JP2005151179A - Directional coupler - Google Patents

Directional coupler Download PDF

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JP2005151179A
JP2005151179A JP2003385851A JP2003385851A JP2005151179A JP 2005151179 A JP2005151179 A JP 2005151179A JP 2003385851 A JP2003385851 A JP 2003385851A JP 2003385851 A JP2003385851 A JP 2003385851A JP 2005151179 A JP2005151179 A JP 2005151179A
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line
sub
main
directional coupler
partial
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JP4154730B2 (en
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Yosuke Matsushita
洋介 松下
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a directional coupler which ensures a sufficient electromagnetic coupling degree even with the chip size reduced, and reduces the insertion loss of a main line. <P>SOLUTION: An internal circuit composed of a main line 2, a sub-line 3, and an electromagnetic coupling part 4 is formed on a dielectric board 5 through an insulation layer 6. The coupling part 4 is covered with the insulation layer 6 to form a chip, and outer terminals 8-1, 8-2, 9-1, 9-2 are mounted on the chip. Concretely, the coupling part 4 is formed with a main branch line 40 of a part of the main line 2, and a sub-branch line 41 of a part of the sub-line 3. The main branch line 40 is composed of a line parts 40a, 40b forming a parallel connection structure, and the sub-branch line 41 is composed of a lines 41a, 41b forming a parallel connection structure. The line lengths of the lines 40a, 40b are set to be equal and those of the lines 41a, 41b are set to be equal. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

この発明は、携帯電話などの移動体通信機に適用される方向性結合器に関するものである。   The present invention relates to a directional coupler applied to a mobile communication device such as a mobile phone.

従来、この種の方向性結合器として、例えば、特許文献1及び特許文献2に開示されたものがある。
特許文献1に開示の方向性結合器は、主線路及び副線路の一部の領域が互いに平行になるようにして、電磁気的結合部を形成すると共に、主線路の線路長を、副線路の線路長よりも短く設定している。具体的には、主線路を、略直線状の線路又は所定の位置で曲折した略直線状の線路で構成し、副線路を、所定の位置で曲折した略直線状の線路をスパイラル状に組み付けて構成している。
このように、主線路の線路長を、副線路の線路長よりも短く設定することで、主線路による挿入損失を低減することができるようになっている。
一方、特許文献2に開示の方向性結合器は、主線路と副線路とを共にスパイラル状に形成して、互いに平行になる部分即ち電磁気的結合部を長く設定している。
このように、電磁気的結合部を長く設定することで、副線路に大きな電力の信号を発生させることができるようになっている。
Conventionally, as this type of directional coupler, for example, there are those disclosed in Patent Document 1 and Patent Document 2.
The directional coupler disclosed in Patent Document 1 forms an electromagnetic coupling portion so that a partial region of the main line and the sub-line are parallel to each other, and the line length of the main line is set to It is set shorter than the track length. Specifically, the main line is composed of a substantially straight line or a substantially straight line bent at a predetermined position, and the sub-line is assembled in a spiral shape with a substantially straight line bent at a predetermined position. Is configured.
Thus, the insertion loss by the main line can be reduced by setting the line length of the main line shorter than the line length of the sub line.
On the other hand, in the directional coupler disclosed in Patent Document 2, the main line and the sub-line are both formed in a spiral shape, and the portions that are parallel to each other, that is, the electromagnetic coupling portion, are set long.
Thus, by setting the electromagnetic coupling portion to be long, a signal with a large electric power can be generated in the sub line.

特開2003−133817号公報JP 2003-133817 A 特開2002−280810号公報JP 2002-280810 A

しかし、上記した従来の方向性結合器では、次のような問題がある。
近年の移動体通信機の小型化に伴い、方向性結合器のチップサイズも非常に小さくなっている。したがって、特許文献1に開示の方向性結合器では、チップサイズの極小化に伴い、副線路の線路長よりも短く設定された主線路の線路長をさらに短くする必要がある。このため、主線路と副線路との電磁気的結合部の長さも短くなり、十分な電磁気的結合度を得ることができなくなる。
一方、特許文献2に開示の方向性結合器では、主線路と副線路とを共にスパイラル状に形成しているので、チップサイズを極小化しても、主線路と副線路との電磁気的結合部の長さを十分確保することができる。しかしながら、主線路がスパイラル状に形成されているので、線路長が長く、このため、主線路による挿入損失が大きくなるという問題がある。
However, the conventional directional coupler described above has the following problems.
With the recent miniaturization of mobile communication devices, the chip size of directional couplers has become very small. Therefore, in the directional coupler disclosed in Patent Document 1, it is necessary to further shorten the line length of the main line set to be shorter than the line length of the sub line as the chip size is minimized. For this reason, the length of the electromagnetic coupling portion between the main line and the sub line is also shortened, and a sufficient degree of electromagnetic coupling cannot be obtained.
On the other hand, in the directional coupler disclosed in Patent Document 2, since both the main line and the sub line are formed in a spiral shape, even if the chip size is minimized, the electromagnetic coupling portion between the main line and the sub line Can be secured sufficiently long. However, since the main line is formed in a spiral shape, the line length is long, and there is a problem that the insertion loss due to the main line becomes large.

この発明は、上述した課題を解決するためになされたもので、チップサイズを小さくした場合においても、十分な電磁気的結合度を確保することができると共に、主線路による挿入損失を低減化することができる方向性結合器を提供することを目的とする。   The present invention has been made to solve the above-described problems. Even when the chip size is reduced, a sufficient degree of electromagnetic coupling can be ensured and insertion loss due to the main line can be reduced. An object of the present invention is to provide a directional coupler capable of

上記課題を解決するために、請求項1の発明は、高周波信号である主信号を伝送する主線路と、この主線路を流れる主信号の電力に対応した副信号を出力する副線路と、主線路の一部である主部分線路と副線路の一部である副部分線路とを平行な状態で近接させることにより構成し、当該主部分線路と副部分線路との電磁気的結合により、主信号に対応した副信号を生じさせる電磁気的結合部とを備える方向性結合器であって、電磁気的結合部の主部分線路及び副部分線路の少なくとも一方を、並列接続構造の一対の線路部で形成すると共に、これら一対の線路部の長さを等しく設定した構成としてある。
かかる構成により、電磁気的結合部の主部分線路が、並列接続構造の一対の線路部で形成されている場合には、主線路に高周波の主信号が伝送されると、主線路を流れる主信号が電磁気的結合部の主部分線路に至り、一対の線路部に分れて流入した後、合流する。このとき、一対の線路部の長さが等しく設定されているので、一方の線路部からの主信号と他方の線路部からの主信号とに位相差が生じることはない。また、主部分線路と副部分線路とが平行な状態で近接し、主信号が主部分線路に流れることにより、主部分線路と副部分線路とが電磁気的に結合し、主信号に対応した副信号が副部分線路に生じる。
このとき、副部分線路が、並列接続構造の一対の線路部で形成されている場合には、主部分線路の一対の線路部に平行な状態で近接しているので、主部分線路と副部分線路との電磁気的結合が強くなり、大きな電力の副信号が副線路に生じることとなる。また、副部分線路の一対の線路部の長さも等しく設定されているので、一方の線路部からの副信号と他方線路部からの副信号とに位相差が生じることはない。
In order to solve the above-described problems, the invention of claim 1 includes a main line that transmits a main signal that is a high-frequency signal, a sub-line that outputs a sub-signal corresponding to the power of the main signal flowing through the main line, The main partial line that is a part of the line and the sub partial line that is a part of the sub line are arranged close to each other in parallel, and the main signal is generated by electromagnetic coupling between the main partial line and the sub partial line. A directional coupler including an electromagnetic coupling section that generates a sub-signal corresponding to the at least one of a main partial line and a sub partial line of the electromagnetic coupling section formed by a pair of line sections having a parallel connection structure In addition, the length of the pair of line portions is set to be equal.
With this configuration, when the main partial line of the electromagnetic coupling portion is formed by a pair of line portions having a parallel connection structure, when a high-frequency main signal is transmitted to the main line, the main signal flowing through the main line Reaches the main partial line of the electromagnetic coupling part, and flows into the pair of line parts and then merges. At this time, since the lengths of the pair of line portions are set to be equal, there is no phase difference between the main signal from one line portion and the main signal from the other line portion. In addition, the main partial line and the sub partial line are close to each other in parallel, and the main signal flows to the main partial line, so that the main partial line and the sub partial line are electromagnetically coupled, and the sub signal corresponding to the main signal is connected. A signal is generated on the sub-partial line.
At this time, when the sub partial line is formed of a pair of line portions having a parallel connection structure, the main partial line and the sub portion are close to each other in parallel with the pair of line portions of the main partial line. The electromagnetic coupling with the line becomes strong, and a large power sub-signal is generated in the sub-line. Further, since the lengths of the pair of line portions of the sub partial line are also set equal, there is no phase difference between the sub signal from one line portion and the sub signal from the other line portion.

