JP2005150633A - Electronic controller - Google Patents
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- JP2005150633A JP2005150633A JP2003389824A JP2003389824A JP2005150633A JP 2005150633 A JP2005150633 A JP 2005150633A JP 2003389824 A JP2003389824 A JP 2003389824A JP 2003389824 A JP2003389824 A JP 2003389824A JP 2005150633 A JP2005150633 A JP 2005150633A
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Abstract
Description
本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
電子制御装置は、とりわけ車両に用いられるものについては、スペースの制約から小型化の要求がある。しかし、アクチュエータによっては数十Aの電流が流れるので、厚さに限界のある通常のプリント基板上の配線パターンによってアクチュエータの通電ライン等を構成するのは、発熱や基板上スペース等の面から実用上不可能であった。このため、プリント基板上の配線パターンに比較して導体の幅および厚さが格段に大きく大電流を流すことが可能なバスバー(導電板)がプリント基板上に取り付けられることにより、通電ライン等が構成されている。 In particular, electronic control devices used for vehicles are required to be downsized due to space limitations. However, since an electric current of several tens of A flows depending on the actuator, it is practical from the viewpoint of heat generation and the space on the board to configure the actuator energization line etc. by the wiring pattern on the normal printed board with a limit on the thickness. It was impossible. For this reason, the width and thickness of the conductor are much larger than the wiring pattern on the printed circuit board, and a bus bar (conductive plate) capable of flowing a large current is attached on the printed circuit board, so that the energization line and the like are It is configured.
従来では、一枚の回路基板上に平面的に部品を配置する構成であったため、特に回路基板の面方向の大きさが大型になる。 Conventionally, the components are arranged in a plane on a single circuit board, so that the size in the surface direction of the circuit board is particularly large.
また、電子制御装置が車室内に配置される場合には、それ程高い防水性は要求されないが、エンジンルーム内(特にエンジンルームの下部)の場合には、浸水が当然想定されるので、水飛沫などにもある程度耐えうる防水性が要求される。特に、車両の安全性の要求が高まる近年では、車両水没時等のより厳しい環境下でも高い信頼性が各装置に要求されつつあり、たとえ車室内に配置される電子制御装置であっても、高い気密性や防塵対策が要求される傾向が高まっている。 In addition, when the electronic control device is disposed in the vehicle interior, high waterproofness is not required. However, in the engine room (especially in the lower part of the engine room), water is naturally assumed, so It is required to be waterproof to some extent. In particular, in recent years when the demand for vehicle safety is increasing, high reliability is being demanded of each device even in a harsh environment such as when the vehicle is submerged, even if it is an electronic control device arranged in a vehicle interior, There is an increasing tendency to require high airtightness and dust-proof measures.
上記問題を解決するために、駆動回路を金属基板に、制御回路を絶縁基板に、電解コンデンサなどの大電流回路部品を金属製の回路導体構成部材がインサート成形により一体化されたベース基板に実装し、金属基板及び絶縁基板を、ベース基板に積層状態に取り付けた構造とする車両の電子制御装置が考案されている(特許文献1参照)。 To solve the above problems, the drive circuit is mounted on a metal substrate, the control circuit is mounted on an insulating substrate, and a large current circuit component such as an electrolytic capacitor is mounted on a base substrate in which metal circuit conductor components are integrated by insert molding. However, an electronic control device for a vehicle has been devised that has a structure in which a metal substrate and an insulating substrate are attached to a base substrate in a stacked state (see Patent Document 1).
特許文献1の例では、金属基板および絶縁基板はベース基板に固定されてはいない。よって、金属基板および絶縁基板がベース基板に組み付けられた状態の中間組立品(サブアセンブリ)では、このサブアセンブリを上下反転させて作業を行なうと金属基板および絶縁基板がベース基板から外れて落下してしまう。また、このサブアセンブリの状態では、加熱して溶かした液体状のはんだが入っているはんだ槽の上を通して、部品と基板の接合部にはんだ付けを行なう工程(いわゆるフロー工程)では、はんだ層(液体)の浮力により基板あるいは部品がベース基板から浮き上がって、正しくはんだ付けされない恐れもある。 In the example of Patent Document 1, the metal substrate and the insulating substrate are not fixed to the base substrate. Therefore, in an intermediate assembly (subassembly) in which the metal substrate and the insulating substrate are assembled to the base substrate, when the subassembly is turned upside down, the metal substrate and the insulating substrate fall off the base substrate and fall. End up. In this sub-assembly state, a solder layer (so-called flow process) is performed in a soldering process (so-called flow process) through a solder bath containing liquid solder melted by heating. There is a possibility that the board or component will be lifted from the base board due to the buoyancy of the liquid, and may not be soldered correctly.
