JP2005159067A - Solid-state imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem of a conventional solid-state imaging apparatus provided with a photo diode that electric charges cannot have been completely transferred at a low voltage by arranging a plurality of transfer gates to one photo diode. <P>SOLUTION: Immediately beneath the respective transfer gates 19a, 19b, n-type through-channel layers 21a, 21b are formed on a substrate adjacent to a surface shield region 17, p-type barrier layers 22a, 22b are formed inside the substrate adjacent to an n-type conductive region 16 of a PD 18, and n-type channel forming layers 23 are consecutively formed above the barrier layers 22a, 22b and under the through-channel layers 21a, 21b in a way that the n-type channel forming layers 23 are partly protruded from the n-type conductive region 16 of the PD 18 downwardly to the transfer gates 19a, 19b. The concentration of the n-type channel forming layer 23 is selected a little higher than the concentration of the n-type conductive region 16 of the PD 18. Electric charges generated / stored in a conduction region of the n-type conductive region 16 can be completely transferred even when a plurality of the transfer gates are arranged to the PD 18. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a solid-state imaging device, and more particularly to a solid-state imaging device having a complete transfer photodiode structure.

  Examples of the image pickup element using silicon (Si) include a charge transfer element (CCD) and a CMOS image sensor. Among these, the power supply voltage of the CCD is generally higher than that of a normal large-scale semiconductor integrated circuit (LSI), and is usually 6 V or more. On the other hand, since the CMOS image sensor is configured using the CMOS technology used in the LSI, the power supply voltage is the same as that of the LSI, and is generally 5 V or less, and most is 3.3 V or less. In addition, CCDs are increasingly used for portable terminals and the like, and there is a great demand for lower voltage.

  By the way, it is known that when the power supply voltage is lowered, a transfer residue occurs when charges are transferred from a photodiode through a transfer gate, and problems such as afterimage and kTC noise occur. A solid-state imaging device that solves this problem has been known (see, for example, Patent Document 1). This solid-state imaging device has a cross-sectional structure shown in FIG. 8 (note that the substrate is omitted because it becomes complicated).

  The solid-state imaging device includes a p-well 1 formed on a substrate, an n-type conductive region 2 formed on the p-well 1, and a photodiode (a surface shield region 3 formed on the n-type conductive region 2). PD) 4, a transfer gate 5 formed on the p-well 1 in the vicinity of the surface shield region 3, and a drain 6 formed in the vicinity of the transfer gate 5 on the opposite side of the surface shield region 3. In the unit cell portion of the solid-state imaging device, the n-type through channel layer 7 is formed on the substrate adjacent to the surface shield under the transfer gate 5 and the substrate is adjacent to the n-type conductive region 2 of the PD 4. The same p-type barrier layer 8 is formed at a higher concentration than the p-well 1, and a portion of the n-type conductive region 2 of the PD 4 protrudes below the transfer gate 5 above the barrier layer 8. A channel forming layer 9 of a mold is formed There. The channel formation layer 9 has a slightly higher concentration than the n-type conductive region 2 of the PD 4.

  In this solid-state imaging device, the potential shape of the signal charge 10 when the transfer gate 5 is turned on is as shown in FIG. In the case of electrons, since the potential has the property of falling to the higher potential, it is assumed that the downward direction is drawn positively in this drawing. Further, in this specification, when it is described that the potential is high and low in the future, it is seen from the electron, and the sign is reversed.

  The channel forming layer 9 lowers the potential between the n-type conductive region 2 of the photodiode and the transfer gate 5 and guides the signal charge 10 to the transfer gate 5. The through-channel layer 7 prevents a phenomenon that a low potential charge called a potential pocket accumulates under the transfer gate 5 and acts so that the potential gradient to the drain 6 becomes smooth. Therefore, the signal charge reaching the transfer gate 5 10 reaches the drain 6. That is, as shown in FIG. 9, the potential smoothly forms a gradient from the photodiode to the drain 6. With such a device, the photodiode can be completely transferred even under a low voltage.

JP-A-11-284166

  The above-described conventional solid-state imaging device is effective when the number of transfer gates 5 is one. However, when there are a plurality of transfer gates 5, a problem occurs in the conventional solid-state imaging device. This will be described with reference to FIG. 10A and 10B show a solid-state imaging device in which two transfer gates 5a and 5b are arranged on the left and right of one photodiode. FIG. 10A is a plan view and FIG. 10B is a longitudinal sectional view. In FIG. 8, the same components as those in FIG. 8 are denoted by the same reference numerals, and the left-hand portion of the left-right symmetric components is denoted by the suffix “a”, and the right-hand portion is denoted by the suffix “b”.