請求項2の発明は、請求項1に記載の方向性結合器において、主部分線路の一対の線路部を、主線路の一方部側で分岐して他方部側で合流する第1及び第2の線路部で形成し、当該主線路の一方部側と第1の線路部とを絶縁層の一方側に配すると共に、主線路の他方部側と第2の線路部とを当該絶縁層の他方側に配し、当該第1の線路部の先端を第1のビアホールを介して当該主線路の他方部側と第2の線路部との連続部に接続すると共に、当該第2の線路部の先端を第1のビアホールと同長の第2のビアホールを介して当該主線路の一方部側と第1の線路部との連続部に接続した構成とする。
かかる構成により、主信号は、絶縁層の一方側に配された主線路の一方部側から第1の線路部と第2のビアホールとに分流する。そして、第1の線路部を流れる主信号は第1のビアホールを通じて絶縁層の他方側に配された主線路の他方部側に流れ込む。一方、第2のビアホールを流れる主信号は、絶縁層の他方側に配された第2の線路部に流れ、連続部を通じて主線路の他方部側に流れ込む。このとき、第1及び第2のビアホールが同長であるので、第1の線路部及び第2のビアホールを通じて主線路の他方部側に流れ込む主信号と第2のビアホール及び第2の線路部を通じて主線路の他方部側に流れ込む主信号とに、位相差は生じない。このように主信号が第1及び第2の線路部に流れることによって、第1及び第2の線路部と副線路の副部分線路との間の電磁気的結合がなされ、副信号が副部分線路に誘起される。
According to a second aspect of the present invention, in the directional coupler according to the first aspect, the pair of line portions of the main partial line are branched on one side of the main line and merged on the other side. The one line side of the main line and the first line part are arranged on one side of the insulating layer, and the other side of the main line and the second line part are arranged on the insulating layer. The second line portion is arranged on the other side, and the tip of the first line portion is connected to a continuous portion between the other portion side of the main line and the second line portion via the first via hole. The tip of the first via hole is connected to a continuous portion between the one side of the main line and the first line portion via a second via hole having the same length as the first via hole.
With this configuration, the main signal is diverted from one side of the main line arranged on one side of the insulating layer to the first line portion and the second via hole. The main signal flowing through the first line portion flows into the other side of the main line disposed on the other side of the insulating layer through the first via hole. On the other hand, the main signal flowing through the second via hole flows into the second line portion disposed on the other side of the insulating layer, and flows into the other side of the main line through the continuous portion. At this time, since the first and second via holes have the same length, the main signal flowing into the other side of the main line through the first line portion and the second via hole, and the second via hole and the second line portion. There is no phase difference between the main signal flowing into the other side of the main line. Thus, when the main signal flows through the first and second line portions, electromagnetic coupling is made between the first and second line portions and the sub partial line of the sub line, and the sub signal is transmitted to the sub partial line. Induced by

請求項3の発明は、請求項1または請求項2に記載の方向性結合器において、副部分線路の一対の線路部を、副線路の一方部側で分岐して他方部側で合流する第3及び第4の線路部で形成し、当該副線路の一方部側と第3の線路部とを絶縁層の一方側に配すると共に、副線路の他方部側と第4の線路部とを絶縁層の他方側に配し、当該第3の線路部の先端を第3のビアホールを介して当該副線路の他方部側と第4の線路部との連続部に接続すると共に、当該第4の線路部の先端を第3のビアホールと同長の第4のビアホールを介して当該副線路の一方部側と第3の線路部との連続部に接続した構成とする。
かかる構成により、主部分線路の一対の線路部が、請求項2に記載の方向性結合器のごとく、主線路の一方部側で分岐して他方部側で合流する第1及び第2の線路部で形成されている場合には、上記のごとく、主信号が第1及び第2の線路部に流れることによって、第1及び第2の線路部と副部分線路の第3及び第4の線路部との間の電磁気的結合がなされ、副信号が第3及び第4の線路部に誘起される。そして、第3の線路部及び第3のビアホールに誘起された副信号が、連続部を介して副線路の一方部側に出力される。また、第4の線路部及び第4のビアホールに誘起された副信号も、当該連続部を介して副線路の一方部側に出力される。このとき、第3及び第4のビアホールが同長であるので、第3の線路部及び第3のビアホールを通じて副線路の一方部側に出力される副信号と第4のビアホール及び第4の線路部を通じて副線路の一方部側に出力される副信号とに、位相差は生じない。
According to a third aspect of the present invention, in the directional coupler according to the first or second aspect, the pair of line portions of the sub partial line is branched on one side of the sub line and joined on the other side. 3 and the fourth line portion, and one side of the sub line and the third line portion are arranged on one side of the insulating layer, and the other side of the sub line and the fourth line portion are arranged. It is arranged on the other side of the insulating layer, and the tip of the third line portion is connected to a continuous portion between the other portion side of the sub-line and the fourth line portion through a third via hole, and the fourth line portion The tip of the line portion is connected to a continuous portion of one side of the sub-line and the third line portion via a fourth via hole having the same length as the third via hole.
With such a configuration, the first and second lines in which the pair of line portions of the main partial line branches on one side of the main line and merges on the other side, like the directional coupler according to claim 2. In this case, the main signal flows through the first and second line sections as described above, so that the third and fourth lines of the first and second line sections and the sub-partial line are formed. Electromagnetic coupling is established between the first and second sections, and a sub-signal is induced in the third and fourth line sections. Then, the sub signal induced in the third line portion and the third via hole is output to one side of the sub line via the continuous portion. Further, the sub signal induced in the fourth line portion and the fourth via hole is also output to one side of the sub line via the continuous portion. At this time, since the third and fourth via holes have the same length, the sub signal output to one side of the sub line through the third line portion and the third via hole, the fourth via hole, and the fourth line are output. There is no phase difference between the sub signal output to one side of the sub line through the unit.

請求項4の発明は、請求項1に記載の方向性結合器において、主線路と副線路とを、絶縁層を介して積層すると共に、主線路の主部分線路と副線路の副部分線路とを、絶縁層を介して対向させることで、電磁気的結合部を構成した。   According to a fourth aspect of the present invention, in the directional coupler according to the first aspect, the main line and the sub line are laminated via an insulating layer, and the main partial line of the main line and the sub partial line of the sub line are Were made to face each other through an insulating layer to constitute an electromagnetic coupling portion.