そこで、本発明の課題は、上述の技術的課題を解決し、基板の位置決め,組み付け時の案内,支持,および製造工程途中の仮固定を一つの樹脂成型部材で行なうことが可能な電子制御装置を提供することにある。 Accordingly, an object of the present invention is to solve the above-mentioned technical problems, and an electronic control device capable of performing positioning of a substrate, guidance at the time of assembly, support, and temporary fixing during a manufacturing process with a single resin molded member Is to provide.
本発明は、上記課題を解決するための電子制御装置を提供するものである。即ち、請求項1によれば、本発明の電子制御装置は、
基材が絶縁体で被覆された金属よりなり所定の回路部品が実装された金属基板と、所定の回路部品が実装され、かつ金属製の回路導体構成部材がインサート成形により樹脂製の基材と一体化されたベース基板とよりなり、金属基板ならびにベース基板を重なるように取り付けられて形成される基板ユニットを含む電子制御装置であって、
ベース基板には、金属基板との組み付け時に位置合わせ部にて位置を合わせてその状態を保つための支持部および金属基板を係合してその係合状態を保持するための組付係合部が樹脂製の基材と一体的に形成され、
金属基板には、位置合わせ部が嵌め込まれる固定孔が形成され、
位置合わせ部が固定孔に挿入されるとともに、組付係合部が金属基板の外周方向に弾性変形状態を経て係合することにより、ベース基板と金属基板が合体されて、基板ユニットが形成されることを特徴とする電子制御装置として構成される。
The present invention provides an electronic control device for solving the above problems. That is, according to claim 1, the electronic control device of the present invention is
A metal substrate on which a base material is made of a metal covered with an insulator and on which a predetermined circuit component is mounted; a predetermined circuit component is mounted; and a metal circuit conductor constituent member is made of a resin base material by insert molding. An electronic control device comprising an integrated base substrate and including a metal substrate and a substrate unit formed by being attached so as to overlap the base substrate,
The base substrate has a support portion for aligning and maintaining the position at the alignment portion during assembly with the metal substrate, and an assembly engagement portion for engaging the metal substrate and maintaining the engagement state. Is formed integrally with a resin base material,
The metal substrate is formed with a fixing hole into which the alignment portion is fitted,
The alignment portion is inserted into the fixing hole, and the assembly engagement portion engages in the outer peripheral direction of the metal substrate through an elastically deformed state, whereby the base substrate and the metal substrate are combined to form a substrate unit. It is comprised as an electronic control apparatus characterized by this.
本構成によって、ベース基板に金属基板を組み付けるための部材は、ベース基板を構成している樹脂製の基材と一体的に形成されるので、該基材の形成工程を変更するだけでよく、他に組み付け用の部材を用意する必要はない。よって、本構成によって製造コストが上昇することはない。 With this configuration, the member for assembling the metal substrate to the base substrate is formed integrally with the resin base material constituting the base substrate, so it is only necessary to change the base material formation process. There is no need to prepare other members for assembly. Therefore, the manufacturing cost is not increased by this configuration.
また、本構成によって、金属基板がベース基板に固定されるため、基板ユニット(いわゆる、サブアセンブリの状態)を上下逆さまにした状態でも、一方の基板が外れて落下することもないので、種々の作業を行なうことも可能である。基板ユニットの状態でフロー工程によるはんだ付けを行なうことも可能となる。つまり、フロー工程はコンベアにより自動的に基板ユニットをはんだ層内を通過させる形態のため、手作業ではんだ付けを行なう工程に比べてはんだ付けに要するコストは低減される。 In addition, since the metal substrate is fixed to the base substrate by this configuration, even if the substrate unit (so-called subassembly state) is turned upside down, one of the substrates does not come off and fall, It is also possible to work. It is also possible to perform soldering by a flow process in the state of the board unit. That is, since the flow process automatically passes the board unit through the solder layer by the conveyor, the cost required for soldering is reduced as compared with the process of performing soldering manually.
さらに、本構成によって、このサブアセンブリの状態で運搬あるいは輸送を行なっても、ユニットが分離することはない。よって、ベース基板に金属基板を組み付けた後の工程を離れた場所において行なうことも可能である。 Further, according to the present configuration, the unit is not separated even when transported or transported in the state of this subassembly. Therefore, the process after the metal substrate is assembled to the base substrate can be performed at a remote location.