  In addition, here, the shape of the n-type conductive region 2 of the photodiode as viewed from above is a square, and the impurity concentration is also between the transfer gates 5a and 5b. Channel formation layers 9a and 9b that are darker than the diode portion are formed.

  Here, when the transfer gate 5b is turned on, the charge (electrons) 11 in the channel formation layer 9a cannot escape from the low potential as shown in FIG. 11, and this becomes a residual charge, which causes kTC noise. Or afterimage.

  There is often a desire to provide a plurality of transfer gates in one photodiode. For example, there is a case where it is desired to select a transfer destination or a case where it is desired to discard the charge of the photodiode and reset it. The conventional structure cannot meet such a request.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a solid-state imaging device capable of performing complete transfer of a photodiode even at a plurality of transfer gates under a low voltage.

  To achieve the above object, the present invention has a first conductivity type well formed on a substrate and a top surface formed in the first conductivity type well having a circular shape, an elliptical shape or a polygonal shape. A photodiode comprising a conductive region of the second conductivity type, and a plurality of second conductivity types regularly arranged in a well of the first conductivity type in the vicinity of the second conductivity type conductive region of the photodiode; A plurality of transfer gates provided between the drain, the conductive region of the second conductivity type of the photodiode and the plurality of drains, and above the well; and a second conductivity type of the photodiode by photoelectric conversion A solid-state imaging device comprising: a second conductivity type channel formation layer that guides charge generated in a conductive region to a substrate immediately below an on-state transfer gate among a plurality of transfer gates, Layer die photo Concentration higher than that of the second conductive type conductive region of the diode and continuous along the outer peripheral edge so that the shape seen from above includes the outer peripheral edge of the second conductive type conductive region of the photodiode In the cross-sectional direction, it is formed in the direction of the substrate directly below the plurality of transfer gates from within the conductive region of the second conductivity type of the photodiode.

  In the present invention, a channel forming layer for reading out charges generated and accumulated in the second conductive type conductive region of the photodiode at a low voltage and guiding them to the transfer gate is provided by the second conductive type conductive region of the photodiode. Is a shape formed along the outer peripheral edge so that the shape seen from the upper surface includes the outer peripheral edge of the conductive region of the second conductivity type of the photodiode, that is, an annular shape, an elliptical ring shape, or Since it is formed in a hollow polygonal shape, the potential of the channel formation layer can be made relatively lower than the potential of the conductive region of the second conductivity type of the photodiode.

  According to the present invention, since the potential of the channel formation layer is made relatively lower than the potential of the second conductive type conductive region of the photodiode, it is generated in the second conductive type conductive region of the photodiode. The accumulated charge can be transferred through the channel formation layer even if there are multiple transfer gates, and collected and transferred to the substrate directly below the turned-on transfer gate, so that the complete charge transfer of the photodiode under a low voltage is possible. It can be performed.

  Next, the best mode for carrying out the present invention will be described with reference to the drawings. 1A and 1B are a top view and a longitudinal sectional view, respectively, of a first embodiment of a solid-state imaging device according to the present invention. The problem with the solid-state imaging device shown in FIG. 10 was that channel forming layers 9a and 9b were made only in the vicinity of transfer gates 5a and 5b. Therefore, the first embodiment is characterized in that a channel forming layer is formed all around the photodiode.

  As shown in FIGS. 1A and 1B, the unit cell portion of the solid-state imaging device according to the present embodiment has a top shape formed on a p well 15 and a p well 15 on a substrate (not shown). A rectangular n-type conductive region 16 and a photodiode (PD) 18 including a p-type surface shield region 17 having a higher concentration than the p-well 15 formed on the n-type conductive region 16 are formed. Therefore, similarly to the n-type conductive region 16, the top surface of the PD 18 has a quadrangular shape. Further, transfer gates 19a and 19b are formed symmetrically on the p well 15 with the surface shield region 17 interposed therebetween, and the drains 20a and 20b are adjacent to the transfer gates 19a and 19b on the opposite side to the surface shield region 17. Is formed.

  Further, n-type through channel layers 21 a and 21 b are formed on the substrate adjacent to the surface shield region 17 immediately below the transfer gates 19 a and 19 b, respectively, and the substrate is adjacent to the n-type conductive region 16 of the PD 18. The same p-type barrier layers 22a and 22b having a higher concentration than the p-well 15 are formed inside, and further above the barrier layers 22a and 22b and below the through-channel layers 21a and 21b, A hollow rectangular column-shaped n-type channel forming layer 23 is formed so as to partially protrude from the type conductive region 16 to below the transfer gates 19a and 19b.