請求項5の発明は、請求項1ないし請求項3のいずれかに記載の方向性結合器において、主線路を、略直線状または所定の個所で曲折した略直線状をなし、且つスパイラル状に周回しない線路に形成し、副線路を、スパイラル状に周回する線路に形成した構成とする。   According to a fifth aspect of the present invention, in the directional coupler according to any one of the first to third aspects, the main line has a substantially straight line shape or a substantially straight line shape that is bent at a predetermined position, and has a spiral shape. The line is formed in a line that does not circulate, and the sub line is formed in a line that circulates in a spiral shape.

請求項6の発明は、請求項1ないし請求項5のいずれかに記載の方向性結合器において、主線路の全線長を、副線路の全線長よりも短く設定した構成とする。   The invention of claim 6 is the directional coupler according to any one of claims 1 to 5, wherein the total length of the main line is set shorter than the total length of the sub-line.

請求項7の発明は、請求項1ないし請求項6のいずれかに記載の方向性結合器において、主部分線路の線長と副部分線路の線長とを、等しく設定した構成とする。   The invention of claim 7 is the directional coupler according to any one of claims 1 to 6, wherein the line length of the main partial line and the line length of the sub partial line are set equal.

請求項8の発明は、請求項1ないし請求項7のいずれかに記載の方向性結合器において、副線路の線幅を、主線路の線幅よりも狭く設定した構成とする。   The invention according to claim 8 is the directional coupler according to any one of claims 1 to 7, wherein the line width of the sub-line is set to be narrower than the line width of the main line.

以上説明したように、この発明の方向性結合器によれば、電磁気的結合部の主部分線路及び副部分線路の少なくとも一方を、並列接続構造の一対の線路部で形成したので、チップサイズを小さくして、主線路または副線路の長さを短くしても、主部分線路と副部分線路との十分な電磁気的結合が確保され、大きな電力の副信号を得ることができる。さらに、当該一対の線路部の長さが等しく設定されているので、一対の線路部の結合部で合流する主信号または副信号に位相差が生ぜず、主部分線路及び副部分線路の少なくとも一方を一対の線路部で形成したことによって生じるおそれのある主線路または副線路の電力損失を防止することができるという効果がある。特に、主部分線路及び副部分線路の双方を、並列接続構造の一対の線路部で形成することで、主部分線路と副部分線路との電磁気的結合度がさらに強くすることができ、この結果、さらに大きな電力の副信号を得ることができる。   As described above, according to the directional coupler of the present invention, since at least one of the main partial line and the sub partial line of the electromagnetic coupling portion is formed by the pair of line portions of the parallel connection structure, the chip size is reduced. Even if the length of the main line or the sub-line is shortened by reducing the length, sufficient electromagnetic coupling between the main partial line and the sub-partial line is ensured, and a large power sub-signal can be obtained. Further, since the lengths of the pair of line portions are set to be equal, there is no phase difference in the main signal or the sub signal joined at the coupling portion of the pair of line portions, and at least one of the main partial line and the sub partial line There is an effect that it is possible to prevent the power loss of the main line or the sub-line that may be caused by forming a pair of line sections. In particular, by forming both the main partial line and the sub partial line with a pair of line portions having a parallel connection structure, the degree of electromagnetic coupling between the main partial line and the sub partial line can be further increased. Further, it is possible to obtain a sub signal with higher power.

また、請求項5の発明に係る方向性結合器よれば、副線路を、スパイラル状に周回する線路に形成しているので、電磁気的結合部の副部分線路を長くすることができ、主部分線路と副部分線路との電磁気的結合度をさらに高めることができる。   Further, according to the directional coupler according to the invention of claim 5, since the sub-line is formed in the line that circulates in a spiral shape, the sub-part line of the electromagnetic coupling part can be lengthened, and the main part The degree of electromagnetic coupling between the line and the sub partial line can be further increased.

また、請求項6の発明に係る方向性結合器よれば、主線路の全線長を、副線路の全線長よりも短く設定したので、主線路による挿入損失を低減化することができる。   In the directional coupler according to the invention of claim 6, since the total length of the main line is set shorter than the total length of the sub-line, the insertion loss due to the main line can be reduced.

また、請求項8の発明に係る方向性結合器によれば、副線路の線幅を主線路の線幅よりも狭く設定したので、僅かなパターン形成領域に設けた主線路と副線路においても、方向性を大きくすることができる。この結果、特性を損なうことなく、方向性結合器のサイズをさらに小さくすることができる。   In the directional coupler according to the invention of claim 8, since the line width of the sub-line is set narrower than the line width of the main line, the main line and the sub-line provided in a slight pattern formation region The directionality can be increased. As a result, the size of the directional coupler can be further reduced without impairing the characteristics.

以下、この発明の最良の形態について図面を参照して説明する。   The best mode of the present invention will be described below with reference to the drawings.

図1は、この発明の第1実施例に係る方向性結合器をの分解斜視図であり、図2は、主線路及び副線路を構成する下層側の内部導体パターンを示す平面図であり、図3は、絶縁層を示す平面図であり、図4は、主線路及び副線路を構成する上層側の内部導体パターンを示す平面図であり、図5は、方向性結合器の外観図である。
図1に示すように、この実施例の方向性結合器1においては、主線路2と副線路3と電磁気的結合部4とを有してなる内部回路を、誘電体基板5上に絶縁層6を介して形成し、その上に、絶縁層7で被覆することでチップを構成している。そして、このチップに外部端子8−1,8−2,9−1,9−2を取り付けた構造になっている。
FIG. 1 is an exploded perspective view of a directional coupler according to a first embodiment of the present invention, and FIG. 2 is a plan view showing an internal conductor pattern on a lower layer side constituting a main line and a sub line, FIG. 3 is a plan view showing the insulating layer, FIG. 4 is a plan view showing an internal conductor pattern on the upper layer side constituting the main line and the sub line, and FIG. 5 is an external view of the directional coupler. is there.
As shown in FIG. 1, in the directional coupler 1 of this embodiment, an internal circuit having a main line 2, a sub line 3, and an electromagnetic coupling portion 4 is provided on a dielectric substrate 5 with an insulating layer. The chip is formed by covering with an insulating layer 7 thereon. And it has the structure which attached external terminal 8-1, 8-2, 9-1, 9-2 to this chip | tip.

主線路2は、高周波信号である主信号を伝送するための線路であり、主線路導体パターン20,21で構成されている。
具体的には、図2に示すように、主線路導体パターン20は、誘電体基板5の上縁左隅に位置する端子20aから誘電体基板5の左側辺に沿って延出した後、所定個所で右側へ曲折したL字状のパターンである。また、主線路導体パターン21は、図1に示すように、絶縁層6を介して主線路導体パターン20の上方に配されている。この主線路導体パターン21は、図4に示すように、主線路導体パターン20上に積層された絶縁層6上に形成されており、その形状は、主線路導体パターン20と線対称をなし、その端子21aが絶縁層6の上縁右隅に位置している。このような主線路導体パターン20,21で構成された主線路2は、平面視において略U字状をなし、スパイラル状に周回していない。すなわち、主線路2の全線長は、後述するスパイラル状の副線路3の全長よりも短く設定されている。
The main line 2 is a line for transmitting a main signal, which is a high-frequency signal, and is composed of main line conductor patterns 20 and 21.
Specifically, as shown in FIG. 2, the main line conductor pattern 20 extends from the terminal 20 a located at the left corner of the upper edge of the dielectric substrate 5 along the left side of the dielectric substrate 5, and then, at a predetermined location. This is an L-shaped pattern bent to the right. Further, as shown in FIG. 1, the main line conductor pattern 21 is disposed above the main line conductor pattern 20 via the insulating layer 6. As shown in FIG. 4, the main line conductor pattern 21 is formed on the insulating layer 6 laminated on the main line conductor pattern 20, and the shape thereof is line-symmetric with the main line conductor pattern 20. The terminal 21 a is located at the upper right corner of the insulating layer 6. The main line 2 composed of the main line conductor patterns 20 and 21 has a substantially U shape in a plan view and does not circulate in a spiral shape. That is, the total line length of the main line 2 is set to be shorter than the total length of a spiral sub-line 3 described later.