請求項2によれば、本発明の電子制御装置は、基板ユニットにおけるベース基板には、その支持部の内部に基板ユニットを電子制御装置のハウジングに取り付けるための螺子案内部が形成される構成をとる。本構成によって、支持部と螺子案内部が一体的に形成されるので、これらを別個に形成した場合に比べて基板の面積を小さくすることができる。また、ベース基板を構成する樹脂製の基材の形状も複雑にならないため、基材形成に要するコストも低減できる。 According to a second aspect of the present invention, in the electronic control device of the present invention, the base substrate in the substrate unit has a structure in which a screw guide portion for attaching the substrate unit to the housing of the electronic control device is formed inside the support portion. Take. With this configuration, since the support portion and the screw guide portion are integrally formed, the area of the substrate can be reduced as compared with the case where they are formed separately. Moreover, since the shape of the resin-made base material which comprises a base board | substrate does not become complicated, the cost required for base-material formation can also be reduced.
また、請求項3によれば、本発明の電子制御装置は、螺子案内部を用い、基板ユニットをハウジングの底部をなすヒートシンクに固定し、ヒートシンクが金属基板で発生する熱を放熱する構成をとる。 According to a third aspect of the present invention, the electronic control device of the present invention uses a screw guide portion, fixes the substrate unit to a heat sink that forms the bottom of the housing, and the heat sink radiates heat generated by the metal substrate. .
本構成によって、部品点数の増加を回避しつつ、金属基板で発生する熱の高い放熱性を確保できる。というのは、ヒートシンクが底面を構成していて、その外面が外気にさらされることになるので、高い放熱性が得られる。また、例えば金属基板自体が放熱板としても機能する構成とすることもできるが、その場合には、金属基板自体がある程度の放熱面積を有する大きさや形状である必要があり、ベース基板への取り付けや電気的接続作業の容易性を必ずしも高く確保できない恐れがある。しかし、このように放熱板と金属基板が分離された構造であると、そのような問題が生じない。また、放熱効果を調整する場合には、ヒートシンクの形状を変更するだけでよいので、金属基板その他の電子制御装置を構成する部材に影響を及ぼさない。 With this configuration, it is possible to ensure high heat dissipation of heat generated in the metal substrate while avoiding an increase in the number of components. This is because the heat sink constitutes the bottom surface, and the outer surface is exposed to the outside air, so that high heat dissipation is obtained. Also, for example, the metal substrate itself can be configured to function as a heat sink, but in that case, the metal substrate itself needs to have a size and shape having a certain heat radiation area, and is attached to the base substrate. In addition, the ease of electrical connection work may not necessarily be ensured. However, such a problem does not occur when the heat sink and the metal substrate are separated as described above. Further, when adjusting the heat dissipation effect, it is only necessary to change the shape of the heat sink, so that the metal substrate and other members constituting the electronic control device are not affected.
また、請求項4によれば、本発明の電子制御装置は、ハウジングとヒートシンクの間に防水用のOリングを挟んで固定し、Oリングを螺子止め方向に圧縮することによりOリングが防水の役割を果たす構成をとる。本構成によって、電子制御装置への水等の液体の浸入を防止することが可能となる。 According to a fourth aspect of the present invention, in the electronic control device of the present invention, the waterproof O-ring is sandwiched and fixed between the housing and the heat sink, and the O-ring is compressed in the screwing direction so that the O-ring is waterproof. Take a composition to play a role. With this configuration, it is possible to prevent liquid such as water from entering the electronic control device.
請求項5によれば、本発明の電子制御装置は、ヒートシンクに組付係合部の先端部を格納する格納孔を備える構成をとる。本構成によって、組付係合部の先端部が金属基板の底面から突出する構造となっても、基板ユニット(金属基板)をヒートシンクに固定する際に余計な隙間ができたり、金属基板がヒートシンクに密着せずに金属基板で発生する熱を放熱できないということは起きなくなる。また、基板ユニット(金属基板)をヒートシンクに固定する際に、組付係合部の先端部を破損するということも起きない。 According to the fifth aspect of the present invention, the electronic control device of the present invention has a configuration in which the heat sink includes a storage hole for storing the tip of the assembly engagement portion. With this configuration, even when the tip of the assembly engaging portion protrudes from the bottom surface of the metal substrate, an extra gap is formed when the substrate unit (metal substrate) is fixed to the heat sink, or the metal substrate is It is no longer possible to dissipate heat generated in the metal substrate without being in close contact with the substrate. Further, when the substrate unit (metal substrate) is fixed to the heat sink, the tip of the assembly engagement portion is not damaged.