  That is, when viewed from above, the channel forming layer 23 having a width including the outer peripheral edge of the n-type conductive region 16 is continuously formed along the outer periphery of the n-type conductive region 16 having a rectangular shape on the upper surface. . The channel forming layer 23 is slightly higher in concentration than the n-type conductive region 16 of the PD 18. Incident light enters the p-well 15 from the surface shield 17 side in FIG.

  In the solid-state imaging device of the first embodiment having the above structure, when one transfer gate 19b is turned on as in FIG. 10, the potential shape at this time is schematically illustrated in FIG. As shown. The channel formation layer 23 is the same n-type as the n-type conductive region 16 of the photodiode 18, but its impurity concentration is slightly higher. Therefore, as shown in FIG. 2, the n-type conductive region 16 of the photodiode 18 is formed. Since the potential at the channel formation layer 23 is relatively lower than the potential at the center of the n-type conductive region 16 as shown in FIG. 1B by photoelectrically converting incident light. As shown in FIG. 2, the signal charges 25 generated in the first step are transmitted through the channel forming layer 23, and all the charges are discharged through the through channel layer 21b immediately below the transfer gate 19b.

  FIG. 3 is a top view of a second embodiment of the solid-state imaging device according to the present invention. In the figure, the same components as those in FIG. In the second embodiment shown in FIG. 3, two transfer gates 19 b and 19 c are arranged so as to be perpendicular to each other with respect to the channel forming layer 23. An n-type through channel layer is formed on the substrate immediately below the transfer gate 19c, and a drain 20c is formed adjacent to the through channel layer. In the present embodiment as well, the signal charges generated in the n-type conductive region 16 can be completely transferred as in the first embodiment.

  FIG. 4 is a top view of a third embodiment of the solid-state imaging device according to the present invention. In the figure, the same components as those in FIGS. 1 and 3 are denoted by the same reference numerals, and the description thereof is omitted. The third embodiment shown in FIG. 4 is characterized in that a total of four transfer gates 19a, 19b, 19c and 19d, which are connected to the photodiode, are arranged at right angles to the channel forming layer 23. There is.

  An n-type through channel layer is formed on the substrate immediately below the transfer gate 19d, and a drain 20d is formed adjacent to the through channel layer. In the present embodiment, as in the first and second embodiments, the signal charges generated in the n-type conductive region 16 can be completely transferred.

  Thus, when the upper surface shape of the photodiode 18 is a square shape, the arrangement position of the transfer gate can be freely set to any two or more sides of the square as shown by the above 19a to 19d. On the other hand, when the channel forming layer 23 is formed along the outer peripheral edge of the photodiode 18 as described above, if the angle of the corner is small, the height of the potential of the channel forming layer 23 at this corner is: There are cases where the height is higher than the side of the square shape of the upper surface of the photodiode 18 or is lower.

  When the potential is high, it becomes a barrier, and it becomes difficult for the electric charge to flow, and a residual charge is generated. For this reason, it is better that the angle of the corner portion is larger. For this reason, the upper surface shape of the photodiode is preferably a polygonal shape of a quadrangle or more.

  The types of polygons that are quadrangular or more are preferably 24, 16 and 12 but are practically simple in terms of an octagon or less. It is desirable that the polygon is a regular polygon having the same angle at each vertex. Although it may not be a regular polygon due to the arrangement, it may be somewhat distorted, but each angle is preferably larger than 90 degrees. In addition, when the number of vertices of a polygon is small, it is easy to generate a charge residue at each vertex.

  5 and 6 are top views of the fourth and fifth embodiments of the solid-state imaging device according to the present invention. In each figure, the same components as those in FIG. In the fourth and fifth embodiments shown in FIGS. 5 and 6, two transfer gates 19a and 19b are provided at positions where the transfer gates connected to the photodiodes face each other. In the fourth embodiment, the upper surface shape of the photodiode 34 is a regular octagon, and the width of the photodiode 34 is n-type along the outer periphery of the n-type conductive region and including the outer peripheral edge of the n-type conductive region. The n-type channel forming layer 35 continuously formed so as to partially protrude from the conductive region to below the transfer gates 19a and 19b has a hollow octagonal column shape.