一方、図1において、副線路3は、主線路2の主信号の電力に対応した副信号を出力する線路であり、副線路導体パターン30,31で構成され、平面視においてスパイラル状をなす。
具体的には、図2に示すように、副線路導体パターン30は、誘電体基板5の下縁左隅に位置する端子30aから右方向に水平に延出した後、上方に曲折し、誘電体基板5の上縁近傍で曲折して、主線路導体パターン20の端子20a側に水平に延出する。その後、副線路導体パターン30は、主線路導体パターン20の形状に沿ってL字状に曲折し、その先端を主線路導体パターン20の先端に揃えている。また、副線路導体パターン31は、図1に示すように、絶縁層6を介して副線路導体パターン30の上方に配されている。この副線路導体パターン31も、図4に示すように、絶縁層6上に形成されており、その形状は、副線路導体パターン30と線対称をなし、その端子31aは、絶縁層6の下線右隅に位置している。
On the other hand, in FIG. 1, the sub-line 3 is a line that outputs a sub-signal corresponding to the power of the main signal of the main line 2, is composed of sub-line conductor patterns 30 and 31, and has a spiral shape in plan view.
Specifically, as shown in FIG. 2, the sub-line conductor pattern 30 extends horizontally from the terminal 30a located at the lower left corner of the dielectric substrate 5 in the right direction, then bends upward, It bends in the vicinity of the upper edge of the substrate 5 and extends horizontally to the terminal 20 a side of the main line conductor pattern 20. Thereafter, the sub line conductor pattern 30 is bent in an L shape along the shape of the main line conductor pattern 20, and the tip thereof is aligned with the tip of the main line conductor pattern 20. Further, as shown in FIG. 1, the sub line conductor pattern 31 is arranged above the sub line conductor pattern 30 with the insulating layer 6 interposed therebetween. As shown in FIG. 4, the sub-line conductor pattern 31 is also formed on the insulating layer 6, and its shape is symmetrical with the sub-line conductor pattern 30, and its terminal 31 a is an underline of the insulating layer 6. Located in the right corner.

上記副線路導体パターン30,31で構成された副線路3は、スパイラル状をなし、その線幅は、主線路2の線幅よりも狭く設定されている。
具体的には、副線路3の線幅を主線路2の線幅の90%以下に設定して、。副線路3に大きな自己インダクタンスを確保させると共に方向性を向上させている。また、副線路3の線幅を主線路2の線幅の50%以上に設定して、副線路3の直流抵抗値の増大を防止している。
The sub-line 3 constituted by the sub-line conductor patterns 30 and 31 has a spiral shape, and the line width is set narrower than the line width of the main line 2.
Specifically, the line width of the sub line 3 is set to 90% or less of the line width of the main line 2. A large self-inductance is ensured in the sub-line 3 and the directionality is improved. Further, the line width of the sub-line 3 is set to 50% or more of the line width of the main line 2 to prevent the DC resistance value of the sub-line 3 from increasing.

図1において、電磁気的結合部4は、主信号に基づく主線路2と副線路3との間の電磁気的結合を行う部分であり、主線路2の一部と副線路3の一部とで構成されている。
図6は、図5の矢視A−A断面図であり、電磁気的結合部4の主部分線路を示し、図7は、図5の矢視B−B断面図であり、電磁気的結合部4の副部分線路を示し、図8は、絶縁層6,7を除いて電磁気的結合部4を示す概略斜視図である。
電磁気的結合部4は、図8に示すように、主線路2の一部をなす主部分線路40と副線路3の一部をなす副部分線路41とを平行な状態で近接させることで構成した。
In FIG. 1, the electromagnetic coupling unit 4 is a part that performs electromagnetic coupling between the main line 2 and the sub-line 3 based on the main signal, and is a part of the main line 2 and a part of the sub-line 3. It is configured.
6 is a cross-sectional view taken along the line AA in FIG. 5 and shows a main partial line of the electromagnetic coupling portion 4. FIG. 7 is a cross-sectional view taken along the line BB in FIG. 4 is a schematic perspective view showing the electromagnetic coupling portion 4 except for the insulating layers 6 and 7.
As shown in FIG. 8, the electromagnetic coupling unit 4 is configured by bringing a main partial line 40 that forms part of the main line 2 and a sub partial line 41 that forms part of the sub line 3 close to each other in parallel. did.

主部分線路40は、並列接続構造の一対の線路部である第1及び第2の線路部40a,40bで形成されている。
具体的には、図6にも示すように、絶縁層6の下側に配された主線路導体パターン20の水平部分を主部分線路40の第1の線路部40aとし、絶縁層6の上側に配され且つ線路部40aに対向する主線路導体パターン21の水平部分を主部分線路40の第2の線路部40bとする。そして、図2〜図4に示すように、絶縁層6において、第1及び第2のビアホール40c,40dを線路部40a,40bのそれぞれの先端に対応する個所に形成し、図6及び図8に示すように、線路部40aの先端をビアホール40cを介して主線路導体パターン21と線路部40bとの連続部21bに接続すると共に、線路部40bの先端をビアホール40dを介して主線路導体パターン20と線路部40aとの連続部20bに接続することで、主部分線路40を形成する。これにより、線路部40a及びビアホール40cでなる線路とビアホール40d及び線路部40bでなる線路とが、主線路導体パターン20の連続部20bで分岐し、主線路導体パターン21の連続部21bで結合した状態となる。しかも、ビアホール40c,40dは同長であるので、これらの線路の長さは等しい。
The main partial line 40 is formed of first and second line parts 40a and 40b which are a pair of line parts having a parallel connection structure.
Specifically, as shown in FIG. 6, the horizontal portion of the main line conductor pattern 20 disposed below the insulating layer 6 is defined as the first line portion 40 a of the main partial line 40, and the upper side of the insulating layer 6. The horizontal portion of the main line conductor pattern 21 that is disposed on the opposite side of the line portion 40 a is defined as a second line portion 40 b of the main partial line 40. 2 to 4, in the insulating layer 6, the first and second via holes 40c and 40d are formed at locations corresponding to the respective tips of the line portions 40a and 40b. As shown in FIG. 4, the tip of the line portion 40a is connected to the continuous portion 21b of the main line conductor pattern 21 and the line portion 40b via the via hole 40c, and the tip of the line portion 40b is connected to the main line conductor pattern via the via hole 40d. The main partial line 40 is formed by connecting to the continuous part 20b of the line 20 and the line part 40a. As a result, the line composed of the line portion 40a and the via hole 40c and the line composed of the via hole 40d and the line portion 40b branch off at the continuous portion 20b of the main line conductor pattern 20 and are coupled at the continuous portion 21b of the main line conductor pattern 21. It becomes a state. Moreover, since the via holes 40c and 40d have the same length, the lengths of these lines are equal.