また、請求項6によれば、本発明の電子制御装置は、螺子案内部が支持部の形成方向とは反対方向に延伸される構成をとる。本構成によって、螺子案内部がベース基板上方にも形成され、その高さが実装部品のうちで最も高さのあるものと同等あるいはそれ以上の高さを有することで、基板ユニットをヒートシンク(筐体)に固定する際に、取り付け螺子を確実に螺子案内部に挿入することができ、誤って螺子を基板ユニット上に落下させるということもなくなる。 According to the sixth aspect of the present invention, the electronic control device of the present invention has a configuration in which the screw guide portion is extended in a direction opposite to the forming direction of the support portion. With this configuration, the screw guide portion is also formed above the base substrate, and the height of the screw guide portion is equal to or higher than that of the highest mounted component, so that the substrate unit can be attached to the heat sink (housing). When fixing to the body), the attachment screw can be surely inserted into the screw guide portion, and the screw is not accidentally dropped onto the substrate unit.
また、請求項7によれば、本発明の電子制御装置は、支持部はベース基板の一組の対角上に設けられ、組付係合部はベース基板の他の一組の対角上に設けられる構成をとる。本構成によって少ない部品点数でベース基板に金属基板を確実に組み付けることができる。このため、低コストでの製作が可能となる。 According to the seventh aspect of the present invention, in the electronic control device of the present invention, the support portion is provided on one set of diagonals of the base substrate, and the assembly engagement portion is on the other set of diagonals of the base substrate. The structure provided in is taken. With this configuration, the metal substrate can be reliably assembled to the base substrate with a small number of parts. For this reason, manufacture at low cost is possible.
金属基板がベース基板に対して確実に組み付けられる電子制御装置を実現するために、支持部がベース基板の一組の対角上に設けられ、組付係合部がベース基板の他の一組の対角上に設けられる構成として実現した。 In order to realize an electronic control device in which the metal substrate is securely assembled to the base substrate, the support portion is provided on one set of diagonals of the base substrate, and the assembly engagement portion is another set of the base substrate. It was realized as a configuration provided on the diagonal of.
以下、本発明の電子制御装置を四輪駆動車に適用した実施例について図面を用いて説明する。なお、本発明の電子制御装置の適用範囲を四輪駆動車に限定するものではない。 Hereinafter, an embodiment in which an electronic control device of the present invention is applied to a four-wheel drive vehicle will be described with reference to the drawings. The application range of the electronic control device of the present invention is not limited to a four-wheel drive vehicle.
図1は、本実施形態における四輪駆動車の概略構成図を示す。図1において、四輪駆動車1は、内燃機関であるエンジン2およびトランスアクスル3を備えている。トランスアクスル3は、トランスミッション3a、フロントディファレンシャル3bおよびトランスファ3c等を有している。前記フロントディファレンシャル3bは左右一対のフロントアクスル4a,4bと連結され、その一対のフロントアクスル4a,4bにはそれぞれ前輪5a,5bがそれぞれ連結されている。従って、エンジン2の駆動力は、トランスミッション3a、フロントディファレンシャル3bおよび左右一対のフロントアクスル4a,4bを介して前輪5a,5bにそれぞれトルク伝達される。 FIG. 1 is a schematic configuration diagram of a four-wheel drive vehicle in the present embodiment. In FIG. 1, a four-wheel drive vehicle 1 includes an engine 2 and a transaxle 3 which are internal combustion engines. The transaxle 3 includes a transmission 3a, a front differential 3b, a transfer 3c, and the like. The front differential 3b is connected to a pair of left and right front axles 4a and 4b, and front wheels 5a and 5b are connected to the pair of front axles 4a and 4b, respectively. Accordingly, the driving force of the engine 2 is transmitted to the front wheels 5a and 5b via the transmission 3a, the front differential 3b and the pair of left and right front axles 4a and 4b, respectively.
また、前記トランスファ3cはプロペラシャフト6に連結され、そのプロペラシャフト6は駆動力伝達装置7に駆動連結されている。従って、エンジン2の駆動力は、トランスミッション3a、トランスファ3cおよびプロペラシャフト6を介して駆動力伝達装置7に伝達される。駆動力伝達装置7はドライブピニオンシャフト8を介してリアディファレンシャル9に連結され、そのリアディファレンシャル9は左右一対のリアアクスル10a,10bに連結されている。そして、リアアクスル10a,10bには、それぞれ後輪11a,11bが連結されている。 The transfer 3 c is connected to a propeller shaft 6, and the propeller shaft 6 is drivingly connected to a driving force transmission device 7. Therefore, the driving force of the engine 2 is transmitted to the driving force transmission device 7 via the transmission 3a, the transfer 3c, and the propeller shaft 6. The driving force transmission device 7 is connected to a rear differential 9 via a drive pinion shaft 8, and the rear differential 9 is connected to a pair of left and right rear axles 10a and 10b. Rear wheels 11a and 11b are connected to the rear axles 10a and 10b, respectively.
