relatively thin substrate 20 is not deformed by the pressure of the high-pressure water. Further, since the water jet 168 penetrating the substrate 20 can escape downward through the first through-groove 32-1, it can collide with the first support member 30-1 and bounce off to raise the substrate 20. There is no. Therefore, the first channel CH1 can be cut with high accuracy.

  In this way, all the first cutting lines Lx1 to Lx6 constituting the first channel CH1 are cut, but the one-stroke cutting line is inside the substrate 20 and is not crossed. Is never split. After the end of this step, for example, the high pressure water generator 12 is stopped and the injection of the high pressure water from the injection nozzle 16 is stopped.

  Thereafter, in step S208, the first support member 30-2 is removed from the holding table 18 (step S208). As described above, since the substrate 20 is not divided in the first channel cutting step, even if the first support member 30-2 is removed in this step, a part or all of the substrate 20 is dropped. Absent.

  Next, the second support member 30-2 is attached to the holding table 18 (step S210), the second channel CH2 of the substrate 20 is cut by one stroke (step S212), and further, the second support member 30-2 is attached to the holding table. 18 (step S214), and then the semiconductor chip C is picked up from the second support member 30-2 (step S216). Since steps S210 to S216 are substantially the same as steps S106 to S112 described above, detailed description thereof is omitted.

  As described above, according to the water jet cutting apparatus 10 and the cutting method according to the present embodiment, when the substrate 20 is thin and easily deformed by the pressure of the high-pressure liquid, it corresponds to each channel when cutting each channel. The substrate 20 can be supported by the support member 30 having the through-grooves 32 and the high-pressure liquid can be ejected for cutting. Therefore, when each channel is cut, the deformation of the substrate 20 due to the pressure of the high-pressure liquid, the phenomenon of the substrate 20 floating due to the rebound of the high-pressure liquid from the support member 30, and the like can be prevented. Can be cut with high precision.

  Further, even when the substrate 20 is thick and is not easily deformed by the pressure of the high-pressure liquid, the substrate 20 is supported by the support member 30 having the through groove 32 corresponding to the channel at least when the second channel is cut. Thus, it is possible to prevent the individual chips C from being held by the support member 30 and being separated after the cutting process.

  Further, the support member 30 can be made relatively easily and inexpensively, for example, by simply forming the through groove 32 in the plate-like member. For this reason, various support members 30 can be prepared in accordance with the type (size, thickness, shape, cutting line interval, number, etc.) of the substrate 20. For this reason, it is possible to cut various types of substrates 20 with one water jet device 10 without changing the design of the device itself, by simply replacing the support member 30 according to the type of the substrate 20. become.

  The preferred embodiments and examples of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It will be obvious to those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  For example, in the above-described embodiment, the example of the substrate 20 such as the QFN substrate has been described as an object to be cut, but the present invention is not limited to such an example. If the object to be cut has a plurality of cutting lines, for example, a package substrate such as a CSP substrate, a GPS substrate, a BGA substrate, a semiconductor wafer, a sapphire substrate, a glass material, a ceramic material, a metal material, a plastic, etc. It may be a synthetic resin material. Further, the shape of the object to be cut is not limited to a substantially rectangular shape, and may be an arbitrary shape such as a substantially disk shape. Further, the shape of the table window 182, the support member 30, the adhesive tape 50, etc. can be changed to a shape other than a substantially rectangular shape in accordance with the shape of the object to be cut.

  In the above embodiment, the cutting lines Lx and Ly are straight lines, but are not limited to such examples, and may be curved lines. Moreover, in the board | substrate 20 concerning the said embodiment, although 1st channel CH1 and 2nd channel CH2 were orthogonal, it is not limited to this example, When it crosses with predetermined angle (theta) (0 <(theta) <90 degrees). There may be.

  Moreover, although the said embodiment demonstrated the example which employ | adopted the water jet cutting device 10 as a cutting device, this invention is not limited to this example. The cutting apparatus can be variously modified as long as it has a high-pressure liquid injection means for injecting a high-pressure liquid and can cut a workpiece by high-pressure liquid injection. For example, the high-pressure liquid to be ejected is not limited to the above example of high-pressure water, and may be any liquid. Further, it is not always necessary to mix abrasives (abrasive grains) in the high pressure liquid, and the object to be cut may be cut only by the collision energy of the high pressure liquid.

  Further, a plurality of high-pressure liquid ejecting means may be provided in one cutting device so that a plurality of parts or a plurality of objects to be cut can be simultaneously cut. This configuration can be applied, for example, when cutting a package substrate in which a plurality of package portions 24 are formed on one metal frame 22.

  In the water jet cutting apparatus 10, the substrate 20 is cut by moving the holding table 18 holding the substrate 20 while fixing the spray nozzle 16, but the present invention is not limited to such an example. For example, the substrate 20 may be cut by moving the spray nozzle 16 with respect to the substrate 20 fixed on the holding table 18.