また、副部分線路41は、並列接続構造の一対の線路部である第3及び第4の線路部41a,41bで形成されている。
具体的には、図7及び図8に示すように、絶縁層6の下側に配され且つ主線路導体パターン20の水平部分と近接する副線路導体パターン30の水平部分を、副部分線路41の第3の線路部41aとし、絶縁層6の上側に配され且つこの線路部41aに対向する副線路導体パターン31の水平部分を、副部分線路41の第4の線路部41bとする。そして、図2〜図4に示すように、絶縁層6において、第3及び第4のビアホール41c,41dを線路部41a,41bのそれぞれの先端に対応する個所に形成し、図7及び図8に示すように、線路部41aの先端をビアホール41cを介して副線路導体パターン31と線路部41bとの連続部31bに接続すると共に、線路部41bの先端をビアホール41dを介して副線路導体パターン30と線路部41aとの連続部30bに接続することで、副部分線路41を形成する。これにより、線路部41b及びビアホール41dでなる線路とビアホール41c及び線路部41aでなる線路が副線路導体パターン31の連続部31bで分岐し、副線路導体パターン30の連続部30bで結合した状態となり、しかも、これらの線路の長さは等しい。この結果、この副部分線路41の線路長と上記主部分線路40の線路長とは同長となる。
Further, the sub partial line 41 is formed by third and fourth line portions 41a and 41b which are a pair of line portions having a parallel connection structure.
Specifically, as shown in FIGS. 7 and 8, the horizontal portion of the sub-line conductor pattern 30 disposed below the insulating layer 6 and close to the horizontal portion of the main line conductor pattern 20 is replaced with the sub-partial line 41. The horizontal portion of the sub-line conductor pattern 31 that is disposed on the upper side of the insulating layer 6 and faces the line portion 41a is referred to as a fourth line portion 41b of the sub-partial line 41. 2 to 4, in the insulating layer 6, the third and fourth via holes 41c and 41d are formed at locations corresponding to the respective ends of the line portions 41a and 41b, as shown in FIGS. As shown in FIG. 4, the tip of the line portion 41a is connected to the continuous portion 31b of the sub-line conductor pattern 31 and the line portion 41b via the via hole 41c, and the tip of the line portion 41b is connected to the sub-line conductor pattern via the via hole 41d. The sub partial line 41 is formed by connecting to the continuous part 30b of the line 30 and the line part 41a. As a result, the line composed of the line portion 41b and the via hole 41d and the line composed of the via hole 41c and the line portion 41a branch at the continuous portion 31b of the sub-line conductor pattern 31 and are coupled at the continuous portion 30b of the sub-line conductor pattern 30. Moreover, the lengths of these lines are equal. As a result, the line length of the sub partial line 41 and the line length of the main partial line 40 are the same.

上記の如く、誘電体基板5上に絶縁層6を介して形成された主線路2,副線路3,電磁気的結合部4でなる内部回路を絶縁層7で上方より被覆することで、サイコロ状のチップ1′が形成される。外部端子8−1,8−2,9−1,9−2は、このチップ1′の外側に取り付けられ(図5参照)、主線路導体パターン20の端子20a,主線路導体パターン21の端子21a,副線路導体パターン31の端子31a,副線路導体パターン30の端子30aにそれぞれ接触している。   As described above, the internal circuit composed of the main line 2, the sub line 3, and the electromagnetic coupling portion 4 formed on the dielectric substrate 5 through the insulating layer 6 is covered with the insulating layer 7 from above so that a dice shape is formed. Chip 1 'is formed. The external terminals 8-1, 8-2, 9-1, 9-2 are attached to the outside of the chip 1 ′ (see FIG. 5), the terminals 20 a of the main line conductor pattern 20, and the terminals of the main line conductor pattern 21. 21a, the terminal 31a of the sub line conductor pattern 31, and the terminal 30a of the sub line conductor pattern 30 are in contact with each other.

このような構成の方向性結合器1において、誘電体基板5,絶縁層6,7の材料にガラス,ガラスセラミックス,アルミナ,フェライト,シリコン,二酸化シリコン等を用い、主線路2及び副線路3の材料にAg,Ag−Pd,Cu,Ni,Al等の導電性材料を用いる。そして、厚膜印刷,フォトリソグラフィ,スパッタリング蒸着等の周知の薄膜形成法により、主線路2及び副線路3を平滑な誘電体基板5上に形成することができる。   In the directional coupler 1 having such a configuration, the dielectric substrate 5, the insulating layers 6 and 7 are made of glass, glass ceramics, alumina, ferrite, silicon, silicon dioxide or the like, and the main line 2 and the sub line 3 are formed. A conductive material such as Ag, Ag-Pd, Cu, Ni, or Al is used as the material. Then, the main line 2 and the sub line 3 can be formed on the smooth dielectric substrate 5 by a well-known thin film forming method such as thick film printing, photolithography, and sputtering deposition.

次に、この実施例の方向性結合器1が示す作用及び効果について説明する。
図9は、方向性結合器1の作用を説明するために模式的に表した内部回路図である。
図5に示した外観の方向性結合器1を図示しない外部基板に実装した後、高周波信号である主信号Mを外部基板から外部端子8−1を介して入力すると、図9に示すように、主信号Mは、主線路2の端子20aから主線路導体パターン20内に入り、連続部20bに至る。したがって、主線路導体パターン20は主線路2の一方部側をなす。そして、この主信号Mが連続部20bにおいて分岐し、主信号M1として主部分線路40の線路部40aに流入すると共に、主信号M1と同一の主信号M2が破線で示すビアホール40dを介して一点鎖線で示す線路部40bに流入する。これと並行して、主信号M1が、破線で示すビアホール40cを介して連続部21bに至り、連続部21bにおいて主信号M2と合流する。
この結果、端子20aから入力された主信号Mの電力と端子21aに出力される主信号Mの電力とはほぼ同値であり、主部分線路40による電力損失はほとんど生じない。
ところで、上記したように、主信号M1が通ってきた線路40a,40cと主信号M2が通ってきた線路40d,40bとはその線路長が等しく設定されている。したがって、合流地点の連続部21bにおいて、主信号M1,2に位相差は発生しない。
そして、主信号M1,2が合成され、主信号Mとして一点鎖線で示す主線路導体パターン21に出力され、端子21a及び外部端子8−2を介して外部基板側に出力される。したがって、主線路導体パターン21は主線路2の他方部側をなす。
Next, the operation and effect of the directional coupler 1 of this embodiment will be described.
FIG. 9 is an internal circuit diagram schematically illustrating the operation of the directional coupler 1.
When the directional coupler 1 having the appearance shown in FIG. 5 is mounted on an external board (not shown) and then a main signal M that is a high-frequency signal is input from the external board via the external terminal 8-1, as shown in FIG. The main signal M enters the main line conductor pattern 20 from the terminal 20a of the main line 2 and reaches the continuous portion 20b. Therefore, the main line conductor pattern 20 forms one side of the main line 2. And this main signal M branches in the continuous part 20b, flows into the line part 40a of the main partial line 40 as the main signal M1, and the same main signal M2 as the main signal M1 passes through the via hole 40d shown by a broken line. It flows into the line part 40b shown with a chain line. In parallel with this, the main signal M1 reaches the continuous portion 21b via the via hole 40c indicated by a broken line, and merges with the main signal M2 in the continuous portion 21b.
As a result, the power of the main signal M input from the terminal 20a and the power of the main signal M output to the terminal 21a are almost the same value, and power loss due to the main partial line 40 hardly occurs.
As described above, the line lengths of the lines 40a and 40c through which the main signal M1 passes and the lines 40d and 40b through which the main signal M2 pass are set equal. Therefore, there is no phase difference between the main signals M1 and M2 in the continuous portion 21b at the merge point.
The main signals M1 and M2 are combined and output as the main signal M to the main line conductor pattern 21 indicated by a one-dot chain line, and output to the external substrate side via the terminal 21a and the external terminal 8-2. Therefore, the main line conductor pattern 21 forms the other side of the main line 2.