駆動力伝達装置7は、湿式多板式の電磁クラッチ機構を備え、同電磁クラッチ機構には電磁コイルと互いに接離可能な複数のクラッチ板を有している。そして、電磁コイルに後記する駆動力配分用電子制御装置21からの制御信号(指令値)に基づいて給電される電流値に応じて各クラッチ板は互いに摩擦係合し、ドライブピニオンシャフト8にプロペラシャフト6の駆動力がトルク伝達される。 The driving force transmission device 7 includes a wet-type multi-plate electromagnetic clutch mechanism, and the electromagnetic clutch mechanism has a plurality of clutch plates that can be connected to and separated from the electromagnetic coil. Then, the clutch plates are frictionally engaged with each other in accordance with a current value supplied based on a control signal (command value) from the driving force distribution electronic control device 21 to be described later on the electromagnetic coil, and the propeller is attached to the drive pinion shaft 8. Torque is transmitted to the driving force of the shaft 6.
21は駆動力伝達装置7を駆動制御する駆動力配分用電子制御装置(以下、単にECUという)で、このECU21は、モード選択スイッチ31にセットされた運転モードに応じて、スロットル開度センサ32,前輪5a,5bおよび後輪11a,11bの車輪の回転を検出する車輪速センサ33a〜33d,および油温センサ34から算出した、スロットル開度,差動回転速度,車速,および油温に基づいて駆動力伝達装置7の制御を行なう。 Reference numeral 21 denotes a driving force distribution electronic control device (hereinafter simply referred to as an ECU) for driving and controlling the driving force transmission device 7, and the ECU 21 corresponds to a throttle opening sensor 32 according to the operation mode set in the mode selection switch 31. , Based on the throttle opening, differential rotational speed, vehicle speed, and oil temperature calculated from the wheel speed sensors 33a to 33d for detecting the rotation of the wheels of the front wheels 5a and 5b and the rear wheels 11a and 11b and the oil temperature sensor 34. Then, the driving force transmission device 7 is controlled.
図2にECU21の外観を示す。図2(a)は上面から見た図、図2(b)はコネクタ43,44のある側面から見た図である。ECU21の樹脂製のハウジング51には、図2のようにブラケット41a,41bが一体的に形成され、かつ、その側面にコネクタ43,44が突出している。本ECU21は水滴がかかりやすい車両の外部(例えば、車両底面とプロペラシャフト6との間)に取り付けられるので、防水性を必要とする。また、大電流を扱うため発熱する部品を実装している。 FIG. 2 shows the appearance of the ECU 21. FIG. 2A is a view as seen from above, and FIG. 2B is a view as seen from the side where the connectors 43 and 44 are located. As shown in FIG. 2, brackets 41 a and 41 b are integrally formed on the resin housing 51 of the ECU 21, and connectors 43 and 44 protrude from the side surfaces thereof. Since the ECU 21 is attached to the outside of the vehicle (for example, between the bottom surface of the vehicle and the propeller shaft 6) where water droplets are likely to be applied, waterproofing is required. In addition, components that generate heat are mounted to handle large currents.
次に、ECU21の内部に格納されるベース基板48および金属基板49との組み付けについて図3〜図6を用いて説明する。図3はベース基板48を示した斜視図,図4は組み付け時の構成を示した斜視図,図5は駆動力配分用ECU21の組み付け構成を示した図,図6は図5における組み付け部分の詳細図である。 Next, assembly of the base substrate 48 and the metal substrate 49 stored in the ECU 21 will be described with reference to FIGS. 3 is a perspective view showing the base substrate 48, FIG. 4 is a perspective view showing the configuration at the time of assembly, FIG. 5 is a diagram showing the assembly configuration of the driving force distribution ECU 21, and FIG. 6 is an assembly part of FIG. FIG.
図3はベース基板48の構成の概略を示したものである。ベース基板48は金属製の回路導体構成部材(バスバー)がインサート成形により樹脂製の基材と一体化され、電源回路および大電流回路部品等の大電流が流れる部品あるいは回路が実装されている。図8はベース基板48を斜め上方から見た図で、ベース基板48の一組の対角上には支柱47(本発明における支持部)が設けられ、他の一組の対角上には組付係合部46が設けられている。また、図4は金属基板49をベース基板48に組み付けた状態を示したものである。 FIG. 3 shows an outline of the configuration of the base substrate 48. In the base substrate 48, a metal circuit conductor constituent member (bus bar) is integrated with a resin base material by insert molding, and components or circuits through which a large current flows such as a power supply circuit and a large current circuit component are mounted. FIG. 8 is a view of the base substrate 48 as viewed obliquely from above. A column 47 (support portion in the present invention) is provided on one set of diagonals of the base substrate 48, and on another set of diagonals. An assembly engagement portion 46 is provided. FIG. 4 shows a state in which the metal substrate 49 is assembled to the base substrate 48.