  Moreover, although the water jet cutting device 10 according to the above embodiment cuts the substrate 20 substantially vertically, the present invention is not limited to such an example. For example, the substrate 20 may be cut obliquely by tilting the spray nozzle 16 or the substrate 20.

  The present invention can be applied to a cutting device and a cutting method for cutting an object to be cut by jetting high-pressure liquid. In particular, a difficult-to-work material such as a QFN substrate that is difficult to cut by a dicing device having a cutting blade is used as a high-pressure liquid. The present invention can be applied to a cutting apparatus and a cutting method for cutting by jetting.

It is the schematic which shows the structure of the water jet cutting device concerning the 1st Embodiment of this invention. It is a perspective view which shows the structure of the holding table and table moving apparatus concerning the embodiment. It is the top view and front view which show the board | substrate which is a to-be-cut object concerning the embodiment. It is a top view which shows the 1st supporting member and 2nd supporting member concerning the embodiment. FIG. 5A is a perspective view showing the configuration of the holding table and the support member according to the embodiment, and FIG. 5B shows the substrate and the support member attached to the holding table according to the embodiment. It is sectional drawing. FIG. 6A is a perspective view showing the configuration of the holding table, the support member, and the adhesive tape according to the embodiment, and FIG. It is sectional drawing which shows a tape and a supporting member. It is a flowchart which shows the cutting method concerning the embodiment. It is process explanatory drawing for demonstrating the 1st channel cutting process of the cutting method concerning the embodiment. It is process explanatory drawing for demonstrating the 2nd channel cutting process of the cutting method concerning the embodiment. It is process explanatory drawing for demonstrating the pick-up process of the cutting method concerning the embodiment. It is a flowchart which shows another cutting method concerning the embodiment. It is process explanatory drawing for demonstrating the 1st channel cutting process of another cutting method concerning the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Water jet cutting device 12: High pressure water generator 14: Abrasive material mixing device 16: Injection nozzle 18: Holding table 20: Substrate 22: Metal frame 24: Package part 26: First cutting start through hole 28: Second Cutting start through hole 30: support member 30-1: first support member 30-2: second support member 32: through groove 32-1: first through groove 32-2: second through groove 40: table moving device 42: Catch tank 44: Abrasive recovery device 50: Adhesive tape 168: Water jet 182: Table window C: Semiconductor chip Lx: First cutting line Ly: Second cutting line CH1: First channel CH2: Second channel

Claims (13)

A cutting device that divides the workpiece into a plurality of chips by cutting a plurality of channels of the workpiece by jetting high pressure liquid:
High-pressure liquid injection means for injecting high-pressure liquid onto the workpiece;
At least one support member having a through groove continuously formed at a position corresponding to one-stroke cutting of any one of the channels;
With
A cutting apparatus characterized by cutting one of the channels with a single stroke by spraying high-pressure liquid by the high-pressure liquid spraying means while supporting the object to be cut by any one of the support members. . The plurality of channels includes a first channel and a second channel substantially orthogonal to the first channel,
The support member is formed continuously at a position corresponding to the first channel having a first through groove continuously formed at a position corresponding to one-stroke cutting of the first channel, and at a position corresponding to one-stroke cutting of the second channel. The cutting apparatus according to claim 1, comprising one or both of a second support member having a second through groove.   The cutting apparatus according to claim 1, wherein the support member includes a vacuum suction unit that vacuum-sucks the workpiece.   4. The cutting apparatus according to claim 3, wherein the vacuum suction means vacuum-sucks each chip area constituting the workpiece.   The cutting apparatus according to claim 1, wherein the support member and the object to be cut are adhered by an adhesive member.   6. The cutting apparatus according to claim 5, wherein the adhesive member has a property that adhesive force is reduced by receiving ultraviolet rays.   6. The cutting apparatus according to claim 5, wherein the adhesive member has a property that adhesive force is reduced by receiving heat.   The cutting apparatus according to claim 5, wherein the adhesive member is an adhesive tape.   The cutting apparatus according to any one of claims 1, 2, 3, 4, 5, 6, 7, and 8, wherein the high-pressure liquid contains an abrasive. A cutting method for dividing the object to be cut into a plurality of chips by cutting the first channel and the second channel of the object to be cut by jetting high-pressure liquid:
A first channel cutting step of cutting the first channel by spraying high pressure liquid;
High-pressure liquid is sprayed while supporting the object to be cut from the first channel by a second support member having a second through groove continuously formed at a position corresponding to one-stroke cutting of the second channel. A second channel cutting step of cutting the second channel with a single stroke;
A cutting method characterized by comprising: In the first channel cutting step,
By spraying high-pressure liquid while supporting the object to be cut by a first support member having a first through groove formed continuously at a position corresponding to one-stroke cutting of the first channel, the first channel is The cutting method according to claim 10, wherein cutting is performed with a single stroke. In the first channel cutting step,
The cutting method according to claim 10, wherein the first channel is cut with a single stroke by spraying a high-pressure liquid without supporting the object to be cut by a support member. In the first channel cutting step,
The cutting method according to claim 10, wherein the first channel is cut with a single stroke along a line such that the workpiece is not divided.

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