上記のように、主信号Mが電磁気的結合部4の主部分線路40内を流れることで、主部分線路40と近接した副部分線路41が電磁気的に結合され、副信号Sが誘起される。
具体的には、副信号S1が副部分線路41の線路部41b及びビアホール41dに誘起され、副信号S2がビアホール41c及び線路部41aに誘起される。そして、副信号S1,S2が連続部30bにおいて合流し、副信号Sとして副線路導体パターン30に出力される。したがって、副線路導体パターン30は副線路3の一方部側をなし、副線路導体パターン31は他方部側をなす。
この場合においても、線路41b,41dと線路41c,41aとの線路長が等しいので、連続部30bにおける副信号S1,2に位相差は生ぜず、副線路導体パターン31に誘起された副信号Sとほぼ同電力の副信号Sが、実線で示す副線路導体パターン30に生じ、端子30aを介して外部端子9−2に出力される。
したがって、外部端子9−2に出力される副信号Sを外部基板側で監視することで、主線路2を流れている主信号Mの状態を確認することができる。
As described above, when the main signal M flows in the main partial line 40 of the electromagnetic coupling unit 4, the sub partial line 41 adjacent to the main partial line 40 is electromagnetically coupled, and the sub signal S is induced. .
Specifically, the sub signal S1 is induced in the line portion 41b and the via hole 41d of the sub partial line 41, and the sub signal S2 is induced in the via hole 41c and the line portion 41a. Then, the sub signals S1 and S2 merge at the continuous portion 30b and are output to the sub line conductor pattern 30 as the sub signal S. Accordingly, the sub line conductor pattern 30 forms one side of the sub line 3 and the sub line conductor pattern 31 forms the other side.
Also in this case, since the line lengths of the lines 41b and 41d and the lines 41c and 41a are equal, no phase difference occurs in the sub-signals S1 and S2 in the continuous portion 30b, and the sub-signal S induced in the sub-line conductor pattern 31 is generated. The sub-signal S having substantially the same power is generated in the sub-line conductor pattern 30 indicated by the solid line, and is output to the external terminal 9-2 via the terminal 30a.
Therefore, the state of the main signal M flowing through the main line 2 can be confirmed by monitoring the sub-signal S output to the external terminal 9-2 on the external substrate side.

ところで、上記したように、この実施例では、主線路2をスパイラル状でなく略U字状に形成して、主線路2の全長を短くすることにより、主線路2による挿入損失を低減している。したがって、方向性結合器1を極小化すると、主線路2がさらに短くなる。この結果、主部分線路40の線路長を確保できず、副部分線路41との電磁気的結合度が低くなって、十分な電力の副信号Sを外部端子9−2に出力することができず、監視が困難になるおそれがある。
しかし、この実施例の方向性結合器1では、並列接続構造の線路部40a,40bで主部分線路40を構成し、同じく並列接続構造の線路部41a,41bで副部分線路41を構成しているので、電磁気的相互作用が4本の線路部40a,40b,41a,41b間で行われることとなり、主部分線路40と副部分線路41との電磁気的結合度は非常に高い。したがって、方向性結合器1の外部端子9−2に十分な電力の副信号Sを出力させることができる。しかも、副線路3がスパイラル状に形成されているので、図2(図4)に示すように、線路部40a(40b)が線路部41a(41b)だけでなく、下側で近接する水平な線路部41f(41g)とも電磁気的に結合している。したがって、副線路3が非スパイラルの場合に比べて、より高い電磁気的結合度を得ることができる。
By the way, as described above, in this embodiment, the main line 2 is formed in a substantially U shape instead of a spiral shape, and the total length of the main line 2 is shortened, thereby reducing the insertion loss due to the main line 2. Yes. Therefore, when the directional coupler 1 is minimized, the main line 2 is further shortened. As a result, the line length of the main partial line 40 cannot be secured, the degree of electromagnetic coupling with the sub partial line 41 becomes low, and the sub signal S with sufficient power cannot be output to the external terminal 9-2. Monitoring may be difficult.
However, in the directional coupler 1 of this embodiment, the main partial line 40 is constituted by the line portions 40a and 40b having the parallel connection structure, and the sub partial line 41 is similarly constituted by the line portions 41a and 41b having the parallel connection structure. Therefore, the electromagnetic interaction is performed between the four line portions 40a, 40b, 41a, 41b, and the degree of electromagnetic coupling between the main partial line 40 and the sub partial line 41 is very high. Therefore, the sub-signal S having sufficient power can be output to the external terminal 9-2 of the directional coupler 1. Moreover, since the sub-line 3 is formed in a spiral shape, as shown in FIG. 2 (FIG. 4), the line part 40a (40b) is not only the line part 41a (41b) but also the horizontal line that is close to the lower side. The line part 41f (41g) is also electromagnetically coupled. Therefore, it is possible to obtain a higher degree of electromagnetic coupling than when the sub line 3 is non-spiral.

次に、この発明の第2実施例について説明する。
図10は、この発明の第2実施例に係る方向性結合器の要部を示す分解斜視図である。
図10に示すように、この実施例では、台形状の主線路2−1を誘電体基板5上に形成し、主線路2−1と線対称形状の副線路3−1を絶縁層6上に形成する。そして、主部分線路40−1と副部分線路41−1とを絶縁層6を介して対向させて電磁気的結合部4を形成した。
Next explained is the second embodiment of the invention.
FIG. 10 is an exploded perspective view showing a main part of the directional coupler according to the second embodiment of the present invention.
As shown in FIG. 10, in this embodiment, a trapezoidal main line 2-1 is formed on a dielectric substrate 5, and a sub-line 3-1 line symmetrical with the main line 2-1 is formed on the insulating layer 6. To form. Then, the electromagnetic coupling portion 4 was formed by making the main partial line 40-1 and the sub partial line 41-1 face each other via the insulating layer 6.

具体的には、主線路2−1を次のようにして形成している。
すなわち、誘電体基板5の下縁左隅及び右隅に端子20a−1,21a−1と形成し、直線状の主線路導体パターン20−1,21−1を端子20a−1,21a−1から誘電体基板5の中央部に向けて延出させ、誘電体基板5の中央部に形成された主部分線路40−1に接続している。
主部分線路40−1は、長方形の形状をなし、主線路導体パターン20−1,21−1の先端が、この主部分線路40−1の対角線上の各頂点部に接続されている。これにより、主部分線路40−1の図10における下辺と右辺とで線路部40a−1を構成し、左辺と上辺とで線路部40b−1を構成している。
Specifically, the main line 2-1 is formed as follows.
That is, terminals 20a-1 and 21a-1 are formed at the lower left corner and right corner of the dielectric substrate 5, and the linear main line conductor patterns 20-1 and 21-1 are formed from the terminals 20a-1 and 21a-1. It extends toward the center of the dielectric substrate 5 and is connected to the main partial line 40-1 formed at the center of the dielectric substrate 5.
The main partial line 40-1 has a rectangular shape, and the ends of the main line conductor patterns 20-1, 21-1 are connected to the respective vertexes on the diagonal line of the main partial line 40-1. Thereby, the line part 40a-1 is comprised by the lower side and right side in FIG. 10 of the main partial line 40-1, and the line part 40b-1 is comprised by the left side and the upper side.