支柱47は、図5および図6のように、支柱47の金属基板49に対向する方向(即ち、ベース基板48の下部)には支柱下部47bが形成され、その先端には支柱下部47bよりも小さな外径をもつ位置合わせ部47aが同心円状に段付き形状で形成され、位置合わせ部47aの周縁に支柱端面部47fを形成している。一方、支柱47の金属基板49に対向しない方向(即ち、ベース基板48の上部)には、基板ユニット100をECU21のハウジングの底部をなすヒートシンク53に固定する螺子のための案内ガイド部47eが形成され、案内ガイド部47e,ベース基板48,および支柱下部47bを貫通する形態で螺子案内部47dが形成されている。 As shown in FIGS. 5 and 6, the column 47 is formed with a column lower portion 47b in the direction facing the metal substrate 49 of the column 47 (that is, the lower portion of the base substrate 48), and at the tip thereof than the column lower portion 47b. An alignment portion 47a having a small outer diameter is formed in a concentric stepped shape, and a column end surface portion 47f is formed on the periphery of the alignment portion 47a. On the other hand, a guide guide portion 47e for a screw that fixes the substrate unit 100 to the heat sink 53 that forms the bottom of the housing of the ECU 21 is formed in a direction not facing the metal substrate 49 of the support column 47 (that is, the upper portion of the base substrate 48). Then, a screw guide portion 47d is formed so as to penetrate the guide guide portion 47e, the base substrate 48, and the column lower portion 47b.
なお、図3,図4,および図8においては、説明の都合上、支柱47におけるベース基板48の上部に構成される部分を省略している。また、図5および図6のベース基板48および金属基板49においても、本実施例の説明に支障のない部分について一部を省略している。 3, 4, and 8, for convenience of explanation, a portion configured on the upper portion of the base substrate 48 in the column 47 is omitted. Also, in the base substrate 48 and the metal substrate 49 of FIGS. 5 and 6, a part of the portion that does not interfere with the description of the present embodiment is omitted.
また、組付係合部46は金属基板49方向に突出して形成され略L字形状をなし、A方向に弾性変形可能であるとともに、その先端部46aに傾斜面46bが形成され、金属基板49にスムーズかつ確実に係合するようになっている。 Further, the assembly engaging portion 46 is formed so as to protrude in the direction of the metal substrate 49, has a substantially L shape, can be elastically deformed in the A direction, and has an inclined surface 46b formed at the tip portion 46a thereof. It is designed to engage smoothly and reliably.
金属基板49には位置合わせ部47aを受け入れるための固定孔49aが形成される。固定孔49aの直径は位置合わせ部47aの外形とほぼ同じであるため、支柱端面部47fが位置合わせ部47aを固定孔49aに挿入した際のストッパーの役割を果たす。なお、金属基板49には駆動力伝達装置7の電磁コイル等のアクチュエータを駆動するための駆動回路等の熱を発しやすい部品あるいは回路が実装される。 The metal substrate 49 is formed with a fixing hole 49a for receiving the alignment portion 47a. Since the diameter of the fixing hole 49a is substantially the same as the outer shape of the alignment portion 47a, the column end surface portion 47f serves as a stopper when the alignment portion 47a is inserted into the fixing hole 49a. The metal substrate 49 is mounted with components or circuits that easily generate heat, such as a drive circuit for driving an actuator such as an electromagnetic coil of the driving force transmission device 7.
次に、金属基板49のベース基板48への組み付けの詳細について図5および図6を用いて説明する。位置合わせ部47aを固定孔49aに挿入しつつ、組付係合部46の先端部46aが金属基板49の外周方向に弾性変形し、位置合わせ部47aが固定孔49aに嵌め込まれて位置決めが行なわれるとともに、組付係合部46の先端部46aが弾性変形状態から原形に復帰して金属基板49に係合状態となって基板ユニット100が形成される。このときに、支柱端面部47fが金属基板49に突き当てられた状態となっている。 Next, details of assembly of the metal substrate 49 to the base substrate 48 will be described with reference to FIGS. While the alignment portion 47a is inserted into the fixing hole 49a, the distal end portion 46a of the assembly engagement portion 46 is elastically deformed in the outer peripheral direction of the metal substrate 49, and the alignment portion 47a is fitted into the fixing hole 49a for positioning. At the same time, the tip end portion 46a of the assembly engaging portion 46 returns to the original shape from the elastically deformed state and is engaged with the metal substrate 49, whereby the substrate unit 100 is formed. At this time, the column end surface portion 47f is in contact with the metal substrate 49.