  On the other hand, in the fifth embodiment of FIG. 6, the top surface shape of the photodiode 36 is a regular hexagon, and the outer periphery of the n-type conductive region is formed along the outer periphery of the n-type conductive region of the photodiode 36. The n-type channel forming layer 37 that is continuously formed so as to partially protrude from the n-type conductive region to the lower side of the transfer gates 19a and 19b with a width that includes the hollow hexagonal column shape. When the top surface shape of the photodiode and the n-type conductive region constituting the photodiode is a polygon, if the transfer gate is arranged at the corner of the polygon, it becomes difficult to predict the shape of the potential at the time of transfer. As shown in FIGS. 1 and 3 to 6, it is desirable that one side surface portion of the transfer gate having a quadrangular upper surface is disposed on the side portion of the polygon as viewed from the upper surface.

  As the ultimate polygon, the top surface shape of the photodiode may be circular (or elliptical) as shown in the top view of the sixth embodiment of the solid-state imaging device according to the present invention shown in FIG. In FIG. 7, the shape of the photodiode 38 and the n-type conductive region constituting a part thereof is a cylindrical shape which is the most ideal shape. Further, a part of the width of the n-type conductive region extends downward from the n-type conductive region to the lower side of the transfer gates 19a and 19b along the outer periphery of the n-type conductive region of the photodiode 38 and including the outer peripheral edge of the n-type conductive region. In addition, the n-type channel forming layer 39 formed continuously is circular.

  In this case, another problem arises. When the top surfaces of the transfer gates 19a and 19 are square, a part of the transfer gates 19a and 19b overlaps the photodiode 38 in the top view, and an overlap portion as indicated by 41 in FIG. Normally, even if the overlap portion 41 occurs due to mask displacement in the photoresist process, the design is performed with a margin so that the charge transfer is successful. In this case, however, there is a problem that the overlap portion 41 varies depending on the location. . Therefore, it is necessary to increase the design margin.

  On the other hand, a great merit of making the photodiode 38 and the channel forming layer 39 circular or elliptical as shown in FIG. 7 is that the arrangement position of the transfer gate can be freely set.

  Note that the present invention is not limited to the above embodiment, and the top surface shape of the photodiode may be a polygonal shape other than the above embodiment, and the number and arrangement position of the transfer gates are as shown in FIG. It is not limited to FIG. 3 and FIG. Further, the wells, channel forming layers, through channel layers, barrier layers, drains, and the like may be of a conductivity type opposite to that shown in FIG.

It is the top view and longitudinal cross-sectional view of the 1st Embodiment of this invention. It is a three-dimensional schematic diagram of the potential shape of FIG. It is a top view of the 2nd Embodiment of this invention. It is a top view of the 3rd Embodiment of this invention. It is a top view of the 4th Embodiment of this invention. It is a top view of the 5th Embodiment of this invention. It is a top view of the 6th Embodiment of this invention. It is a longitudinal cross-sectional view of an example of the conventional solid-state imaging device. FIG. 9 is a potential schematic diagram when the charge flow (arrow) in FIG. 8 is followed (transfer gate is turned on). It is the apparatus top view and longitudinal cross-sectional view explaining the problem of the conventional solid-state imaging device. FIG. 11 is a potential schematic diagram along the flow of electric charge (arrow) in FIG. 10 (one transfer gate is turned on).

Explanation of symbols

15 p-well 16 n-type conductive region of photodiode 17 surface shield region 18 photodiode (PD)
19a, 19b, 19c, 19d Transfer gate 20a, 20b, 20c, 20d Drain (n)
21a, 21b Through channel layer (n)
22a, 22b Barrier layer (n)
23, 35, 37, 39 Channel forming layer (n)
25 Signal charge 30 Charge flow

Claims (1)

A photo of a first conductivity type well formed on a substrate and a second conductivity type conductive region having a top surface of a circular, elliptical or polygonal shape formed in the first conductivity type well. A plurality of drains of the second conductivity type regularly arranged in the well of the first conductivity type in the vicinity of the conductive region of the second conductivity type of the photodiode; and a second of the photodiode Generated in the second conductive type conductive region of the photodiode by photoelectric conversion between the conductive region of the first conductive type and the plurality of drains and above the well and the transfer gate. A solid-state imaging device comprising: a second conductivity type channel forming layer for guiding charges to a substrate directly below the turned-on transfer gate among the plurality of transfer gates;
The channel formation layer is higher in concentration than the second conductive type conductive region of the photodiode, and the shape seen from above includes the outer peripheral edge portion of the second conductive type conductive region of the photodiode. In the cross-sectional direction, it is formed in the direction of the substrate immediately below the plurality of transfer gates from within the conductive region of the second conductivity type of the photodiode. A solid-state imaging device.

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