一方、副線路3−1は、次のようにして形成されている。
すなわち、絶縁層6の上縁左隅及び右隅を端子30a−1,31a−1を形成し、直線状の副線路導体パターン30−1,31−1を端子30a−1,31a−1から絶縁層6の中央部に向けて延出させ、絶縁層6の中央部に形成された副部分線路41−1に接続している。
副部分線路41−1は、主部分線路40−1と同形であり、主部分線路40−1と対応する位置に形成されている。副線路導体パターン30−1,31−1は、この副部分線路41−1の対角線上の各頂点部に接続されている。これにより、副部分線路41−1の下辺と左辺とで41a−1を構成し、左辺と上辺とで線路部41b−1を構成している。
すなわち、同形の主部分線路40−1と副部分線路41−1とは、絶縁層6を介して絶縁層6の中央部で対向している。
これにより、主信号Mを主線路2−1の主線路導体パターン20−1に入力すると、主部分線路40−1の線路部40a−1,40b−1で分岐された後、合流して、ほぼ同電力の主信号Mが主線路導体パターン21−1に出力される。
このとき、主部分線路40−1と副部分線路41−1との電磁気的な結合によって、副信号Sが副線路3−1に誘起され、この副信号Sが副線路導体パターン31−1から副部分線路41−1に分岐入力した後、合流して、副線路導体パターン30−1に出力される。
その他の構成,作用及び効果は、上記第1実施例と同様であるので、その記載は省略する。
On the other hand, the sub line 3-1 is formed as follows.
That is, the terminals 30a-1 and 31a-1 are formed at the upper left corner and the right corner of the insulating layer 6, and the linear sub-line conductor patterns 30-1 and 31-1 are insulated from the terminals 30a-1 and 31a-1. The layer 6 extends toward the center of the layer 6 and is connected to the sub partial line 41-1 formed at the center of the insulating layer 6.
The sub partial line 41-1 has the same shape as the main partial line 40-1, and is formed at a position corresponding to the main partial line 40-1. The sub-line conductor patterns 30-1 and 31-1 are connected to the respective vertexes on the diagonal line of the sub-partial line 41-1. Thereby, 41a-1 is comprised by the lower side and left side of the subpartial line 41-1, and the line part 41b-1 is comprised by the left side and the upper side.
In other words, the main partial line 40-1 and the sub partial line 41-1 having the same shape are opposed to each other at the center of the insulating layer 6 with the insulating layer 6 interposed therebetween.
Thereby, when the main signal M is input to the main line conductor pattern 20-1 of the main line 2-1, after being branched by the line portions 40a-1 and 40b-1 of the main partial line 40-1, the main signal M is merged, A main signal M having substantially the same power is output to the main line conductor pattern 21-1.
At this time, the sub signal S is induced in the sub line 3-1 by the electromagnetic coupling between the main partial line 40-1 and the sub partial line 41-1, and the sub signal S is transmitted from the sub line conductor pattern 31-1. After branching input to the sub-partial line 41-1, they are merged and output to the sub-line conductor pattern 30-1.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

なお、この発明は、上記実施例に限定されるものではなく、発明の要旨の範囲内において種々の変形や変更が可能である。
例えば、上記第2実施例では、主線路と副線路とを台形状に形成したが、主線路,副線路が誘電体基板5,絶縁層6上にそれぞれ形成されていればよく、その形状は任意である。したがって、図11に示すように、主線路導体パターン20−2,主部分線路40−2,主線路導体パターン21−2を対角線状に配することにより、主線路2−2を誘電体基板5上に形成すると共に、副線路導体パターン30−2,副部分線路41−2,副線路導体パターン31−2でなる副線路3−2を主線路2−2と線対称に形成して絶縁層6上に積層する。このようにして、同形の主部分線路40−2と副部分線路41−2とを絶縁層6を介して対向させるようにしてもよい。
In addition, this invention is not limited to the said Example, A various deformation | transformation and change are possible within the range of the summary of invention.
For example, in the second embodiment, the main line and the sub line are formed in a trapezoidal shape. However, the main line and the sub line only have to be formed on the dielectric substrate 5 and the insulating layer 6, respectively. Is optional. Therefore, as shown in FIG. 11, the main line 2-2 is disposed on the dielectric substrate 5 by arranging the main line conductor pattern 20-2, the main partial line 40-2, and the main line conductor pattern 21-2 diagonally. In addition, the sub-line 3-2 formed of the sub-line conductor pattern 30-2, the sub-partial line 41-2, and the sub-line conductor pattern 31-2 is formed symmetrically with the main line 2-2 to form an insulating layer. 6 is laminated. In this way, the main partial line 40-2 and the sub partial line 41-2 having the same shape may be opposed to each other via the insulating layer 6.

例えば、上記第1実施例では、電磁気的結合部4の主部分線路40及び副部分線路41の双方を一対の線路部である線路部40a,40b及び線路部41a,41bで形成したが、図12及び図13に示すように、主部分線路40及び副部分線路41の一方のみを一対の線路部で形成する構成としてもよい。
すなわち、図12(a)〜(c)に示すように、主部分線路40のみを並列接続構造の線路部40a,40bで形成する。そして、副線路3は、副線路導体パターン30の先端30cと副線路導体パターン31の先端31cとをビアホール33を介して直列に接続して、副線路3に並列接続構造の副部分線路41を形成しない構造とすることもできる。
また、図13(a)〜(c)に示すように、副部分線路41のみを並列接続構造の線路部41a,41bで形成する。そして、主線路導体パターン20の先端20cと主線路導体パターン21の先端21cとをビアホール22を介して直列に接続して、主線路2に並列接続の主部分線路40を形成しない構造とすることもできる。
For example, in the first embodiment, both the main partial line 40 and the sub partial line 41 of the electromagnetic coupling unit 4 are formed by a pair of line parts 40a and 40b and line parts 41a and 41b. As shown in FIGS. 12 and 13, only one of the main partial line 40 and the sub partial line 41 may be formed by a pair of line parts.
That is, as shown in FIGS. 12A to 12C, only the main partial line 40 is formed by the line parts 40a and 40b having a parallel connection structure. The sub-line 3 connects the tip 30c of the sub-line conductor pattern 30 and the tip 31c of the sub-line conductor pattern 31 in series via the via hole 33, and the sub-line 3 having a parallel connection structure is connected to the sub-line 3. A structure that is not formed may be used.
Further, as shown in FIGS. 13A to 13C, only the sub-partial line 41 is formed by line parts 41a and 41b having a parallel connection structure. And the front-end | tip 20c of the main line conductor pattern 20 and the front-end | tip 21c of the main line conductor pattern 21 are connected in series via the via hole 22, and it is set as the structure which does not form the main partial line 40 connected in parallel with the main line 2. You can also.

この発明の第1実施例に係る方向性結合器をの分解斜視図である。It is a disassembled perspective view of the directional coupler which concerns on 1st Example of this invention. 主線路及び副線路を構成する下層側の内部導体パターンを示す平面図である。It is a top view which shows the internal conductor pattern of the lower layer side which comprises a main line and a subline. 絶縁層を示す平面図である。It is a top view which shows an insulating layer. 主線路及び副線路を構成する上層側の内部導体パターンを示す平面図である。It is a top view which shows the internal conductor pattern of the upper layer side which comprises a main line and a subline. 方向性結合器の外観図である。It is an external view of a directional coupler. 図5の矢視A−A断面図である。It is arrow AA sectional drawing of FIG. 図5の矢視B−B断面図である。It is arrow BB sectional drawing of FIG. 絶縁層を除いて電磁気的結合部を示す概略斜視図である。It is a schematic perspective view which shows an electromagnetic coupling part except an insulating layer. 方向性結合器の作用を説明するために模式的に表した内部回路図である。FIG. 3 is an internal circuit diagram schematically illustrating the operation of a directional coupler. この発明の第2実施例に係る方向性結合器の要部を示す分解斜視図である。It is a disassembled perspective view which shows the principal part of the directional coupler which concerns on 2nd Example of this invention. 第2実施例の変形例を示す分解斜視図である。It is a disassembled perspective view which shows the modification of 2nd Example. 第1実施例の変形例を示す平面図である。It is a top view which shows the modification of 1st Example. 第1実施例の他の変形例を示す平面図である。It is a top view which shows the other modification of 1st Example.