この後、ベース基板48に実装されているバスバー端子群57を金属基板49にはんだ付けする。この際、ベース基板48は組付係合部46により金属基板49に係合状態であるためフロー工程によりはんだ層を通過させても、両基板が分離することはないので、確実にはんだ付けを行なうことが可能である。 Thereafter, the bus bar terminal group 57 mounted on the base substrate 48 is soldered to the metal substrate 49. At this time, since the base substrate 48 is engaged with the metal substrate 49 by the assembly engaging portion 46, even if the solder layer is passed through the flow process, both the substrates are not separated. It is possible to do.
次に、基板ユニット100のECU21のハウジング51への取り付け方法について説明する。基板ユニット100は螺子案内部47dに螺子45を挿入して、螺子孔53cにおいて螺子止めを行なってヒートシンク53に固定する。このとき、案内ガイド部47eおよび螺子案内部47dがあることによって、螺子45を螺子孔53cに確実に挿入することができ、螺子止めの作業を容易に行なうことができる。 Next, a method for attaching the board unit 100 to the housing 51 of the ECU 21 will be described. The board unit 100 inserts the screw 45 into the screw guide 47d, and fixes the screw to the heat sink 53 by screwing in the screw hole 53c. At this time, the presence of the guide guide portion 47e and the screw guide portion 47d allows the screw 45 to be reliably inserted into the screw hole 53c, and the screwing operation can be easily performed.
組付係合部46の先端部46aが金属基板49の底面から突出する形状の場合には、図6のようにヒートシンク53の先端部46aに対向する面に、先端部46aとの干渉を避けるための格納孔53bを設ける方法を採ってもよい。 When the front end portion 46a of the assembly engaging portion 46 has a shape protruding from the bottom surface of the metal substrate 49, avoid interference with the front end portion 46a on the surface facing the front end portion 46a of the heat sink 53 as shown in FIG. A method of providing a storage hole 53b for this purpose may be employed.
基板ユニット100をヒートシンク53に取り付けた後に、螺子54を螺子案内部53aに挿入して螺子孔55において螺子止めすることにより、ヒートシンク53をハウジング51に固定することで基板ユニット100がECU21に収納される。 After the board unit 100 is attached to the heat sink 53, the board 54 is inserted into the ECU 21 by fixing the heat sink 53 to the housing 51 by inserting the screw 54 into the screw guide 53a and screwing it in the screw hole 55. The
ハウジング51の側壁下部のOリング52に対向する箇所にはOリング52を収納する収納溝56が形成されている(図6参照)。収納溝の深さはOリング52の外形よりも小さく、ハウジング51にヒートシンク53を取り付けることによってOリング52は圧縮変形されて収納溝56およびヒートシンク53に適度な圧力で密着するため、確実なシール機能が期待できる。これにより、ハウジング51とヒートシンク53の間から水などの液体が浸入してもOリング52によってECU21内部への浸入は確実に防止できる。 A housing groove 56 for housing the O-ring 52 is formed at a position facing the O-ring 52 at the lower side wall of the housing 51 (see FIG. 6). The depth of the storage groove is smaller than the outer shape of the O-ring 52, and by attaching the heat sink 53 to the housing 51, the O-ring 52 is compressed and deformed and is brought into close contact with the storage groove 56 and the heat sink 53 with an appropriate pressure. Function can be expected. As a result, even if a liquid such as water enters from between the housing 51 and the heat sink 53, the O-ring 52 can reliably prevent the intrusion into the ECU 21.
Oリング52に熱伝導性のよい部材を用いることで、発熱する部品が実装されている金属基板49からヒートシンク53に熱が伝導し、ヒートシンク53から外部に熱を放射することで金属基板49および実装部品の冷却効果を高めることが可能となる。 By using a member having good thermal conductivity for the O-ring 52, heat is conducted from the metal substrate 49 on which a heat-generating component is mounted to the heat sink 53, and heat is radiated from the heat sink 53 to the outside. It becomes possible to enhance the cooling effect of the mounted components.
本実施例においては、図8のようにベース基板48の一組の対角上には支柱47が設けられ、他の一組の対角上には組付係合部46が設けられる構成であったが、ベース基板48の二組の対角上に支柱47を設け、ベース基板48の各辺の所定の位置に組付係合部46を設ける構成を採ってもよい。このように、支柱47および組付係合部46の数あるいは設置位置についての制約は特にない。また、図7はベース基板48の一部を斜め下方から見たものであるが、このように支柱47および組付係合部46を一体化する構成を採ってもよい。 In this embodiment, as shown in FIG. 8, the support 47 is provided on one set of diagonals of the base substrate 48, and the assembly engaging portion 46 is provided on the other set of diagonals. However, a configuration may be adopted in which the supports 47 are provided on the two diagonals of the base substrate 48 and the assembly engaging portions 46 are provided at predetermined positions on each side of the base substrate 48. As described above, there are no particular restrictions on the number or installation positions of the support columns 47 and the assembly engaging portions 46. Further, FIG. 7 shows a part of the base substrate 48 as viewed obliquely from below, but a configuration in which the support 47 and the assembly engaging portion 46 are integrated as described above may be adopted.
以上、本発明の実施の形態を説明したが、これらはあくまで例示にすぎず、本発明はこれらに限定されるものではなく、特許請求の範囲の趣旨を逸脱しない限りにおいて、当業者の知識に基づく種々の変更が可能である。 Although the embodiments of the present invention have been described above, these are merely examples, and the present invention is not limited to these embodiments, and the knowledge of those skilled in the art can be used without departing from the spirit of the claims. Various modifications based on this are possible.
1 四輪駆動車
7 駆動力伝達装置
21 駆動力配分用電子制御装置(ECU)
46 組付係合部
47 支柱
47a 位置合わせ部
47b 支柱下部
47d 螺子案内部
47e 案内ガイド部
47f 支柱端面部
48 ベース基板
49 金属基板
49a 固定孔
51 ハウジング
52 Oリング
53 ヒートシンク
100 基板ユニット
DESCRIPTION OF SYMBOLS 1 Four-wheel drive vehicle 7 Driving force transmission device 21 Driving force distribution electronic control unit (ECU)
46 Assembly engagement portion 47 Post 47a Positioning portion 47b Lower column 47d Screw guide 47e Guide guide 47f Post end surface 48 Base substrate 49 Metal substrate 49a Fixing hole 51 Housing 52 O-ring 53 Heat sink 100 Substrate unit
Claims (7)
前記ベース基板には、前記金属基板との組み付け時に位置合わせ部にて位置を合わせてその状態を保つための支持部および前記金属基板を係合してその係合状態を保持するための組付係合部が前記樹脂製の基材と一体的に形成され、
前記金属基板には、前記位置合わせ部が嵌め込まれる固定孔が形成され、
前記位置合わせ部が前記固定孔に挿入されるとともに、前記組付係合部が前記金属基板の外周方向に弾性変形状態を経て係合することにより、前記ベース基板と前記金属基板が合体されて、前記基板ユニットが形成されることを特徴とする電子制御装置。 A metal substrate on which a base material is made of a metal covered with an insulator and on which a predetermined circuit component is mounted; a predetermined circuit component is mounted; and a metal circuit conductor constituent member is made of a resin base material by insert molding. An electronic control device comprising an integrated base substrate and comprising a substrate unit formed by being attached to overlap the metal substrate and the base substrate,
An assembly for engaging the metal substrate and maintaining the engagement state by engaging the base substrate with the base substrate and aligning the position with the alignment portion when the assembly is performed with the metal substrate. The engaging portion is formed integrally with the resin base material,
The metal substrate is formed with a fixing hole into which the alignment portion is fitted,
The base portion and the metal substrate are merged when the alignment portion is inserted into the fixing hole and the assembly engagement portion engages in an outer peripheral direction of the metal substrate through an elastic deformation state. An electronic control device, wherein the substrate unit is formed.
The said support part is provided on one set of diagonals of the said base substrate, and the said assembly engagement part is provided on another set of diagonals of the said base substrate. The electronic control device according to claim 1.
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JP2011071344A (en) * | 2009-09-25 | 2011-04-07 | Autonetworks Technologies Ltd | Circuit unit |
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JP2001196770A (en) * | 2000-01-12 | 2001-07-19 | Omron Corp | Control unit |
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Publication number | Priority date | Publication date | Assignee | Title |
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US7413445B2 (en) | 2005-09-26 | 2008-08-19 | Jtekt Corporation | Electronic control unit having watertight sealing agent |
EP1778001A2 (en) | 2005-10-18 | 2007-04-25 | Jtekt Corporation | Method for applying coating agent and electronic control unit |
US7679923B2 (en) | 2005-10-18 | 2010-03-16 | JText Corporation | Method for applying coating agent and electronic control unit |
US7419386B2 (en) | 2005-12-28 | 2008-09-02 | Sumitomo Wiring Systems, Ltd. | Electrical junction box |
US7719833B2 (en) | 2006-03-31 | 2010-05-18 | Jtekt Corporation | Electronic control device |
US7755907B2 (en) | 2006-03-31 | 2010-07-13 | Jtekt Corporation | Electronic control device |
JP2008159764A (en) * | 2006-12-22 | 2008-07-10 | Jtekt Corp | Electronic control device |
JP2011071344A (en) * | 2009-09-25 | 2011-04-07 | Autonetworks Technologies Ltd | Circuit unit |
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