符号の説明Explanation of symbols

1…方向性結合器、 2…主線路、 3…副線路、 4…電磁気的結合部、 5…誘電体基板、 6,7…絶縁層、 8−1,8−2,9−1,9−2…外部端子、 20,21…主線路導体パターン、 20a,21a,30a,31a…端子、 20b,21b,31b,30b…連続部、 30,31…副線路導体パターン、 40…主部分線路、 41…副部分線路、 40a,40b…第1及び第2の線路部、 40c,40d…第1及び第2のビアホール、 41a,41b…第3及び第4の線路部、 41c,41d…第3及び第4のビアホール、 M…主信号、 S…副信号。   DESCRIPTION OF SYMBOLS 1 ... Directional coupler, 2 ... Main line, 3 ... Sub line, 4 ... Electromagnetic coupling part, 5 ... Dielectric board | substrate, 6, 7 ... Insulating layer, 8-1, 8-2, 9-1, 9 -2, external terminal, 20, 21 ... main line conductor pattern, 20a, 21a, 30a, 31a ... terminal, 20b, 21b, 31b, 30b ... continuous part, 30, 31 ... sub-line conductor pattern, 40 ... main partial line 41 ... Sub-partial line, 40a, 40b ... 1st and 2nd line part, 40c, 40d ... 1st and 2nd via hole, 41a, 41b ... 3rd and 4th line part, 41c, 41d ... 1st 3 and 4th via hole, M ... main signal, S ... sub signal.

Claims (8)

高周波信号である主信号を伝送する主線路と、
この主線路を流れる主信号の電力に対応した副信号を出力する副線路と、
上記主線路の一部である主部分線路と上記副線路の一部である副部分線路とを平行な状態で近接させることにより構成し、当該主部分線路と副部分線路との電磁気的結合により、上記主信号に対応した上記副信号を生じさせる電磁気的結合部と
を備える方向性結合器であって、
上記電磁気的結合部の主部分線路及び副部分線路の少なくとも一方を、並列接続構造の一対の線路部で形成すると共に、これら一対の線路部の長さを等しく設定した、
ことを特徴とする方向性結合器。
A main line for transmitting a main signal which is a high-frequency signal;
A sub line that outputs a sub signal corresponding to the power of the main signal flowing through the main line;
The main partial line, which is a part of the main line, and the sub partial line, which is a part of the sub line, are arranged close to each other in parallel, and by electromagnetic coupling between the main partial line and the sub partial line. A directional coupler comprising: an electromagnetic coupling unit that generates the sub-signal corresponding to the main signal;
At least one of the main partial line and the sub partial line of the electromagnetic coupling portion is formed with a pair of line portions of a parallel connection structure, and the lengths of the pair of line portions are set equal.
A directional coupler characterized by that.
請求項1に記載の方向性結合器において、
上記主部分線路の一対の線路部を、主線路の一方部側で分岐して他方部側で合流する第1及び第2の線路部で形成し、
当該主線路の一方部側と上記第1の線路部とを絶縁層の一方側に配すると共に、上記主線路の他方部側と上記第2の線路部とを当該絶縁層の他方側に配し、当該第1の線路部の先端を第1のビアホールを介して当該主線路の他方部側と第2の線路部との連続部に接続すると共に、当該第2の線路部の先端を上記第1のビアホールと同長の第2のビアホールを介して当該主線路の一方部側と第1の線路部との連続部に接続した、
ことを特徴とする方向性結合器。
The directional coupler according to claim 1, wherein
A pair of line portions of the main partial line is formed by first and second line portions that branch on one side of the main line and merge on the other side,
One side of the main line and the first line part are arranged on one side of the insulating layer, and the other side of the main line and the second line part are arranged on the other side of the insulating layer. And connecting the tip of the first line part to the continuous part of the other part of the main line and the second line part via the first via hole, and connecting the tip of the second line part to the continuous part. The second via hole having the same length as the first via hole is connected to a continuous portion between the one side of the main line and the first line portion.
A directional coupler characterized by that.
請求項1または請求項2に記載の方向性結合器において、
上記副部分線路の一対の線路部を、副線路の一方部側で分岐して他方部側で合流する第3及び第4の線路部で形成し、
当該副線路の一方部側と上記第3の線路部とを上記絶縁層の一方側に配すると共に、上記副線路の他方部側と上記第4の線路部とを上記絶縁層の他方側に配し、当該第3の線路部の先端を第3のビアホールを介して当該副線路の他方部側と第4の線路部との連続部に接続すると共に、当該第4の線路部の先端を上記第3のビアホールと同長の第4のビアホールを介して当該副線路の一方部側と第3の線路部との連続部に接続した、
ことを特徴とする方向性結合器。
The directional coupler according to claim 1 or 2,
A pair of line parts of the sub partial line is formed by third and fourth line parts that branch on one side of the sub line and merge on the other side,
One side of the sub line and the third line part are arranged on one side of the insulating layer, and the other side of the sub line and the fourth line part are on the other side of the insulating layer. And connecting the tip of the third line portion to the continuous portion of the other line side of the sub-line and the fourth line portion through the third via hole, and the tip of the fourth line portion. Connected to a continuous portion of one side of the sub-line and the third line portion through a fourth via hole having the same length as the third via hole,
A directional coupler characterized by that.
請求項1に記載の方向性結合器において、
上記主線路と副線路とを、絶縁層を介して積層すると共に、
上記主線路の主部分線路と副線路の副部分線路とを、上記絶縁層を介して対向させることで、上記電磁気的結合部を構成した、
ことを特徴とする方向性結合器。
The directional coupler according to claim 1, wherein
While laminating the main line and the sub line via an insulating layer,
By configuring the main partial line of the main line and the sub partial line of the sub line to face each other via the insulating layer, the electromagnetic coupling unit is configured.
A directional coupler characterized by that.
請求項1ないし請求項3のいずれかに記載の方向性結合器において、
上記主線路を、略直線状または所定の個所で曲折した略直線状をなし、且つスパイラル状に周回しない線路に形成し、
上記副線路を、スパイラル状に周回する線路に形成した、
ことを特徴とする方向性結合器。
The directional coupler according to any one of claims 1 to 3,
The main line is formed in a substantially straight line or a substantially straight line bent at a predetermined location, and formed in a line that does not circulate in a spiral shape,
The sub-line was formed on a line that circulates in a spiral shape,
A directional coupler characterized by that.
請求項1ないし請求項5のいずれかに記載の方向性結合器において、
上記主線路の全線長を、上記副線路の全線長よりも短く設定した、
ことを特徴とする方向性結合器。
The directional coupler according to any one of claims 1 to 5,
The total length of the main line is set shorter than the total length of the sub-line,
A directional coupler characterized by that.
請求項1ないし請求項6のいずれかに記載の方向性結合器において、
上記主部分線路の線長と副部分線路の線長とを、等しく設定した、
ことを特徴とする方向性結合器。
The directional coupler according to any one of claims 1 to 6,
The line length of the main partial line and the line length of the sub partial line were set equal,
A directional coupler characterized by that.
請求項1ないし請求項7のいずれかに記載の方向性結合器において、
上記副線路の線幅を、主線路の線幅よりも狭く設定した、
ことを特徴とする方向性結合器。
The directional coupler according to any one of claims 1 to 7,
The line width of the sub-line is set to be narrower than the line width of the main line.
A directional coupler characterized by that.
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US7504907B2 (en) 2005-05-20 2009-03-17 Murata Manufacturing Co., Ltd. Multilayer directional coupler
JP2013098743A (en) * 2011-10-31 2013-05-20 Sumitomo Electric Device Innovations Inc Coupler
JP2016171398A (en) * 2015-03-11 2016-09-23 Tdk株式会社 Directional coupler and radio communication device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7504907B2 (en) 2005-05-20 2009-03-17 Murata Manufacturing Co., Ltd. Multilayer directional coupler
JP2013098743A (en) * 2011-10-31 2013-05-20 Sumitomo Electric Device Innovations Inc Coupler
JP2016171398A (en) * 2015-03-11 2016-09-23 Tdk株式会社 Directional coupler and radio communication device
US9838055B2 (en) 2015-03-11 2017-12-05 Tdk Corporation Directional coupler and wireless communication device
TWI611626B (en) * 2015-03-11 2018-01-11 Tdk股份有限公司 Directional coupler and wireless communication device

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